Room-temperature-curable resin composition as well as preparation method and application thereof

Abstract

The invention discloses a resin composition capable of being cured at room temperature as well as a preparation method and application thereof. The resin composition comprises a composition A and a composition B, the composition A comprises 50-80 parts by mass of a benzaldehyde compound and 2-10 parts by mass of a catalyst, and the composition B at least comprises 90-135 parts by mass of a polythiol compound; the benzaldehyde compound is an aromatic compound of which the benzene ring contains at least one aldehyde group; the structure of the polythiol compound is as follows: # imgabs0 #, R1 is alkylene of C2-C18, R2 is-R3-SH, and R3 is alkylene of C2-C18. The resin composition provided by the invention can be cured at room temperature, and the cured resin shows high bonding strength, low water absorption, excellent heat and humidity resistance and chemical resistance, and has a good application prospect in the aspects of industrial assembly and electronic assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of adhesives, and in particular to a room temperature curable resin composition and a preparation method and application thereof. Background Art

[0002] Benzaldehyde resin, as a thermosetting resin, is widely used in industrial production due to its excellent mechanical properties, heat resistance and chemical stability. Benzaldehyde resin is generally liquid or semi-solid at room temperature, and a curing agent needs to be added to promote the curing reaction. The curing agent is a key component that causes the resin to transform from a liquid or semi-solid state to a solid state. It initiates polymerization reactions, cross-linking reactions or other chemical reactions to form chemical bonds between the resin molecular chains, thereby achieving curing. The type and amount of the curing agent directly affect the curing temperature, curing time and curing process of the resin. At the same time, its chemical structure and reactivity determine the properties of the cured material, including mechanical strength, heat resistance, chemical corrosion resistance, water resistance, electrical insulation, etc., thereby affecting the quality and application range of the resin products cured by it.

[0003] Traditional benzaldehyde resin curing agents usually require high temperatures or long heating times to achieve curing, which limits their applicability in specific application scenarios, such as the bonding of heat-sensitive materials or energy consumption issues during large-scale construction. Due to their unique chemical structure and reactivity, thiol curing agents can cure resins at relatively low temperatures and are usually used to cure epoxy resins. However, existing thiol curing agents have great limitations in acid and alkali resistance and moisture and heat resistance. The resin products cured by them have relatively poor acid and alkali resistance and moisture and heat resistance, which limits their wide application in industrial equipment or electronic devices used in humid and hot environments.

[0004] Based on this, there is an urgent need for a benzaldehyde resin composition that can be cured at room temperature and has high bonding strength, acid and alkali resistance, and excellent moisture and heat resistance to meet the performance requirements in the field of high-performance industrial assembly and electronic assembly. Summary of the invention

[0005] To solve the above problems, the present invention provides a room temperature curable resin composition and a preparation method and application thereof, wherein a polythiol compound with a specific structure is used as a curing agent to cure the benzaldehyde resin, which not only can achieve room temperature curing of the benzaldehyde resin, but also the cured benzaldehyde resin exhibits high bonding strength, low water absorption and excellent alkali resistance and moisture and heat resistance, and has good application prospects in the field of electronic packaging.

[0006] Specifically, the following technical solutions are provided:

[0007] The first aspect of the present invention provides a room temperature curable resin composition, the resin composition comprising composition A and composition B; in terms of mass fractions, the composition A comprises 50-80 parts of a benzaldehyde compound and 2-10 parts of a catalyst, and the composition B comprises at least 90-135 parts of a polythiol compound;

[0008] The benzaldehyde compound is an aromatic compound containing at least one aldehyde group on the benzene ring;

[0009] The structure of the polythiol compound is as follows:

[0010]

[0011] Among them, R 1 C 2-18 The alkylene group, R 2 For-R 3 -SH, R 3 C 2-18 of alkylene.

[0012] At present, the curing conditions of benzaldehyde resin are relatively harsh, the energy consumption is large and it is not suitable for bonding heat-sensitive materials, and the acid and alkali resistance and thermal properties of the existing mercaptan curing agent for low-temperature curable resins are poor, which is difficult to meet the application requirements of industrial assembly and electronic devices used in hot and humid environments. To solve the above problems, the present invention uses a polythiol compound of a specific structure as a curing agent to cure benzaldehyde compounds, and the polythiol compound contains a rigid biphenyl structure and four flexible alkyl mercapto groups, which can form a stable thioether bond and a cross-linked network with a high cross-linking density through a condensation reaction between the mercapto group and the aldehyde group of the benzaldehyde compound at room temperature, thereby enhancing the bonding strength and durability of the adhesive; at the same time, the polythiol compound does not have an easily hydrolyzed group, and after the condensation reaction with the benzaldehyde compound, the hydrophilic group can be reduced, the hydrophobic structural unit can be increased, and the water resistance and chemical resistance of the resin composition after curing can be further improved, thereby significantly improving the moisture and heat resistance, alkali resistance, etc. of the cured resin. By using the polythiol compound with a specific structure as a curing agent, not only can the benzaldehyde resin be cured at room temperature, but the cured resin composition also exhibits high bonding strength, low water absorption, high hydrophobicity, and excellent alkali resistance and moisture and heat resistance.

