A soft soldering control method using laser heating and related equipment

Abstract

The present application relates to the field of welding control technology, and in particular to a method and related equipment for controlling soft soldering using laser heating, wherein the method comprises: obtaining the welding height, and moving the nozzle to the welding position based on the welding height; obtaining solder information, and obtaining the solder melting point temperature based on the solder information; obtaining the target power based on the preset energy conversion rule and the solder melting point temperature; obtaining the environmental information of soft soldering; obtaining the energy conversion ratio based on the solder information and the environmental information; obtaining the calibration power based on the energy conversion ratio and the target power; and heating the solder based on the calibration power. The present application is helpful to improve the welding quality.

Description

Technical Field

[0001] The present application relates to the field of welding control technology, and in particular to a soft soldering control method using laser heating and related equipment. Background Art

[0002] Microelectronic welding technology mainly refers to the connection technology in the miniaturization design and manufacturing process of electronic components and circuits. Microelectronic welding technology has two purposes when connecting two materials: one is to obtain good conductivity, and the other is to obtain lasting and reliable mechanical connection strength. Brazing technology is generally divided into hard soldering (Brazing) technology and soft soldering (Soldering) technology. Relevant societies stipulate that brazing performed when the liquidus temperature of the solder is higher than 450℃ is hard soldering, and soldering performed when the liquidus temperature is lower than 450℃ is soft soldering. This division is accepted by most people in the world, and soft soldering technology is mainly used in microelectronic welding technology.

[0003] In the related art, during the welding process, when a laser is used to heat the solder, the laser is set to a corresponding output power according to the melting point of the solder, so that the heating temperature of the solder gradually rises to the melting point of the solder, and then the temperature is maintained. The liquid solder wets and spreads on the surface of the pad and fills the gap in the pad, dissolves and diffuses with the pad, and finally solidifies and crystallizes to achieve an atomic bond connection between the connected materials.

[0004] However, in the related art, due to the different materials of the solder, the corresponding various properties are also different. In addition, due to the environmental influence during welding, when the energy emitted by the laser is received by the solder, there will be some deviations from the pre-estimated situation, resulting in the heating temperature of the solder being too high or too low, which ultimately affects the welding quality. Summary of the invention

[0005] In order to help improve welding quality, the present application provides a soft soldering control method using laser heating and related equipment.

[0006] In the first aspect, the present application provides a method for controlling soldering by laser heating, which adopts the following technical solution:

[0007] A method for controlling soft soldering by laser heating, comprising:

[0008] Acquiring a welding height, and moving the nozzle to a welding position based on the welding height;

[0009] Acquire solder information, and acquire solder melting point temperature based on the solder information;

[0010] Based on the preset energy conversion rule and the melting point temperature of the solder, obtaining the target power;

[0011] Obtain environmental information for soldering;

[0012] Based on the solder information and the environmental information, obtaining an energy conversion ratio;

[0013] Based on the energy conversion ratio and the target power, obtaining a calibration power;

[0014] Based on the calibrated power, the solder is heated.

[0015] By adopting the above technical solution, the nozzle is first moved to the welding position corresponding to the welding height, the solder information is obtained, and the solder melting point temperature is obtained from the solder information, and then based on the solder melting point temperature, the corresponding target power is matched according to the energy conversion rule; further, the environmental information of the soft soldering is obtained, and then the energy conversion ratio is obtained according to the solder information and the environmental information, and the calibration power is calculated according to the energy conversion ratio and the target power, and finally the solder is heated according to the calibration power;

[0016] Due to the difference between solder information and environmental information, when emitting laser to heat the solder according to the target power, there will be corresponding deviations in the energy conversion process. Therefore, the corresponding energy conversion ratio is calculated according to the corresponding solder information and environmental information, and then the target power is calibrated according to the energy conversion ratio to generate a calibrated power that is more in line with the current situation. Using the calibrated power to heat the solder can help to more accurately maintain the heating temperature at the melting point of the solder, thereby ensuring the smooth melting of the solder while reducing the occurrence of burns to the welded objects due to excessive temperature, which in turn helps to improve the welding quality.

