Copper conductor packaging processing equipment with positioning function

Abstract

The invention belongs to the technical field of copper conductor packaging processing, and particularly relates to copper conductor packaging processing equipment with a positioning function, which comprises a material conveying mechanism, an L-shaped supporting plate is arranged on one side of the material conveying mechanism, a metering pump is fixedly mounted at one end of the L-shaped supporting plate, the outlet end of the metering pump is connected with a glue injection head, and the inlet end of the metering pump is connected with a glue tank. The conveying mechanism comprises a rack, the lower end of the L-shaped supporting plate is fixedly connected with the rack, two sets of transmission shafts are rotationally installed on the rack, a plurality of sets of shifting forks are driven to do circular motion, electronic elements to be packaged can continuously pass through a glue injection head to be subjected to glue injection, and therefore continuous packaging of the electronic elements is achieved. According to the electronic component packaging device, the packaging efficiency of the electronic component is improved, the shifting fork, the L-shaped supporting plate and the discharging conveying belt are arranged in a matched mode, automatic discharging of the electronic component after glue injection can be achieved, and therefore the automation rate of the device is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of copper conductor packaging and processing, in particular to copper conductor packaging and processing equipment with a positioning function. Background Art

[0002] Copper conductors refer to electronic components or structures made of copper materials, which are mainly used to transmit electrical energy or electrical signals. In order to ensure that electronic components can operate stably for a long time, they are generally potted through packaging equipment, so that the circuits on the electronic components and various electronic components are immersed in the potting glue. The solidified potting glue protects and dissipates heat for the circuits on the electronic components and various electronic components.

[0003] The patent with publication number CN220919775U discloses a device for quantitatively adding potting glue, including a workbench, a fixed seat is movably installed on the workbench, a glue tank is arranged directly above the fixed seat, a first slider is slidably connected to the upper surface of the workbench, a second motor is fixedly installed on the first slider, a rotating rod is connected to the end of the second motor, and the end of the rotating rod is fixedly connected to the fixed seat, an extrusion block is movably installed in the glue tank, a third connecting rod is connected to the middle of the extrusion block, the upper end of the third connecting rod is connected to the second connecting rod, a threaded block is arranged at one end of the second connecting rod, and the threaded block is screwed to the second threaded screw. This scheme controls the moving distance of the extrusion block in the glue tank by driving the second threaded screw to rotate, thereby controlling the amount of glue extruded by the extrusion block, thereby realizing quantitative addition of potting glue to its electronic components.

[0004] In the above scheme, only one group of electronic components can be fixed on the fixing seat at a time. Therefore, each time after a group of electronic components is sealed with glue, the group of electronic components needs to be removed before the next group of electronic components can be sealed with glue. This operation method has a low automation rate, resulting in a relatively low efficiency in the sealing of electronic components. For this reason, the present invention provides a copper conductor packaging and processing equipment with a positioning function. Summary of the invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The technical solution adopted by the present invention to solve the technical problem is as follows: the copper conductor packaging processing equipment with positioning function described in the present invention comprises a feeding mechanism, an L-shaped support plate is arranged on one side of the feeding mechanism, a metering pump is fixedly installed on one end of the L-shaped support plate, the outlet end of the metering pump is connected to the glue injection head, the inlet end of the metering pump is connected to the glue tank, and a discharging conveyor belt is arranged on the other end of the L-shaped support plate. The feeding mechanism comprises a frame, the lower end of the L-shaped support plate is fixedly connected to the frame, two sets of transmission shafts rotatably mounted on the frame, a main sprocket fixedly mounted on the transmission shaft, a chain bites the two sets of main sprockets, and a plurality of sets of shift forks for placing electronic components are distributed around the outer ring of the chain; By driving several groups of shift forks to make circular motion, the electronic components to be packaged can be continuously injected through the injection head, thereby realizing continuous packaging of the electronic components and improving the packaging efficiency of the electronic components. Secondly, through the coordinated setting of the shift fork, L-shaped support plate and discharge conveyor belt, the automatic unloading of the electronic components after injection can be realized, thereby improving the automation rate of the device.

