Liquid cooling flow guide frame and electronic equipment

Abstract

The invention provides a liquid cooling flow guide frame and electronic equipment, and relates to the field of heat exchange. A liquid cooling flow guide frame is applied to electronic equipment and comprises a frame body, convex ribs are arranged on the peripheral side of the frame body, and a liquid storage cavity is defined by the frame body and the convex ribs; the bearing part is arranged in the middle of the frame body in a hollowed-out mode and used for bearing a cold plate arranged in the electronic equipment; the flow guide groove is formed in at least one side of the frame body, and the flow guide groove is communicated with the liquid storage cavity. Through the liquid cooling heat conduction frame, the reliability of the liquid cooling heat dissipation electronic equipment can be improved.

Description

Technical Field

[0001] The present invention relates to the field of heat exchange technology, and in particular to a liquid cooling guide frame and an electronic device. Background Art

[0002] With the development of electronic technology, the number of electrical components integrated in an electronic device has gradually increased. More heat will be generated during the operation of the electronic device. Traditional air cooling cannot meet the heat dissipation needs of electronic equipment with high heat generation. Therefore, the application of liquid cooling with higher heat dissipation efficiency in electronic equipment has gradually expanded.

[0003] Liquid cooling requires the circulation of cold liquid in electronic equipment, which requires a sealed circulation pipeline in the electronic equipment to avoid the risk of cold liquid leaking and dripping onto electrical components, causing damage such as short circuits. However, if the pressure in the circulation pipeline is too high or the input / output connectors that are connected to the circulation pipeline are aged, the cold liquid will still leak, and dripping cold liquid will still cause damage to the electronic equipment. How to reduce the risk of damage to electronic equipment using liquid cooling due to cold liquid leakage is an urgent problem to be solved by those skilled in the art. Summary of the invention

[0004] In order to overcome the problems existing in the related art, this specification provides a liquid cooling guide frame and an electronic device.

[0005] According to a first aspect of an embodiment of this specification, a liquid cooling flow guide frame is provided, which is applied to an electronic device, including:

[0006] A frame body, wherein convex ribs are arranged on the periphery of the frame body, and the frame body and the convex ribs enclose a liquid storage cavity;

[0007] A supporting portion, hollowed out and arranged in the middle of the frame, for supporting a cold plate arranged in the electronic device;

[0008] A guide groove is arranged on at least one side of the frame, and the guide groove is connected to the liquid storage cavity.

[0009] Optionally, in the length direction of the frame, the guide grooves are arranged on both sides of the frame.

[0010] Optionally, the number of the supporting parts is two.

[0011] According to a second aspect of the embodiments of this specification, an electronic device is provided, including:

[0012] Box;

[0013] A printed circuit board, on which a heating device is arranged;

[0014] The liquid cooling guide frame described in any one of the above items is arranged above the printed circuit board, and the heating device is exposed from the supporting part;

[0015] A cold plate, disposed above the supporting portion and in contact with the heating element;

[0016] The circulation pipeline is plugged into the cold plate, and the connection between the circulation pipeline and the cold plate corresponds to the liquid storage cavity of the liquid cooling guide frame.

[0017] Optionally, the guide groove of the liquid cooling guide frame is formed between the printed circuit board and the side wall of the box body.

[0018] Optionally, the box includes a bottom plate;

[0019] Wherein, a drainage channel is formed on the bottom plate, and the drainage channel extends to the edge of the box body;

[0020] The projection of the guide groove of the liquid cooling guide frame in the vertical direction falls into the drainage channel, and a drainage hole is arranged at the edge of the drainage channel close to the bottom plate.

[0021] Optionally, the cold plate comprises:

[0022] A plate body, a heat exchange portion is formed on the plate body, and a heat exchange cavity is formed in the heat exchange portion;

[0023] A liquid cooling joint, arranged in the heat exchange part, communicated with the heat exchange cavity, and connected with the circulation pipeline;

[0024] A fence is formed by protruding upward from the edge of the heat exchange part, the heat exchange part and the fence form a liquid collecting tank, and the projection of the liquid cooling joint in the vertical direction falls into the liquid collecting tank;

[0025] Wherein, an extension portion is provided on the liquid collecting tank, an opening is formed at the edge of the extension portion, and the projection of the opening in the vertical direction falls outside the cold plate and falls into the liquid storage cavity.

