Ceramic tube shell and designing and manufacturing method thereof

Abstract

The invention discloses a ceramic tube shell and a designing and manufacturing method thereof, and relates to the technical field of ceramic tube shell research and development, the ceramic tube shell comprises a body frame and a conduction assembly, the conduction assembly comprises an upper polar plate, an oxygen-free copper column and a lower polar plate, the upper polar plate and the oxygen-free copper column are both installed in the body frame, and the lower polar plate is installed at the bottom of the body frame; two ends of the oxygen-free copper column are respectively communicated with the upper polar plate and the lower polar plate. According to the invention, micro-resistor conduction can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic tube shell research and development, and in particular to a ceramic tube shell and a design and manufacturing method thereof. Background Art

[0002] Ceramic tube shell, also known as ceramic package tube shell, refers to a package shell made of ceramic as raw material. Compared with traditional metal shells, ceramic tube shells have better high temperature resistance, corrosion resistance, vibration resistance and other properties. At the same time, this package shell also has excellent mechanical properties, thermal stability, insulation performance, airtightness, moisture resistance, light-proof performance, etc., and is one of the commonly used electronic packaging materials.

[0003] Existing ceramic tube shells are often made of tungsten material to form grouting columns, and then the circuit is turned on through the grouting columns. They have the problem of large on-resistance, which leads to slow response speed and unsatisfactory action sensitivity. When faced with rapidly changing voltage or current conditions, they may not be able to respond in time, thus affecting their ability to protect the circuit. Summary of the invention

[0004] The object of the present invention is to provide a ceramic tube shell and a design and manufacturing method thereof, so as to solve the problems existing in the above-mentioned prior art and realize micro-resistance conduction.

[0005] To achieve the above object, the present invention provides the following solutions:

[0006] The present invention provides a ceramic tube shell, comprising a main body frame and a conduction component, wherein the conduction component comprises an upper electrode plate, an oxygen-free copper column and a lower electrode plate, wherein the upper electrode plate and the oxygen-free copper column are both installed inside the main body frame, and the lower electrode plate is installed at the bottom of the main body frame, and the two ends of the oxygen-free copper column are respectively connected to the upper electrode plate and the lower electrode plate.

[0007] Preferably, the main body frame includes an outer frame, an outer cover plate and an installation layer group, both ends of the outer frame are open, and the first end of the outer frame is connected to the outer cover plate and sealed by the outer cover plate, the second end of the outer frame is connected to the installation layer group and sealed by the installation layer group, the upper electrode plate is installed in the installation layer group, the lower electrode plate is installed on the side of the installation layer group away from the outer cover plate, and the oxygen-free copper column is installed in the installation layer group.

[0008] Preferably, the mounting layer group includes a first mounting layer and a second mounting layer stacked together, one side of the first mounting layer is connected to the outer frame, the other side of the first mounting layer is connected to one side of the second mounting layer, the other side of the second mounting layer is connected to the lower electrode plate, the upper electrode plate is installed in the first mounting layer, and the oxygen-free copper column can pass through the first mounting layer and the second mounting layer.

[0009] Preferably, two mounting frames are provided on the first mounting layer, and the upper electrode plate is mounted in one mounting frame, and an inner cover plate is mounted in the other mounting frame, and there are two oxygen-free copper columns, and one end of the two oxygen-free copper columns are respectively connected to a side of the inner cover plate away from the outer cover plate and a side of the upper electrode plate away from the outer cover plate.

[0010] Preferably, the second mounting layer is provided with two circular holes, the two circular holes correspond one-to-one to the two oxygen-free copper pillars, and the inner walls of the two circular holes are provided with a metal layer, the oxygen-free copper pillars are installed in the circular holes and fixed to the metal layer by a brazing process.

[0011] Preferably, the inner cover plate and the first mounting layer, and the upper electrode plate and the first mounting layer are fixed by welding.

