Thin-film capacitor, capacitor assembly and capacitor assembly preparation method

Abstract

The invention provides a thin-film capacitor, a capacitor assembly and a capacitor assembly preparation method. The thin-film capacitor is simple in structure, and the preparation process is simple and convenient. The capacitor structure comprises a first thin film layer, a second thin film layer and a capacitor core, the first thin film layer comprises a first metal layer and a first film layer, the first film layer is stacked on one side of the first metal layer and connected with the first metal layer, and the second film layer is stacked on the other side of the first metal layer and connected with the second metal layer. The first thin film layer comprises a first metal layer and a first film layer, the second thin film layer comprises a second metal layer and a second film layer, the second film layer is stacked on one side of the second metal layer and connected with the second metal layer, and the first thin film layer and the second thin film layer are stacked and jointly wound on the capacitor core.

Description

Technical Field

[0001] The present application relates to the technical field of capacitors, and in particular to a thin film capacitor, a capacitor assembly, and a method for preparing the capacitor assembly. Background Art

[0002] Capacitor components are one of the essential basic components in electronic circuits. Their importance lies in their ability to store electrical energy and release it when needed. This unique function makes capacitor components play a key role in various electronic devices and systems, which also makes capacitor components used in multiple industries and technical fields. Although existing capacitor components store electrical energy and release it when needed, the process of preparing existing capacitor components is complicated and costly. Summary of the invention

[0003] One advantage of the present application is that it provides a thin film capacitor, a capacitor assembly, and a method for preparing a capacitor assembly. The thin film capacitor and the capacitor assembly have simple structures and a simple preparation process.

[0004] Another advantage of the present application is to provide a thin film capacitor, a capacitor assembly, and a method for preparing a capacitor assembly, wherein in order to achieve the above advantages, no complex structure or expensive materials are required in the present application. Therefore, the present application successfully and effectively provides a solution, not only providing a simple thin film capacitor, a capacitor assembly, and a method for preparing a capacitor assembly, but also increasing the practicality and reliability of the thin film capacitor, the capacitor assembly, and the method for preparing a capacitor assembly.

[0005] Based on this, in order to achieve at least one of the above advantages or other advantages and purposes of the present application, the present application provides a thin film capacitor including:

[0006] A capacitor structure and a capacitor housing, wherein the capacitor structure comprises a first film layer, a second film layer and a capacitor core, wherein the first film layer comprises a first metal layer and a first film layer, wherein the first film layer is stacked on one side of the first metal layer and connected to the first metal layer, wherein the second film layer comprises a second metal layer and a second film layer, wherein the second film layer is stacked on one side of the second metal layer and connected to the second metal layer, wherein the first film layer and the second film layer are stacked and wound together on the capacitor core;

[0007] The capacitor housing includes a housing body and two leads, the two leads are fixed to the housing body, the housing body has a first hollow space, the capacitor structure is arranged in the first hollow space, the capacitor structure is connected to the inner wall of the housing body, and the two leads are connected to the first film layer or the second film layer.

[0008] With such configuration, the areas of the first metal layer and the second metal layer are larger, which reduces the occurrence of metal layer failure due to wear and tear, and increases the service life of the thin film capacitor.

[0009] According to one embodiment of the present application, the first film layer and the second film layer are stacked in such a manner that a side of the first film layer away from the first metal layer is stacked on a side of the second metal layer away from the second film layer. Such a configuration can prevent conduction between the first film layer and the second film layer, thereby preventing the thin film capacitor from short-circuiting.

[0010] According to an embodiment of the present application, the two leads are leads with a bent portion, and the two leads include a positive electrode lead and a negative electrode lead.

[0011] Compared with the solution in which the two leads do not have bending portions, the bending portions of the two leads with bending portions can not only offset stress and absorb vibration, but also improve heat dissipation efficiency.

[0012] According to one embodiment of the present application, a truss structure is provided on the surface of one end of the capacitor casing away from the first hollow space, and the truss structure includes two truss plates arranged at both ends of the surface, and the two truss plates together constitute a supporting surface for supporting the capacitor casing. Compared with a solution without a truss structure, the solution with a truss structure has a smaller contact area between the capacitor casing and the plane and the same area of ​​the supporting surface, and is more suitable for different placement environments.

