High-molecular-weight polyethylene insulating layer module capable of being secondarily formed for high-voltage cable

By providing a high-molecular-weight polyethylene insulation layer module for high-voltage cables that can be overmolded, the problem of troublesome installation during the cable welding process is solved, the insulation layer is quickly and conveniently welded, and the wear resistance and resistance of the material are improved. Impact performance.

CN119340039AActive Publication Date: 2025-01-21HENAN JIAFENG ELECTRIC POWER ENGINEERING CO LTD
View PDF 17 Cites 0 Cited by

Patent Information

Application Number
CN202411881689.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-19
Publication Date
2025-01-21
Estimated Expiration
2044-12-19

AI Technical Summary

Technical Problem

During the existing cable fusion process, the installation and use of heat shrink tubes are troublesome, and there is a lack of a welding module that can achieve rapid fusion of the cable insulation layer and convenient installation process.

Method used

Provides a high-molecular-weight polyethylene insulation layer module for high-voltage cables that can be re-molded. The module is in the shape of a semi-circular tube, with a clamping block integrally connected to the bottom. The module is formed by preliminary stamping at low temperature, and is heated again at high temperature. , cross-linking and welding the particles in the module to achieve a tight connection with the cable insulation layer.

Benefits of technology

Through secondary molding technology, the installation steps of the module are simplified, and the insulation layer is quickly and conveniently welded. The high molecular weight polyethylene material used has better wear resistance, corrosion resistance and impact resistance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119340039A_ABST
    Figure CN119340039A_ABST
Patent Text Reader

Abstract

The invention discloses a high-voltage cable high molecular weight polyethylene insulating layer module capable of being secondarily formed, and relates to the field of high-voltage cable welding, the high-voltage cable high molecular weight polyethylene insulating layer module comprises a module body, the module body is in a semicircular tube shape, the bottom of the module body is integrally connected with clamping blocks, the clamping blocks are bent towards one side in a right-angle mode, and the number of the clamping blocks is two. The two clamping blocks are bent towards the same side at the bottom of the module; every two modules form a group to be used in a matched mode, the two modules are connected in a clamped mode through a clamping block, and the two modules are in central symmetry. The effect of secondary forming of the module is achieved through low-temperature stamping during production and secondary heating during use; in addition, the module made of the high molecular weight polyethylene material has more excellent wear resistance and corrosion resistance, and the impact resistance and the tensile property are better; by arranging the modules, the two modules are assembled to perform fusion welding on the insulating layer, and the two modules are clamped, so that the module mounting steps can be effectively simplified, and the fusion welding operation of the insulating layer is quicker and more convenient.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the technical field of high-voltage cable welding, in particular to a high-molecular-weight polyethylene insulation layer module for a high-voltage cable that can be secondary molded. Background Art

[0002] Cable welding is a technology that connects two sections of cable. It is widely used in cable fault repair and new construction projects in the fields of electricity and communications. Cable welding is a process of melting the inner core, insulation layer, sheath and other materials of two cables into a whole through high-temperature sintering to achieve the connection and insulation function of the cable. It can effectively improve the construction quality and efficiency of power projects and ensure the reliability of the power system.

[0003] At present, the heat shrink tube method or the cold shrink tube method is usually used for welding the insulation layers between two cables. The heat shrink tube method is to put a heat shrink tube on the connection of the cable insulation layer and fix it, and then use a hot air gun to heat the heat shrink tube to shrink it and tightly wrap the insulation layer to complete the welding.

[0004] The heat shrink tubing used in the existing cable welding process is in the shape of a round tube. If you want to install it at the insulation layer connection where the inner core has been connected, you need to cut it manually, then put it on the connection and fix it with a wrapping tape. This process has the problem that the insulation layer welding operation is too cumbersome. There is a lack of a welding module that can achieve rapid welding of the cable insulation layer and is easy to operate during the installation process. Summary of the invention

[0005] The object of the present invention is to provide a high-molecular-weight polyethylene insulation layer module for a high-voltage cable that can be secondary molded, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a high-molecular-weight polyethylene insulation layer module for a high-voltage cable that can be secondary molded, comprising a module, the module is in a semicircular tubular shape, a card block is integrally connected to the bottom of the module, the card block is bent at a right angle toward one side, there are two card blocks, and the two card blocks are bent toward the same side at the bottom of the module.