[0017] Optionally, obtaining the target power based on a preset energy conversion rule and the solder melting point temperature includes:

[0018] Get the output temperature range;

[0019] Based on the preset energy conversion rule, obtaining a comparison relationship between the target power and the output temperature;

[0020] Determining whether the solder melting point temperature is within the output temperature range;

[0021] If the solder melting point temperature is within the output temperature range, the target power corresponding to the solder melting point temperature is acquired based on the control relationship.

[0022] Optionally, acquiring the energy conversion ratio based on the solder information and the environmental information includes:

[0023] Based on the solder information, obtaining the absorptivity, thermal conductivity and specific heat capacity of the solder;

[0024] Based on the environmental information, obtaining real-time room temperature, heat dissipation level and focal position;

[0025] An energy conversion ratio is obtained based on the absorptivity, the thermal conductivity, the specific heat capacity, the real-time room temperature, the heat dissipation level, and the focal point position.

[0026] Optionally, acquiring the energy conversion ratio based on the absorptivity, the thermal conductivity, the specific heat capacity, the real-time room temperature, the heat dissipation level, and the focal position includes:

[0027] Obtain standard data;

[0028] Based on the standard data, the absorptivity, the thermal conductivity, the specific heat capacity, the real-time room temperature, the heat dissipation level and the focal position, respectively obtain corresponding absorptivity difference, thermal conductivity difference, specific heat capacity difference, temperature difference, heat dissipation level difference and distance difference;

[0029] An energy conversion ratio is obtained based on the absorptivity difference, the thermal conductivity difference, the specific heat capacity difference, the temperature difference, the heat dissipation level difference and the distance difference.

[0030] Optionally, acquiring the energy conversion ratio based on the absorptivity difference, the thermal conductivity difference, the specific heat capacity difference, the temperature difference, the heat dissipation level difference and the distance difference includes:

[0031] The absorptivity difference, the thermal conductivity difference, the specific heat capacity difference, the temperature difference, the heat dissipation level difference and the distance difference are respectively compared with corresponding thresholds, and corresponding conversion differences are obtained, wherein the conversion differences include absorptivity conversion difference, heat dissipation level conversion difference, thermal conductivity conversion difference, temperature conversion difference, specific heat capacity conversion difference and distance conversion difference;

[0032] Respectively obtaining weight values ​​corresponding to different conversion differences;

[0033] Based on the different conversion differences and corresponding weight values, obtaining the energy conversion ratio;

[0034] The energy conversion ratio satisfies the following formula:

[0035] ;

[0036] in, is the energy conversion ratio, Convert the difference to absorbance; is the difference in heat dissipation level conversion, is the thermal conductivity conversion difference; is the temperature conversion difference; is the conversion difference of specific heat capacity; is the distance conversion difference, K1 is the weight value corresponding to the absorption rate difference, K2 is the weight value corresponding to the thermal conductivity difference, K3 is the weight value corresponding to the specific heat capacity difference, K4 is the weight value corresponding to the temperature difference, K5 is the weight value corresponding to the heat dissipation level difference, and K6 is the weight value corresponding to the distance difference.

[0037] Optionally, acquiring the calibration power based on the energy conversion ratio and the target power includes:

[0038] Determining whether the energy conversion ratio meets the conversion requirements;

[0039] If the energy conversion ratio meets the conversion requirement, obtaining a calibration power based on the energy conversion ratio and the target power;

[0040] If the energy conversion ratio does not meet the conversion requirement, re-obtaining the energy conversion ratio based on the conversion difference and the corresponding weight value;

[0041] Based on the re-acquired energy conversion ratio and the target power, a calibration power is acquired.

[0042] Optionally, if the energy conversion ratio does not meet the conversion requirement, re-obtaining the energy conversion ratio based on the conversion difference and the corresponding weight value includes:

[0043] Based on the different conversion differences and the corresponding weight values, a calibration energy conversion ratio is obtained, and the calibration energy conversion ratio satisfies the following formula:

[0044] ;

[0045] Using the calibration energy conversion ratio as the energy conversion ratio;

[0046] Among them, B is the proportionality coefficient.

