Film covering device for wafer manufacturing

Abstract

The invention discloses a film coating device for wafer manufacturing, and belongs to the technical field of wafer film coating. The film covering device for wafer manufacturing comprises a film covering table, a cutting cover is rotationally connected to the film covering table, a film covering roll is placed on the inner wall of one end of the film covering table, a moving block is arranged in a guide seat in a sliding fit mode, a waste film treatment mechanism is arranged on the upper side of the moving block, and a recycling seat is fixedly connected to one side of the film covering table. After the wafer is subjected to film covering and cutting, a film rolling frame in the waste film treatment mechanism can rotate in the moving process of the film rolling frame, so that leftover materials of the film covering are rolled, and timely cleaning from the film covering table is achieved. Interference of leftover materials on a production line is avoided, the operation efficiency of the production line is further improved, the leftover materials of a film are pushed into the recycling base to be extruded and recycled, the size of the leftover materials is reduced, follow-up transportation and storage are facilitated, and meanwhile resource cyclic utilization is achieved through recycling.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer coating, and in particular relates to a coating device used for wafer manufacturing. Background Art

[0002] Wafer is an important part of the semiconductor industry. It is the basic material for manufacturing semiconductor devices and integrated circuits (ICs). Wafer, also known as silicon wafer or silicon chip, is a silicon chip used to make silicon semiconductor integrated circuits. It is named wafer because of its round shape. The main component of the wafer is silicon, which is made into a thin sheet through a series of complex processes. It is used to make various circuit component structures on its surface, thereby forming IC products with specific electrical functions.

[0003] Wafer lamination is an important part of the semiconductor manufacturing process. It protects the wafer: during wafer grinding, cutting, transportation and storage, the film can effectively protect the wafer surface from damage, scratches, contamination or chemical corrosion. During wafer grinding and cutting, the film can provide stable support to ensure that the wafer will not move or deform during processing, thereby improving processing accuracy. The film can also be used as a substrate for subsequent processes (such as photolithography, etching, etc.) to facilitate more complex processing operations. Commonly used materials for wafer lamination include blue film, UV film, PET substrate film, etc. Wafer lamination is an important part of semiconductor manufacturing. It is of great significance to protect the wafer, improve processing accuracy and facilitate subsequent processing. When laminating the wafer, it is necessary to select appropriate materials, methods and environment, and strictly abide by operating procedures and safety protection measures.

[0004] The prior art discloses some invention patents in the field of wafer laminating technology, among which the invention patent with publication number CN116631906B discloses an integrated wafer blue film laminating machine and its control system, including a frame, on which are respectively provided a CST loading and unloading assembly for storing wafers with film laminating completed, an iron ring loading assembly for adding wafers to be processed, and a film laminating unwinding module for laminating wafers; the CST loading and unloading assembly includes a silo for storing wafers, the silo is provided with a supporting partition, and a linear module is provided at the inlet of the silo; the iron ring loading assembly includes an iron ring loading silo and a secondary positioning module, and an iron ring loading robot is provided above the iron ring loading silo; the film laminating unwinding module includes a film laminating channel, and an unwinding mechanism and a winding mechanism are suspended and installed in sequence above the film laminating channel, and a film cutting component is provided between the unwinding mechanism and the winding mechanism. This application only requires manual placement of the wafer to be processed into the iron ring loading bin, and does not require manual adjustment of the position of the wafer, which can improve the processing efficiency of wafer coating.

[0005] When the prior art is used, after the film on the wafer is cut, film scraps will be generated. Since this technology is not convenient for timely processing of the film scraps, the film scraps will accumulate in the work area and occupy a large amount of space, causing the work environment to become messy, affecting work efficiency and employee convenience. At the same time, the film scraps that are not processed in time may adhere to the wafer or other production equipment, causing pollution to subsequent production processes, such as introducing impurities, affecting the flatness of the wafer surface, etc., thereby reducing the quality and pass rate of the product.