[0007] Preferably, two modules are used as a group, the two modules are connected via a clamping block, and the two modules are centrally symmetrical.

[0008] Preferably, the preparation process comprises the following steps: S1: Put the high molecular weight polyethylene material into the injection molding machine in a clean environment of Class 10,000, and keep the temperature of the injection molding machine in the range of 60℃-80℃, so that the injection molding machine crushes the high molecular weight polyethylene material into powder; S2: Pour the polymer polyethylene powder into a stamping machine, add 1% of an active agent with carbon tetrachloride as the main raw material, and perform preliminary stamping and molding at a temperature of 60°C-80°C and a pressure of 1.96MPa to prepare a module. At this time, the powder particles in the module are only in contact and bonded but not cross-linked; S3: The module is taken out of the stamping machine to cool naturally, and then vacuum packed in a clean environment.

[0009] Preferably, the stamping machine includes a lower die base embedded in the upper surface of the chassis, a lower die is embedded in the upper surface of the lower die base, a fixed base is connected to the upper surface of the lower die base, a stamping assembly is installed on the top of the fixed base, the bottom of the stamping assembly passes through the fixed base and is connected to the upper die base, the bottom of the upper die base is connected to the lower die, the number of the lower die is four, and they are arranged equidistantly in the lower die base.

[0010] Preferably, a movable groove is provided inside the lower mold base on one side of the lower mold, a cavity is provided inside the lower mold, a movable mold is installed inside the cavity, a groove is provided on one side of the movable mold, a first clamping mold is installed on the inner wall of the cavity on one side of the movable mold, a second clamping mold is installed on the inner wall of the cavity on the other side of the movable mold, a baffle is installed inside the cavity on one side of the movable mold, a driving mechanism is connected to the side wall of the baffle, a sliding groove is provided inside the lower mold below the movable mold, a mold opening mechanism is installed inside the sliding groove, the first clamping mold and the second clamping mold are both integrally connected to the lower mold, the second clamping mold is movably connected to the movable mold via the groove, and the movable mold is slidably connected to the bottom surface of the cavity.

[0011] Preferably, the driving mechanism includes a fixed column installed at the center of the baffle side wall, the side of the fixed column away from the baffle passes through the lower mold side wall and is connected to a connecting plate, the bottom of the connecting plate is vertically connected to a movable plate, and one side of the movable plate is connected to an electric push rod.

[0012] Preferably, the baffle is slidably connected to the bottom surface of the cavity, the baffle is connected to the connecting plate via a fixing column, the number of the baffle connecting plates is four, and the bottoms of the four connecting plates are all connected to the movable plate.

[0013] Preferably, the mold opening mechanism includes a slider installed at the bottom of the movable mold, a screw hole is opened through the middle of the slider, a screw rod is arranged inside the screw hole, one end of the screw rod is connected to a motor, the other end of the screw rod passes through four lower molds and a bearing is installed between the lower mold base, there are two screw rods, and transmission wheels are installed on the two screw rods, and a transmission belt is connected between the two transmission wheels.

[0014] Preferably, the slider is clamped in the slide groove and forms a sliding connection with the slide groove, the screw rod passes through the four lower molds in sequence, and the screw rod forms a threaded connection with the sliders in the four lower molds through the screw hole.

