Heat conduction rubber mat film pasting cutting machine and processing method thereof

Abstract

The invention relates to a heat conduction rubber mat film pasting and cutting machine and a machining method thereof.The heat conduction rubber mat film pasting and cutting machine comprises a workbench, a movable material table, a cutting mechanism and a film pasting mechanism, and a heat conduction rubber mat is flatly laid on the movable material table; a cutting knife of the cutting mechanism cuts the heat-conducting rubber gasket on the cutting station twice, the heat-conducting rubber gasket forms at least two heat-conducting rubber gasket strips through the first cutting operation, a tearing strip is formed between every two adjacent heat-conducting rubber gasket strips, and the tearing strips are separated from the heat-conducting rubber gasket strips through external force before film pasting operation; the heat-conducting rubber cushion strip is cut for the second time to form at least two heat-conducting rubber cushion blocks; and the film pasting mechanism pastes the release film on the heat-conducting rubber cushion strip before the second cutting operation, so that the heat-conducting rubber cushion block formed after the second cutting operation carries the release film. The whole heat-conducting rubber gasket can be processed into a small heat-conducting rubber cushion block with the release film, and at least one side edge of the release film exceeds the heat-conducting rubber cushion block, so that the heat-conducting rubber gasket is convenient for a user to use.

Description

Technical Field

[0001] The present invention relates to the technical field of cutting machines, and in particular to a thermal conductive adhesive pad film cutting machine and a processing method thereof. Background Art

[0002] Thermally conductive pads are high-performance gap-filling thermal conductive materials. They have good viscosity, flexibility, compression properties, and excellent thermal conductivity. As a medium for heat transfer, thermally conductive pads are arranged between electronic devices and heat dissipation structures to increase the heat dissipation effect of electronic devices. Thermally conductive pads have a certain viscosity and are easier to install than ordinary insulating thermal conductive materials.

[0003] In the production process of thermal conductive adhesive pads, the thermal conductive adhesive pads will first be formed into a wide thermal conductive adhesive pad, and then cut into small thermal conductive adhesive pad blocks. The thermal conductive adhesive pad has a certain viscosity. In order to prevent the cut thermal conductive adhesive pad blocks from sticking together, it is necessary to stick a release film on the thermal conductive adhesive pad blocks to facilitate subsequent packaging. If the release film is affixed before the thermal conductive adhesive pad is cut, the release film and the thermal conductive adhesive pad will be cut together, making the release film and the thermal conductive adhesive pad block the same size. When the thermal conductive adhesive pad block is used later, it is difficult to separate the release film from the thermal conductive adhesive pad, resulting in inconvenience in the use of the thermal conductive adhesive pad; if the release film is affixed after the thermal conductive adhesive pad is cut into thermal conductive adhesive pad blocks, each thermal conductive adhesive pad block needs to be positioned before affixing the thermal conductive adhesive pad, resulting in a large workload in the process of affixing the release film, affecting the production efficiency of the thermal conductive adhesive pad.

[0004] Therefore, it is necessary to design a cutting machine for the thermal conductive adhesive pad to perform cutting and film laminating operations on the thermal conductive adhesive pad. Summary of the invention

[0005] In order to solve the deficiencies of the prior art, the present invention provides a thermal conductive adhesive pad film cutting machine and a processing method thereof.

[0006] In a first aspect, the present invention provides a thermal conductive adhesive pad film cutting machine, comprising a workbench, a movable material table, a cutting mechanism and a film pasting mechanism, wherein the workbench is provided with a loading and unloading station, a cutting station and a film pasting station in a straight line, and the movable material table is flatly laid with a thermal conductive adhesive pad, and drives the thermal conductive adhesive pad to reciprocate between the loading and unloading station, the cutting station and the film pasting station; The cutting mechanism is arranged at the cutting station, and the cutting knife of the cutting mechanism cuts the thermally conductive adhesive pad on the cutting station twice, and the cutting directions of the cutting knives of the two cuttings are perpendicular to each other. The thermally conductive adhesive pad is formed into at least two thermally conductive adhesive pad strips by the first cutting operation, and a tear strip is formed between two adjacent thermally conductive adhesive pad strips. The tear strip is separated from the thermally conductive adhesive pad strip by external force before the film laminating operation, and the thermally conductive adhesive pad strip is formed into at least two thermally conductive adhesive pad blocks by the second cutting operation; The film pasting mechanism is arranged at the film pasting station. The film pasting mechanism pastes the release film on the thermal conductive adhesive pad before the second cutting operation, so that the thermal conductive adhesive pad formed after the second cutting operation carries the release film. During the film pasting operation, part of the edge of the release film falls into the avoidance groove formed after the two adjacent thermal conductive adhesive pads are separated by the tear strip.

[0007] In some embodiments, the cutting mechanism includes a first cutting knife, a cutting lifting module and a cutting translation module, the first cutting knife is vertically arranged above the cutting station, the first cutting knife is arranged on a first lifting seat of the cutting lifting module, the cutting lifting module drives the first cutting knife to move in the Z-axis direction, the cutting lifting module is arranged on the first moving seat of the cutting translation module, and the cutting translation module drives the cutting lifting module and the first cutting knife to move in the X-axis direction to perform the first cutting operation on the thermal conductive adhesive gasket along the X-axis direction.

[0008] In some embodiments, the cutting mechanism also includes a rotating knife drive assembly, which is arranged on a first lifting seat, and the rotating knife drive assembly includes a knife seat and a rotating knife motor connected in a transmission manner, the first cutting knife is inserted into the axial hole of the knife seat, and the first cutting knife is connected to the axial hole by a key, and the rotating knife motor drives the first cutting knife to rotate 90° through the knife seat to perform a second cutting operation on the thermal conductive rubber pad strip along the Y-axis direction.