[0006] Based on this, the present invention designs a coating device for wafer manufacturing to solve the above problems. Summary of the invention

[0007] The purpose of the present invention is to solve the problem that when the prior art is used, after cutting the coating on the wafer, scraps of the coating will be generated. Since the technology is not convenient for timely processing of the scraps of the coating, the scraps of the coating will accumulate in the working area and occupy a large amount of space, causing the working environment to become messy, affecting work efficiency and the convenience of employees' operation. At the same time, the scraps of the coating that are not processed in time may adhere to the wafer or other production equipment, causing pollution to subsequent production processes, such as introducing impurities, affecting the flatness of the wafer surface, etc., thereby reducing the quality and pass rate of the product. A coating device for wafer manufacturing is proposed.

[0008] In order to achieve the above object, the present invention adopts the following technical solutions:

[0009] The coating device for wafer manufacturing comprises a coating table, on which a cutting cover is rotatably connected, a coating roll is placed on the inner wall of one end of the coating table, a plurality of wafer rings are placed in the coating table, an adjustment mechanism is rotatably connected in the coating table, a guide seat is fixedly connected to one side of the coating table, a moving block is slidably provided in the guide seat, a waste film processing mechanism is provided on the upper side of the moving block, and a recovery seat is fixedly connected to one side of the coating table.

[0010] As a further description of the above technical solution:

[0011] The inner walls of both sides of the laminating platform where the laminating roll is located are provided with placement grooves, a lifting rod is slidably arranged inside the laminating platform, a pedal is rotatably connected to the bottom of the laminating platform, and the pedal is arranged in sliding contact with the bottom end of the lifting rod.

[0012] As a further description of the above technical solution:

[0013] The adjustment mechanism includes a worm A, which is rotatably connected to the inner wall of the coating table. A worm wheel A is meshingly provided at the inner end of the worm A. An adjustment disk is fixedly connected to the worm wheel A. The adjustment disk is rotatably connected to the inner wall of the coating table. A plurality of adjustment grooves are provided on the adjustment disk. An adjustment rod is slidably provided in the adjustment groove. The adjustment rod is slidably provided in the inner wall of the coating table. The adjustment rod is in sliding contact with the bottom of the wafer ring. The plurality of wafer rings are slidably provided.

[0014] As a further description of the above technical solution:

[0015] A cutting blade is slidably provided at one end of the cutting cover, a turning handle is rotatably provided through the middle of the cutting cover, an electric push rod is fixedly provided at the inner end of the turning handle, and a cutting blade is fixedly provided at the other end of the electric push rod.

[0016] As a further description of the above technical solution:

[0017] A threaded rod is provided on the inner wall of the guide seat for rotation, one end of the threaded rod is connected and fixedly provided with a motor, the motor is connected and fixedly provided with the outer wall of the guide seat, the other end of the threaded rod is connected and fixedly provided with a universal joint group, a transmission rack is connected and fixedly provided on the upper side of the guide seat, an adjustment rack is connected and fixedly provided on one end of the guide seat close to the recovery seat, and a guide groove is provided on the inner wall of the guide seat.

[0018] As a further description of the above technical solution:

[0019] One end of the moving block is threadedly connected to the threaded rod, the inner wall of the moving block is slidably equipped with a guide frame, one end of the guide frame is connected and fixedly equipped with a guide column, and the guide column is slidably equipped with the inner wall of the guide groove.

[0020] As a further description of the above technical solution:

[0021] The waste film processing mechanism includes a universal joint A, which is rotatably connected to the guide frame. A transmission wheel is fixedly connected to one end of the universal joint A, and the transmission wheel is meshingly transmitted with a transmission rack. A worm B is fixedly connected to the other end of the universal joint A, and a worm wheel B is meshingly transmitted with one side of the worm B. The worm wheel B is rotatably connected to the guide frame through a pin shaft, and a rotating seat is fixedly connected to one end of the pin shaft.

