Fabric for electronic product packing material as well as production process and application of fabric

Abstract

The invention discloses a fabric for an electronic product packing material as well as a production process and application of the fabric. The fabric is formed by weaving warp yarns and weft yarns and comprises an upper gigging layer, a middle layer and a lower layer, the raising layer adopts a satin weave; the middle layer and the lower layer are formed by weaving easy-to-shrink yarns; the middle layer and the lower layer adopt plain weave, and the up-down interweaving rule of warp and weft yarns of the middle layer is opposite to the up-down interweaving rule of warp and weft yarns of the lower layer; the fabric is subjected to pre-shaping, raising, dyeing, drying, calendaring and sanding treatment; and the thickness of the fabric is less than 0.3 to 0.4 mm. The fabric for the electronic product packing material not only has the advantages of being thin in thickness, comfortable in hand feeling and the like, but also has the advantage of being variable in thickness, the thickness can be changed through fluffy fluff, fiber expansion and movement and the like when the fabric is heated and attached, so that grooves in the attached surface are filled, the stability in the length direction and the width direction can be kept, and the attaching effect of the packing material is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of textiles, and in particular to a fabric for electronic product packaging, and a production process and application thereof. Background Art

[0002] At present, electronic products are generally required to be thin and light, such as the keyboard packaging of tablet computers. Therefore, the thickness of the packaging materials and accessories of electronic products is generally required to be less than 0.45mm. In order to meet the requirements of thinness and lightness, and at the same time for beauty and comfortable feel, the existing electronic product packaging materials generally use impregnated non-woven fabrics; impregnated non-woven fabrics not only have high-density fluff but also have a thin thickness, but are harmful to the environment during the production process. When woven fabrics are bonded to electronic boards, due to the grooves on the electronic product boards, there will be uneven appearance marks after bonding, and they will also shrink greatly when heated, resulting in problems with the bonding of packaging materials. Summary of the invention

[0003] In order to solve the above technical problems, the purpose of the present invention is to provide a fabric for electronic product packaging and its production process and application; the fabric for electronic product packaging not only has the advantages of thin thickness and comfortable hand feel, but also has the characteristic of variable thickness. It can change the thickness through fluffy hair, fiber expansion and movement when heated and bonded, thereby filling the grooves on the bonding surface, and maintaining stability in length and width directions, thereby ensuring the bonding effect of the packaging material.

[0004] In order to achieve the above technical objectives and the above technical effects, the present invention is implemented through the following technical solutions:

[0005] A fabric for electronic product packaging, the fabric is woven with warp yarn and weft yarn, and comprises an upper pile layer, a middle layer and a lower layer; the pile layer adopts a satin weave; the middle layer and the lower layer are woven with easily shrinkable yarns; the middle layer and the lower layer adopt a plain weave, and the sinking and floating interweaving pattern of the warp and weft yarns of the middle layer is opposite to the sinking and floating interweaving pattern of the warp and weft yarns of the lower layer; the fabric is pre-shaped, piled, dyed, dried, calendered and sanded; the thickness of the fabric is below 0.3-0.4mm.

[0006] Furthermore, the yarn used in the upper pile layer is 50-60D / 144f polyester DTY yarn; the yarn used in the middle layer is 20-30D / 12F easy-shrink FDY yarn; and the yarn used in the lower layer is 20-30D / 12F easy-shrink FDY yarn.

[0007] Furthermore, the satin weave is a five-piece satin weave.

[0008] Furthermore, the yarns of the upper pile layer, the middle layer and the lower layer are woven in sequence in a ratio of 1:1:1.

[0009] Furthermore, the middle layer and the lower layer are both plain weave structures, wherein the starting warp and weft yarns of the middle layer have a sinking and floating interweaving pattern of: the warp yarns are one up and one down; and the starting warp and weft yarns of the lower layer have a sinking and floating interweaving pattern of: the warp yarns are one down and one up.

[0010] The present invention further provides a production process for fabrics used in electronic product packaging materials, which comprises the steps of grey cloth weaving, pre-forming, raising, dyeing, drying, calendering and sanding in sequence.

