Air conditioner heat dissipation method and device, storage medium and air conditioner

By setting up cooling pipelines and water flow control components on the target components of the air conditioner, adjusting the water flow according to the temperature information, the problem of poor effect of the existing air conditioner heat dissipation method at high ambient temperatures is solved, and more efficient heat dissipation and Condensate water utilization.

CN119393828APending Publication Date: 2025-02-07PANASONIC HOME APPLIANCES AIR CONDITIONING GUANGZHOU CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202411444455.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-16
Publication Date
2025-02-07

AI Technical Summary

Technical Problem

The existing air conditioners rely on fan exhaust, resulting in poor heat dissipation effect at high ambient temperatures.

Method used

By setting a cooling pipeline on the surface of the target component housing of the air conditioner and setting a water flow control element at the water inlet of the cooling pipeline, the water flow of the cooling pipeline is adjusted according to the temperature information of the target component to improve the heat dissipation efficiency.

Benefits of technology

The heat dissipation efficiency and condensate utilization rate of the air conditioner are improved, especially at high ambient temperatures, and the temperature of the target components can be more effectively reduced.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119393828A_ABST
    Figure CN119393828A_ABST
Patent Text Reader

Abstract

According to the air conditioner heat dissipation method and device, the storage medium and the air conditioner, temperature information of a target component is obtained, whether the temperature of the target component exceeds a first temperature threshold value or not is determined according to the temperature information, and when the temperature of the target component exceeds the first temperature threshold value, the water flow rate of the target component is calculated based on the corresponding relation between the temperature of the target component and the water flow rate. The water flow of the condensate water entering the cooling pipeline is adjusted through the water flow control element, so that the temperature of the target component is reduced, the temperature of the target component is close to the target set temperature, and the heat dissipation efficiency and the condensate water utilization rate of the air conditioner can be improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the field of air conditioners, and in particular to an air conditioner heat dissipation method, device, storage medium and air conditioner. Background Art

[0002] The existing heat dissipation method of the air conditioner is usually to set a heat sink on the module that needs heat dissipation, so that the heat generated during the operation of the air conditioner is dissipated through the heat sink, and the purpose of heat dissipation and cooling is achieved by forced exhaust through a fan.

[0003] However, the heat dissipation method of the air conditioner described above relies on fan exhaust to dissipate heat, and when the ambient temperature is relatively high, the heat dissipation effect is poor. Summary of the invention

[0004] The embodiments of the present application provide an air conditioner heat dissipation method, device, storage medium and air conditioner, which can improve the heat dissipation efficiency of the air conditioner.

[0005] In a first aspect, an embodiment of the present application provides a heat dissipation method for an air conditioner, wherein the air conditioner comprises a target component, a heat dissipation device and a condensed water collection component, wherein the heat dissipation device comprises a water flow control element and a cooling pipeline arranged on the surface of a housing of the target component, wherein the water flow control element is arranged at a condensed water inlet of the cooling pipeline, and the condensed water inlet is connected to the condensed water collection component, wherein the method comprises the following steps:

[0006] Obtain temperature information of target components;

[0007] Determining, according to the temperature information of the target component, whether the temperature of the target component exceeds a first temperature threshold;

[0008] When the temperature of the target component exceeds a first temperature threshold, the water flow rate of the cooling pipeline is adjusted by the water flow control element based on the corresponding relationship between the temperature of the target component and the water flow rate, so that the temperature of the target component approaches the target set temperature.

[0009] In a second aspect, an embodiment of the present application provides an air conditioner heat dissipation device, the air conditioner comprising a target component, a heat dissipation device and a condensed water collection component, the heat dissipation device comprising a water flow control element and a cooling pipeline arranged on the surface of the housing of the target component, the water flow control element being arranged at a condensed water inlet of the cooling pipeline, the condensed water inlet being connected to the condensed water collection component, the device comprising:

[0010] A temperature information acquisition module is used to acquire temperature information of a target component;

[0011] a temperature judgment module, used to determine whether the temperature of the target component exceeds a first temperature threshold according to the temperature information of the target component;

[0012] The water flow adjustment module is used to adjust the water flow of the cooling pipeline through the water flow control element based on the corresponding relationship between the temperature of the target component and the water flow when the temperature of the target component exceeds a first temperature threshold, so that the temperature of the target component approaches the target set temperature.

[0013] In a third aspect, an embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the air conditioner heat dissipation method as described in any one of the above.

[0014] In a fourth aspect, an embodiment of the present application provides a computer device, including a target component, a heat dissipation device, a condensed water collection component, a memory, a processor, and a computer program stored in the memory and executable by the processor;

[0015] The heat dissipation device comprises a water flow control element and a cooling pipeline arranged on the surface of the housing of the target component, the water flow control element is arranged at the condensed water inlet of the cooling pipeline, and the condensed water inlet is connected to the condensed water collecting component;

[0016] When the processor executes the computer program, the steps of the air conditioner heat dissipation method as described in any one of the above are implemented.

[0017] In an embodiment of the present application, by acquiring the temperature information of the target component, it is determined whether the temperature of the target component exceeds a first temperature threshold value based on the temperature information. When the temperature of the target component exceeds the first temperature threshold value, based on the correspondence between the temperature of the target component and the water flow rate, the water flow rate of the condensed water entering the cooling pipeline is adjusted through a water flow control element, thereby reducing the temperature of the target component and making the temperature of the target component close to the target set temperature. The present application can improve the heat dissipation efficiency and condensed water utilization rate of the air conditioner.

