Hybrid antenna substrate
By designing a hybrid antenna substrate in a 5G communication system, using the combination of multi-layer structure and patch antennas, the problems of reduced antenna size and increased bandwidth are solved, and efficient frequency matching and frequency coverage are achieved, suitable for smartphones, etc. equipment.
Patent Information
- Application Number
- CN202380043637.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-05-31
- Filing Date
- 2023-05-31
- Publication Date
- 2025-01-14
AI Technical Summary
In 5G communication systems, antenna systems in millimeter wave band need to be reduced in size to be installed in devices such as smartphones, while increasing bandwidth to meet the needs of high data transmission rates. However, the prior art is difficult to do without increasing the antenna size Implemented next.
A hybrid antenna substrate is designed to optimize the dielectric constant and wiring by stacking multiple antenna wiring layers and insulating layers on the core unit, and using the combination of low-band and high-band patch antennas, combined with an additional patch antenna pattern layer. The arrangement of layers forms a core layer with a high dielectric constant and an insulating layer with a low dielectric constant to achieve a compact antenna structure.
A hybrid antenna substrate with thin thickness, high resolution and wide bandwidth is realized, which improves the performance of the antenna, especially within the frequency coverage range of the millimeter wave band, reduces return loss and enhances frequency matching.
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Figure CN119318075A_ABST
Abstract
Description
Technical Field
[0001] Embodiments relate to a hybrid antenna substrate. Background Art
[0002] Recently, efforts have been made to develop improved fifth-generation (5G) or pre-5G communication systems to meet the demand for wireless data traffic.
[0003] To achieve high data transmission rates, 5G communication systems use millimeter wave (mmWave) frequency bands (below 6 GHz, 28 GHz, 38 GHz or higher frequencies). This high frequency band is called mmWave because of its wavelength.
[0004] In order to reduce the path loss of radio waves in the ultra-high frequency band and increase the transmission distance of radio waves, integrated technologies such as beamforming, massive multiple-input multiple-output (MIMO), and array antennas have been developed in 5G communication systems.
[0005] Because hundreds of active antennas are needed to cover the above frequency bands, the size of the antenna system may be relatively increased.
[0006] However, the antenna needs to be reduced in size so as to be mounted in a smartphone or the like, and therefore, various studies are being conducted to increase the bandwidth of the antenna without increasing the size of the antenna. Summary of the invention
[0007] Technical issues
[0008] Embodiments provide a hybrid antenna substrate having a compact size and a wide bandwidth.
[0009] Technical Solution
[0010] According to an embodiment, a hybrid antenna substrate may include: a core unit, which includes a core layer and a core wiring layer stacked in a vertical direction; and an antenna unit, which is arranged on the core unit, wherein the antenna unit may include a plurality of antenna wiring layers stacked in sequence on the core unit and an antenna insulation layer arranged between the plurality of antenna wiring layers, and the core layer may have a higher dielectric constant than the antenna insulation layer.
[0011] In an example, the antenna wiring layer may include a short-distance patch antenna and a long-distance patch antenna, the long-distance patch antenna being disposed farther away from the core unit in a vertical direction than the short-distance patch antenna, and the long-distance patch antenna having a smaller surface area than the short-distance patch antenna. The antenna insulation layer may include a short-distance insulation layer located below the short-distance patch antenna and a long-distance insulation layer located below the long-distance patch antenna, and the long-distance insulation layer may have a lower dielectric constant than the short-distance insulation layer.
[0012] In an example, the plurality of antenna wiring layers may include a lower wiring layer disposed on the core unit and an intermediate wiring layer disposed on the lower wiring layer.
[0013] In an example, one of the lower wiring layer and the middle wiring layer may include a low-band patch antenna, and the remaining one of the lower wiring layer and the middle wiring layer may include a high-band patch antenna.
[0014] In an example, the plurality of antenna wiring layers may further include an upper wiring layer disposed on the intermediate wiring layer.
[0015] In an example, one of the lower wiring layer, the middle wiring layer, and the upper wiring layer may include a low-band patch antenna, another of the lower wiring layer, the middle wiring layer, and the upper wiring layer may include a high-band patch antenna, and the remaining one of the lower wiring layer, the middle wiring layer, and the upper wiring layer may include an additional patch antenna.
[0016] In an example, the additional patch antenna may include a first conductive antenna pattern layer having a polygonal, circular, or elliptical plan shape.
[0017] In an example, the additional patch antenna may include a second conductive antenna pattern layer having a polygonal, circular, or elliptical plan shape having an open cavity formed therein.
[0018] In an example, the additional patch antenna may include a third conductive antenna pattern layer having a plurality of plane patterns formed on the same plane.
[0019] In an example, the additional patch antenna may include at least two of the following conductive antenna pattern layers in combination: a first conductive antenna pattern layer having a polygonal, circular or elliptical planar shape; a second conductive antenna pattern layer having a polygonal, circular or elliptical planar shape having an open cavity formed therein; and a third conductive antenna pattern layer having multiple planar patterns formed on the same plane.
[0020] In an example, the multiple antenna wiring layers may include a first wiring layer to an Mth (here, M is a positive integer greater than or equal to 2) wiring layer stacked in sequence in a vertical direction from a core unit, the antenna insulation layer may include a first insulation layer to an Nth (1≤N≤M-1) insulation layer having a first dielectric constant to an Nth dielectric constant, respectively, and the nth insulation layer (1≤n≤N) insulation layer may be arranged between the nth wiring layer and the n+1th wiring layer.
