Nano-silver sintering machine

Abstract

The nano-silver sintering machine comprises a base, four guide columns are fixed to the positions, close to the four corners, of the base, the four guide columns are arranged in parallel, and a first lifting component is installed on the base; the upper mounting plate is fixed to the ends, away from the fixed platform, of the four guide columns; the middle platform is connected with the output end of the first lifting component, and the middle platform can slide along the four guide columns under the action of the first lifting component; the pressing assembly is used for placing a chip jig, the pressing assembly is arranged between the upper mounting plate and the base, and the pressing assembly is partially mounted on the upper mounting plate; and the automatic film feeding device is mounted on the middle platform, and is used for pulling the film from one side of the middle platform to cover the film on the chip jig and winding the used film. The automatic film feeding mode of the nano-silver sintering machine is achieved through the material receiving assembly and the feeding assembly, the production time can be saved, operation is convenient, and pollution of manual operation to films and chips is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of nano-silver sintering equipment, and in particular relates to a nano-silver sintering machine. Background Art

[0002] Sintering is a solid-state phase change process in which powder particles are combined together through surface diffusion under external pressure to form a dense solid material. Compared with other metal materials, silver has higher thermal conductivity and low resistivity, and due to its higher strength and hardness and lower elastic modulus, it has better mechanical properties and application reliability.

[0003] Nanosilver sintering machine is a device used to sinter nano-scale silver powder. Nanosilver sintering is a new type of packaging material used for power semiconductor devices. It is specifically used to solder chips to corresponding circuit boards. During the processing, in order to prevent oxidation of the chip solder layer, it is usually necessary to seal the welding chamber on the chip fixture by covering it with a film.

[0004] During production and processing, a variety of process gases will be introduced into the vacuum welding chamber, and a thin film will be covered on the top of the welding chamber to keep the welding area in a low-oxygen environment. On the one hand, this can solve the key anti-oxidation problem in the sintering process. On the other hand, it can prevent the solder from contaminating the pressure head during high-temperature sintering, prevent the pressure head from direct contact with the chip, and reduce the risk of damage to the pressure head.

[0005] At present, operators still use manual replacement of the film on the chip fixture. The defects are: first, the manual operation method will pollute the film and chip, causing the chip and the welding layer to be contaminated with impurities, affecting the quality of welding; second, the manual operation method of film feeding is time-consuming and seriously wastes production time. At the same time, the manual operation method is inefficient during processing. Faced with the current rapidly developing semiconductor market, the industry is in urgent need of improving the reliability and efficiency of sintering equipment processing. Summary of the invention

[0006] In order to solve the technical problems that the chip and the welding layer are contaminated with impurities when the thin film on the chip fixture is manually replaced, which affects the quality of welding, and the manual film feeding method is time-consuming and inefficient, the present invention provides a nano silver sintering machine, which realizes the automatic film feeding method of the nano silver sintering machine through a material receiving component and a material feeding component, can save production time, facilitate operation, and reduce the pollution of the film and chip by manual operation.

[0007] In order to solve the above technical problems, the present invention adopts the following technical solutions: A nano silver sintering machine, comprising: A base, wherein four guide columns are fixed near the four corners of the base, the four guide columns are arranged parallel to each other, and a first lifting component is installed on the base; An upper mounting plate fixed to ends of the four guide posts away from the fixed platform; An intermediate platform connected to the output end of the first lifting component, wherein the intermediate platform can slide along the four guide posts under the action of the first lifting component; A pressing assembly for placing a chip fixture, the pressing assembly being disposed between the upper mounting plate and the base, and the pressing assembly being partially mounted on the upper mounting plate; and An automatic film feeding device is installed on the intermediate platform, and is used to pull the film from one side of the intermediate platform to cover the chip fixture, and to roll up the used film.

[0008] Furthermore, the automatic film feeding device comprises: A feeding assembly installed on one side of the intermediate platform, the feeding assembly is used to fix the rolled film; A receiving assembly, which is arranged opposite to the feeding assembly, and can pull the film to cover the chip fixture and then rewind it; and A clamping assembly is arranged between the material receiving assembly and the material feeding assembly, and the clamping assembly has a pressing plate located above the chip fixture, and the pressing plate is used to press the film toward the working cavity of the chip fixture.