[0009] In some embodiments, the film sticking mechanism includes a film sticking device, a film sticking lifting module and a film sticking translation module. The film sticking device is arranged on a second lifting seat of the film sticking lifting module, and the film sticking lifting module drives the film sticking device to move in the Z-axis direction. The film sticking lifting module is arranged on the second moving seat of the film sticking translation module, and the film sticking translation module drives the film sticking lifting module and the film sticking device to move in the X-axis direction, so as to stick a release film on the thermal conductive adhesive pad strip along the X-axis direction.

[0010] In some embodiments, the cutting mechanism also includes a second cutting knife, which is arranged on a second lifting seat of the film lifting module. The film lifting module and the film translation module drive the second cutting knife to move in the X-axis and Z-axis directions to drive the second cutting knife to perform the first cutting operation on the thermal conductive adhesive gasket along the X-axis direction.

[0011] In some embodiments, the first cutting knife is a vibrating knife, and the second cutting knife is a circular knife.

[0012] The film sticking device comprises a feeding shaft, a traction roller, a film pushing roller, a film clamping head, a cutting knife and a film sticking pressing roller which are sequentially arranged on a second lifting seat along a feeding path of the release film material strip, the feeding shaft is sleeved with a material roll, and the material roll releases the release film material strip to the traction roller under the action of the film pushing roller, the film pushing roller is transmission-connected with a film pushing cylinder, and the film pushing cylinder drives the film pushing roller to move along a film pushing guide rail relative to the traction roller to pull the release film material strip; the film clamping head is transmission-connected with the film clamping cylinder, and the second lifting seat is provided with a guide plate opposite to the film clamping head on the other side of the release film material strip, and the film clamping head clamps the release film material strip between the film clamping head and the guide plate under the drive of the film clamping cylinder, and the film sticking pressing roller sticks the release film on the thermal conductive adhesive pad strip in a rolling manner, and the cutter is transmission-connected with a film cutting cylinder, and the film cutting cylinder drives the cutter to cut off the release film between the film clamping head and the film sticking pressing roller.

[0013] In some embodiments, the movable material table includes a slide, a splint and a support plate. Two splints are symmetrically arranged on both sides of the slide. Each splint is transmission-connected to an alignment cylinder. The alignment cylinder is installed on the slide. A thermal conductive rubber gasket is laid flat on the support plate. The support plate is placed on the slide. The two splints are driven by the alignment cylinder to align the support plate with the slide in the X-axis direction. The slide is transmission-connected to a linear module, and the linear module drives the slide and the support plate to move in the Y-axis direction.

[0014] In a second aspect, the present invention further provides a processing method of a thermally conductive adhesive pad film cutting machine, comprising the following steps performed by the thermally conductive adhesive pad film cutting machine described in the first aspect: Step 1: Loading: placing a support plate with a thermally conductive adhesive pad on a slide at a loading and unloading station, and centering the support plate and the thermally conductive adhesive pad on the slide in the X-axis direction through a clamping plate; Step 2, a first cutting operation, wherein the movable material table drives the thermally conductive adhesive gasket to move to the cutting station, and the thermally conductive adhesive gasket is cut for the first time by a cutting knife moving along the X-axis direction, wherein the first cutting operation forms at least one tear strip on the thermally conductive adhesive gasket, and each tear strip is formed by the thermally conductive adhesive gasket being cut twice by the cutting knife along two parallel paths; Step 3, waste removal, the movable material table drives the thermally conductive adhesive pad to move to the loading and unloading station, and uses external force to tear and separate the tear strip cut in step 2, and separate the thermally conductive adhesive pad into at least two thermally conductive adhesive pad strips, wherein the thermally conductive adhesive pad strips are arranged on the support plate along the X-axis direction; Step 4: film pasting operation, the moving material table drives the thermal conductive adhesive pad to move to the film pasting station, and the film pasting mechanism pastes a release film on each thermal conductive adhesive pad, wherein at least one side edge of the release film falls into the avoidance groove formed by the tear strip; Step 5, a second cutting operation, the movable material table drives the thermally conductive adhesive strip after film application to move to the cutting station, the first cutting knife rotates 90 degrees, the movable material table drives the thermally conductive adhesive strip to move along the Y-axis, the first cutting knife moves in the Y-axis direction relative to the thermally conductive adhesive strip, so as to perform a second cutting operation on the thermally conductive adhesive strip and the release film, and cut each thermally conductive adhesive strip into at least two thermally conductive adhesive pad blocks; Step six, unloading, the movable material table drives the thermal conductive adhesive pad to move to the loading and unloading station, takes the support plate and the thermal conductive adhesive pad off the slide, and separates the thermal conductive adhesive pad with a release film from the support plate.

[0015] In some embodiments, the cutting knife in step 2 is selected from the first cutting knife or the second cutting knife.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: the thermally conductive adhesive pad is cut twice and film-laminating is performed once through the cutting mechanism and the film-laminating mechanism; the thermally conductive adhesive pad strip and the tear strip are formed simultaneously in the first cutting operation; the tear strip is torn off before the film-laminating operation to form an avoidance groove between adjacent thermally conductive adhesive pad strips; during the film-laminating operation, the edge of the release film can fall into the avoidance groove so that the width of the release film can be greater than the width of the thermally conductive adhesive pad strip; before the second cutting operation, the release film is pasted on the thermally conductive adhesive pad, so that the cut and formed thermally conductive adhesive pad block carries the release film; after the second cutting operation, the edge of the release film carried by the thermally conductive adhesive pad block will exceed the thermally conductive adhesive pad block, thereby facilitating the separation of the release film when the thermally conductive adhesive pad block is used. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is one of the three-dimensional structural schematic diagrams of the thermal conductive adhesive pad film cutting machine according to the embodiment of the present application.

[0018] Figure 2 This is the second three-dimensional structural schematic diagram of the thermal conductive adhesive pad film cutting machine according to the embodiment of the present application.

[0019] Figure 3 It is a schematic diagram of the planar structure of the thermal conductive adhesive pad film cutting machine according to an embodiment of the present application.

[0020] Figure 4 It is a schematic diagram of the three-dimensional structure of the cutting mechanism of an embodiment of the present application.

