High-precision die bonder and use method thereof

Abstract

The invention belongs to the technical field of die bonders, and particularly relates to a high-precision die bonder and a use method of the high-precision die bonder. The gantry assembly is provided with a working table plate, side edge plates arranged on the two sides of the working table plate in the Y-axis direction, a gantry Y-axis assembly arranged on the top of each side edge plate, two gantry X-axis assemblies connected between the two gantry Y-axis assemblies in a sliding mode, a die bonding module connected to the first gantry X-axis assembly in a sliding mode, and a glue dipping module connected to the second gantry X-axis assembly in a sliding mode; the die bonding module is used for moving in a three-dimensional space to pick up a chip and placing the chip to a specified die bonding position; the glue dipping module is used for moving in a three-dimensional space, and glue is smeared on a specified die bonding position of a substrate placed on the working table plate. The using method comprises the steps of detecting the position of a chip on a wafer, picking up the chip, caching the chip, carrying out chip die bonding, and carrying out product glue dipping and dispensing. According to the invention, the die bonding precision of the chip is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of crystal bonding machines, and in particular relates to a high-precision crystal bonding machine and a use method thereof. Background Art

[0002] A die bonder is a semiconductor device that is mainly used for back-end mounting of semiconductor chips. Its working principle is to fix the chip and the electrical substrate together to form a reliable electrical connection between the chip and the substrate.

[0003] As chip sizes become smaller and smaller, the bonding accuracy of traditional die bonding equipment can only meet the requirements of traditional large-size chip bonding. For small chip sizes, there is a higher demand for the bonding accuracy of the equipment. The positioning of the chip and the substrate is an important link to ensure the accuracy of chip mounting and bonding.

[0004] Therefore, the present invention designs a new die bonding machine to solve the technical problem of improving the die bonding accuracy of chip mounting. Summary of the invention

[0005] In order to solve the above technical problem, that is, how to improve the chip bonding accuracy, the present invention provides the following technical solutions:

[0006] On the one hand, the present invention provides a high-precision crystal bonding machine, comprising a frame and a gantry assembly arranged on the top of the frame, the gantry assembly comprising a workbench, side panels arranged on both sides of the workbench in the Y-axis direction, a gantry Y-axis assembly arranged on the top of each side panel, and two gantry X-axis assemblies slidably connected between the two gantry Y-axis assemblies, the gantry Y-axis assembly being used to move the gantry X-axis assembly in the Y-axis direction, the crystal bonding machine also comprising a crystal bonding module slidably connected to the first gantry X-axis assembly and a glue dipping module slidably connected to the second gantry X-axis assembly, the crystal bonding module being used to move in three-dimensional space to pick up chips and place them in designated crystal bonding positions; the glue dipping module being used to move in three-dimensional space to apply glue to designated crystal bonding positions of a substrate placed on the workbench, and after the crystal bonding module places the chip at the crystal bonding position, the chip is fixed to the substrate.

[0007] Furthermore, the crystal bonding module includes a crystal bonding component and a crystal bonding vision component connected to the crystal bonding component, the crystal bonding vision component is used to locate the chip position using CCD technology, and the crystal bonding component is used to perform chip absorption, movement and placement; the crystal bonding component includes a crystal bonding lifting mechanism slidably connected to the first gantry X-axis component, and a bonding head mechanism installed on the crystal bonding lifting mechanism, the crystal bonding lifting mechanism is used to drive the bonding head mechanism to lift and lower in the Z-axis direction, and the bonding head mechanism is used to perform chip absorption, movement and placement; the bonding head mechanism includes a crystal bonding adjustment mechanism and a bonding head rotating component connected to the crystal bonding adjustment mechanism, and the crystal bonding adjustment mechanism is used to accurately adjust the position of the bonding head rotating component in the horizontal direction; the bonding head rotating component absorbs the chip through rotational movement and places the chip to the specified position; the crystal bonding vision component includes a crystal bonding vision lifting mechanism and a first CCD camera component connected to the crystal bonding vision lifting mechanism, and the crystal bonding vision lifting mechanism is responsible for driving the first CCD camera component to move up and down to capture the chip.

[0008] Furthermore, the crystal bonding lifting mechanism of the crystal bonding assembly includes a first motor bottom plate, a U-shaped linear motor arranged on the first motor bottom plate, a single mover follower block arranged on the mover of the U-shaped linear motor, a lifting follower block arranged on the single mover follower block, and a sliding mechanism connected to the inner side of the lifting follower block, and a bonding head mechanism is connected to the lifting follower block; under the drive of the U-shaped linear motor, the single mover follower block slides with the lifting follower block, thereby driving the bonding head mechanism to perform lifting movement;

[0009] The pop-up head rotating assembly comprises a DD motor connected to a solid crystal adjustment mechanism, a pop-up head seat connected below the DD motor, a group of cylinders connected to the top of the pop-up head seat, an air blowing block arranged between the cylinders, a voice coil motor arranged below the air blowing block, a pop-up head suction nozzle rod arranged at the bottom of the air blowing block, a suction nozzle connected to the bottom of the pop-up head suction nozzle rod, and a first spring passed through the pop-up head suction nozzle rod; the top of the air blowing block is connected to the top of the pop-up head seat, the top of the voice coil motor is connected to the top of the pop-up head seat; the pop-up head suction nozzle rod is slidably connected to the pop-up head seat, and a spring is passed through the pop-up head suction nozzle rod.

[0010] Furthermore, the glue dipping module includes a glue dipping component, a glue storage component connected to the glue dipping component, and a glue dipping vision component connected to the glue dipping component. The glue dipping component includes a glue dipping lifting mechanism slidably connected to the second gantry X-axis component, a glue dipping mechanism connected to the bottom of the glue dipping lifting mechanism, the glue dipping mechanism includes a glue dipping adjustment mechanism connected to the glue dipping lifting mechanism, a spring-type glue dipping mechanism connected to the glue dipping adjustment mechanism, and a glue dipping head connected to the end of the spring-type glue dipping mechanism; the glue storage component includes a glue storage motor component, a glue storage tray component connected to the bottom of the glue storage motor component, and the glue storage motor component is used to drive the glue storage tray component to rotate; the glue dipping vision component is used to use CCD technology to identify the specific position of glue dipping on the substrate, the glue dipping component drives the glue dipping head to move vertically and rotationally, and drives the glue dipping head to move to the glue storage tray of the glue storage tray component to rotate and dip glue, and after the glue dipping is completed, glue is applied to the designated solid crystal position of the substrate.

[0011] Furthermore, the spring-type glue dipping mechanism includes a glue dispensing head mounting plate, a glue dispensing sleeve mounting plate connected to the glue dispensing head mounting plate, a pressing plate connecting the glue dispensing head mounting plate and the bottom of the glue dispensing sleeve mounting plate, a spring pressure block connected to the glue dispensing head mounting plate and the top of the glue dispensing sleeve mounting plate, and a compression spring sleeved on the top of the spring pressure block; and the bottom of the glue dispensing sleeve mounting plate is connected to a glue dipping head.

[0012] Furthermore, the glue storage motor assembly includes a glue dipping mounting plate connected to the glue dipping lifting mechanism, a bearing mounting seat connected to the glue dipping mounting plate, a transmission shaft passing through the bearing mounting seat, a servo motor rotatably connected to the top of the transmission shaft, and a servo motor connected to the top of the bearing mounting seat; the glue storage tray assembly includes a glue storage tray connected to the bottom end of the transmission shaft, a micrometer connected to the top of the front side of the bearing mounting seat, a spring guide column connected to the bottom end of the front side of the bearing mounting seat, and a spring passing through the spring guide column, and the bottom of the micrometer is connected to the top of the spring guide column.

[0013] Furthermore, the rubber storage tray assembly also includes an adjustment fixing seat passing through the middle of the bottom end of the front side of the bearing mounting seat, a scraper connected to the bottom of the adjustment fixing seat, the top of the adjustment fixing seat is connected to the top of the spring guide column, and the bottom of the scraper contacts the top of the rubber storage tray; it also includes a rubber storage guide seat set at the bottom end of the front side of the bearing mounting seat, and a rubber storage block connected to the rubber storage guide seat, the adjustment fixing seat is enclosed in the rubber storage guide seat and the rubber storage block, and the adjustment fixing seat is in close contact with the rubber storage guide seat and the rubber storage block.

[0014] Furthermore, the crystal bonding machine also includes a wafer loading mechanism, a picking module, a cache module, a wafer-level camera module, and an upper vision module. The wafer loading mechanism is used to supply chips. The picking module is slidably connected to the end face of the workbench close to the wafer loading mechanism along the X-axis direction. The cache module is arranged on the inner walls of the side panels on both sides close to the picking module. The wafer-level camera module is located above the wafer loading mechanism. The wafer-level camera module is used to identify the position of the chip on the wafer in the wafer loading mechanism. The picking module is used to pick up the chip identified by the wafer-level camera module from the wafer and place the temporary cache chip on the cache module. The cache module waits for the crystal bonding module to pick up the cached chip.