[0009] Furthermore, the material receiving assembly includes a material receiving plate fixed to one side of the middle platform, two oppositely arranged first roller mounting plates are fixed on the material receiving plate, one of the first roller mounting plates is installed with a driving unit, an active roller is coaxially connected to the output end of the driving unit, the active roller is rotatably installed between the two first roller mounting plates, a pressure roller is rotatably installed between the two first roller mounting plates, the pressure roller is used to press the film onto the surface of the active roller, a material receiving roller is also installed on one of the first roller mounting plates, the material receiving roller is transmission-connected to the driving unit, and the film is wound onto the material receiving roller after passing through the active roller.

[0010] Further, the driving unit includes a driving motor, a first gear installed at an output end of the driving motor, a second gear meshing with the first gear, a first pulley coaxially connected to the second gear, and a second pulley; Among them, the driving motor is installed on one side of the first roller mounting plate through a motor seat, the first gear is coaxially connected to the active roller, the second gear is rotatably mounted on this first roller mounting plate, the receiving roller is fixed to one side of the first roller mounting plate through a belt mounting plate, the receiving roller is coaxially connected to the second pulley, and the second pulley is connected to the first pulley through a belt drive.

[0011] Furthermore, the material receiving assembly also includes a first support unit for adjusting the tension of the film, the first support unit includes a first adjustment plate and a first support guide roller, a strip-shaped adjustment hole is opened in the middle of the first adjustment plate along the length direction, one end of the first adjustment plate is rotatably connected to the first roller mounting plate, and the first support guide roller is rotatably installed on the end of the first adjustment plate away from the first roller mounting plate, the first support guide roller is used to support the lower part of the film, and the film first passes through the first support guide roller and then passes through the active roller.

[0012] Furthermore, the material receiving assembly also includes two clamping structures, and the two clamping structures respectively include clamping screws threadedly connected to the first roller mounting plates respectively, and a clamping slider sleeved on the pressure roller, and the clamping slider is slidably set in a slide groove opened in the first roller mounting plate, and the end of the clamping screw abuts against one side of the clamping slider so that rotating the clamping screw can push the pressure roller to move through the clamping slider.

[0013] Furthermore, the feeding assembly includes a feeding plate fixed to one side of the middle platform, a second roller mounting plate fixedly mounted on the feeding plate, and a fixed shaft for fixing the rolled film, the fixed shaft is rotatably mounted on the second roller mounting plate, baffles are fixed near both ends of the fixed shaft, the distance between the two baffles matches the width of the film, the feeding plate is fixed with a laser sensor, and the laser sensor is used to detect the remaining state of the rolled film on the fixed shaft.

[0014] Furthermore, the pressing assembly includes a first heating platform, a pressing head fixed on the first heating platform, and a second heating platform arranged corresponding to the pressing head. The first heating platform is fixed on the side of the upper mounting plate facing the middle platform, and the second heating platform is fixed on the middle platform. The second heating platform is used to place the chip fixture.

[0015] Furthermore, the feeding assembly also includes a second supporting unit for adjusting the tension of the film, the second supporting unit includes a second adjusting plate and a second supporting guide roller, a strip-shaped adjusting hole is opened in the middle of the second adjusting plate along the length direction, one end of the second adjusting plate is rotatably connected to the second roller mounting plate, and the second supporting guide roller is rotatably installed on the end of the second adjusting plate away from the second roller mounting plate, and the second supporting guide roller is used to support the lower part of the film.

[0016] Furthermore, the clamping assembly includes four second lifting components installed on the middle platform, and the ends of the second lifting components away from the middle platform are connected to the pressure plate. The clamping assembly also includes two guide plates installed at both ends of the pressure plate. The length direction of the guide plate is perpendicular to the length direction of the film. The guide plate can contact the passing film, and the middle part of the guide plate has a guide groove matching the width of the film.