[0013] According to another aspect of the present application, the present application further provides a capacitor component comprising:

[0014] One or more of the above-mentioned film capacitors;

[0015] a component housing having a second hollow space;

[0016] A resin layer, wherein the resin layer has one or more through spaces matching the capacitor housing;

[0017] A heat dissipation base plate, the heat dissipation base plate is arranged in the second hollow space of the component housing, and one side of the heat dissipation base plate is provided with a pin groove structure matching the truss structure, the film capacitor is inserted in the through space and connected to the pin groove structure, the resin layer is in contact with the heat dissipation base plate, and the resin layer, the film capacitor and the heat dissipation base plate are all arranged in the second hollow space;

[0018] A busbar assembly is fixedly connected to the assembly housing and to the two leads.

[0019] Compared with the solution without the pin-slot structure, the solution with the pin-slot structure can make the connection between the film capacitor and the heat dissipation base plate more secure, thereby increasing the overall structural strength of the capacitor assembly.

[0020] According to one embodiment of the present application, the busbar assembly includes a first busbar, a second busbar, an insulating plate and a coating layer, the first busbar and the second busbar jointly clamp the insulating plate, and the coating layer wraps the first busbar, the second busbar and the insulating plate.

[0021] With such arrangement, the insulating plate and the coating layer can prevent conduction between the first busbar and the second busbar, thereby causing a short circuit in the capacitor assembly.

[0022] According to one embodiment of the present application, the first busbar and the second busbar both have hollow holes and welding holes, and the position of the hollow holes on the first busbar corresponds to the position of the welding holes on the second busbar, the position of the welding holes on the first busbar corresponds to the position of the hollow holes on the second busbar, the coating layer has wire-passing holes, the positions of the wire-passing holes correspond to the positions of the hollow holes and the welding holes, the positive lead is fixed to the welding hole on the first busbar, and the negative lead is fixed to the welding hole on the second busbar.

[0023] Such an arrangement can prevent the leads from connecting the first busbar and the second busbar, thereby short-circuiting the capacitor assembly, during the process of welding the two leads of the film capacitor to the first busbar and the second busbar respectively.

[0024] According to an embodiment of the present application, the welding hole is a hole with a hollow structure.

[0025] With such a configuration, compared with ordinary holes as welding holes, the welding holes are holes with a hollow structure, which can reduce the contact area between the busbar and the outside world, reduce heat loss during welding, and thus reduce the welding time, thereby preventing the thin film capacitor from being heated to an excessively high temperature due to excessive welding time, thereby preventing the thin film capacitor from being damaged.

[0026] According to another aspect of the present application, the present application further provides a method for preparing a capacitor assembly, which is used to prepare the above-mentioned capacitor assembly, comprising the following steps:

[0027] Providing a component housing, wherein the component housing has a hollow structure;

[0028] placing a metal heat sink in the component housing;

[0029] Placing the film capacitor on the metal heat sink;

[0030] Injecting liquid resin into the hollow structure in the component housing until the resin submerges the capacitor structure of the film capacitor, and allowing the resin to solidify;

[0031] Fix the pre-assembled busbar assembly to the upper end of the assembly housing opening, and allow the two leads of each film capacitor to pass through the holes in the busbar assembly;

[0032] The positive electrode lead and the negative electrode lead of the film capacitor are welded to the first busbar and the second busbar respectively to obtain the capacitor assembly.

[0033] With such a configuration, by injecting resin, not only the sealing of the film capacitor is completed, but also the resin layer is prepared. The resin layer has good thermal conductivity and can help the capacitor assembly to dissipate heat better.

[0034] According to one embodiment of the present application, the process of obtaining the pre-assembled busbar assembly includes the following steps:

[0035] The first busbar and the second busbar are used to clamp the insulating plate together for pressing;

[0036] Two insulating adhesive films are attached to the upper and lower surfaces of the first busbar and the second busbar, and the insulating adhesive films are heat-pressed to perform a packaging operation.