[0007] Preferably, two sets of mounting grooves are provided on the L-shaped support plate, and a plurality of sets of rollers are rotatably installed in the mounting grooves at equal distances; The setting of the roller reduces the friction between the electronic components and the L-shaped pallet.

[0008] Preferably, the shift fork comprises a fork body, a chain is fixed at one end of the fork body, a slave correction plate is movably installed on both sides of the fork body, a main correction plate is movably plugged in the fork body, a movable plate is connected to both ends of the main correction plate, the movable plate is plugged in the slave correction plate, an active plate fixedly connected to the middle of the main correction plate, the active plate is movably plugged in the fork body, an elastic ring is sleeved on the active plate, rectangular grooves are provided on both sides of the fork body, the slave correction plate is plugged in the rectangular groove, two groups of guide grooves are provided on both sides of the slave correction plate, four groups of guide rails are provided in the rectangular groove, the guide grooves are slidably connected to the guide rails, an oblique slide groove is provided on the movable plate, a pin shaft is provided in the slave correction plate, the pin shaft is located in the oblique slide groove, a roller is rotatably installed on the end of the active plate, a trapezoidal plate is fixedly installed on the frame, and an inclined surface for pushing the roller is provided at one end of the trapezoidal plate; Under the guidance of the oblique slide groove, the slave correction plate moves along the guide rail toward the electronic component, so that the electronic component is limited between the slave correction plate, the main correction plate and the L-shaped support plate, which not only ensures the accuracy of limiting and transporting the electronic component, but also improves the placement efficiency of the electronic component.

[0009] Preferably, a curing mechanism is provided on the L-shaped support plate, the curing mechanism comprises a curing box, the curing box is fixedly mounted on the L-shaped support plate, two groups of resistance wire heaters are mounted on the upper end of the curing box, three groups of transmission rollers are rotatably mounted in the curing box, the three groups of transmission rollers are all meshed with synchronous toothed belts, the curing mechanism also comprises two groups of gears, the two groups of gears are meshed with each other, one group of gears is fixedly mounted on the end of one group of transmission rollers, the other group of gears is fixedly mounted on one end of the driven shaft, a slave sprocket is mounted on the other end of the driven shaft, the slave sprocket bites the chain, and the driven shaft is rotatably mounted on the bottom of the L-shaped support plate; The electronic components will directly enter the curing box. At this time, the two sets of resistance wire heaters have increased the temperature inside the curing box. The increased temperature inside the curing box will accelerate the curing of the potting glue, reduce the fluidity of the potting glue, and improve the packaging effect of the electronic components.

[0010] The beneficial effects of the present invention are as follows: 1. By driving several groups of forks to make circular motion, the electronic components to be packaged can be continuously injected through the injection head, thereby realizing continuous packaging of electronic components and improving the packaging efficiency of electronic components. Secondly, through the coordinated setting of the fork, L-shaped support plate and discharge conveyor belt, the electronic components after injection can be automatically unloaded, thereby improving the automation rate of the device.

[0011] 2. Before the staff puts the electronic components into the fork body, the design size of the fork body is larger than the electronic components themselves, so that the staff can place the electronic components on the fork body very easily. Then, as the shift fork makes a circular motion, the roller on the shift fork will be squeezed by the inclined surface of one end of the trapezoidal plate, so that the roller drives the active plate to move toward the inside of the fork body, and the active plate compresses the elastic ring. At the same time, the active plate drives the main correction plate to squeeze the electronic components, and the two sets of movable plates move together with the main correction plate. As the movable plate moves, the pin shaft in the slave correction plate will move along the oblique groove on the movable plate. Under the guidance of the oblique groove, the slave correction plate moves along the guide rail toward the electronic components, so that the electronic components are limited between the slave correction plate, the main correction plate and the L-shaped support plate, which not only ensures the accuracy of limiting and carrying the electronic components, but also improves the placement efficiency of the electronic components.

