Female header with good heat dissipation performance and female header connector with good heat dissipation performance

Abstract

The invention belongs to the field of electrical connection devices, and particularly relates to a female header with good heat dissipation performance. The jacks are formed in the surface of one side of the socket, the heat dissipation holes extend to the surface of the other side of the socket from the bottoms of the jacks, the electrodes are arranged in one-to-one correspondence with the jacks, one ends of the electrodes are fixed to the inner side walls of the jacks, and the other ends of the electrodes extend into the heat dissipation holes; the electrodes have heat sensitivity, and when the temperature of the electrodes rises, the electrodes are heated to deform so that the ends, located in the heat dissipation holes, of the electrodes can stretch out of the heat dissipation holes. The heat dissipation device has the effect of carrying out targeted heat dissipation on the electrode in work.

Description

Technical Field

[0001] The present application relates to the field of electrical connection devices, and in particular to a female header with good heat dissipation and a female header connector with good heat dissipation. Background Art

[0002] Female header connectors are widely used in power and electronic systems to achieve electrical connections and current distribution. These connectors usually include a female header and multiple pin headers. The female header serves as the output channel of the main power supply, while the pin header can be electrically connected to different electrical devices or circuits. The plug-in design allows the pin header to be easily inserted or removed from the female header to achieve rapid configuration or reorganization of the circuit.

[0003] The importance of the mother-pin header system lies in providing a centralized and reliable electrical connection point, which greatly simplifies power management and distribution. Especially in situations where equipment needs to be frequently replaced or maintained, such as data centers and industrial automation, the quick disassembly function between the pin header and the mother-pin header allows engineers to quickly replace machines or upgrade systems without disassembling the entire power distribution system. This design not only improves maintenance efficiency, but also reduces system downtime. Especially in the case of multiple pin header outputs, only some of the pin headers need to be disconnected to achieve maintenance of the electrical equipment corresponding to the pin header without affecting the normal operation of the remaining equipment.

[0004] However, although the pluggable design of the female header connector brings significant convenience, the electrodes for pluggable connection are achieved by abutment rather than welding or fixed connection. This physical contact point is not as stable as a permanent welding point in terms of electrical performance, which makes the contact resistance between the pin header and the female header relatively large. In the actual high-power, high-current transmission process, although the increase in resistance does not cause obvious power consumption loss relative to the entire system, it will cause the heating phenomenon at the electrode to increase, which not only affects the current transmission efficiency, but may also accelerate material aging, thereby affecting the stability and safety of the entire system. Therefore, there is an urgent need for a new design of a female header connector to reduce the heating problem caused by contact resistance. Summary of the invention

[0005] In order to solve the above problems, alleviate the heating of the electrodes at the connection between the mother header and the pin header, and reduce the working temperature of the mother header, in a first aspect, the present application provides a mother header with good heat dissipation.

[0006] The present application provides a motherboard with good heat dissipation, which adopts the following technical solution: A female header with good heat dissipation performance comprises a socket; a plurality of sockets provided on one side surface of the socket and heat dissipation holes extending from the bottom of the sockets to the other side surface of the socket, and electrodes arranged in one-to-one correspondence with the sockets, one end of the electrode being fixed to the inner side wall of the socket and the other end extending into the heat dissipation hole; the electrode is heat-sensitive, and when the temperature of the electrode rises, the electrode is deformed by the heat so that the end located in the heat dissipation hole can extend out of the heat dissipation hole.

[0007] By adopting the above technical solution, when the electrode heats up due to the current load during operation, its free end will extend to the back of the socket through the heat dissipation hole, and the heat dissipation method will change from mainly heat conduction to mainly heat convection. By increasing the heat dissipation specific surface area, the heat is more effectively dissipated to the environment, reducing the heat accumulation of the electrode and surrounding components. This adaptive heat dissipation mechanism can significantly improve the working efficiency and electrical safety of the motherboard, especially under high load conditions, helping to prevent electrical failures caused by overheating.

[0008] Optionally, the electrode is a double-layer structure, including a first electrode layer and a second electrode layer bonded to each other, and the thermal expansion coefficient of the first electrode layer is greater than the thermal expansion coefficient of the second electrode layer.