[0012] Preferably, the outer cover plate and the outer frame, the outer frame and the first mounting layer, the first mounting layer and the second mounting layer, and the second mounting layer and the lower electrode plate are all fixed by welding.

[0013] Preferably, the first mounting layer and the second mounting layer are both made of alumina ceramic material.

[0014] Preferably, the outer frame is a hollow fallable frame.

[0015] The present invention also provides a method for designing and manufacturing a ceramic tube shell as described in any one of the above technical solutions, comprising the following steps:

[0016] S1. Through simulation tests, the resistance values ​​of ceramic tube shells with oxygen-free copper pillars of different conductivity and different numbers of oxygen-free copper pillars are simulated;

[0017] S2. According to the simulation results in S1, a ceramic shell sample is produced;

[0018] S3. Use a resistance measuring instrument to measure the actual resistance of the ceramic tube shell sample, compare the actual resistance with the simulated resistance value in S1, and compare the actual resistance with the resistance value of a conventional ceramic tube shell;

[0019] S4. According to the comparison result in S3, the parameter information of the oxygen-free copper column is adjusted, and finally the parameter information of the required ceramic tube shell is obtained, and the ceramic tube shell is produced.

[0020] Compared with the prior art, the present invention has achieved the following technical effects:

[0021] The ceramic tube shell and the design and manufacturing method thereof provided by the present invention, the conduction component includes an upper electrode plate, an oxygen-free copper column and a lower electrode plate, the upper electrode plate and the oxygen-free copper column are both installed inside the main body frame, the lower electrode plate is installed at the bottom of the main body frame, and the two ends of the oxygen-free copper column are respectively connected to the upper electrode plate and the lower electrode plate to achieve circuit conduction. At the same time, the oxygen-free copper column has a small conduction resistance and a large conduction rate, thereby achieving micro-resistance and low-energy consumption conduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is a schematic diagram of the structure of the ceramic tube shell in the first embodiment;

[0024] Figure 2 It is a structural explosion diagram of the ceramic tube shell in Example 1;

[0025] Figure 3 for Figure 2 A schematic diagram at another angle;

[0026] In the figure: 1-outer cover, 2-outer frame, 3-first mounting layer, 4-second mounting layer, 5-upper plate, 6-inner cover, 7-mounting frame, 8-round hole, 9-oxygen-free copper column, 10-lower plate. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] The purpose of the present invention is to provide a ceramic tube shell to solve the problems existing in the prior art and achieve micro-resistance conduction.

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] Embodiment 1

[0031] like Figure 1-Figure 3As shown, this embodiment provides a ceramic tube shell, including a main body frame and a conductive component, the conductive component includes an upper electrode plate 5, an oxygen-free copper column 9 and a lower electrode plate 10, the upper electrode plate 5 and the oxygen-free copper column 9 are both installed inside the main body frame, the lower electrode plate 10 is installed at the bottom of the main body frame, and the two ends of the oxygen-free copper column 9 are respectively connected to the upper electrode plate 5 and the lower electrode plate 10 to achieve circuit conduction. At the same time, the oxygen-free copper column 9 has a small on-resistance and a large conductivity, thereby achieving micro-resistance and low-energy consumption conduction.

[0032] Specifically, the main body frame includes an outer frame 2, an outer cover plate 1 and a mounting layer group. Both ends of the outer frame 2 are open, and the first end of the outer frame 2 is connected to the outer cover plate 1 and sealed by the outer cover plate 1. The second end of the outer frame 2 is connected to the mounting layer group and sealed by the mounting layer group to achieve the encapsulation of the internal structure of the ceramic tube shell. The upper electrode plate 5 is installed in the mounting layer group, and the lower electrode plate 10 is installed on the side of the mounting layer group away from the outer cover plate 1. The oxygen-free copper column 9 is installed in the mounting layer group, and then the relatively arranged upper electrode plate 5 and lower electrode plate 10 are connected and conductive through the oxygen-free copper column 9.