[0021] Figure 5 It is a schematic diagram of the exploded structure of the first cutting knife and the first lifting seat of the embodiment of the present application.

[0022] Figure 6 This is one of the three-dimensional structural schematic diagrams of the film sticking mechanism of the embodiment of the present application.

[0023] Figure 7 This is the second three-dimensional structural schematic diagram of the film sticking mechanism of the embodiment of the present application.

[0024] Figure 8 It is a schematic diagram of the structure of the release film material belt feeding path of the film sticking mechanism in an embodiment of the present application.

[0025] Fig. 9 It is a schematic diagram of the three-dimensional structure of the mobile material table of an embodiment of the present application.

[0026] Fig.10 It is a schematic diagram of the processing of the thermal conductive pad according to an embodiment of the present application.

[0027] Reference numerals: 101, workbench; 102, frame; 103, beam; 104, loading and unloading station; 105, cutting station; 106, film laminating station; 201, thermal conductive adhesive pad; 202, thermal conductive adhesive pad strip; 203, thermal conductive adhesive pad block; 204, tear strip; 205, avoidance groove; 206, release film; 207, material feeding path; 100. Mobile material table; 1. Pallet; 11. Slide; 12. Clamp; 13. Alignment cylinder; 14. Linear module; 15. Drive motor; 16. Third screw pair; 17. Slide rail; 200, cutting mechanism; 2. First cutting knife; 21. Blade; 3. Cutting lifting module; 31. First lifting seat; 32. First lifting motor; 33. First screw rod pair; 4. Cutting translation module; 41. First moving seat; 42. First linear motor; 5. Rotary cutter drive assembly; 51. Rotary cutter motor; 52. Cutter seat; 53. Shaft hole; 54. Key; 6. Second cutting knife; 61. Knife adjustment assembly; 300, film sticking mechanism; 7. Film laminating device; 71. Unwinding shaft; 72. Pulling material roller; 73. Film-pressing material roller; 731. Film-pressing cylinder; 732. Film-pressing guide rail; 74. Film clamping head; 741. Film clamping cylinder; 742. Guide plate; 743. Guide block; 744. Adjusting screw; 75. Cutter; 76. Film laminating pressure roller; 77. Film cutting cylinder; 8. Film sticking lifting module; 81. Second lifting seat; 82. Second lifting motor; 83. Second screw rod pair; 9. Film-sticking translation module; 91. Second moving seat; 92. Second linear motor. DETAILED DESCRIPTION

[0028] Specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0029] refer to Figure 1The figure shows the three-dimensional structure of the thermal conductive adhesive pad film cutting machine. A cutting mechanism 200 and a film pasting mechanism 300 are arranged above the workbench 101. The thermal conductive adhesive pad 201 is spread on the movable material table 100. The movable material table 100 reciprocates along a straight line between the loading and unloading station 104, the cutting mechanism 200 and the film pasting mechanism 300. The cutting mechanism 200 cuts the thermal conductive adhesive pad twice and cuts the thermal conductive adhesive pad 201 into small pieces of thermal conductive adhesive pad blocks 203. The film pasting mechanism 300 performs film pasting operation on the thermal conductive adhesive pad strips 202.

[0030] refer to Figures 1 to 10 A thermal conductive adhesive pad film cutting machine includes a workbench 101, a movable material table 100, a cutting mechanism 200 and a film pasting mechanism 300. The workbench 101 is provided with a loading and unloading station 104, a cutting station 105 and a film pasting station 106 along a straight line. The movable material table 100 is flatly paved with a thermal conductive adhesive pad 201, and drives the thermal conductive adhesive pad 201 to reciprocate between the loading and unloading station 104, the cutting station 105 and the film pasting station 106.

[0031] Among them, the cutting mechanism 200 is set at the cutting station 105, and the cutting knife 75 of the cutting mechanism 200 cuts the thermal conductive adhesive gasket 201 on the cutting station 105 twice. The cutting directions of the cutting knife 75 of the two cuttings are perpendicular to each other. The thermal conductive adhesive gasket 201 forms at least two thermal conductive adhesive pads 202 through the first cutting operation, and a tear strip 204 is formed between two adjacent thermal conductive adhesive pads 202. The tear strip 204 is separated from the thermal conductive adhesive pad 202 by external force before the film laminating operation. The thermal conductive adhesive pad 202 forms at least two thermal conductive adhesive pad blocks 203 through the second cutting operation.

[0032] The film pasting mechanism 300 is arranged at the film pasting station 106. The film pasting mechanism 300 pastes the release film 206 on the thermal conductive adhesive pad 202 before the second cutting operation, so that the thermal conductive adhesive pad 203 formed after the second cutting operation carries the release film 206. During the film pasting operation, part of the edge of the release film 206 falls into the avoidance groove 205 formed after the two adjacent thermal conductive adhesive pads 202 are separated from the tear strip 204.

[0033] It should be further explained that, when the thermal conductive adhesive pad 201 is cut into a plurality of mutually parallel thermal conductive adhesive pad strips 202 in the first cutting operation, the method of separating two adjacent thermal conductive adhesive pad strips 202 is that the cutting knife 75 moves twice to cut out a tear strip 204 of smaller width, and the tear strip 204 and the two thermal conductive adhesive pad strips 202 on both sides have cutting seams, and the cutting seams can ensure that the tear strip 204 can be torn and separated from the thermal conductive adhesive pad strips 202. After the tear strip 204 is torn off, A certain width of avoidance groove 205 will be left between two adjacent thermally conductive adhesive pads 202. When the release film 206 is attached along the thermally conductive adhesive pad 202, the edge of the release film 206 can fall into the avoidance groove 205, so that the edge of the release film 206 at the avoidance groove 205 is not flush with the thermally conductive adhesive pad 202. After the second cutting operation, the side edge of the release film 206 can be exposed relative to the thermally conductive adhesive pad 203, thereby facilitating the thermally conductive adhesive pad 203 to tear off the release film 206 when in use.