[0021] In an example, at least one of the first to Nth dielectric constants may be lower than a dielectric constant of the core layer.
[0022] In an example, the first to Nth dielectric constants may be equal to each other.
[0023] In an example, at least one of the first to Nth dielectric constants may be different from the other dielectric constants.
[0024] In an example, the magnitudes of the first dielectric constant to the Nth dielectric constant may gradually decrease in sequence.
[0025] In an example, the first dielectric constant may be equal to or higher than the dielectric constant of the core layer, and each of the second to Nth dielectric constants may be lower than the dielectric constant of the core layer.
[0026] In an example, each of the first dielectric constant and the second dielectric constant may be equal to or higher than the dielectric constant of the core layer, and each of the third to Nth dielectric constants may be lower than the dielectric constant of the core layer.
[0027] In an example, the hybrid antenna substrate may further include a routing unit disposed under the core unit, and the routing unit may include a plurality of routing wiring layers and a routing insulation layer disposed between the plurality of routing wiring layers.
[0028] In an example, the routing insulation layer may have a lower dielectric constant than the core layer.
[0029] In an example, the dielectric constant of the core layer may be 3.7 to 10.0, and the dielectric constant lower than the dielectric constant of the core layer may be 1.0 to 3.65.
[0030] According to another embodiment, the antenna substrate may include a plurality of antenna areas arranged in a horizontal direction, wherein each of the plurality of antenna areas may include a core unit having a core layer and a core wiring layer stacked in a vertical direction, and an antenna unit arranged on the core unit, the antenna unit may include a plurality of antenna wiring layers stacked in sequence on the core unit and an antenna insulation layer arranged between the plurality of antenna wiring layers, and the core layer may have a higher dielectric constant than the antenna insulation layer.
[0031] Beneficial Effects
[0032] The hybrid antenna substrate according to the embodiment may have a thin thickness, a high degree of separation, a small length in an arrangement direction of a plurality of antenna regions, or a wide bandwidth. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] Figure 1 A plan view of a hybrid antenna substrate according to an embodiment is shown.
[0034] Figure 2 Shows Figure 1 A perspective view of the hybrid antenna substrate shown in FIG.
[0035] Figure 3 Shown along Figure 1 A cross-sectional view taken along line I-I'.
[0036] Figures 4a to 4d Plan views of various embodiments of one antenna region are shown.
[0037] Figure 5 Shows Figure 3 A cross-sectional view of an embodiment of a core unit and an antenna unit is shown in FIG.
[0038] Figure 6 A cross-sectional view of an antenna region of a hybrid antenna substrate according to a comparative example is shown.
[0039] Figure 7a is a graph showing the return loss of a hybrid antenna substrate of a comparative example, Figure 7b It is a graph showing the return loss of the hybrid antenna substrate of the example. DETAILED DESCRIPTION
[0040] Hereinafter, the present disclosure will be described more fully below with reference to the accompanying drawings, in which various embodiments are shown. However, these examples can be implemented in a variety of different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be more comprehensive and complete, and will more fully convey the scope of the present disclosure to those skilled in the art.
[0041] It will be understood that when an element is referred to as being “on” or “under” another element, it may be directly on / under the element, or one or more intervening elements may also be present. In addition, when an element is referred to as being “on” or “under”, “under the element” as well as “on the element” may be included based on the element.
[0042] Furthermore, relational terms such as “first,” “second,” “on / upper,” and “lower / lower” are used merely to distinguish one subject or element from another, and do not necessarily require or involve any physical or logical relationship or order between the subjects or elements.
[0043] In the following, a Cartesian coordinate system will be used to describe the hybrid antenna substrate 100 according to an embodiment, but the embodiment is not limited thereto. That is, according to the Cartesian coordinate system, the x-axis, the y-axis, and the z-axis are orthogonal to each other. However, the embodiment is not limited thereto. That is, the x-axis, the y-axis, and the z-axis may be oblique to each other, rather than orthogonal to each other. In the following, for ease of description, at least one of the x-axis direction and the y-axis direction will be referred to as the "horizontal direction", and the z-axis direction will be referred to as the "vertical direction".
[0044] Figure 1 1 shows a plan view of a hybrid antenna substrate 100 according to an embodiment, Figure 2 Shows Figure 1 A perspective view of the hybrid antenna substrate 100 is shown in FIG.
[0045] The hybrid antenna substrate 100 according to the present embodiment may include a plurality of antenna regions arranged in a horizontal direction. Figure 1 and Figure 2 As shown, the hybrid antenna substrate 100 may include first to fourth antenna regions A1, A2, A3, and A4 arranged in the y-axis direction (the y-axis direction is the horizontal direction). However, the present embodiment is not limited thereto. That is, according to another embodiment, the hybrid antenna substrate 100 may include more than four or less than four antenna regions.
[0046] Figure 3 Shown along Figure 1 A cross-sectional view taken along line I-I'.
[0047] In the following, reference will be made to Figure 3 The configuration of the third antenna area A3 (hereinafter, referred to as "antenna area") is described. Each of the remaining antenna areas A1, A2, and A4 has the same configuration as the third antenna area A3, and thus a redundant description thereof will be omitted.
[0048] The antenna region 200 according to an embodiment may include an antenna unit ANT and a routing unit ROT. According to another embodiment, the antenna region 200 may further include a core unit CO. That is, the core unit CO may be omitted from the antenna region 200.