[0033] The mounting layer group includes a first mounting layer 3 and a second mounting layer 4 stacked together, one side of the first mounting layer 3 is connected to the outer frame 2, the other side of the first mounting layer 3 is connected to one side of the second mounting layer 4, the other side of the second mounting layer 4 is connected to the lower electrode plate 10, and the upper electrode plate 5 is installed in the first mounting layer 3 to achieve the limitation and fixation of the upper electrode plate 5, and the oxygen-free copper column 9 can pass through the first mounting layer 3 and the second mounting layer 4, thereby realizing the connection between the upper electrode plate 5 and the lower electrode plate 10 on both sides.

[0034] Two mounting frames 7 are provided on the first mounting layer 3, and an upper electrode plate 5 is installed in one mounting frame 7, and an inner cover plate 6 is installed in the other mounting frame 7. There are two oxygen-free copper pillars 9, and one end of the two oxygen-free copper pillars 9 is respectively connected to the side of the inner cover plate 6 away from the outer cover plate 1 and the side of the upper electrode plate 5 away from the outer cover plate 1, so that the conduction between the inner cover plate 6 and the lower electrode plate 10 and the conduction between the upper electrode plate 5 and the lower electrode plate 10 are respectively realized through the two oxygen-free copper pillars 9.

[0035] Two circular holes 8 are provided on the second mounting layer 4, and the two circular holes 8 correspond to the two oxygen-free copper pillars 9 one by one, and the inner walls of the two circular holes 8 are provided with a metal layer, and the metal layer is formed on the inner wall of the circular hole 8 by the hole wall slurry hanging process, and then the oxygen-free copper pillar 9 is installed in the circular hole 8 and fixed with the metal layer by the brazing process. The existence of the metal layer can facilitate the brazing of the oxygen-free copper pillar 9 in the circular hole 8. At the same time, in this embodiment, nickel plating of the sides is no longer required. Compared with the prior art, the problem of inconsistent silver creep during brazing is effectively solved, ensuring that the silver creep can be evenly distributed, and improving the quality and consistency of welding. This improvement not only enhances the stability of the product, but also improves its reliability, meeting the demand for high-quality products.

[0036] The inner cover plate 6 and the first mounting layer 3 , as well as the upper electrode plate 5 and the first mounting layer 3 , are fixed by welding to improve the connection stability.

[0037] The outer cover plate 1 and the outer frame 2, the outer frame 2 and the first mounting layer 3, the first mounting layer 3 and the second mounting layer 4, and the second mounting layer 4 and the lower electrode plate 10 are fixed by welding to improve the stability of the overall connection.

[0038] The first mounting layer 3 and the second mounting layer 4 are both made of alumina ceramic material.

[0039] The outer frame 2 is a hollow fellable frame.

[0040] Through the above design, this embodiment can achieve an insulation resistance of ≥1*10 10 Ω, on-resistance ≤0.006Ω, leakage rate ≤1*10 -9 Pa·m 3 / s(He), warpage ≤0.06mm, and the ceramic substrate should not have peeling of the metallization layer or lack of ceramic material at 850℃.

[0041] Embodiment 2

[0042] This embodiment provides a design and manufacturing method of a ceramic tube shell as in Embodiment 1, comprising the following steps:

[0043] S1. Through simulation tests, the resistance values ​​of the ceramic shells under the oxygen-free copper pillars 9 and different numbers of oxygen-free copper pillars 9 are simulated to obtain simulation results;

[0044] S2. According to the simulation results in S1, the required ceramic shell sample is produced;

[0045] S3. Use a resistance measuring instrument to measure the actual resistance of the ceramic shell sample, compare the actual resistance with the simulated resistance value in S1 to improve the accuracy value, and compare the actual resistance with the resistance value of a conventional ceramic shell (i.e., a ceramic shell that conventionally uses a tungsten material filling column), and then verify the simulation result of the ceramic shell sample to ensure that a micro-resistance, low-energy consumption ceramic shell sample is obtained;

[0046] S4. According to the comparison result in S3, the parameter information of the oxygen-free copper column 9 is adjusted, and finally the required parameter information of the ceramic tube shell is obtained, and the ceramic tube shell is produced to achieve mass production of the ceramic tube shell.

