Wafer photoetching equipment for semiconductor manufacturing

Abstract

The invention relates to the technical field of semiconductor photoetching, and particularly discloses semiconductor manufacturing wafer photoetching equipment, which comprises a box body, an operation cavity, a placement table and a semiconductor chip, the operation cavity is arranged on the box body, wafers can be manufactured on the semiconductor chip in the operation box, the placement table is arranged on the operation box, the semiconductor chip is arranged on the placement table, and the semiconductor chip is arranged on the operation box. The placement table is used for fixing a semiconductor chip, a photoetching piece is connected in the operation cavity, the photoetching piece corresponds to the semiconductor chip, a heat reduction assembly and a trigger assembly are arranged, the heat reduction assembly is arranged in the operation cavity, the heat reduction assembly corresponds to the semiconductor chip, and the heat reduction assembly is used for cooling the semiconductor chip. The driving assembly is connected between the heat reduction assembly and the photoetching piece, and the photoetching piece and the heat reduction assembly can be driven to work in the same direction at the same time by arranging the driving assembly, so that heat reduction can be carried out on the semiconductor chip at the same time in the wafer manufacturing process of the semiconductor chip.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor lithography technology, in particular to a semiconductor manufacturing wafer lithography device. Background Art

[0002] The process of semiconductor wafer manufacturing is complex and delicate. Patterning is a key step in semiconductor manufacturing and is achieved through photolithography. First, a layer of corrosion-resistant photoresist is coated on the surface of the silicon wafer, and then a mask with a predetermined electronic component pattern is placed. Through ultraviolet light irradiation, the pattern on the mask is transferred to the photoresist, and then the photoresist in the exposed area is removed, forming a precise pattern on the wafer.

[0003] The photolithography machine is the core equipment in semiconductor manufacturing. It is used to transfer the designed circuit diagram to the semiconductor material, apply a layer of photoresist on the surface of the semiconductor wafer, project the designed circuit diagram onto the wafer through the photolithography mask, expose the photoresist and cause a chemical reaction, and then clean the exposed part with a chemical developer, leaving a photoresist pattern identical to the circuit diagram on the semiconductor surface. However, the photolithography equipment will generate a lot of heat during operation, causing the surface temperature of the wafer to rise, which in turn affects the performance of the semiconductor chip. For this reason, we propose a semiconductor manufacturing wafer photolithography equipment. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor manufacturing wafer lithography device to solve the above-mentioned problem.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor manufacturing wafer lithography equipment, comprising: a box, an operating chamber, a placement table and a semiconductor chip, the operating chamber is arranged on the box, a wafer can be manufactured on the semiconductor chip in the operating box, the placement table is arranged on the operating box, the semiconductor chip is arranged on the placement table, the placement table is used to fix the semiconductor chip, a photolithography piece is connected in the operating chamber, and the photolithography piece corresponds to the semiconductor chip;

[0006] Also includes:

[0007] A heat reduction component is arranged in the operating chamber, corresponds to the semiconductor chip, and cools the semiconductor chip. A driving component is connected between the heat reduction component and the photolithography component;

[0008] A trigger component is disposed in the operating chamber and connected to the driving component. The trigger component is used to start the heat reduction component;

[0009] The control component is arranged in the operating cavity and is connected to the heat reduction component. The control component is used to control the heat dissipation effect of the heat reduction component.

[0010] The heat reduction component includes a condensation component, which is arranged in the operating cavity and corresponds to the semiconductor chip. The condensation component can dissipate the heat on the semiconductor chip.

[0011] Among them, the driving component includes a driving part and a moving part. The driving part is connected in the operating cavity, and the driving part is connected to the photoetching part and the condensing part. The moving part is connected in the operating cavity, and the driving part is connected to the moving part. The driving part controls the photoetching part and the condensing part to move along the X-axis direction, and the moving part controls the part and the condensing part to move along the Z-axis direction.

[0012] Among them, the driving part includes a driving plate, the driving plate is connected in the operating cavity, a driving slot is opened on the driving plate, a motor is connected in the driving slot, a screw rod is connected to the output shaft of the motor, two moving blocks are connected to the screw rod, and the two moving blocks are respectively connected to the photolithography part and the condensation part.