[0049] The core unit CO may include a core layer CI and a core wiring layer CM stacked vertically. Figure 3 As exemplarily shown in FIG. 1 , the core layer CI may be arranged on the core wiring layer CM. Different from what is shown in the figure, the core wiring layer CM may be additionally arranged on the core layer CI.
[0050] According to an embodiment, Figure 3 As shown, the antenna unit ANT may be disposed on the core unit CO, the routing unit ROT may be disposed below the core unit CO, and the core unit CO may be disposed between the antenna unit ANT and the routing unit ROT.
[0051] According to another embodiment, the antenna unit ANT and the routing unit ROT may be arranged on the same horizontal plane.
[0052] According to still another embodiment, the routing unit ROT and the antenna unit ANT may be disposed to be spaced apart from each other, and may be electrically connected to each other via a connection member (eg, a flexible printed circuit board (FPCB)).
[0053] Although the antenna unit ANT and the routing unit ROT of the antenna area 200 according to the present embodiment will be described below as Figure 3 The arrangement is shown, but this embodiment is not limited to any specific configuration relationship between the antenna unit ANT and the routing unit ROT.
[0054] The antenna unit ANT may include a plurality of wiring layers (hereinafter, also referred to as “antenna wiring layers”) and insulating layers (hereinafter, also referred to as “antenna insulating layers”).
[0055] A plurality of antenna wiring layers may be sequentially stacked on the core unit CO, and an antenna insulating layer may be disposed between the plurality of antenna wiring layers.
[0056] According to the present embodiment, the core layer CI may have a higher dielectric constant than the antenna insulating layer.
[0057] For example, the plurality of antenna wiring layers may include a first wiring layer to an Mth wiring layer stacked sequentially upward in a vertical direction from the core unit CO. Here, M is a positive integer greater than or equal to 2. In this case, the antenna insulation layer may include a first insulation layer to an Nth insulation layer having a first dielectric constant to an Nth dielectric constant, respectively. Here, 1≤N≤M-1. Among the first insulation layer to the Nth insulation layer, the nth insulation layer may be disposed between the nth wiring layer and the n+1th wiring layer. Here, 1≤n≤N. The Nth wiring layer as the uppermost insulation layer of the antenna unit ANT may correspond to the top surface of the antenna unit ANT, as shown in FIG. Figure 1 and Figure 2 shown.
[0058] Figure 3The antenna region 200 shown in corresponds to the case where M is 5 and N is 4. As shown, the first to fifth wiring layers AM1, AM2, AM3, AM4 and AM5 can be stacked up in sequence in the vertical direction from the core unit CO, and the first to fourth insulating layers AI1, AI2, AI3 and AI4 can be arranged between adjacent wiring layers in the first to fifth wiring layers AM1, AM2, AM3, AM4 and AM5. That is, the first insulating layer AI1 can be arranged between the first wiring layer AM1 and the second wiring layer AM2, and can have a first dielectric constant; the second insulating layer AI2 can be arranged between the second wiring layer AM2 and the third wiring layer AM3, and can have a second dielectric constant; the third insulating layer AI3 can be arranged between the third wiring layer AM1 and the fourth wiring layer AM4, and can have a third dielectric constant; the fourth insulating layer AI4 as the uppermost insulating layer can be arranged between the fourth wiring layer AM4 and the fifth wiring layer AM5, and can have a fourth dielectric constant.
[0059] According to the present embodiment, at least one of the first to Nth dielectric constants may be lower than the dielectric constant of the core layer CI.
[0060] For example, each of the first to Nth dielectric constants may be lower than the dielectric constant of the core layer CI.
[0061] Alternatively, each of the second to Nth dielectric constants may be lower than the dielectric constant of the core layer CI, and the first dielectric constant may be equal to or higher than the dielectric constant of the core layer CI.
[0062] Alternatively, each of the third to Nth dielectric constants may be lower than the dielectric constant of the core layer CI, and at least one of the first and second dielectric constants may be equal to or higher than the dielectric constant of the core layer CI.
[0063] Alternatively, the first to Nth dielectric constants may be equal to each other.
[0064] Alternatively, if the core unit CO is omitted from the antenna region 200 of the hybrid substrate according to the present embodiment, at least one of the first to Nth dielectric constants may be different from the remaining dielectric constants.
[0065] Alternatively, the magnitudes of the first dielectric constant to the Nth dielectric constant may gradually decrease in the order shown in the following Formula 1, or may gradually increase in the order shown in the following Formula 2.
[0066] [Formula 1]
[0067] Kb1>Kb2>Kb3>Kb4
[0068] [Formula 2]
[0069] Kb4>Kb3>Kb2>Kb1
[0070] In each of Formula 1 and Formula 2, Kb1, Kb2, Kb3, and Kb4 represent a first dielectric constant, a second dielectric constant, a third dielectric constant, and a fourth dielectric constant, respectively.
[0071] According to an embodiment, the antenna wiring layer may include a short-range patch antenna and a long-range patch antenna.
[0072] The long-range patch antenna may be defined as a patch antenna disposed farther away from the core unit CO in a vertical direction than the short-range patch antenna. The long-range patch antenna may have a smaller surface area than the short-range patch antenna.