[0034] The thermal conductive adhesive pad film cutting machine of this embodiment performs two cutting operations and one film pasting operation on the thermal conductive adhesive gasket 201 through the cutting mechanism 200 and the film pasting mechanism 300. The first cutting operation simultaneously forms the thermal conductive adhesive pad strip 202 and the tear strip 204. The tear strip 204 is torn off before the film pasting operation to form an avoidance groove 205 between adjacent thermal conductive adhesive pad strips 202. During the film pasting operation, the edge of the release film 206 can fall into the avoidance groove 205, so that the width of the release film 206 can be greater than the width of the thermal conductive adhesive pad strip 202. Before the second cutting operation, the release film 206 is pasted on the thermal conductive adhesive pad, so that the cut and formed thermal conductive adhesive pad block 203 carries the release film 206. After the second cutting operation, the edge of the release film 206 carried by the thermal conductive adhesive pad block 203 will exceed the thermal conductive adhesive pad block 203, thereby facilitating the separation of the release film 206 when the thermal conductive adhesive pad block 203 is used.

[0035] In order to cut the thermal conductive pad, in this embodiment, refer to Figures 1 to 5 The cutting mechanism 200 includes a first cutting knife 2, a cutting lifting module 3 and a cutting translation module 4. The first cutting knife 2 is vertically arranged above the cutting station 105. The first cutting knife 2 is arranged on a first lifting seat 31 of the cutting lifting module 3. The cutting lifting module 3 drives the first cutting knife 2 to move in the Z-axis direction. The cutting lifting module 3 is arranged on a first moving seat 41 of the cutting translation module 4. The cutting translation module 4 drives the cutting lifting module 3 and the first cutting knife 2 to move in the X-axis direction to perform the first cutting operation on the thermal conductive adhesive gasket 201 along the X-axis direction.

[0036] It should be further explained that the cutting and lifting module 3 includes a first lifting motor 32 and a first screw pair 33, the first lifting motor 32 and the first screw pair 33 are mounted on the first moving seat 41, the first lifting seat 31 is installed on the first screw pair 33, the first lifting motor 32 drives the first lifting seat 31 and the first cutting knife 2 to move up and down along the Z axis through the first screw pair 33, the first lifting motor 32 adopts a servo motor, which can accurately control the lifting height of the first cutting knife 2, so as to accurately cut the thermal conductive rubber pad, and can perform half-cut or full-cut operations on the thermal conductive rubber pad; the cutting translation module 4 includes a first linear motor 42, the first linear motor 42 drives the first moving seat 41 and the first cutting knife 2 to move along the X-axis direction, the translation movement of the first cutting knife 2 only needs to move along a straight line, and the use of the first linear motor 42 can well meet the translation movement of the first cutting knife 2, and at the same time, the first linear motor 42 is simpler in structure than the remaining linear modules 14, reducing the complexity of the entire machine and reducing the complexity of installation and maintenance.

[0037] It can be understood that, with such a configuration, the cutting lifting module 3 drives the first cutting knife 2 to move in the Z-axis direction, the cutting translation module 4 drives the first cutting knife 2 to move in the X-axis direction, and the thermal conductive adhesive pad moves in the Y-axis direction through the movable material table 100, so that the first cutting knife 2 can cut any position of the thermal conductive adhesive pad.

[0038] In order to change the cutting direction of the first cutting blade 2, in this embodiment, refer to Figure 4 and Figure 5 The cutting mechanism 200 also includes a rotary knife driving assembly 5, which is arranged on the first lifting seat 31. The rotary knife driving assembly 5 includes a knife seat 52 and a rotary knife motor 51 that are transmission-connected. The first cutting knife 2 is inserted into the shaft hole 53 of the knife seat 52. The first cutting knife 2 is connected to the shaft hole 53 through a key 54. The rotary knife motor 51 drives the first cutting knife 2 to rotate 90° through the knife seat 52 to perform a second cutting operation on the thermal conductive adhesive pad strip 202 along the Y-axis direction.

[0039] It can be understood that, with such a configuration, the rotary knife motor 51 and the knife seat 52 are connected by a direction transmission connection via gears or a synchronous belt, and the rotary knife motor 51 drives the first cutting knife 2 to rotate by rotating the knife seat 52. The blade 21 of the first cutting knife 2 is set along the X-axis direction during the first cutting operation, and the blade 21 of the first cutting knife 2 is rotated to the Y-axis direction by the rotary knife drive assembly 5, and cooperates with the thermal conductive glue pad strip 202 moving along the Y-axis direction driven by the movable material table 100 to cut the thermal conductive glue pad strip 202 into thermal conductive glue pad blocks 203.

[0040] In order to perform film bonding operation on the thermal conductive adhesive pad strip 202, in this embodiment, refer to Figures 6 to 8The film sticking mechanism 300 includes a film sticking device 7, a film sticking lifting module 8 and a film sticking translation module 9. The film sticking device 7 is arranged on the second lifting seat 81 of the film sticking lifting module 8. The film sticking lifting module 8 drives the film sticking device 7 to move in the Z-axis direction. The film sticking lifting module 8 is arranged on the second moving seat 91 of the film sticking translation module 9. The film sticking translation module 9 drives the film sticking lifting module 8 and the film sticking device 7 to move in the X-axis direction to stick the release film 206 on the thermal conductive adhesive pad strip 202 along the X-axis direction.

