Waterproof diode packaging structure

Abstract

The invention discloses a waterproof diode packaging structure, and belongs to the field of diodes. A waterproof diode packaging structure comprises a plastic protective shell and further comprises a positioning structure, a top end arranged in the plastic protective shell, a heat dissipation structure arranged at the top end of the positioning structure and packaging resin arranged in the top end of the plastic protective shell. According to the invention, the copper ring is accurately embedded into the pressure groove, so that the heat conducting plate is in close contact with the diode chip, the copper ring transmits the heat of the aluminum oxide ceramic heat conducting sheet, the temperature of the lead plate and the diode chip is effectively reduced, the efficient heat dissipation function is realized, the heat in the diode chip can be timely conducted to the external environment, and the service life of the diode chip is prolonged. According to the invention, performance reduction caused by overheating is avoided, direct contact between the diode chip and the packaging resin is ingeniously blocked, and the packaging resin is effectively prevented from cracking and falling off due to direct heating.

Description

Technical Field

[0001] The invention relates to the technical field of diodes, and in particular to a waterproof diode packaging structure. Background Art

[0002] A waterproof diode is a specially designed or processed diode that can work normally in a humid or underwater environment without being damaged. Because of its unidirectional conductivity, the waterproof diode plays a variety of roles in the circuit, such as rectification, detection, and voltage stabilization, and is widely used in outdoor lighting, underwater equipment, automotive electronics and other fields.

[0003] After searching, the Chinese patent application number 202310111249.9 discloses a diode packaging structure, including a base, a chip is installed in the interior of the base, a connecting wire is welded to the surface of the chip, a cover is arranged above the base, a wiring hole is opened at the end of the cover, the wiring hole is installed in cooperation with the connecting wire, a welding plate is riveted under the chip in the base, and the welding plate is welded and fixed to the chip. The present invention can enhance the packaging auxiliary force by providing a notch on the cover. In particular, an annular groove is provided on the cover, and the annular groove is coaxially arranged on the periphery of the wiring hole. By providing an annular groove surrounding the periphery of the wiring hole, the creepage distance can be effectively increased;

[0004] The above patent still has the following shortcomings: the defect of poor heat dissipation effect. Since the device usually uses special packaging materials to ensure its waterproof performance, but these material structures will increase thermal resistance and reduce heat dissipation efficiency, and the device is often used in outdoor or humid environments, the ambient temperature is relatively high, which further aggravates the heat dissipation problem and accelerates the aging process of the packaging glue in contact with the diode, resulting in a decrease in the sealing performance of the packaging glue, and may even cause cracking, falling off and other problems, thereby affecting the waterproof performance and overall reliability of the diode. Summary of the invention

[0005] The purpose of the present invention is to solve the defect of poor heat dissipation effect in the prior art. Since the device usually adopts special packaging materials to ensure its waterproof performance, but these material structures will increase thermal resistance and reduce heat dissipation efficiency, and the device is often used in outdoor or humid environments, the ambient temperature is high, which further aggravates the heat dissipation problem and accelerates the aging process of the packaging glue in contact with the diode, resulting in a decrease in the sealing performance of the packaging glue, and may even cause cracking, falling off and other problems, thereby affecting the waterproof performance and overall reliability of the diode. A waterproof diode packaging structure is proposed.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A waterproof diode packaging structure includes a plastic protective shell and:

[0008] A positioning structure is arranged at the top of the plastic protective shell, and a diode assembly is arranged inside the positioning structure;

[0009] A heat dissipation structure, arranged on the top of the positioning structure, for dissipating heat from the diode assembly;

[0010] A mounting base is arranged at the bottom end of the plastic protective shell;

[0011] An assembly structure is provided between the mounting base and the plastic protective shell, and is used to connect and fix the plastic protective shell to the mounting base;

[0012] The encapsulating resin is arranged inside the top of the plastic protective shell.