[0012] 3. After the electronic components are injected with glue, they will directly enter the curing box. At this time, the two sets of resistance wire heaters have increased the temperature inside the curing box. The increase in the temperature inside the curing box will accelerate the curing of the potting glue, reduce the fluidity of the potting glue, and improve the packaging effect of the electronic components. At the same time, the sprocket will rotate with the circular motion of the chain, and then the sprocket will drive the driven shaft together with a set of gears to rotate. The gear rotates the corresponding transmission roller through another set of gears, and the transmission roller drives the synchronous toothed belt to make a circular motion. As the synchronous toothed belt makes a circular motion, the electronic components after injection will move to the bottom of the synchronous toothed belt, and the upper end of the electronic component will squeeze the outer ring of the synchronous toothed belt, so that the upper end of the electronic component is blocked by the synchronous toothed belt, so that the electronic component will not overflow from the electronic component during the heating and movement process inside the curing box, further improving the packaging effect of the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be further described below in conjunction with the accompanying drawings.

[0014] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0015] Figure 2 It is a schematic diagram of the combination of the transmission shaft, main sprocket, chain, shift fork, L-shaped support plate, glue injection head, discharge conveyor belt and electronic components of the present invention.

[0016] Figure 3 It is a schematic diagram of the L-shaped support plate, electronic components and shift fork assembly of the present invention.

[0017] Figure 4 It is a schematic diagram of the chain, shift fork and electronic components of the present invention.

[0018] Figure 5 It is a cross-sectional schematic diagram of the shift fork of the present invention.

[0019] Figure 6 It is a schematic diagram of the cutaway fork body and the correction plate assembly of the present invention.

[0020] Figure 7 It is a schematic diagram of the combination of the feeding mechanism, the glue injection head and the discharging conveyor belt of the present invention.

[0021] Figure 8 It is a schematic diagram of the combination of the glue injection head, the discharging conveyor belt, the curing mechanism, the chain and the shift fork of the present invention.

[0022] Fig. 9 This is a schematic diagram of the combination of the curing mechanism, chain and shift fork from another perspective of the present invention.

[0023] In the figure: 1, feeding mechanism; 2, L-shaped support plate; 201, roller; 202, mounting groove; 3, metering pump; 4, glue injection head; 5, glue tank; 6, discharging conveyor belt; 7, curing mechanism; 8, electronic components; 101, frame; 1011, trapezoidal plate; 1012, inclined plane; 102, transmission shaft; 103, main sprocket; 104, chain; 105, fork; 1051, fork body; 511, rectangular groove; 5 12. Guide rail; 1052. Slave correction plate; 521. Pin shaft; 522. Guide groove; 1053. Main correction plate; 531. Oblique slide groove; 1054. Movable plate; 1055. Active plate; 551. Roller; 1056. Elastic ring; 701. Curing box; 702. Resistance wire heater; 703. Transmission roller; 704. Slave sprocket; 705. Driven shaft; 706. Gear; 707. Synchronous belt. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0025] Embodiment 1 like Figures 1 to 3As shown, the copper conductor packaging processing equipment with a positioning function of an embodiment of the present invention includes a feeding mechanism 1, an L-shaped support plate 2 is arranged on one side of the feeding mechanism 1, a metering pump 3 is fixedly installed on one end of the L-shaped support plate 2, the outlet end of the metering pump 3 is connected to a glue injection head 4, and the inlet end of the metering pump 3 is connected to a glue tank 5, and a discharge conveyor belt 6 is arranged at the other end of the L-shaped support plate 2. The feeding mechanism 1 includes a frame 101, the lower end of the L-shaped support plate 2 is fixedly connected to the frame 101, two groups of transmission shafts 102 rotatably mounted on the frame 101, a main sprocket 103 fixedly mounted on the transmission shaft 102, a chain 104 bites the two groups of main sprockets 103, and a plurality of groups of forks 105 for placing electronic components 8 are distributed around the outer ring of the chain 104.