[0018] For better understanding and implementation, the present invention is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of an existing heat dissipation device;

[0020] Figure 2 A schematic diagram of an application scenario of an air conditioner heat dissipation method according to an embodiment of the present invention;

[0021] Figure 3 A flow chart of a heat dissipation method for an air conditioner according to another embodiment of the present invention;

[0022] Figure 4 A flow chart of a heat dissipation method for an air conditioner according to another embodiment of the present invention;

[0023] Figure 5 A schematic structural diagram of a heat dissipation device for an air conditioner according to an embodiment of the present invention;

[0024] Figure 6 The figure is a schematic diagram of the structure of an air conditioner in one embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to make the objectives, technical solutions and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0026] It should be clear that the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the embodiments of the present application.

[0027] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the embodiments of the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0028] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims. In the description of the present application, it should be understood that the terms "first", "second", "third", etc. are only used to distinguish similar objects, and do not have to be used to describe a specific order or sequence, nor can they be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0029] In addition, in the description of this application, unless otherwise specified, "several" means two or more. "And / or" describes the corresponding relationship of the associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0030] See also Figure 1, which is a schematic diagram of an existing heat dissipation device 100 in an embodiment. The heat dissipation device 100 is a heat sink. The heat dissipation device 100 is applied to a circuit board 200 of an air conditioner to achieve heat dissipation of the circuit board 200 of the air conditioner.

[0031] The circuit board 200 includes a first component 210 and a second component 220 . The heat dissipation device 100 dissipates heat generated during operation of the circuit board 200 through a heat sink.

[0032] However, due to the high price of heat sinks (such as aluminum heat sinks), and limited by production costs, heat sinks are usually only installed on components with higher temperatures, such as Figure 1 As shown, the heat sink 100 is disposed on the first element 210 with a higher temperature. For other components without heat sinks, such as Figure 1 The lower temperature of the second element 220 in the circuit board is uncontrollable during operation, which may affect the life and normal operation of the element. In addition, since a heat sink is added to the circuit board, the weight of the circuit board is increased, affecting the lightweight design and user experience of the air conditioner.

[0033] The heat dissipation effect of the above-mentioned heat dissipation device is affected by the shape, size and placement of the heat sink. Therefore, in order to speed up the heat dissipation of the components, forced exhaust is usually performed by a fan to achieve a better heat dissipation effect.

[0034] However, relying on fans to force exhaust air for heat dissipation has a poor heat dissipation effect and is not energy-efficient due to the small specific heat capacity of wind. In addition, for occasions with relatively high outdoor temperatures, the temperature is easily too high due to poor heat dissipation, causing the equipment to go into standby mode, thus affecting the operating reliability of the air conditioner.

[0035] Therefore, in response to the above problems, the present application provides an air conditioner heat dissipation method, which accelerates the heat dissipation of the air conditioner components by setting a heat dissipation device on the components of the air conditioner that need heat dissipation, and improves the heat dissipation efficiency of the air conditioner by controlling the heat dissipation device when the temperature is high.

[0036] Specifically, the heat dissipation device of the embodiment of the present application includes a water flow control element and a cooling pipe arranged on the surface of the shell of the target component of the air conditioner, the water flow control element is arranged at the water inlet of the cooling pipe, and the cooling pipe is connected to the condensation water collection component of the air conditioner.

[0037] The condensed water collecting component is used to collect the condensed water generated during the operation of the air conditioner. In the embodiment of the present application, the condensed water collecting component can be used to collect the condensed water generated by the indoor unit of the air conditioner in the cooling mode, or the condensed water collecting component can collect the condensed water generated by the outdoor unit of the air conditioner in the heating mode.

[0038] The condensed water collecting component may be a water collection tray or the like.

[0039] The water flow control element is used to control the flow of condensed water entering the cooling pipeline. The water flow control element can be a valve, a water pump, a flow switch, or other element that can be used to control the flow of condensed water.

[0040] See also Figure 2 The embodiment of the present application provides an air conditioner heat dissipation method, which specifically includes

[0041] S110: Acquire temperature information of a target component;

[0042] The target component may be a component of the air conditioner that is prone to heat, for example, a component on the outdoor unit of the air conditioner. In the embodiment of the present application, the target component may be a circuit board of the outdoor unit. Since the circuit board of the outdoor unit is in an outdoor environment, when the outdoor environment temperature is high, it is easy to cause the circuit board to have a high temperature during operation, which affects the life and operation stability of the components of the circuit board.

[0043] When the target component is a circuit board, the cooling pipeline can be set in the groove of the circuit box where the circuit board is located, without the need to re-plan the position of the cooling pipeline, thereby facilitating cooling of the circuit board.

[0044] The temperature information can be detected by a temperature detection element such as a temperature sensor provided on the target component.

[0045] S120: determining, according to the temperature information of the target component, whether the temperature of the target component exceeds a first temperature threshold;

[0046] The first temperature threshold may be a preset higher temperature value, and the first temperature threshold is used to determine whether the target component needs to be cooled down. When the temperature of the target component exceeds the first temperature threshold, it indicates that the temperature of the target component is high and the target component needs to be cooled down.

[0047] In the embodiment of the present application, the first temperature threshold may be 35°C.

[0048] S130: When the temperature of the target component exceeds a first temperature threshold, based on the corresponding relationship between the temperature of the target component and the water flow rate, the water flow rate of the cooling pipeline is adjusted by the water flow control element so that the temperature of the target component approaches the target set temperature.