[0015] Preferably, the method of use comprises the following steps: Splice two modules that have been initially pressed to the joint of the two cables, wrap a high-temperature isolation tape around the surface of the module, then put an external heating tape on the outside of the high-temperature isolation tape, wrap a high-frequency internal heating tube around both sides of the external heating tape, and connect the external heating tape and the high-frequency internal heating tube to an external heating control device to perform secondary heating on the module at a temperature of 140-180° for no less than 30 minutes. After heating, the particles inside the module and in contact with the two modules are cross-linked and welded to complete welding with the original insulation layer on the cable.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The high-molecular-weight polyethylene insulation layer module of the high-voltage cable that can be secondary molded is prepared by adding 1% of an activator with carbon tetrachloride as the main raw material to the powder of the high-molecular-weight polyethylene, and initially stamping the module at a low temperature of 60°C-80°C. In the initial molding state, the powder particles in the module are only in contact and bonded, and there is no cross-linking state. After the module is installed at the connection of the insulation layer, secondary heating is performed at 140°C-180°C to make the particles in the module and the contact parts of the two modules cross-linked and welded, so as to achieve welding with the original insulation layer on the cable. The secondary molding effect of the module is achieved by low-temperature stamping during production and secondary heating during use. In addition, the module made of high-molecular-weight polyethylene has better wear resistance and corrosion resistance than the polyolefin hot-melt tube used for traditional welding, and has better impact resistance and tensile resistance, and can withstand greater external forces without being easily deformed or broken.

[0017] The high-molecular-weight polyethylene insulation layer module for high-voltage cables that can be secondary molded is produced by setting the modules and preliminarily punching them out in a punching and molding machine. When the modules are used for welding the insulation layers of the cables, one module is placed upright on the connection of the insulation layers, and the other module is placed upside down. The two modules are snap-fitted and assembled together by a clamping block, which is convenient for subsequent secondary processing of the modules. By assembling the two modules to weld the insulation layers, and the two modules are snap-fitted, the steps of module installation can be effectively simplified, and the welding operation of the insulation layers can be made faster and more convenient.

[0018] The high-molecular-weight polyethylene insulation layer module of a high-voltage cable that can be secondary molded is provided with a mold opening mechanism. After the module is initially molded, the upper mold moves up and is separated from the lower mold. The module is in the mold cavity. The motor drives the screw to rotate. The screw drives the slider to slide in the slide groove through the screw hole. The slider drives the movable mold to move toward one side of the second clamping mold in the mold cavity. The movable mold drives the clamping block at the bottom of the module to separate from the first clamping mold and the second clamping mold until the second clamping mold is inserted into the groove. The clamping block at the bottom of the module is quickly demolded through the movement of the movable mold, which facilitates the module to be taken out of the mold cavity. The screw synchronously drives multiple sliders to move, so as to achieve the effect of simultaneous mold opening of multiple modules inside the lower molds.

[0019] The high-molecular-weight polyethylene insulation layer module for high-voltage cables that can be secondary molded is provided with a baffle plate and a driving mechanism. During the process of the movable mold moving and opening the mold, the movable plate is pushed to move by extending the electric push rod. The movable plate drives multiple connecting plates to move in the movable groove. The multiple connecting plates drive multiple baffle plates to move in the cavity at the same time through the fixed column to adjust the internal space of the cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the module assembly state structure of the present invention; Figure 2 This is a schematic diagram of the front section structure of the module assembly state of the present invention; Figure 3 It is a front cutaway structural schematic diagram of the lower die mechanism of the stamping forming machine of the present invention; Figure 4 It is a front cutaway structural schematic diagram of the driving mechanism of the stamping and forming machine of the present invention; Figure 5 It is a schematic diagram of the connection structure between the movable mold and the mold opening mechanism of the present invention; Figure 6 It is a schematic diagram of the connection structure between the baffle and the driving mechanism of the present invention; Figure 7 For the present invention Figure 3 A schematic diagram of the enlarged structure of the middle part A; Figure 8 It is a schematic diagram of the movable mold and slider structure of the present invention.

[0021] In the figure: 1. module; 2. card block; 3. stamping machine; 31. lower die seat; 311. movable groove; 32. lower die; 321. cavity; 322. movable die; 323. groove; 324. first die; 325. second die; 326. baffle; 327. driving mechanism; 3271. fixed column; 3272. connecting plate; 3273. movable plate; 3274. electric push rod; 328. slide; 329. mold opening mechanism; 3291. slider; 3292. screw hole; 3293. screw; 3294. motor; 3295. transmission wheel; 3296. transmission belt; 3297. bearing; 33. fixed seat; 34. stamping assembly; 35. upper die seat; 36. upper die. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] like Figures 1 to 8As shown, the high-voltage cable high molecular weight polyethylene insulation layer module that can be secondary molded in this embodiment includes a module 1, which is in a semicircular tubular shape. A card block 2 is integrally connected to the bottom of the module 1, and the card block 2 is bent at a right angle toward one side. There are two card blocks 2, and the two card blocks 2 are bent toward the same side at the bottom of the module 1. One card block 2 is located at the edge of the bottom of the module 1 close to the inner wall on one side, and the other card block 2 is located at the edge of the bottom of the module 1 close to the outer wall on one side.