[0041] It should be further explained that the film-sticking lifting module 8 includes a second lifting motor 82 and a second screw pair 83. The second lifting motor 82 and the second screw pair 83 are mounted on the second moving seat 91. The second lifting motor 82 drives the second lifting seat 81 to move up and down along the Z-axis direction through the second screw pair 83. The second lifting motor 82 adopts a servo motor, which can accurately control the lifting height of the film-sticking device 7, so as to accurately stick the release film 206 on the thermal conductive adhesive pad 202; the film-sticking translation module 9 includes a second linear motor 92. The second linear motor 92 drives the second moving seat 91 and the film-sticking device 7 to move along the X-axis direction. When the film-sticking device 7 performs the film-sticking operation, it only needs to move along the X-axis. The release film 206 can be attached to the thermal conductive adhesive pad 202. The second linear motor 92 can well meet the translational movement of the film sticking device 7. At the same time, the second linear motor 92 is simpler in structure than the remaining linear modules 14, which reduces the complexity of the entire machine and reduces the complexity of installation and maintenance. At the same time, in order to facilitate control and wiring, the first linear motor 42 and the second linear motor 92 are installed in parallel on both sides of the frame 102 beam 103, so that the cutting mechanism 200 and the film sticking mechanism 300 are respectively installed on both sides of the beam 103, and the respective weights of the two mechanisms are used to form a counterweight to ensure that the cutting mechanism 200 and the film sticking mechanism 300 can operate stably.

[0042] It can be understood that, with such a configuration, the film pasting device 7 is used to unwind the release film 206, stick the release film 206 on the thermal conductive adhesive pad 202 and cut off the release film 206, the film pasting lifting module 8 drives the film pasting device 7 to move in the Z-axis direction, the film pasting translation module 9 drives the film pasting device 7 to move in the X-axis direction, and the thermal conductive adhesive pad 202 moves along the Y-axis direction driven by the moving material table 100, so that the film pasting device 7 can perform film pasting operations on the thermal conductive adhesive pad 202 at any position.

[0043] In order to cut the thermal conductive pads according to different thicknesses, in this embodiment, Figure 7 The cutting mechanism 200 also includes a second cutting knife 6, which is arranged on a second lifting seat 81 of the film lifting module 8. The film lifting module 8 and the film translation module 9 drive the second cutting knife 6 to move in the X-axis and Z-axis directions to drive the second cutting knife 6 to perform the first cutting operation on the thermal conductive adhesive pad 201 along the X-axis direction.

[0044] It should be further explained that the second cutting knife 6 is a circular knife, and a knife adjusting assembly 61 is arranged between the second cutting knife 6 and the second lifting seat 81. According to the different thicknesses of the thermal conductive adhesive gasket 201, the height of the second cutting knife 6 relative to the second lifting seat 81 is adjusted by the knife adjusting assembly 61, so as to control the depth of the second cutting knife 6 cutting the thermal conductive adhesive gasket 201. The knife adjusting assembly 61 will also adjust the inclination angle of the second cutting knife 6 so that the blade of the second cutting knife 6 can cut at an optimal angle.

[0045] It can be understood that, with such a configuration, the second cutting knife 6 is arranged along the X-axis direction, and the second cutting knife 6 is installed on the second lifting seat 81. It moves along the Z-axis and X-axis directions respectively driven by the film lifting module 8 and the film translation module 9. The thermal conductive adhesive gasket 201 moves along the Y-axis direction driven by the moving material table 100, so that the second cutting knife 6 can perform the first cutting operation on any position of the thermal conductive adhesive gasket 201 along the X-axis direction. Separating the second cutting knife 6 from the first cutting knife 2 can reduce the structure on one side of the first cutting knife 2, and at the same time avoid the high-frequency vibration of the first cutting knife 2 affecting the cutting accuracy of the circular knife.

[0046] In order to better cut the thermal conductive pads of different thicknesses, in this embodiment, reference Figure 4 and Figure 7 The first cutting knife 2 is a vibrating knife, and the second cutting knife 6 is a circular knife.

[0047] It can be understood that, in such a configuration, the first cutting knife 2 is a vibrating knife, which can cut thermal conductive adhesive pads of different thicknesses, and the second cutting knife 6 adopts a circular knife, which can cut thinner thermal conductive adhesive pads well. The circular knife is more energy-efficient than the vibrating knife when working, so the second cutting knife 6 can be used for the first cutting operation of the thinner thermal conductive adhesive pad. The cutting effect of the circular knife on the thermal conductive adhesive pad strip 202 with a release film 206 is weaker than that of the vibrating knife. For the second cutting operation, the first cutting knife 2 should still be used.

[0048] In order to attach the release film 206 to the thermally conductive adhesive pad 202, in this embodiment, refer to Figures 6 to 8The film laminating device 7 includes a discharge shaft 71, a traction roller 72, a film-pushing roller 73, a film clamping head 74, a cutter 75 and a film-laminating pressing roller 76 which are sequentially arranged on the second lifting seat 81 along the material path 207 of the release film 206. A material roll is sleeved on the discharge shaft 71. The material roll releases the release film 206 material strip to the traction roller 72 under the action of the film-pushing roller 73. The film-pushing roller 73 is transmission-connected to a film-pushing cylinder 731. The film-pushing cylinder 731 drives the film-pushing roller 73 to move along the film-pushing guide rail 732 relative to the traction roller 72 to pull the release film 206 material strip. The clamping head 74 is transmission-connected to the clamping cylinder 741, and the second lifting seat 81 is provided with a guide plate 742 opposite to the clamping head 74 on the other side of the release film 206 strip. The clamping head 74 clamps the release film 206 strip between the clamping head 74 and the guide plate 742 under the drive of the clamping cylinder 741, and the film pressing roller 76 sticks the release film 206 on the thermal conductive adhesive pad 202 in a rolling manner. The cutter 75 is transmission-connected to the film cutting cylinder 77, and the film cutting cylinder 77 drives the cutter 75 to cut the release film 206 between the clamping head 74 and the film pressing roller 76.

[0049] It should be further explained that a guide block 743 is provided on one side of the guide plate 742 close to the release film 206 material strip, and an adjusting screw 744 is provided on the other side of the guide plate 742. The adjusting screw 744 is threadedly connected to the guide block 743. The adjusting screw 744 is provided along the Y-axis direction. By rotating the adjusting screw 744, the position of the block in the Y-axis direction can be adjusted, thereby adjusting the position of the edge of the release film 206 material strip in the Y-axis direction, so that the edge of the release film 206 can accurately fall into the avoidance groove 205 between the thermal conductive adhesive pad strips 202, thereby improving the accuracy of the film pasting.