[0026] Optionally, the liquid cooling joint comprises:

[0027] External Management Department;

[0028] An inner tube portion, disposed in the outer tube portion and connected to the circulation pipeline;

[0029] The electronic device further comprises an outer sleeve, which is sleeved outside the circulation pipeline and wrapped around the outer side of the outer tube;

[0030] Wherein, the projection of the edge of the outer sleeve in the vertical direction falls into the liquid collecting tank.

[0031] Optionally, a liquid leakage groove is provided on a side of the outer tube portion close to the liquid collecting groove, and the liquid leakage groove extends to the outside of the outer sleeve.

[0032] Optionally, the electronic device further includes a fan;

[0033] The liquid cooling guide frame also includes a windshield;

[0034] The wind shield is arranged on a side edge of the liquid cooling guide frame close to the fan.

[0035] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0036] In the embodiments of the present specification, in the above-mentioned liquid-cooled guide frame, the cold liquid dripping from the cold plate is collected by the formed liquid storage cavity, and the collected cold liquid is discharged to the outside of the printed circuit board of the electronic device through the guide groove at the edge of the plate body, thereby preventing the dripping cold liquid from falling onto the electrical components on the printed circuit board and causing damage to the electronic device, thereby improving the reliability of the electronic equipment with liquid cooling.

[0037] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0039] Figure 1 It is a structural schematic diagram of a liquid cooling guide frame involved in an embodiment of the present application;

[0040] Figure 2 is a top view of a liquid cooling guide frame involved in an embodiment of the present application;

[0041] Figure 3 It is a structural schematic diagram of an electronic device involved in an implementation manner of the present application;

[0042] Figure 4 is a top view of a bottom plate in an electronic device involved in an embodiment of the present application;

[0043] Figure 5 It is a schematic structural diagram of a cold plate in an electronic device involved in an embodiment of the present application;

[0044] Figure 6 is a cross-sectional view of a liquid cooling joint and an outer sleeve of a cold plate in an electronic device according to an embodiment of the present application;

[0045] Figure 7It is a schematic diagram of the structure of another electronic device involved in the implementation mode of the present application. DETAILED DESCRIPTION

[0046] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

[0047] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. The singular forms "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0048] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0049] The present application provides a liquid cooling guide frame 100, such as Figure 1 As shown, it is applied to electronic equipment, including:

[0050] A frame body 1, a convex rib 2 is arranged on the circumference of the frame body 1, and the frame body 1 and the convex rib 2 enclose a liquid storage cavity 10;

[0051] A supporting portion 3, which is hollowed out and disposed in the middle of the frame 1, and is used to support a cold plate disposed in the electronic device;

[0052] The guide groove 4 is disposed on at least one side of the frame 1 , and the guide groove 4 is connected to the liquid storage cavity 10 .

[0053] The frame 1 may be nearly rectangular, and the convex rib 2 is arranged at the edge of the rectangle. The height of the convex rib 2 may be set according to actual needs to prevent the cold liquid from dripping.

[0054] The supporting portion 3 may include a hole 30 formed on the frame 1 and a supporting protrusion 31 extending along the hole 30 . The shape of the supporting protrusion 31 may be set according to the size of the cold plate to be supported, and the height may be similar to the height of the rib 2 .

[0055] The guide groove 4 can be nearly annular, wherein the outer wall 40 is connected to the frame 1, and the inner cavity 41 is connected to the liquid storage cavity 10. The guide groove 4 can extend outward from the frame 1 for a distance, for example, to the outside of the printed circuit board, so that cold liquid drips onto the printed circuit board and causes damage.

[0056] When the cold liquid drips, the frame 1 receives the dripping cold liquid, and the liquid storage cavity 10 surrounded by the ribs 2 and the frame 1 can collect the dripping cold liquid. In addition, since the height of the ribs 2 is higher than the frame 1, the ribs 2 have a certain retaining effect on the cold liquid, thereby preventing it from sliding out of the liquid storage cavity 10.