[0073] For example, refer to Figure 3 , assuming that the first wiring layer AM1 among the first wiring layer AM1 to the fifth wiring layer AM5 is a short-distance patch antenna, the second wiring layer AM2 to the fifth wiring layer AM5 may correspond to a long-distance patch antenna. Alternatively, assuming that the first wiring layer AM1 and the second wiring layer AM2 among the first wiring layer AM1 to the fifth wiring layer AM5 are short-distance patch antennas, the third wiring layer AM3 to the fifth wiring layer AM5 may correspond to a long-distance patch antenna. In this way, the short-distance patch antenna and the long-distance patch antenna are only relative concepts.
[0074] In this case, for convenience of description, among the insulating layers, the insulating layer located below the short-distance patch antenna will be referred to as a “short-distance insulating layer”, and the insulating layer located below the long-distance patch antenna will be referred to as a “long-distance insulating layer”.
[0075] According to an embodiment, the long-distance insulating layer may have a lower dielectric constant than the short-distance insulating layer.
[0076] According to another embodiment, the plurality of antenna wiring layers may include a lower wiring layer and an intermediate wiring layer. The lower wiring layer may be disposed on the core unit CO, and the intermediate wiring layer may be disposed on the lower wiring layer.
[0077] According to yet another embodiment, the plurality of antenna wiring layers may further include an upper wiring layer. The upper wiring layer may be disposed on the intermediate wiring layer.
[0078] Among the first to N-th wiring layers, one of the first to M-2-th wiring layers may correspond to the lower wiring layer, one of the third to M-th wiring layers may correspond to the upper wiring layer, and one of the second to N-1-th wiring layers may correspond to the middle wiring layer. Figure 3, one of the first to third wiring layers AM1, AM2 and AM3 can correspond to the lower wiring layer, one of the third to fifth wiring layers AM3, AM4 and AM5 can correspond to the upper wiring layer, and one of the second to fourth wiring layers AM2, AM3 and AM4 can correspond to the middle wiring layer.
[0079] If the multiple antenna wiring layers include a lower wiring layer and an intermediate wiring layer, one of the lower wiring layer and the intermediate wiring layer may include a low-band (Low-Band, LB) patch antenna, and the other of the lower wiring layer and the intermediate wiring layer may include a high-band (High-Band, HB) patch antenna.
[0080] Alternatively, if the multiple antenna wiring layers include a lower wiring layer, a middle wiring layer, and an upper wiring layer, one of the lower wiring layer, the middle wiring layer, and the upper wiring layer may include a low-frequency band patch antenna, another of the lower wiring layer, the middle wiring layer, and the upper wiring layer may include a high-frequency band patch antenna, and the remaining one of the lower wiring layer, the middle wiring layer, and the upper wiring layer may include an additional patch antenna.
[0081] The third wiring layer AM3 may include a LB patch antenna as a lower wiring layer, the fourth wiring layer AM4 may include a HB patch antenna as a middle wiring layer, and the fifth wiring layer AM5 may include an additional patch antenna as an upper wiring layer.
[0082] Alternatively, the third wiring layer AM3 may include an additional patch antenna as a lower wiring layer, the fourth wiring layer AM4 may include a LB patch antenna as a middle wiring layer, and the fifth wiring layer AM5 may include a HB patch antenna as an upper wiring layer.
[0083] Alternatively, the third wiring layer AM3 may include a LB patch antenna as a lower wiring layer, the fourth wiring layer AM4 may include an additional patch antenna as a middle wiring layer, and the fifth wiring layer AM5 may include a HB patch antenna as an upper wiring layer.
[0084] According to the present embodiment, the first to fourth antenna areas A1, A2, A3, and A4 may include a first additional patch antenna, a second additional patch antenna, a third additional patch antenna, and a fourth additional patch antenna, respectively. Figure 1 and Figure 2The case where an additional patch antenna is provided on the uppermost wiring layer of each antenna area from the first antenna area to the fourth antenna area A1, A2, A3 and A4 is exemplarily shown. That is, the first additional patch antenna 120-1 can be provided on the fifth wiring layer AM5 of the first antenna area A1, the second additional patch antenna 120-2 can be provided on the fifth wiring layer AM5 of the second antenna area A2, the third additional patch antenna 120-3 can be provided on the fifth wiring layer AM5 of the third antenna area A3, and the fourth additional patch antenna 120-4 can be provided on the fifth wiring layer AM5 of the fourth antenna area A4.
[0085] The first to fourth additional patch antennas may have different shapes, or may have the same shape.
[0086] In the following, reference will be made to Figures 4a to 4d Various shapes of the first to fourth additional patch antennas (hereinafter, referred to as “additional patch antennas”) will be described.
[0087] Figures 4a to 4d Plan views 120A, 120B, 120C, and 120D show various embodiments of an antenna region that may correspond to Figure 1 The “A” portion of the third antenna area A3 is shown in FIG.
[0088] Figures 4a to 4d Each of the additional patch antennas 120A, 120B, 120C, and 120D shown in FIG. 1 may correspond to Figure 1 and Figure 2 An embodiment of each of the first to fourth additional patch antennas 120 - 1 , 120 - 2 , 120 - 3 , and 120 - 4 shown in FIG.
[0089] The additional patch antenna may include a first conductive antenna pattern layer having a polygonal, circular, or elliptical planar shape. Figure 4a As shown, the first conductive antenna pattern layer 120A may have a rectangular planar shape.
[0090] Alternatively, the additional patch antenna may include a second conductive antenna pattern layer having a polygonal, circular, or elliptical planar shape with an open cavity formed therein. Figure 4b As shown, the second conductive antenna pattern layer 120B may have a rectangular planar shape having an open cross-shaped cavity 120H formed therein.