[0022] As a further description of the above technical solution:

[0023] A film roll frame is rotatably connected to one end of the rotating seat, a pusher block is slidably arranged on the film roll frame, a tension spring is fixedly arranged at one end of the pusher block, and the other end of the tension spring is fixedly arranged with the film roll frame.

[0024] As a further description of the above technical solution:

[0025] A worm gear C is fixedly connected to one end of the film winding frame, a worm C is meshingly arranged on one side of the worm gear C, the worm C is rotatably connected to a rotating seat, an adjusting wheel is fixedly connected to one end of the worm C, and the adjusting wheel is meshingly arranged with an adjusting rack.

[0026] As a further description of the above technical solution:

[0027] An inclined rod is fixedly connected inside the recovery seat, and the inclined rod is in sliding contact with the pushing block. A spiral pushing rack is rotatably connected inside the recovery seat, and a blocking cover is threadedly connected at the opening of the bottom end of the recovery seat. One end of the spiral pushing rack is rotatably connected to the universal joint group.

[0028] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0029] 1. In the present invention, after the wafer is coated and cut, the film roll rack in the waste film processing mechanism can be rotated during the movement of the film roll rack to roll up the coated scraps, thereby realizing timely cleaning from the coating table, avoiding interference of the scraps on the production line, and improving the operation efficiency of the production line. The coated scraps are pushed into the recovery seat for extrusion recovery to reduce their volume and facilitate subsequent transportation and storage. At the same time, the useful components in the scraps can be recovered and reused through extrusion recovery, thereby realizing the recycling of resources.

[0030] 2. In the present invention, by setting up multiple wafer rings and adjustment mechanisms, it is possible to achieve limited coating of wafers of different sizes such as 6 inches, 8 inches, 12 inches, etc., to meet diverse production needs. At the same time, the wafer after coating can be lifted up by the lifting rod, which is convenient for quick removal, thereby improving production efficiency and operational convenience.

[0031] 3. In the present invention, by providing an adjustable cutting blade, it is convenient to cut the coating on wafers of different sizes. At the same time, by providing a placement groove, it is convenient to place the coating roll, thereby significantly improving the flexibility and ease of use of the wafer manufacturing coating device, meeting different production needs and improving production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram of the overall structure of the film coating device for wafer manufacturing proposed by the present invention;

[0033] Figure 2 It is a partial cross-sectional schematic diagram of the overall structure of the film coating device for wafer manufacturing proposed by the present invention;

[0034] Figure 3 A schematic cross-sectional view of the structure of a coating platform of a coating device for wafer manufacturing proposed by the present invention;

[0035] Figure 4 It is a schematic diagram of the structure of the adjustment mechanism and the like of the coating device for wafer manufacturing proposed by the present invention;

[0036] Figure 5 A schematic cross-sectional view of a cutting cover structure of a film coating device for wafer manufacturing proposed by the present invention;

[0037] Figure 6 A schematic cross-sectional view of the guide seat structure of the film coating device for wafer manufacturing proposed by the present invention;

[0038] Figure 7 It is a schematic diagram of the expansion of the moving block structure of the film coating device for wafer manufacturing proposed by the present invention;

[0039] Figure 8 This is a schematic diagram of the structure of the waste film processing mechanism of the film coating device for wafer manufacturing proposed by the present invention;

[0040] Fig. 9 The present invention is a schematic cross-sectional view of the recovery seat structure of the coating device for wafer manufacturing proposed by the present invention.