[0009] By adopting the above technical solution, when the electrode extends to the back of the socket, the deformation of the first electrode layer is greater than that of the second electrode layer, and the portion of the electrode in the heat dissipation hole is constrained and cannot be curled, while the protruding portion will bend toward the second electrode layer. This reduces the distance between the end of the electrode and the socket surface when the electrode extends to the same heat dissipation length, which has the effect of reducing the overall size of the structure.

[0010] Optionally, the electrode includes an insulating segment located in the socket and a conductive segment connected to the end of the insulating segment. In a first state, the conductive segment is partially located in the socket and extends into the heat dissipation hole. In a second state, the electrode expands due to heat so that the conductive segment leaves the socket and completely enters the heat dissipation hole.

[0011] By adopting the above technical solution, when the female connector is working normally, the temperature of the electrode is within the preset safety range, at least part of the conductive segment is located in the socket, and is electrically connected to the pin header; when the working temperature of the electrode exceeds the preset safety limit, the entire circuit system is at risk of overload or short circuit, the conductive segment of the electrode completely enters the heat dissipation hole, the electrode and the pin header are disconnected, and the circuit stops working, thereby avoiding combustion or even explosion caused by excessive temperature.

[0012] Optionally, it further includes a shell, the socket is arranged in the shell and the bottom of the socket is spaced apart from the shell, the jack is exposed outside the shell, and the portion of the electrode extending out of the surface of the socket is located in the shell.

[0013] By adopting the above technical solution, the shell can protect the electrodes extending out of the socket.

[0014] Optionally, a baffle is provided at the opening of one end of the heat dissipation hole away from the socket, and the baffle is fixedly connected to the socket or the shell. When the electrode is extended due to heat, the baffle can guide the electrode to tilt toward one side of the opening, and the tangent line extending from one end of the socket surface forms an acute angle with the surface of the socket.

[0015] By adopting the above technical solution, the extension process of the electrode is blocked by the blocking piece and can only be extended at an angle, so that when the electrode is extended to the same heat dissipation length, the distance between its end and the socket surface is reduced, which has the effect of reducing the overall size of the structure.

[0016] Optionally, a plurality of ventilation holes are provided on the shell to achieve convective heat exchange of the extending portion of the electrode.

[0017] By adopting the above technical solution, the convective heat transfer on the electrode surface is more intense and the heat dissipation effect is better.

[0018] Optionally, one end of the electrode located in the insertion hole is wavy, and the thermal expansion coefficient of the inner side of each wave bend is greater than the thermal expansion coefficient of the outer side.

[0019] By adopting the above technical solution, when the electrode is heated, the expansion amount of the inner side of the wave bend is greater than the expansion amount of the outer side, the wave bend produces a reverse curve, the curvature decreases, and the length of the entire electrode increases.

[0020] Optionally, the electrode is made of thermotropic SMP material.

[0021] By adopting the above technical solution, when the electrode is heated, its size will change according to a preset shape and extend out of the heat dissipation hole to achieve heat dissipation.

[0022] In a second aspect, the present application provides a female connector with good heat dissipation performance.

[0023] The present application provides a female connector with good heat dissipation, which adopts the following technical solution: A female connector with good heat dissipation comprises a pin header and a female connector. The female connector is the female connector with good heat dissipation. The pin header is inserted into the jack and is electrically connected to the electrode.

[0024] Optionally, there are multiple groups of pin headers, and each group of pin headers is electrically connected to the female header respectively.

[0025] By adopting the above technical solution, there is a larger resistance between the pin row and the electrode than other parts of the circuit. Therefore, when the circuit is working, the electrode position has a higher temperature to support the extension and heat dissipation of the electrode, and only the electrode in the working state will extend to dissipate heat, avoiding the obstruction of the cooling airflow by the electrode in the non-working state, thereby increasing the airflow rate and cooling efficiency.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. The motherboard design of the present invention adopts a thermosensitive electrode, which can automatically extend and protrude outside the heat dissipation hole when the working temperature rises, increasing the heat dissipation surface area, thereby accelerating the heat dissipation. This design of automatically adjusting the heat dissipation area allows the electrode to actively improve the heat dissipation efficiency when the current load increases, effectively reducing the accumulation of heat energy generated by resistance, avoiding overheating of electrical equipment, and improving the stability and reliability of the system.

