Over-temperature protection method and device, equipment and storage medium

Abstract

The invention discloses an over-temperature protection method, device and equipment and a storage medium, and relates to the field of circuit protection, working temperatures of a target module and other circuit modules in target equipment are determined respectively, and when the target module is over-temperature, it is indicated that the whole target equipment cannot work normally. At the moment, the whole target equipment can be directly turned off to ensure the safety and reliability of the equipment; when only one or more circuit modules in the other circuit modules are over-temperature, only the over-temperature circuit module can be turned off independently, and the target module can still work continuously and control the circuit modules which are not over-temperature in the other circuit modules to work continuously. According to the technical scheme, different coping modes are adopted according to different over-temperature conditions of the target equipment, a more reasonable over-temperature protection mechanism is provided, the target equipment can meet the function safety requirement, and normal work of the target equipment can be guaranteed as much as possible on the basis that the safety and reliability of the equipment are guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of circuit protection, and in particular to an over-temperature protection method, device, equipment and storage medium. Background Art

[0002] At present, users have higher and higher requirements for automobile safety. However, with the continuous development of intelligent driving, the signals that need to be processed by modules such as domain controllers and front-view integrated devices used to realize intelligent driving in automobiles are also increasing. In the process of the domain controller and the front-view integrated device running to realize intelligent driving, the heat power consumption generated by the SOC (system on chip) is very large, and the temperature rise of the SOC causes it to fail to work normally. In this case, the thermal design of the domain controller and the front-view integrated device will face great challenges, especially the installation position of the front-view integrated device is usually near the rearview mirror of the cockpit, built in a plastic cover, and the heat is not easy to dissipate. In the environment of strong direct sunlight in summer, the temperature is very high, and overheating is very easy to occur. Therefore, how to realize over-temperature protection in the domain controller and the front-view integrated device has become a technical problem that needs to be solved urgently. Summary of the invention

[0003] The purpose of the present invention is to provide an over-temperature protection method, device, equipment and storage medium, which adopt different response methods for different over-temperature conditions occurring in the target device, provide a more reasonable over-temperature protection mechanism, enable the target device to meet the functional safety requirements, and can ensure the normal operation of the target device as much as possible on the basis of ensuring the safety and reliability of the device.

[0004] In order to solve the above technical problems, the present invention provides an over-temperature protection method, comprising:

[0005] Determining a first operating temperature of a target module in a target device and a second operating temperature of other circuit modules in the target device; wherein the other circuit modules are at least one circuit module in the target device other than the target module;

[0006] Determining whether the target module is over-temperature based on the first operating temperature;

[0007] If the target module is over-temperature, the target device is controlled to shut down;

[0008] If the target module is not over-temperatured, determining whether a circuit module in other circuit modules is over-temperatured based on the second operating temperature;

[0009] If a circuit module among other circuit modules has an over-temperature, the over-temperature circuit module is controlled to be shut down.

[0010] Optionally, judging whether the target module is over-temperature based on the first operating temperature includes:

[0011] Determining whether the first operating temperature is greater than a first temperature threshold;

[0012] If the first operating temperature is greater than the first temperature threshold, it is determined that the target module is over-temperature;

[0013] If the first operating temperature is not greater than the first temperature threshold, determining whether the first operating temperature is greater than a second temperature threshold;

[0014] If the first operating temperature is greater than the second temperature threshold, jump back to the step of determining whether the first operating temperature is greater than the first temperature threshold;

[0015] If the first operating temperature is not greater than the second temperature threshold, it is determined that the target module is not over-heated.

[0016] Optionally, also include:

[0017] For any circuit module among other circuit modules, when the circuit module is overheated, the overtemperature count value corresponding to the circuit module is increased by 1; wherein the overtemperature count value is set to an initial value when the target device is powered on;

[0018] If there is a circuit module whose over-temperature count value is greater than the count threshold, the circuit module is controlled to remain turned off before the target device is powered off.

[0019] Optionally, before the over-temperature control circuit module is shut down, the method further includes:

[0020] re-enabling the over-temperature circuit module after a preset time period, and determining whether the re-enabled circuit module is still over-temperature based on the second operating temperature;

[0021] If so, jump to the step of shutting down the circuit module for controlling overtemperature.

[0022] Optionally, the other circuit modules are each equipped with a built-in temperature sensor, the target module and the other circuit modules are integrated on a circuit board, and a thermistor is provided on the circuit board;

[0023] Determining a first operating temperature of a target module in a target device and a second operating temperature of other circuit modules in the target device includes:

[0024] Obtaining a resistance value of the thermistor, and determining a temperature corresponding to the resistance value of the thermistor as a first operating temperature of a target module in a target device;

[0025] The detection results of each temperature sensor are acquired, and the detection results of the temperature sensors are determined as the second operating temperatures of the corresponding other circuit modules.

[0026] Optionally, a watchdog program is set in the power management circuit of the target device; controlling the target device to shut down includes:

[0027] Stop feeding the watchdog program in the power management circuit so that the power management circuit controls the target module to reset.

[0028] Optional, control over-temperature circuit module shutdown, including:

[0029] The power module corresponding to the over-temperature circuit module is controlled to be powered off, so as to control the over-temperature circuit module to be shut down.

[0030] In order to solve the above technical problems, the present invention also provides an over-temperature protection device, comprising:

[0031] a temperature determination unit, configured to determine a first operating temperature of a target module in a target device and a second operating temperature of other circuit modules in the target device; wherein the other circuit modules are at least one circuit module in the target device other than the target module;

[0032] A first judging unit, configured to judge whether the target module is over-temperature based on the first operating temperature;

[0033] A first shut-down unit, configured to control the target device to shut down if the target module is over-temperature;

[0034] A second judgment unit, configured to judge whether a circuit module in other circuit modules is over-temperature based on the second operating temperature if the target module is not over-temperature;

[0035] The second shut-down unit is used for controlling the over-temperature circuit module to shut down if a circuit module among other circuit modules has an over-temperature.