[0091] Alternatively, the additional patch antenna may include a third conductive antenna pattern layer having a plurality of planar patterns formed on the same plane. Figure 4cAs shown, the third conductive antenna pattern layer 120C may have a rectangular planar shape in which four corners CR1, CR2, CR3, and CR4 are cut. The third conductive antenna pattern layer 120C may include a plurality of strip patterns B1, B2, B3, and B4 spaced apart from each other.
[0092] Alternatively, the additional patch antenna may include at least two of the above-mentioned first conductive antenna pattern layer, second conductive antenna pattern layer, and third conductive antenna pattern layer in combination.
[0093] For example, Figure 4d As shown, the additional patch antenna 120D may include, in combination, the second conductive antenna pattern layer 120B and the third conductive antenna pattern layer 120C, the third conductive antenna pattern layer 120C having a planar shape accommodating the second conductive antenna pattern layer 120B therein.
[0094] On the other hand, the routing unit ROT may include a signal transmission line, and the plurality of wiring layers included in the routing unit ROT may include a signal pattern, a power pattern, or a resistance pattern. In addition, the routing unit ROT may have various routing characteristics such as power / data, input / output, and radio frequency (RF) routing in a combined form.
[0095] The core wiring layer CM may be a main ground portion GND formed as a ground (GND) pattern, and the routing unit ROT may also have a ground pattern. Power may be supplied from the routing unit ROT through the core unit CO to the antenna unit ANT.
[0096] Similar to the antenna unit ANT, the routing unit ROT may also include a plurality of wiring layers (hereinafter, also referred to as “routing wiring layers”) and insulating layers (hereinafter, also referred to as “routing insulating layers”).
[0097] A routing insulation layer may be provided between a plurality of routing wiring layers.
[0098] The plurality of wiring layers may include an M+1th wiring layer to an M+Sth wiring layer stacked sequentially downward in a vertical direction from the core unit CO. Here, S is a positive integer greater than or equal to 2. In this case, the routing insulation layer may include an N+1th insulation layer to an N+Sth insulation layer. The N+1th insulation layer is disposed between the core unit CO and the N+2th wiring layer and has an N+1th dielectric constant. In addition, among the N+2th insulation layer to the N+Sth insulation layer, the N+sth insulation layer may be disposed between the N+sth wiring layer and the N+s+1th wiring layer and may have an N+sth dielectric constant. Here, 2≤s≤S.
[0099] Figure 3The antenna region 200 shown in corresponds to the case where M is 5, N is 4, and S is 4. As shown, the sixth to ninth wiring layers RM1, RM2, RM3, and RM4 may be stacked sequentially downward in the vertical direction from the core unit CO, and the fifth to eighth insulating layers RI1, RI2, RI3, and RI4 may be disposed between the core layer CO and the sixth to ninth wiring layers RM1, RM2, RM3, and RM4. That is, the fifth insulating layer RI1 may be disposed between the core unit CO and the sixth wiring layer RM1 and may have a fifth dielectric constant; the sixth insulating layer RI2 may be disposed between the sixth wiring layer RM1 and the seventh wiring layer RM2 and may have a sixth dielectric constant; the seventh insulating layer RI3 may be disposed between the seventh wiring layer RM2 and the eighth wiring layer RM3 and may have a seventh dielectric constant; the eighth insulating layer RI4 may be disposed between the eighth wiring layer RM3 and the ninth wiring layer RM4 and may have an eighth dielectric constant.
[0100] The routing insulation layer according to the present embodiment may have a lower dielectric constant than the core layer CI. Figure 3 At least one of the fifth to eighth dielectric constants shown in may be lower than the dielectric constant of the core layer CI. For example, each of the fifth to eighth dielectric constants may be lower than the dielectric constant of the core layer CI.
[0101] Furthermore, the first to eighth dielectric constants may be equal to one another, or may be different from one another.
[0102] According to the present embodiment, the dielectric constant of the core layer CI may be 3.7 to 10.0, preferably 4.5 to 9.2, and more preferably 6.0 to 8.0.
[0103] In addition, among the first to eighth dielectric constants, the dielectric constant lower than the dielectric constant of the core layer CI may be 1.0 to 3.65, preferably 1.5 to 3.6, and more preferably 1.9 to 2.9. However, the present embodiment is not limited thereto.
[0104] For example, the core layer CI may have a first high dielectric constant of 6.2, a second high dielectric constant of 7.2, or a third high dielectric constant of 9.0, and among the first to eighth dielectric constants, the dielectric constant lower than the dielectric constant of the core layer CI may be 3.53, and among the first to eighth dielectric constants, the dielectric constant not lower than the dielectric constant of the core layer CI may be the first dielectric constant, the second dielectric constant, or the third dielectric constant. However, the present embodiment is not limited thereto.
[0105] The material of each of the above-mentioned first wiring layer to the M+S wiring layer and the core wiring layer CM may include metals such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) or their alloys.
[0106] The above-mentioned first conductive antenna pattern layer to the fourth conductive antenna pattern layer (e.g., 120A, 120B, 120C, and 120D) can be arranged on a plane so as to overlap each other and can be combined. In addition, the HB patch antenna, the LB patch antenna, and the additional patch antenna can be electrically connected to a radio frequency integrated circuit (RFIC) (not shown) through a feed pattern. However, the embodiment is not limited to any specific material of each of the first wiring layer to the M+S wiring layer and the core wiring layer CM. The RFIC can be arranged below, above, or next to the routing unit ROT.