[0026] Specifically, the discharge conveyor belt 6 is a conveyor belt device in the prior art, and the potting glue is stored in the glue tank 5. When the electronic component 8 needs to be packaged, the electronic component 8 is placed in an empty group of forks 105, and the fork 105 is located behind the glue injection head 4, and one end face and the bottom face of the fork 105 are respectively attached to two groups of mutually perpendicular surfaces on the L-shaped support plate 2, and then a group of transmission shafts 102 are driven by a motor to rotate, and the transmission shaft 102 drives the chain 104 together with a plurality of groups of forks 105 to make a circular motion, and the electronic component 8 to be packaged moves with the fork 105, and the attached Figure 2 The direction indicated by the middle arrow is the circular motion direction, until the electronic component 8 to be packaged moves to the bottom of the glue injection head 4, then the fork 105 is stopped, and then the metering pump 3 is started, the metering pump 3 extracts the potting glue from the glue tank 5, and injects a certain amount of potting glue into the electronic component 8 through the glue injection head 4. During this process, the staff can continue to place the electronic component 8 to be packaged into the next set of forks 105. After the glue injection of the electronic component 8 is completed, the fork 105 is continued to be driven to make a circular motion, and the electronic components 8 to be packaged pass under the glue injection head 4 one by one. When the electronic components 8 after glue injection move to the discharge conveyor belt 6, the glue injection head 4 is in the process of injecting glue to the electronic component 8. The discharging conveyor belt 6 is moved to convey the electronic components 8 after the injection of glue, so that the electronic components 8 after the injection of glue not only automatically detach from the fork 105, but also convey the electronic components 8 after the injection of glue to the next set of processes, and then the above operation is repeated in a cycle. Compared with the prior art, by driving several groups of forks 105 to make circular motions, the electronic components 8 to be packaged can be continuously injected with glue through the injection head 4, thereby realizing continuous packaging of the electronic components 8 and improving the packaging efficiency of the electronic components 8. Secondly, through the coordinated setting of the fork 105, the L-shaped support plate 2 and the discharging conveyor belt 6, the automatic unloading of the electronic components 8 after the injection of glue can be realized, thereby improving the automation rate of the device.

[0027] Furthermore, two groups of mounting grooves 202 are formed on the L-shaped support plate 2, and a plurality of groups of rollers 201 are rotatably mounted in the mounting grooves 202 at equal distances.

[0028] Specifically, when the fork 105 drives the electronic component 8 to move, one end surface of the electronic component 8 and the ground will move along two rows of rollers 201, and the moving electronic component 8 drives the rollers 201 to rotate. The setting of the rollers 201 reduces the friction between the electronic component 8 and the L-shaped support plate 2.

[0029] like Figures 4 to 7 As shown, the shift fork 105 includes a fork body 1051, one end of the fork body 1051 is fixed with the chain 104, both sides of the fork body 1051 are movably installed with a slave correction plate 1052, the fork body 1051 is movably plugged with a main correction plate 1053, both ends of the main correction plate 1053 are connected with a movable plate 1054, the movable plate 1054 is plugged with the slave correction plate 1052, and an active plate 1055 fixedly connected to the middle of the main correction plate 1053 is movably plugged into the fork body 1051, an elastic ring 1056 is sleeved on the active plate 1055, and a rectangular Slot 511, the rectangular slot 511 is inserted into the correction plate 1052, two groups of guide slots 522 are opened on both sides of the correction plate 1052, four groups of guide rails 512 are arranged in the rectangular slot 511, the guide slots 522 are slidably connected to the guide rails 512, an oblique slide groove 531 is opened on the movable plate 1054, a pin shaft 521 is set in the correction plate 1052, the pin shaft 521 is located in the oblique slide groove 531, a roller 551 is rotatably installed at the end of the active plate 1055, a trapezoidal plate 1011 is fixedly installed on the frame 101, and an inclined surface 1012 for pushing the roller 551 is arranged at one end of the trapezoidal plate 1011.