[0036] In order to solve the above technical problems, the present invention further provides an electronic device, comprising:

[0037] Memory for storing computer programs;

[0038] A processor is used to implement the steps of the over-temperature protection method as described above.

[0039] In order to solve the above technical problem, the present invention also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the over-temperature protection method as described above are implemented.

[0040] The present invention provides an over-temperature protection method, which determines the operating temperature of the target module and other circuit modules in the target device respectively. When the target module is over-heated, it means that the entire target device cannot work normally. At this time, the entire target device can be directly shut down to ensure the safety and reliability of the device; when only one or more circuit modules in other circuit modules are over-heated, only the over-heated circuit module can be shut down separately, and the target module can still continue to work and control the circuit modules in other circuit modules that are not over-heated to continue to work. Different response methods are adopted for different over-temperature situations of the target device, and a more reasonable over-temperature protection mechanism is provided, so that the target device can meet the functional safety requirements, and can try to ensure the normal operation of the target device on the basis of ensuring the safety and reliability of the device.

[0041] The present invention also provides an over-temperature protection device, an electronic device and a computer-readable storage medium, which have the same beneficial effects as the above-mentioned over-temperature protection method. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the prior art and the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0043] Figure 1 A schematic flow chart of an over-temperature protection method provided by the present invention;

[0044] Figure 2 A schematic diagram of the structure of a domain controller of a car provided by the present invention;

[0045] Figure 3 A schematic flow chart of an over-temperature protection method for a domain controller provided by the present invention;

[0046] Figure 4 A schematic diagram of the structure of a front-view integrated machine for a vehicle provided by the present invention;

[0047] Figure 5 A schematic flow chart of an over-temperature protection method for a front-view integrated machine provided by the present invention;

[0048] Figure 6 A schematic structural diagram of an over-temperature protection device provided by the present invention;

[0049] Figure 7 The present invention provides a schematic structural diagram of an electronic device. DETAILED DESCRIPTION

[0050] The core of the present invention is to provide an over-temperature protection method, device, equipment and storage medium, which adopt different response methods for different over-temperature conditions occurring in the target device, and provide a more reasonable over-temperature protection mechanism, so that the target device can meet the functional safety requirements, and can ensure the normal operation of the target device as much as possible on the basis of ensuring the safety and reliability of the device.

[0051] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0052] In actual applications, the intelligent driving of automobiles will cause the SOC in the domain controller of the automobile and the SOC in the front-view integrated machine to generate high heat during operation. Especially for the SOC in the domain controller, in order to reduce costs, its PCB (Printed Circuit Board) will be set to a multi-layer structure when designing the SOC. For example, if a SOC with a computing power of 8TOPS is selected as the computing module in the domain controller, the thermal power consumption is 23W. In order to reduce costs, the PCB is set to 10 layers, and the PCB size will also be designed to be relatively small. However, in this case, the number of layers and size of the PCB and the large thermal power consumption caused by the computing power itself will increase the difficulty of thermal design of the entire domain controller. Once overheating occurs, the entire automotive chip will be degraded or even damaged. Therefore, it is very necessary to do a good job of temperature monitoring of the domain controller to ensure that the operating temperature during its operation does not exceed the temperature range allowed by the chip to meet the functional safety requirements of the vehicle. The front-view integrated machine also has similar problems. Although the SOC, DDR (Double Data Rate) storage module and other chips are equipped with thermal conductive glue for heat dissipation, this heat dissipation cannot meet the functional safety requirements of the vehicle at all.

[0053] Please refer to Figure 1 , Figure 1 A schematic flow chart of an over-temperature protection method provided by the present invention; To solve the above technical problems, the present invention provides an over-temperature protection method, comprising:

[0054] S11: determining a first operating temperature of a target module in a target device and a second operating temperature of other circuit modules in the target device; wherein the other circuit modules are at least one circuit module in the target device other than the target module;

[0055] It is not difficult to understand that in order to achieve over-temperature protection for the target device, it is first necessary to determine the real-time operating temperature of each circuit module in the target device, so that protective measures can be timely intervened when the target device is overheated. In the process of over-temperature protection, the circuit modules in the target device are divided into two types in the present application, one is the target module, and the other is other circuit modules. Different over-temperature protection methods are set for the two different situations of over-temperature of the target module or other circuit modules. The target module refers to the circuit module that serves as the processing core or control core in the target device. Once the target module is abnormal, the entire target device will not be able to work normally; for example, when the target device is a domain controller, the target module can be the SOC of the domain controller, and when the target device is a front-view all-in-one machine, the target module can be the processor of the front-view all-in-one machine. Other circuit modules are other circuit modules in the target device except the target module after the target module is determined.

[0056] It should be noted that the target module and other circuit modules do not only refer to one circuit module in the target device, but may also be multiple circuit modules in the target device. For example, when the target device is a domain controller and the target module is the SOC of the domain controller, the other circuit modules may be one or more of the CAN (Control Area Network) transceiver, DSI3 (Display Serial Interface Specification 3) main transceiver, Ethernet PHY (Physical Layer), deserializer and serializer in the domain controller. Correspondingly, the first operating temperature and the second operating temperature must also be only one temperature. When the other circuit modules include N other circuit modules, the second operating temperature of the other circuit modules in the target device includes N second operating temperatures corresponding to the N other circuit modules, and the first operating temperature is similar. The specific number of the target module and its first operating temperature, the specific number of other circuit modules and their second operating temperatures, and the specific method of determining the operating temperature are not particularly limited in this application, and can be selected and set according to the specific internal structure of the target device and the actual application.