[0057] In an electronic device that uses liquid cooling for heat dissipation, a liquid cooling guide frame 100 can be arranged between a cold plate and a printed circuit board. The supporting portion 3 of the liquid cooling guide frame 100 supports the cold plate, and the edges of the two are tightly fitted. A supporting protrusion 31 with a height similar to that of the rib 2 is provided on the supporting portion 3. The supporting protrusion 31 can also maintain the liquid cooling in the liquid storage cavity 10 to prevent the cold liquid from dripping from the gap between the supporting portion 3 and the cold plate to the printed circuit board.

[0058] When the cold liquid accumulates in the liquid storage chamber 10, it will spread in all directions. When the cold liquid reaches the edge of the liquid storage chamber 10, it is discharged along the inner cavity 41 of the guide groove 4, for example, discharged to the bottom plate of the electronic device where no electrical components are set, or directly discharged to the outside of the electronic device, which can be set according to actual needs without limitation.

[0059] A flexible conduit may also be sleeved on the outer circumference of the guide groove 4 , and the flexible conduit may extend to the bottom plate of the electronic device or extend outside the electronic device to facilitate the discharge of the cold liquid.

[0060] In the embodiments of the present specification, in the above-mentioned liquid-cooled guide frame, the cold liquid dripping from the cold plate is collected by the formed liquid storage cavity, and the collected cold liquid is discharged to the outside of the printed circuit board of the electronic device through the guide groove at the edge of the plate body, thereby preventing the dripping cold liquid from falling onto the electrical components on the printed circuit board and causing damage to the electronic device, thereby improving the reliability of the electronic equipment with liquid cooling.

[0061] In addition, due to the provision of the liquid cooling guide frame 100, heat can be transferred more effectively between the cold plate and the heat dissipation object, so that the heat dissipation effect in the electronic device can also be improved through the liquid cooling guide frame 100.

[0062] Since the cold liquid in the liquid storage chamber 10 will diffuse around along the surface of the frame 1 , if the cold liquid flows to the side where the guide groove 4 is not provided, there is still a possibility that the cold liquid will drip from the liquid cooling guide frame 100 .

[0063] In order to avoid dripping caused by disorderly diffusion of the cooling liquid, optional, such as Figure 2 As shown, in the length direction X of the frame 1 , the guide grooves 4 are arranged on both sides of the frame 1 .

[0064] By providing guide grooves 4 on both sides of the liquid cooling guide frame 100, the cold liquid accumulated on either side can be discharged outward along the guide grooves 4, thereby avoiding dripping caused by the cold liquid accumulating on one side and further improving the reliability of the liquid cooling electronic equipment.

[0065] Since multiple cold plates may be provided in the electronic device, all of these cold plates need to be supported by the liquid cooling guide frame 100, therefore, optionally, as Figure 1 As shown, the number of the supporting parts 3 is two.

[0066] The two supporting parts 3 are arranged in the middle of the liquid-cooling guide frame 100 according to actual needs. They can be arranged with a gap or connected through a connecting hole. They can be arranged according to actual needs without limitation.

[0067] Correspondingly, the present application also provides an electronic device 200, such as Figure 3 As shown, including:

[0068] The box body 5 may be composed of a bottom plate 50, side plates 51 and a top plate;

[0069] A printed circuit board 6, on which a heating device is arranged. The heating device may be a CPU, an image processor, a memory, etc., and may be arranged according to actual needs without limitation;

[0070] The liquid cooling guide frame 100 described in any one of the above items is arranged above the printed circuit board 6, and the heating device is exposed from the supporting portion 3. Since the supporting portion 3 is hollowed out to set a hole 30 on the liquid cooling guide frame 100, its shape can be formed according to the shape of the heating device, so that the heating device can be embedded in the hole 30 of the supporting portion 3;

[0071] The cold plate 7 is disposed above the supporting portion 3 and in contact with the heating device. The bottom surface of the cold plate 7 can be mounted on the supporting protrusion 31 of the supporting portion 3 and fit tightly, and is in contact with the heating device through the hole 30 of the supporting portion 3.