[0013] As a preferred technical solution of the present application, the diode assembly includes a lead plate arranged at the top of the positioning structure, a diode chip welded to the top of the lead plate, a connecting terminal inserted into the plastic protective shell and connected to the lead plate, a terminal seat fixed on both sides of the mounting base, and a connecting wire connected to the bottom of the terminal seat.

[0014] As a preferred technical solution of the present application, the heat dissipation structure includes a buckle ring arranged inside the top of the plastic protective shell, a buckle groove opened on the outside of the buckle ring, a buckle block fixed on the inner wall of the plastic protective shell and embedded in the buckle groove, a pressure ring fixed inside the buckle ring, a copper ring arranged inside the pressure ring, a heat conducting plate fixed at the top of the copper ring and in contact with the diode chip, and a heat sink fixed at the top of the heat conducting plate.

[0015] As a preferred technical solution of the present application, the positioning structure includes a positioning seat fixed at the top end of the plastic protective shell, a clamping block inserted inside the positioning seat, a positioning rod fixed on one side of one group of clamping blocks, a positioning groove opened inside another group of clamping blocks, a wire groove opened inside one side of the clamping block and slidably connected to the connecting terminal, a pressing groove opened at the top end of the clamping block, and an alumina ceramic thermal conductive plate fixed inside the top end of the clamping block and in contact with the lead plate.

[0016] As a preferred technical solution of the present application, the assembly structure includes a connecting shell fixed on the outside of the mounting base, a rotating groove opened on the outside of the plastic protective shell, a screw sleeve rotatably connected to the inside of the rotating groove, an anti-slip groove opened on the outside of the screw sleeve, and a rubber pad fixed at the bottom end of the plastic protective shell.

[0017] As a preferred technical solution of the present application, a plurality of groups of heat sinks are arranged on the top of the heat conducting plate, and the plurality of groups of heat sinks are distributed at equal intervals on the top of the heat conducting plate.

[0018] As a preferred technical solution of the present application, a snap-fit ​​structure is formed between the buckle block and the buckle groove, and a welded integrated structure is formed between the copper ring and the heat conducting plate.

[0019] As a preferred technical solution of the present application, the interior of the positioning seat is a funnel-shaped inclined structure, and the internal cavity of the positioning seat matches the shape of the bottom of the clamping block.

[0020] As a preferred technical solution of the present application, a plug-in structure is formed between the positioning rod and the positioning groove, and the positioning rods are symmetrically distributed on the vertical center line of the clamping block.

[0021] As a preferred technical solution of the present application, an external thread is arranged on the outer side wall of the connecting shell, and an internal thread cooperating with the external thread is arranged inside the anti-slip groove.

[0022] Compared with the prior art, the present invention provides a waterproof diode packaging structure having the following features:

[0023] Beneficial effects:

[0024] 1. The waterproof diode packaging structure precisely embeds the copper ring into the groove to make the heat conducting plate and the diode chip in close contact. The copper ring transfers the heat of the alumina ceramic heat conducting sheet, effectively reducing the temperature of the lead plate and the diode chip. It not only realizes the efficient heat dissipation function, but also can timely conduct the heat inside the diode chip to the external environment, avoiding the performance degradation caused by overheating, but also cleverly blocks the direct contact between the diode chip and the packaging resin, effectively preventing the packaging resin from cracking and falling off due to direct heat.

[0025] 2. The waterproof diode packaging structure, by closing two sets of clamps, the positioning rod is accurately inserted into the positioning groove, and the lead plate and the diode chip are placed inside the two sets of alumina ceramic thermal conductive sheets, and then the clamps are cleverly inserted into the positioning seat, and the clamps are tightly fitted. This design not only realizes the rapid installation and positioning function, so that the diode chip can be quickly installed and fixed during the assembly process, but also strictly limits the position of the diode chip to prevent it from shifting and shaking during the packaging process, thereby ensuring the stability and reliability of the packaging;