[0057] S12: determining whether the target module is over-temperature based on the first operating temperature;

[0058] It is understandable that after determining the first operating temperature of the target module, it is possible to determine whether the target module is overheated based on the monitored first operating temperature. The overtemperature threshold of the target module can be set in advance according to the normal working process of the target module. When the first operating temperature is greater than the overtemperature threshold, it is determined that the target module is overheated. A variety of criteria can also be set to determine whether the target module is overheated. This application does not make any special restrictions here. In the process of determining the first operating temperature, it can be to detect the first operating temperature of the target module in real time and then make a real-time judgment on the first operating temperature; it can also be to set a fixed detection cycle, and periodically perform the determination and judgment process of the first operating temperature according to the detection cycle. This application does not make any special restrictions on the specific method and frequency of determining whether the target module is overheated, and it can be set and adjusted according to actual application requirements.

[0059] S13: If the target module is over-temperature, the target device is controlled to shut down;

[0060] It is not difficult to understand that the target module is the processing core and control core of the entire target device. Therefore, once the target module is overheated, it means that the work of the target module may be abnormal. If the target module continues to work, it may cause safety hazards. Therefore, the target module cannot continue to work at this time, and it cannot normally process and control the various working processes of the target device, which leads to the inability of the entire target device to work normally. At this time, for the safety and reliability of the entire target device, the entire target device can be directly turned off, and the entire target device can be controlled to stop working until the fault is eliminated. At the same time, for the target device, the core of the execution of the entire over-temperature protection method is also the target module, or a module in the target module. Therefore, once the target module is overheated, the entire over-temperature protection method is difficult to continue to execute. Therefore, it is necessary to shut down the entire target device at this time to ensure that the target device can be protected from over-temperature during the entire normal working process. There are many options for shutting down the entire target device. Starting from the power supply architecture, the power supply to the entire target device can be directly stopped, and the entire target device can be controlled to stop working from the software program. This application does not make any special restrictions here.

[0061] S14: If the target module is not over-temperatured, determining whether a circuit module in other circuit modules is over-temperatured based on the second operating temperature;

[0062] It is understandable that after determining the second operating temperature of other circuit modules, it is possible to determine whether other circuit modules are overheated based on the monitored second operating temperature. The overtemperature threshold of other circuit modules can be set in advance according to the normal working process of other circuit modules. When the second operating temperature is greater than the corresponding overtemperature threshold, it is determined that other circuit modules are overheated. Multiple criteria can also be set to determine whether other circuit modules are overheated. This application does not make any special restrictions here. In general, other circuit modules include multiple circuit modules. For each circuit module, step S11 determines its corresponding second operating temperature. At this time, it is possible to determine whether each circuit module in other circuit modules is overheated based on the second operating temperature corresponding to each circuit module. In the process of determining the second operating temperature, the second operating temperature of other circuit modules can be detected in real time, and then the second operating temperature can be judged in real time; or a fixed detection cycle can be set, and the second operating temperature can be determined and judged periodically according to the detection cycle. The specific method and frequency of judging whether other circuit modules are overheated are not particularly limited in this application, and can be set and adjusted according to actual application requirements.

[0063] S15: If a circuit module among other circuit modules has an over-temperature, the over-temperature circuit module is controlled to be turned off.

[0064] It is not difficult to understand that the circuit modules in other circuit modules are set up by the target device to realize specific functions. These other circuit modules will complete the corresponding specific functions under the control of the target module, or realize the corresponding specific functions by exchanging data with the target module. Therefore, if there is a circuit module overheating in other circuit modules, and the target module is not overheating, it means that the target device can still complete some functions under the action of the target module, but the overheated circuit module cannot continue to cooperate with the target module to realize its corresponding specific function. If the overheated circuit module continues to work, there may be safety hazards. Therefore, at this time, it is only necessary to control the overheated circuit module to shut down, and the circuit modules in the target module and other circuit modules that have not overheated can still work normally to complete other functions. It should be noted that the existence of circuit module overheating in other circuit modules means that as long as any circuit module in other circuit modules is overheated, the overheated circuit module needs to be controlled to shut down.

[0065] It should be noted that this application does not make any special limitations on the specific type and implementation method of the target device. Taking into account the differences in computing power requirements and heat levels of various circuit modules in the target device in actual applications, the entire over-temperature protection method can perform temperature monitoring on all circuit modules in the target device, or it can only set temperature monitoring for some circuit modules that generate more serious heat during operation, balancing costs and safety requirements.

[0066] As a specific embodiment, please refer to Figure 2 , Figure 2 This is a structural diagram of a domain controller of a car provided by the present invention; please refer to Figure 3 , Figure 3 The present invention provides a flow chart of an over-temperature protection method for a domain controller; the target device may be a domain controller of a car, the core processing unit of the domain controller is a SOC, and therefore the target module is the SOC of the domain controller. The domain controller includes a SOC, a PMIC (Power Management IC), a CAN transceiver, a DDR, a DSI3 master transceiver, an Ethernet PHY, a deserializer, and a serializer. As the core processing unit, SOC can control the power supply to other modules through PMIC; the CAN transceiver is connected to the body CAN through the main connector, and the vehicle's driving data can be determined through the body CAN and transmitted to the SOC so that the SOC can control the vehicle. DDR is used as a storage module to store data; the DSI3 main transceiver is connected to the ultrasonic radar sensor through the main connector, and the detection data of the ultrasonic radar sensor can be transmitted to the SOC so that the SOC can perform functions such as reversing parking distance judgment and forward collision warning. The Ethernet PHY is connected to the gateway through the main connector to facilitate communication between the SOC and other networks; the deserializer is connected to the camera module through the four-in-one FAKRA connector, which can help the SOC determine the obstacles around the car; the serializer is connected to the car computer through the FAKRA connector so that the SOC can achieve information exchange.