[0015] Furthermore, the cache module includes a cache lifting mechanism arranged on the inner wall of the side panel, a cache component connected to the cache lifting mechanism, the cache component includes a cache follower block connected to the cache lifting mechanism, a cache vacuum plate connected to the top of the cache follower block, a mirror suction cup mounting plate connected to the top of the cache vacuum plate, and a mirror suction cup arranged on the mirror suction cup mounting plate, the mirror suction cup mounting plate is internally provided with a vacuum air duct ventilation, and the mirror suction cup mounting plate is externally provided with an air pipe joint for connecting to a vacuum source.

[0016] Furthermore, the wafer loading mechanism includes a wafer Y-axis base connected to the top, a wafer middle base slidably connected to the top of the wafer Y-axis base, a wafer X-movement plate slidably connected to the top of the wafer middle base, a turntable connected to the top of the wafer X-movement plate, and a crystal plate connected to the top of the turntable, and the turntable is connected to the driving mechanism through a belt transmission mechanism.

[0017] In one aspect, the present invention provides a method for using a die bonder, comprising the following steps:

[0018] Step S1, the wafer-level camera module identifies the wafer in the wafer loading mechanism and detects the specific position of each chip;

[0019] Step S2: The picking module moves to the corresponding chip position according to the detection result of the wafer-level camera module, and picks up the chip from the wafer;

[0020] Step S3: The picking module places the picked-up chip on the cache module to temporarily fix the chip;

[0021] Step S4, the solid crystal vision component uses CCD technology to locate the cached chip to ensure the accurate position of the chip;

[0022] Step S5, the die-bonding assembly absorbs the chip on the cache module through a rotational motion;

[0023] Step S6: After the nozzle of the die bonding component picks up the chip, the upper visual module checks the angle of the chip and adjusts the chip angle;

[0024] Step S8, the die-bonding vision component uses CCD technology again to locate the designated die-bonding position on the substrate;

[0025] Step S9, the die-bonding assembly places the chip precisely at a designated position on the substrate to complete the die-bonding operation;

[0026] The following steps are performed simultaneously with steps S4-S9:

[0027] Step S10, the glue storage motor assembly in the glue dipping module drives the glue storage disk to rotate, so that the glue is evenly distributed on the glue storage disk;

[0028] Step S11, the glue dipping visual component uses CCD technology to identify the specific position on the substrate where glue dipping is required;

[0029] Step S12, the glue dipping mechanism is driven down by the glue dipping mechanism, and the spring-type glue dipping mechanism contacts the glue storage tray and dips the glue; the glue dipping mechanism then moves to a designated position on the substrate, and the glue is precisely applied to the die-bonding position through the glue dipping head, providing the necessary adhesive for chip fixation.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] The crystal bonding module of the present invention moves precisely in three-dimensional space to pick up chips; synchronously, the glue dipping module moves in three-dimensional space, and after dipping glue, moves to the position on the substrate where glue needs to be applied. The crystal bonding module places the chip at the glue application position to complete automatic fixation of the chip. The present invention improves the crystal bonding accuracy of the chip.

[0032] The firm connection and support between the various components of the wafer-level camera adjustment base of the present invention ensure the stability of the camera during operation and reduce the impact of vibration and interference on image capture. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the three-dimensional structure of the crystal bonding machine of the present invention;

[0034] Figure 2 For the present invention Figure 1 The main view of

[0035] Figure 3 It is a three-dimensional structural schematic diagram of the crystal bonding machine of the present invention, omitting the frame and gantry assembly;

[0036] Figure 4 This is an exploded view of the die bonding machine of the present invention, omitting the frame;

[0037] Figure 5 It is a three-dimensional structural schematic diagram of the gantry assembly of the present invention;

[0038] Figure 6It is a schematic diagram of the three-dimensional structure of the die-bonding module of the present invention;

[0039] Figure 7 An exploded view of the die-bonding module of the present invention;

[0040] Figure 8 It is a schematic diagram of the three-dimensional structure of the die-bonding assembly of the present invention;

[0041] Fig. 9 It is a schematic diagram of the three-dimensional structure of the solid crystal visual component of the present invention;

[0042] Fig.10 It is a schematic diagram of the three-dimensional structure of the wafer-level camera module of the present invention;

[0043] Fig.11 It is a schematic diagram of the three-dimensional structure of the upper visual module of the present invention;

[0044] Fig.12 It is a schematic diagram of the three-dimensional structure of the pickup module of the present invention;

[0045] Fig.13 It is a schematic diagram of the three-dimensional structure of the crystal extraction assembly of the present invention;

[0046] Fig.14 It is a three-dimensional structural schematic diagram of the cache module of the present invention;

[0047] Fig.15 It is a three-dimensional structural schematic diagram of the wafer loading mechanism of the present invention;

[0048] Fig.16 It is one of the three-dimensional structural schematic diagrams of the ejector mechanism of the present invention;

[0049] Fig.17 The second schematic diagram of the three-dimensional structure of the ejector mechanism of the present invention;

[0050] Fig.18 An exploded view of the glue dipping module of the present invention;

[0051] Fig.19 It is a schematic diagram of the three-dimensional structure of the glue dipping component of the present invention;

[0052] Fig. 20 It is a three-dimensional structural schematic diagram of the spring-type glue dipping mechanism of the present invention;

[0053] Fig.21 It is a schematic diagram of the three-dimensional structure of the glue storage assembly of the present invention;

[0054] Fig. 22 It is a schematic diagram of the three-dimensional structure of the dipped glue visual component of the present invention.

[0055] Reference numerals:

[0056] 100 is a die bonder; 1 is a gantry assembly; 2 is a die bond module; 3 is a wafer-level camera module; 4 is an upper vision module; 5 is a pick-up module; 6 is a buffer module; 7 is a wafer loading mechanism; 8 is an ejector mechanism; 9 is a glue dipping module; 10 is a rack; 10-1 is a wafer loading base; 11 is a material taking assembly;

[0057] 1-1 is the workbench plate; 1-2 is the side plate; 1-3 is the gantry Y-axis assembly; 1-31 is the gantry Y-axis; 1-32 is the first linear motor; 1-33 is the first slider; 1-34 is the first guide rail; 1-35 is the gantry Y-axis sliding seat; 1-4 is the gantry X-axis assembly; 1-41 is the gantry X-axis crossbeam; 1-42 is the second guide rail; 1-43 is the second slider; 1-44 is the second linear motor; 1-45 is the gantry X-axis sliding plate; 1-5 is the gantry connecting seat; 2-1 is the crystal fixing assembly; 2-11 is the first motor base plate; 2-12 is the U-shaped linear Line motor; 2-13 is a single mover follower block; 2-14 is a lifting follower block; 2-15 is the third guide rail; 2-16 is the third slider; 2-17 is a solid crystal adjustment plate 1; 2-18 is a solid crystal adjustment plate 2; 2-19 is an adjustment screw 1; 2-110 is an adjustment screw 2; 2-111 is a DD motor; 2-112 is a bond head seat; 2-113 is a cylinder; 2-114 is a blowing block; 2-115 is a voice coil motor; 2-116 is a bond head nozzle rod; 2-117 is a nozzle; 2-118 is the first spring; 2-119 is a contact screw fixing seat;

[0058] 2-2 is a solid crystal vision component; 2-21 is a lifting base plate; 2-22 is a fourth guide rail; 2-23 is a fourth slider; 2-24 is a first ball screw; 2-25 is a nut follower block; 2-26 is a first servo motor; 2-27 is a support side; 2-28 is a fixed side; 2-29 is a lens holder; 2-210 is a first CCD camera component; 2-211 is a camera body; 2-212 is a lens; 2-213 is a light source holder; 2-214 is a coaxial light source; 2-215 is a ring light source;

[0059] 3 is a wafer-level camera module; 3-1 is a wafer-level camera adjustment seat; 3-11 is a visual fixing seat; 3-12 is a cross roller vertical plate; 3-13 is a wafer camera adjustment plate; 3-14 is an adjustment rod; 3-15 is a height fixing plate; 3-16 is a camera extension seat; 3-17 is a camera extension upper plate; 3-18 is a camera fixing seat; 3-19 is a lens height adjustment plate; 3-110 is a wafer ring light mounting plate; 3-111 is an adjustment fixing block; 3-2 is a second CCD camera assembly; 3-21 is a prism;

[0060] 4 is the upper vision module; 4-1 is the upper vision fixed adjustment seat; 4-2 is the third CCD camera assembly;