[0107] The material of each of the above-mentioned first insulating layer to the N+S insulating layer and the core layer CI can be implemented as a material with insulating properties (hereinafter referred to as "insulating material"). For example, as the insulating material, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a material including a reinforcing material such as glass fiber and / or an inorganic filler together therewith (for example, ABF, PID, BCC or prepreg (PPG)). However, the insulating material is not limited to the resin material. For example, a glass plate can be used, or a ceramic plate can be used. However, the embodiment is not limited to any specific material of each of the first insulating layer to the N+S insulating layer and the core layer CI. The thickness of the core layer CI can be greater than the thickness of each of the first insulating layer to the N+S insulating layer.
[0108] on the other hand, Figure 3 The detailed configuration of the core unit CO and the antenna unit ANT in the antenna area 200 shown in FIG. Figure 5 A more detailed description is given.
[0109] Figure 5 Shows Figure 3 sectional view of an embodiment of a core unit CO and an antenna unit ANT shown in FIG.
[0110] The antenna area according to this embodiment may include the first to T-th layers L stacked in sequence in the vertical direction from the bottom of the routing unit ROT disposed below the core unit CO to the top of the antenna unit ANT disposed above the core unit CO. T=M+S+1. For example, Figure 3 As shown, the antenna region 200 may include a first layer L1 to a tenth layer L10 (T=10).
[0111] Each of the first to T-th layers may include at least one of a wiring layer and an insulating layer. For example, each of the first to T-1-th layers may include a wiring layer and an insulating layer disposed on the wiring layer, and the T-th layer may include only a wiring layer. Figure 3 As shown, wiring layers and insulating layers may be alternately stacked in a vertical direction to realize a plurality of layers. The vertically stacked wiring layers may be electrically insulated from each other by the insulating layers.
[0112] Reference Figure 3 The first layer L1 may include a ninth wiring layer RM4 and an eighth insulating layer RI4 disposed on the ninth wiring layer RM4; the second layer L2 may include an eighth wiring layer RM3 and a seventh insulating layer RI3 disposed on the eighth wiring layer RM3; the third layer L3 may include a seventh wiring layer RM2 and a sixth insulating layer RI2 disposed on the seventh wiring layer RM2; the fourth layer L4 may include a sixth wiring layer RM1 and a fifth insulating layer RI1 disposed on the sixth wiring layer RM1.
[0113] Reference Figure 3 and Figure 5 The fifth layer L5 corresponding to the core unit CO may include a core wiring layer CM and a core layer CI arranged on the core wiring layer CM, the sixth layer L6 may include a first wiring layer AM1 and a first insulating layer AI1 arranged on the first wiring layer AM1, the seventh layer L7 may include a second wiring layer AM2 and a second insulating layer AI2 arranged on the second wiring layer AM2, the eighth layer L8 may include a third wiring layer AM3 and a third insulating layer AI3 arranged on the third wiring layer AM3, the ninth layer L9 may include a fourth wiring layer AM4 and a fourth insulating layer AI4 arranged on the fourth wiring layer AM4, and the tenth layer L10 may include only the fifth wiring layer AM5.
[0114] Reference Figure 5 , the antenna region may further include a connection pattern (or wiring via) that electrically connects the wiring layers included in the plurality of layers to each other.
[0115] For example, Figure 5 As shown, the connection pattern may include: a connection pattern CP1 that interconnects the wiring layer CM of the fifth layer L5 and the wiring layer AM1 of the sixth layer L6; a connection pattern CP2 that interconnects the wiring layer AM1 of the sixth layer L6 and the wiring layer AM2 of the seventh layer L7; a connection pattern CP3 that interconnects the wiring layer AM2 of the seventh layer L7 and the wiring layer AM3 of the eighth layer L8; and a connection pattern CP4 that interconnects the wiring layer AM3 of the eighth layer L8 and the wiring layer AM4 of the ninth layer L9. However, the embodiments are not limited to any specific number, shape, or arrangement position of the connection patterns.
[0116] The material of the connection pattern may be a metal such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) or an alloy thereof. The connection pattern may include a feed via that electrically connects the HB, LB and additional patch antenna to the feed pattern, or a feed via that electrically connects the feed patterns arranged in different layers to each other. In addition, the connection pattern may include a ground via that electrically connects the ground patterns arranged in different layers to each other. In addition, the connection pattern may include a signal via, a power via, etc. The connection pattern may have a cylindrical shape or an hourglass shape, or may have a tapered shape whose width gradually decreases from its bottom to its top.
[0117] According to this embodiment, it is possible to Figure 5 A HB patch antenna is set in one of the eighth to tenth layers L8, L9 and L10 shown, a LB patch antenna can be set in another layer of the eighth to tenth layers L8, L9 and L10, and an additional patch antenna can be set in the remaining layer of the eighth to tenth layers L8, L9 and L10.
[0118] For example, refer to Figure 5 , the antenna 222 disposed in the eighth layer L8 may correspond to the LB patch antenna, the antenna 224 disposed in the ninth layer L9 may correspond to the HB patch antenna, and the antenna 226 disposed in the tenth layer L10 may correspond to the additional patch antenna.
[0119] Hereinafter, an antenna region of a hybrid antenna substrate according to a comparative example and an antenna region of a hybrid antenna substrate according to the present embodiment will be described with reference to the accompanying drawings.
