Wafer film pasting and defoaming equipment and processing method

Abstract

The invention discloses wafer film pasting and defoaming equipment and a processing method, and particularly relates to the technical field of wafer film pasting and defoaming. The wafer film pasting and defoaming equipment comprises a base, a material guiding, film pasting and defoaming assembly is arranged on the base, and the material guiding, film pasting and defoaming assembly comprises a heating box arranged on one side of the top of the base; and a rotary table is arranged on one side of the heating box. Through corresponding cooperative use of all structures, the pasting side slope can make contact with the outer side of a wafer, a second material reel rotates a film body to be pasted on the outer side of the wafer through limiting of the pressing rod and the pasting side slope, the wafer after film pasting can be conveyed to the bottom of the pressing shaft, film pasting production can be conducted on the wafer easily and continuously, and the production efficiency is improved. The pressing shaft is in contact with the outer side of the wafer to pressurize the film on the wafer, bubbles generated during film pasting are pressed out, the heating plate is reset and heated through the heating box, the film can be easily and fully attached to the wafer, and the film pasting quality is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer film degassing, and more specifically, to a wafer film degassing device and a processing method. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits, also known as silicon wafer. Its original material is silicon, which undergoes a series of complex processing processes, such as cutting, polishing, slicing, etc., and finally forms a round piece with a specific diameter, namely a wafer. Wafer is the carrier used to produce integrated circuits. According to its diameter, it can be divided into 4-inch, 5-inch, 6-inch, 8-inch and other specifications. Recently, 12-inch and even larger wafers have been developed. The main processing methods of wafers are sheet processing and batch processing, processing one or more wafers at the same time.

[0003] Problems such as contamination and scratches on the wafer surface will affect product quality. Wafer film bonding is an effective way to avoid these problems. By covering the wafer surface with a thin film, the wafer can be protected from contamination, scratches, etc. during the process and storage. At the same time, some bubbles that cannot be removed will inevitably appear in the film bonding process, thereby affecting product quality and causing defective products. For this purpose, a wafer film bonding degassing device is provided. Summary of the invention

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a wafer film degassing device and a processing method, aiming to solve the problems raised in the above-mentioned background technology.

[0005] The present invention is achieved in this way, and the present invention provides the following technical solutions:

[0006] A wafer film degassing device comprises a base, on which a material guiding film degassing component is arranged; the material guiding film degassing component comprises a heating box arranged on one side of the top of the base, a turntable is arranged on one side of the heating box, a plurality of supporting shaft seats are distributed on the outer side of the turntable, and a vertical plate is arranged on the side of the turntable away from the heating box; a pressure rod is arranged on one side of the vertical plate, the pressure rod is slidably connected to the vertical plate, and a side slope is provided on one side of the bottom of the pressure rod; an L-rod located on one side of the turntable is arranged between the heating box and the turntable, an electric push rod is arranged on the top side of the L-rod, a connecting plate is arranged on the output end of the electric push rod, a guide seat is arranged at the bottom of the connecting plate, a lower pressing frame is arranged at the bottom of the guide seat, and the bottom of the lower pressing frame is rotatably connected with two pressing shafts.

[0007] It can be seen that in the above technical solution, the wafer is placed on the support shaft seat, and the multiple support shaft seats are driven to move by the rotation of the turntable, so that the support shaft seat can be moved to one end of the pressure rod, and the pressure rod is driven to move by the hydraulic rod, so that the side slope can contact the outer side of the wafer, so that the second material reel can rotate and the film body can pass through the limit of the pressure rod and the side slope to stick the film on the outer side of the wafer, and the waste material can be rolled up on the second material reel;

[0008] Optionally, in a possible implementation, a first material reel is provided on one side of the top of the vertical plate, a second material reel is provided at the bottom of the first material reel, a hydraulic rod is provided on the top of the pressure rod, an output end of the hydraulic rod extends to the pressure rod, a film body is provided on the first material reel, and one end of the film body is wound around the second material reel by the end of the pressure rod;