[0072] The circulation pipeline 8 is plugged into the cold plate 7 , and the connection between the circulation pipeline 8 and the cold plate 7 corresponds to the liquid storage cavity 10 of the liquid-cooling guide frame 100 .

[0073] When the electronic device 200 uses liquid cooling for heat dissipation, the circulation pipeline 8 needs to be connected to the cold plate 7 so that the external circulating cold liquid flows into the heat exchange cavity in the cold plate 7 to form a liquid cooling cycle.

[0074] In the vertical direction, the cold plate 7, the liquid cooling guide frame 100 and the printed circuit board 6 are arranged in sequence from top to bottom. After the cold liquid circulation is turned on, if the connection between the cold plate 7 and the circulation pipeline 08 is abnormal, or the seal at the connection is aged, etc., the cold liquid will seep out and drip.

[0075] At this time, since the liquid cooling guide frame 100 is arranged under the cold plate 7, it can receive the cold liquid dripping from the cold plate 7, and when cold liquid accumulates, it will flow out to the outside of the electronic device 200 along the guide groove 4, thereby avoiding the cold liquid from dripping onto the printed circuit board 6 and improving the reliability of the liquid cooling electronic device.

[0076] Optionally, the guide groove 4 of the liquid-cooling guide frame 100 is formed between the printed circuit board 6 and the side plate 51 of the box body 5 .

[0077] Since the printed circuit board 6 can be arranged on the bottom plate 50 of the box body 5, and the printed circuit board 6 is spaced a certain distance from the bottom plate 50 by structures such as support columns, and in order to facilitate the installation of the printed circuit board 6, the size of the printed circuit board 6 is smaller than the distance between the two side plates 51 of the box body 5. When the cold liquid flows out along the guide groove 4, since the guide groove 4 is arranged between the printed circuit board 6 and the side plate 51, the cold liquid can flow from the gap between the two to the bottom plate 50, thereby preventing the cold liquid from dripping onto the printed circuit board 6.

[0078] Optional, such as Figure 4 As shown, the box body 5 includes a bottom plate 50;

[0079] A drainage channel 50A is formed on the bottom plate 50, and the drainage channel 50A extends to the edge of the box body 5;

[0080] The projection of the guide groove 4 of the liquid-cooling guide frame 100 in the vertical direction Y falls into the drainage channel 50A, and a drainage hole 50B is provided at the edge of the drainage channel 50A close to the bottom plate 50 .

[0081] A drainage channel 50A may be formed on the bottom plate 50 by pressing a sheet metal. The drainage channel 50A may have a certain slope and extend from the middle of the bottom plate 50 to the edge so that the cold liquid can be discharged at the edge. In order to control the stability of the cold liquid discharge from the electronic device 200 and enable the cold liquid to be discharged from one place, a drainage hole 50B may be formed.

[0082] Optional, such as Figure 5 As shown, the cold plate 7 comprises:

[0083] A plate body 70, on which a heat exchange portion 71 is formed, and a heat exchange cavity is formed in the heat exchange portion 71;

[0084] The liquid cooling joint 72 is provided in the heat exchange part 71, communicated with the heat exchange cavity, and connected with the circulation pipeline 8. Through the connection between the liquid cooling joint 72 and the circulation pipeline 8, the cold liquid in the circulation pipeline 8 can enter the heat exchange cavity, and dissipate heat through the contact between the plate body 70 and the heat generating device;

[0085] The fence 73 is formed by protruding upward from the edge of the heat exchange portion 71. The heat exchange portion 71 and the fence 73 enclose a liquid collecting tank 74. The projection of the liquid cooling joint 72 in the vertical direction Y falls into the liquid collecting tank 74. Since the size of the liquid collecting tank 74 can include the liquid cooling joint 72, when the cold liquid at the liquid cooling joint 72 seeps out and drips, it can first drip into the liquid collecting tank 74 for retention;

[0086] The liquid collecting tank 74 is provided with an extension portion 74A, and an opening 74B is formed at the edge of the extension portion 74A. The projection of the opening 74B in the vertical direction Y falls outside the cold plate 7 and into the liquid storage cavity 10 .