[0026] 3. The waterproof diode packaging structure moves the mounting base toward the plastic protective shell by rotating the screw sleeve. At the same time, the rubber pad fills the gap between the connecting shell and the plastic protective shell, effectively preventing liquid leakage. This design not only realizes the quick connection function, allowing the device to be quickly connected to the circuit, but also ensures the sealing and waterproof performance of the connection, which can ensure the normal use of the device even in a humid or liquid environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1This is one of the structural schematic diagrams of a waterproof diode packaging structure proposed by the present invention;

[0028] Figure 2 This is a second structural schematic diagram of a waterproof diode packaging structure proposed by the present invention;

[0029] Figure 3 This is a third structural schematic diagram of a waterproof diode packaging structure proposed by the present invention;

[0030] Figure 4 This is a fourth structural schematic diagram of a waterproof diode packaging structure proposed by the present invention;

[0031] Figure 5 A waterproof diode packaging structure proposed by the present invention Figure 2 The structural diagram of part A in the figure;

[0032] Figure 6 A schematic diagram of the three-dimensional structure of a positioning structure in a waterproof diode packaging structure proposed by the present invention;

[0033] Figure 7 The present invention provides a schematic diagram of a three-dimensional cross-sectional structure of a heat dissipation structure in a waterproof diode packaging structure.

[0034] In the figure:

[0035] 1. Plastic protective shell; 2. Packaging resin; 3. Heat dissipation structure; 301. Pressing ring; 302. Buckling ring; 303. Heat sink; 304. Heat conducting plate; 305. Copper ring; 306. Buckle block; 307. Buckle groove; 4. Assembly structure; 401. Screw sleeve; 402. Anti-skid groove; 403. Connecting shell; 404. Rotating groove; 405. Rubber pad; 5. Connecting wire; 6. Positioning structure; 601. Positioning seat; 602. Clamping block; 603. Wire groove; 604. Pressing groove; 605. Alumina ceramic heat conducting sheet; 606. Positioning rod; 607. Positioning groove; 7. Terminal seat; 8. Mounting base; 9. Connecting terminal; 10. Lead plate; 11. Diode chip. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0037] like Figures 1 to 7 As shown, an embodiment of the present invention provides a waterproof diode packaging structure, including a plastic protective shell 1, and also including:

[0038] The positioning structure 6 is arranged at the top of the plastic protective shell 1, and a diode component is arranged inside the positioning structure 6;

[0039] The heat dissipation structure 3 is arranged on the top of the positioning structure 6 and is used to dissipate heat for the diode assembly;

[0040] A mounting base 8 is arranged at the bottom end of the plastic protective shell 1;

[0041] The assembly structure 4 is arranged between the mounting base 8 and the plastic protective shell 1, and is used to connect and fix the plastic protective shell 1 to the mounting base 8;

[0042] The packaging resin 2 is arranged inside the top end of the plastic protective shell 1 .

[0043] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, in one embodiment: the diode assembly includes a lead plate 10 arranged at the top of the positioning structure 6, a diode chip 11 welded to the top of the lead plate 10, a connecting terminal 9 inserted into the plastic protective shell 1 and connected to the lead plate 10, a terminal seat 7 fixed on both sides of the mounting base 8, and a connecting wire 5 connected to the bottom of the terminal seat 7.

[0044] like Figure 7 As shown, in one embodiment: the heat dissipation structure 3 includes a buckle ring 302 arranged inside the top of the plastic protective shell 1, a buckle groove 307 opened on the outside of the buckle ring 302, a buckle block 306 fixed on the inner wall of the plastic protective shell 1 and embedded in the buckle groove 307, a pressing ring 301 fixed inside the buckle ring 302, a copper ring 305 arranged inside the pressing ring 301, a heat conducting plate 304 fixed at the top of the copper ring 305 and in contact with the diode chip 11, and a heat sink 303 fixed at the top of the heat conducting plate 304; by inserting the copper ring 305 into the pressing groove 604, the heat conducting plate 304 is in contact with the diode chip 11, and the copper ring 305 transfers the heat of the alumina ceramic heat conducting plate 605, so that the temperature of the lead plate 10 and the diode chip 11 is reduced, and the buckle ring 302 is installed to ensure that each group of components is not easy to shake and fall off during the glue dripping process.