[0009] Optionally, in a possible embodiment, two vertical rods are provided on the top of the lower pressure frame, the vertical rods extend to the guide seat and are slidably connected to the guide seat, the outer side of the vertical rods is sleeved with a spring, a screw transmission module is provided on one side of the heating box, the screw transmission module is installed on the base, a material picking gripper is provided on the screw transmission module, a conveyor belt is provided at the bottom of the material picking gripper, the conveyor belt is installed on the base, a plurality of pads are provided in the heating box, and a heating plate is provided on the top of each pad, an electric slide rail is provided on the top, the heating plate is slidably connected to the electric slide rail, and an electric actuator is provided on the pad;

[0010] It can be seen that in the above technical scheme, the wafer is placed on the support shaft seat, and the multiple support shaft seats are driven to move by the rotation of the turntable, so that the support shaft seat can be moved to one end of the pressure rod, and the pressure rod is driven to move by the hydraulic rod, so that the side slope can contact the outside of the wafer, which is easy for the second material reel to rotate, and the film body can be limited by the pressure rod and the side slope to be pasted on the outside of the wafer, and the waste material can be rolled up on the second material reel. At the same time, when the pressure shaft contacts the wafer, the pressure shaft is limited by the wafer, and the vertical rod is displaced and the spring is compressed, which buffers the contact between the pressure shaft and the wafer, and the material grabber clamps it, so that the wafer can be transported to the conveyor belt, and the electric actuator is used to start the electric slide rail to extend the heating plate from the heating box, and then the wafer is placed on the heating plate, and the heating plate is reset and heated through the heating box, which makes it easy for the film to fully fit the wafer and ensure the quality of the film.

[0011] The present invention also provides a processing method, using the above-mentioned wafer film degassing equipment, comprising the following steps:

[0012] Step 1: The staff installs the device at the designated position. When laminating the wafer, the wafer is placed on the support shaft seat. The turntable rotates to drive the multiple support shaft seats to move, so that the support shaft seat can move to one end of the pressure rod. The hydraulic rod is used to start the pressure rod to move, so that the side slope can contact the outside of the wafer, so that the second material reel can rotate and the film body can pass through the pressure rod and the side slope to limit the film on the outside of the wafer, and the waste material can be rolled up on the second material reel;

[0013] Step 2: After the wafer film is attached, the turntable rotates to transport the wafers on the remaining support shaft seats to the bottom of the pressure rod for film attachment. The wafers after film attachment can be transported to the bottom of the pressure shaft, and the electric push rod starts the driving connecting plate to drive the guide seat, the lower pressure frame and the pressure shaft to move downward. The pressure shaft contacts the outside of the wafer to pressurize the film on the wafer, so that the bubbles generated during film attachment can be pressed out.

[0014] Step 3: When the pressing shaft contacts the wafer, the pressing shaft is limited by the wafer, and the vertical rod is displaced and the spring is compressed, so as to buffer the contact between the pressing shaft and the wafer and avoid damage to the film;

[0015] Step 4: After the wafer is squeezed and de-bubbled by the pressing shaft, it rotates on the turntable and is clamped by the material grabber so that it can be transported to the conveyor belt. The electric actuator is used to start the electric slide rail to extend the heating plate from the heating box. The wafer is then placed on the heating plate and reset through the heating box for heating, which makes it easier for the film to fit fully with the wafer, ensuring the quality of the film.