[0049] The corresponding relationship between the temperature of the target component and the water flow rate can be preset by the user. For different target component temperatures, the corresponding water flow rates are different.

[0050] Based on the corresponding relationship between the temperature of the target component and the water flow rate, the water flow rate of the cooling pipeline is adaptively adjusted so that the temperature of the target component is close to the target setting temperature. The target setting temperature can be an ideal temperature of the target component preset by the user, and the target setting temperature can be less than the first temperature threshold.

[0051] In an embodiment of the present application, the temperature of the target component may be directly proportional to the water flow rate. When the temperature of the target component is higher, the corresponding water flow rate is higher, thereby increasing the water flow rate of the condensed water entering the cooling pipeline, thereby achieving rapid cooling of the target component. When the temperature of the target component is lower, the corresponding water flow rate is lower, thereby reducing the water flow rate of the condensed water entering the cooling pipeline, thereby achieving adaptive adjustment of the water flow rate of the condensed water in the cooling pipeline, achieving precise control of the condensed water in the cooling pipeline, and avoiding waste of water resources.

[0052] Since the specific heat capacity of water is greater than that of air, its temperature changes less when absorbing or releasing the same amount of heat. Using condensed water to lower the temperature of the target component can absorb more heat, thereby more effectively regulating the temperature of the target component and improving the heat dissipation effect of the target component. This allows the heat dissipation device to be better used in environments with higher temperatures, such as outdoor units with higher ambient temperatures, to improve the heat dissipation effect of the target components of the outdoor unit.

[0053] In an embodiment of the present application, by acquiring the temperature information of the target component, it is determined whether the temperature of the target component exceeds a first temperature threshold value based on the temperature information. When the temperature of the target component exceeds the first temperature threshold value, based on the correspondence between the temperature of the target component and the water flow rate, the water flow rate of the condensed water entering the cooling pipeline is adjusted through a water flow control element, thereby reducing the temperature of the target component and making the temperature of the target component close to the target set temperature. The present application can improve the heat dissipation efficiency and condensed water utilization rate of the air conditioner.

[0054] In step S120, when the temperature of the target component is less than the first temperature threshold, it means that the current temperature of the target component is low and there is no need to cool the target component. At this time, the condensed water of the air conditioner can be controlled not to enter the cooling pipeline by the water flow control element.

[0055] In step S130, the corresponding relationship between the temperature of the target component and the water flow rate can be determined based on the law of conservation of energy and a heat transfer formula, wherein the heat transfer formula is used to calculate the amount of heat required to increase or decrease the temperature of an object.

[0056] Specifically, assuming that the ideal temperature of the target component is the target set temperature, the heat Q1 required to reduce the temperature of the target component from the current temperature to the target set temperature is obtained in the following manner:

[0057] Q1=U*A*△T1

[0058] Among them, Q1 represents the heat required to reduce the temperature of the target component to the target set temperature, U represents the heat transfer coefficient, the heat transfer coefficient can be determined according to the material of the target component, A represents the area of ​​the target component, and △T1 represents the difference between the current temperature of the target component and the target set temperature.

[0059] The heat absorption of the heat sink is obtained as follows:

[0060] Q2=qm*Cp*△T2

[0061] Among them, Q2 represents the heat absorption of the heat dissipation device, qm represents the water flow rate, Cp represents the specific heat capacity of water, which can be taken as 4.2KJ / kg*℃, and △T2 represents the difference between the water inlet temperature and the water outlet temperature of the heat dissipation device.

[0062] The water inlet temperature and the water outlet temperature of the heat dissipation device can be detected by a first temperature detection device arranged at the water inlet of the cooling pipeline and a second temperature detection device arranged at the water outlet of the cooling pipeline.

[0063] Based on the law of conservation of energy, let Q1 = Q2, and get the corresponding relationship between the temperature of the target component and the water flow rate:

[0064] T=qm*Cp / U*A+Tm

[0065] Wherein, T represents the temperature of the target component, and Tm represents the target setting temperature.

[0066] It can be seen from the above formula that the water flow rate of the cooling pipeline is proportional to the temperature of the target component. Therefore, when adjusting the water flow rate of the cooling pipeline, when the temperature of the target component is high, the water flow rate of the cooling pipeline can be increased, and when the temperature of the target component is low, the water flow rate of the cooling pipeline can be reduced.

[0067] When the temperature of the target component is greater than the first temperature threshold, the water flow rate of the cooling pipeline is adaptively adjusted based on the corresponding relationship between the temperature of the target component and the water flow rate, so that the temperature of the target component is close to the target set temperature. However, when the temperature of the target component is high, the temperature of the target component needs to be lowered as soon as possible to avoid damage to the target component due to excessive temperature for a long time.

[0068] To address the above problem, multiple different temperature intervals can be set, and different water flow ranges can be set in sequence from high to low according to the temperature of the temperature interval. The higher the temperature interval, the larger the corresponding water flow range. This can speed up the heat dissipation of the target component by increasing the water flow rate in the cooling pipeline, thereby improving the cooling speed and efficiency of the target component.