[0045] like Figure 6As shown, in one embodiment: the positioning structure 6 includes a positioning seat 601 fixed to the top of the inside of the plastic protective shell 1, a clamping block 602 inserted into the positioning seat 601, a positioning rod 606 fixed on one side of one group of clamping blocks 602, a positioning groove 607 opened in the other group of clamping blocks 602, a wire groove 603 opened in one side of the clamping block 602 and slidably connected to the connecting terminal 9, a pressing groove 604 opened at the top of the clamping block 602, and an alumina ceramic thermal conductive sheet 605 fixed inside the top of the clamping block 602 and in contact with the lead plate 10; by closing the two groups of clamping blocks 602 and inserting the positioning rod 606 into the positioning groove 607, the lead plate 10 and the diode chip 11 are located inside the two groups of alumina ceramic thermal conductive sheets 605, and the clamping block 602 is inserted into the interior of the positioning seat 601, so that the clamping block 602 fits tightly after installation and is not easy to separate.

[0046] like Figure 5 As shown, in one embodiment: the assembly structure 4 includes a connecting shell 403 fixed on the outside of the mounting base 8, a rotating groove 404 opened on the outside of the plastic protective shell 1, a screw sleeve 401 rotatably connected to the inside of the rotating groove 404, an anti-slip groove 402 opened on the outside of the screw sleeve 401, and a rubber pad 405 fixed at the bottom end of the plastic protective shell 1; the screw sleeve 401 is rotated to pull the mounting base 8 toward the plastic protective shell 1, and the rubber pad 405 is deformed to fill the gap between the connecting shell 403 and the plastic protective shell 1 to prevent liquid leakage.

[0047] like Figure 7 As shown, in one embodiment: a plurality of groups of heat sinks 303 are arranged on the top of the heat conducting plate 304, and the plurality of groups of heat sinks 303 are evenly spaced and distributed on the top of the heat conducting plate 304; the heat dissipation area of ​​the heat conducting plate 304 is increased by the plurality of groups of heat sinks 303, thereby improving the heat dissipation effect of the heat conducting plate 304.

[0048] like Figure 7 As shown, in one embodiment: a snap-fit ​​structure is formed between the buckle block 306 and the buckle groove 307, and a welded integrated structure is formed between the copper ring 305 and the heat conducting plate 304; the buckle block 306 is inserted into the buckle groove 307 to quickly fix the position between the buckle ring 302 and the plastic protective shell 1 so that it is not easy to fall off; since the copper ring 305 and the heat conducting plate 304 are welded integrated, the generation of gaps is reduced, so that the copper ring 305 can directly transfer heat to the heat conducting plate 304.

[0049] like Figure 6 As shown, in one embodiment, the interior of the positioning seat 601 is a funnel-shaped inclined structure, and the internal cavity of the positioning seat 601 matches the bottom shape of the clamping block 602; the internal funnel-shaped groove of the positioning seat 601 is used to make the clamping block 602 fit tightly after installation and not easy to separate.

[0050] like Figure 6 As shown, in one embodiment: a plug-in structure is formed between the positioning rod 606 and the positioning groove 607, and the positioning rod 606 is symmetrically distributed on the vertical center line of the clamp 602; by inserting the positioning rod 606 into the interior of the positioning groove 607, the installation of the two groups of clamps 602 is positioned to ensure that the two groups of clamps 602 are accurately aligned.

[0051] like Figure 5 As shown, in one embodiment: an external thread is provided on the outer wall of the connecting shell 403, and an internal thread that cooperates with the external thread is provided inside the anti-slip groove 402; through the engagement of the threads, the screw sleeve 401 pulls the connecting shell 403 toward the plastic protective shell 1 during rotation, so that the plastic protective shell 1 is tightly connected and fixed to the mounting base 8.