[0016] Technical effects and advantages of the present invention:

[0017] 1. The present invention places the wafer on the support shaft seat, and drives the multiple support shaft seats to move through the rotation of the turntable, so that the support shaft seat can move to one end of the pressure rod, and the hydraulic rod is started to drive the pressure rod to move, so that the side slope can contact the outer side of the wafer, and the second material reel can rotate to allow the film body to pass through the limit of the pressure rod and the side slope and stick the film on the outer side of the wafer, and the waste material can be rolled up on the second material reel;

[0018] 2. The present invention transports the wafers on the remaining support shaft seats to the bottom of the pressing rod for film lamination by rotating the turntable, and the wafers after film lamination can be transported to the bottom of the pressing shaft, which is easy to continuously lamination the wafers;

[0019] 3. The present invention starts the driving connection plate by the electric push rod to drive the guide seat, the lower pressing frame and the pressing shaft to move downward, and the pressing shaft contacts the outer side of the wafer to pressurize the film on the wafer, so that the bubbles generated during the film application can be pressed out, thereby ensuring the quality of the film application;

[0020] 4. The present invention starts and drives the electric slide rail through the electric actuator to make the heating plate extend out of the heating box, and then the wafer is placed on the heating plate. The heating plate is reset and heated through the heating box, which makes it easy for the film to fully fit the wafer and ensure the quality of the film.

[0021] To sum up, the overall design is simple and the structure is reasonable. Through the corresponding coordination of various structures, the pressure rod is displaced so that the side slope can contact the outside of the wafer, which makes it easy for the second material reel to rotate, and the film body can be limited by the pressure rod and the side slope to be pasted on the outside of the wafer, and the waste material can be rolled up on the second material reel, and the wafers on the remaining supporting shaft seats are transported to the bottom of the pressure rod for film pasting, and the wafers after film pasting can be transported to the bottom of the pressure shaft, which is easy to continuously produce wafers for film pasting. The pressure shaft contacts the outside of the wafer, and presses the film on the wafer, so that the bubbles generated during film pasting can be pressed out, and the heating plate is reset and heated through the heating box, which makes it easy for the film to fully fit the wafer, thereby ensuring the quality of film pasting. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0023] Figure 1 It is the front view of the overall structure of the present invention.

[0024] Figure 2 It is a side view of the overall structure of the present invention.

[0025] Figure 3 It is a top view of the overall structure of the present invention.

[0026] Figure 4 It is a side view of the connecting plate, the guide seat and the lower pressing frame of the present invention.

[0027] Figure 5 It is a three-dimensional diagram of the heating box, the backing plate and the electric slide rail of the present invention.

[0028] Figure 6 It is a three-dimensional diagram of the pad, electric slide rail and heating plate of the present invention.

[0029] In the figure: 1. base; 2. heating box; 3. turntable; 4. support shaft seat; 5. vertical plate; 6. first material reel; 7. second material reel; 8. pressure rod; 9. side slope; 10. hydraulic rod; 11. membrane body; 12. L rod; 13. electric push rod; 14. connecting plate; 15. guide seat; 16. lower pressure frame; 17. pressure shaft; 18. vertical rod; 19. spring; 20. screw transmission module; 21. material grabber; 22. pad; 23. heating plate; 24. electric slide rail; 25. electric actuator; 26. conveyor belt. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] As attached Figure 1-6 The wafer film degassing equipment shown in the figure uses a material-guiding film degassing assembly arranged on a base 1, and a pressure rod 8 is displaced so that the side slope 9 can contact the outer side of the wafer, so that the second material reel 7 can rotate so that the film body 11 can pass through the limit of the pressure rod 8 and the side slope 9 and be filmed on the outer side of the wafer, and the waste material can be rolled up on the second material reel 7, and the remaining wafers on the support shaft seat 4 are transported to the bottom of the pressure rod 8 for filming, and the wafers after filming can be transported to the bottom of the pressure shaft 17, so that it is easy to continuously produce film on the wafers, and the pressure shaft 17 contacts the outer side of the wafer to pressurize the film on the wafer, so that the bubbles generated during filming can be pressed out, and the heating plate 23 is reset and heated through the heating box 2, so that the film is easy to fully fit with the wafer, ensuring the quality of filming, and the specific structure of the assembly is set as follows;