[0067] In order to achieve over-temperature protection, the domain controller is also equipped with a first temperature sensor (Temp sensor 1) and a second temperature sensor (Temp sensor 2). The first temperature sensor can detect the temperature of the entire domain controller's PCB board. The second temperature sensor is set near the SOC and can detect the temperature around the SOC. Therefore, the first temperature sensor and the second temperature sensor can be used to achieve over-temperature protection of the SOC of the domain controller. At the same time, the first temperature sensor and the second temperature sensor also become other circuit modules in the domain controller. Their temperature detection results can not only reflect the temperature of the SOC, but also serve as temperature data for their own over-temperature protection. At the same time, each module except the SOC has a built-in temperature sensor (Temp sensor) or temperature monitor (temp monitor) to achieve over-temperature protection for other circuit modules. SOC is divided into MCU domain and MAIN domain. Temperature sensors can also be built into MCU domain and MAIN domain to detect the working temperature of SOC. On the one hand, SOC monitors its own temperature by reading the data of the temperature sensor built into MCU domain and the temperature sensor built into MAIN domain. On the other hand, SOC interacts with the temperature sensor or temperature monitor of each module through the corresponding bus to monitor the temperature information of each module and make corresponding over-temperature performance according to the over-temperature of different modules. For example, the normal judgment criteria of Temp1 can include that the detection result of the temperature sensor built into SOC is not greater than 125℃, the detection result of the first temperature sensor is not greater than 105℃, the detection result of the second temperature sensor is not greater than 120℃, MR4=110b, and the detection result of the temperature sensor built into PMIC is not greater than 140℃. The judgment of whether SOC is over-temperature is realized through multiple judgment criteria. Temp2 normal criteria may include the detection result of the serializer built-in temperature sensor is not greater than 120°C, the detection result of the deserializer built-in temperature sensor is not greater than 120°C, the detection result of the Ethernet PHY built-in temperature sensor is not greater than 130°C, the detection result of the CAN transceiver built-in temperature sensor is not greater than 140°C, and the detection result of the DSI3 main transceiver built-in temperature sensor is not greater than 150°C. Table 1 is a summary table of the over-temperature protection mode and other working information of each module in the domain controller.

[0068] Table 1 Working information of each module in the domain controller

[0069]

[0070] In order to ensure the normal operation and safety of the chips in each module of the domain controller, the over-temperature threshold corresponding to each module is set with reference to the different Tj values ​​(maximum junction temperature) of each chip, so as to provide over-temperature protection for each circuit module in the domain controller. The over-temperature threshold of some chips is set at the factory, such as SOC, CAN transceiver, DSI3 master transceiver and Ethernet PHY. Once the junction temperature of these chips exceeds the over-temperature threshold, the chip will shut down its own function; the over-temperature threshold of some chips is set by SOC to the corresponding register through the communication bus, and the over-temperature threshold can be set to be slightly lower than the Tj value, such as PMIC, first temperature sensor, second temperature sensor, deserializer and serializer; and the temperature of the DDR temperature sensor corresponds to the value of register MR4[2:0]. When MR4=110b, it indicates that the junction temperature of DDR is too high and SOC performs shutdown protection.

[0071] It is understandable that the core of the temperature monitoring system and over-temperature protection of the domain controller is SOC, which monitors the temperature of itself and each module in the domain controller in real time. If over-temperature occurs, SOC will shut down each module and the peripherals connected to the module or shut down itself, and can further transmit the corresponding over-temperature information to the vehicle body through the CAN bus, and display it in the vehicle's vehicle computer module to play a warning role. Considering the corresponding functions of each module in the domain controller, the SOC, the first temperature sensor, the second temperature sensor, the DDR and the PMIC that will affect the normal operation of the SOC if over-temperature occurs are classified as target modules, and their corresponding temperature detection results are classified as the first operating temperature Temp1; other CAN transceivers, DSI3 master transceivers, Ethernet PHY, deserializers and serializers involving peripherals are classified as other circuit modules, and their corresponding temperature detection results are classified as the second operating temperature Temp2.

[0072] For the domain controller, the specific over-temperature protection method is as follows: Figure 3 As shown, after the domain controller is powered on, the chips related to Temp1 are powered on first. After the SOC works normally, it first determines whether Temp1 is normal. If Temp1 is over-temperature, it enters shutdown mode. In shutdown mode, the SOC directly controls itself to shut down, thereby shutting down the entire domain controller. If Temp1 is normal, it continues to determine whether Temp2 is normal. If Temp2 is also normal, the domain controller works normally. If Temp2 is over-temperature, the over-temperature module and the corresponding peripherals of the module are turned off.

[0073] As a specific embodiment, please refer to Figure 4 , Figure 4 This is a structural diagram of a front-view integrated machine for a car provided by the present invention; please refer to Figure 5 , Figure 5A flow chart of an over-temperature protection method for a front-view integrated machine provided by the present invention; the target device can be a front-view integrated machine of a car, and the core processing unit of the front-view integrated machine is an MCU, so the target module is the MCU of the front-view integrated machine. The front-view integrated machine includes a connector, a power module, a control module (MCU), a computing module (SOC), a storage module (DDR), an image acquisition module (Camera cmos), a communication module (CAN transceiver), etc. The power module includes a PMIC, a Camera power module for powering the image acquisition module, and a SOC power module for powering the computing module. KL30 is a battery power supply, which keeps the power supply constant, and KL15 is an ignition signal. After the front-view integrated machine receives the KL15 ignition signal, the PMIC is enabled, and the PMIC outputs power to the CAN transceiver and the MCU. After the MCU is started, the SOC power module and the Camera power module are enabled, thereby controlling the SOC, DDR and Camera cmos to power on, and the SOC starts and executes the corresponding commands issued by the MCU to realize data transmission and communication of each module. At the same time, the PMIC has a built-in watchdog to monitor the working status of the MCU. According to the Tj value of each chip, a reasonable temperature protection threshold can be set so that the front-view integrated machine can work at a higher temperature without overheating and damaging the chip. If the threshold is exceeded, take corresponding measures. Table 2 is a summary of the over-temperature protection mode and other working information of each module in the front-view integrated machine. Considering the corresponding functions of each module in the front-view integrated machine, and calculating the power consumption of the load, the devices with the largest heat generation are SOC, DDR and image acquisition module. SOC and DDR have thermal conductive glue for heat dissipation. Camera cmos cannot set thermal conductive glue due to the special chip, so these three devices are used as temperature monitoring objects. Therefore, during over-temperature protection, the MCU is used as the target module, and its corresponding temperature detection result is classified as the first working temperature; other SOC, DDR and image acquisition modules are classified as other circuit modules, and their corresponding temperature detection results are classified as the second working temperature. The SOC, DDR and image acquisition module all have built-in temperature sensors. However, the built-in temperature sensor in the DDR can only provide temperature compensation self-refresh and cannot monitor its temperature in real time. Therefore, a thermistor NTC is placed near the DDR to indirectly monitor the DDR temperature. At the same time, the NTC is integrated on the circuit board of the front-view all-in-one machine to reflect the operating temperature of the MCU.