[0120] Figure 6 A cross-sectional view of an antenna region of a hybrid antenna substrate according to a comparative example is shown.
[0121] according to Figure 6 The antenna area of the comparative example shown is similar to that of Figure 5 The antenna region of the illustrated embodiment includes a fifth layer L5 to a tenth layer L10 , each of which includes at least one of a wiring layer and an insulating layer.
[0122] according to Figure 6 The dielectric constant of the antenna insulation layer included in the antenna region of the comparative example shown is equal to the dielectric constant of the core layer CI, while according to Figure 5 The dielectric constant of the antenna insulation layer included in the antenna region of the embodiment shown in is lower than the dielectric constant of the core layer CI. Figure 6 The antenna area of the comparative example shown includes the LB patch antenna 22 and the HB patch antenna 24, and according to Figure 5The antenna area of the embodiment shown in FIG. 2 includes an additional patch antenna 226 as well as the LB patch antenna 222 and the HB patch antenna 224. In addition, Figure 6 The antenna area shown is Figure 5 The antenna areas shown are the same, so their redundant descriptions will be omitted.
[0123] exist Figure 5 and Figure 6 In each of the figures, the distance (or thickness) from the fifth layer L5 to the seventh layer L7 in the vertical direction will be referred to as the first thickness h1, and the distance from the eighth layer L9 to the tenth layer L10 in the vertical direction will be referred to as the second thickness h2.
[0124] In the comparative example, the dielectric constant of the core layer CI (the core layer CI is the core unit CO) included in the fifth layer L5 and the first to fourth dielectric constants of the antenna insulation layers AI1 to AI4 included in the sixth to tenth layers L6 to L10 are equal to each other.
[0125] However, in the present embodiment, the dielectric constant of the core layer CI is higher than at least one of the first to fourth dielectric constants. Therefore, the performance (e.g., gain) of the hybrid antenna substrate including the antenna region can be maintained at the same level as that of the comparative example, that is, the thickness of the antenna region in the vertical direction can be reduced while having the same resonant frequency as that of the comparative example.
[0126] That is to say, even if Figure 5 In the embodiment shown in FIG. 1 , when the LB patch antenna 122 and the HB patch antenna 124 are respectively arranged in the eighth layer L8 and the ninth layer L9, the same as in FIG. 1 can also be ensured. Figure 6 The comparative example shown in FIG. 1 has the same performance when the LB patch antenna 22 and the HB patch antenna 24 are respectively arranged in the eighth layer L8 and the tenth layer L10. Therefore, when the antenna area according to the present embodiment does not include Figure 5 When the tenth layer L10 is shown in FIG, the antenna region according to this embodiment can have the same performance as the comparative example while having a thickness H2, and the thickness H2 is smaller than the thickness H1 of the antenna region of the comparative example by the thickness of the tenth layer L10 and the fourth insulating layer AI4.
[0127] Furthermore, in the hybrid antenna substrate, when the distance between the patch antennas provided in the antenna region arranged in the horizontal direction is maintained at a predetermined distance, the separation degree can be ensured.
[0128] In the case of the hybrid antenna substrate 100 according to the present embodiment, since the dielectric constant of the core layer CI is higher than at least one of the first to fourth dielectric constants, the distances Y1, Y2, and Y3 between the patch antennas 120-1 to 120-4 can be reduced while ensuring the same separation as the hybrid antenna substrate of the comparative example. Therefore, the length of the hybrid antenna substrate according to the present embodiment in the Y-axis direction (horizontal direction) can be reduced compared to the length of the hybrid antenna substrate according to the comparative example.
[0129] Alternatively, when the distances Y1, Y2, and Y3 in the Y-axis direction are set equal to those in the comparative example, the separation between adjacent antenna areas can be further improved.
[0130] Figure 7a is a graph showing the return loss of a hybrid antenna substrate of a comparative example, Figure 7b Graph showing the return loss of the hybrid antenna substrate of this embodiment. Figure 7a and Figure 7b In each of the graphs in FIG. 1 , the horizontal axis represents frequency and the vertical axis represents return loss.
[0131] Return loss (reflection coefficient) is the ratio of reflected voltage to input voltage. A large absolute value means low reflectivity and excellent matching. Generally speaking, the matching standard can be set to -10 dB or less.
[0132] The antenna region according to this embodiment may further include an additional patch antenna while maintaining the same thickness as the comparative example. This is because, as described above, the additional patch antenna can be placed in the optional tenth layer L10 on the optional fourth insulating layer AI4 while ensuring the same performance as the comparative example.
[0133] like Figure 6 As shown, when the LB patch antenna 22 and the HB patch antenna 24 are respectively arranged on the eighth layer L8 and the tenth layer L10, the obtained Figure 7a The return loss characteristics are shown in Figure 7a In the case of the comparative example shown in , there is a resonance frequency f1, and the fractional bandwidth (FBW: fractional bandwidth) is only 17.1% based on -10 dB.
[0134] On the other hand, Figure 5 As shown, when the LB patch antenna 122 and the HB patch antenna 124 are respectively arranged in the eighth layer L8 and the ninth layer L9 and the additional patch antenna 126 is arranged in the tenth layer L10, and as Figure 5 As shown, when Figure 4dWhen the second conductive antenna pattern layer 120B and the third conductive antenna pattern layer 120C shown in FIG. 1 are disposed on the fourth insulating layer AI4 as additional patch antennas, the following can be obtained: Figure 7b The return loss characteristics are shown in Figure 7b In the case of the embodiment shown in , it can be seen that there are two resonant frequencies f2 and f3, and due to the additional patch antenna 126, the bandwidth of the low-band return loss within the commercial frequency range of the millimeter wave (mmWave) band is improved. Figure 7b It can be seen that: based on -10dB, the fractional bandwidth in this embodiment is 30.4%, which is larger than the fractional bandwidth in the comparative example. Therefore, compared with the comparative example, the frequency coverage in this embodiment is increased, so this embodiment can be more effectively applied to the global network.