[0011] The production process of the fabric for electronic product packaging material includes the following steps:

[0012] (1) Grey fabric weaving: the upper pile layer of the grey fabric is woven with warp yarns and weft yarns in a satin weave, and the middle layer and the lower layer are woven with a plain weave; wherein the middle layer and the lower layer are woven with easily shrinkable yarns; the warp and weft yarns of the middle layer have a sinking and floating interweaving pattern opposite to that of the warp and weft yarns of the lower layer;

[0013] (2) Pre-setting: The grey fabric after raising is pre-set at a temperature of 150-160°C and a width of 160 cm;

[0014] (3) Raising: The pre-shaped grey fabric is raised using a raising machine at a speed of 15-20 m / min;

[0015] (4) Dyeing: dyeing the raised grey fabric, the dyeing process parameters are: dyeing temperature 130-140°C, heat preservation for 40 minutes; heating rate 0.8-1°C / min, cooling rate 1-1.2°C / min;

[0016] (5) Drying: Dry the dyed fabric at a temperature of 170-180°C and a width of 150 cm;

[0017] (6) Calendering: Calendering the fabric, calendering process parameters: temperature 50-60°C, pressure 8-10MPa, speed 20-25m / min;

[0018] (7) Sanding: The calendered fabric is sanded using a sanding machine. The sanding process parameters are: 600 mesh sandpaper, 1200-1500 rpm.

[0019] The present invention also provides an application of fabrics for electronic product packaging materials, wherein the fabrics for electronic product packaging materials are bonded to an electronic product board by hot melt adhesive; when thermally bonded, the fabrics for electronic auxiliary materials increase in thickness, but remain unchanged in length and width.

[0020] Beneficial effects of the present invention:

[0021] The fabric for electronic product packaging comprises an upper fleece layer, a middle layer and a lower layer; the upper fleece layer adopts satin weave, and after the fleece treatment, the floating long lines of the satin weave form short dense fleece, giving the fabric a more comfortable fleece feeling; the middle layer and the lower layer of the fabric are woven with easily shrinkable yarns, and the middle layer and the lower layer adopt plain weave, and the sinking and floating interweaving rule of the warp and weft yarns in the middle layer is opposite to the sinking and floating interweaving rule of the warp and weft yarns in the lower layer; the middle layer and the lower layer of the plain weave are plain weave, so that the fabric density is higher, and the middle layer and the lower layer of the fabric adopt easily shrinkable yarns, so that after heat setting and dyeing, The yarn shrinks completely, and because the two layers of warp and weft yarns have opposite sinking and floating interweaving patterns, the middle layer and the lower layer are tightened against each other to fix the structure; due to the shrinkage effect and the tensioning effect of the tissue, the density of the entire fabric is fixed after dyeing and drying. During calendering, the molecular chain segments of the fibers move and rearrange, and the gaps between the fibers are reduced, thereby reducing the overall thickness of the fabric. However, due to the fixed density, the shrinkage rate of the fabric will not change, thereby meeting the requirements of light thickness and ensuring the stability of the fabric in length and width.

[0022] When in use, the fabric is placed together with the hot-melt adhesive film on an electronic product board (such as a fiberglass board), and under the action of heat, the fabric is bonded to the electronic product board through the hot-melt adhesive; when heated, the fluff of the fabric becomes more fluffy under the action of heat than before heating, and the fibers in the yarn also expand and move under the action of heat, so that the spacing between the yarns is adjusted. These changes increase the thickness of the fabric, so that the grooves of the electronic product board can be filled, ensuring the flatness of the appearance after bonding; due to the locking of the fabric density, the process of heat bonding does not cause the fabric to shrink in width, that is, the length and width of the fabric do not change, thereby ensuring the bonding effect of the packaging material. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a diagram of the organizational structure of the fabric according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The technical solutions in the present invention will be described clearly and completely below in conjunction with specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] The invention provides a fabric for electronic product packaging material, which is woven by warp yarn and weft yarn, and comprises an upper pile layer, a middle layer and a lower layer; the pile layer adopts a satin weave; the middle layer and the lower layer are woven by easily shrinkable yarns; the middle layer and the lower layer adopt a plain weave, and the sinking and floating interweaving rule of the warp and weft yarns of the middle layer is opposite to the sinking and floating interweaving rule of the warp and weft yarns of the lower layer; the fabric is subjected to pre-forming, pile raising, dyeing, drying, calendering and sanding treatment; the thickness of the fabric is below 0.3-0.4mm.

[0026] The yarn used in the upper pile layer is 50-60D / 144f polyester DTY yarn; the yarn used in the middle layer is 20-30D / 12F easy-shrink FDY yarn; the yarn used in the lower layer is 20-30D / 12F easy-shrink FDY yarn.