[0026] Specifically, two modules 1 are used as a group, the two modules 1 are connected by the clamping block 2, and the two modules 1 are centrally symmetrical. When in use, one module 1 is placed upright and the other module 1 is placed upside down and assembled at the connection of the cable insulation layer. By assembling two modules 1 to weld the insulation layer, and clamping the two modules 1 together, the steps of installing the modules 1 can be effectively simplified, making the insulation layer welding operation faster and more convenient.

[0027] When preparing the high molecular weight polyethylene insulation layer module of the high voltage cable that can be secondary molded, the preparation process includes the following steps: S1: Put the high molecular weight polyethylene material into the injection molding machine in a clean environment of Class 10,000, and keep the temperature of the injection molding machine in the range of 60℃-80℃, so that the injection molding machine crushes the high molecular weight polyethylene material into powder; S2: Pour the polymer polyethylene powder into a stamping machine 3, add 1% of an active agent with carbon tetrachloride as the main raw material, and perform preliminary stamping and molding at a temperature of 60°C-80°C and a pressure of 1.96MPa to prepare a module 1. At this time, the powder particles in the module 1 are only in contact and bonded but not cross-linked; In this step, the method of using the preliminary stamping module 1 of the stamping forming machine 3 is as follows: after the module 1 is stamped and formed, the stamping assembly 34 is first controlled to move upward, the stamping assembly 34 drives the upper die seat 35 to move upward, the upper die seat 35 drives the upper die 36 to move upward and separate from the lower die 32, and the module 1 is in the cavity 321, and then the motor 3294 is started, the motor 3294 drives the screw rod 3293 to rotate, the screw rod 3293 drives the slider 3291 to slide in the slide groove 328 through the screw hole 3292, and the slider 3291 drives the movable die 322 to move toward one side of the second clamping die 325 in the cavity 321, and the electric push rod 3294 is driven to rotate. The rod 3274 extends to push the movable plate 3273 to move, and the movable plate 3273 drives the multiple connecting plates 3272 to move in the movable groove 311. The multiple connecting plates 3272 drive the multiple baffles 326 to move in the cavity 321 toward the side away from the movable mold 322 through the fixed column 3271. The movable mold 322 drives the block 2 at the bottom of the module 1 to separate from the first clamping mold 324 and the second clamping mold 325 until the second clamping mold 325 is inserted into the groove 323. The block 2 at the bottom of the module 1 is quickly demolded by the movement of the movable mold 322, and then the module 1 can be taken out of the cavity 321. S3: taking the module 1 out of the stamping machine 3 to cool naturally, and vacuum packaging it in a clean environment; The molecular weight of polyethylene in the raw material state is 500,000-1 million. The maximum molecular weight of polyethylene that plays a bonding role in the semi-finished product state is 3 million, and the minimum is 1.5 million. In addition, the minimum proportion of low molecular weight polyethylene in the semi-finished product state is not less than 30%, and the maximum does not exceed 50%.

[0028] When the secondary moldable high-voltage cable high molecular weight polyethylene insulation layer module is used, the method of use includes the following steps: Splice two modules 1 that have been preliminarily pressed to the joints of the two cables, wrap a high-temperature isolation tape around the surface of the module 1, then put an external heating tape on the outside of the high-temperature isolation tape, wrap a high-frequency internal heating tube around both sides of the external heating tape, and connect the external heating tape and the high-frequency internal heating tube to an external heating control device, perform secondary heating on the module 1, the heating temperature is 140-180°, the heating time is not less than 30 minutes, after heating, the particles inside the module 1 and the contact parts of the two modules 1 are cross-linked and welded, completing the welding with the original insulation layer on the cable.