[0017] Compared with the prior art, the beneficial effects of this solution are: 1. The nano-silver sintering machine of the present invention acts on the middle platform through the first lifting component, so that the chip fixture can be lifted to be close to or away from the first heating platform, thereby improving the degree of automation of production. A material receiving component is installed on the middle platform, and a material feeding component is installed on one side of the middle platform corresponding to the material receiving component. The material receiving component and the material feeding component realize the automatic film feeding mode of the nano-silver sintering machine, which can save production time, facilitate operation, and reduce the pollution of thin films and chips caused by manual operation.

[0018] 2. The pressing plate, film and sealing ring on the working chamber of the chip fixture of the pressing assembly of the nano-silver sintering machine of the present invention form a sealed chamber under the pressure of the pressing assembly. By setting the pressing assembly, the sealing effect of introducing various process gases into the working chamber of the chip fixture during the production process is better, so that the welding area can continuously maintain a low-oxygen environment, solving the key anti-oxidation problem in the sintering process. By setting the pressing assembly, the film can be prevented from lateral deflection during movement, thereby ensuring the stability of the sealing operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is the main view of the nano silver sintering machine; Figure 2 This is the front view of the automatic film feeding device; Figure 3 It is a schematic diagram of the structure of the receiving component; Figure 4 It is a schematic diagram of the connection of the pressing structure of the receiving component; Figure 5 It is a schematic diagram of the feeding component structure.

[0020] The reference numerals are: Intermediate platform 1, chip fixture 11, second heating platform 12, first heating platform 13, feeding assembly 2, feeding plate 21, second roller mounting plate 22, fixed shaft 23, baffle 24, laser sensor 25, second support unit 26, second adjustment plate 261, second support guide roller 262, receiving assembly 3, receiving plate 31, first roller mounting plate 32, slide 321, active roller 33, hand wheel 331, pressure roller 34, receiving roller 35, third roller mounting plate 351, drive unit 36, driving motor 361, first gear 362, second gear 363, conveyor belt 364, motor seat 365, first support unit 37, first adjustment plate 371, first support guide roller 372, adjustment hole 373, clamping structure 38, clamping screw 381, clamping slider 382, ​​clamping assembly 4, pressure plate 41, second lifting component 42, guide plate 43, film 5, base 6, first lifting component 61, fixed platform 62, guide column 63, upper mounting plate 64. DETAILED DESCRIPTION

[0021] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0022] In the field of chip packaging, silver nano solder paste is an important electronic packaging connection material. The sintering temperature is much lower than the melting point of its corresponding bulk material. The sintered body has excellent thermal conductivity and electrical conductivity, and can achieve high-temperature sintering and low-temperature service. Traditional tin-based solder paste, conductive glue, etc. are prone to failure at high temperatures (>300°C) and difficult to serve. Therefore, silver nano solder paste can effectively replace traditional connection materials in the field of high-temperature and high-power chip connection.

[0023] To this end, the present invention provides a nano silver sintering machine, such as Figure 1 As shown, including, The base 6 has a fixed platform 62 fixed on the upper part of the base 6. The fixed platform 62 is a flat plate structure. Four guide columns 63 are fixed near the four corners of the fixed platform 62 of the base 6. The four guide columns 63 are arranged parallel to each other. The base 6 is equipped with a first lifting component 61. The guide columns 63 are arranged perpendicular to the fixed platform 62. The guide columns 63 are sleeved with linear bearings on the outside and are slidably connected to the intermediate platform through the linear bearings. An upper mounting plate 64, which is fixed to the ends of the four guide posts 63 away from the fixed platform 62; The intermediate platform 1 is a flat plate structure, and is horizontally arranged. The intermediate platform 1 is connected to the output end of the first lifting component 61. The intermediate platform 1 can slide along the four guide columns 63 under the action of the first lifting component 61; A pressing assembly for placing the chip fixture 11, the pressing assembly is arranged between the upper mounting plate 64 and the base 6, and the pressing assembly is partially mounted on the upper mounting plate 64; and An automatic film feeding device is installed on the intermediate platform 1 , and is used to pull the film 5 from one side of the intermediate platform 1 to cover the chip fixture 11 , and to roll up the used film 5 .

[0024] In this embodiment, the automatic film feeding device is used to pull the film 5 from one side of the intermediate platform 1 to cover the chip fixture 11, and to roll up the used film 5. The first lifting component 61 is operated to drive the intermediate platform 1 to move along the height direction of the guide column 63, and the chip to be processed on the chip fixture 11 is processed through the pressing assembly.