[0037] With such a configuration, the coating layer that wraps the first busbar, the second busbar and the insulating plate can be prepared, thereby reducing the contact area between the first busbar and the second busbar and the outside world, thereby reducing the occurrence of the situation where the first busbar and the second busbar are affected by unnecessary external factors and the performance of the capacitor assembly is affected.

[0038] The present application provides a thin film capacitor, a capacitor assembly, and a method for preparing a capacitor assembly. Compared with existing thin film capacitors and capacitor assemblies, the thin film capacitor and capacitor assembly provided by the present application have simpler structures, and the process of preparing the capacitor assembly is also simpler.

[0039] Specifically, in the film capacitor provided in the present application, the shell body accommodates and protects the capacitor structure and two leads to prevent the film capacitor from being damaged by unnecessary external factors. The capacitor structure is formed by stacking two layers of thin films that have been metallized on one side and winding the capacitor core together. The two leads are connected to the film, and the two leads are fixed to the shell body. The two leads are respectively the positive and negative pins of the capacitor, which lays the foundation for connecting with the busbar assembly when preparing the capacitor assembly later. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 A three-dimensional schematic diagram of a thin film capacitor provided in one embodiment of the present application;

[0042] Figure 2 A schematic diagram showing the stacking of the first film layer and the second film layer according to the above embodiment of the present application is shown;

[0043] Figure 3 A schematic structural diagram of a capacitor structure according to the above embodiment of the present application is shown;

[0044] Figure 4 A three-dimensional schematic diagram of a capacitor assembly provided in another embodiment of the present application;

[0045] Figure 5 An exploded schematic diagram of a capacitor assembly according to the above embodiment of the present application is shown;

[0046] Figure 6 A schematic diagram showing the connection between the truss structure of the film capacitor and the pin-slot structure of the heat dissipation base plate according to the above embodiment of the present application is shown;

[0047] Figure 7 A schematic structural diagram of the hollow holes and welding holes of the busbar assembly according to the above embodiment of the present application is shown;

[0048] Figure 8 A schematic flow chart of a method for preparing a capacitor assembly provided in accordance with another embodiment of the present application.

[0049] Figure numerals: 1, capacitor assembly; 10, film capacitor; 11, capacitor structure; 111, first film layer; 1111, first metal layer; 1112, first film layer; 112, second film layer; 1121, second metal layer; 1122, second film layer; 113, capacitor core; 12, capacitor housing; 121, housing body; 122, lead; 1221, positive lead; 1222, negative lead; 123, truss structure; 1231, truss plate; 20, assembly housing; 30, resin layer; 40, heat dissipation base plate; 41, pin groove structure; 50, busbar assembly; 51, first busbar; 52 second busbar; 53, insulating plate; 54, coating layer; 55, hollow hole; 56, welding hole. DETAILED DESCRIPTION

[0050] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0051] Considering that the existing capacitor assembly can store electrical energy and release it when needed, the structure of the existing capacitor assembly is complex, and the process of preparing the existing capacitor assembly is complex and costly. In order to solve this problem, the present application provides a thin film capacitor, a capacitor assembly, and a method for preparing a capacitor assembly, which has a simpler structure and a simpler process than the prior art.

[0052] For details, please refer to the attached Figures 1 to 3 An embodiment of the present application provides a thin film capacitor 10 , which may include: a capacitor structure 11 and a capacitor housing 12 .

[0053] More specifically, the capacitor structure 11 includes a first film layer 111, a second film layer 112, and a capacitor core 113, wherein the first film layer 111 includes a first metal layer 1111 and a first film layer 1112, wherein the first film layer 1112 is stacked on one side of the first metal layer 1111 and connected to the first metal layer 1111, and the second film layer 112 includes a second metal layer 1121 and a second film layer 1122, wherein the second film layer 1122 is stacked on one side of the second metal layer 1121 and connected to the second metal layer 1121, and the first film layer 111 and the second film layer 1122 are connected to each other. Both film layers 112 are film layers that have been metallized on one side. The first film layer 111 and the second film layer 112 are stacked and wound together on the capacitor core 113. The capacitor housing 12 includes a housing body 121 and two leads 122. The two leads 122 are fixed to the housing body 121. The housing body 121 has a first hollow space. The capacitor structure 11 is arranged in the first hollow space of the housing body 121 and is connected to the inner wall of the housing body 121. The two leads 122 are connected to the first film layer 111 or the second film layer 112.