[0069] Specifically, Figure 3 As shown, in one embodiment, the method further includes:

[0070] S210: When the temperature of the target component is in a first temperature range, based on the corresponding relationship between the temperature of the target component and the water flow rate, adjusting the water flow rate of the cooling pipeline through the water flow rate control element so that the temperature of the target component is close to the target set temperature;

[0071] S220: When the temperature of the target component is within the second temperature range, adjusting the water flow of the cooling pipeline by the water flow control element so that the water flow of the cooling pipeline is within the first water flow range;

[0072] S230: When the temperature of the target component is within a third temperature range, adjusting the water flow of the cooling pipeline by the water flow control element so that the water flow of the cooling pipeline is within a second water flow range;

[0073] S240: When the temperature of the target component is in a fourth temperature range, adjusting the water flow of the cooling pipeline to a maximum water flow through the water flow control element;

[0074] In the embodiment of the present application, four temperature intervals and two water flow ranges are set to control the water flow of the cooling pipeline.

[0075] Among them, the first temperature threshold ≤ the first temperature interval < the second temperature interval < the third temperature interval < the fourth temperature interval; the first water flow range < the second water flow range < the maximum water flow.

[0076] Each temperature interval can be set according to user needs. Specifically, the first temperature interval can be 35℃≤T≤75℃, the second temperature interval can be 75℃<T≤85℃, the third temperature interval can be 85℃<T≤90℃, and the second temperature interval can be 90℃<T≤95℃, where T represents the temperature of the target component.

[0077] The water flow range corresponding to each temperature range can be set according to actual application conditions such as the maximum water flow of the cooling pipeline.

[0078] In an embodiment of the present application, the water flow rate of the cooling pipeline is adjusted by a water flow control element. When the water flow control element is a water pump, when adjusting the water flow rate of the cooling pipeline, the water flow rate of the cooling pipeline can be adjusted by adjusting the rotation speed of the water pump.

[0079] The water flow range can be determined according to the water flow corresponding to different rotational speeds of the water pump, and the water flow can be adjusted by controlling the rotational speed of the water pump, thereby more conveniently realizing the control of the water flow of the cooling pipeline.

[0080] Specifically, the first water flow rate range can be the water flow rate corresponding to 70% of the water pump speed ≤ qm<80% of the water flow rate corresponding to the water pump speed, the second water flow rate range can be the water flow rate corresponding to 80% of the water pump speed ≤ qm<90% of the water flow rate corresponding to the water pump speed, and the maximum water flow rate is the water flow rate corresponding to the maximum speed of the water pump.

[0081] In this embodiment, the temperature of the target component is divided into four temperature intervals, and the water flow range of the cooling pipeline is determined according to the temperature interval. The higher the temperature interval, the larger the corresponding water flow range. Therefore, when the temperature of the target component is high, the heat dissipation of the target component can be accelerated by increasing the water flow of the cooling pipeline, thereby improving the cooling speed and efficiency of the target component.

[0082] It should be noted that the user can also divide the temperature range into other numbers and set the corresponding number of water flow ranges according to actual application requirements, so as to achieve precise adjustment of the water flow of the cooling pipeline.

[0083] In another embodiment, the temperature of the target component may be divided into five temperature intervals: first temperature interval < second temperature interval < third temperature interval < fourth temperature interval < fifth temperature interval;

[0084] When the temperature of the target component is in the fifth temperature range, it means that the current temperature of the target component is extremely high and there is a greater risk of high-temperature damage.

[0085] Therefore, the heat dissipation device of the embodiment of the present application further includes a cooling medium valve, the cooling pipeline is connected to the cooling medium input port through the cooling medium valve, and the temperature of the cooling medium at the cooling medium input port is lower than the temperature of the condensed water.

[0086] Optionally, the cooling pipeline can be provided with a three-way valve, which is respectively connected to the cooling pipeline, the condensate water inlet and the cooling medium inlet, the condensate water inlet is provided with a condensate water valve for controlling the condensate water input, and the cooling medium inlet is provided with a cooling medium valve for controlling the cooling medium input.

[0087] The method further comprises:

[0088] When the temperature of the target component is in the fifth temperature range, the cooling medium valve is controlled to open, the cooling medium entering the cooling pipeline is adjusted, and the cooling medium flow rate of the cooling pipeline is adjusted to the maximum flow rate; wherein the fifth temperature range is greater than the fourth temperature range.

[0089] The cooling medium in the embodiment of the present application can be a cooling medium with a lower temperature such as refrigerant.

[0090] Compared with condensed water, refrigerant and other cooling media have a lower temperature and can quickly reduce the temperature of the target component in a high temperature environment. However, since some refrigerants are not a single substance, such as R140A refrigerant, which is a mixed refrigerant, there is a possibility of physical property migration during long-term operation, resulting in inaccurate temperature control. Too low refrigerant temperature can easily cause risks such as condensation and damage to the target component. Therefore, in the embodiment of the present application, when the temperature of the target component is in the fifth temperature range, that is, when the temperature of the target component is at an extremely high temperature, the cooling medium valve is opened to use a cooling medium with a lower temperature to speed up the cooling of the target component and avoid high-temperature damage to the target component. For conventional high-temperature scenarios, condensed water with a single substance and more controllable temperature is used to cool the target component, thereby achieving precise temperature control of the target component and improving the operating reliability and life of the target component.

[0091] In an embodiment of the present application, when the temperature of the target component is in the fifth temperature range, the cooling medium valve is opened, the cooling medium in the cooling pipeline is adjusted to a cooling medium having a temperature lower than the temperature of the condensed water, and the cooling medium flow rate of the cooling pipeline is adjusted to a maximum flow rate, thereby accelerating the cooling speed of the temperature of the target component and improving the cooling efficiency of the target component.