[0027] 2. In the present invention, electrodes that are not involved in the work will not extend out of the heat dissipation holes, so they will not block or interfere with the heat dissipation area. This design means that only the working electrodes will participate in the convection heat exchange on the back of the socket, optimizing the targetedness and efficiency of heat dissipation. Such a configuration reduces ineffective heat dissipation blockage, ensures smooth heat dissipation air circulation, and further enhances the overall heat dissipation effect, especially when the socket density is high and there are many unoccupied electrodes.

[0028] 3. The electrode consists of an insulating section and a conductive section. This design allows the conductive section to be pushed into the heat dissipation hole when the electrode expands excessively due to overheating, thereby disconnecting the circuit. This automatic power-off protection mechanism can respond quickly when the circuit is abnormal, such as overload or short circuit, and automatically cut off the power supply to avoid electrical accidents and improve the safety of the system. This design is particularly suitable for high-load electrical systems, which can effectively prevent the spread of faults and protect the safety of equipment and personnel.

[0029] 4. The different thermal expansion coefficients of the first electrode layer and the second electrode layer enable the electrode to store flexural prestress inside the heat dissipation hole after thermal expansion, and the electrode bends by itself after extending out of the heat dissipation hole. This bending of the electrode helps to reduce the required mechanical space, making the female connector design more compact and suitable for space-constrained application scenarios, such as portable devices or dense electrical layouts. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is an overall structural diagram of a motherboard with good heat dissipation performance according to Example 1 of the present application; Figure 2 It is a partial cross-sectional view of a motherboard with good heat dissipation in a non-working state according to Example 1 of the present application; Figure 3 This is a partial cross-sectional view of a motherboard with good heat dissipation in working state according to Example 1 of the present application; Figure 4 It is a partial cross-sectional view of a mother header with good heat dissipation in a non-working state according to Embodiment 2 of the present application; Figure 5 This is a partial cross-sectional view of a motherboard in working state with good heat dissipation according to Embodiment 2 of the present application; Figure 6 This is an overall structural diagram of a female connector with good heat dissipation performance according to Embodiment 4 of the present application; Figure 7 This is a partial exploded view of a female connector with good heat dissipation performance according to Example 4 of the present application.

[0031] Explanation of the reference numerals: 1. female header; 11. socket; 12. jack; 13. electrode; 131. conductive segment; 132. insulating segment; 133. first electrode layer; 134. second electrode layer; 14. shell; 15. baffle; 16. vent; 17. heat dissipation hole; 2. pin header. DETAILED DESCRIPTION

[0032] The following is combined with Figure 1-7 This application is described in further detail.

[0033] The female connector is a commonly used power distribution hub in power electronic systems. Through the detachable connection between the female connector and multiple sets of pin headers, it achieves an effect similar to a power strip but with a higher wiring density. In practical applications, the use of female connectors makes it easier to inspect and maintain downstream equipment. On the one hand, the female connector itself serves as a protective structure for the entire electrical system. When the circuit is overloaded, short-circuited, or has other defects, the female connector is more likely to fail first, so that the circuit fault is discovered before it actually damages the electrical equipment; on the other hand, when inspecting some downstream equipment, you only need to pull out the corresponding pin headers, which will not interfere with the normal operation of other equipment.

[0034] However, due to this plug-and-play detachable connection, there is a relatively high resistance between the female header and the pin header. Although the actual resistance value does not have a significant effect on current transmission, it will cause heating inside the female header connector during high current and high power transmission, and may even lead to overheating, combustion, and explosion accidents.

[0035] The embodiment of the present application discloses a motherboard with good heat dissipation performance.