[0041] Legend:

[0042] 1. Laminating table; 2. Cutting cover; 3. Laminating roll; 4. Wafer ring; 5. Adjustment mechanism; 6. Guide seat; 7. Moving block; 8. Waste film processing mechanism; 9. Recovery seat; 101. Placement slot; 102. Ejector rod; 103. Pedal; 501. Worm A; 502. Worm wheel A; 503. Adjustment disk; 504. Adjustment slot; 505. Adjustment rod; 201. Cutting blade; 202. Turning handle; 203. Electric push rod; 204. Cutting blade; 601. Threaded rod; 602. Motor; 603, universal joint assembly; 604, transmission rack; 605, adjustment rack; 606, guide groove; 701, guide frame; 702, guide column; 801, universal joint A; 802, transmission wheel; 803, worm B; 804, worm wheel B; 805, rotating seat; 806, film roll frame; 807, push block; 808, tension spring; 809, worm wheel C; 810, worm C; 811, adjustment wheel; 901, inclined rod; 902, spiral push frame; 903, blocking cover. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] Please see attached Figure 1 -Attached Fig. 9 The present invention provides a technical solution: a coating device for wafer manufacturing, comprising a coating table 1, a cutting cover 2 is rotatably connected on the coating table 1, a coating roll 3 is placed on the inner wall of one end of the coating table 1, a plurality of wafer rings 4 are placed in the coating table 1, an adjustment mechanism 5 is rotatably connected in the coating table 1, a guide seat 6 is fixedly connected to one side of the coating table 1, a moving block 7 is slidably matched in the guide seat 6, a waste film processing mechanism 8 is arranged on the upper side of the moving block 7, and a recovery seat 9 is fixedly connected to one side of the coating table 1. The plurality of wafer rings 4 can respectively place 6-inch, 8-inch, and 12-inch wafers.

[0045] Specifically, Figure 3 As shown, the inner walls of the coating platform 1 at both sides of the coating roll 3 are provided with placement grooves 101, and a lifting rod 102 is provided in the coating platform 1 for sliding cooperation. A pedal 103 is provided at the bottom of the coating platform 1 for rotational connection, and the pedal 103 is provided for sliding contact with the bottom end of the lifting rod 102. When the pedal 103 is stepped on, the pedal 103 will lift the lifting rod 102, so that the lifting rod 102 drives the coated wafer to lift up, which is convenient for removal.

[0046] Specifically, Figure 4 As shown, the adjustment mechanism 5 includes a worm A501, which is rotatably connected to the inner wall of the coating table 1 through the worm A501, and a worm wheel A502 is provided at the inner end of the worm A501 for meshing transmission. An adjustment disk 503 is fixedly connected to the worm wheel A502, and the adjustment disk 503 is rotatably connected to the inner wall of the coating table 1. A plurality of adjustment grooves 504 are provided on the adjustment disk 503, and an adjustment rod 505 is slidably provided in the adjustment groove 504. The adjustment rod 505 is slidably provided in the inner wall of the coating table 1, and the adjustment rod 505 is slidably contacted with the bottom of the wafer ring 4, and a plurality of wafer rings 4 are slidably provided between each other. Rotate the worm A501 so that the worm A501 drives the adjustment disk 503 connected to the worm wheel A502 to rotate. At this time, the adjustment groove 504 on the adjustment disk 503 will drive the adjustment rod 505 to move, so that the adjustment rod 505 moves away from the bottom of the inner wafer ring 4. At this time, the innermost wafer ring 4 will fall, forming a groove between it and the outer wafer ring 4.

[0047] Specifically, Figure 5As shown, a cutting blade 201 is provided at one end of the cutting cover 2 in a sliding manner, a turning handle 202 is provided in a rotationally connected manner through the middle of the cutting cover 2, an electric push rod 203 is fixedly provided at the inner end of the turning handle 202, and a cutting blade 204 is fixedly provided at the other end of the electric push rod 203. The electric push rod 203 is used to drive the cutting blade 204 to adjust to a position suitable for cutting the film on a 6-inch wafer, and then the cutting cover 2 is rotated to make it flat, and then the turning handle 202 is held to drive the cutting blade 204 connected to the electric push rod 203 to rotate around the outer side of the wafer, thereby cutting the film on the wafer ring 4, and then the cutting blade 201 is pushed to cut the film.