[0061] 5 is a pick-up module; 5-1 is a crystal-taking X-axis motion assembly; 5-11 is a crystal-taking X-axis crossbeam; 5-12 is a fifth guide rail; 5-13 is a fifth slider; 5-14 is a material-taking slider plate; 5-15 is a first motor mounting plate; 5-16 is a third linear motor; 5-2 is a crystal-taking assembly;

[0062] 6 is a cache module; 6-1 is a cache lifting mechanism; 6-11 is a cache module bottom plate; 6-12 is a second ball screw; 6-13 is a screw bearing seat; 6-14 is an active bearing seat; 6-15 is a synchronous wheel one; 6-16 is a motor mounting seat; 6-17 is a second servo motor; 6-18 is a synchronous wheel two; 6-19 is a sixth guide rail; 6-110 is a sixth slider; 6-111 is a conveyor belt one; 6-112 is a driven bearing seat; 6-113 is a cache module nut seat; 6-2 is a cache assembly; 6-21 is a cache follower block; 6-22 is a cache vacuum plate; 6-23 is a mirror suction cup mounting plate; 6-24 is a mirror suction cup;

[0063] 7 is a wafer loading mechanism; 7-1 is a wafer Y-axis base; 7-2 is a wafer middle seat; 7-3 is a wafer X-motion plate; 7-4 is a turntable; 7-5 is a wafer plate; 7-6 is a belt transmission mechanism; 7-61 is a synchronous wheel three; 7-62 is a synchronous wheel four; 7-63 is a synchronous wheel five; 7-64 is a pulley mounting plate; 7-65 is a connecting shaft; 7-66 is a conveyor belt two; 7-67 is a conveyor belt three; 7-8 is a motor mounting plate; 7-9 is a third servo motor;

[0064] 8 is an ejector mechanism; 8-1 is an ejector adjustment seat assembly; 8-2 is an ejector assembly; 8-11 is an ejector base; 8-12 is an ejector adjustment plate 1; 8-13 is an ejector adjustment plate 2; 8-14 is an ejector intermediate plate; 8-15 is a waist hole connecting piece; 8-21 is an ejector mounting frame; 8-23 is an ejector bearing seat; 8-24 is an ejector cap adjustment seat; 8-25 is an ejector cap; 8-26 is a U-shaped voice coil motor; 8-27 is an ejector shaft assembly;

[0065] 9 is a glue dipping module; 9-1 is a glue dipping component; 9-2 is a glue storage component; 9-3 is a glue dipping visual component; 9-11 is a glue dipping lifting mechanism; 9-12 is a glue dipping adjustment block; 9-13 is a glue dipping adjustment plate; 9-14 is a fourth servo motor; 9-15 is a glue dispensing sleeve bracket; 9-16 is a spring-type glue dipping mechanism; 9-161 is a glue dispensing head mounting plate; 9-162 is a glue dispensing sleeve mounting plate; 9-163 is a pressing sheet; 9-164 is a spring pressing block; 9-165 is a compression spring; 9-17 is a glue dipping head;

[0066] 9-21 is a glue storage motor assembly; 9-22 is a glue dipping mounting plate; 9-23 is a bearing mounting seat; 9-24 is a transmission shaft; 9-25 is the fifth servo motor; 9-26 is a contour plate; 9-27 is a second motor mounting plate; 9-28 is a glue storage tray; 9-29 is a micrometer; 9-210 is a spring guide column; 9-211 is a second spring; 9-212 is a glue storage block; 9-213 is an adjustment fixing seat; 9-214 is a scraper; 9-215 is a glue storage guide seat. DETAILED DESCRIPTION

[0067] The technical solution of the present invention will be clearly described below in conjunction with the accompanying drawings. Obviously, the described embodiments are not all embodiments of the present invention, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the protection scope of the present invention.

[0068] It should be noted that the directions or positional relationships indicated by terms such as “center”, “up”, “down”, “horizontal”, “left”, “right”, “front”, “back”, “lateral” and “longitudinal” are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0069] Example 1

[0070] Combination Figure 1-Figure 4 As shown, the present invention provides a high-precision crystal bonding machine, including a frame 10, a gantry assembly 1 arranged on the top of the frame 10, a crystal bonding module 2 installed on the front side of the top of the gantry assembly 1, a glue dipping module 9 installed on the rear side of the top of the gantry assembly 1, a wafer loading mechanism 7 arranged on the top surface of the shell of the frame 10, a pin mechanism 8 arranged below the wafer loading mechanism 7, a material picking assembly 11 arranged in the middle of a workbench 1-1 in the gantry assembly 1, a wafer-level camera module 3 and an upper vision module 4 arranged at the front end of the workbench 1-1, a picking module 5 arranged on the front end surface of the workbench 1-1, and cache modules 6 arranged on both sides of the picking module 5.

[0071] The gantry assembly 1 is used to drive the crystal bonding module 2 and the glue dipping module 9 thereon to move in a two-dimensional space.

[0072] The wafer loading mechanism 7 is used to supply chips to the die bonding module 2. The material taking component 11 is used to place and push the substrate.

[0073] The wafer-level camera module 3 is used to detect the chip position on the wafer in the wafer loading mechanism 7, and use the camera to take pictures of the chips on the wafer to identify the specific position of each chip.

[0074] The picking module 5 is used to pick up the chip identified by the wafer-level camera module 3 from the wafer and place it on the cache module 6 .

[0075] The cache module 6 is used to cache the chips picked up by the pickup module 5 by vacuum adsorbing the chips so that the die bonding module 2 can take away the chips.

[0076] The die bonding module 2 is used to locate the chip position in the cache using CCD technology, pick up the chip cached by the cache module 6, and place the chip on the designated die bonding position of the substrate.

[0077] The upper visual module 4 is used to perform visual analysis on the chip from bottom to top after the chip is picked up by the die bonding module 2. The die bonding module 2 adjusts the angle of the picked up chip according to the recognition result to ensure that the chip is correctly placed.

[0078] The glue dipping module 9 is used to identify the specific position of the glue dipping on the substrate by using CCD technology, and then apply the glue to the designated die-bonding position of the substrate after rotating the glue dipping module.

[0079] Combination Figure 1 , Figure 4 , Figure 5 As shown, the gantry assembly 1 includes a work table 1-1 and side panels 1-2 arranged on the left and right sides of the work table 1-1. The two side panels 1-2 are provided with openings, and the two ends of the work table 1-1 are respectively arranged in the openings of the side panels 1-2. The substrate to be processed enters the material removal assembly 11 on the work table 1-1 from the opening on the left, and the substrate that has been processed leaves the work table 1-1 from the opening on the right.

[0080] The gantry assembly 1 also includes two gantry Y-axis assemblies 1 - 3 and two gantry X-axis assemblies 1 - 4 slidably connected to the gantry Y-axis assemblies 1 - 3.

[0081] The gantry Y-axis assembly 1-3 includes a gantry Y-axis 1-31 disposed on the top of each side plate 1-2, a linear drive mechanism disposed outside the gantry Y-axis 1-31, and a sliding mechanism disposed on the top of the gantry Y-axis 1-31. The linear drive mechanism is a first linear motor 1-32 disposed on the side of the gantry Y-axis 1-31 away from the worktable 1-1, and the sliding mechanism is a matching first guide rail 1-34 and a first slider 1-33 disposed on the top of the gantry Y-axis 1-31. The top of the first slider 1-33 is connected to the mover of the first linear motor 1-32 through a gantry Y-axis sliding seat 1-35. The gantry Y-axis sliding seat 1-35 is connected to the gantry X-axis assembly 1-4 through a gantry connecting seat 1-5. When the first linear motor 1-32 is working, the mover of the first linear motor 1-32 drives the first slider 1-33 to move along the first guide rail 1-34 in the Y-axis direction through the gantry Y-axis sliding seat 1-35, thereby driving the gantry X-axis assembly 1-4 to move.

[0082] The gantry X-axis assembly 1-4 includes two gantry X-axis beams 1-41 connected between the two gantry Y-axis beams 1-31, a linear drive mechanism and a sliding mechanism arranged on the side of the gantry X-axis beam 1-41 close to the worktable 1-1, and the end of the gantry X-axis beam 1-41 is connected to the gantry connecting seat 1-5, so that the gantry X-axis beam 1-41 can move between the gantry Y-axis 1-31. The sliding mechanism includes two matching second guide rails 1-42 and a second slider 1-43 arranged in the X-axis direction at the upper and lower positions inside the gantry X-axis beam 1-41. The linear drive mechanism is a second linear motor 1-44 arranged between the two second guide rails 1-42.

[0083] The mover of the second linear motor 1-44 is provided with a gantry X-axis sliding plate 1-45, both ends of which are connected to the second slider 1-43, and the first gantry X-axis sliding plate 1-45 on the front side is connected with a crystal fixing module 2. The second linear motor 1-44 moves, driving the first gantry X-axis sliding plate 1-45 to move, and further driving the crystal fixing module 2 installed on the gantry X-axis sliding plate 1-45 to move.