[0036] Example 1 Reference Figure 1 , Figure 2The female header with good heat dissipation includes a socket 11, a housing 14 for receiving and protecting the socket 11, a plurality of sockets 12 provided on one side of the socket 11, and electrodes 13 and heat dissipation holes 17 provided one by one with the sockets 12. For the sake of simplicity, the side of the socket 11 with the sockets 12 provided is defined as the front side, and the side opposite to the front side is defined as the back side.

[0037] The depth of the plug hole 12 is between one quarter and three quarters of the distance between the front and back of the socket 11 . The heat dissipation hole 17 is formed at the bottom of the corresponding plug hole 12 and extends to the back of the socket 11 .

[0038] Please refer to Figure 3 The electrode 13 is arranged to fit the inner wall of the socket 12, and there is a gap between the electrode 13 and the inner wall on the opposite side of the socket 12 for the pin 2 to be inserted. One end of the electrode 13 close to the front of the socket 11 is fixedly connected to the socket 11, and the other end is inserted into the heat dissipation hole 17. The electrode 13 is made of a thermosensitive material, exemplarily a thermotropic SMP material. The length of the electrode 13 is positively correlated with the temperature. When the temperature rises, the fixed end of the electrode 13 remains connected to the socket 11, and the free end of the electrode 13 extends from the back of the socket 11 through the heat dissipation hole 17.

[0039] Preferably, the electrode 13 is a double-layer structure, including a first electrode layer 133 and a second electrode layer 134 that are bonded to each other, wherein the thermal expansion coefficient of the first electrode layer 133 is greater than the thermal expansion coefficient of the second electrode layer 134. Specifically, the second electrode layer 134 is sandwiched by the first electrode layer 133 and the inner wall of the socket 12, and the first electrode layer 133 and the second electrode layer 134 are bonded to the inner wall of the socket 11 without direct contact.

[0040] The housing 14 is an insulating box with one side open, and the socket 11 is arranged in the housing 14. The front of the socket 11 is flush with the opening of the housing 14, and there is a gap between the back of the socket 11 and the bottom of the housing 14, and the width of the gap is based on the electrode 13 expanding and extending without obstruction in the working state.

[0041] Preferably, a plurality of vents 16 are provided on the shell 14 , and one end of the vent 16 in the shell 14 is connected to the gap between the back of the socket 11 and the bottom of the shell 14 to achieve convective heat exchange for the electrode 13 .

[0042] The implementation principle of Example 1 is: When the entire electrical system is in operation, the pins 2 corresponding to the downstream electrical equipment are inserted into the socket 11, the pins 2 and the electrodes 13 are in contact with each other, and the pins 2 are physically connected to the socket 12 and electrically connected to the electrodes 13. Because there is a relatively large resistance between the electrodes 13 and the pins 2, there is a phenomenon of converting electrical energy into thermal energy at the electrodes 13, and the temperature of the electrodes 13 rises. Because the size of the electrodes 13 is positively correlated with the temperature, the electrodes 13 expand, and their free ends protrude from the heat dissipation holes 17 to between the back of the socket 11 and the housing 14. The protruding electrodes 13 have a large specific surface area, so they can have a better cooling effect under convection heat transfer, and can keep the working temperature of the electrodes 13 within a relatively safe and stable range.

[0043] Moreover, in the actual operation of the female connector, not all electrodes 13 are necessarily in working state at the same time. Because of different configurations of the electrical system or for power protection considerations, the socket 11 is not necessarily fully loaded, and some of the jacks 12 will not be connected to the pin header 2, so there are some idle electrodes 13. This part of the electrodes 13 will not protrude from the heat dissipation holes 17, which means that only the electrodes 13 in working state on the back of the socket 11 will block the flow of the air-cooling airflow, that is, compared with the solution in the prior art that heat dissipation fins are set one by one for each electrode 13, the air-cooling airflow of this embodiment will not interfere with the ineffective electrodes 13 that are not working, and the heat dissipation power can be concentrated on the working electrode 13, the air-cooling airflow velocity is faster, and the cooling efficiency is also higher.