[0013] Among them, the moving part includes a moving plate, the moving plate is connected in the operating cavity, a moving groove is opened on the moving plate, a motor 2 is connected in the moving groove, a screw rod 2 is connected to the output shaft of the motor 2, a moving block 2 is connected to the screw rod 2, and the moving block 2 is connected to the driving plate.

[0014] Among them, the trigger component includes sector tooth 1, sector tooth 1 is connected to the output shaft of motor 2, a fixed plate is connected in the movable groove, a fixed shaft is connected to the fixed plate, sector tooth 2 is connected to the fixed shaft, and sector tooth 1 is meshed with sector tooth 2.

[0015] Among them, the sector tooth 2 is connected with a trigger plate, the movable groove is connected with a horizontal plate 1, the horizontal plate 1 is connected with a torsion spring, the torsion spring is connected with a horizontal plate 2, the movable groove is connected with a trigger key, and the horizontal plate 2 corresponds to the trigger key.

[0016] The control component includes a control board, which is connected to the condensing element. A control slot is provided on the control board, in which a control element is connected. The control element is used to control the heat dissipation effect of the condensing element.

[0017] The control part comprises a sliding rheostat, a sliding sheet is connected to the sliding rheostat, a rectangular plate is connected to the sliding sheet, a sliding rod is connected to the sliding rheostat, and a plurality of locking teeth are arranged on the sliding rod.

[0018] Among them, motor three is connected in the control slot, motor three is connected to a rotating shaft, the rotating shaft is connected to a clamping plate, a plurality of movable holes are opened on the rectangular plate, and the clamping plate corresponds to the movable holes, a spring is connected to the rectangular plate, and the spring is connected in the control slot.

[0019] The present invention has at least the following beneficial effects: by setting a heat reduction component and a trigger component, the heat reduction component is arranged in the operating cavity, the heat reduction component corresponds to the semiconductor chip, and the heat reduction component cools the semiconductor chip. A driving component is connected between the heat reduction component and the photolithography component, and the driving component can drive the photolithography component and the heat reduction component to work in the same direction at the same time, so that the semiconductor chip can be cooled at the same time during the semiconductor chip manufacturing wafer process, thereby preventing the semiconductor chip from shrinking or expanding due to the high temperature of the semiconductor chip during the semiconductor chip manufacturing wafer process, affecting its attachment and graphic position on the processing surface, the trigger component is arranged in the operating cavity, and the trigger component is connected to the drive component, the trigger component is used to start the heat reduction component, the trigger component can be started according to the semiconductor processing time, and then the trigger component starts the heat reduction component to cool the semiconductor, thereby preventing the semiconductor chip from being processed for a long time and the semiconductor chip temperature from being too high. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the local structure of the box body of the present invention;

[0022] Figure 3 It is a schematic diagram of the structure of the photoetching part and the condensing part of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure of the drive assembly of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of the trigger component of the present invention;

[0025] Figure 6 for Figure 5 Schematic diagram of the structure of the middle A area;

[0026] Figure 7 This is a schematic diagram of the structure of the trigger component of the present invention;

[0027] Figure 8 It is a schematic diagram of the structure of the driving member of the present invention;

[0028] Fig. 9 This is a schematic diagram of the control component structure of the present invention;

[0029] Fig.10 for Fig. 9 Schematic diagram of the structure of the middle B area;

[0030] Fig.11 It is a schematic diagram of the control component structure of the present invention.

[0031] In the figure: 1, box; 2, operating chamber; 3, placing table; 4, semiconductor chip; 5, photolithography component; 6, heat reduction component; 61, condensation component; 7, moving component; 71, moving plate; 72, moving slot; 8, driving component; 81, driving plate; 82, driving slot; 9, screw rod 2; 10, fixed plate; 11, fixed shaft; 12, horizontal plate 2; 13, horizontal plate 1; 14, torsion spring; 15, trigger key; 16, fan Sector tooth two; 17, motor two; 18, sector tooth one; 19, rotating shaft; 20, trigger plate; 21, moving block two; 22, motor one; 23, screw rod one; 24, moving block one; 25, control assembly; 251, control plate; 252, control slot; 26, control member; 27, spring; 28, slide; 29, rectangular plate; 30, slide rod; 31, moving hole; 32, motor three; 33, clamping plate. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Embodiment 1