[0084] Combination Figure 1 , Figure 5 , Figure 6 As shown, the die bonding module 2 includes a set of die bonding components 2-1 connected to the front gantry X-axis sliding plate 1-45, and a die bonding visual component 2-2 arranged in the middle of the die bonding component 2-1. The die bonding component 2-1 is responsible for performing the suction, movement and placement of the chip, and the die bonding visual component 2-2 realizes the accurate identification and positioning of the chip, thereby providing accurate guidance and control for the die bonding component 2-1.

[0085] The die bonding assembly 2-1 includes a die bonding lifting mechanism disposed on the front gantry X-axis sliding plate 1-45 and a bonding head mechanism installed on the die bonding lifting mechanism. The die bonding lifting mechanism is used to realize the lifting and lowering movement of the bonding head mechanism in the Z-axis direction. The bonding head mechanism is used to perform the suction and placement actions of the chip. Through the gantry assembly 1 and the lifting mechanism of the die bonding assembly 2-1, the bonding head mechanism can move in a three-dimensional space.

[0086] Combination Figure 6-Figure 8As shown, the solid crystal lifting mechanism includes a first motor base plate 2-11, a U-shaped linear motor 2-12 arranged on the first motor base plate 2-11, a single mover follower block 2-13 arranged on the mover of the U-shaped linear motor 2-12, a lifting follower block 2-14 arranged on the single mover follower block 2-13, and a matching third slider 2-16 and a third guide rail 2-15 connected to the inner side of the lifting follower block 2-14. The third guide rail 2-15 is arranged on the first motor base plate 2-11. A bang head mechanism is connected to the lifting follower block 2-14. The mover of the U-shaped linear motor 2-12 drives the single mover follower block 2-13, and then drives the lifting follower block 2-14 to drive the third slider 2-16 to move up and down on the third guide rail 2-15, thereby driving the lifting bang head mechanism to perform lifting and lowering movements.

[0087] Combination Figure 6-Figure 8 As shown, the bonding head mechanism includes a die bonding adjustment mechanism and a bonding head rotating assembly connected to the die bonding adjustment mechanism. The die bonding adjustment mechanism is used to accurately adjust the position of the bonding head rotating assembly in the X-axis and Y-axis directions to ensure that the chip can be accurately placed at the specified position on the substrate. The bonding head rotating assembly is used to realize the rotation and precise placement of the chip.

[0088] Combination Figure 6-Figure 8 As shown, the crystal bonding adjustment mechanism includes a crystal bonding adjustment plate 1-2-17 for adjusting the position of the bunker rotating assembly in the X-axis, and a crystal bonding adjustment plate 2-18 for adjusting the position of the bunker rotating assembly in the Y-axis. The crystal bonding adjustment plate 1-2-17 is connected to the lifting follower block 2-14, and an adjustment screw 1-2-19 is arranged on the crystal bonding adjustment plate 1-2-17. The adjustment plate 2-18 is connected to the adjustment plate 1-2-17 through the adjustment screw 2-110, and the crystal bonding adjustment plate 2-18 is connected to the top of the bunker rotating assembly. The offset of the bunker rotating assembly in the X-axis direction can be adjusted by rotating the adjustment screw 1-2-19, and the offset of the bunker rotating assembly in the Y-axis direction can be adjusted by rotating the adjustment screw 2-110. The fine-tuning function of the crystal bonding adjustment mechanism can further ensure that the chip can be accurately placed on the substrate.

[0089] Combination Figure 6-Figure 8As shown, the bang head rotating assembly includes a DD motor 2-111 connected to the top of the adjustment plate 2-18, a bang head seat 2-112 connected below the DD motor 2-111, a group of cylinders 2-113 connected to the top of the bang head seat 2-112, a blowing block 2-114 arranged between the cylinders 2-113, a voice coil motor 2-115 arranged below the blowing block 2-114, a bang head suction nozzle rod 2-116 arranged at the bottom of the blowing block 2-114, a suction nozzle 2-117 connected to the bottom of the bang head suction nozzle rod 2-116, and a first spring 2-118 passed through the bang head suction nozzle rod 2-116. Among them, the top of the blowing block 2-114 is connected to the top of the bang head seat 2-112, and the top of the voice coil motor 2-115 is connected to the top of the bang head seat 2-112. A vacuum air pipe joint is provided on the Bang head suction nozzle rod 2-116, and the top two ends of the Bang head suction nozzle rod 2-116 are respectively connected to the cylinder 2-113, and the Bang head suction nozzle rod 2-116 is slidably connected with the Bang head seat 2-112 through a cross roller straight rail, and the first spring 2-118 is sleeved on the screw rod, and the top end of the first spring 2-118 is hung on the top of the screw rod, and the bottom end of the first spring 2-118 is hung on the Bang head suction nozzle rod 2-116, and the bottom of the screw rod is fixed to the contact screw fixing seat 2-119, and the contact screw fixing seat 2-119 is connected to the Bang head seat 2-112.

[0090] The bonding head mechanism moves to the cache module 6 in three-dimensional space, and the suction nozzle 2-117 sucks the chip under the action of vacuum; after the suction nozzle 2-117 takes the chip, the upper visual module 4 will perform a visual analysis of the chip on the suction nozzle 2-117 to determine whether the chip angle is appropriate, and the DD motor 2-111 operates to adjust the angle of the suction nozzle 2-117; after the angle is adjusted to be appropriate, the suction nozzle 2-117 carries the chip to the substrate, and after the chip is placed in the substrate bonding position, the chip will not be subjected to a large force due to the action of the voice coil motor 2-115; the bonding adjustment mechanism fine-tunes the suction nozzle 2-117 in the horizontal direction, and the cylinder 2-113 drives the bonding head suction nozzle rod 2-116 to slide to give the chip a preset pressure, so that the chip is close to the substrate, completing a bonding action; after the bonding, the cylinder 2-113 returns to its position, and the bonding head suction nozzle rod 2-116 also returns to its position upward at the same time under the action of the first spring 2-118. The air blowing block 2-114 is used to blow air to clean the chip before die bonding to remove dust and impurities on the chip surface; at the same time, before placing the chip, the air blowing block 2-114 will blow away dust or impurities on the substrate. Through the coordinated work of the die bonding adjustment mechanism and the bonding head rotating assembly, it can ensure that the chip has extremely high placement accuracy and reliability in packaging or similar processes.

[0091] Combination Figure 6 , Figure 7 , Fig. 9As shown, the solid crystal vision component 2-2 includes a solid crystal vision lifting mechanism and a first CCD camera component 2-210 connected to the solid crystal vision lifting mechanism. The solid crystal vision lifting mechanism includes a lifting base plate 2-21 disposed in the middle of the gantry X-axis sliding plate 1-45 on the front side, a fourth guide rail 2-22 and a fourth slider 2-23 in the Z-axis direction disposed on the left and right sides of the lifting base plate 2-21, and a screw drive mechanism disposed between the two fourth guide rails 2-22. The solid crystal vision lifting mechanism is responsible for driving the first CCD camera component 2-210 to move up and down to capture the target chip image.

[0092] Combination Figure 6 , Figure 7 , Fig. 9 As shown, the screw drive mechanism has a first ball screw 2-24, a nut follower block 2-25 provided on the first ball screw 2-24, and a first servo motor 2-26. The bottom end of the first ball screw 2-24 is connected to the bottom of the lifting base plate 2-21 through the support side 2-27, and the top end of the first ball screw 2-24 is connected to the top of the lifting base plate 2-21 through the fixed side 2-28. The nut follower block 2-25 is connected to the fourth slider 2-23, and the nut follower block 2-25 is connected to the first CCD camera assembly 2-210. The first servo motor 2-26 is connected to the top of the lifting base plate 2-21, and the output shaft of the first servo motor 2-26 is connected to the first ball screw 2-24 through a coupling. When the first ball screw 2-24 rotates, the nut follower block 2-25 will move along the first ball screw 2-24, thereby driving the first CCD camera assembly 2-210 to move up and down. The nut follower block 2-25 is connected to a lens fixing seat 2-29, and a first CCD camera assembly 2-210 is installed in the lens fixing seat 2-29.

[0093] Combination Figure 6 , Figure 7 , Fig. 9 As shown, the first CCD camera assembly 2-210 includes a camera body 2-211, a lens 2-212, a light source fixing seat 2-213, a coaxial light source 2-214, and an annular light source 2-215. The lens 2-212 in the first CCD camera assembly 2-210 is arranged inside the lens fixing seat 2-29 along the Z-axis direction, the coaxial light source 2-214 in the downward-looking camera 2-210 is installed on the lens 2-212 of the downward-looking camera through the light source fixing seat 2-213, and the annular light source 2-215 is installed on one side of the lens 2-212.