[0048] Specifically, Figure 6 As shown, a threaded rod 601 is provided through the inner wall of the guide seat 6 for rotation connection, a motor 602 is connected and fixedly provided at one end of the threaded rod 601, the motor 602 is connected and fixedly provided with the outer wall of the guide seat 6, a universal joint assembly 603 is connected and fixedly provided at the other end of the threaded rod 601, a transmission rack 604 is connected and fixedly provided at the upper side of the guide seat 6, an adjustment rack 605 is connected and fixedly provided at one end of the guide seat 6 close to the recovery seat 9, and a guide groove 606 is provided on the inner wall of the guide seat 6. The motor 602 drives the threaded rod 601 to rotate, and at this time, the threaded rod 601 will drive the moving block 7 to move, and at this time, under the action of the guide groove 606, the guide frame 701 connected to the guide column 702 will be driven to move upward when moving horizontally.

[0049] Specifically, Figure 7 As shown, one end of the moving block 7 is threadedly connected to the threaded rod 601, and a guide frame 701 is slidably provided on the inner wall of the moving block 7. One end of the guide frame 701 is fixedly connected to a guide column 702, and the guide column 702 is slidably provided on the inner wall of the guide groove 606.

[0050] Specifically, Figure 8 As shown, the waste film processing mechanism 8 includes a universal joint A801, which is rotatably connected to the guide frame 701, a transmission wheel 802 is fixedly connected to one end of the universal joint A801, and the transmission wheel 802 is meshed with the transmission rack 604 for transmission, and a worm B803 is fixedly connected to the other end of the universal joint A801, and a worm wheel B804 is meshed with one side of the worm B803 for transmission, and the worm wheel B804 is rotatably connected to the guide frame 701 through a pin shaft, and a rotating seat 805 is fixedly connected to one end of the pin shaft. Under the action of the transmission rack 604, the universal joint A801 ​​connected to the transmission wheel 802 will rotate, so that the universal joint A801 ​​drives the worm B803 to rotate, so that the worm B803 drives the rotating seat 805 connected to the worm wheel B804 to rotate, so that the film roll frame 806 on the rotating seat 805 rotates, and the film scraps are rolled up and cleaned.

[0051] One end of the rotating seat 805 is rotatably connected with a film roll frame 806, and a pusher block 807 is slidably provided on the film roll frame 806. One end of the pusher block 807 is fixedly connected with a tension spring 808, and the other end of the tension spring 808 is fixedly connected to the film roll frame 806. Under the action of the inclined rod 901, the pusher block 807 slides on the film roll frame 806, thereby pushing the rolled film scraps into the recovery seat 9.

[0052] A worm gear C809 is fixedly connected to one end of the film roll frame 806, a worm gear C810 is meshed and driven on one side of the worm gear C809, the worm gear C810 is rotatably connected to the rotating seat 805, an adjusting wheel 811 is fixedly connected to one end of the worm gear C810, and the adjusting wheel 811 is meshed and driven on the adjusting rack 605. Under the action of the adjusting rack 605, the worm gear C810 connected to the adjusting wheel 811 is driven to rotate, so that the worm gear C810 drives the film roll frame 806 connected to the worm gear C809 to rotate into the recovery seat 9.

[0053] Specifically, Fig. 9 As shown, an inclined rod 901 is fixedly connected in the recovery seat 9, and the inclined rod 901 is arranged in sliding contact with the pusher block 807. A spiral pusher frame 902 is rotatably connected in the recovery seat 9. A blocking cover 903 is threadedly connected at the bottom opening of the recovery seat 9, and one end of the spiral pusher frame 902 is rotatably connected to the universal joint assembly 603. When the threaded rod 601 rotates, the connected spiral pusher frame 902 is driven to rotate through the universal joint assembly 603, so that the coated scraps are pushed to one side of the recovery seat 9 for extrusion and recovery.