[0052] Specifically, when the waterproof diode packaging structure is used: when packaging the device, the diode chip 11 is welded to the surface of the lead plate 10, and the connection terminal 9 is connected and fixed to the circuit inside the lead plate 10, so that the positioning structure 6 fixes the position of the connection terminal 9, and the installation of the lead plate 10 is positioned, so that the lead plate 10 is accurately placed at the center position inside the plastic protective shell 1, and then the heat dissipation structure 3 is installed on the top of the positioning structure 6, and the positioning structure 6 is pressed and fixed, and at the same time, the heat dissipation structure 3 can cooperate with the positioning structure 6 to fix the lead plate 10 and the diode chip 1 1 for heat dissipation. After assembly, use a glue dispenser to inject glue into the interior of the plastic protective shell 1 to fill the space inside the plastic protective shell 1, prevent gas and liquid from contacting the diode chip 11, and achieve a waterproof and sealing effect. At the same time, the plastic protective shell 1 is used to reinforce and protect the entire device to reduce the impact of collision on the entire device. When installing the device, insert the connecting terminal 9 into the terminal seat 7, rotate the assembly structure 4, connect and fix the plastic protective shell 1 and the mounting base 8, connect the connecting wire 5 to the external circuit, and enable the device to rectify and stabilize the current in the circuit;

[0053] By placing two groups of clamping blocks 602 on the outside of the connecting terminal 9 and pushing the two groups of clamping blocks 602 together, the connecting terminal 9 is located inside the wire groove 603, and the positioning rod 606 is inserted into the positioning groove 607, and the two groups of positioning rods 606 are accurately aligned, so that the lead plate 10 and the diode chip 11 are located inside the two groups of alumina ceramic heat conductive sheets 605, and the clamping block 602 is inserted into the positioning seat 601, so that the lead plate 10 and the diode chip 11 are installed inside the plastic protective shell 1, and at the same time, the funnel-shaped groove inside the positioning seat 601 is used to make the clamping block 602 fit tightly after installation and not easy to separate, and the heat at the bottom of the lead plate 10 is transferred to the surrounding components through the alumina ceramic heat conductive sheet 605, so as to reduce the temperature of the lead plate 10, and at the same time, the material of the alumina ceramic heat conductive sheet 605 is alumina ceramic material, which has excellent thermal conductivity and insulation, ensuring the normal use of the lead plate 10;

[0054] After the positioning structure 6 is installed, the copper ring 305 is inserted into the inner part of the pressing groove 604, so that the heat conducting plate 304 is aligned with the diode chip 11 and contacts the diode chip 11 to dissipate heat. The inner wall of the copper ring 305 contacts the alumina ceramic heat conducting sheet 605, so that the copper ring 305 can transfer the heat of the alumina ceramic heat conducting sheet 605, and the heat is dissipated by the heat conducting plate 304. At the same time, the heat dissipation area of ​​the heat conducting plate 304 is increased by using the heat sink 303, and the heat dissipation effect of the heat conducting plate 304 is improved. The temperature of the lead plate 10 and the diode chip 11 is reduced to ensure the normal use of the device. The buckle ring 302 is inserted into the plastic protective shell 1, and the buckle block 306 is embedded in the buckle groove 307 to fix the buckle ring 302 inside the plastic protective shell 1. At the same time, the pressing ring 301 directly presses the copper ring 305, and the copper ring 305 presses the clamping block 602 through the pressing groove 604 to ensure that each group of components is stably fixed inside the device and that each group of components is not easy to shake and fall off during the glue dripping process;

[0055] When docking the device, the connecting terminal 9 is aligned and inserted into the terminal seat 7 to make the connecting shell 403 contact with the screw sleeve 401, and the screw sleeve 401 is rotated to make the screw sleeve 401 move downward along the outer wall of the connecting shell 403 through the internal thread, so that the mounting base 8 moves toward the plastic protective shell 1, and the rubber pad 405 contacts the connecting shell 403. As the screw sleeve 401 continues to rotate, the pressure on the rubber pad 405 increases, causing it to deform to fill the gap between the connecting shell 403 and the plastic protective shell 1, thereby preventing liquid leakage, and increasing the friction on the surface of the screw sleeve 401 through the anti-slip groove 402 to facilitate the rotation of the screw sleeve 401.