[0050] The film roller 73 is driven by the film cylinder 731 to pull the release film 206 strip to a distance, thereby pulling the material roll on the unloading shaft 71 to rotate and unwind. The length of the release film 206 strip pushed by the film roller 73 each time is the length of the release film 206 strip that the release film 206 needs to be attached to the guide plate 742. The length of the thermal adhesive pad 202 is such that the film pasting operation of one thermal adhesive pad 202 can be completed by pushing the release film 206 once; during the film pasting operation, the film pasting lifting module 8 will drive the film pasting device 7 to move downward, and the film pasting translation module 9 will drive the film pasting device 7 to start from the outside of the thermal adhesive pad 202, and press the release film 206 onto the thermal adhesive pad 202 through the film pasting pressing roller 76, and roll the release film 206 onto the thermal adhesive pad 202 in turn through the two film pasting pressing rollers 76, so as to discharge the air between the release film 206 and the thermal adhesive pad 202, so that the release film 206 can be better pasted on the thermal adhesive pad 202, and after pasting, the film clamping head 74 and the guide plate 742 clamp the release film 206 strip, and the cutter 75 cuts the release film 206 strip, and the film pasting operation of one thermal adhesive pad 202 is completed.

[0051] In order to stably drive the thermal conductive adhesive pad 201 to move, in this embodiment, reference Fig. 9 The movable material table 100 includes a slide 11, a clamp 12 and a pallet 1. Two clamps 12 are symmetrically arranged on both sides of the slide 11. Each clamp 12 is transmission-connected with an alignment cylinder 13. The alignment cylinder 13 is installed on the slide 11. A thermal conductive adhesive pad 201 is laid flat on the pallet 1. The pallet 1 is placed on the slide 11. The two clamps 12 are driven by the alignment cylinder 13 to align the pallet 1 with the slide 11 in the X-axis direction. The slide 11 is transmission-connected with a linear module 14. The linear module 14 drives the slide 11 and the pallet 1 to move in the Y-axis direction.

[0052] It should be further explained that the linear module 14 includes a drive motor 15 and a third screw pair 16, the drive motor 15 is connected to the third screw pair 16, the third screw pair 16 is connected to the slide 11, and slide rails 17 are arranged in parallel on both sides of the third screw pair 16. The drive motor 15 drives the slide 11 to move along the slide rails 17 through the third screw pair 16, and drives the slide 11 to reciprocate between the loading and unloading station 104, the cutting station 105 and the film laminating station 106. The loading and unloading station 104 is a docking station. The loading of the thermal conductive adhesive gasket 201 and the unloading of the thermal conductive adhesive pad block 203 are both carried out at the loading and unloading station 104. At the same time, the tear strip 204 can also be removed at the loading and unloading station 104. The removal of the tear strip 204 can be done by manually clamping the tear strip 204 and tearing it off from the pallet 1, or by a robot hooking or clamping the tear strip 204 and tearing it off from the pallet 1.

[0053] It can be understood that, with such a configuration, the pallet 1 is used for transit transportation, and the thermal conductive adhesive pad 201 will be first spread flat on the pallet 1. By transporting the thermal conductive adhesive pad 201 by the pallet 1, the loading and unloading efficiency of the thermal conductive adhesive pad 201 can be improved. The pallet 1 is aligned and clamped on the slide 11 by two symmetrically arranged clamping plates 12, so that the thermal conductive adhesive pad and the pallet 1 need to be stably placed on the slide 11, and the slide 11 moves in a straight line driven by the linear module 14.

[0054] The thermal conductive adhesive pad film cutting machine of the embodiment of the present application completes the loading of the thermal conductive adhesive pad 201, removes the tear strip 204 and the unloading of the thermal conductive adhesive pad block 203 at the loading and unloading station 104, completes the first cutting operation for the thermal conductive adhesive pad 201 and the second cutting operation for the thermal conductive adhesive pad strip 202 at the cutting station 105, and completes the filming operation for the thermal conductive adhesive pad strip 202 at the filming station 106. Through the two cutting operations, the whole thermal conductive adhesive pad 201 is converted into a plurality of thermal conductive adhesive pad strips 202. 02, and then become multiple thermally conductive adhesive pads 203, which can improve the production efficiency of the entire thermally conductive adhesive pad. During the film pasting operation, the edge of the release film 206 can fall into the avoidance groove 205 formed after tearing off the tear strip 204, so that the width of the release film 206 can be greater than the width of the thermally conductive adhesive pad strip 202. After the second cutting operation, the edge of the release film 206 carried by the thermally conductive adhesive pad 203 will exceed the thermally conductive adhesive pad 203, thereby facilitating the separation of the release film 206 when the thermally conductive adhesive pad 203 is used.