[0025] Furthermore, the automatic film feeding device includes: Figure 1 and Figure 2 As shown: A feeding assembly 2 installed on one side of the intermediate platform 1, the feeding assembly 2 is used to fix a rolled film, the rolled film is a film to be used; A receiving assembly 3, which is arranged opposite to the feeding assembly 2, and the receiving assembly 3 can pull the film 5 to cover the chip fixture 11 and then rewind it; and The clamping assembly 4 is arranged between the receiving assembly 3 and the feeding assembly 2 , and has a pressing plate 41 located above the chip fixture 11 , and the pressing plate 41 is used to press the film 5 toward the working cavity of the chip fixture 11 .

[0026] According to a specific embodiment provided by the present invention, a receiving assembly 3 and a feeding assembly 2 are respectively provided on the left and right sides of the middle platform 1. During the operation of the receiving assembly 3, the film 5 is forced to be flattened at the bottom section of the pressing plate 41 due to the tension formed by the winding of multiple rollers of the feeding assembly 2 and the receiving assembly 3, thereby avoiding wrinkles during lamination.

[0027] The nano silver sintering machine of the present invention adopts an automated film feeding method, which can save production time, facilitate operation, and reduce the contamination of the film 5 and the chip caused by manual operation. The sealing rings on the pressing plate 41, the film 5 and the working chamber of the chip fixture 11 form a sealed chamber under the pressure of the clamping component 4. During the production process, a variety of process gases are introduced into this working chamber to keep the welding area in a low-oxygen environment, solving the key anti-oxidation problem in the sintering process; at the same time, the vacuum working chamber is introduced with process gases to prevent the solder from contaminating the pressure head during the high-temperature sintering process, prevent the pressure head from directly contacting the chip, and reduce the risk of damage to the pressure head. At the same time, because the film 5 has a certain thickness and elasticity, it can protect the chip under the high pressure of the sintering machine pressure head, and the chip will not be unevenly stressed and broken when it is slightly uneven.

[0028] Further, see Figure 3 The receiving assembly 3 includes a receiving plate 31 fixed to one side of the middle platform 1, and two oppositely arranged first roller mounting plates 32 are fixed on the receiving plate 31, and one of the first roller mounting plates 32 is installed with a driving unit 36, and the output end of the driving unit 36 ​​is coaxially connected with an active roller 33, and the active roller 33 is rotatably installed between the two first roller mounting plates 32, and a pressure roller 34 is rotatably installed between the two first roller mounting plates 32, and the pressure roller 34 is used to press the film 5 to the surface of the active roller 33, and a receiving roller 35 is also installed on one of the first roller mounting plates 32, specifically, a third roller mounting plate 351 is installed on the first roller mounting plate 32, and the receiving roller 35 is rotatably installed on the third roller mounting plate 351, and the height of the receiving roller 35 is greater than the active roller 33. The receiving roller 35 is transmission-connected with the driving unit 36, and the film 5 is rolled up to the receiving roller 35 after passing through the active roller 33.

[0029] According to a specific embodiment provided by the present invention, specifically, the receiving plate 31 is vertically fixed to the end surface of one side of the middle platform 1, the first roller mounting plates 32 are arranged parallel to each other and are vertically fixed to the receiving plate 31, the receiving roller 35, the pressure roller 34, and the active roller 33 are arranged parallel to each other, and the two first roller mounting plates 32 have coaxial holes, and bearings are installed in the holes. The active roller 33 and the pressure roller 34 are respectively installed in the bearings and can rotate freely. When the driving unit 36 ​​is working, the active roller 33 rotates, and the receiving roller 35 is wound with the used film 5. The receiving roller 35 is connected to the driving unit 36 ​​in a transmission manner. The used film 5 is wound to the receiving roller 35 after passing through the active roller 33. The receiving roller 35 is fixed with a stopper near both ends to limit the winding position of the film 5 to the middle of the receiving roller 35.