[0074] Table 2 Working information of each module in the front-view integrated machine

[0075]

[0076] For the front-view integrated machine, the specific over-temperature protection method is as follows: Figure 5As shown in the figure, the core of temperature monitoring in the front-view integrated machine is MCU. After the front-view integrated machine is powered on, the MCU is powered on and starts, and immediately monitors the temperature NTCTemp corresponding to the thermistor NTC. If NTC Temp>122℃, it enters the shutdown mode; if 105℃<NTC Temp<122℃, it continues to monitor NTC Temp repeatedly until NTC Temp is less than or equal to 105℃, and the front-view integrated machine enters the normal working mode; if NTC Temp<105℃, the front-view integrated machine enters the normal working mode. After the front-view integrated machine works normally, the MCU monitors the detection results of the temperature sensors built into the SOC, DDR, and Camera cmos in real time, and monitors NTC Temp to cooperate in implementing over-temperature protection for DDR. If NTC Temp<105℃, the operating temperature of the SOC is ≥122℃ or the operating temperature of the Camera cmos is ≥122℃, it enters the diagnostic mode. When entering the diagnostic mode, the MCU can control the power supply of the over-temperature SOC to power off and stop working by pulling down the enable of the SOC power module through GPIO2, and the DDR will also stop working, or the MCU can control the power supply of the Camera cmos to power off and stop working by pulling down the enable of the Camera power module through GPIO1. At the same time, an over-temperature fault is reported, and the fault information is transmitted to the CAN transceiver, and then transmitted to the body CAN through the CAN bus. The body CAN transmits the fault information to the vehicle device for display. When entering the shutdown mode, the MCU's GPIO3 does not feed the PMIC, and the PMIC's RST pin pulls down the MCU's reset signal reset to reset the MCU. If it is still in the shutdown mode after resetting, it will continue to reset until it jumps out of the shutdown mode. Therefore, in the shutdown mode, the MCU will reset repeatedly and cannot work normally, thereby controlling the entire front-view integrated machine to stop working. At this time, the body CAN will receive a periodic abnormal CAN error signal and output it to the vehicle device for display.

[0077] It is understandable that the present invention effectively improves the functional safety of the product by setting a more reasonable temperature monitoring method. When a module in the target device in the vehicle is overheated, the corresponding overtemperature information can be transmitted to the vehicle body, and the vehicle body then reminds through the display device. Other types of target devices can also be equipped with corresponding prompt modules to provide overtemperature prompts, and different prompt strategies can be further set for each module to distinguish them. This application does not make any special restrictions on the setting and implementation of the prompt module.

[0078] The present invention provides an over-temperature protection method, which determines the operating temperature of the target module and other circuit modules in the target device respectively. When the target module is over-heated, it means that the entire target device cannot work normally. At this time, the entire target device can be directly shut down to ensure the safety and reliability of the device; when only one or more circuit modules in other circuit modules are over-heated, only the over-heated circuit module can be shut down separately, and the target module can still continue to work and control the circuit modules in other circuit modules that are not over-heated to continue to work. Different response methods are adopted for different over-temperature situations of the target device, and a more reasonable over-temperature protection mechanism is provided, so that the target device can meet the functional safety requirements, and can try to ensure the normal operation of the target device on the basis of ensuring the safety and reliability of the device.

[0079] As an optional embodiment, judging whether the target module is over-temperature based on the first operating temperature includes:

[0080] Determining whether the first operating temperature is greater than a first temperature threshold;

[0081] If the first operating temperature is greater than the first temperature threshold, it is determined that the target module is over-temperature;

[0082] If the first operating temperature is not greater than the first temperature threshold, determining whether the first operating temperature is greater than the second temperature threshold;

[0083] If the first operating temperature is greater than the second temperature threshold, jump back to the step of determining whether the first operating temperature is greater than the first temperature threshold;

[0084] If the first operating temperature is not greater than the second temperature threshold, it is determined that the target module is not over-heated.

[0085] It is not difficult to understand that in order to further ensure the normal operation of the entire target device, in the process of judging whether the target module is overheated, multiple judgment intervals are set. When the first operating temperature is greater than the first temperature threshold, the target module can be directly judged to be overheated, but when the first operating temperature is not greater than the first temperature threshold, the pre-alarm interval is further set by adding a second temperature threshold that is less than the first temperature threshold. When the first operating temperature is between the first temperature threshold and the second temperature threshold, the target module has generated a certain amount of heat. At this time, if the target module is still started normally or the target module is kept working normally, the operating temperature of the target module is likely to rise rapidly, thereby overheating in a short time. Therefore, in this case, repeated judgments can be continuously performed to reduce the calculation amount and processing amount of the target module, so that its operating temperature is reduced. In this process, other cooling means can be further connected to reduce the operating temperature of the target module, and then when the first operating temperature is reduced to below the second temperature threshold, the target module is started normally or the target module is controlled to perform subsequent work. The specific types and implementation methods of the first temperature threshold and the second temperature threshold are not specifically limited in this application. There are also multiple implementation methods for the frequency of the two judgment processes, which are not specifically limited in this application.