[0087] Since the cold liquid can first drip into the liquid collecting groove 74 formed on the cold plate 7 after seeping out and dripping from the liquid cooling joint 72, and the height difference between the liquid collecting groove 74 and the liquid cooling joint 72 is small, the impact is small, and the cold liquid is prevented from splashing a long distance when dripping, so that part of the cold liquid splashes onto the printed circuit board 6. Thereafter, when a large amount of cold liquid accumulates in the liquid collecting groove 74, it drips onto the liquid cooling guide frame 100 of the lower layer through the opening 74B. In this way, the liquid cooling joint 72, the liquid collecting groove 74, the liquid cooling guide frame 100 and the bottom plate 50 of the cold plate 7 are layered in the vertical direction Y, so that the distance of each dripping of the cold liquid will not be large, and the problem of the cold liquid splashing onto the printed circuit board 6 during the dripping process is avoided, and the reliability of the electronic equipment with liquid cooling and heat dissipation is further improved.

[0088] Optional, such as Figure 6 As shown, the liquid cooling joint 72 includes:

[0089] Outer tube portion 72A;

[0090] The inner tube portion 72B is disposed inside the outer tube portion 72A and connected to the circulation pipeline 8;

[0091] The electronic device 200 further includes an outer sleeve 80, which is sleeved outside the circulation pipeline 8 and wrapped around the outer side of the outer tube portion 72A;

[0092] The projection of the edge of the outer sleeve 80 in the vertical direction Y falls into the liquid collecting tank 74 .

[0093] In the electronic device 200, an inner and outer tube form can be formed. That is, an outer tube 80 is set on the outer periphery of the circulation pipeline 8, and the length of the outer tube 80 needs to be longer than the outer tube part 72A, and there is a certain degree of airtightness between the outer tube 80 and the circulation pipeline 8, so that the cold liquid that seeps into the outer tube 80 can flow to the side of the outer tube part 72A close to the center of the cold plate 7, so that the seeped cold liquid can avoid leaking and dripping onto the printed circuit board 6.

[0094] In order to allow the cold liquid that seeps into the outer sleeve 80 to flow smoothly into the collecting tank 74 and avoid accumulating in the outer sleeve 80 and being unable to be discharged, resulting in excessive pressure in the outer sleeve 80 and spraying out, optionally, a leakage tank 72C is provided on one side of the outer tube portion 72A close to the collecting tank 74, and the leakage tank 72C extends to the outside of the outer sleeve 80.

[0095] The leakage groove 72C can be opened on one side of the outer tube portion 72A close to the collecting groove 74, that is, the lower side in the vertical direction Y. In this way, the cold liquid accumulated in the outer sleeve 80 can smoothly flow into the collecting groove 74, and then drip into the liquid cooling guide frame 100 and be discharged outside the electronic device 200.

[0096] Since the liquid-cooled electronic device 200 may also have an air-cooled structure, such as a fan 9 , when the fan 9 is working, the cold liquid in the liquid storage chamber 10 may be blown out and drip onto the printed circuit board 6 .

[0097] In order to avoid the above problems, the electronic device 200 may be configured as follows: Figure 7 As shown, a fan 9 is also included;

[0098] The liquid cooling guide frame 100 further includes a wind shield 11;

[0099] The wind shield 11 is disposed on one side edge of the liquid cooling guide frame 100 close to the fan 9 .

[0100] By providing the wind shield 11 , it is possible to prevent the wind blown by the fan 9 from blowing the cooling liquid onto the printed circuit board 6 , thereby further improving the reliability of the liquid-cooled electronic device.

[0101] The electronic device 200 mentioned above may be a personal computer, a router, a switch, a server, a firewall, etc., and may be configured according to actual needs without limitation.