[0030] Further, the driving unit 36 ​​includes a driving motor 361, a first gear 362 installed at the output end of the driving motor 361, a second gear 363 meshing with the first gear 362, a first pulley and a second pulley coaxially connected to the second gear 363; Among them, the driving motor 361 is installed on one side of the first roller mounting plate 32 through a motor seat 365, the first gear 362 is coaxially connected to the active roller 33, the second gear 363 is rotatably installed on this first roller mounting plate 32, and the receiving roller 35 is fixed to one side of the first roller mounting plate 32 through a belt mounting plate, the receiving roller 35 is coaxially connected to the second pulley, and the second pulley is connected to the first pulley through a belt drive.

[0031] According to a specific embodiment provided by the present invention, this embodiment provides a specific structure of a driving unit 36, wherein a motor seat 365 is vertically fixed on one side of a first roller mounting plate 32, and the active roller 33 is driven by a driving motor 361 to drive the second gear 363 and the first gear 362 to mesh and rotate counterclockwise, wherein the pitch circle diameter of the first gear 362 is larger than the pitch circle diameter of the second gear 363, thereby forming a deceleration effect; the first gear 362 of the active roller 33 is coaxially mounted with a first pulley, and at the same time, a second pulley is also mounted on the same side of the receiving roller 35, and the receiving roller 35 is passively rotated clockwise via a belt drive, thereby achieving the effect of winding up the film 5.

[0032] Furthermore, the receiving assembly 3 further includes a first support unit 37 for adjusting the tension of the film 5, the first support unit 37 includes a first adjustment plate 371 and a first support guide roller 372, a strip-shaped adjustment hole 373 is provided in the middle of the first adjustment plate 371 along the length direction, one end of the first adjustment plate 371 is rotatably connected to the first roller mounting plate 32, and the first support guide roller 372 is rotatably mounted on the end of the first adjustment plate 371 away from the first roller mounting plate 32, the first support guide roller 372 is used to support the lower part of the film 5, and the film 5 first passes through the first support guide roller 372 and then passes through the active roller 33. The first support guide roller 372 is arranged in parallel with the active roller 33, and the height of the first support guide roller 372 is greater than that of the receiving roller 35.

[0033] According to a specific embodiment provided by the present invention, in order to better adjust the tension of the film 5 during winding, the winding assembly of this embodiment further includes a first support unit 37, and a first support guide roller 372 is arranged above the active roller 33 and the receiving roller 35. The lower end of the first adjustment plate 371 is rotatably connected to the first roller mounting plate 32 through a fastener, that is, the fastener (such as a bolt) is arranged in a strip-shaped adjustment hole 373, so that the first adjustment plate 371 can rotate relative to the first roller mounting plate 32, and the height and angle can be adjusted to find a suitable tension of the film 5.

[0034] Furthermore, the material receiving assembly 3 also includes two pressing structures 38, such as Figure 4 The schematic diagram of the clamping structure connection of the receiving assembly shown in the figure, the two clamping structures 38 respectively include a clamping screw 381 threadedly connected to the first roller mounting plate 32, a clamping slider 382 sleeved on the pressing roller 34, the clamping slider 382 is slidably set in the slide groove 321 opened in the first roller mounting plate 32, and the end of the clamping screw 381 abuts against one side of the clamping slider 382, ​​so that the clamping screw 381 can be rotated to push the pressing roller 34 to move through the clamping slider 382. The active roller 33 is coaxially fixedly installed with a hand wheel 331, and the active roller 33 is provided with a hand wheel 331 on the opposite side of the driving motor 361, so that the film can be manually rolled when the equipment is not in operation.

[0035] According to a specific embodiment provided by the present invention, in order to adjust the pressure from the pressure roller 34 to the active roller 33 and better press the film 5 against the surface of the active roller 33, the material receiving assembly 3 of this embodiment further includes two clamping structures 38, which are respectively arranged corresponding to the two first roller mounting plates 32 and corresponding to the two ends of the pressure roller 34. In this embodiment, the clamping screw 381 is threadedly connected with the first roller mounting plates 32 where they are located, and the clamping screw 381 is arranged perpendicular to the pressure roller 34. The first roller mounting plate 32 is provided with a slide groove 321 along the length direction, and a clamping slider 382 is sleeved on the outside of the pressure roller 34. A bearing is installed between the clamping slider 382 and the pressure roller 34. The end of the clamping screw 381 extends into the slide groove 321 and abuts against one side of the clamping slider 382, ​​so that the rotation of the clamping screw 381 can push the pressure roller 34 to move through the clamping slider 382 to adjust the distance between the pressure roller 34 and the active roller 33.