[0030] Specifically, in order to ensure the accuracy of the fork 105 in limiting the position of the electronic component 8 and in carrying the electronic component 8, the size design between the fork 105 and the electronic component 8 will be relatively compact, which is not conducive to the staff to place the electronic component 8 into the fork 105, affecting the placement efficiency of the electronic component 8. Therefore, before the staff puts the electronic component 8 into the fork body 1051, the design size of the fork body 1051 is larger than the electronic component 8 itself, so that the staff can easily place the electronic component 8 on the fork body 1051, and then as the fork 105 makes a circular motion, the roller 551 on the fork 105 will be squeezed by the inclined surface 1012 at one end of the trapezoidal plate 1011, so that the roller 551 drives the active plate 1055 to move toward the inside of the fork body 1051, and the active plate 1055 compresses the elastic ring 1056, and at the same time the active plate 1055 drives the main correction plate 1053 to squeeze the electronic component 8, and And the two groups of movable plates 1054 move together with the main correction plate 1053. As the movable plate 1054 moves, the pin shaft 521 in the slave correction plate 1052 will move along the oblique slide groove 531 on the movable plate 1054. Under the guidance of the oblique slide groove 531, the slave correction plate 1052 moves along the guide rail 512 toward the electronic component 8, so that the electronic component 8 is limited between the slave correction plate 1052, the main correction plate 1053, and the L-shaped support plate 2, which not only ensures the accuracy of limiting and transporting the electronic component 8, but also improves the placement efficiency of the electronic component 8. When the electronic component 8 after glue injection moves to the discharge conveyor belt 6, the roller 551 will stagger the trapezoidal plate 1011, and under the rebound force of the elastic ring 1056, the slave correction plate 1052 and the main correction plate 1053 will release the limit on the electronic component 8, so that the electronic component 8 can be smoothly transported by the discharge conveyor belt 6.

[0031] Embodiment 2 like Figures 8 to 9 As shown, comparative example 1, wherein another embodiment of the present invention is: a curing mechanism 7 is arranged on the L-shaped pallet 2, the curing mechanism 7 comprises a curing box 701, the curing box 701 is fixedly mounted on the L-shaped pallet 2, two groups of resistance wire heaters 702 are mounted on the upper end of the curing box 701, three groups of transmission rollers 703 are rotatably mounted in the curing box 701, the three groups of transmission rollers 703 are all engaged with a synchronous toothed belt 707, the curing mechanism 7 also comprises two groups of gears 706, the two groups of gears 706 are engaged with each other, one group of gears 706 is fixedly mounted on the end of one group of transmission rollers 703, the other group of gears 706 is fixedly mounted on one end of a driven shaft 705, a slave sprocket 704 is mounted on the other end of the driven shaft 705, the slave sprocket 704 engages with the chain 104, and the driven shaft 705 is rotatably mounted on the bottom of the L-shaped pallet 2.

[0032] Specifically, the outer ring of the synchronous toothed belt 707 is coated with a layer of silicone rubber. The surface energy of silicone rubber is low and it is not easy to be adhered by the potting glue. After the potting glue is injected into the electronic component 8, the potting glue will not solidify immediately, and the potting glue still has good fluidity, resulting in the potting glue easily overflowing from the electronic component 8 during the transportation of the electronic component 8, affecting the packaging effect of the electronic component 8. Therefore, after the electronic component 8 is injected with glue, the electronic component 8 will directly enter the curing box 701. At this time, the two sets of resistance wire heaters 702 have increased the temperature inside the curing box 701. The increase in the temperature inside the curing box 701 will accelerate the curing of the potting glue, reduce the fluidity of the potting glue, and improve the packaging effect of the electronic component 8. At the same time, the sprocket 704 will As the circular motion chain 104 rotates, the sprocket 704 drives the driven shaft 705 together with a set of gears 706 to rotate. The gear 706 rotates the corresponding transmission roller 703 through another set of gears 706. The transmission roller 703 drives the synchronous toothed belt 707 to make a circular motion. As the synchronous toothed belt 707 makes a circular motion, the electronic component 8 after the injection of glue will move to the bottom of the synchronous toothed belt 707, and the upper end of the electronic component 8 will squeeze the outer ring of the synchronous toothed belt 707, so that the upper end of the electronic component 8 is blocked by the synchronous toothed belt 707, so that the electronic component 8 will not overflow from the electronic component 8 during the heating and movement of the electronic component 8 in the curing box 701, thereby further improving the packaging effect of the electronic component 8.