[0055] refer to Figures 1 to 10 The embodiment of the present application also provides a method for processing a thermal conductive adhesive pad film cutting machine, comprising the following steps performed on the thermal conductive adhesive pad film cutting machine: Step 1: Loading, such as Fig. 9 and Fig.10As shown in part a, the support plate 1 with the thermally conductive adhesive pad 201 is placed on the slide 11 at the loading and unloading station 104, and the support plate 1 and the thermally conductive adhesive pad 201 are centered with the slide 11 in the X-axis direction through the clamping plate 12; Step 2, the first cutting operation, the moving material table 100 drives the thermal conductive adhesive gasket 201 to move to the cutting station 105, and the thermal conductive adhesive gasket 201 is cut for the first time by the cutting knife 75 moving along the X-axis direction. The first cutting operation processes at least one tear strip 204 on the thermal conductive adhesive gasket 201, and each tear strip 204 is formed by the thermal conductive adhesive gasket 201 being cut twice along two parallel paths by the cutting knife 75. The tear strip 204 and the thermal conductive adhesive gasket strip 202 formed by the first cutting operation are as follows: Fig.10 As shown in part b; Step 3, waste removal, the moving material table 100 drives the thermal conductive adhesive pad 201 to move to the loading and unloading station 104, and uses external force to tear and separate the tear strip 204 cut in step 2, and separates the thermal conductive adhesive pad 201 into at least two thermal conductive adhesive pad strips 202, wherein the thermal conductive adhesive pad strip 202 is arranged on the support plate 1 along the X-axis direction, and the thermal conductive adhesive pad strip 202 after removing the tear strip 204 is as shown in FIG. Fig.10 As shown in part c; Step 4: Film pasting operation. The moving material table 100 drives the thermal conductive adhesive pad 202 to move to the film pasting station 106. The film pasting mechanism 300 pastes a release film 206 on each thermal conductive adhesive pad 202. At least one edge of the release film 206 falls into the avoidance groove 205 formed by the tear strip 204. The thermal conductive adhesive pad 202 formed after the film pasting operation is as shown in FIG. Fig.10 As shown in part d; Step 5, the second cutting operation, the moving material table 100 drives the thermal conductive adhesive strip 202 after film application to move to the cutting station 105, the first cutting knife 2 rotates 90 degrees, the moving material table 100 drives the thermal conductive adhesive strip to move along the Y axis, the first cutting knife 2 moves in the Y axis direction relative to the thermal conductive adhesive strip 202, so as to perform a second cutting operation on the thermal conductive adhesive strip 202 and the release film 206, and cut each thermal conductive adhesive strip 202 into at least two thermal conductive adhesive pads 203. After the second cutting operation, the thermal conductive adhesive pads 203 are formed as shown in FIG. Fig.10 As shown in part e; Step 6: unloading, the moving material table 100 drives the thermal conductive adhesive pad 203 to move to the loading and unloading station 104, the support plate 1 and the thermal conductive adhesive pad 203 are taken off the slide 11, and the thermal conductive adhesive pad 203 with the release film 206 is separated from the support plate 1. Fig.10 As shown in part e of the drawing, the thermally conductive adhesive pads 203 formed after two cutting operations can be separated from each other.

[0056] It can be understood that, with such a configuration, the thermally conductive adhesive gasket 201 is cut into a plurality of thermally conductive adhesive pad blocks 203 through two cutting operations in mutually perpendicular cutting directions, and waste removal and film pasting operations are performed between the two cutting operations. By cutting out the tear strip 204 structure during the first cutting operation, the adjacent thermally conductive adhesive pad strips 202 can be well separated by tearing off the tear strip 204. At the same time, the edge of the pasted release film 206 can extend beyond the thermally conductive adhesive pad strip 202, so that at least one side edge of the release film 206 will not be flush with the thermally conductive adhesive pad block 203, which is convenient for separating the release film 206 during use.

[0057] In order to better cut the thermal conductive pads of different thicknesses, in this embodiment, reference Figure 4 and Figure 7 The cutting knife 75 in step 2 is selected from the first cutting knife 2 or the second cutting knife 6.

[0058] It can be understood that, in such a configuration, the first cutting knife 2 is a vibrating knife, and the second cutting knife 6 is a circular knife. The vibrating knife can cut thermal conductive adhesive pads of different thicknesses, and the first cutting knife 2 can be used for the first cutting operation and the second cutting operation; the circular knife can cut thinner thermal conductive adhesive pads very well, and the circular knife is more energy-efficient than the vibrating knife when working, so the second cutting knife 6 can be used for the first cutting operation of thinner thermal conductive adhesive pads, and the circular knife has a weaker cutting effect on the thermal conductive adhesive pad strip 202 with a release film 206 than the vibrating knife. For the second cutting operation, the first cutting knife 2 should still be used.

[0059] The processing method of the thermal conductive adhesive pad film cutting machine of the embodiment of the present application sequentially performs the loading of the thermal conductive adhesive gasket 201, the first cutting operation, waste removal, film pasting operation, the second cutting operation, and the unloading of the thermal conductive adhesive pad block 203, so that the entire thermal conductive adhesive gasket 201 is processed into small pieces of thermal conductive adhesive pads 203 carrying release films 206, thereby improving the production efficiency of the thermal conductive adhesive pad. At the same time, at least one side edge of the release film 206 extends beyond the thermal conductive adhesive pad block 203. When the thermal conductive adhesive pad block 203 is in use, the release film 206 can be easily separated from the thermal conductive adhesive pad block 203, which is convenient for users to use.

[0060] The above does not limit the technical scope of the present invention in any way. Any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A thermal conductive adhesive pad film cutting machine, characterized in that: It includes a workbench, a movable material table, a cutting mechanism and a film pasting mechanism. The workbench is provided with a loading and unloading station, a cutting station and a film pasting station in a straight line. The movable material table is flatly paved with a thermal conductive adhesive pad, and drives the thermal conductive adhesive pad to reciprocate between the loading and unloading station, the cutting station and the film pasting station. The cutting mechanism is arranged at the cutting station, and the cutting knife of the cutting mechanism cuts the thermally conductive adhesive pad on the cutting station twice, and the cutting directions of the cutting knives of the two cuttings are perpendicular to each other. The thermally conductive adhesive pad is formed into at least two thermally conductive adhesive pad strips by the first cutting operation, and a tear strip is formed between two adjacent thermally conductive adhesive pad strips. The tear strip is separated from the thermally conductive adhesive pad strip by external force before the film laminating operation, and the thermally conductive adhesive pad strip is formed into at least two thermally conductive adhesive pad blocks by the second cutting operation; The film pasting mechanism is arranged at the film pasting station. The film pasting mechanism pastes the release film on the thermal conductive adhesive pad before the second cutting operation, so that the thermal conductive adhesive pad formed after the second cutting operation carries the release film. During the film pasting operation, part of the edge of the release film falls into the avoidance groove formed after the two adjacent thermal conductive adhesive pads are separated by the tear strip.