[0036] In the present invention, the film 5 moves in the direction Figure 4 When the driving motor 361 is working, the film 5 is located on the upper part of the first supporting guide roller 372 for support, passes through the active roller 33 and bypasses the lower part of the active roller 33. At this time, the pressure roller 34 is pressed against the surface of the active roller 33 and is finally wound up by the receiving roller 35. A clamping screw 381 is set on the side of the first roller mounting plate 32, and the gap and pressure between the active roller 33 and the pressure roller 34 can be manually adjusted. The pressure roller 34 passively rotates clockwise driven by friction.

[0037] Further, see Figure 5 The feeding assembly 2 includes a feeding plate 21 fixed to one side of the intermediate platform 1, a second roller mounting plate 22 fixedly mounted on the feeding plate 21, and a fixed shaft 23 for fixing the rolled film 5. The fixed shaft 23 is rotatably mounted on the second roller mounting plate 22. Baffles 24 are fixed near both ends of the fixed shaft 23. The distance between the two baffles 24 matches the width of the film 5. The feeding plate 21 is fixed with a laser sensor 25, which is used to detect the remaining state of the rolled film 5 on the fixed shaft 23. The laser sensor 25 is set toward the film 5. The laser sensor 25 is used to detect the remaining state of the rolled film on the fixed shaft 23, that is, when the rolled film on the fixed shaft 23 is used up, the laser sensor 25 will send a corresponding signal.

[0038] According to a specific embodiment provided by the present invention, the feeding plate 21 is fixed on the side of the middle platform 1 opposite to the receiving plate 31, the paper tube of the rolled film is sleeved on the fixed shaft 23 and can rotate freely, and baffles 24 are arranged on both sides of the fixed shaft 23, and the baffles 24 are detachably connected to the fixed shaft 23 to prevent the paper tube of the rolled film 5 from sliding along the axis direction of the fixed shaft 23, and the rolled film 5 can be removed at the same time. The shape of the baffle 24 is not limited, and it can be a circular plate or a rectangular plate.

[0039] Furthermore, if Figure 1 As shown, the pressing assembly includes a first heating platform 13, a pressing head fixed on the first heating platform 13, and a second heating platform 12 corresponding to the pressing head. The first heating platform 13 is fixed on the side of the upper mounting plate 64 facing the intermediate platform 1, and the second heating platform 12 is fixed on the intermediate platform 1. The second heating platform 12 is used to place the chip fixture 11. The second heating platform 12 is horizontally installed on the upper part of the intermediate platform 1, and the chip fixture 11 is placed on the upper part of the second heating platform 12. The first heating platform 13 is installed on the upper mounting plate 64, and a pressing head is fixed on the side of the first heating platform 13 facing the second heating platform 12. The second heating platform 12 is fixed on the intermediate platform 1. When in use, the pressing plate 41 is first lowered to seal the film 5 on the working cavity of the chip fixture 11. The intermediate platform 1 rises with the operation of the first lifting component 61, and the pressing plate 41 is abutted against the first heating platform 13, so that the first heating platform 13 and the second heating platform 12 can jointly process the chip on the chip fixture 11.

[0040] Furthermore, the feeding assembly 2 also includes a second support unit 26 for adjusting the tension of the film 5, the second support unit 26 includes a second adjustment plate 261 and a second support guide roller 262, a strip-shaped adjustment hole 373 is opened in the middle of the second adjustment plate 261 along the length direction, one end of the second adjustment plate 261 is rotatably connected to the second roller mounting plate 22, and the second support guide roller 262 is rotatably installed on the end of the second adjustment plate 261 away from the second roller mounting plate 22, and the second support guide roller 262 is used to support the lower part of the film 5.