[0029] The high-temperature isolation belt is used for thermal insulation protection to prevent the heat from dissipating during the insulation layer welding process and causing burns to the operators. The external heating belt, high-frequency internal heating tube and heating control equipment are all existing heating equipment for cable insulation layer welding, which are used here for secondary heating of module 1.

[0030] Specifically, the stamping machine 3 includes a lower die base 31 embedded in the upper surface of the chassis, a lower die 32 embedded in the upper surface of the lower die base 31, a fixed base 33 connected to the upper surface of the lower die base 31, a stamping assembly 34 installed on the top of the fixed base 33, the bottom of the stamping assembly 34 passes through the fixed base 33 and is connected to the upper die base 35, the bottom of the upper die base 35 is connected to the lower die 32, there are four lower die dies 32, and they are arranged equidistantly in the lower die base 31, there are also four upper die dies 36, which correspond to the positions of the lower die dies 32, and are used for batch stamping of four modules 1, the upper die base 35 is pushed downward by the stamping assembly 34, and the upper die base 35 drives the upper die 36 to move downward and close the mold with the lower die 32, so as to stamp the high molecular weight polyethylene powder in the cavity 321.

[0031] Furthermore, a movable groove 311 is provided inside the lower mold base 31 on one side of the lower mold 32, a cavity 321 is provided inside the lower mold 32, a movable mold 322 is installed inside the cavity 321, a groove 323 is provided on one side of the movable mold 322, a first clamping mold 324 is installed on the inner wall of the cavity 321 on one side of the movable mold 322, and a second clamping mold 325 is installed on the inner wall of the cavity 321 on the other side of the movable mold 322. The first clamping mold 324 and the second clamping mold 325 are respectively used for molding the two card blocks 2 at the bottom of the module 1, and a baffle 326 is installed inside the cavity 321 on one side of the movable mold 322 for adjusting the internal space of the cavity 321 to facilitate the movable mold 322. The movable mold 322 moves to open the mold, and the bottom of the baffle 326 is in precise contact with the ground of the cavity 321 to meet the requirements of stamping and forming of the module 1. The side wall of the baffle 326 is connected to a driving mechanism 327 for driving multiple baffles 326 to move synchronously. A slide groove 328 is provided inside the lower mold 32 below the movable mold 322, and a mold opening mechanism 329 is installed inside the slide groove 328 for opening the block 2 at the bottom of the module 1 to facilitate the unloading of the module 1. The first clamping mold 324 and the second clamping mold 325 are both integrally connected to the lower mold 32, and the second clamping mold 325 is movably plugged into the movable mold 322 through the groove 323, and the movable mold 322 is slidably connected to the bottom surface of the cavity 321.

[0032] Furthermore, the driving mechanism 327 includes a fixed column 3271 installed at the center of the side wall of the baffle 326, the side of the fixed column 3271 away from the baffle 326 passes through the side wall of the lower mold 32 and is connected to a connecting plate 3272, the bottom of the connecting plate 3272 is vertically connected to a movable plate 3273, one side of the movable plate 3273 is connected to an electric push rod 3274, the electric push rod 3274 is installed inside the lower mold base 31, the telescopic end of the electric push rod 3274 is connected to the movable plate 3273, the movable plate 3273 is pushed to move by the extension of the electric push rod 3274, and the movable plate 3273 drives multiple connecting plates 3272 to move in the movable groove 311.

[0033] Furthermore, the baffle 326 is slidably connected to the bottom surface of the cavity 321, and the baffle 326 is connected to the connecting plate 3272 via the fixed column 3271. There are four baffles 326 and connecting plates 3272, and the bottoms of the four connecting plates 3272 are all connected to the movable plate 3273. When the multiple connecting plates 3272 move in the movable groove 311, the multiple connecting plates 3272 drive the multiple baffles 326 to move in the cavity 321 at the same time via the fixed column 3271 to adjust the internal space of the cavity 321.