2. The thermal conductive adhesive pad film cutting machine according to claim 1, characterized in that: The cutting mechanism includes a first cutting knife, a cutting lifting module and a cutting translation module. The first cutting knife is vertically arranged above the cutting station. The first cutting knife is arranged on a first lifting seat of the cutting lifting module. The cutting lifting module drives the first cutting knife to move in the Z-axis direction. The cutting lifting module is arranged on a first moving seat of the cutting translation module. The cutting translation module drives the cutting lifting module and the first cutting knife to move in the X-axis direction to perform a first cutting operation on the thermal conductive adhesive gasket along the X-axis direction.

3. The thermal conductive adhesive pad film cutting machine according to claim 2, characterized in that: The cutting mechanism also includes a rotary knife drive assembly, which is arranged on a first lifting seat. The rotary knife drive assembly includes a knife seat and a rotary knife motor that are transmission-connected. The first cutting knife is inserted into the axial hole of the knife seat. The first cutting knife is connected to the axial hole by a key. The rotary knife motor drives the first cutting knife to rotate 90° through the knife seat to perform a second cutting operation on the thermal conductive rubber pad strip along the Y-axis direction.

4. The thermal conductive adhesive pad film cutting machine according to claim 2, characterized in that: The film sticking mechanism includes a film sticking device, a film sticking lifting module and a film sticking translation module. The film sticking device is arranged on the second lifting seat of the film sticking lifting module. The film sticking lifting module drives the film sticking device to move in the Z-axis direction. The film sticking lifting module is arranged on the second moving seat of the film sticking translation module. The film sticking translation module drives the film sticking lifting module and the film sticking device to move in the X-axis direction to stick a release film on the thermal conductive adhesive pad strip along the X-axis direction.

5. The thermal conductive adhesive pad film cutting machine according to claim 4, characterized in that: The cutting mechanism also includes a second cutting knife, which is arranged on a second lifting seat of the film lifting module. The film lifting module and the film translation module drive the second cutting knife to move in the X-axis and Z-axis directions to drive the second cutting knife to perform the first cutting operation on the thermal conductive adhesive gasket along the X-axis direction.

6. The thermal conductive adhesive pad film cutting machine according to claim 5, characterized in that: The first cutting knife is a vibrating knife, and the second cutting knife is a circular knife.

7. The thermal conductive adhesive pad film cutting machine according to claim 4, characterized in that: The film pasting device comprises a feeding shaft, a traction roller, a film stepping roller, a film clamping head, a cutting knife and a film pasting pressing roller which are sequentially arranged on a second lifting seat along a feeding path of the release film material strip, the feeding shaft is sleeved with a material roll, and the material roll releases the release film material strip toward the traction roller under the action of the film stepping roller, the film stepping roller is transmission-connected with a film stepping cylinder, and the film stepping cylinder drives the film stepping roller to move along the film stepping guide rail relative to the traction roller to pull the release film material strip; the film clamping head is transmission-connected with the film clamping cylinder, and the second lifting seat is provided with a guide plate opposite to the film clamping head at the other side of the release film material strip, and the film clamping head clamps the release film material strip between the film clamping head and the guide plate under the drive of the film clamping cylinder, and the film pasting pressing roller sticks the release film on the thermal conductive adhesive pad strip in a rolling manner, and the cutter is transmission-connected with the film cutting cylinder, and the film cutting cylinder drives the cutter to cut the release film between the film clamping head and the film pasting pressing roller.

8. The thermal conductive adhesive pad film cutting machine according to claim 1, characterized in that: The movable material table includes a slide, a splint and a support plate. Two splints are symmetrically arranged on both sides of the slide. Each splint is transmission-connected to an alignment cylinder. The alignment cylinder is installed on the slide. A thermal conductive adhesive gasket is laid flat on the support plate. The support plate is placed on the slide. The two splints are driven by the alignment cylinder to align the support plate with the slide in the X-axis direction. The slide is transmission-connected to a linear module, which drives the slide and the support plate to move in the Y-axis direction.

9. A processing method of a thermal conductive adhesive pad film cutting machine, characterized in that: The following steps are performed by the thermal conductive adhesive pad film cutting machine according to any one of claims 1 to 8: Step 1: Loading: placing a support plate with a thermally conductive adhesive pad on a slide at a loading and unloading station, and centering the support plate and the thermally conductive adhesive pad on the slide in the X-axis direction through a clamping plate; Step 2, a first cutting operation, wherein the movable material table drives the thermally conductive adhesive gasket to move to the cutting station, and the thermally conductive adhesive gasket is cut for the first time by a cutting knife moving along the X-axis direction, wherein the first cutting operation forms at least one tear strip on the thermally conductive adhesive gasket, and each tear strip is formed by the thermally conductive adhesive gasket being cut twice by the cutting knife along two parallel paths; Step 3, waste removal, the movable material table drives the thermally conductive adhesive pad to move to the loading and unloading station, and uses external force to tear and separate the tear strip cut in step 2, and separate the thermally conductive adhesive pad into at least two thermally conductive adhesive pad strips, wherein the thermally conductive adhesive pad strips are arranged on the support plate along the X-axis direction; Step 4: film pasting operation, the moving material table drives the thermal conductive adhesive pad to move to the film pasting station, and the film pasting mechanism pastes a release film on each thermal conductive adhesive pad, wherein at least one side edge of the release film falls into the avoidance groove formed by the tear strip; Step 5, a second cutting operation, the movable material table drives the thermally conductive adhesive strip after film application to move to the cutting station, the first cutting knife rotates 90 degrees, the movable material table drives the thermally conductive adhesive strip to move along the Y-axis, the first cutting knife moves in the Y-axis direction relative to the thermally conductive adhesive strip, so as to perform a second cutting operation on the thermally conductive adhesive strip and the release film, and cut each thermally conductive adhesive strip into at least two thermally conductive adhesive pad blocks; Step six, unloading, the movable material table drives the thermal conductive adhesive pad to move to the loading and unloading station, takes the support plate and the thermal conductive adhesive pad off the slide, and separates the thermal conductive adhesive pad with a release film from the support plate.

10. The processing method of the thermal conductive adhesive pad film cutting machine according to claim 9, characterized in that: The cutting knife in step 2 is selected from the first cutting knife or the second cutting knife.

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