[0032] The material guiding film laminating and degassing assembly comprises a heating box 2 arranged on one side of the top of a base 1, a turntable 3 is arranged on one side of the heating box 2, a plurality of supporting shaft seats 4 are distributed on the outer side of the turntable 3, and a vertical plate 5 is arranged on the side of the turntable 3 away from the heating box 2;

[0033] A pressure rod 8 is provided on one side of the vertical plate 5, and the pressure rod 8 is slidably connected to the vertical plate 5. A side slope 9 is provided on one side of the bottom of the pressure rod 8;

[0034] An L-rod 12 is arranged between the heating box 2 and the turntable 3 and is located on one side of the turntable 3. An electric push rod 13 is arranged on the top side of the L-rod 12. A connecting plate 14 is arranged at the output end of the electric push rod 13. A guide seat 15 is arranged at the bottom of the connecting plate 14. A lower pressing frame 16 is arranged at the bottom of the guide seat 15. The bottom of the lower pressing frame 16 is rotatably connected to two pressing shafts 17.

[0035] A first material reel 6 is arranged on one side of the top of the vertical plate 5, a second material reel 7 is arranged at the bottom of the first material reel 6, a hydraulic rod 10 is arranged on the top of the pressure rod 8, the output end of the hydraulic rod 10 extends to the pressure rod 8, a film body 11 is arranged on the first material reel 6, and one end of the film body 11 is wound on the second material reel 7 by the end of the pressure rod 8;

[0036] Two vertical rods 18 are arranged on the top of the lower pressing frame 16, and the vertical rods 18 extend to the guide seat 15 and are slidably connected to the guide seat 15. A spring 19 is sleeved on the outer side of the vertical rod 18. A screw transmission module 20 is arranged on one side of the heating box 2, and the screw transmission module 20 is installed on the base 1. A material grabber 21 is arranged on the screw transmission module 20, and a conveyor belt 26 is arranged at the bottom of the material grabber 21. The conveyor belt 26 is installed on the base 1. A plurality of pads 22 are arranged in the heating box 2, and a heating plate 23 is arranged on the top of each pad 22. An electric slide rail 24 is arranged on the top of 202, and the heating plate 23 is slidably connected to the electric slide rail 24. An electric actuator 25 is arranged on the pad 22;

[0037] The present invention also provides a processing method, using the above-mentioned wafer film degassing equipment, which specifically includes the following steps:

[0038] Step 1: The staff installs the device at the designated position. When laminating the wafer, the wafer is placed on the support shaft seat 4. The turntable 3 rotates to drive the multiple support shaft seats 4 to move, so that the support shaft seat 4 can move to one end of the pressure rod 8. The hydraulic rod 10 is used to start the pressure rod 8 to move, so that the side slope 9 can contact the outside of the wafer, and the second material reel 7 can rotate to allow the film body 11 to pass through the pressure rod 8 and the side slope 9 to limit the film on the outside of the wafer, and the waste material can be rolled up on the second material reel 7;

[0039] Step 2: After the wafer film is attached, the turntable 3 is rotated to transport the wafers on the remaining support shaft seats 4 to the bottom of the pressure rod 8 for film attachment, and the wafers after film attachment can be transported to the bottom of the pressure shaft 17, and the electric push rod 13 is used to start the driving connecting plate 14 to drive the guide seat 15, the lower pressure frame 16 and the pressure shaft 17 to move downward, and the pressure shaft 17 contacts the outer side of the wafer to pressurize the film on the wafer, so that the bubbles generated during film attachment can be pressed out;

[0040] Step 3: When the pressing shaft 17 contacts the wafer, the pressing shaft 17 is limited by the wafer, and the vertical rod 18 is displaced and the spring 19 is compressed, so as to buffer the contact between the pressing shaft 17 and the wafer and avoid damage to the film;

[0041] Step four, after the wafer is squeezed and defoamed by the pressing shaft 17, it is rotated by the turntable 3 and clamped by the material grabber 21, so that the wafer can be transported to the conveyor belt 26, and the electric actuator 25 starts to drive the electric slide rail 24 to make the heating plate 23 extend from the heating box 2, and then the wafer is placed on the heating plate 23. The heating plate 23 is reset and heated by the heating box 2, so that the film can be easily attached to the wafer and the quality of the film can be ensured.