[0054] Working principle, when in use: first adjust the wafer ring 4 according to the size of the wafer to be coated. For example, when coating a 6-inch wafer, rotate the worm A501 so that the worm A501 drives the adjustment disk 503 connected to the worm wheel A502 to rotate. At this time, the adjustment groove 504 on the adjustment disk 503 drives the adjustment rod 505 to move, so that the adjustment rod 505 moves away from the bottom of the inner wafer ring 4. At this time, the innermost wafer ring 4 will fall, forming a groove between it and the outer wafer ring 4, and then place the 6-inch wafer on the innermost wafer ring 4;

[0055] Then pull the film roll 3 and cover it on the wafer ring 4 for film coating, and at the same time insert one end of the film roll 3 into the slot in the middle of the film roll frame 806, and then use the electric push rod 203 to drive the cutting blade 204 to adjust to a position suitable for cutting the film on the 6-inch wafer, and then turn the cutting cover 2 to make it flat, and then hold the turning handle 202 to drive the cutting blade 204 connected to the electric push rod 203 to rotate around the outside of the wafer, so as to cut the film on the wafer ring 4, and then push the cutting blade 201 to cut the film, and then step on the pedal 103, so that the pedal 103 will lift the ejector rod 102, so that the ejector rod 102 drives the film-coated wafer to be lifted up, which is convenient for removal;

[0056] Then, the motor 602 is used to drive the threaded rod 601 to rotate, and the threaded rod 601 will drive the moving block 7 to move. At this time, under the action of the guide groove 606, the guide frame 701 connected to the guide column 702 will be driven to move upward during the lateral movement. Then, under the action of the transmission rack 604, the universal joint A801 ​​connected to the transmission wheel 802 will rotate, so that the universal joint A801 ​​drives the worm B803 to rotate, so that the worm B803 drives the rotating seat 805 connected to the worm wheel B804 to rotate, so that the film roll frame 806 on the rotating seat 805 rotates, and the film scraps are rolled up and cleaned;

[0057] When the film roll frame 806 moves to the top of the recovery seat 9, the adjusting rack 605 drives the worm C810 connected to the adjusting wheel 811 to rotate, so that the worm C810 drives the film roll frame 806 connected to the worm wheel C809 to rotate into the recovery seat 9. At this time, under the action of the inclined rod 901, the pushing block 807 slides on the film roll frame 806, thereby pushing the rolled film scraps into the recovery seat 9;

[0058] Then, when the threaded rod 601 rotates, the connected spiral pusher frame 902 will be driven to rotate through the universal joint assembly 603, so that the coated scraps are pushed to the inside of one side of the recovery seat 9 for extrusion recovery.

[0059] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A coating device for wafer manufacturing, comprising a coating table (1), characterized in that: A cutting cover (2) is rotatably connected to the coating platform (1), a coating roll (3) is placed on the inner wall of one end of the coating platform (1), a plurality of wafer rings (4) are placed in the coating platform (1), an adjustment mechanism (5) is rotatably connected to the coating platform (1), a guide seat (6) is fixedly connected to one side of the coating platform (1), a moving block (7) is slidably provided in the guide seat (6), a waste film processing mechanism (8) is provided on the upper side of the moving block (7), and a recovery seat (9) is fixedly connected to one side of the coating platform (1).

2. The coating device for wafer manufacturing according to claim 1, characterized in that: The inner walls of both sides of the coating platform (1) at the coating roll (3) are provided with placement grooves (101), a lifting rod (102) is slidably arranged inside the coating platform (1), a pedal (103) is rotatably connected to the bottom of the coating platform (1), and the pedal (103) is arranged in sliding contact with the bottom end of the lifting rod (102).