[0092] In one embodiment, the target component may be a circuit board, and the circuit board is used to control the operation of the air conditioner, and the water flow of the cooling pipeline is adjusted by the water flow control element, and further includes:

[0093] The operating frequency of the compressor of the air conditioner is reduced.

[0094] The circuit board can be used to control the operating frequency of the compressor of the air conditioner.

[0095] In the embodiment of the present application, by reducing the operating frequency of the compressor of the air conditioner, the energy consumption of the circuit board is reduced, thereby promoting the cooling of the circuit board, and improving the cooling speed and cooling efficiency of the circuit board.

[0096] When lowering the operating frequency of the air conditioner's compressor, different frequency reduction amplitudes can be set according to different temperature ranges. The higher the temperature range, the greater the corresponding frequency reduction amplitude of the compressor's operating frequency. By setting different frequency reduction amplitudes for different temperature ranges, stable frequency reduction of the compressor can be achieved, thereby ensuring the smooth operation of the air conditioner.

[0097] In one embodiment, reducing the operating frequency of the compressor of the air conditioner includes:

[0098] When the temperature of the target component is in a second temperature range, reducing the operating frequency of the compressor of the air conditioner according to a preset first frequency reduction amplitude;

[0099] When the temperature of the target component is within a third temperature range, reducing the operating frequency of the compressor of the air conditioner according to a preset second frequency reduction amplitude;

[0100] When the temperature of the target component is within a fourth temperature range, adjusting the operating frequency of the compressor of the air conditioner to a minimum operating frequency;

[0101] When the temperature of the target component is in a fifth temperature interval, adjusting the operating frequency of the compressor of the air conditioner to a minimum operating frequency;

[0102] The first frequency reduction range is less than the second frequency reduction range.

[0103] The first frequency reduction amplitude and the second frequency reduction amplitude are the reduction amplitudes of the operating frequency of the compressor of the air conditioner preset by the user, and the first frequency reduction amplitude and the second frequency reduction amplitude are used to determine the Hertz amount by which the operating frequency of the compressor decreases per minute.

[0104] In the embodiment of the present application, the first frequency reduction amplitude may be 5 Hz / min, and the second frequency reduction amplitude may be 10 Hz / min.

[0105] In the embodiment of the present application, different frequency reduction amplitudes are set for different temperature ranges, so as to stably reduce the operating frequency of the compressor and ensure the smooth operation of the air conditioner. At the same time, by reducing the operating frequency of the compressor, the cooling speed and efficiency of the circuit board are improved.

[0106] In one embodiment, the method further comprises the following steps:

[0107] When the temperature of the target component is in the fifth temperature interval and the duration reaches the target duration, the air conditioner is controlled to standby until the temperature of the target component is lower than the second temperature interval, and the air conditioner is controlled to start automatically;

[0108] The fifth temperature interval is a temperature interval with a relatively high temperature. When the temperature of the target component is in the fifth temperature interval, it indicates that the target component is in an extremely high temperature environment.

[0109] The target duration can be set according to the operation requirements, for example, it can be set to 1 minute.

[0110] When the temperature of the target component is in the fifth temperature interval and the duration reaches the target duration, it means that the above-mentioned heat dissipation method is difficult to reduce the temperature of the target component. At this time, in order to ensure the safe operation of the air conditioner, the air conditioner is controlled to standby, thereby reducing the temperature of the target component and avoiding damage to the target component.

[0111] When the temperature of the target component is lower than the second temperature range, it indicates that the temperature of the target component is relatively high but within a controllable range. At this time, the air conditioner is controlled to start automatically. After the air conditioner starts automatically, the temperature of the target component can be lowered by executing the air conditioner heat dissipation method of the above-mentioned embodiment of the present application.

[0112] In an embodiment of the present application, when the temperature of the target component is in the fifth temperature range and the duration reaches the target duration, the air conditioner is controlled to standby, thereby quickly reducing the temperature of the target component. When the temperature of the target component is lower than the second temperature range, the air conditioner is controlled to start automatically. This embodiment of the present application can prevent the target component from being in a high temperature environment for a long time, prevent the target component from being damaged by high temperature, and improve the operating reliability and life of the target component.

[0113] In one embodiment, the method further comprises the following steps:

[0114] If the number of self-start times of the air conditioner reaches the target number, the air conditioner is controlled to shut down and a fault message is displayed.

[0115] The target number of times can be set according to actual application conditions. In this embodiment, the target number of times can be set to three times.

[0116] After the air conditioner starts itself, if the temperature of the target component is in the fifth temperature range and the duration reaches the target duration, the air conditioner standby is triggered again, and the number of self-starts increases by 1. If the number of self-starts reaches the target number, it means that the operating temperature of the target component is abnormal after the air conditioner is started. At this time, a fault message is displayed to remind the user that the air conditioner is operating abnormally, so that the user can repair it in time.

[0117] The fault information is used to inform the user that the air conditioner is operating abnormally. The fault information may include the identification of the target component, the fault code and other information that can be used to indicate the content of the fault.

[0118] In the embodiment of the present application, when the number of self-start times of the air conditioner reaches the target number, the air conditioner is controlled to shut down, thereby avoiding damage to the target components due to continuous operation in an extremely high temperature environment, thereby improving the operating safety of the air conditioner; by displaying fault information, the user is prompted that the air conditioner is operating abnormally, which facilitates the user to repair the air conditioner in a timely manner and improves maintenance efficiency.