[0047] In the second aspect, the present application also discloses a soldering control system using laser heating, which adopts the following technical solution:

[0048] A soldering control system utilizing laser heating, comprising:

[0049] A first acquisition module, used for acquiring a welding height and moving the nozzle to a welding position based on the welding height;

[0050] A second acquisition module is used to acquire solder information and acquire the solder melting point temperature based on the solder information;

[0051] A third acquisition module is used to acquire the target power based on a preset energy conversion rule and the melting point temperature of the solder;

[0052] A fourth acquisition module is used to acquire environmental information of soldering;

[0053] A fifth acquisition module, configured to acquire an energy conversion ratio based on the solder information and the environmental information;

[0054] A sixth acquisition module, configured to acquire a calibration power based on the energy conversion ratio and the target power;

[0055] The welding module is used for heating the solder based on the calibrated power.

[0056] By adopting the above technical solution, the nozzle is first moved to the welding position corresponding to the welding height, the solder information is obtained, and the solder melting point temperature is obtained from the solder information, and then based on the solder melting point temperature, the corresponding target power is matched according to the energy conversion rule; further, the environmental information of the soft soldering is obtained, and then the energy conversion ratio is obtained according to the solder information and the environmental information, and the calibration power is calculated according to the energy conversion ratio and the target power, and finally the solder is heated according to the calibration power;

[0057] Due to the difference between solder information and environmental information, when emitting laser to heat the solder according to the target power, there will be corresponding deviations in the energy conversion process. Therefore, the corresponding energy conversion ratio is calculated according to the corresponding solder information and environmental information, and then the target power is calibrated according to the energy conversion ratio to generate a calibrated power that is more in line with the current situation. Using the calibrated power to heat the solder can help to more accurately maintain the heating temperature at the melting point of the solder, thereby ensuring the smooth melting of the solder while reducing the occurrence of burns to the welded objects due to excessive temperature, which in turn helps to improve the welding quality.

[0058] In a third aspect, the present application provides a computer device, which adopts the following technical solution:

[0059] An intelligent terminal comprises a memory and a processor, wherein the memory is used to store a computer program that can be run on the processor, and when the processor loads the computer program, the method of the first aspect is executed.

[0060] By adopting the above technical solution, a computer program is generated based on the method of the first aspect and stored in a memory to be loaded and executed by a processor, thereby manufacturing an intelligent terminal based on the memory and the processor for user convenience.

[0061] In a fourth aspect, the present application provides a computer-readable storage medium, which adopts the following technical solution:

[0062] A computer-readable storage medium stores a computer program, and when the computer program is loaded by a processor, the method of the first aspect is executed.

[0063] By adopting the above technical solution, a computer program is generated based on the method of the first aspect and stored in a computer-readable storage medium so as to be loaded and executed by a processor. The computer-readable storage medium facilitates the readability and storage of the computer program.

[0064] In summary, this application includes the following beneficial technical effects:

[0065] Due to the difference between solder information and environmental information, when emitting laser to heat the solder according to the target power, there will be corresponding deviations in the energy conversion process. Therefore, the corresponding energy conversion ratio is calculated according to the corresponding solder information and environmental information, and then the target power is calibrated according to the energy conversion ratio to generate a calibrated power that is more in line with the current situation. Using the calibrated power to heat the solder can help to more accurately maintain the heating temperature at the melting point of the solder, thereby ensuring the smooth melting of the solder while reducing the occurrence of burns to the welded objects due to excessive temperature, which in turn helps to improve the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 This is a main flow chart of a soft soldering control method using laser heating according to an embodiment of the present application;

[0067] Figure 2 is a flowchart of steps S201 to S204;

[0068] Figure 3 is a flowchart of steps S301 to S303;

[0069] Figure 4 is a step flow chart from step S401 to step S403;

[0070] Figure 5 is a flowchart of steps S501 to S503;

[0071] Figure 6 is a flowchart of steps S601 to S604;

[0072] Figure 7 is a step flow chart from step S701 to step S702;

[0073] Figure 8 This is a module diagram of a soft soldering control system using laser heating according to an embodiment of the present application.

[0074] Description of reference numerals:

[0075] 1. First acquisition module; 2. Second acquisition module; 3. Third acquisition module; 4. Fourth acquisition module; 5. Fifth acquisition module; 6. Sixth acquisition module; 7. Welding module. DETAILED DESCRIPTION

[0076] In a first aspect, the present application discloses a method for controlling soft soldering using laser heating.

[0077] Reference Figure 1 , a method for controlling soft soldering by laser heating, comprising steps S101 to S107:

[0078] Step S101: Acquire the welding height, and move the nozzle to the welding position based on the welding height.