[0034] Furthermore, the mold opening mechanism 329 includes a slider 3291 installed at the bottom of the movable mold 322, a screw hole 3292 is opened in the middle of the slider 3291, a screw rod 3293 is set inside the screw hole 3292, one end of the screw rod 3293 is connected to a motor 3294, the motor 3294 is installed inside the lower mold base 31, the shaft end of the motor 3294 is connected to the screw rod 3293, and the motor 3294 is actually a motor 3294 with a forward and reverse circuit, and the other end of the screw rod 3293 is connected to the motor 3294. A bearing 3297 is installed between the four lower molds 32 and the lower mold base 31. The screw 3293 is rotatably connected to the lower mold base 31 via the bearing 3297 and can rotate relative to the four lower molds 32. There are two screws 3293, and a transmission wheel 3295 is installed on each of the two screws 3293. A transmission belt 3296 is connected between the two transmission wheels 3295. The two screws 3293 are rotatably connected through the transmission wheel 3295 and the transmission belt 3296.

[0035] Furthermore, the slider 3291 is stuck in the slide groove 328 and forms a sliding connection with the slide groove 328, the screw 3293 passes through the four lower molds 32 in sequence, and the screw 3293 forms a threaded connection with the sliders 3291 in the four lower molds 32 through the screw hole 3292, and the screw 3293 is driven to rotate by the motor 3294, and the screw 3293 drives the slider 3291 to slide in the slide groove 328 through the screw hole 3292, and the slider 3291 drives the movable mold 322 to move in the cavity 3 21 moves toward one side of the second clamping mold 325, and the movable mold 322 drives the block 2 at the bottom of the module 1 to separate from the first clamping mold 324 and the second clamping mold 325 until the second clamping mold 325 is inserted into the groove 323. The block 2 at the bottom of the module 1 is quickly demolded by the movement of the movable mold 322, which facilitates the removal of the module 1 from the cavity 321, and the screw 3293 synchronously drives the multiple sliders 3291 to move, thereby achieving the effect of simultaneously opening the modules 1 inside the multiple lower molds 32.

[0036] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-molecular-weight polyethylene insulation layer module for a high-voltage cable that can be secondary molded, comprising a module (1), characterized in that: The module (1) is in the shape of a semicircular tube, and a card block (2) is integrally connected to the bottom of the module (1), and the card block (2) is bent at a right angle toward one side. There are two card blocks (2), and the two card blocks (2) are bent toward the same side at the bottom of the module (1).

2. The high-voltage cable high molecular weight polyethylene insulation layer module capable of secondary molding according to claim 1, characterized in that: Two modules (1) are used together as a set, the two modules (1) are connected via a clamping block (2), and the two modules (1) are centrally symmetrical.

3. The high molecular weight polyethylene insulation layer module for high voltage cables capable of secondary molding according to claim 1, characterized in that: The preparation process comprises the following steps: S1: Put the high molecular weight polyethylene material into the injection molding machine in a clean environment of Class 10,000, and keep the temperature of the injection molding machine in the range of 60℃-80℃, so that the injection molding machine crushes the high molecular weight polyethylene material into powder; S2: Pour high molecular weight polyethylene powder into a stamping machine (3), add 1% of an activator whose main raw material is carbon tetrachloride, and perform preliminary stamping and molding at a temperature of 60°C-80°C and a pressure of 1.96 MPa to prepare a module (1). At this time, the powder particles in the module (1) are only in contact and bonded with each other but not cross-linked; S3: The module (1) is taken out of the stamping machine (3) to cool naturally, and then vacuum-packaged in a clean environment.

4. The high molecular weight polyethylene insulation layer module for high voltage cables capable of secondary molding according to claim 3, characterized in that: The punching and forming machine (3) comprises a lower die base (31) embedded in the upper surface of a chassis, a lower die (32) embedded in the upper surface of the lower die base (31), a fixed base (33) connected to the upper surface of the lower die base (31), a punching assembly (34) installed on the top of the fixed base (33), the bottom of the punching assembly (34) passes through the fixed base (33) and is connected to an upper die base (35), the bottom of the upper die base (35) is connected to the lower die (32), and the number of the lower die (32) is four, and they are arranged at equal distances in the lower die base (31).