[0047] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A ceramic tube shell, characterized in that: It includes a main body frame and a conduction component, wherein the conduction component includes an upper electrode plate, an oxygen-free copper column and a lower electrode plate, wherein the upper electrode plate and the oxygen-free copper column are both installed inside the main body frame, and the lower electrode plate is installed at the bottom of the main body frame, and the two ends of the oxygen-free copper column are respectively connected to the upper electrode plate and the lower electrode plate.

2. The ceramic tube shell according to claim 1, characterized in that: The main body frame includes an outer frame, an outer cover plate and an installation layer group, both ends of the outer frame are open, and the first end of the outer frame is connected to the outer cover plate and sealed by the outer cover plate, the second end of the outer frame is connected to the installation layer group and sealed by the installation layer group, the upper electrode plate is installed in the installation layer group, the lower electrode plate is installed on the side of the installation layer group away from the outer cover plate, and the oxygen-free copper column is installed in the installation layer group.

3. The ceramic tube shell according to claim 2, characterized in that: The mounting layer group includes a first mounting layer and a second mounting layer stacked together, one side of the first mounting layer is connected to the outer frame, the other side of the first mounting layer is connected to one side of the second mounting layer, the other side of the second mounting layer is connected to the lower electrode plate, the upper electrode plate is installed in the first mounting layer, and the oxygen-free copper column can pass through the first mounting layer and the second mounting layer.

4. The ceramic tube shell according to claim 3, characterized in that: Two mounting frames are provided on the first mounting layer, and the upper electrode plate is installed in one mounting frame, and an inner cover plate is installed in the other mounting frame. There are two oxygen-free copper columns, and one end of the two oxygen-free copper columns is respectively connected to a side of the inner cover plate away from the outer cover plate and a side of the upper electrode plate away from the outer cover plate.

5. The ceramic tube shell according to claim 4, characterized in that: The second mounting layer is provided with two circular holes, the two circular holes correspond to the two oxygen-free copper pillars one by one, and the inner walls of the two circular holes are provided with a metal layer, the oxygen-free copper pillars are installed in the circular holes and fixed to the metal layer by a brazing process.

6. The ceramic tube shell according to claim 4, characterized in that: The inner cover plate and the first mounting layer, as well as the upper electrode plate and the first mounting layer are fixed by welding.

7. The ceramic tube shell according to claim 3, characterized in that: The outer cover plate and the outer frame, the outer frame and the first mounting layer, the first mounting layer and the second mounting layer, and the second mounting layer and the lower electrode plate are all fixed by welding.

8. The ceramic tube shell according to claim 3, characterized in that: The first installation layer and the second installation layer are both made of alumina ceramic material.

9. The ceramic tube shell according to claim 2, characterized in that: The outer frame is a hollow fellable frame.

10. A method for designing and manufacturing a ceramic tube shell according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. Through simulation tests, the resistance values ​​of ceramic tube shells with oxygen-free copper pillars of different conductivity and different numbers of oxygen-free copper pillars are simulated; S2. According to the simulation results in S1, a ceramic shell sample is produced; S3. Use a resistance measuring instrument to measure the actual resistance of the ceramic tube shell sample, compare the actual resistance with the simulated resistance value in S1, and compare the actual resistance with the resistance value of a conventional ceramic tube shell; S4. According to the comparison result in S3, the parameter information of the oxygen-free copper column is adjusted, and finally the parameter information of the required ceramic tube shell is obtained, and the ceramic tube shell is produced.

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