[0079] Specifically, in this embodiment, the welding height is the height between the nozzle and the welding point during welding. The Z-axis motor coordinates of the nozzle welding height are first obtained. The coordinates can be a fixed height value set manually or calculated through the measurement data of the laser displacement sensor. In this embodiment, the laser displacement sensor is installed on the Z-axis mounting plate through the laser displacement sensor bracket and can rise or fall with the Z-axis.

[0080] Step S102: Obtain solder information, and obtain solder melting point temperature based on the solder information.

[0081] Specifically, in this embodiment, the solder information is related information of the solder, including the type of solder, melting point temperature and related properties, etc. After the solder is determined, the solder information is pre-stored in the soft soldering control system; the solder melting point temperature is the critical temperature at which the solid solder melts into liquid, for example, the melting point temperature of tin is 231.89°C.

[0082] Step S103: Obtaining target power based on preset energy conversion rules and solder melting point temperature.

[0083] Specifically, the preset energy conversion rule is a conversion rule between the preset output temperature and the output power. For example, when the laser output power is AW, the corresponding output temperature is a°C, and when the laser output power is BW, the corresponding output temperature is b°C, etc. In this embodiment, after determining the melting point temperature of the solder, the output power corresponding to the laser is obtained according to the preset energy conversion rule, and the output power is the target power. For example, if the melting point temperature of the solder is b°C, the output power of the laser needs to be set to BW, and the target power is BW.

[0084] Step S104: Obtaining soldering environment information.

[0085] Specifically, in this embodiment, the environmental information refers to the relevant information of the environment in which the soldering is performed and the specific conditions during the soldering, including the indoor temperature, the heat dissipation level, and the focus of the focused light beam.

[0086] Step S105: Obtaining energy conversion ratio based on solder information and environmental information.

[0087] Specifically, the energy conversion ratio is calculated based on the comparison results of the solder information and environmental information with the corresponding standard values. In this embodiment, the energy conversion ratio refers to the ratio between the actual power and the target power when the solder is heated to the melting point by laser and maintained at this temperature.

[0088] Step S106: Obtain calibration power based on the energy conversion ratio and the target power.

[0089] Specifically, the calibration power is the target power after calibration by the energy conversion ratio. In this embodiment, the calibration power=target power÷energy conversion ratio.

[0090] Step S107: heating the solder based on the calibrated power.

[0091] Specifically, in this embodiment, the output power of the laser is set to a calibration power, and the solder is heated according to the calibration power.

[0092] The soft soldering control method using laser heating provided in this embodiment first moves the nozzle to the welding position corresponding to the welding height, obtains the solder information, and obtains the solder melting point temperature from the solder information, and then matches the corresponding target power according to the energy conversion rule based on the solder melting point temperature; further obtains the environmental information of the soft soldering, and then obtains the energy conversion ratio based on the solder information and the environmental information, calculates the calibration power based on the energy conversion ratio and the target power, and finally heats the solder according to the calibration power.

[0093] Due to the difference between solder information and environmental information, when emitting laser to heat the solder according to the target power, there will be corresponding deviations in the energy conversion process. Therefore, the corresponding energy conversion ratio is calculated according to the corresponding solder information and environmental information, and then the target power is calibrated according to the energy conversion ratio to generate a calibrated power that is more in line with the current situation. Using the calibrated power to heat the solder can help to more accurately maintain the heating temperature at the melting point of the solder, thereby ensuring the smooth melting of the solder while reducing the occurrence of burns to the welded objects due to excessive temperature, which in turn helps to improve the welding quality.

[0094] Reference Figure 2 In one implementation of this embodiment, step S103 obtains the target power based on the preset energy conversion rule and the melting point temperature of the solder, including steps S201 to S204:

[0095] Step S201: Obtain output temperature range.

[0096] Specifically, the output temperature range is the temperature range that can be reached when the laser emits laser to heat the solder, including the maximum output temperature and the minimum output temperature. In this embodiment, the output temperature range is the rated temperature range, that is, the maximum output temperature and the minimum output temperature are pre-set.

[0097] Step S202: based on a preset energy conversion rule, obtaining a comparison relationship between the target power and the output temperature.