[0086] Specifically, by adding a second temperature threshold, temporary cooling of the target module can be achieved when the temperature is high, so as to avoid the target module from overheating in a short period of time after it is determined that the target module is not overheated, further enhancing the over-temperature protection of the target module and improving the safety and reliability of the target module and the entire target device.

[0087] As an optional embodiment, it also includes:

[0088] For any circuit module among other circuit modules, when the circuit module is overheated, the overtemperature count value corresponding to the circuit module is increased by 1; wherein the overtemperature count value is set to an initial value when the target device is powered on;

[0089] If there is a circuit module whose over-temperature count value is greater than the count threshold, the circuit module is controlled to remain turned off before the target device is powered off.

[0090] It is understandable that in order to enhance the over-temperature protection of each circuit module in other circuit modules, the over-temperature conditions of other circuit modules will be further counted. When a circuit module in other circuit modules is controlled to be shut down after over-temperature, the corresponding over-temperature count value will be increased by 1; when the number of over-temperatures of a certain other circuit module in the current power-on process of the target device reaches the counting threshold, the circuit module will be controlled to be always shut down during the current power-on process of the target device until the target device is powered on again, and the over-temperature count values ​​of each other circuit module will be restored to the initial value, restart the counting, and repeat the above steps. The specific values ​​of the counting threshold and the initial value are not particularly limited in this application, and the initial value is generally set to 0. For the target device in the car, a power-on process of the target device is an ignition of the car. Therefore, the shutdown of each circuit module in other circuit modules can be counted at this time within an ignition cycle. When the count is greater than 10 times, the corresponding SOC / DDR / Camera coms will be turned off forever until the KL15 signal is powered on again. The number of counts is uniformly restored to zero.

[0091] Specifically, by counting the number of times other circuit modules are shut down, the counting threshold is used to further monitor the over-temperature conditions in other circuit modules. If a certain other circuit module is shut down repeatedly, abnormal heating and the like may occur. At this time, this circuit module is kept in the shut-down state to facilitate troubleshooting and other operations. If the target device is powered on again later, the circuit module will be started normally. This further enhances the over-temperature protection of other circuit modules and improves the safety and reliability of other circuit modules and the entire target device.

[0092] As an optional embodiment, before the over-temperature control circuit module is shut down, the method further includes:

[0093] re-enabling the over-temperature circuit module after a preset time period, and determining whether the re-enabled circuit module is still over-temperature based on the second operating temperature;

[0094] If so, jump to the step of shutting down the circuit module controlling the overtemperature.

[0095] It is not difficult to understand that in order to avoid the occurrence of misjudgments, after a circuit module among other circuit modules that is judged to be overheated is controlled to be shut down, the circuit module can be re-enabled, and then the operating temperature can be repeatedly judged using the second operating temperature. If the circuit module is still overheated after repeated judgment, the circuit module can be controlled to be shut down; if the circuit module is not overheated after repeated judgment, the last overtemperature judgment may be a misjudgment, and the circuit module can be controlled to work normally at this time. The present application does not make any special restrictions on the number of repeated judgments and the specific values ​​of the preset time period, and is not limited to the method of only performing one repeated judgment in this embodiment. Taking the target device as a domain controller as an example, when Temp2 is overheated and the overheated module and the corresponding peripherals of the module are turned off, the SOC enables the chip of the overheated module, and the chip works normally. The SOC then judges the number of abnormal Temp2 corresponding to the overheated module. If the number of abnormal times of Temp2 is greater than 3 times, the over-temperature module and the corresponding peripherals are turned off; if the number of abnormal times of Temp2 is less than or equal to 3 times, the over-temperature module and the peripherals are enabled to control the module to work normally.

[0096] Specifically, by setting up a repeated judgment process for the operating temperature of the circuit module that is shut down due to overtemperature in other circuit modules, misjudgment and the like are avoided, the accuracy and reliability of the operation of shutting down other circuit modules are improved, and the normal operation of other circuit modules is further ensured.

[0097] As an optional embodiment, temperature sensors are built into other circuit modules, and the target module and other circuit modules are integrated on a circuit board, on which a thermistor is provided;

[0098] Determining a first operating temperature of a target module in a target device and a second operating temperature of other circuit modules in the target device includes:

[0099] Obtaining a resistance value of the thermistor, and determining a temperature corresponding to the resistance value of the thermistor as a first operating temperature of a target module in a target device;

[0100] The detection results of each temperature sensor are obtained, and the detection results of the temperature sensors are determined as the second operating temperatures of the corresponding other circuit modules.

[0101] It is understandable that the detection process of the first operating temperature of the target module and the second operating temperature of other circuit modules can be achieved by building a temperature sensor inside the corresponding module. At the same time, the first operating temperature of the target module can also be achieved by integrating a thermistor or other thermal sensitive element on the circuit board of the target device. A temperature sensor can also be built into the target module to cooperate with the thermistor to achieve the determination process of the first operating temperature; for example, the detection result of the temperature sensor built into the target module and the temperature value corresponding to the thermistor set near the target module can be weighted averaged, and the final result is used as the first operating temperature. The specific types and implementation methods of the temperature sensor and thermistor are not particularly limited in this application, and the thermistor can also be implemented using other types of thermal sensitive elements.

[0102] Specifically, by integrating NTC on the circuit board, the resistance change of NTC can be effectively used to determine the first operating temperature. When the temperature corresponding to NTC is too high, it means that the operating temperature of the entire circuit board is high, and the first operating temperature of the corresponding target module will also be relatively high. Thermistors have low cost, simple structure, and are easy to implement. At the same time, temperature detection can also be achieved by integrating a temperature sensor inside the module.

[0103] As an optional embodiment, a watchdog program is set in the power management circuit of the target device; controlling the target device to shut down includes:

[0104] Stop feeding the watchdog program in the power management circuit so that the power management circuit controls the target module to reset.