[0094] Combination Figure 3 , Figure 4 , Fig.10As shown, the wafer-level camera module 3 includes a wafer-level camera adjustment base 3-1 and a second CCD camera assembly 3-2 disposed on the wafer-level camera adjustment base 3-1. The wafer-level camera adjustment base 3-1 is responsible for supporting and adjusting the position and height of the second CCD camera assembly 3-2 to ensure that the second CCD camera assembly 3-2 can capture an image of the wafer surface below.

[0095] Combination Figure 3 , Figure 4 , Fig.10 As shown, the wafer-level camera adjustment seat 3-1 includes a visual fixing seat 3-11 connected to the workbench 1-1, a cross roller vertical plate 3-12 slidably connected to the top of the visual fixing seat 3-11, a wafer camera adjustment plate 3-13 straddling the rear sides of the visual fixing seat 3-11 and the cross roller vertical plate 3-12, an adjustment rod 3-14 inserted through the wafer camera adjustment plate 3-13 and the cross roller vertical plate 3-12, and an adjustment fixed block 3-111 connected to both ends of the visual fixing seat 3-11, wherein a waist hole is provided in the adjustment fixed block 3-111, and the visual fixing seat 3-11 and the cross roller vertical plate 3-12 are slidably connected through a cross roller linear guide rail. By rotating the adjustment rod 3-14, the cross roller vertical plate 3-12 can be driven to move in the horizontal direction, thereby realizing the horizontal adjustment of the second CCD camera assembly 3-2.

[0096] Combination Figure 3 , Figure 4 , Fig.10 As shown, the wafer-level camera adjustment seat 3-1 also includes height fixing plates 3-15 arranged on both sides of the cross roller vertical plate 3-12 in the Z-axis direction, a camera extension seat 3-16 connected to the cross roller vertical plate 3-12 in a sliding manner in the Z-axis direction, a camera fixing seat 3-18 connected to the camera extension seat 3-16, a camera extension upper plate 3-17 connected between the two sides of the top front end of the camera extension seat 3-16, a lens height adjustment plate 3-19 connected to the front end of the camera extension upper plate 3-17 through a waist hole, and a wafer ring light mounting plate 3-110 connected to the bottom of the lens height adjustment plate 3-19. The cross roller vertical plate 3-12 is connected to the camera extension seat 3-16 through a cross roller linear guide rail, and the height fixing plate 3-15 is connected to the camera extension seat 3-16, and a waist hole is arranged in the height fixing plate 3-15.

[0097] The height fixing plate 3-15 is used to further fix and support the camera extension seat 3-16, so as to facilitate the adjustment and fixing of the position of the camera extension seat 3-16. The camera extension seat 3-16 is used to carry the second CCD camera assembly 3-2, and is connected to the cross roller vertical plate 3-12 through a cross roller linear guide to achieve height adjustment in the Z-axis direction. The design of the camera extension seat 3-16 allows the camera to be adjusted in height within a larger range to adapt to wafers of different sizes and detection requirements.

[0098] The camera fixing seat 3-18 is used to support and fix the wafer-level phase 3-2 to prevent it from moving or vibrating during operation. The camera extension upper plate 3-17 is used to provide additional support and stability for the wafer-level phase 3-2. The lens height adjustment plate 3-19 is used to fine-tune the height of the lens of the wafer-level phase 3-2 within a certain range. The second CCD camera assembly 3-2 is arranged between the camera extension seat 3-16 and the camera fixing seat 3-18. The second CCD camera assembly 3-2 is similar to the first CCD camera assembly 2-210 and will not be introduced in detail. The prism 3-21 of the second CCD camera assembly 3-2 is located above the wafer ring light mounting plate 3-110.

[0099] Combination Figure 3 , Figure 4 , Fig.11 As shown, the upper vision module 4 is arranged on the right side of the wafer-level camera module 3, and includes an upper vision fixing adjustment seat 4-1 and a third CCD camera assembly 4-2 arranged on the upper vision fixing adjustment seat 4-1. The upper vision fixing adjustment seat 4-1 is responsible for supporting and adjusting the position and angle of the third CCD camera assembly 4-2, and the third CCD camera assembly 4-2 is responsible for capturing the image of the target chip from above.

[0100] Combination Figure 3 , Figure 4 , Fig.12 As shown, the picking module 5 includes a crystal picking X-axis motion component 5-1 and a crystal picking component 5-2 slidably connected to the crystal picking X-axis motion component 5-1.

[0101] Combination Figure 3 , Figure 4 , Fig.11 As shown, the crystal taking X-axis motion assembly 5-1 includes a crystal taking X-axis crossbeam 5-11 arranged on the front end surface of the workbench 1-1, two matching fifth guide rails 5-12 and a fifth slider 5-13 arranged along the X-axis direction of the crystal taking X-axis crossbeam 5-11, a material taking slider plate 5-14 connected to the top of the fifth slider 5-13, a material taking motor mounting plate 5-15 arranged on the bottom of the front end of the workbench 1-1, and a third linear motor 5-16 arranged at the bottom of the material taking motor mounting plate 5-15. The bottom of the crystal taking X-axis crossbeam 5-11 is connected to the front end of the material taking motor mounting plate 5-15, and the inner side of the material taking slider plate 5-14 is connected to the mover of the third linear motor 5-16. The crystal taking assembly 5-2 is connected to the outer side of the material taking slider plate 5-14.

[0102] Combination Figure 8 , Fig.13 As shown, the crystal picking component 5 - 2 is similar in structure to the crystal bonding component 2 - 1 of the crystal bonding module 2 , except that it has no cylinder and does not need to perform crystal bonding. It only needs to pick up the chip and place it on the cache module 6 .

[0103] Combination Figure 5 , Fig.14 As shown, the cache module 6 includes a cache lifting mechanism 6-1 disposed on the inner wall of the two side panels 1-2, and a cache component 6-2 connected to the cache lifting mechanism 6-1, including a cache module on the left and a cache module on the right. The cache module 6 is used to temporarily store chips. The chips taken from the wafer loading mechanism 7 by the picking module 5 are placed on the cache module 6, waiting for the die bonding module 2 to take away the chips.

[0104] Combination Figure 5 , Fig.14 As shown, the cache lifting mechanism 6-1 includes a cache module bottom plate 6-11 arranged on the inner wall of the side plate 1-2, and a screw belt transmission driving mechanism connected to the cache module bottom plate 6-11.

[0105] like Fig.14 As shown, the screw belt transmission drive mechanism includes a second ball screw 6-12 installed on the cache module bottom plate 6-11 in the Z-axis direction, the top of the second ball screw 6-12 is connected to the top of the cache module bottom plate 6-11 through a driven bearing seat 6-112, and the bottom of the second ball screw 6-12 is inserted through the screw bearing seat 6-13 and connected to the bottom of the cache module bottom plate 6-11. The screw belt transmission drive mechanism also includes an active bearing seat 6-14 arranged inside the screw bearing seat 6-13, and a synchronous wheel 1 6-15 arranged below the bottom of the active bearing seat 6-14. The bottom of the second ball screw 6-12 is inserted through the active bearing seat 6-14, and the synchronous wheel 1 6-15 is sleeved on the bottom of the second ball screw 6-12.

[0106] like Fig.14 As shown, the screw belt transmission drive mechanism also includes a motor mounting seat 6-16 arranged on the outer side of the bottom of the screw bearing seat 6-13, a second servo motor 6-17 arranged on the top of the motor mounting seat 6-16, and a synchronous wheel 2 6-18 is sleeved on the end of the output shaft of the second servo motor 6-17. The output shaft of the second servo motor 6-17 is passed through the motor mounting seat 6-16, and the synchronous wheel 2 6-18 is located at the bottom of the motor mounting seat 6-16. The synchronous wheel 1 6-15 is connected to the synchronous wheel 2 6-18 through a conveyor belt 1 6-111. The cache lifting mechanism 6-1 also includes a cache module nut seat 6-113 mounted on the middle part of the second ball screw 6-12, a sixth guide rail 6-19 and a matching sixth slider 6-110 arranged on the cache module base plate 6-11 close to the workbench 1-1. The right side of the cache module nut seat 6-113 is connected to the sixth slider 6-110, and the cache module nut seat 6-113 is connected to the cache assembly 6-2.

[0107] When the second servo motor 6-17 is started, its output shaft drives the synchronous wheel 2 6-18 to rotate. Through the conveyor belt 1 6-111, the rotation of the synchronous wheel 2 6-18 is transmitted to the synchronous wheel 1 6-15, which in turn drives the second ball screw 6-12 to rotate, and the rotation of the second ball screw 6-12 is converted into the up and down movement of the cache module nut seat 6-113.