[0119] like Figure 4 As shown, in one embodiment, before adjusting the water flow of the cooling pipeline by the water flow control element, it also includes:

[0120] S310: Detecting the water flow of the cooling pipeline and determining whether the water flow reaches the target water flow;

[0121] S320: If the water flow cannot reach the target water flow, control the third-party water source valve to open to increase the water flow of the cooling pipeline.

[0122] The water flow rate of the cooling pipeline can be detected by a flow meter, flow switch or other element that can be used to detect the water flow rate and is arranged in the cooling pipeline.

[0123] The target water flow rate is a larger water flow rate value pre-set by the user. When the water flow rate reaches the target water flow rate, it means that the condensed water in the current condensed water collection component can meet the water demand during the heat dissipation process of the air conditioner.

[0124] When the water flow cannot reach the target water flow, it means that the condensed water in the condensed water collection component cannot meet the water demand during the heat dissipation process of the air conditioner. At this time, the third-party water source valve is controlled to open and the third-party water source is connected to increase the water flow in the cooling pipeline, thereby meeting the water demand during the heat dissipation process of the air conditioner.

[0125] After controlling the third-party water source valve to open and connecting to the third-party water source, the water flow of the cooling pipeline is continuously detected. When the water flow of the cooling pipeline reaches the target water flow, the third-party water source valve is controlled to close, thereby avoiding waste of water resources.

[0126] In an embodiment of the present application, the water flow rate of the cooling pipeline is detected to determine whether the water flow rate of the cooling pipeline reaches the target water flow rate, so as to determine whether the current condensed water input can meet the water demand during the heat dissipation process. When the water flow rate cannot reach the target water flow rate, the third-party water source valve is controlled to open and the third-party water source is connected to increase the water flow rate of the cooling pipeline, so as to meet the water demand during the heat dissipation process of the air conditioner and avoid the influence of insufficient water flow on the heat dissipation of the air conditioner.

[0127] In one embodiment, the heat dissipation device includes a pressure differential bypass valve, which is arranged at the outlet of the cooling pipeline. The pressure differential bypass valve is respectively connected to the condensed water outlet and the condensed water recovery device. The pressure differential bypass valve is used to detect the water pressure of the cooling pipeline. When the water pressure exceeds the target water pressure, the condensed water in the cooling pipeline is diverted to the condensed water outlet, thereby discharging excess condensed water from the heat dissipation device and reducing the water pressure of the cooling pipeline; when the water pressure does not exceed the target water pressure, the condensed water in the cooling pipeline is diverted to the condensed water recovery device.

[0128] The condensed water recovery device is used to recycle the condensed water. The condensed water recovery device can adopt the existing condensed water recovery device to recycle the condensed water. The water outlet of the condensed water recovery device can be connected to the condensed water collecting component of the air conditioner, so that the recycled condensed water can be used for the heat dissipation of the air conditioner, thereby improving the utilization rate of the condensed water.

[0129] like Figure 5As shown, the embodiment of the present application also provides an air conditioner heat dissipation device, the air conditioner includes a target component, a heat dissipation device and a condensed water collecting component, the heat dissipation device includes a water flow control element and a cooling pipeline arranged on the surface of the housing of the target component, the water flow control element is arranged at the condensed water inlet of the cooling pipeline, the condensed water inlet is connected to the condensed water collecting component, and the device includes:

[0130] The temperature information acquisition module 310 is used to acquire the temperature information of the target component;

[0131] A temperature judgment module 320 is used to determine whether the temperature of the target component exceeds a first temperature threshold according to the temperature information of the target component;

[0132] The water flow adjustment module 330 is used to adjust the water flow of the cooling pipeline through the water flow control element when the temperature of the target component exceeds a first temperature threshold, based on the corresponding relationship between the temperature of the target component and the water flow, so that the temperature of the target component approaches the target set temperature.

[0133] In one embodiment, the heat dissipation device includes a third-party water source valve, the cooling pipeline is connected to the third-party water source through the third-party water source valve, and the device further includes:

[0134] A water flow detection module, used to detect the water flow of the cooling pipeline and determine whether the water flow reaches the target water flow;

[0135] The third-party water source valve opening module is used to control the third-party water source valve to open to increase the water flow of the cooling pipeline if the water flow cannot reach the target water flow.

[0136] In one embodiment, the apparatus further comprises:

[0137] a first water flow adjustment module, configured to adjust the water flow of the cooling pipeline through the water flow control element when the temperature of the target component is in a first temperature range, based on the corresponding relationship between the temperature of the target component and the water flow, so that the temperature of the target component is close to the target set temperature;

[0138] A second water flow adjustment module, configured to adjust the water flow of the cooling pipeline through the water flow control element when the temperature of the target component is in the second temperature range, so that the water flow of the cooling pipeline is in the first water flow range;

[0139] A third water flow adjustment module, used for adjusting the water flow of the cooling pipeline through the water flow control element when the temperature of the target component is in a third temperature range, so that the water flow of the cooling pipeline is in a second water flow range;

[0140] a fourth water flow adjustment module, configured to adjust the water flow of the cooling pipeline to a maximum water flow through the water flow control element when the temperature of the target component is within a fourth temperature range;

[0141] Among them, the first temperature threshold ≤ the first temperature interval < the second temperature interval < the third temperature interval < the fourth temperature interval; the first water flow range < the second water flow range < the maximum water flow.