[0098] Specifically, the comparison relationship is the comparison relationship between the target power and the output temperature. According to the comparison relationship, the output temperature corresponding to different target powers can be clearly known. In this embodiment, the comparison relationship is pre-set and stored in the welding control system, which can be a comparison diagram or a comparison table.

[0099] Step S203: Determine whether the melting point of the solder is within the output temperature range.

[0100] Specifically, in this embodiment, by comparing the solder melting point temperature with the maximum output temperature and the minimum output temperature, it is determined whether the solder melting point temperature is higher than the minimum output temperature and lower than the maximum output temperature, and thus whether the solder melting point temperature is within the output temperature range.

[0101] Step S204: If the solder melting point temperature is within the output temperature range, then based on the reference relationship, a target power corresponding to the solder melting point temperature is obtained.

[0102] The soft soldering control method using laser heating provided in this embodiment obtains the control relationship between the target power and the output temperature, and then determines whether the melting point temperature of the solder is within the output temperature range. If so, it indicates that the solder can be melted by emitting laser light from the laser, so the target power corresponding to the melting point temperature of the solder can be found directly based on the control relationship.

[0103] Reference Figure 3 In one implementation of this embodiment, step S105 obtains the energy conversion ratio based on the solder information and the environmental information, including steps S301 to S303:

[0104] Step S301: Based on the solder information, the absorptivity, thermal conductivity and specific heat capacity of the solder are obtained.

[0105] Specifically, the absorptivity, thermal conductivity and specific heat capacity of the solder are obtained from the solder information. In this embodiment, the absorptivity refers to the absorption rate of the solder to the laser energy, that is, the ratio of the radiation energy absorbed by the solder to the radiation energy projected onto the solder; the thermal conductivity refers to the ability of the solder to conduct heat; the specific heat capacity is the amount of heat absorbed (or released) by a unit mass of solder when the unit temperature is increased (or decreased) by a unit.

[0106] Step S302: Based on the environmental information, obtain the real-time room temperature, heat dissipation level and focus position.

[0107] Specifically, the real-time room temperature is the real-time temperature in the space where the soft soldering is performed; the heat dissipation level is the difficulty of transferring heat from the solder to the surrounding environment during the laser heating of the solder. In this embodiment, the heat dissipation level can be set to level one to level five, where level one represents the worst heat dissipation capability and level five represents the best heat dissipation capability; the focal position is the focus of the focusing beam, that is, the focus of the laser beam.

[0108] Step S303: Obtain the energy conversion ratio based on the absorptivity, thermal conductivity, specific heat capacity, real-time room temperature, heat dissipation level and focal position.

[0109] Specifically, in this embodiment, the energy conversion ratio is calculated based on the absorptivity, thermal conductivity, specific heat capacity, real-time room temperature, heat dissipation level, and focal position.

[0110] The soft soldering control method using laser heating provided in this embodiment obtains the absorption rate, thermal conductivity and specific heat capacity of the solder according to the solder information, obtains the real-time room temperature, heat dissipation level and focal position according to the environmental information, and then combines the absorption rate, thermal conductivity and specific heat capacity, the real-time room temperature, heat dissipation level and focal position to calculate the energy conversion ratio.

[0111] Reference Figure 4 In one implementation of this embodiment, the process further includes steps S401 to S403:

[0112] Step S401: Acquire standard data.

[0113] Specifically, the standard data is pre-set benchmark data, including standard absorption rate, standard thermal conductivity, standard specific heat capacity, standard real-time room temperature, standard heat dissipation level and standard focal position, etc. In this embodiment, the standard data can be set according to user needs. For example, the most commonly used solder is tin, then the standard data corresponding to the solder information is set according to the requirements of tin, and the standard information corresponding to the environmental information is set according to the environment where tin is used as the solder most often for welding.

[0114] Step S402: Based on standard data, absorptivity, thermal conductivity, specific heat capacity, real-time room temperature, heat dissipation level and focal position, obtain corresponding absorptivity difference, thermal conductivity difference, specific heat capacity difference, temperature difference, heat dissipation level difference and distance difference respectively.

[0115] Specifically, in this embodiment, the absorbance difference is the difference between the absorbance and the standard absorbance, the thermal conductivity difference is the difference between the thermal conductivity and the standard thermal conductivity, the specific heat capacity difference is the difference between the specific heat capacity and the standard specific heat capacity, the temperature difference is the difference between the real-time room temperature and the standard real-time temperature difference, the heat dissipation level difference is the difference between the heat dissipation level and the standard heat dissipation level, and the distance difference is the straight-line distance between the focal position and the standard intersection position.