[0033] Working principle: electronic components 8 are placed in an empty set of forks 105, the forks 105 are located behind the glue injection head 4, and one end face and the bottom face of the forks 105 are respectively attached to two sets of mutually perpendicular surfaces on the L-shaped support plate 2, and then a set of transmission shafts 102 are driven by a motor to rotate, and the transmission shafts 102 drive the chains 104 together with several sets of forks 105 to make circular motions, and the electronic components 8 to be packaged move together with the forks 105 until the electronic components 8 to be packaged move to the bottom of the glue injection head 4, and then the movement of the forks 105 is stopped, and then the metering pump 3 is started, and the metering pump 3 extracts the potting glue from the glue tank 5, and injects a certain amount of potting glue through the glue injection head 4. The electronic components 8 are inserted into the electronic components 8. During this process, the staff can continue to place the electronic components 8 to be packaged into the next set of forks 105. After the electronic components 8 are injected with glue, the forks 105 are continued to be driven to make circular motions. The electronic components 8 to be packaged pass under the injection head 4 one by one. When the injected electronic components 8 move to the discharge conveyor belt 6, the injection head 4 is injecting glue to the electronic components 8. The discharge conveyor belt 6 is started to convey the injected electronic components 8 through the discharge conveyor belt 6, so that the injected electronic components 8 are not only automatically separated from the forks 105, but also the injected electronic components 8 are conveyed to the next set of processes, and then the above operation is repeated in a cycle. Before the staff puts the electronic component 8 into the fork body 1051, the design size of the fork body 1051 is larger than the electronic component 8 itself, so that the staff can easily place the electronic component 8 on the fork body 1051, and then as the fork 105 makes a circular motion, the roller 551 on the fork 105 will be squeezed by the inclined surface 1012 at one end of the trapezoidal plate 1011, so that the roller 551 drives the active plate 1055 to move toward the inside of the fork body 1051, and the active plate 1055 compresses the elastic ring 1056, and at the same time, the active plate 1055 drives the main correction plate 1053 to squeeze the electronic component 8, and the two sets of movable plates 1054 move together with the main correction plate 1053. The movable plate 1054 moves, and the pin shaft 521 in the slave correction plate 1052 moves along the oblique slide groove 531 on the movable plate 1054. Under the guidance of the oblique slide groove 531, the slave correction plate 1052 moves toward the electronic component 8 along the guide rail 512, so that the electronic component 8 is limited between the slave correction plate 1052, the main correction plate 1053, and the L-shaped support plate 2. When the electronic component 8 after the injection is moved to the discharge conveyor belt 6, the roller 551 will stagger the trapezoidal plate 1011. Under the rebound force of the elastic ring 1056, the slave correction plate 1052 and the main correction plate 1053 will release the limitation on the electronic component 8, so that the electronic component 8 can be smoothly conveyed by the discharge conveyor belt 6. After the electronic component 8 is injected with glue, the electronic component 8 will directly enter the curing box 701. At this time, the two groups of resistance wire heaters 702 have increased the temperature inside the curing box 701. The increase in the temperature inside the curing box 701 will accelerate the curing of the potting glue. At the same time, the sprocket 704 will rotate with the circular motion of the chain 104, and then the sprocket 704 will drive the driven shaft 705 together with a group of gears 706 to rotate. The gear 706 rotates the corresponding transmission roller 703 through another group of gears 706. The transmission roller 703 drives the synchronous toothed belt 707 to make a circular motion. As the synchronous toothed belt 707 makes a circular motion, the electronic component 8 after the injection of glue will move to the bottom of the synchronous toothed belt 707, and the upper end of the electronic component 8 will squeeze the outer ring of the synchronous toothed belt 707, so that the upper end of the electronic component 8 is blocked by the synchronous toothed belt 707, so that the potting glue will not overflow from the electronic component 8 during the heating and movement of the electronic component 8 in the curing box 701.