[0027] The production process of the fabric for electronic product packaging material includes grey cloth weaving, pre-forming, raising, dyeing, drying, calendering and sanding in sequence.

[0028] Specifically, the production process of the fabric for electronic product packaging includes the following steps:

[0029] (1) Grey fabric weaving: the upper pile layer of the grey fabric is woven with warp yarns and weft yarns in a satin weave, and the middle layer and the lower layer are woven with a plain weave; wherein the middle layer and the lower layer are woven with easily shrinkable yarns; the warp and weft yarns of the middle layer have a sinking and floating interweaving pattern opposite to that of the warp and weft yarns of the lower layer;

[0030] (2) Pre-setting: The grey fabric after raising is pre-set at a temperature of 150-160°C and a width of 160 cm;

[0031] (3) raising the nap: using a raising machine to raise the grey fabric woven in step (1) at a speed of 15-20 m / min;

[0032] (4) Dyeing: dyeing the pre-shaped grey cloth, dyeing process parameters: dyeing temperature 130-140°C, heat preservation for 40 minutes; heating rate 0.8-1°C / min, cooling rate 1-1.2°C / min;

[0033] (5) Drying: Dry the dyed fabric at a temperature of 170-180°C and a width of 150 cm;

[0034] (6) Calendering: Calendering the fabric, calendering process parameters: temperature 50-60°C, pressure 8-10MPa, speed 20-25m / min;

[0035] (7) Sanding: The calendered fabric is sanded using a sanding machine. The sanding process parameters are: 600 mesh sandpaper, 1200-1500 rpm.

[0036] Example

[0037] like Figure 1 As shown, the fabric for electronic product packaging in this embodiment is woven with warp yarn and weft yarn, and includes an upper pile layer, a middle layer and a lower layer; in this embodiment, the upper pile layer adopts a five-piece satin weave; the middle layer and the lower layer are woven with easily shrinkable yarns; the middle layer and the lower layer adopt a plain weave, and the sinking and floating interweaving pattern of the warp and weft yarns in the middle layer is opposite to the sinking and floating interweaving pattern of the warp and weft yarns in the lower layer; the fabric is pre-shaped, piled, dyed, dried, calendered and sanded; the thickness of the fabric is 0.3mm.

[0038] In this embodiment, the yarn used in the upper pile layer is 55D / 144f regenerated polyester DTY yarn; the yarn used in the middle layer is 20D / 12F regenerated easy-shrink FDY yarn; and the yarn used in the lower layer is 20D / 12F regenerated easy-shrink FDY yarn.

[0039] In this embodiment, the yarns of the upper pile layer, the middle layer and the lower layer are woven sequentially in a ratio of 1:1:1.

[0040] In this embodiment, the middle layer and the lower layer are both plain weave structures, wherein the starting warp and weft yarns of the middle layer have a sinking and floating interweaving pattern of: the warp yarns are one up and one down; the starting warp and weft yarns of the lower layer have a sinking and floating interweaving pattern of: the warp yarns are one down and one up.

[0041] Specifically, the fabric structure is as follows Figure 1 As shown. Among them, ■ is the warp weave point, that is, the warp yarn is on the top and the weft yarn is on the bottom; □ is the weft weave point, that is, the weft yarn is on the top and the warp yarn is on the bottom. A basic weave of this fabric is woven with 30 warp yarns and 30 weft yarns, among which the 1st, 4th, 7th, 10th, 13th, 16th, 19th, 22nd, 25th, 28th warp yarns and the 1st, 4th, 7th, 10th, 13th, 16th, 19th, 22nd, 25th, 28th weft yarns are woven into the upper pile layer according to the satin weave; the satin weave has floating long lines; the 2nd, 5th, 8th, 11th, 14th, 17th, 20th, 23rd, 26th, 29th The 3rd, 6th, 9th, 12th, 15th, 18th, 21st, 24th, 27th and 30th warp yarns and the 3rd, 6th, 9th, 12th, 15th, 18th, 21st, 24th, 27th and 30th weft yarns are used to weave the lower layer, and the warp point pattern is: one up and one down in sequence.