5. The high molecular weight polyethylene insulation layer module for high voltage cables capable of secondary molding according to claim 4, characterized in that: A movable groove (311) is provided inside the lower mold base (31) on one side of the lower mold (32), a mold cavity (321) is provided inside the lower mold (32), a movable mold (322) is installed inside the mold cavity (321), a groove (323) is provided on one side of the movable mold (322), a first clamping mold (324) is installed on the inner wall of the mold cavity (321) on one side of the movable mold (322), a second clamping mold (325) is installed on the inner wall of the mold cavity (321) on the other side of the movable mold (322), and the mold cavity (321) on one side of the movable mold (322) is provided with a mold cavity (321). 21) is internally installed with a baffle (326), the side wall of the baffle (326) is connected to a driving mechanism (327), a slide groove (328) is provided inside the lower mold (32) below the movable mold (322), a mold opening mechanism (329) is installed inside the slide groove (328), the first clamping mold (324) and the second clamping mold (325) are both integrally connected to the lower mold (32), the second clamping mold (325) is movably plugged into the movable mold (322) via the groove (323), and the movable mold (322) is slidably connected to the bottom surface of the cavity (321).

6. The high molecular weight polyethylene insulation layer module for high voltage cables capable of secondary molding according to claim 5, characterized in that: The driving mechanism (327) comprises a fixed column (3271) installed at the center of the side wall of the baffle (326); the side of the fixed column (3271) away from the baffle (326) passes through the side wall of the lower mold (32) and is connected to a connecting plate (3272); the bottom of the connecting plate (3272) is vertically connected to a movable plate (3273); and one side of the movable plate (3273) is connected to an electric push rod (3274).

7. The high molecular weight polyethylene insulation layer module for high voltage cables capable of secondary molding according to claim 6, characterized in that: The baffle (326) is slidably connected to the bottom surface of the cavity (321), and the baffle (326) is connected to the connecting plate (3272) via the fixing column (3271). The number of the baffle (326) and the connecting plates (3272) is four, and the bottoms of the four connecting plates (3272) are all connected to the movable plate (3273).

8. The process for preparing the secondary moldable high-voltage cable high molecular weight polyethylene insulation layer module according to claim 7, characterized in that: The mold opening mechanism (329) comprises a slider (3291) installed at the bottom of the movable mold (322), a screw hole (3292) is provided through the middle of the slider (3291), a screw rod (3293) is provided through the inside of the screw hole (3292), one end of the screw rod (3293) is connected to a motor (3294), the other end of the screw rod (3293) passes through four lower molds (32) and a bearing (3297) is installed between the screw rod (3293) and the lower mold base (31), there are two screw rods (3293), and a transmission wheel (3295) is installed on each of the two screw rods (3293), and a transmission belt (3296) is connected between the two transmission wheels (3295).

9. The high molecular weight polyethylene insulation layer module for high voltage cables capable of secondary molding according to claim 8, characterized in that: The slider (3291) is stuck in the slide groove (328) and forms a sliding connection with the slide groove (328), the screw rod (3293) passes through the four lower molds (32) in sequence, and the screw rod (3293) forms a threaded connection with the sliders (3291) in the four lower molds (32) through the screw hole (3292).

10. The high molecular weight polyethylene insulation layer module for high voltage cables capable of secondary molding according to claim 1, characterized in that: The method of use includes the following steps: The two preliminarily pressed modules (1) are spliced ​​to the joints of the two cables, a high-temperature insulating tape is wrapped around the surface of the module (1), and then an external heating tape is put on the outside of the high-temperature insulating tape, and a high-frequency internal heating tube is wrapped around both sides of the external heating tape. The external heating tape and the high-frequency internal heating tube are externally connected to a heating control device, and the module (1) is heated for a second time at a heating temperature of 140-180° for a heating time of not less than 30 minutes. After heating, the particles in the module (1) and the contact parts of the two modules (1) are cross-linked and welded, and the welding with the original insulation layer on the cable is completed.

Citation Information

Patent Citations

  • Hollow-wall winding pipeline injection molding connector

    CN109000070A

  • Crosslinked polyethylene power cable intermediate connector and manufacturing method thereof

    CN110350376A

  • Modularized recovery method for high-voltage cross-linked polyethylene insulated cable joint

    CN112952516A

  • High-toughness cable and preparation method thereof

    CN117894529A

  • Light control cable with good fireproof effect

    CN119008091A