[0034] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A copper conductor packaging processing device with a positioning function, comprising a feeding mechanism (1), characterized in that: An L-shaped support plate (2) is provided on one side of the feeding mechanism (1); a metering pump (3) is fixedly mounted on one end of the L-shaped support plate (2); an outlet end of the metering pump (3) is connected to a glue injection head (4); an inlet end of the metering pump (3) is connected to a glue tank (5); and a discharge conveyor belt (6) is provided at the other end of the L-shaped support plate (2); The feeding mechanism (1) comprises: A frame (101), wherein the lower end of the L-shaped support plate (2) is fixedly connected to the frame (101); Rotating two sets of transmission shafts (102) mounted on the frame (101); A main sprocket (103) fixedly mounted on the transmission shaft (102); A chain (104), the chain (104) engaging the two sets of main sprockets (103); Several groups of shift forks (105) for placing electronic components (8) are distributed around the outer ring of the chain (104).

2. The copper conductor packaging processing equipment with positioning function according to claim 1, characterized in that: The L-shaped support plate (2) is provided with two groups of mounting grooves (202), and a plurality of groups of rollers (201) are rotatably mounted in the mounting grooves (202) at equal distances.

3. The copper conductor packaging processing equipment with positioning function according to claim 2, characterized in that: The shift fork (105) comprises: A fork body (1051), one end of the fork body (1051) fixing the chain (104); Correction plates (1052) are movably mounted on both sides of the fork body (1051); A main correction plate (1053) is movably inserted into the fork body (1051); Both ends of the main correction plate (1053) are connected to movable plates (1054), and the movable plates (1054) are plugged into the slave correction plate (1052); An active plate (1055) is fixedly connected to the middle part of the main correction plate (1053), and the active plate (1055) is movably inserted into the interior of the fork body (1051); An elastic ring (1056) sleeved on the active plate (1055).

4. The copper conductor packaging processing equipment with positioning function according to claim 3, characterized in that: Rectangular grooves (511) are provided on both sides of the fork body (1051), and the slave correction plate (1052) is plugged into the rectangular grooves (511).

5. The copper conductor packaging and processing equipment with positioning function according to claim 4, characterized in that: Two groups of guide grooves (522) are provided on both sides of the correction plate (1052), four groups of guide rails (512) are arranged in the rectangular groove (511), and the guide grooves (522) are slidably connected to the guide rails (512).

6. The copper conductor packaging processing equipment with positioning function according to claim 5, characterized in that: An oblique sliding groove (531) is provided on the movable plate (1054), a pin shaft (521) is provided in the correction plate (1052), and the pin shaft (521) is located in the oblique sliding groove (531).

7. The copper conductor packaging and processing equipment with positioning function according to claim 6, characterized in that: A roller (551) is rotatably mounted on the end of the active plate (1055), a trapezoidal plate (1011) is fixedly mounted on the frame (101), and an inclined surface (1012) for pushing the roller (551) is provided at one end of the trapezoidal plate (1011).

8. The copper conductor packaging and processing equipment with positioning function according to claim 7, characterized in that: The L-shaped support plate (2) is provided with a curing mechanism (7), and the curing mechanism (7) comprises: A curing box (701), the curing box (701) being fixedly mounted on the L-shaped support plate (2); Two groups of resistance wire heaters (702) are installed at the upper end of the curing box (701); Rotating three sets of transmission rollers (703) installed in the curing box (701); A synchronous toothed belt (707), wherein the three sets of transmission rollers (703) are all engaged with the synchronous toothed belt (707).

9. The copper conductor packaging processing equipment with positioning function according to claim 8, characterized in that: The curing mechanism (7) further comprises two groups of gears (706), the two groups of gears (706) meshing with each other, one group of gears (706) being fixedly mounted on the ends of a group of transmission rollers (703), and the other group of gears (706) being fixedly mounted on one end of a driven shaft (705), and a driven sprocket (704) being mounted on the other end of the driven shaft (705).

10. The copper conductor packaging processing equipment with positioning function according to claim 9, characterized in that: The driven sprocket (704) engages with the chain (104), and the driven shaft (705) is rotatably mounted on the bottom of the L-shaped support plate (2).

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