[0042] According to the above structure, when in use, the wafer is placed on the support shaft seat 4, and the turntable 3 rotates to drive the multiple support shaft seats 4 to move, so that the support shaft seat 4 can move to one end of the pressure rod 8, and the hydraulic rod 10 is used to start the pressure rod 8 to move, so that the side slope 9 can contact the outside of the wafer, and the second material reel 7 can rotate so that the film body 11 can pass through the pressure rod 8 and the side slope 9 to stick the film on the outside of the wafer, and the waste material can be rolled up on the second material reel 7;

[0043] After the wafer film is attached, the turntable 3 rotates to transport the remaining wafers on the support shaft seat 4 to the bottom of the pressure rod 8 for film attachment, and the wafers after film attachment can be transported to the bottom of the pressure shaft 17, and the electric push rod 13 starts to drive the connecting plate 14 to drive the guide seat 15, the lower pressure frame 16 and the pressure shaft 17 to move downward, and the pressure shaft 17 contacts the outer side of the wafer to pressurize the film on the wafer, so that the bubbles generated during film attachment can be pressed out;

[0044] At the same time, when the pressing shaft 17 contacts the wafer, the pressing shaft 17 is limited by the wafer, and the vertical rod 18 is displaced and the spring 19 is compressed, so as to buffer the pressing shaft 17 when it contacts the wafer to avoid damage to the film. After the wafer is squeezed and defoamed by the pressing shaft 17, it is rotated by the turntable 3 and clamped by the material grabber 21, so that the wafer can be transported to the conveyor belt 26, and the electric actuator 25 starts to drive the electric slide rail 24 to operate, so that the heating plate 23 is extended from the heating box 2, and then the wafer is placed on the heating plate 23, and the heating plate 23 is reset to be heated by the heating box 2, so that the film is easy to fully fit with the wafer and the quality of the film is ensured.

[0045] Different from the prior art, the present application discloses a wafer film degassing equipment and processing method, by displacing the pressure rod 8, the side slope 9 can contact the outside of the wafer, and the second material reel 7 can rotate so that the film body 11 can pass through the pressure rod 8 and the side slope 9 to limit the film on the outside of the wafer, and the waste material can be rolled up on the second material reel 7, and the remaining wafers on the support shaft seat 4 are transported to the bottom of the pressure rod 8 for film pasting, and the wafers after film pasting can be transported to the bottom of the pressure shaft 17, which is easy to continuously produce wafers for film pasting. The pressure shaft 17 contacts the outside of the wafer to pressurize the film on the wafer, so that the bubbles generated during film pasting can be pressed out, and the heating plate 23 is reset and heated through the heating box 2, which makes it easy for the film to fully fit the wafer and ensure the quality of film pasting.

[0046] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer film degassing device, comprising a base (1), characterized in that: The base (1) is provided with a material-conducting, film-sticking and degassing component; the material-conducting, film-sticking and degassing component comprises a heating box (2) arranged on one side of the top of the base (1); a turntable (3) is arranged on one side of the heating box (2); a plurality of supporting shaft seats (4) are distributed on the outer side of the turntable (3); a vertical plate (5) is arranged on the side of the turntable (3) away from the heating box (2); a pressure rod (8) is arranged on one side of the vertical plate (5); the pressure rod (8) is slidably connected to the vertical plate (5); the bottom of the pressure rod (8) A side slope (9) is provided on one side; an L-rod (12) located on one side of the turntable (3) is provided between the heating box (2) and the turntable (3); an electric push rod (13) is provided on one side of the top of the L-rod (12); a connecting plate (14) is provided at the output end of the electric push rod (13); a guide seat (15) is provided at the bottom of the connecting plate (14); a lower pressing frame (16) is provided at the bottom of the guide seat (15); and the bottom of the lower pressing frame (16) is rotatably connected to two pressing shafts (17).