[0054] It is worth noting that the first metal layer 1111 and the second metal layer 1121 have a larger area, which reduces the occurrence of metal layer failure due to use loss and increases the service life of the thin film capacitor 10.

[0055] Optionally, the two leads 122 are leads 122 with a bent portion, and the two leads 122 include a positive electrode lead 1221 and a negative electrode lead 1222 .

[0056] It is worth noting that Figure 1 As shown, the bending portions of the two leads 122 can not only offset stress and absorb vibration, but also improve heat dissipation efficiency.

[0057] In terms of offsetting stress and absorbing vibration: This solution disperses the force applied to the structure by setting a curved shape, thereby reducing the stress in a single area, and the bent structure can change the path of the load so that the stress is more evenly distributed over the entire structure, thereby avoiding pressure overload in some areas of the lead 122, thereby reducing the risk of damage. Not only that, the bent portion can also enhance the stability of the structure. For example, the design of the arched bridge uses the curved shape to convert the load into compressive stress along the curved downward structure, thereby achieving effective force transmission.

[0058] In terms of improving heat dissipation efficiency: compared with the lead wire 122 without a bending portion per unit length, the lead wire 122 with a bending portion per unit length has a larger volume, which can not only lengthen the heat transfer path of the two leads 122, but also increase the heat dissipation area of ​​the two leads 122. This prevents the film capacitor 10 from being heated to an excessively high temperature due to a long welding time, thereby preventing the film capacitor 10 from being damaged.

[0059] It is worth noting that Figure 1 As shown, a truss structure 123 is provided on the surface of one end of the capacitor housing 12 away from the first hollow space, and the truss structure 123 includes two truss plates 1231 arranged at both ends of the surface, and the two truss plates 1231 together constitute a supporting surface for supporting the capacitor housing, which is used to place the film capacitor 10 stably on a plane. Compared with a solution without a truss structure 123, the capacitor housing 12 with the truss structure 123 has a smaller contact area with the plane and the area of ​​the supporting surface is the same, so it is more suitable for different placement environments.

[0060] It is worth noting that Figure 2 As shown, the first film layer 111 and the second film layer 112 are stacked in such a manner that a side of the first film layer 1112 away from the first metal layer 1111 is stacked on a side of the second metal layer 1121 away from the second film layer 1122. Such a configuration can prevent the first film layer 111 and the second film layer 112 from being electrically connected, thereby preventing the film capacitor 10 from being short-circuited.

[0061] In another embodiment of the present application, the first film layer 111 and the second film layer 112 are provided with a diaphragm, and the metallized side of the first film layer 111 is stacked close to the metallized side of the second film layer 112. Due to the diaphragm, the first film layer 111 and the second film layer 112 are conductive, so that a short circuit of the film capacitor 10 will not occur.

[0062] It is worth noting that the first metal layer 1111 and the second metal layer 1121 are obtained by metallizing the surfaces of the first film layer 1112 and the second film layer 1122, and the process of the metallization treatment includes but is not limited to chemical vapor deposition and physical vapor deposition. Specifically: Chemical vapor deposition: using gaseous precursor compounds, through chemical reactions in a high temperature environment, the gaseous precursor compounds are decomposed, thereby depositing metal on the surface of the film to form a metal layer; physical vapor deposition: a technology for depositing thin films on the surface of a substrate based on physical processes such as sputtering and evaporation, sputtering: in a high vacuum environment, using an inert gas (such as argon) to discharge a plasma to sputter the target metal (such as aluminum) atoms onto the surface of the film. This method can produce a uniform and dense metal layer, evaporation: by heating the metal source to evaporate it, the metal atoms are then deposited on the surface of the film. This method requires controlling the evaporation rate and vacuum to ensure the uniformity of the metal layer.