[0142] In one embodiment, the heat dissipation device includes a cooling medium valve, the cooling pipeline is connected to the cooling medium input port through the cooling medium valve, the temperature of the cooling medium at the cooling medium input port is lower than the temperature of the condensed water, and the device includes:

[0143] The fifth water flow adjustment module is used to control the opening of the cooling medium valve when the temperature of the target component is in the fifth temperature range, adjust the cooling medium entering the cooling pipeline, and adjust the cooling medium flow of the cooling pipeline to the maximum flow; wherein the fifth temperature range is greater than the fourth temperature range.

[0144] In one embodiment, when the target component is a circuit board, the device further comprises:

[0145] The operating frequency reducing module is used to reduce the operating frequency of the compressor of the air conditioner.

[0146] In one embodiment, the operating frequency reduction module includes:

[0147] a first operating frequency reducing unit, configured to reduce the operating frequency of the compressor of the air conditioner according to a preset first frequency reduction amplitude when the temperature of the target component is within a second temperature range;

[0148] a second operating frequency reducing unit, configured to reduce the operating frequency of the compressor of the air conditioner according to a preset second frequency reduction amplitude when the temperature of the target component is within a third temperature range;

[0149] a third operating frequency reducing unit, configured to adjust the operating frequency of the compressor of the air conditioner to a minimum operating frequency when the temperature of the target component is within a fourth temperature range;

[0150] a fourth operating frequency reducing unit, configured to adjust the operating frequency of the compressor of the air conditioner to a minimum operating frequency when the temperature of the target component is within a fifth temperature interval;

[0151] The first frequency reduction range is less than the second frequency reduction range.

[0152] In one embodiment, the apparatus further comprises:

[0153] A standby module, used for controlling the air conditioner to standby when the temperature of the target component is in the fifth temperature interval and the duration reaches the target duration, and controlling the air conditioner to start automatically until the temperature of the target component is lower than the second temperature interval;

[0154] The shutdown module is used to control the air conditioner to shut down and display fault information if the number of self-start times of the air conditioner reaches the target number.

[0155] It should be noted that the air conditioner heat dissipation device provided in the above embodiment only uses the division of the above functional modules as an example when executing the air conditioner heat dissipation method. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. In addition, the air conditioner heat dissipation device provided in the above embodiment and the air conditioner heat dissipation method in the above embodiment belong to the same concept, and the implementation process thereof is detailed in the method embodiment, which will not be repeated here.

[0156] An embodiment of the present application further provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the air conditioner heat dissipation method as described in any one of the above are implemented.

[0157] The embodiments of the present application may take the form of a computer program product implemented on one or more storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing program code. Computer-readable storage media include permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include but are not limited to: phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, tape disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.

[0158] like Figure 6 As shown, the embodiment of the present application further provides an air conditioner 400, including a target component 410, a heat dissipation device 420, a condensed water collection component 430, a memory, a processor, and a computer program stored in the memory and executable by the processor;

[0159] The heat dissipation device 420 includes a water flow control element 421 and a cooling pipeline 423 arranged on the shell surface of the target component 410 . The water flow control element 421 is arranged at the condensation water inlet of the cooling pipeline 423 , and the condensation water inlet is connected to the condensation water collecting component 430 .

[0160] The memory includes read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), one-time programmable read-only memory (OTPROM), electronically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, magnetic disk storage, magnetic tape storage, or any other computer-readable medium that can be used to carry or store data.

[0161] The processor is the control core (Control Unit) of the air conditioner 400, and uses various interfaces and lines to connect the various components of the entire air conditioner 400. It runs or executes the programs or modules stored in the memory, and calls the data stored in the memory to perform various functions of the air conditioner 400 and process data. For example, when the processor executes the computer program stored in the memory, it implements all or part of the steps of the air conditioner heat dissipation method described in the embodiment of the present application; or implements all or part of the functions of the air conditioner heat dissipation device. The processor can be composed of an integrated circuit, for example, it can be composed of a single packaged integrated circuit, or it can be composed of multiple integrated circuits with the same or different functions, including one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and a combination of various control chips.

[0162] In one embodiment, the heat dissipation device 420 further includes a water flow switch 424, a first temperature detection device 425, a flow meter 426, a three-way valve 427, a third-party water source valve 428, a second temperature detection device 429, a bypass pressure difference valve 4210 and a condensate valve 4211, and the air conditioner 400 further includes a condensate recovery device 440;

[0163] The water flow switch 424 is used to adjust the water flow of the cooling pipeline 423;

[0164] The first temperature detection device 425 is used to detect the inlet water temperature of the cooling pipeline 423;

[0165] The flow meter 426 is used to detect the water flow of the cooling pipeline 423;

[0166] The third-party water source valve 428 is used to access the third-party water source.

[0167] The second temperature detection device 429 is used to detect the outlet water temperature of the cooling pipeline 423;

[0168] The bypass differential pressure valve 4210 is used to detect the water pressure of the cooling pipeline 423, and when the water pressure exceeds the target water pressure, the condensed water of the cooling pipeline 423 is diverted to the condensed water outlet.

[0169] The condensate valve 4211 is used to control the condensate input into the cooling pipeline 423 .

[0170] The condensed water recovery device 440 is used to realize the recovery and utilization of condensed water.

[0171] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0172] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included within the scope of the claims of the present application.