2. The wafer film degassing equipment according to claim 1, characterized in that: A first material reel (6) is arranged on one side of the top of the vertical plate (5), a second material reel (7) is arranged at the bottom of the first material reel (6), and a hydraulic rod (10) is arranged on the top of the pressure rod (8).

3. The wafer film degassing equipment according to claim 2, characterized in that: The output end of the hydraulic rod (10) extends to the pressure rod (8), and a film body (11) is arranged on the first material reel (6). One end of the film body (11) is wound around the second material reel (7) by the end of the pressure rod (8).

4. The wafer film degassing equipment according to claim 1, characterized in that: Two vertical rods (18) are arranged on the top of the pressing frame (16). The vertical rods (18) extend to the guide seat (15) and are slidably connected to the guide seat (15). The outer sides of the vertical rods (18) are sleeved with springs (19).

5. The wafer film degassing equipment according to claim 1, characterized in that: A screw transmission module (20) is provided on one side of the heating box (2), the screw transmission module (20) is mounted on the base (1), and a material grabbing gripper (21) is provided on the screw transmission module (20).

6. The wafer film degassing equipment according to claim 5, characterized in that: A conveyor belt (26) is provided at the bottom of the material taking gripper (21), and the conveyor belt (26) is installed on the base (1).

7. The wafer film degassing equipment according to claim 1, characterized in that: A plurality of pads (22) are arranged in the heating box (2), and a heating plate (23) is arranged on the top of each pad (22).

8. The wafer film degassing equipment according to claim 7, characterized in that: An electric slide rail (24) is arranged on the top of the (202), the heating plate (23) is slidably connected to the electric slide rail (24), and an electric actuator (25) is arranged on the pad (22).

9. A processing method, using the wafer film degassing equipment according to any one of claims 1 to 8, characterized in that: The following steps are involved: Step 1, placing the wafer on the support shaft seat (4), and driving the plurality of support shaft seats (4) to move by rotating the turntable (3), so that the support shaft seat (4) can move to one end of the pressure rod (8), and starting the pressure rod (8) to move by the hydraulic rod (10), so that the side slope (9) can contact the outer side of the wafer, so that the second material reel (7) can rotate the film body (11) to pass through the limit of the pressure rod (8) and the side slope (9) to stick the film on the outer side of the wafer, and the waste material can be rolled up on the second material reel (7); Step 2: The turntable (3) is rotated again to transport the remaining wafers on the support shaft seat (4) to the bottom of the pressure rod (8) for film lamination. After the film lamination is completed, the wafer can be transported to the bottom of the pressure shaft (17). Through the contact between the pressure shaft (17) and the outer side of the wafer, the film is pressurized on the wafer, so that the bubbles generated during the film lamination can be pressed out; Step three, when the pressing shaft (17) contacts the wafer, the pressing shaft (17) is limited by the wafer, and the vertical rod (18) is displaced and the spring (19) is compressed, so as to provide a buffer when the pressing shaft (17) contacts the wafer; Step 4: After the wafer is squeezed and defoamed by the pressing shaft (17), it is rotated by the turntable (3) and clamped by the material grabber (21), so that the wafer can be transported to the conveyor belt (26). The electric actuator (25) starts to drive the electric slide rail (24) to operate, thereby extending the heating plate (23) from the heating box (2). Then, the wafer is placed on the heating plate (23), and the heating plate (23) is reset and heated by the heating box (2), so that the film can be easily attached to the wafer and the quality of the film can be ensured.

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