[0034] See also Figures 1 to 11 The present invention provides a technical solution: a semiconductor manufacturing wafer lithography device, comprising: a box body 1, an operating chamber 2, a placement table 3 and a semiconductor chip 4, the operating chamber 2 is arranged on the box body 1, the operating box can manufacture wafers on the semiconductor chip 4, the placement table 3 is arranged on the operating box, the semiconductor chip 4 is arranged on the placement table 3, the placement table 3 is used to fix the semiconductor chip 4, and a photolithography piece 5 is connected in the operating chamber 2, and the photolithography piece 5 corresponds to the semiconductor chip 4;

[0035] Also includes:

[0036] The heat reduction component 6 is arranged in the operation chamber 2, and corresponds to the semiconductor chip 4. The heat reduction component 6 cools down the semiconductor chip 4. A driving component is connected between the heat reduction component 6 and the photolithography component 5. By setting the driving component, the photolithography component 5 and the heat reduction component 6 can be driven to work in the same direction at the same time, so that the semiconductor chip 4 can be cooled at the same time during the process of manufacturing the wafer of the semiconductor chip 4, thereby preventing the high temperature of the semiconductor chip 4 from causing the wafer to shrink or expand during the process of manufacturing the wafer of the semiconductor chip 4, thereby affecting its adhesion and pattern position on the processing surface;

[0037] A trigger component is disposed in the operating chamber 2 and is connected to the driving component. The trigger component is used to start the heat reduction component 6. The trigger component can be started according to the semiconductor processing time, and then the trigger component starts the heat reduction component 6 to reduce the heat of the semiconductor, thereby preventing the semiconductor chip 4 from being processed for a long time and the temperature of the semiconductor chip 4 being too high;

[0038] The control component 25 is arranged in the operating chamber 2, and the control component 25 is connected to the heat reduction component 6. The control component 25 is used to control the heat dissipation effect of the heat reduction component 6. The control component 25 can adjust the temperature of the heat reduction component 6 according to the semiconductor heating time, thereby preventing the temperature of the semiconductor chip 4 from being too high.

[0039] The heat reduction component 6 includes a condensation element 61, which is arranged in the operating chamber 2 and corresponds to the semiconductor chip 4. The condensation element 61 can dissipate the heat on the semiconductor chip 4. By setting the condensation element 61, the semiconductor chip 4 can be cooled, thereby preventing the semiconductor chip 4 from having too high a temperature for a long time.

[0040] The driving component includes a driving member 8 and a moving member 7. The driving member 8 is connected in the operating cavity 2, and the driving member 8 is connected to the photolithography member 5 and the condensation member 61. The moving member 7 is connected in the operating cavity 2, and the driving member 8 is connected to the moving member 7. The driving member 8 controls the photolithography member 5 and the condensation member 61 to move along the X-axis direction, and the moving member 7 controls the member 26 and the condensation member 61 to move along the Z-axis direction, thereby ensuring that the photolithography member 5 and the condensation member 61 can move synchronously. During the processing of the semiconductor chip 4, the semiconductor chip 4 can be cooled by the condensation member 61, thereby preventing the temperature of the semiconductor chip 4 from being too high and affecting the chip processing quality.

[0041] The driving member 8 includes a driving plate 81, which is connected to the operating chamber 2. A driving slot 82 is provided on the driving plate 81. A motor 22 is connected to the driving slot 82. A screw rod 23 is connected to the output shaft of the motor 22. Two moving blocks 24 are connected to the screw rod 23, and the two moving blocks 24 are respectively connected to the photolithography member 5 and the condensation member 61. By setting the driving slot 82, the motor 22 can be protected, thereby extending the service life of the motor 22. When the motor 22 is started, the motor 22 drives the screw rod 23 to rotate. The rotation of the screw rod 23 can drive the two moving blocks to move along the X-axis, thereby simultaneously driving the photolithography member 5 and the condensation member 61 to move, thereby cooling the surface of the semiconductor chip 4 during the processing of the semiconductor chip 4.

[0042] The moving part 7 includes a moving plate 71, which is connected to the operating chamber 2. A moving groove 72 is provided on the moving plate 71. A motor 17 is connected to the moving groove 72. A screw rod 9 is connected to the output shaft of the motor 17. A moving block 21 is connected to the screw rod 9. The moving block 21 is connected to the driving plate 81. The motor 17 can be protected by setting the moving groove 72, thereby extending the service life of the motor 17. When the motor 17 starts, it drives the screw rod 9 to rotate. The rotation of the screw rod 9 drives the moving block 21 to move along the Z axis, thereby simultaneously driving the photolithography part 5 and the condensation part 61 to move.