[0105] It is not difficult to understand that a power management circuit is generally set in the target device to manage the power supply process of each module. At the same time, a watchdog program will be built into the PMIC. If the target module runs stably, the watchdog program will be fed after executing specific instructions. If the watchdog does not receive the feeding signal from the target module within a certain period, it will be considered a system failure and force the target module to reset. This application can use this reset operation to shut down the target device. When the target module is overheated, the target module will stop outputting the feeding signal, and the power management circuit will automatically control the reset of the target module, thereby shutting down the entire target device. Taking the target device as a front-view integrated machine as an example, if the GPIO3 of the MCU does not feed the PMIC, the RST pin of the PMIC pulls down the reset signal reset of the MCU to reset the MCU. If it is still in shutdown mode after resetting, it will continue to reset until it jumps out of shutdown mode. In shutdown mode, the MCU is repeatedly reset and cannot work normally.

[0106] Specifically, by reusing the watchdog program in the power management circuit of the target device, the target device can be shut down by controlling the reset of the target module, thereby realizing over-temperature protection when the target module is over-temperature. This is simple, effective and easy to implement, without setting additional control signals or hardware structures, further saving the cost of the entire target device.

[0107] As an optional embodiment, controlling the over-temperature circuit module to shut down includes:

[0108] The power module corresponding to the over-temperature circuit module is controlled to be powered off, so as to control the over-temperature circuit module to be shut down.

[0109] It is understandable that if other circuit modules are overheated, the target module can directly control the power module that supplies power to the overheated circuit module to power off, so that the overheated circuit module cannot obtain power supply normally, thereby controlling the overheated circuit module to shut down.

[0110] Specifically, the shutdown control of other circuit modules can be achieved directly by disconnecting the power supply, which is simple, effective and easy to implement without setting additional control signals or hardware structures, further saving the cost of the entire target device.

[0111] Please refer to Figure 6 , Figure 6 A schematic diagram of the structure of an over-temperature protection device provided by the present invention; To solve the above technical problems, the present invention also provides an over-temperature protection device, comprising:

[0112] A temperature determination unit 11, used to determine a first operating temperature of a target module in a target device and a second operating temperature of other circuit modules in the target device; wherein the other circuit modules are at least one circuit module in the target device other than the target module;

[0113] A first judging unit 12, configured to judge whether a target module is over-temperature based on a first operating temperature;

[0114] A first shut-down unit 13, used to control the target device to shut down if the target module is over-temperature;

[0115] A second judgment unit 14 is used to judge whether a circuit module in other circuit modules is over-temperature based on the second operating temperature if the target module is not over-temperature;

[0116] The second shut-down unit 15 is used to control the over-temperature circuit module to shut down if there is an over-temperature circuit module among other circuit modules.

[0117] As an optional embodiment, the first judging unit 12 includes:

[0118] an alarm determination unit, configured to determine whether the first operating temperature is greater than a first temperature threshold;

[0119] an over-temperature determination unit, configured to determine that the target module is over-temperatured if the first operating temperature is greater than the first temperature threshold;

[0120] a first early warning judgment unit, configured to judge whether the first operating temperature is greater than a second temperature threshold if the first operating temperature is not greater than the first temperature threshold;

[0121] a second early warning judgment unit, configured to jump again to the step of judging whether the first operating temperature is greater than the first temperature threshold if the first operating temperature is greater than the second temperature threshold;

[0122] The normal determination unit is configured to determine that the target module is not over-temperatured if the first operating temperature is not greater than the second temperature threshold.

[0123] As an optional embodiment, it also includes:

[0124] An over-temperature counting unit, for any circuit module among other circuit modules, when the circuit module is over-heated, adding 1 to the over-temperature count value corresponding to the circuit module; wherein the over-temperature count value is set to an initial value when the target device is powered on;

[0125] The shutdown keeping unit is used for controlling the circuit module to remain shut down before the target device is powered off if the over-temperature count value of the circuit module is greater than the count threshold.

[0126] As an optional embodiment, it also includes:

[0127] The repeated judgment unit is used to re-enable the over-temperature circuit module after a preset time period, and judge whether the re-enabled circuit module is still over-temperature based on the second operating temperature; if so, trigger the second shutdown unit 15.

[0128] As an optional embodiment, the temperature determination unit 11 includes:

[0129] a first operating temperature determining unit, configured to obtain a resistance value of the thermistor, and determine a temperature corresponding to the resistance value of the thermistor as a first operating temperature of a target module in a target device;

[0130] The second operating temperature determining unit is used to obtain the detection results of each temperature sensor, and determine the detection results of the temperature sensor as the second operating temperatures of the corresponding other circuit modules.

[0131] As an optional embodiment, the first shut-down unit 13 includes:

[0132] The reset control unit is used to stop the dog feeding operation of the watchdog program in the power management circuit so that the power management circuit controls the reset of the target module.

[0133] As an optional embodiment, the second shut-down unit 15 includes:

[0134] The power-off control unit is used to control the power supply module corresponding to the over-temperature circuit module to power off, so as to control the over-temperature circuit module to shut down.

[0135] For an introduction to an over-temperature protection device provided by the present invention, please refer to the above-mentioned embodiment of the over-temperature protection method, and the present invention will not be repeated here.

[0136] Please refer to Figure 7 , Figure 7 The present invention provides a schematic diagram of the structure of an electronic device. To solve the above technical problems, the present invention also provides an electronic device, including:

[0137] A memory 21, used for storing computer programs;

[0138] The processor 22 is used to implement the steps of the above-mentioned over-temperature protection method.

[0139] Among them, the processor 22 may include one or more processing cores, such as a 4-core processor, an 8-core processor, etc. The processor 22 can be implemented in at least one hardware form of DSP (Digital Signal Processor), FPGA (Field-Programmable Gate Array), and PLA (Programmable Logic Array). The processor 22 may also include a main processor and a coprocessor. The main processor is a processor for processing data in the awake state, also known as a central processing unit; the coprocessor is a low-power processor for processing data in the standby state. In some embodiments, the processor 22 may integrate a GPU (graphics processing unit), which is responsible for rendering and drawing the content to be displayed on the display screen. In some embodiments, the processor 22 may also include an AI (Artificial Intelligence) processor, which is used to process computing operations related to machine learning.