[0116] Step S403: Obtaining the energy conversion ratio based on the absorptivity difference, thermal conductivity difference, specific heat capacity difference, temperature difference, heat dissipation level difference and distance difference.

[0117] The soft soldering control method using laser heating provided in this embodiment first sets a standard data, then subtracts the absorptivity, thermal conductivity, specific heat capacity, real-time room temperature, heat dissipation level and focal position from the corresponding standard data and obtains the corresponding differences as the absorptivity difference, thermal conductivity difference, specific heat capacity difference, temperature difference, heat dissipation level difference and distance difference, and finally calculates the energy conversion ratio by combining the absorptivity difference, thermal conductivity difference, specific heat capacity difference, temperature difference, heat dissipation level difference and distance difference.

[0118] Reference Figure 5 In one implementation of this embodiment, step S403 obtains the energy conversion ratio based on the absorptivity difference, thermal conductivity difference, specific heat capacity difference, temperature difference, heat dissipation level difference and distance difference, and includes steps S501 to S503:

[0119] Step S501: compare the absorptivity difference, thermal conductivity difference, specific heat capacity difference, temperature difference, heat dissipation level difference and distance difference with corresponding thresholds respectively, and obtain corresponding conversion difference.

[0120] Specifically, in the present embodiment, threshold values ​​corresponding to the absorptivity difference, thermal conductivity difference, specific heat capacity difference, temperature difference, heat dissipation level difference and distance difference are respectively provided, and the corresponding threshold values ​​are respectively subtracted from the absorptivity difference, thermal conductivity difference, specific heat capacity difference, temperature difference, heat dissipation level difference and distance difference to obtain the corresponding conversion difference, which includes the absorptivity conversion difference, the heat dissipation level conversion difference, the thermal conductivity conversion difference, the temperature conversion difference, the specific heat capacity conversion difference and the distance conversion difference; for example, the absorptivity conversion difference minus the threshold value corresponding to the absorptivity difference can obtain the absorptivity conversion difference, and the thermal conductivity conversion difference minus the threshold value corresponding to the thermal conductivity difference can obtain the thermal conductivity conversion difference.

[0121] Step S502: Obtain weight values ​​corresponding to different conversion differences respectively.

[0122] Specifically, the weight value can be set according to the influence of different conversion differences on the energy conversion ratio. In this embodiment, the weight values ​​corresponding to the absorption rate conversion difference, heat dissipation level conversion difference, thermal conductivity conversion difference, temperature conversion difference, specific heat capacity conversion difference and distance conversion difference are 15%, 15%, 15%, 15%, 15% and 25%, respectively. They can also be set according to user needs.

[0123] Step S503: Obtaining energy conversion ratio based on different conversion differences and corresponding weight values.

[0124] Specifically, in this embodiment, the energy conversion ratio satisfies the following formula:

[0125] ;

[0126] in, is the energy conversion ratio, Convert the difference to absorbance; is the difference in heat dissipation level conversion, is the thermal conductivity conversion difference; is the temperature conversion difference; is the conversion difference of specific heat capacity; is the distance conversion difference, K1 is the weight value corresponding to the absorptivity difference, K2 is the weight value corresponding to the thermal conductivity difference, K3 is the weight value corresponding to the specific heat capacity difference, K4 is the weight value corresponding to the temperature difference, K5 is the weight value corresponding to the heat dissipation level difference, and K6 is the weight value corresponding to the distance difference.

[0127] The soft soldering control method using laser heating provided in this embodiment obtains conversion differences including absorption rate conversion difference, heat dissipation level conversion difference, thermal conductivity conversion difference, temperature conversion difference, specific heat capacity conversion difference and distance conversion difference, and then combines the weight values ​​corresponding to different conversion differences to calculate the energy conversion ratio.

[0128] Reference Figure 6 In one implementation of this embodiment, step S106 obtains the calibration power based on the energy conversion ratio and the target power, including steps S601 to S604:

[0129] Step S601: Determine whether the energy conversion ratio meets the conversion requirements.

[0130] Specifically, in this embodiment, the conversion requirement is a pre-set criterion for determining whether the energy conversion ratio meets the requirement.