[0108] like Fig.14 As shown, the cache assembly 6-2 includes a cache follower block 6-21 connected to the cache module nut seat 6-113, a cache vacuum plate 6-22 connected to the top of the cache follower block 6-21, two mirror suction cup mounting plates 6-23 connected to the top of the cache vacuum plate 6-22, and a mirror suction cup 6-24 arranged on the mirror suction cup mounting plate 6-23. There are many tiny air holes on the mirror suction cup 6-24. The mirror suction cup 6-24 mounting plate 6-23 is provided with a vacuum air duct ventilation inside, and the mirror suction cup mounting plate 6-23 is provided with an air pipe joint for connecting a vacuum source outside. A sealing ring is provided between the contact surface of the mirror suction cup mounting plate 6-23 and the mirror suction cup 6-24 to achieve sealing without destroying the vacuum environment. The cache vacuum plate 6-22 is moved up and down under the action of the cache module nut seat 6-113, and can flexibly adjust the height of the cached chip; the chip is adsorbed by the vacuum negative air pressure on the mirror suction cup 6-24 to achieve the purpose of storing the chip.

[0109] Combination Figure 1 , Figure 3 , Fig.15 As shown, the wafer loading mechanism 7 is installed on the top of the frame 10 through the wafer loading base 10-1, and the top of the wafer loading mechanism 7 is located below the wafer-level camera module 3, which is convenient for the wafer-level camera module 3 to visually locate and detect the wafer.

[0110] Combination Figure 1 , Figure 3 , Fig.15 As shown, the wafer loading mechanism 7 includes a wafer Y-axis base 7-1 connected to the top of the wafer loading base 10-1, a wafer middle base 7-2 slidably connected to the top of the wafer Y-axis base 7-1, a wafer X-motion plate 7-3 slidably connected to the top of the wafer middle base 7-2, a turntable 7-4 connected to the top of the wafer X-motion plate 7-3, and a wafer plate 7-5 connected to the top of the turntable 7-4 for carrying and fixing the wafer. The wafer middle base 7-2 slides along the Y-axis direction on the wafer Y-axis base 7-1 to provide movement of the wafer in the Y-axis direction. The wafer X-motion plate 7-3 slides in the X-axis direction on the wafer middle base 7-2 to provide movement of the wafer in the X-axis direction. The turntable 7-4 is used to rotate the wafer to adjust its position.

[0111] like Fig.15As shown, the turntable 7-4 is connected to a driving mechanism through a belt transmission mechanism 7-6, and the belt transmission mechanism 7-6 includes a synchronous wheel 3 7-61 arranged on the wafer X motion plate 7-3, a conveyor belt 2 7-66 connecting the synchronous wheel 3 7-61 and the outer side of the turntable 7-4, a synchronous wheel 4 7-62 arranged coaxially with the synchronous wheel 3 7-61, and the synchronous wheel 4 7-62 is connected to the synchronous wheel 5 7-63 through a conveyor belt 3 7-67. A pulley mounting plate 7-64 is sleeved on the connecting shaft 7-65 between the synchronous wheel 3 7-61 and the synchronous wheel 4 7-62, and the bottom of the pulley mounting plate 7-64 is connected to the wafer X motion plate 7-3.

[0112] like Fig.15 As shown, the top of the pulley mounting plate 7-64 is connected to a motor mounting plate 7-8. The driving mechanism is a third servo motor 7-9 connected below the synchronous wheel 5 7-63, the synchronous wheel 5 7-63 is sleeved on the output shaft of the third servo motor 7-9, and the third servo motor 7-9 is connected to the motor mounting plate 7-8.

[0113] Wafer loading mechanism 7 working principle:

[0114] When the third servo motor 7-9 is started, its output shaft drives the synchronous wheel 5 7-63 to rotate, and transmits the rotation to the synchronous wheel 4 7-62 and the synchronous wheel 3 7-61 through the conveyor belt 3 7-67, and then drives the turntable 7-4 to rotate through the conveyor belt 2 7-66, and the crystal plate 7-5 on the turntable 7-4 rotates accordingly to adjust the position of the wafer. At the same time, the wafer center seat 7-2 and the wafer X motion plate 7-3 can work together to realize the movement of the wafer in the X-axis and Y-axis directions. In this way, the wafer can be accurately moved to the bottom of the wafer-level camera module 3 for visual positioning and detection, and then picked up by the pickup module 5.

[0115] Combination Figure 15-17 As shown, the ejector mechanism 8 is located below the wafer loading mechanism 7, and includes an ejector adjustment seat assembly 8-1 and an ejector assembly 8-2 disposed on the top of the ejector adjustment seat assembly 8-1. The two parts work together to ensure that the wafer can be lifted and positioned smoothly and accurately. The ejector adjustment seat assembly 8-1 provides an installation and adjustment platform for the ejector assembly 8-2, allowing the ejector assembly 8-2 to be precisely fine-tuned in the X-axis and Y-axis directions, so that the ejector mechanism 8 can adapt to wafers of different sizes and different process requirements, and the wafer can be lifted by the ejector assembly 8-2.

[0116] Combination Figure 16-Figure 17As shown, the ejector adjustment seat assembly 8-1 includes an ejector base 8-11, an ejector adjustment plate 1 8-12 slidably connected to the top of the ejector base 8-11, an ejector adjustment plate 2 8-13 slidably connected to the top of the ejector adjustment plate 1 8-12, and an ejector intermediate plate 8-14 connected to the top of the ejector adjustment plate 2 8-13. The ejector adjustment plate 1 8-12 is connected to the ejector intermediate plate 8-14 through a waist hole connecting piece 8-15, the ejector adjustment plate 1 8-12 is connected to the ejector base 8-11 through an adjusting screw, and the ejector adjustment plate 2 8-13 is connected to the ejector base 8-11 through an adjusting screw. By rotating the adjusting screw, the position of the ejector mechanism 8 in the horizontal direction can be fine-tuned.

[0117] Combination Figure 16-Figure 17 As shown, the ejector assembly 8-2 includes an ejector mounting frame 8-21 disposed on the ejector middle plate 8-14, an ejector bearing seat 8-23 connected to the top of the ejector mounting frame 8-21, an ejector cap adjustment seat 8-24 connected to the top of the ejector bearing seat 8-23, an ejector cap 8-25 connected to the top of the ejector cap adjustment seat 8-24, a U-shaped voice coil motor 8-26 disposed inside the ejector mounting frame 8-21, an ejector shaft assembly 8-27 disposed on the top of the U-shaped voice coil motor 8-26, and an ejector located in the ejector cap 8-25 connected to the ejector shaft assembly 8-27. In the ejector mechanism 8, the U-shaped voice coil motor 8-26 provides power, which is transmitted to the ejector through the ejector shaft assembly 8-27, thereby realizing the lifting and positioning of the wafer.

[0118] Combination Figure 1 , Fig.18 As shown, the glue dipping module 9 includes two glue dipping components 9-1 slidably connected to the second gantry X-axis sliding plate 1-45 on the rear side, a glue storage component 9-2 connected to the glue dipping component 9-1, and a glue dipping vision component 9-3 arranged between the two glue dipping components 9-1. The glue dipping component 9-1 is responsible for the actual glue dipping and dispensing operations; the glue storage component 9-2 is used to store and supply glue; the glue dipping vision component 9-3 is used to identify the glue dipping position on the positioning substrate; these components work together to achieve precise application of glue.

[0119] Combination Fig.18 , Fig.19 As shown, the glue dipping assembly 9-1 includes a glue dipping lifting mechanism 9-11 slidably connected to the rear side of the gantry X-axis sliding plate 1-45, and a glue dipping mechanism connected to the bottom of the glue dipping lifting mechanism 9-11. The glue dipping lifting mechanism 9-11 is used to drive the glue dipping mechanism to perform lifting and lowering movements.

[0120] The structure of the glue dipping and lifting mechanism 9-11 is consistent with that of the die-bonding lifting mechanism of the die-bonding assembly 2-1, and will not be analyzed further.

[0121] like Fig.19As shown, the glue dipping mechanism includes a glue dipping adjustment mechanism connected to the glue dipping lifting mechanism 9-11, the glue dipping adjustment mechanism includes a glue dipping adjustment block 9-12, a glue dipping adjustment plate 9-13 connected to the glue dipping adjustment block 9-12, and the glue dipping mechanism also includes a fourth servo motor 9-14 arranged on the top of the glue dipping adjustment plate 9-13, a glue dispensing sleeve bracket 9-15 connected to the fourth servo motor 9-14, a spring-type glue dipping mechanism 9-16 connected to the bottom of the glue dispensing sleeve bracket 9-15, and a glue dipping head 9-17 connected to the end of the spring-type glue dipping mechanism 9-16. The glue dipping adjustment plate 9-13 connected to the glue dipping adjustment block 9-12 is provided with a pin hole and an adjustable slotted screw hole, which can respectively realize the horizontal adjustment of the glue dipping head 9-17 in the horizontal and vertical directions, so that the glue for dipping and dispensing of the glue dipping head 9-17 is evenly distributed. The fourth servo motor 9-14 drives the glue dipping head 9-17 to rotate, swing to the glue storage tray 9-28 to dip in glue, and then swing back after dipping in glue, and move downward to dispense glue on the substrate.