[0135] Furthermore, the additional patch antenna may be implemented in various shapes so that the hybrid antenna substrate according to the present embodiment has desired performance.
[0136] For example, when an additional patch antenna is implemented as Figure 4a When the first conductive antenna pattern layer is exemplarily shown in FIG. 1 , the efficiency of the antenna gain can be improved. When the additional patch antenna is implemented as Figure 4b When the second conductive antenna pattern layer exemplarily shown in FIG. 1 is provided, the size of the patch antenna can be reduced. When the additional patch antenna is implemented as Figure 4c When the third conductive antenna pattern layer is exemplarily shown in FIG. 1 , the bandwidth can be increased.
[0137] Therefore, the hybrid antenna substrate according to the above-described embodiment may have a smaller thickness than the comparative example, may have a higher degree of separation than the comparative example, or may have a smaller length in an arrangement direction of a plurality of antenna regions than the comparative example.
[0138] Alternatively, the hybrid antenna substrate according to the present embodiment has a wider fractional bandwidth than the comparative example.
[0139] Although the present disclosure has been specifically shown and described with reference to the exemplary embodiments of the present disclosure, these embodiments are presented for illustrative purposes only and do not limit the present disclosure, and it will be apparent to those skilled in the art that various modifications may be made in form and detail without departing from the basic characteristics of the embodiments described herein. For example, the various configurations described in the embodiments may be modified and applied. In addition, such modifications and differences in application shall be understood to fall within the scope of the present disclosure as defined by the appended claims.
[0140] [Implementation Methods of the Invention]
[0141] Various embodiments have been described in terms of the best mode for carrying out the present disclosure.
[0142]
Industry Applicability
[0143] The hybrid antenna substrate according to the embodiment may be used in a smartphone or the like.
Claims
1. A hybrid antenna substrate, comprising: a core unit, the core unit comprising a core layer and a core wiring layer stacked in a vertical direction; as well as an antenna unit, wherein the antenna unit is arranged on the core unit, Wherein, the antenna unit comprises: a plurality of antenna wiring layers, the plurality of antenna wiring layers being sequentially stacked on the core unit; and an antenna insulation layer, the antenna insulation layer being disposed between the plurality of antenna wiring layers, and The core layer has a higher dielectric constant than the antenna insulation layer.
2. The hybrid antenna substrate according to claim 1, wherein: The antenna wiring layer comprises: Short range patch antennas; and a long-distance patch antenna, the long-distance patch antenna being arranged farther away from the core unit in the vertical direction than the short-distance patch antenna, the long-distance patch antenna having a smaller surface area than the short-distance patch antenna, Wherein, the antenna insulation layer comprises: a short-distance insulating layer, the short-distance insulating layer being located below the short-distance patch antenna; and a long distance insulating layer, the long distance insulating layer being located below the long distance patch antenna, and The long-distance insulating layer has a lower dielectric constant than the short-distance insulating layer.
3. The hybrid antenna substrate according to claim 1, wherein: The plurality of antenna wiring layers include: a lower wiring layer disposed on the core unit; and An intermediate wiring layer is disposed above the lower wiring layer.
4. The hybrid antenna substrate according to claim 3, wherein: One of the lower wiring layer and the middle wiring layer includes a low-band patch antenna, and Wherein, the remaining one of the lower wiring layer and the middle wiring layer includes a high-frequency band patch antenna.
5. The hybrid antenna substrate according to claim 3, wherein: The plurality of antenna wiring layers further include an upper wiring layer disposed above the intermediate wiring layer.
6. The hybrid antenna substrate according to claim 5, wherein: one of the lower wiring layer, the middle wiring layer, and the upper wiring layer includes a low-band patch antenna, wherein the other of the lower wiring layer, the middle wiring layer and the upper wiring layer comprises a high-frequency band patch antenna, and Wherein, the remaining one of the lower wiring layer, the middle wiring layer and the upper wiring layer includes an additional patch antenna.
7. The hybrid antenna substrate according to claim 6, wherein: The additional patch antenna includes a first conductive antenna pattern layer having a polygonal, circular, or elliptical planar shape.
8. The hybrid antenna substrate according to claim 6, wherein: The additional patch antenna includes a second conductive antenna pattern layer having a polygonal, circular, or elliptical planar shape having an open cavity formed therein.
9. The hybrid antenna substrate according to claim 6, wherein: The additional patch antenna includes a third conductive antenna pattern layer having a plurality of planar patterns formed on the same plane.
10. The hybrid antenna substrate according to claim 6, wherein: The additional patch antenna comprises, in combination, at least two of the following conductive antenna pattern layers: A first conductive antenna pattern layer, wherein the first conductive antenna pattern layer has a polygonal, circular or elliptical plane shape; a second conductive antenna pattern layer having a polygonal, circular or elliptical plane shape with an open cavity formed therein; as well as The third conductive antenna pattern layer has a plurality of plane patterns formed on the same plane.