Claims

1. A method for heat dissipation of an air conditioner, characterized in that: The air conditioner comprises a target component, a heat dissipation device and a condensed water collecting component, the heat dissipation device comprises a water flow control element and a cooling pipeline arranged on the surface of the housing of the target component, the water flow control element is arranged at the condensed water inlet of the cooling pipeline, the condensed water inlet is connected to the condensed water collecting component, and the method comprises the following steps: Obtain temperature information of target components; Determining, according to the temperature information of the target component, whether the temperature of the target component exceeds a first temperature threshold; When the temperature of the target component exceeds a first temperature threshold, the water flow rate of the cooling pipeline is adjusted by the water flow control element based on the corresponding relationship between the temperature of the target component and the water flow rate, so that the temperature of the target component approaches the target set temperature.

2. The air conditioner heat dissipation method according to claim 1, characterized in that: The heat dissipation device includes a third-party water source valve, the cooling pipeline is connected to the third-party water source through the third-party water source valve, and before the water flow rate of the cooling pipeline is adjusted by the water flow control element, it also includes: Detecting the water flow of the cooling pipeline and determining whether the water flow reaches the target water flow; If the water flow cannot reach the target water flow, the third-party water source valve is controlled to open to increase the water flow of the cooling pipeline.

3. The air conditioner heat dissipation method according to claim 1, characterized in that: The method further comprises: When the temperature of the target component is in a first temperature range, based on the corresponding relationship between the temperature of the target component and the water flow rate, the water flow rate of the cooling pipeline is adjusted by the water flow rate control element so that the temperature of the target component is close to the target set temperature; When the temperature of the target component is within the second temperature range, the water flow rate of the cooling pipeline is adjusted by the water flow rate control element so that the water flow rate of the cooling pipeline is within the first water flow rate range; When the temperature of the target component is within a third temperature range, adjusting the water flow of the cooling pipeline by the water flow control element so that the water flow of the cooling pipeline is within a second water flow range; When the temperature of the target component is in a fourth temperature range, adjusting the water flow of the cooling pipeline to a maximum water flow through the water flow control element; Among them, the first temperature threshold ≤ the first temperature interval < the second temperature interval < the third temperature interval < the fourth temperature interval; the first water flow range < the second water flow range < the maximum water flow.

4. The air conditioner heat dissipation method according to claim 3, characterized in that: The heat dissipation device comprises a cooling medium valve, the cooling pipeline is connected to a cooling medium input port through the cooling medium valve, the temperature of the cooling medium at the cooling medium input port is lower than the temperature of the condensed water, and further comprises: When the temperature of the target component is in the fifth temperature range, the cooling medium valve is controlled to open, the cooling medium entering the cooling pipeline is adjusted, and the cooling medium flow rate of the cooling pipeline is adjusted to the maximum flow rate; wherein the fifth temperature range is greater than the fourth temperature range.

5. The air conditioner heat dissipation method according to claim 3, characterized in that: When the target component is a circuit board, adjusting the water flow of the cooling pipeline by the water flow control element further includes: The operating frequency of the compressor of the air conditioner is reduced.

6. The air conditioner heat dissipation method according to claim 5, characterized in that: Reducing the operating frequency of the compressor of the air conditioner, comprising: When the temperature of the target component is within a second temperature range, reducing the operating frequency of the compressor of the air conditioner according to a preset first frequency reduction amplitude; When the temperature of the target component is within a third temperature range, reducing the operating frequency of the compressor of the air conditioner according to a preset second frequency reduction amplitude; When the temperature of the target component is within a fourth temperature range, adjusting the operating frequency of the compressor of the air conditioner to a minimum operating frequency; When the temperature of the target component is in a fifth temperature interval, adjusting the operating frequency of the compressor of the air conditioner to a minimum operating frequency; The first frequency reduction range is less than the second frequency reduction range.

7. The air conditioner heat dissipation method according to claim 4, characterized in that: The following steps are also included: When the temperature of the target component is in the fifth temperature interval and the duration reaches the target duration, the air conditioner is controlled to standby until the temperature of the target component is lower than the second temperature interval, and the air conditioner is controlled to start automatically; If the number of self-start times of the air conditioner reaches the target number, the air conditioner is controlled to shut down and a fault message is displayed.

8. An air conditioner heat dissipation device, characterized in that: The air conditioner comprises a target component, a heat dissipation device and a condensed water collecting component, wherein the heat dissipation device comprises a water flow control element and a cooling pipeline arranged on the surface of the housing of the target component, wherein the water flow control element is arranged at a condensed water inlet of the cooling pipeline, and the condensed water inlet is connected to the condensed water collecting component, wherein the device comprises: A temperature information acquisition module is used to acquire temperature information of a target component; a temperature judgment module, used to determine whether the temperature of the target component exceeds a first temperature threshold according to the temperature information of the target component; The water flow adjustment module is used to adjust the water flow of the cooling pipeline through the water flow control element based on the corresponding relationship between the temperature of the target component and the water flow when the temperature of the target component exceeds a first temperature threshold, so that the temperature of the target component approaches the target set temperature.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the air conditioner heat dissipation method as described in any one of claims 1 to 7 are implemented.

10. An air conditioner, characterized in that: The device comprises a target component, a heat sink, a condensed water collecting component, a memory, a processor, and a computer program stored in the memory and executable by the processor; The heat dissipation device comprises a water flow control element and a cooling pipeline arranged on the surface of the housing of the target component, the water flow control element is arranged at the condensed water inlet of the cooling pipeline, and the condensed water inlet is connected to the condensed water collecting component; When the processor executes the computer program, the steps of the air conditioner heat dissipation method according to any one of claims 1 to 7 are implemented.