3. The coating device for wafer manufacturing according to claim 1, characterized in that: The adjustment mechanism (5) comprises a worm A (501), the worm A (501) is rotatably connected to the inner wall of the coating platform (1), the inner end of the worm A (501) is meshingly provided with a worm wheel A (502), an adjustment disk (503) is fixedly connected to the worm wheel A (502), the adjustment disk (503) is rotatably connected to the inner wall of the coating platform (1), a plurality of adjustment grooves (504) are provided on the adjustment disk (503), an adjustment rod (505) is slidably provided in the adjustment grooves (504), the adjustment rod (505) is slidably provided with the inner wall of the coating platform (1), the adjustment rod (505) is slidably contacted with the bottom of the wafer ring (4), and a plurality of wafer rings (4) are slidably provided with each other.

4. The coating device for wafer manufacturing according to claim 1, characterized in that: A cutting blade (201) is slidably provided at one end of the cutting cover (2), a turning handle (202) is rotatably provided through the middle of the cutting cover (2), an electric push rod (203) is fixedly provided at the inner end of the turning handle (202), and a cutting blade (204) is fixedly provided at the other end of the electric push rod (203).

5. The coating device for wafer manufacturing according to claim 1, characterized in that: A threaded rod (601) is rotatably connected to the inner wall of the guide seat (6), one end of the threaded rod (601) is connected and fixedly provided with a motor (602), the motor (602) is connected and fixedly provided with the outer wall of the guide seat (6), the other end of the threaded rod (601) is connected and fixedly provided with a universal joint assembly (603), a transmission rack (604) is connected and fixedly provided on the upper side of the guide seat (6), an adjustment rack (605) is connected and fixedly provided on one end of the guide seat (6) close to the recovery seat (9), and a guide groove (606) is provided on the inner wall of the guide seat (6).

6. The coating device for wafer manufacturing according to claim 5, characterized in that: One end of the moving block (7) is threadedly connected to the threaded rod (601), and a guide frame (701) is slidably provided on the inner wall of the moving block (7), and one end of the guide frame (701) is connected and fixedly provided with a guide column (702), and the guide column (702) is slidably provided on the inner wall of the guide groove (606).

7. The coating device for wafer manufacturing according to claim 6, characterized in that: The waste film processing mechanism (8) includes a universal joint A (801), and the universal joint A (801) is rotatably connected to the guide frame (701). One end of the universal joint A (801) is connected and fixedly provided with a transmission wheel (802), and the transmission wheel (802) is meshingly transmitted with a transmission rack (604). The other end of the universal joint A (801) is connected and fixedly provided with a worm B (803), and one side of the worm B (803) is meshingly transmitted with a worm wheel B (804), and the worm wheel B (804) is rotatably connected to the guide frame (701) through a pin shaft, and one end of the pin shaft is connected and fixedly provided with a rotating seat (805).

8. The coating device for wafer manufacturing according to claim 7, characterized in that: A film roll frame (806) is rotatably connected to one end of the rotating seat (805), a pusher block (807) is slidably provided on the film roll frame (806), a tension spring (808) is fixedly provided at one end of the pusher block (807), and the other end of the tension spring (808) is fixedly provided and connected to the film roll frame (806).

9. The film coating device for wafer manufacturing according to claim 8, characterized in that: A worm gear C (809) is fixedly connected to one end of the film roll frame (806), a worm gear C (809) is meshingly connected to one side of the worm gear C (809), the worm gear C (810) is rotatably connected to the rotating seat (805), an adjusting wheel (811) is fixedly connected to one end of the worm gear C (810), and the adjusting wheel (811) is meshingly connected to the adjusting rack (605).

10. The film coating device for wafer manufacturing according to claim 9, characterized in that: The recovery seat (9) is internally connected and fixedly provided with an inclined rod (901), the inclined rod (901) being arranged in sliding contact with a pushing block (807), the recovery seat (9) is internally rotatably provided with a spiral pushing frame (902), the bottom opening of the recovery seat (9) is threadedly provided with a blocking cover (903), and one end of the spiral pushing frame (902) is rotatably connected with a universal joint assembly (603).

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