[0131] Step S602: If the energy conversion ratio meets the conversion requirement, the calibration power is obtained based on the energy conversion ratio and the target power.

[0132] Step S603: If the energy conversion ratio does not meet the conversion requirement, the energy conversion ratio is re-acquired based on the conversion difference and the corresponding weight value.

[0133] Step S604: Acquire calibration power based on the re-acquired energy conversion ratio and target power.

[0134] The soft soldering control method using laser heating provided in this embodiment first determines whether the energy conversion ratio meets the conversion requirements. If so, it indicates that the energy conversion ratio meets the requirements, so the calibration power is directly calculated according to the energy conversion ratio and the target power; if not, it indicates that the energy conversion ratio does not meet the requirements, so the energy conversion ratio needs to be recalculated, and finally the calibration power is recalculated based on the recalculated energy conversion ratio and the target power.

[0135] Reference Figure 7 In one implementation of this embodiment, if the energy conversion ratio does not meet the conversion requirement in step S603, then based on the conversion difference and the corresponding weight value, re-obtaining the energy conversion ratio includes steps S701 to S702:

[0136] Step S701: Obtain a calibration energy conversion ratio based on different conversion differences and corresponding weight values.

[0137] Specifically, in this embodiment, the calibration energy conversion ratio satisfies the following formula:

[0138] , where B is the proportionality coefficient.

[0139] Step S702: Using the calibrated energy conversion ratio as the energy conversion ratio.

[0140] The soft soldering control method using laser heating provided in this embodiment can obtain the energy conversion ratio again based on the conversion difference and the corresponding weight value when the energy conversion ratio does not meet the conversion requirement.

[0141] In a second aspect, the present application also discloses a soft soldering control system utilizing laser heating.

[0142] Reference Figure 8 , a soldering control system using laser heating, comprising:

[0143] A first acquisition module, used for acquiring a welding height and moving the nozzle to a welding position based on the welding height;

[0144] A second acquisition module is used to acquire solder information and acquire the solder melting point temperature based on the solder information;

[0145] A third acquisition module is used to acquire the target power based on a preset energy conversion rule and a melting point temperature of the solder;

[0146] A fourth acquisition module is used to acquire environmental information of soldering;

[0147] A fifth acquisition module, used for acquiring an energy conversion ratio based on solder information and environmental information;

[0148] A sixth acquisition module, configured to acquire a calibration power based on the energy conversion ratio and the target power;

[0149] The soldering module is used to heat the solder based on the calibrated power.

[0150] In a third aspect, an embodiment of the present application discloses an intelligent terminal, including a memory and a processor, wherein the memory is used to store a computer program that can be run on the processor, and when the processor loads the computer program, a soft soldering control method using laser heating of the above embodiment is executed.

[0151] In a fourth aspect, an embodiment of the present application discloses a computer-readable storage medium, and a computer program is stored in the computer-readable storage medium, wherein when the computer program is loaded by a processor, a soft soldering control method using laser heating of the above embodiment is executed.

[0152] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method for controlling soldering by laser heating, characterized in that: include: obtaining a welding height, and moving the nozzle to a welding position based on the welding height; Acquiring solder information, and acquiring the solder melting point temperature based on the solder information; Obtaining target power based on a preset energy conversion rule and the solder melting point temperature; Obtain environmental information of soldering; acquiring an energy conversion ratio based on the solder information and the environmental information; Acquire a calibration power based on the energy conversion ratio and the target power; heating the solder based on the calibrated power; Wherein, obtaining the target power based on the preset energy conversion rule and the solder melting point temperature includes: Get the output temperature range; Based on the preset energy conversion rule, obtaining a comparison relationship between the target power and the output temperature; Determining whether the solder melting point temperature is within the output temperature range; If the solder melting point temperature is within the output temperature range, then based on the control relationship, obtaining a target power corresponding to the solder melting point temperature; The obtaining of the energy conversion ratio based on the solder information and the environmental information includes: Based on the solder information, obtaining the absorptivity, thermal conductivity and specific heat capacity of the solder; Based on the environmental information, obtaining real-time room temperature, heat dissipation level, and focal position; An energy conversion ratio is obtained based on the absorptivity, the thermal conductivity, the specific heat capacity, the real-time room temperature, the heat dissipation level, and the focal position.