[0122] like Fig. 20 As shown, the spring-type glue dipping mechanism 9-16 includes a glue dispensing head mounting plate 9-161 connected to the glue dispensing sleeve bracket 9-15, a glue dispensing sleeve mounting plate 9-162 connected to the glue dispensing head mounting plate 9-161, a pressing piece 9-163 connected to the glue dispensing head mounting plate 9-161 and the bottom of the glue dispensing sleeve mounting plate 9-162, a spring pressing block 9-164 connected to the top of the glue dispensing head mounting plate 9-161 and the glue dispensing sleeve mounting plate 9-162, and a compression spring 9-165 sleeved on the top of the spring pressing block 9-164. A glue dipping head 9-17 is connected to the bottom of the glue dispensing sleeve mounting plate 9-162.

[0123] Combination Fig.18 , Fig.21 As shown, the glue storage assembly 9-2 includes a glue storage motor assembly 9-21 and a glue storage tray assembly connected to the bottom of the glue storage motor assembly 9-21. The glue storage motor assembly provides power and control, while the glue storage tray assembly is responsible for actually storing glue.

[0124] Combination Fig.18 , Fig.21 As shown, the glue storage motor assembly 9-21 includes a glue dipping mounting plate 9-22 connected to the glue dipping lifting mechanism 9-11, a bearing mounting seat 9-23 connected to the glue dipping mounting plate 9-22, a transmission shaft 9-24 passing through the bearing mounting seat 9-23, a fifth servo motor 9-25 connected to the top of the transmission shaft 9-24 through a coupling, a contour plate 9-26 connected to both sides of the top of the bearing mounting seat 9-23, and a second motor mounting plate 9-27 laid on the top of the contour plate 9-26. The fifth servo motor 9-25 is connected to the second motor mounting plate 9-27, and the end of the connecting shaft 9-24 is connected to a glue storage tray 9-28. The fifth servo motor 9-25 drives the glue storage tray 9-28 to rotate.

[0125] like Fig.21 As shown, the glue storage tray assembly includes a glue storage tray 9-28 for storing glue connected to the bottom end of the transmission shaft 9-24, a micrometer 9-29 connected to the top end of the front side of the bearing mounting seat 9-23, a spring guide column 9-210 connected to the bottom end of the front side of the bearing mounting seat 9-23, and a second spring 9-211 passed through the spring guide column 9-210, and the bottom of the micrometer 9-29 is connected to the top of the spring guide column 9-210; the glue storage tray assembly also includes an adjustment fixing seat 9-213 passed through the middle of the bottom end of the front side of the bearing mounting seat 9-23, and the bottom of the adjustment fixing seat 9-213 The scraper 9-214 is connected to the top of the adjusting fixed seat 9-213, the top is connected to the top of the spring guide column 9-210, and the bottom of the scraper 9-214 contacts the top of the glue storage tray 9-28; it also includes a glue storage guide seat 9-215 set at the bottom end of the front side of the bearing mounting seat 9-23, and a glue storage block 9-212 connected to the glue storage guide seat 9-215, the adjusting fixed seat 9-213 is enclosed in the glue storage guide seat 9-215 and the glue storage block 9-212, and the adjusting fixed seat 9-213 is in close contact with the glue storage guide seat 9-215 and the glue storage block 9-212.

[0126] The fourth servo motor 9-14 drives the glue storage tray 9-28 to rotate, and drives the scraper 9-214 to scrape the glue on the glue storage tray 9-28 in a circular manner, so that the glue in the glue storage tray 9-28 is uniform. The glue storage guide seat 9-215 and the glue storage pressure block 9-212 are used to guide and prevent the adjustment fixed seat 9-213 from shaking, and the scraper 9-214 remains stable. The second spring 9-211 pushes up the adjustment fixed seat 9-213, and the micrometer 9-29 presses down the adjustment fixed seat 9-213. The height of the scraper 9-214 can be adjusted by screwing the micrometer 9-29 to adjust the appropriate scraping position. The glue storage tray assembly ensures the stability and uniformity of the glue supply. The glue dipping assembly 9-1 drives the glue dipping head 9-17 to move vertically and rotationally, driving the glue dipping head 9-17 to move to the glue storage tray 9-28 to dip the glue. After the dipping is completed, the glue is applied to the substrate. Glue dispensing is completed.

[0127] like Fig. 22 As shown, the glue dipping visual component 9-3 is similar in structure to the die bonding visual component 2-2 and will not be analyzed. The glue dipping visual component 9-3 is used for visual positioning of the glue dipping position of the substrate during the glue dipping process. The glue dipping visual component 9-3 includes a lifting mechanism and a CCD camera component connected to the lifting mechanism. The lifting mechanism drives the CCD camera component to move up and down precisely in the Z-axis direction to facilitate focusing and shooting. The CCD camera component is the visual perception part of the glue dipping visual component 9-3, which is used to shoot the substrate and perform visual imaging to determine the glue dispensing position and the final chip bonding position.

[0128] Workflow:

[0129] Phase 1: Chip preparation and picking:

[0130] 1. Detect the chip position on the wafer: The wafer-level camera module identifies the wafer in the wafer loading mechanism and detects the specific position of each chip.

[0131] 2. Pick up the chip: The picking module moves to the corresponding chip position according to the detection results of the wafer-level camera module, and picks up the chip from the wafer through vacuum adsorption and other methods.

[0132] 3. Cache chip: The pick-up module places the picked-up chip on the cache module. The cache module temporarily fixes the chip by vacuum adsorption or other means for subsequent operations.

[0133] The second stage: chip bonding:

[0134] 4. CCD locates the cache chip position: On the cache module, the solid crystal vision component locates the cache chip to ensure the precise position of the chip.

[0135] 5. The bonding head mechanism picks up the chip: The bonding head lifting mechanism in the bonding module drives the bonding head mechanism to descend, and the bonding head rotating assembly absorbs the chip on the cache module through rotational motion.

[0136] 6. Adjust the chip angle: After the nozzle of the die-bonding component picks up the chip, the upper vision module checks the angle of the chip and adjusts the chip angle.

[0137] 7. Identify the die bonding position: The die bonding vision component uses CCD technology again to locate the specified die bonding position on the substrate.

[0138] 8. Complete the die bonding: The bonding mechanism places the chip precisely at the designated position on the substrate to complete the die bonding operation.

[0139] The glue dipping module is operated synchronously. While the chip is being bonded, the glue dipping module is also performing the following operations:

[0140] The following steps are performed simultaneously:

[0141] 1. Rotary glue dipping: The glue storage motor assembly in the glue dipping module drives the glue storage tray to rotate, so that the glue is evenly distributed on the glue storage tray.

[0142] 2.CCD identifies the glue dipping position: The glue dipping vision component uses CCD technology to identify the specific position on the substrate where glue dipping is required.

[0143] 3. Product glue dipping and dispensing: The glue dipping lifting mechanism drives the glue dipping mechanism down, and the spring-type glue dipping mechanism contacts the glue storage tray and dips the glue. The glue dipping mechanism then moves to the designated position on the substrate, and the glue is accurately placed around the die-bonding position through the glue dipping head, providing the necessary adhesive for chip fixation.

[0144] The above technical features constitute the best embodiment of the present invention, which has strong adaptability and best implementation effect. Non-essential technical features can be added or reduced according to actual needs to meet the needs of different situations.

[0145] Finally, it should be noted that the above content is only used to illustrate the technical solution of the present invention, rather than to limit the scope of protection of the present invention. Simple modifications or equivalent substitutions of the technical solution of the present invention by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the present invention.

Claims

1. A high-precision die bonding machine, comprising a frame, characterized in that: It also includes a gantry assembly arranged on the top of the frame, the gantry assembly has a workbench, side panels arranged on both sides of the workbench in the Y-axis direction, a gantry Y-axis assembly arranged on the top of each side panel, and two gantry X-axis assemblies slidably connected between the two gantry Y-axis assemblies, the gantry Y-axis assembly is used to move the gantry X-axis assembly in the Y-axis direction, the crystal bonding machine also includes a crystal bonding module slidably connected to the first gantry X-axis assembly, and a glue dipping module slidably connected to the second gantry X-axis assembly, the crystal bonding module is used to move in three-dimensional space to pick up the chip and place it in a designated crystal bonding position; the glue dipping module is used to move in three-dimensional space to apply glue to the designated crystal bonding position of the substrate placed on the workbench, and after the crystal bonding module places the chip at the crystal bonding position, the chip is fixed to the substrate.