[0102] In the embodiments of the present specification, in the above-mentioned liquid-cooled guide frame, the cold liquid dripping from the cold plate is collected by the formed liquid storage cavity, and the collected cold liquid is discharged to the outside of the printed circuit board of the electronic device through the guide groove at the edge of the plate body, thereby preventing the dripping cold liquid from falling onto the electrical components on the printed circuit board and causing damage to the electronic device, thereby improving the reliability of the electronic equipment with liquid cooling.

[0103] In addition, due to the provision of the liquid cooling guide frame 100, heat can be transferred more effectively between the cold plate and the heat dissipation object, so that the heat dissipation effect in the electronic device can also be improved through the liquid cooling guide frame 100.

[0104] Those skilled in the art will readily appreciate other embodiments of the specification after considering the specification and practicing the invention claimed herein. The specification is intended to cover any variations, uses or adaptations of the specification that follow the general principles of the specification and include common knowledge or customary techniques in the art that are not claimed in the specification. The specification and examples are to be considered exemplary only, and the true scope and spirit of the specification are indicated by the following claims.

[0105] It should be understood that the present description is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0106] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A liquid cooling guide frame, characterized in that: Used in electronic equipment, including: A frame body, wherein convex ribs are arranged on the periphery of the frame body, and the frame body and the convex ribs enclose a liquid storage cavity; A supporting portion, hollowed out and arranged in the middle of the frame, for supporting a cold plate arranged in the electronic device; A guide groove is arranged on at least one side of the frame, and the guide groove is connected to the liquid storage cavity.

2. The liquid cooling guide frame according to claim 1, characterized in that: In the length direction of the frame, the guide grooves are arranged on both sides of the frame.

3. The liquid cooling guide frame according to claim 1, characterized in that: The number of the supporting parts is two.

4. An electronic device, characterized in that: include: Box; A printed circuit board, on which a heating device is arranged; The liquid cooling guide frame according to any one of claims 1 to 3 is arranged above the printed circuit board, and the heating device is exposed from the supporting portion; A cold plate, disposed above the supporting portion and in contact with the heating element; The circulation pipeline is plugged into the cold plate, and the connection between the circulation pipeline and the cold plate corresponds to the liquid storage cavity of the liquid cooling guide frame.

5. The electronic device according to claim 4, characterized in that: The guide groove of the liquid cooling guide frame is formed between the printed circuit board and the side wall of the box body.

6. The electronic device according to claim 4, characterized in that: The box body includes a bottom plate; Wherein, a drainage channel is formed on the bottom plate, and the drainage channel extends to the edge of the box body; The projection of the guide groove of the liquid cooling guide frame in the vertical direction falls into the drainage channel, and a drainage hole is arranged at the edge of the drainage channel close to the bottom plate.

7. The electronic device according to claim 4, characterized in that: The cold plate comprises: A plate body, a heat exchange portion is formed on the plate body, and a heat exchange cavity is formed in the heat exchange portion; A liquid cooling joint, arranged in the heat exchange part, communicated with the heat exchange cavity, and connected with the circulation pipeline; A fence is formed by protruding upward from the edge of the heat exchange part, the heat exchange part and the fence form a liquid collecting tank, and the projection of the liquid cooling joint in the vertical direction falls into the liquid collecting tank; Wherein, an extension portion is provided on the liquid collecting tank, an opening is formed at the edge of the extension portion, and the projection of the opening in the vertical direction falls outside the cold plate and falls into the liquid storage cavity.

8. The electronic device according to claim 7, characterized in that: The liquid cooling joint comprises: External Management Department; An inner tube portion, disposed in the outer tube portion and connected to the circulation pipeline; The electronic device further comprises an outer sleeve, which is sleeved outside the circulation pipeline and wrapped around the outer side of the outer tube; Wherein, the projection of the edge of the outer sleeve in the vertical direction falls into the liquid collecting tank.

9. The electronic device according to claim 8, characterized in that: A liquid leakage groove is arranged on one side of the outer tube portion close to the liquid collecting groove, and the liquid leakage groove extends to the outside of the outer sleeve.

10. The electronic device according to claim 4, characterized in that: Also includes a fan; The liquid cooling guide frame also includes a wind shield; The wind shield is arranged on a side edge of the liquid cooling guide frame close to the fan.

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