2. The method for controlling soldering by laser heating according to claim 1, wherein: The acquiring of the energy conversion ratio based on the absorptivity, the thermal conductivity, the specific heat capacity, the real-time room temperature, the heat dissipation level, and the focal position includes: Obtain standard data; Based on the standard data, the absorptivity, the thermal conductivity, the specific heat capacity, the real-time room temperature, the heat dissipation level, and the focal position, respectively obtaining corresponding absorptivity difference, thermal conductivity difference, specific heat capacity difference, temperature difference, heat dissipation level difference, and distance difference; An energy conversion ratio is obtained based on the absorptivity difference, the thermal conductivity difference, the specific heat capacity difference, the temperature difference, the heat dissipation level difference, and the distance difference.

3. The method for controlling soldering by laser heating according to claim 2, wherein: The obtaining of the energy conversion ratio based on the absorptivity difference, the thermal conductivity difference, the specific heat capacity difference, the temperature difference, the heat dissipation level difference, and the distance difference includes: Comparing the absorptivity difference, the thermal conductivity difference, the specific heat capacity difference, the temperature difference, the heat dissipation level difference, and the distance difference with corresponding thresholds, respectively, and obtaining corresponding conversion differences, the conversion differences including the absorptivity conversion difference, the heat dissipation level conversion difference, the thermal conductivity conversion difference, the temperature conversion difference, the specific heat capacity conversion difference, and the distance conversion difference; respectively obtaining weight values ​​corresponding to different conversion differences; Obtaining the energy conversion ratio based on the different conversion differences and corresponding weight values; The energy conversion ratio satisfies the following formula: ； in, is the energy conversion ratio, Convert the difference to absorbance; is the heat dissipation level conversion difference, is the thermal conductivity conversion difference; is the temperature conversion difference; is the conversion difference of specific heat capacity; is the distance conversion difference, K1 is the weight value corresponding to the absorptivity difference, K2 is the weight value corresponding to the thermal conductivity difference, K3 is the weight value corresponding to the specific heat capacity difference, K4 is the weight value corresponding to the temperature difference, K5 is the weight value corresponding to the heat dissipation level difference, and K6 is the weight value corresponding to the distance difference.

4. The method for controlling soldering by laser heating according to claim 3, wherein: The acquiring the calibration power based on the energy conversion ratio and the target power includes: Determining whether the energy conversion ratio meets the conversion requirements; If the energy conversion ratio meets the conversion requirement, obtaining a calibration power based on the energy conversion ratio and the target power; If the energy conversion ratio does not meet the conversion requirement, re-obtaining the energy conversion ratio based on the conversion difference and the corresponding weight value; A calibration power is obtained based on the recovered energy conversion ratio and the target power.

5. The method for controlling soldering by laser heating according to claim 4, wherein: If the energy conversion ratio does not meet the conversion requirement, re-obtaining the energy conversion ratio based on the conversion difference and the corresponding weight value includes: Based on the different conversion differences and the corresponding weight values, a calibration energy conversion ratio is obtained, and the calibration energy conversion ratio satisfies the following formula: ； Using the calibrated energy conversion ratio as the energy conversion ratio; Where B is the proportional coefficient.

6. A laser-heated soldering control system for executing the laser-heated soldering control method according to any one of claims 1 to 5, characterized in that: include: a first acquisition module, configured to acquire a welding height and move the nozzle to a welding position based on the welding height; A second acquisition module is used to acquire solder information and acquire the solder melting point temperature based on the solder information; A third acquisition module is used to obtain the target power based on a preset energy conversion rule and the melting point temperature of the solder; A fourth acquisition module is used to obtain environmental information of soldering; a fifth acquisition module, configured to acquire an energy conversion ratio based on the solder information and the environmental information; a sixth acquisition module, configured to acquire a calibration power based on the energy conversion ratio and the target power; The welding module is used to heat the solder based on the calibrated power.

7. An intelligent terminal, comprising a memory and a processor, characterized in that: The memory is used to store a computer program that can be run on the processor, and when the processor loads the computer program, it executes the method according to any one of claims 1 to 5.

8. A computer-readable storage medium storing a computer program, wherein: When the computer program is loaded into a processor, the method according to any one of claims 1 to 5 is executed.

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