[0063] It is worth noting that Figure 2 As shown, the first metal layer 1111 and the second metal layer 1121 are not completely interlaced to enhance the performance of the thin film capacitor 10 .

[0064] In particular, the materials of the first film layer 111 and the second film layer 112 need to have a higher dielectric constant, a glass transition temperature, and a lower dielectric loss, such as polyphenylene sulfide (PPS). Polyphenylene sulfide is a high-performance engineering thermoplastic material with excellent high temperature resistance, chemical corrosion resistance and electrical properties. Polyphenylene sulfide is generated by the polymerization reaction of thiophenol and is often used in industrial environments requiring high heat resistance and chemical stability.

[0065] In another embodiment of the present application, a capacitor assembly 1 is also provided. Figures 4 to 6 As shown, including:

[0066] One or more of the above-mentioned film capacitors 10;

[0067] A component housing 20, wherein the component housing 20 has a second hollow space;

[0068] A resin layer 30, wherein the resin layer 30 has one or more through spaces matching the capacitor housing 12;

[0069] A heat dissipation base plate 40, the heat dissipation base plate 40 is arranged in the second hollow space of the component housing 20, and a pin groove structure 41 matching the truss structure 123 is provided on one side of the heat dissipation base plate 40, the film capacitor 10 is inserted into the through space and connected to the pin groove structure 41, the resin layer 30 is in contact with the heat dissipation base plate 40, and the resin layer 30, the film capacitor 10 and the heat dissipation base plate 40 are all arranged in the second hollow space;

[0070] The busbar assembly 50 is fixedly connected to the assembly housing 20 and fixedly connected to the two leads 122 .

[0071] It is worth noting that, compared with the solution without the pin groove structure 41 , the solution with the pin groove structure 41 can make the connection between the film capacitor 10 and the heat dissipation base plate 40 more secure, thereby increasing the overall structural strength of the capacitor assembly 1 .

[0072] In particular, the materials constituting the resin layer 30 include but are not limited to materials with good thermal conductivity such as epoxy resin, thermal conductive epoxy resin and thermal conductive plastic. The thermal conductive epoxy resin is prepared by adding thermal conductive fillers (such as aluminum oxide, boron nitride, graphite, etc.) to epoxy resin, and has better thermal conductivity than epoxy resin.

[0073] In particular, providing the resin layer 30 can not only increase the heat dissipation performance of the capacitor assembly 1 by virtue of the good thermal conductivity of the material constituting the resin layer 30 , but also increase the overall structural strength of the capacitor assembly 1 (compared to the capacitor assembly 1 without the resin layer 30 ).

[0074] It is worth noting that Figure 5 As shown, the busbar assembly 50 includes a first busbar 51, a second busbar 52, an insulating plate 53 and a coating layer 54. The first busbar 51 and the second busbar 52 jointly clamp the insulating plate 53, and the coating layer 54 wraps the first busbar 51, the second busbar 52 and the insulating plate 53. In this way, the insulating plate 53 and the coating layer 54 can prevent the first busbar 51 and the second busbar 52 from being conductive, thereby causing the capacitor assembly 1 to be short-circuited.

[0075] Alternatively, if Figure 7As shown, the first busbar 51 and the second busbar 52 both have a hollow hole 55 and a welding hole 56, and the position of the hollow hole 55 on the first busbar 51 corresponds to the position of the welding hole 56 on the second busbar 52, the position of the welding hole 56 on the first busbar 51 corresponds to the position of the hollow hole 55 of the second busbar 52, the coating layer 54 has a wire-passing hole, the position of the wire-passing hole corresponds to the position of the hollow hole 55 and the welding hole 56, the positive lead 1221 is fixed to the welding hole 56 on the first busbar 51, and the negative lead 1222 is fixed to the welding hole 56 on the second busbar 52.

[0076] In particular, if Figure 7 As shown, the diameters of the hollow hole 55 and the wire-passing hole are both larger than the diameter of the welding hole 56. This arrangement can prevent the leads 122 from conducting the first busbar 51 and the second busbar 52 during the process of welding the two leads 122 of the film capacitor 10 to the first busbar 51 and the second busbar 52, thereby short-circuiting the capacitor assembly 1.