[0056] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A waterproof diode packaging structure, comprising a plastic protective shell (1), characterized in that: Also includes: A positioning structure (6) is arranged at the top end of the plastic protective shell (1), and a diode component is arranged inside the positioning structure (6); A heat dissipation structure (3), arranged on the top of the positioning structure (6), for dissipating heat from the diode assembly; A mounting base (8) is arranged at the bottom end of the plastic protective shell (1); An assembly structure (4) is arranged between the mounting base (8) and the plastic protective shell (1) and is used to connect and fix the plastic protective shell (1) to the mounting base (8); The packaging resin (2) is arranged inside the top end of the plastic protective shell (1).

2. A waterproof diode packaging structure according to claim 1, characterized in that: The diode assembly comprises a lead plate (10) arranged at the top end of a positioning structure (6), a diode chip (11) welded to the top end of the lead plate (10), a connecting terminal (9) inserted into the plastic protective shell (1) and connected to the lead plate (10), a terminal seat (7) fixed to both sides of the inside of a mounting base (8), and a connecting wire (5) connected to the bottom end of the terminal seat (7).

3. The waterproof diode packaging structure according to claim 1, characterized in that: The heat dissipation structure (3) comprises a buckle ring (302) arranged inside the top end of the plastic protective shell (1), a buckle groove (307) provided on the outside of the buckle ring (302), a buckle block (306) fixed on the inner side wall of the plastic protective shell (1) and embedded in the buckle groove (307), a pressure ring (301) fixed inside the buckle ring (302), a copper ring (305) arranged inside the pressure ring (301), a heat conduction plate (304) fixed on the top end of the copper ring (305) and in contact with the diode chip (11), and a heat sink (303) fixed on the top end of the heat conduction plate (304).

4. The waterproof diode packaging structure according to claim 1, characterized in that: The positioning structure (6) comprises a positioning seat (601) fixed to the top of the inside of the plastic protective shell (1), a clamping block (602) inserted into the positioning seat (601), a positioning rod (606) fixed to one side of one group of clamping blocks (602), a positioning groove (607) opened inside the other group of clamping blocks (602), a wire groove (603) opened inside one side of the clamping block (602) and slidably connected to the connecting terminal (9), a pressing groove (604) opened at the top of the clamping block (602), and an alumina ceramic heat conductive sheet (605) fixed inside the top of the clamping block (602) and in contact with the lead plate (10).

5. The waterproof diode packaging structure according to claim 1, characterized in that: The assembly structure (4) comprises a connection shell (403) fixed on the outside of the mounting base (8), a rotation groove (404) provided on the outside of the plastic protective shell (1), a screw sleeve (401) rotatably connected inside the rotation groove (404), an anti-slip groove (402) provided on the outside of the screw sleeve (401), and a rubber pad (405) fixed on the bottom end of the plastic protective shell (1).

6. The waterproof diode packaging structure according to claim 3, characterized in that: A plurality of groups of heat sinks (303) are arranged on the top of the heat conducting plate (304), and the plurality of groups of heat sinks (303) are distributed at equal intervals on the top of the heat conducting plate (304).

7. The waterproof diode packaging structure according to claim 3, characterized in that: The buckle block (306) and the buckle groove (307) form a snap-fit ​​structure, and the copper ring (305) and the heat conducting plate (304) form a welded integrated structure.

8. The waterproof diode packaging structure according to claim 4, characterized in that: The interior of the positioning seat (601) is a funnel-shaped inclined surface structure, and the internal cavity of the positioning seat (601) matches the shape of the bottom of the clamping block (602).

9. The waterproof diode packaging structure according to claim 4, characterized in that: The positioning rods (606) and the positioning grooves (607) form a plug-in structure, and the positioning rods (606) are symmetrically distributed on the vertical center line of the clamping block (602).

10. The waterproof diode packaging structure according to claim 5, characterized in that: An external thread is provided on the outer wall of the connection shell (403), and an internal thread matching the external thread is provided inside the anti-slip groove (402).

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