[0140] The memory 21 may include one or more computer-readable storage media, which may be non-transitory. The memory 21 may also include a high-speed random access memory, and a non-volatile memory, such as one or more disk storage devices, flash memory storage devices. In this embodiment, the memory 21 is at least used to store the following computer program, wherein, after the computer program is loaded and executed by the processor 22, it can implement the relevant steps of the over-temperature protection method disclosed in any of the aforementioned embodiments. In addition, the resources stored in the memory 21 may also include an operating system and data, etc., and the storage method may be temporary storage or permanent storage. Among them, the operating system may include Windows, Unix, Linux, etc. The data may include but is not limited to the data of the over-temperature protection method, etc.

[0141] In some embodiments, the electronic device may further include a display screen, an input and output interface, a communication interface, a power supply, and a communication bus.

[0142] It can be understood by those skilled in the art that Figure 7 The structure shown in the figure does not constitute a limitation on the electronic device, and may include more or fewer components than shown in the figure.

[0143] For an introduction to an electronic device provided by the present invention, please refer to the above-mentioned embodiment of the over-temperature protection method, and the present invention will not be described in detail here.

[0144] In order to solve the above technical problems, the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the over-temperature protection method as described above are implemented.

[0145] It is understandable that if the method in the above embodiment is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium to execute all or part of the steps of the method described in each embodiment of the present application. Specifically, the computer-readable storage medium may include but is not limited to any type of disk, including a floppy disk, an optical disk, and a mobile hard disk, or any type of medium or device suitable for storing instructions, data, etc., and the present application does not make any special restrictions here.

[0146] For an introduction to a computer-readable storage medium provided by the present invention, please refer to the above-mentioned embodiment of the over-temperature protection method, and the present invention will not be repeated here.

[0147] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0148] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0149] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0150] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An over-temperature protection method, characterized in that: include: Determining a first operating temperature of a target module in a target device and a second operating temperature of other circuit modules in the target device; wherein the other circuit module is at least one circuit module in the target device other than the target module; Determining whether the target module is over-temperature based on the first operating temperature; If the target module is over-temperature, the target device is controlled to shut down; If the target module is not over-temperatured, determining whether a circuit module in other circuit modules is over-temperatured based on the second operating temperature; If a circuit module among other circuit modules has an over-temperature, the over-temperature circuit module is controlled to be shut down.

2. The over-temperature protection method according to claim 1, characterized in that: Judging whether the target module is over-temperature based on the first operating temperature includes: Determining whether the first operating temperature is greater than a first temperature threshold; If the first operating temperature is greater than the first temperature threshold, it is determined that the target module is over-temperature; If the first operating temperature is not greater than the first temperature threshold, determining whether the first operating temperature is greater than a second temperature threshold; If the first operating temperature is greater than the second temperature threshold, jump back to the step of determining whether the first operating temperature is greater than the first temperature threshold; If the first operating temperature is not greater than the second temperature threshold, it is determined that the target module is not over-heated.

3. The over-temperature protection method according to claim 1, characterized in that: Also includes: For any circuit module among other circuit modules, when the circuit module is overheated, the overtemperature count value corresponding to the circuit module is increased by 1; wherein the overtemperature count value is set to an initial value when the target device is powered on; If there is a circuit module whose over-temperature count value is greater than the count threshold, the circuit module is controlled to remain turned off before the target device is powered off.

4. The over-temperature protection method according to claim 1, characterized in that: Before the over-temperature control circuit module is shut down, it also includes: re-enabling the over-temperature circuit module after a preset time period, and determining whether the re-enabled circuit module is still over-temperature based on the second operating temperature; If so, jump to the step of shutting down the circuit module for controlling overtemperature.

5. The over-temperature protection method according to claim 1, characterized in that: The other circuit modules are each equipped with a built-in temperature sensor, the target module and the other circuit modules are integrated on a circuit board, and a thermistor is provided on the circuit board; Determining a first operating temperature of a target module in a target device and a second operating temperature of other circuit modules in the target device includes: Obtaining a resistance value of the thermistor, and determining a temperature corresponding to the resistance value of the thermistor as a first operating temperature of a target module in a target device; The detection results of each temperature sensor are acquired, and the detection results of the temperature sensors are determined as the second operating temperatures of the corresponding other circuit modules.

6. The over-temperature protection method according to any one of claims 1 to 5, characterized in that: A watchdog program is set in the power management circuit of the target device; controlling the target device to shut down includes: Stop feeding the watchdog program in the power management circuit so that the power management circuit controls the target module to reset.

7. The over-temperature protection method according to any one of claims 1 to 5, characterized in that: The circuit module shuts down when controlling over-temperature, including: The power module corresponding to the over-temperature circuit module is controlled to be powered off, so as to control the over-temperature circuit module to be shut down.

8. An over-temperature protection device, characterized in that: include: a temperature determination unit, configured to determine a first operating temperature of a target module in a target device and a second operating temperature of other circuit modules in the target device; wherein the other circuit modules are at least one circuit module in the target device other than the target module; A first judging unit, configured to judge whether the target module is over-temperature based on the first operating temperature; A first shut-down unit, configured to control the target device to shut down if the target module is over-temperature; A second judgment unit, configured to judge whether a circuit module in other circuit modules is over-temperature based on the second operating temperature if the target module is not over-temperature; The second shut-down unit is used for controlling the over-temperature circuit module to shut down if a circuit module among other circuit modules has an over-temperature.

9. An electronic device, characterized in that: include: Memory for storing computer programs; A processor, used to implement the steps of the over-temperature protection method as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the over-temperature protection method according to any one of claims 1 to 7 are implemented.

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