[0042] Specifically, the production process of the fabric for electronic product packaging includes the following steps:

[0043] (1) Grey cloth weaving: warp and weft yarns are used according to Figure 1 The satin weave shown is woven into the upper pile layer of the grey cloth, and the middle and lower layers are woven according to the plain weave shown;

[0044] (2) Pre-setting: The grey fabric after raising is pre-set at a temperature of 150°C and a width of 160 cm;

[0045] (3) raising: raising the grey fabric woven in step (1) by using a raising machine, with a fabric speed of 17 m / min;

[0046] (4) Dyeing: dyeing the pre-shaped grey fabric, the dyeing process parameters are as follows: dyeing temperature 130°C, heat preservation for 40 minutes; heating rate 0.8°C / min, cooling rate 1°C / min;

[0047] (5) Drying: Dry the dyed fabric at a temperature of 170°C and a width of 150 cm;

[0048] (6) Calendering: The fabric is calendered. The calendering process parameters are: temperature 50°C, pressure 8MPa, speed 20m / min. After calendering, the fabric thickness is less than 0.3-0.4mm.

[0049] (7) Sanding: The calendered fabric is sanded using a sanding machine, with the sanding process parameters being 600 mesh sandpaper and 1200 rpm.

[0050] The thickness of the fabric obtained in this embodiment is 0.35 mm.

[0051] Fabric thermal test

[0052] The fabric of the above embodiment was placed in an oven for baking, and the baking conditions were: baking the fabric flat at 70°C for 1 minute, and then baking at 180°C for 1 minute. After testing, the thickness of the fabric increased to 0.4 mm, and the yarn density and width (length and width) of the fabric were almost unchanged.

[0053] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

[0054] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A fabric for electronic product packaging, characterized in that: The fabric is woven with warp yarns and weft yarns, and comprises an upper pile layer, a middle layer and a lower layer; the pile layer adopts a satin weave; the middle layer and the lower layer are woven with easily shrinkable yarns; the middle layer and the lower layer adopt a plain weave, and the sinking and floating interweaving pattern of the warp and weft yarns of the middle layer is opposite to the sinking and floating interweaving pattern of the warp and weft yarns of the lower layer; the fabric is pre-shaped, piled, dyed, dried, calendered and sanded; the thickness of the fabric is less than 0.3-0.4mm.

2. The fabric for electronic product packaging according to claim 1, characterized in that: The yarn used in the upper pile layer is 50-60D / 144f polyester DTY yarn; the yarn used in the middle layer is 20-30D / 12F easy-shrink FDY yarn; the yarn used in the lower layer is 20-30D / 12F easy-shrink FDY yarn.

3. The fabric for electronic product packaging according to claim 1, characterized in that: The satin weave is a five-piece satin weave.

4. The fabric for electronic product packaging according to claim 1, characterized in that: The yarns of the upper pile layer, the middle layer and the lower layer are woven in sequence in a ratio of 1:1:

1.

5. The fabric for electronic product packaging according to claim 1, characterized in that: The middle layer and the lower layer are both plain weave.

6. A production process for the fabric for electronic product packaging as claimed in any one of claims 1 to 5, characterized in that: It includes the following steps: grey cloth weaving, pre-setting, raising, dyeing, drying, calendering and sanding.

7. The production process of fabrics for electronic product packaging according to claim 6, characterized in that: The steps include: (1) Grey fabric weaving: the upper pile layer of the grey fabric is woven with warp yarns and weft yarns in a satin weave, and the middle layer and the lower layer are woven with a plain weave; wherein the middle layer and the lower layer are woven with easily shrinkable yarns; the warp and weft yarns of the middle layer have a sinking and floating interweaving pattern opposite to that of the warp and weft yarns of the lower layer; (2) Pre-setting: The grey fabric after raising is pre-set at a temperature of 150-160°C and a width of 160 cm; (3) Raising: Raising the grey fabric after pre-setting; (4) Dyeing: dyeing the raised grey fabric, the dyeing process parameters are: dyeing temperature 130-140°C, heat preservation for 40 minutes; heating rate 0.8-1°C / min, cooling rate 1-1.2°C / min; (5) Drying: Dry the dyed fabric at a temperature of 170-180°C and a width of 150 cm; (6) Calendering: Calendering the fabric, calendering process parameters: temperature 50-60°C, pressure 8-10MPa, speed 20-25m / min; (7) Sanding: The calendered fabric is sanded using a sanding machine. The sanding process parameters are: 600 mesh sandpaper, 1200-1500 rpm.

8. The use of the fabric for electronic product packaging according to any one of claims 1 to 5, characterized in that: The fabric for electronic product packaging is attached to the electronic product board by hot melt adhesive; when hot-attached, the fabric for electronic product packaging increases in thickness but does not change in length and width.

Images