[0077] It is worth noting that the positive lead 1221 is fixed to the welding hole 56 on the first busbar 51, and the negative lead 1222 is fixed to the welding hole 56 on the second busbar 52, so that the positive leads 1221 of all the thin film capacitors 10 are fixedly connected to the first busbar 51, and their negative leads 1222 are fixedly connected to the second busbar 52, thereby preventing the performance of the capacitor assembly 1 from being affected due to inconsistent connections of the leads 122.

[0078] Alternatively, if Figure 7 As shown, the welding hole 56 is a hole with a hollow structure.

[0079] It is worth noting that compared with the welding hole 56 which is an ordinary hole, the welding hole 56 is a hole with a hollow structure, which can reduce the contact area between the busbar and the outside world, reduce heat loss during welding, and thus reduce the welding time, thereby preventing the thin film capacitor 10 from being heated to an excessively high temperature due to excessive welding time, thereby preventing the thin film capacitor 10 from being damaged.

[0080] In other embodiments of the present application, Figure 8 As shown, a method for preparing a capacitor assembly 1 is provided, which is used to prepare the above-mentioned capacitor assembly 1, comprising the following steps:

[0081] Providing a component housing 20, wherein the component housing 20 has a hollow structure;

[0082] Placing a metal heat sink in the component housing 20;

[0083] Placing the film capacitor 10 on the metal heat sink;

[0084] Injecting liquid resin into the hollow structure in the component housing 20 until the resin submerges the capacitor structure 11 of the film capacitor 10, and allowing the resin to solidify;

[0085] The pre-assembled busbar assembly 50 is fixed to the upper end of the opening of the assembly housing 20, so that the two leads 122 of each film capacitor 10 pass through the holes in the busbar assembly 50;

[0086] The positive electrode lead 1221 and the negative electrode lead 1222 of the film capacitor 10 are welded to the first busbar 51 and the second busbar 52 respectively to obtain the capacitor assembly 1.

[0087] It is worth noting that by injecting the resin, not only the sealing of the film capacitor 10 is completed, but also the resin layer 30 is prepared. The resin layer 30 has good thermal conductivity and can help the capacitor assembly 1 to dissipate heat better.

[0088] In particular, in the present embodiment, the two leads 122 of the capacitor are respectively welded to the first busbar 51 and the second busbar 52 by selective wave soldering. Selective wave soldering can accurately select specific areas for welding, avoiding heat impact and solder joint contamination on areas that do not require welding, thereby reducing thermal shock to the capacitor assembly 1 and avoiding deformation or damage of various components in the capacitor assembly 1 due to high temperature.

[0089] It is worth noting that the process of obtaining the pre-assembled busbar assembly 50 includes the following steps:

[0090] The first busbar 51 and the second busbar 52 are used to clamp the insulating plate 53 and press them together;

[0091] Two insulating adhesive films are attached to the upper and lower surfaces of the first busbar 51 and the second busbar 52 , and the insulating adhesive films are heat-pressed to perform a packaging operation.

[0092] It is worth noting that, in this way, the coating layer 54 that wraps the first busbar 51, the second busbar 52 and the insulating plate 53 can be prepared, thereby reducing the contact area between the first busbar 51 and the second busbar 52 and the outside world, thereby reducing the occurrence of the first busbar 51 and the second busbar 52 being affected by unnecessary external factors and affecting the performance of the capacitor assembly 1.

[0093] In particular, in this embodiment, the insulating film is a PI (polyimide) film, which is a high-performance polymer material with excellent thermal stability, excellent mechanical strength, good electrical insulation performance and strong chemical stability, and is widely used in the fields of electronics, aerospace, automotive industry and composite materials. In other embodiments, the material of the insulating film includes but is not limited to other materials with good thermal stability, good mechanical strength, good electrical insulation performance and strong chemical stability.