2. The high-precision die bonding machine according to claim 1, characterized in that: The crystal bonding module includes a crystal bonding component and a crystal bonding vision component connected to the crystal bonding component. The crystal bonding vision component is used to locate the chip position using CCD technology, and the crystal bonding component is used to perform chip absorption, movement and placement; the crystal bonding component includes a crystal bonding lifting mechanism slidably connected to the first gantry X-axis component and a bonding head mechanism installed on the crystal bonding lifting mechanism. The crystal bonding lifting mechanism is used to drive the bonding head mechanism to lift and lower in the Z-axis direction, and the bonding head mechanism is used to perform chip absorption, movement and placement; the bonding head mechanism includes a crystal bonding adjustment mechanism and a bonding head rotating component connected to the crystal bonding adjustment mechanism. The crystal bonding adjustment mechanism is used to accurately adjust the position of the bonding head rotating component in the horizontal direction; the bonding head rotating component absorbs the chip through rotational movement and places the chip to the specified position; the crystal bonding vision component includes a crystal bonding vision lifting mechanism and a first CCD camera component connected to the crystal bonding vision lifting mechanism. The crystal bonding vision lifting mechanism is responsible for driving the first CCD camera component to move up and down to capture the chip.

3. The high-precision die bonding machine according to claim 2, characterized in that: The crystal bonding lifting mechanism of the crystal bonding assembly includes a first motor bottom plate, a U-shaped linear motor arranged on the first motor bottom plate, a single mover follower block arranged on the mover of the U-shaped linear motor, a lifting follower block arranged on the single mover follower block, and a sliding mechanism connected to the inner side of the lifting follower block, and a bonding head mechanism is connected to the lifting follower block; under the drive of the U-shaped linear motor, the single mover follower block slides with the lifting follower block, thereby driving the bonding head mechanism to perform lifting movement; The pop-up head rotating assembly comprises a DD motor connected to a solid crystal adjustment mechanism, a pop-up head seat connected below the DD motor, a group of cylinders connected to the top of the pop-up head seat, an air blowing block arranged between the cylinders, a voice coil motor arranged below the air blowing block, a pop-up head suction nozzle rod arranged at the bottom of the air blowing block, a suction nozzle connected to the bottom of the pop-up head suction nozzle rod, and a first spring passed through the pop-up head suction nozzle rod; the top of the air blowing block is connected to the top of the pop-up head seat, the top of the voice coil motor is connected to the top of the pop-up head seat; the pop-up head suction nozzle rod is slidably connected to the pop-up head seat, and a spring is passed through the pop-up head suction nozzle rod.

4. The high-precision die bonding machine according to claim 1, characterized in that: The glue dipping module includes a glue dipping component, a glue storage component connected to the glue dipping component, and a glue dipping vision component connected to the glue dipping component. The glue dipping component includes a glue dipping lifting mechanism slidably connected to the second gantry X-axis component, a glue dipping mechanism connected to the bottom of the glue dipping lifting mechanism, the glue dipping mechanism includes a glue dipping adjustment mechanism connected to the glue dipping lifting mechanism, a spring-type glue dipping mechanism connected to the glue dipping adjustment mechanism, and a glue dipping head connected to the end of the spring-type glue dipping mechanism; the glue storage component includes a glue storage motor component and a glue storage tray component connected to the bottom of the glue storage motor component, the glue storage motor component is used to drive the glue storage tray component to rotate; the glue dipping vision component is used to use CCD technology to identify the specific position of the glue dipping on the substrate, the glue dipping component drives the glue dipping head to move vertically and rotationally, and drives the glue dipping head to move to the glue storage tray of the glue storage tray component to rotate and dip the glue, and after the glue dipping is completed, glue is applied to the designated solid crystal position of the substrate.

5. The high-precision die bonding machine according to claim 4, characterized in that: The spring-type glue dipping mechanism includes a glue dispensing head mounting plate, a glue dispensing sleeve mounting plate connected to the glue dispensing head mounting plate, a pressing piece connecting the glue dispensing head mounting plate and the bottom of the glue dispensing sleeve mounting plate, a spring pressure block connecting the glue dispensing head mounting plate and the top of the glue dispensing sleeve mounting plate, and a compression spring sleeved on the top of the spring pressure block. The bottom of the glue dispensing sleeve mounting plate is connected to a glue dipping head.

6. The high-precision die bonding machine according to claim 4, characterized in that: The glue storage motor assembly includes a glue dipping mounting plate connected to the glue dipping lifting mechanism, a bearing mounting seat connected to the glue dipping mounting plate, a transmission shaft passing through the bearing mounting seat, a servo motor rotatably connected to the top of the transmission shaft, and a servo motor connected to the top of the bearing mounting seat; the glue storage tray assembly includes a glue storage tray connected to the bottom end of the transmission shaft, a micrometer connected to the top of the front side of the bearing mounting seat, a spring guide column connected to the bottom end of the front side of the bearing mounting seat, and a spring passing through the spring guide column, and the bottom of the micrometer is connected to the top of the spring guide column.

7. The high-precision die bonding machine according to claim 6, characterized in that: The rubber storage tray assembly also includes an adjustment fixing seat passing through the middle of the bottom end of the front side of the bearing mounting seat, a scraper connected to the bottom of the adjustment fixing seat, the top of the adjustment fixing seat is connected to the top of the spring guide column, and the bottom of the scraper contacts the top of the rubber storage tray; it also includes a rubber storage guide seat set at the bottom end of the front side of the bearing mounting seat, and a rubber storage block connected to the rubber storage guide seat, the adjustment fixing seat is enclosed in the rubber storage guide seat and the rubber storage block, and the adjustment fixing seat is in close contact with the rubber storage guide seat and the rubber storage block.

8. The high-precision die bonding machine according to claim 1, characterized in that: The crystal bonding machine also includes a wafer loading mechanism, a picking module, a cache module, a wafer-level camera module, and an upper vision module. The wafer loading mechanism is used to supply chips. The picking module is slidably connected to the end face of the workbench close to the wafer loading mechanism along the X-axis direction. The cache module is arranged on the inner walls of the side panels on both sides close to the picking module. The wafer-level camera module is located above the wafer loading mechanism. The wafer-level camera module is used to identify the chip position on the wafer in the wafer loading mechanism. The picking module is used to pick up the chip identified by the wafer-level camera module from the wafer and place the temporary cache chip on the cache module. The cache module waits for the crystal bonding module to pick up the cached chip.

9. The high-precision die bonding machine according to claim 8, characterized in that: The cache module includes a cache lifting mechanism arranged on the inner wall of the side panel, a cache component connected to the cache lifting mechanism, the cache component includes a cache follower block connected to the cache lifting mechanism, a cache vacuum plate connected to the top of the cache follower block, a mirror suction cup mounting plate connected to the top of the cache vacuum plate, and a mirror suction cup arranged on the mirror suction cup mounting plate, the mirror suction cup mounting plate is internally provided with a vacuum air duct ventilation, and the mirror suction cup mounting plate is externally provided with an air pipe joint for connecting to a vacuum source.

10. A method for using a die bonder, characterized in that: The steps include: Step S1, the wafer-level camera module identifies the wafer in the wafer loading mechanism and detects the specific position of each chip; Step S2: The picking module moves to the corresponding chip position according to the detection result of the wafer-level camera module, and picks up the chip from the wafer; Step S3: The picking module places the picked-up chip on the cache module to temporarily fix the chip; Step S4, the solid crystal vision component uses CCD technology to locate the cached chip to ensure the accurate position of the chip; Step S5, the die-bonding assembly absorbs the chip on the cache module through a rotational motion; Step S6: After the nozzle of the die bonding component picks up the chip, the upper visual module checks the angle of the chip and adjusts the chip angle; Step S8, the die-bonding vision component uses CCD technology again to locate the designated die-bonding position on the substrate; Step S9, the die-bonding assembly places the chip precisely at a designated position on the substrate to complete the die-bonding operation; The following steps are performed simultaneously with steps S4-S9: Step S10, the glue storage motor assembly in the glue dipping module drives the glue storage disk to rotate, so that the glue is evenly distributed on the glue storage disk; Step S11, the glue dipping visual component uses CCD technology to identify the specific position on the substrate where glue dipping is required; Step S12, the glue dipping mechanism is driven down by the glue dipping mechanism, and the spring-type glue dipping mechanism contacts the glue storage tray and dips the glue; the glue dipping mechanism is then moved to a designated position on the substrate, and the glue is precisely applied around the die bonding position by the glue dipping head.

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