[0043] The trigger assembly includes a sector tooth 18, which is connected to the output shaft of the motor 2 17, a fixed plate 10 is connected in the movable groove 72, a fixed shaft 11 is connected to the fixed plate 10, a sector tooth 2 16 is connected to the fixed shaft 11, and the sector tooth 18 is meshed with the sector tooth 2 16. The rotation of the motor 2 17 can drive the sector tooth 18 to rotate, and the rotation of the sector tooth 18 can drive the sector tooth 2 16 to rotate, and then the sector tooth 1 can be driven to rotate one circle by the rotation of the sector tooth 18, so that the semiconductor processing time can be timed.

[0044] A trigger plate 20 is connected to the sector tooth 2 16, a horizontal plate 13 is connected in the movable groove 72, a torsion spring 14 is connected to the horizontal plate 13, a horizontal plate 2 12 is connected to the torsion spring 14, a trigger key 15 is connected to the movable groove 72, and the horizontal plate 2 12 corresponds to the trigger key 15, the rotation of the sector tooth 2 16 can drive the trigger plate 20 to rotate, the trigger plate 20 rotates to press the horizontal plate 2 12, the horizontal plate 2 12 rotates to press the trigger key 15, and then the condensation part 61 is opened, the surface of the semiconductor chip 4 can be cooled, and the horizontal plate 2 12 can be automatically restored to its original position by setting the torsion spring 14.

[0045] Embodiment 2

[0046] The control component 25 includes a control board 251, which is connected to the condensation element 61. A control groove 252 is provided on the control board 251. The control groove 252 is connected to the control element 26. The control element 26 is used to control the heat dissipation effect of the condensation element 61. By setting the control groove 252, the control element 26 can be protected, thereby extending the service life of the control element 26.

[0047] The control component 26 includes a sliding rheostat, a slider 28 is connected to the sliding rheostat, a rectangular plate 29 is connected to the slider 28, a sliding rod 30 is connected to the sliding rheostat, and a plurality of teeth are provided on the sliding rod 30. The slider 28 slides on the sliding rod 30. By adjusting the resistance value of the resistor, the current can be changed, thereby affecting the heat dissipation effect of the condenser. When the resistance is reduced, the cooling effect is improved.

[0048] A motor three 32 is connected in the control groove 252, and a rotating shaft 19 is connected to the motor three 32, and a clamping plate 33 is connected to the rotating shaft 19. A plurality of moving holes 31 are opened on the rectangular plate 29, and the clamping plate 33 corresponds to the moving holes 31. A spring 27 is connected to the rectangular plate 29, and the spring 27 is connected in the control groove 252. When the trigger key 15 is triggered, the motor three 32 is started, and the motor three 32 drives the rotating shaft 19 to rotate, and the rotating shaft 19 drives the clamping plate 33 to rotate, and then the clamping plate 33 is clamped with the moving hole 31, which can drive the rectangular plate 29 to move, and then drive the sliding piece 28 to move, so that the resistance can be adjusted, and then the condensation effect of the condensation piece 61 can be changed. By setting the spring 27, the rectangular plate 29 can be automatically restored. When the rectangular plate 29 is automatically restored, by providing a clamping tooth on the sliding rod 30, the resistance can be slowly increased, and the condensation temperature can be slowly restored, so as to prevent the surface temperature difference of the semiconductor chip 4 from being too large and affecting the quality of the semiconductor chip 4.

[0049] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0050] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor manufacturing wafer lithography device, comprising: A box body (1), an operating chamber (2), a placement table (3) and a semiconductor chip (4), wherein the operating chamber (2) is arranged on the box body (1), and the operating box can manufacture wafers on the semiconductor chip (4); the placement table (3) is arranged on the operating box, and the semiconductor chip (4) is arranged on the placement table (3); the placement table (3) is used to fix the semiconductor chip (4); a photolithography piece (5) is connected to the operating chamber (2), and the photolithography piece (5) corresponds to the semiconductor chip (4); It is characterized by: also including: a heat reduction component (6), the heat reduction component (6) being arranged in the operating chamber (2), the heat reduction component (6) corresponding to the semiconductor chip (4), the heat reduction component (6) cooling the semiconductor chip (4), and a driving component being connected between the heat reduction component (6) and the photolithography component (5); a trigger component, the trigger component being arranged in the operating chamber (2) and connected to the driving component, the trigger component being used to activate the heat reduction component (6); A control component (25), wherein the control component (25) is disposed in the operating chamber (2), and the control component (25) is connected to the heat reduction component (6), and the control component (25) is used to control the heat dissipation effect of the heat reduction component (6).