[0094] The technical features of the above embodiments can be combined without changing the basic principles of the present application. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0095] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0096] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0097] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0098] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0099] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A film capacitor, characterized in that: The film capacitor comprises: A capacitor structure and a capacitor housing, wherein the capacitor structure comprises a first film layer, a second film layer and a capacitor core, wherein the first film layer comprises a first metal layer and a first film layer, wherein the first film layer is stacked on one side of the first metal layer and connected to the first metal layer, wherein the second film layer comprises a second metal layer and a second film layer, wherein the second film layer is stacked on one side of the second metal layer and connected to the second metal layer, wherein the first film layer and the second film layer are stacked and wound together on the capacitor core; The capacitor housing includes a housing body and two leads, the two leads are fixed to the housing body, the housing body has a first hollow space, the capacitor structure is arranged in the first hollow space, the capacitor structure is connected to the inner wall of the housing body, and the two leads are connected to the first film layer or the second film layer.

2. The film capacitor according to claim 1, characterized in that: The first film layer and the second film layer are stacked in such a manner that a side of the first film layer away from the first metal layer is stacked on a side of the second metal layer away from the second film layer.

3. The film capacitor according to claim 1, characterized in that: The two leads are leads with a bent portion, and the two leads include a positive electrode lead and a negative electrode lead.

4. The film capacitor according to claim 1, characterized in that: A truss structure is provided on the surface of one end of the capacitor housing away from the first hollow space. The truss structure includes two truss plates arranged at both ends of the surface. The two truss plates together constitute a supporting surface for supporting the capacitor housing.

5. A capacitor assembly, characterized in that: The capacitor assembly comprises: One or more film capacitors as claimed in any one of claims 1 to 4; a component housing having a second hollow space; A resin layer, wherein the resin layer has one or more through spaces matching the capacitor housing; A heat dissipation base plate, the heat dissipation base plate is arranged in the second hollow space of the component housing, and one side of the heat dissipation base plate is provided with a pin-slot structure matching the truss structure of the film capacitor, the film capacitor is inserted in the through space and connected to the pin-slot structure, the resin layer is in contact with the heat dissipation base plate, and the resin layer, the film capacitor and the heat dissipation base plate are all arranged in the second hollow space; A busbar assembly is fixedly connected to the assembly housing and to the two leads.

6. The capacitor assembly according to claim 5, characterized in that: The busbar assembly includes a first busbar, a second busbar, an insulating plate and a coating layer. The first busbar and the second busbar jointly clamp the insulating plate, and the coating layer wraps the first busbar, the second busbar and the insulating plate.

7. The capacitor assembly according to claim 6, characterized in that: The first busbar and the second busbar both have hollow holes and welding holes, and the positions of the hollow holes on the first busbar correspond to the positions of the welding holes on the second busbar, and the positions of the welding holes on the first busbar correspond to the positions of the hollow holes on the second busbar. The coating layer has wire-passing holes, and the positions of the wire-passing holes correspond to the positions of the hollow holes and the welding holes. The positive lead of the thin-film capacitor is fixed to the welding hole on the first busbar, and the negative lead of the thin-film capacitor is fixed to the welding hole on the second busbar.

8. The capacitor assembly according to claim 7, characterized in that: The welding hole is a hole with a hollow structure.

9. A method for preparing a capacitor assembly, characterized in that: The method for preparing the capacitor assembly according to any one of claims 4 to 8 comprises the following steps: Providing a component housing, wherein the component housing has a hollow structure; placing a metal heat sink in the component housing; Placing the film capacitor on the metal heat sink; Injecting liquid resin into the hollow structure in the component housing until the resin submerges the capacitor structure of the film capacitor, and allowing the resin to solidify; Fix the pre-assembled busbar assembly to the upper end of the assembly housing opening, and allow the two leads of each film capacitor to pass through the holes in the busbar assembly; The positive electrode lead and the negative electrode lead of the film capacitor are welded to the first busbar and the second busbar respectively to obtain the capacitor assembly.

10. The method for preparing a capacitor assembly according to claim 9, characterized in that: The process of obtaining the pre-assembled busbar assembly comprises the following steps: The first busbar and the second busbar are used to clamp the insulating plate together for pressing; Two insulating adhesive films are attached to the upper and lower surfaces of the first busbar and the second busbar, and the insulating adhesive films are heat-pressed to perform a packaging operation.

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