[0041] According to a specific embodiment provided by the present invention, the second support unit 26 and the first support unit 37 have the same structure, and the second support unit 26 and the first support unit 37 have the same structure and use principle. The difference is that the film 5 is first pulled from the fixed shaft 23 and then supported by the second support guide roller 262, the height of the second support guide roller 262 is greater than the fixed shaft 23, and then continues to pull to cover and seal the upper part of the working chamber of the chip fixture 11.

[0042] The second supporting guide roller 262 can adjust the height and angle to find the appropriate tension of the film 5. The second supporting guide roller 262 rotates counterclockwise under the traction of the film 5, and the paper tube of the rolled film 5 is sleeved on the fixed shaft 23 and also rotates counterclockwise.

[0043] Furthermore, the clamping assembly 4 includes four second lifting components 42 installed on the middle platform 1, and the ends of the second lifting components 42 away from the middle platform 1 are connected to the pressure plate 41. The clamping assembly 4 also includes two guide plates 43 installed at both ends of the pressure plate 41. The length direction of the guide plate 43 is arranged perpendicular to the length direction of the film 5. The guide plate 43 can contact the passing film 5, and the middle part of the guide plate 43 has a guide groove matching the width of the film 5.

[0044] According to a specific embodiment provided by the present invention, the first lifting component 61 and the second lifting component 42 can both adopt lifting structures such as cylinders, hydraulic cylinders or electric screws. In this embodiment, the first lifting component 61 and the second lifting component 42 adopt cylinders, which are vertically installed on the middle platform 1. After the cylinder works, it drives the pressure plate 41 to move up and down away from or close to the middle platform 1.

[0045] In order to ensure that the position of the film 5 when it moves can be directly above the chip fixture 11, the clamping assembly 4 of this embodiment also includes two guide plates 43 installed at both ends of the pressure plate 41. The film 5 passes through the guide plates 43 installed on the left and right sides of the intermediate platform 1 through the feeding assembly 2 and is finally rolled up by the film 5 receiving assembly 3. The cylinder can be specifically installed around the chip fixture 11, and the pressure plate 41 is located above the chip fixture 11. The bottom of the cylinder body is fixed on the intermediate platform 1, and its piston rod is fixed to the bottom of the pressure plate 41. When the cylinder is shortened, the pressure plate 41 can be driven to press the chip fixture 11 to prevent the chip fixture 11 from moving and cover the film 5 on the chip fixture 11 at the same time. At this time, the sealing rings on the pressure plate 41, the film 5 and the chip fixture 11 form a sealed cavity under the action of the cylinder pressure. During the production process, a variety of process gases are introduced into this cavity to keep the welding area in a low-oxygen environment to solve the key anti-oxidation problem in the sintering process. When the cylinder is extended, the pressure plate 41 can be driven to separate from the chip fixture 11 so that the chip can be removed when the process is completed.

[0046] The guide plate 43 is provided with guide grooves according to the width of the film 5 . Of course, protruding structures may also be fixed on both ends of the guide plate 43 so that the film 5 passes through the guide grooves to prevent the film 5 from being greatly offset relative to the chip fixture 11 .

[0047] Finally, it should be noted that in the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0048] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A nano silver sintering machine, characterized in that: include, A base, wherein four guide columns are fixed near the four corners of the base, the four guide columns are arranged parallel to each other, and a first lifting component is installed on the base; An upper mounting plate fixed to ends of the four guide posts away from the fixed platform; An intermediate platform connected to the output end of the first lifting component, wherein the intermediate platform can slide along the four guide posts under the action of the first lifting component; A pressing assembly for placing a chip fixture, the pressing assembly being arranged between the upper mounting plate and the base, and the pressing assembly being partially mounted on the upper mounting plate; as well as An automatic film feeding device is installed on the intermediate platform, and is used to pull the film from one side of the intermediate platform to cover the chip fixture, and to roll up the used film.

2. A nano silver sintering machine as claimed in claim 1, characterized in that: The automatic film feeding device comprises: A feeding assembly installed on one side of the intermediate platform, the feeding assembly is used to fix the rolled film; A receiving assembly, which is arranged opposite to the feeding assembly, and can pull the film to cover the chip fixture and then rewind it; as well as A clamping assembly is arranged between the material receiving assembly and the material feeding assembly, and the clamping assembly has a pressing plate located above the chip fixture, and the pressing plate is used to press the film toward the working cavity of the chip fixture.