2. The semiconductor manufacturing wafer lithography equipment according to claim 1, characterized in that: The heat reduction component (6) comprises a condensation element (61), wherein the condensation element (61) is arranged in the operating chamber (2), and the condensation element (61) corresponds to the semiconductor chip (4), and the condensation element (61) can dissipate heat from the semiconductor chip (4).

3. The semiconductor manufacturing wafer lithography equipment according to claim 1, characterized in that: The driving component comprises a driving member (8) and a moving member (7); the driving member (8) is connected in the operating chamber (2), and the driving member (8) is connected to the photoetching member (5) and the condensing member (61); the moving member (7) is connected in the operating chamber (2), and the driving member (8) is connected to the moving member (7); the driving member (8) controls the photoetching member (5) and the condensing member (61) to move along the X-axis direction, and the moving member (7) controls the member (26) and the condensing member (61) to move along the Z-axis direction.

4. The semiconductor manufacturing wafer lithography equipment according to claim 3, characterized in that: The driving member (8) comprises a driving plate (81), the driving plate (81) is connected in the operating chamber (2), a driving slot (82) is provided on the driving plate (81), a motor (22) is connected in the driving slot (82), a screw rod (23) is connected to the output shaft of the motor (22), two moving blocks (24) are connected to the screw rod (23), and the two moving blocks (24) are respectively connected to the photolithography member (5) and the condensation member (61).

5. The semiconductor manufacturing wafer lithography equipment according to claim 4, characterized in that: The moving member (7) comprises a moving plate (71), the moving plate (71) is connected in the operating chamber (2), a moving groove (72) is provided on the moving plate (71), a second motor (17) is connected in the moving groove (72), a second screw rod (9) is connected to the output shaft of the second motor (17), a second moving block (21) is connected to the second screw rod (9), and the second moving block (21) is connected to the driving plate (81).

6. The semiconductor manufacturing wafer lithography equipment according to claim 5, characterized in that: The trigger assembly comprises a sector tooth 1 (18), the sector tooth 1 (18) being connected to the output shaft of the motor 2 (17), a fixed plate (10) being connected in the movable groove (72), a fixed shaft (11) being connected to the fixed plate (10), a sector tooth 2 (16) being connected to the fixed shaft (11), and the sector tooth 1 (18) being meshed with the sector tooth 2 (16).

7. The semiconductor manufacturing wafer lithography equipment according to claim 6, characterized in that: The sector tooth 2 (16) is connected to a trigger plate (20), the movable groove (72) is connected to a transverse plate 1 (13), the transverse plate 1 (13) is connected to a torsion spring (14), the torsion spring (14) is connected to a transverse plate 2 (12), the movable groove (72) is connected to a trigger key (15), and the transverse plate 2 (12) corresponds to the trigger key (15).

8. The semiconductor manufacturing wafer lithography equipment according to claim 1, characterized in that: The control assembly (25) comprises a control board (251), the control board (251) is connected to the condensing element (61), a control slot (252) is provided on the control board (251), a control element (26) is connected in the control slot (252), and the control element (26) is used to control the heat dissipation effect of the condensing element (61).

9. The semiconductor manufacturing wafer lithography equipment according to claim 8, characterized in that: The control member (26) comprises a sliding rheostat, a sliding sheet (28) is connected to the sliding rheostat, a rectangular plate (29) is connected to the sliding sheet (28), a sliding rod (30) is connected to the sliding rheostat, and a plurality of latching teeth are provided on the sliding rod (30).

10. The semiconductor manufacturing wafer lithography equipment according to claim 9, characterized in that: The control groove (252) is connected to a motor three (32), a rotating shaft (19) is connected to the motor three (32), a clamping plate (33) is connected to the rotating shaft (19), a plurality of movable holes (31) are formed on the rectangular plate (29), and the clamping plate (33) corresponds to the movable holes (31), a spring (27) is connected to the rectangular plate (29), and the spring (27) is connected to the control groove (252).

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