[0044] In addition, because the thermal expansion coefficient of the first electrode layer 133 is greater than that of the second electrode layer 134, when the electrode 13 extends toward the back of the socket 11, the deformation on one side of the first electrode layer 133 is greater than the deformation on the second electrode layer 134. The portion of the electrode 13 in the heat dissipation hole 17 is constrained and cannot curl, while the protruding portion will bend toward the side of the second electrode layer 134, so that when the electrode 13 extends out for the same heat dissipation length, the distance between its end and the back of the socket 11 is reduced, that is, the gap between the shell 14 and the back of the socket 11 is reduced, which has the effect of reducing the overall size of the structure.

[0045] Example 2 Refer to,4. Figure 5, the difference between this embodiment and embodiment 1 is that: the electrode 13 in this embodiment at least includes an insulating segment 132 and a conductive segment 131. The conductive segment 131 is located on the side of the insulating segment 132 away from the fixed end of the electrode 13. When the electrode 13 is in the first state, that is, normal operation, the length of the insulating segment 132 is less than the length of the electrode 13 in the jack 12, and the pin 2 is in contact with the conductive segment 131; when the electrode 2 is in the second state, that is, when the device fails, the temperature of the electrode 13 exceeds the preset limit temperature, the electrode 13 continues to expand, and the length of the insulating segment 132 is greater than or equal to the length of the electrode 13 in the jack 12.

[0046] Exemplarily, the insulating segment 132 and the conductive segment 131 may be realized by coating corresponding coatings on the surface of the electrode 13 .

[0047] Preferably, a baffle 15 is provided at one end of the heat dissipation hole 17 away from the socket 12. The baffle 15 is fixedly connected to the socket 11 or the shell 14, and can be optionally an inclined surface or an arc surface. When the electrode 13 protrudes from the heat dissipation hole 17 due to heat, the baffle 15 interferes with the electrode 13, causing the protruding direction of the electrode 13 to be deflected, and the angle between the tangent of the free end of the electrode 13 and the back of the socket 11 is an acute angle.

[0048] The implementation principle of Example 2 is: When the electrode 13 is in a normal operating temperature range, the length of the insulating section 132 is smaller than the length of the electrode 13 in the jack 12, the pin header 2 is in direct contact with the conductive section 131 of the electrode 13, and the female connector works normally.

[0049] When the electrical system is overloaded or short-circuited, the temperature of the electrode 13 continues to rise, exceeding the preset safe temperature range, and the electrode 13 continues to extend, pushing the conductive segment 131 completely into the heat dissipation hole 17, disconnecting the conductive segment 131 from the pin header 2 to achieve circuit-breaking protection.

[0050] In summary, the motherboard with good heat dissipation provided in this embodiment has the effect of preventing accidents, physically disconnecting the circuit in advance before deflagration or even explosion occurs, preventing the temperature from continuing to rise while also giving the operator an abnormal signal.

[0051] Example 3 The difference between this embodiment and the first embodiment is that the electrode 13 in this embodiment is not made entirely of the thermotropic SMP material and does not have a double-layer structure.

[0052] It should be noted that the term "not completely thermotropic SMP material" here means that the deformation of the electrode 13 in this embodiment does not rely on the material itself to expand proportionally after being heated to achieve the extension of the electrode 13. Therefore, only a part of the electrode 13 needs to be thermosensitive. As for the specific implementation principle of the thermosensitive effect, it can be that the material itself has a large thermal expansion coefficient or a thermotropic SMP material, and is not limited to a specific material. This is common knowledge in the field and will not be repeated here.

[0053] In this embodiment, one end of the electrode 13 located in the socket 12 is wavy, the plane where the axis of the electrode 13 is located is parallel to the inner wall of the socket 12 it is in contact with, and the thermal expansion coefficient on the inner side of each wave bend is greater than the thermal expansion coefficient on the outer side.

[0054] The implementation principle of Example 3 is: Another structure is provided in which the electrode 13 is deformed and extended to dissipate heat. When the electrode 13 is heated, the expansion amount of the inner side of the wave bend is greater than the expansion amount of the outer side, the wave bend produces a reverse curve, the curvature decreases, and the length of the entire electrode 13 increases.

[0055] The embodiment of the present application also discloses a female connector with good heat dissipation performance.