3. A nano silver sintering machine as claimed in claim 2, characterized in that: The material receiving assembly includes a material receiving plate fixed to one side of the middle platform, two oppositely arranged first roller mounting plates are fixed on the material receiving plate, one of the first roller mounting plates is installed with a driving unit, an active roller is coaxially connected to the output end of the driving unit, the active roller is rotatably installed between the two first roller mounting plates, a pressure roller is rotatably installed between the two first roller mounting plates, the pressure roller is used to press the film onto the surface of the active roller, a material receiving roller is also installed on one of the first roller mounting plates, the material receiving roller is transmission-connected to the driving unit, and the film is wound onto the material receiving roller after passing through the active roller.

4. A nano silver sintering machine as claimed in claim 3, characterized in that: The driving unit comprises a driving motor, a first gear mounted at an output end of the driving motor, a second gear meshing with the first gear, a first pulley coaxially connected with the second gear, and a second pulley; Among them, the driving motor is installed on one side of the first roller mounting plate through a motor seat, the first gear is coaxially connected to the active roller, the second gear is rotatably mounted on this first roller mounting plate, the receiving roller is fixed to one side of the first roller mounting plate through a belt mounting plate, the receiving roller is coaxially connected to the second pulley, and the second pulley is connected to the first pulley through a belt drive.

5. A nano silver sintering machine as claimed in claim 4, characterized in that: The material receiving assembly also includes a first support unit for adjusting the tension of the film, the first support unit includes a first adjustment plate and a first support guide roller, a strip-shaped adjustment hole is opened in the middle of the first adjustment plate along the length direction, one end of the first adjustment plate is rotatably connected to the first roller mounting plate, and the first support guide roller is rotatably installed on the end of the first adjustment plate away from the first roller mounting plate, the first support guide roller is used to support the lower part of the film, and the film first passes through the first support guide roller and then passes through the active roller.

6. A nano silver sintering machine as claimed in claim 3, 4 or 5, characterized in that: The material receiving assembly also includes two clamping structures, which respectively include clamping screws threadedly connected to the first roller mounting plates, and a clamping slider sleeved on the pressure roller. The clamping slider is slidably set in a slide groove opened in the first roller mounting plate, and the end of the clamping screw abuts against one side of the clamping slider so that rotating the clamping screw can push the pressure roller to move through the clamping slider.

7. A nano silver sintering machine as claimed in claim 6, characterized in that: The feeding assembly includes a feeding plate fixed to one side of the middle platform, a second roller mounting plate fixedly mounted on the feeding plate, and a fixed shaft for fixing the rolled film, the fixed shaft is rotatably mounted on the second roller mounting plate, baffles are fixed near both ends of the fixed shaft, the distance between the two baffles matches the width of the film, a laser sensor is fixed to the feeding plate, and the laser sensor is used to detect the remaining state of the rolled film on the fixed shaft.

8. A nano silver sintering machine as claimed in claim 1 or 7, characterized in that: The pressing assembly includes a first heating platform, a pressing head fixed on the first heating platform, and a second heating platform corresponding to the pressing head. The second heating platform is fixed on the middle platform and is used for placing a chip fixture.

9. A nano silver sintering machine as claimed in claim 8, characterized in that: The feeding assembly also includes a second supporting unit for adjusting the tension of the film, the second supporting unit includes a second adjusting plate and a second supporting guide roller, a strip-shaped adjusting hole is opened in the middle of the second adjusting plate along the length direction, one end of the second adjusting plate is rotatably connected to the second roller mounting plate, and the second supporting guide roller is rotatably installed on the end of the second adjusting plate away from the second roller mounting plate, and the second supporting guide roller is used to support the lower part of the film.

10. A nano silver sintering machine as claimed in claim 1 or 9, characterized in that: The clamping assembly includes four second lifting components installed on the middle platform, and the ends of the second lifting components away from the middle platform are connected to the pressure plate. The clamping assembly also includes two guide plates installed at both ends of the pressure plate. The length direction of the guide plate is perpendicular to the length direction of the film. The guide plate can contact the passing film, and the middle part of the guide plate has a guide groove matching the width of the film.

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