[0056] Example 4 Reference Figure 6 , Figure 7 The female connector with good heat dissipation includes a female connector 1 and a pin connector 2 matched with the female connector 1. The female connector 1 is the female connector with good heat dissipation disclosed in any one of embodiments 1-3.

[0057] There are multiple groups of pin headers 2, and each group of pin headers 2 is respectively inserted into the jack 12 to achieve electrical connection with the female header 1.

[0058] The implementation principle of Example 4 is: After the pin row 2 is inserted into the jack 12 , it is electrically connected to the electrode 13 . As the current passes through, the electrode 13 gradually heats up and expands. The electrode 13 in the working state protrudes from the heat dissipation hole 17 toward the back of the socket 11 , achieving targeted heat dissipation for the working electrode 13 .

[0059] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A motherboard with good heat dissipation, characterized in that: include: socket(11); A plurality of plug holes (12) provided on one side surface of the socket (11) and a heat dissipation hole (17) extending from the bottom of the plug holes (12) to the other side surface of the socket (11), and An electrode (13) is arranged in one-to-one correspondence with the jack (12), one end of the electrode (13) is fixed to the inner wall of the jack (12) and the other end extends into the heat dissipation hole (17); the electrode (13) is heat-sensitive, and when the temperature of the electrode (13) rises, the electrode (13) is deformed by the heat so that the end located in the heat dissipation hole (17) can extend out of the heat dissipation hole (17).

2. The motherboard with good heat dissipation according to claim 1, characterized in that: The electrode (13) is a double-layer structure, comprising a first electrode layer (133) and a second electrode layer (134) which are bonded to each other, and the thermal expansion coefficient of the first electrode layer (133) is greater than the thermal expansion coefficient of the second electrode layer (134).

3. The motherboard with good heat dissipation according to claim 1, characterized in that: The electrode (13) comprises an insulating segment (132) located in the insertion hole (12) and a conductive segment (131) connected to the end of the insulating segment (132); in a first state, the conductive segment (131) is partially located in the insertion hole (12) and extends into the heat dissipation hole (17); in a second state, the electrode (13) expands due to heat so that the conductive segment (131) leaves the insertion hole (12) and completely enters the heat dissipation hole (17).

4. The motherboard with good heat dissipation according to claim 1, characterized in that: It also comprises a shell (14), the socket (11) being arranged in the shell (14) and the bottom of the socket (11) being spaced apart from the shell (14), the plug hole (12) being exposed outside the shell (14), and the portion of the electrode (13) extending out of the surface of the socket (11) being located inside the shell (14).

5. The motherboard with good heat dissipation according to claim 4, characterized in that: A baffle (15) is provided at an opening at one end of the heat dissipation hole (17) away from the plug hole (12); the baffle (15) is fixedly connected to the socket (11) or the housing (14); when the electrode (13) is extended due to heat, the baffle (15) can guide the electrode (13) to tilt toward one side of the opening, and the angle between the tangent line at one end extending from the surface of the socket (11) and the surface of the socket (11) is an acute angle.

6. The motherboard with good heat dissipation according to claim 4, characterized in that: The shell (14) is provided with a plurality of ventilation holes (16) for realizing convection heat exchange of the extended portion of the electrode (13).

7. The motherboard with good heat dissipation according to claim 1, characterized in that: One end of the electrode (13) located in the insertion hole (12) is wavy, and the thermal expansion coefficient of the inner side of each wavy bend is greater than the thermal expansion coefficient of the outer side.

8. The motherboard with good heat dissipation according to claim 1, characterized in that: The electrode (13) is made of a thermotropic SMP material.

9. A female connector with good heat dissipation performance, comprising a female connector (1) and a pin connector (2), characterized in that: The female header (1) is a female header (1) with good heat dissipation according to any one of claims 1 to 8, and the pin header (2) is inserted into the plug hole (12) and is electrically connected to the electrode (13).

10. The female connector with good heat dissipation performance according to claim 9, characterized in that: There are multiple groups of pin headers (2), and each group of pin headers (2) is electrically connected to the female header (1).

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