[0013] Further, the benzaldehyde compound is selected from one or more of benzaldehyde, p-hydroxybenzaldehyde, p-aminobenzaldehyde vanillin, p-methoxybenzaldehyde, 4-hydroxy-3-methoxybenzaldehyde, p-nitrobenzaldehyde, m-nitrobenzaldehyde, 2-thienylbenzaldehyde and 2-furanylbenzaldehyde; preferably, the benzaldehyde compound contains at least p-hydroxybenzaldehyde, p-methoxybenzaldehyde and 4-hydroxy-3-methoxybenzaldehyde; more preferably, the mass ratio of 4-hydroxy-3-methoxybenzaldehyde to p-hydroxybenzaldehyde and p-methoxybenzaldehyde in the composition A is preferably (40-60):(5-10):(5-10).

[0014] Furthermore, the polythiol compound is a compound represented by the following structural formula:

[0015]

[0016] Among them, R 1 C 2-18 The alkylene group, R 2 For-R 3 -SH, R 3 C 2-18 of alkylene.

[0017] Furthermore, the preparation method of the polythiol compound comprises the following steps: under a protective atmosphere,

[0018] (1) reacting 4,4'-biphenol and a compound represented by formula I in the presence of a first base reagent, a first phase transfer catalyst and a first solvent to obtain a first intermediate product represented by formula II;

[0019] (2) heating the first intermediate product to obtain a second intermediate product represented by formula III;

[0020] (3) reacting the second intermediate product with the compound represented by formula IV in the presence of a second base reagent, a second phase transfer catalyst and a second solvent to obtain a third intermediate product represented by formula V;

[0021] (4) reacting the third intermediate product with thioacetic acid in the presence of a free radical initiator and a third solvent to obtain a fourth intermediate product represented by formula VI;

[0022] (5) reacting the fourth intermediate product with an acid reagent or a base reagent in the presence of a fourth solvent to obtain the thiol curing agent;

[0023] The structures of the above formula I to formula VI are as follows:

[0024]

[0025] Wherein, X is Cl or Br;

[0026] h is any integer from 0 to 16, and l is any integer from 0 to 15.

[0027] In some preferred embodiments, in step S1, the first alkaline reagent can be selected from one or more of potassium carbonate, sodium carbonate, potassium hydroxide, sodium hydroxide, triethylamine, and p-dimethylaminopyridine; the first phase transfer catalyst is selected from one or more of crown ethers, onium salts, ammonium salts, sulfonium salts, arsenic salts, polyethers, non-cyclic polyethers and tertiary amine catalysts; the first solvent is selected from one or more of acetone, ethyl acetate, tetrahydrofuran, N,N'-dimethylformamide, dichloromethane, dioxane, ethanol, and methanol; the reaction temperature is 60-90°C, and the reaction time is 6-15h.

[0028] In some preferred embodiments, in step S2, the heating reaction temperature is 150-250°C, and the heating reaction time is 10-18h.

[0029] In some preferred embodiments, in step S3, the second alkaline reagent can be selected from one or more of potassium carbonate, sodium carbonate, potassium hydroxide, sodium hydroxide, triethylamine, and p-dimethylaminopyridine; the second phase transfer catalyst is selected from one or more of crown ethers, onium salts, ammonium salts, sulfonium salts, arsenic salts, polyethers, non-cyclic polyethers and tertiary amine catalysts; the second solvent is selected from one or more of acetone, ethyl acetate, tetrahydrofuran, N,N'-dimethylformamide, dichloromethane, dioxane, ethanol, and methanol; the reaction temperature is 60-90°C, and the reaction time is 6-15h.

[0030] In some preferred embodiments, in step S4, the free radical initiator is selected from one or more of azo, organic peroxide and redox initiators, such as azobisisobutyronitrile or benzoyl peroxide; the third solvent is selected from one or more of acetone, ethyl acetate, tetrahydrofuran, N,N'-dimethylformamide, dichloromethane, dioxane, ethanol, and methanol; the reaction temperature is 60-90°C, and the reaction time is 15-25h.

[0031] In some preferred embodiments, in step S5, the acid reagent is hydrochloric acid and / or sulfuric acid, and the base reagent includes but is not limited to sodium hydroxide; the fourth solvent is selected from one or more of acetone, ethyl acetate, tetrahydrofuran, N,N'-dimethylformamide, dichloromethane, dioxane, ethanol, and methanol; the reaction temperature is 55-95°C, and the reaction time is 25-40h.

[0032] Furthermore, the molar ratio of aldehyde functional groups to thiol functional groups in the resin composition is 1:(1.6-2.4), for example 1:1.6, 1:1.7, 1:1.8, 1:1.9, 1:2, 1:2.1, 1:2.2, 1:2.3, 1:2.4, etc., including but not limited to the molar ratios listed above, more preferably 1:(1.8-2.2).

[0033] Furthermore, the catalyst is selected from one or more of an acidic catalyst, a basic catalyst, an organic photocatalyst, a phase transfer catalyst, and a metal catalyst; in some preferred embodiments, the catalyst is trifluoroacetic acid and / or zirconium chloride, more preferably trifluoroacetic acid.

[0034] Furthermore, the composition B further comprises 2-30 parts of a filler and / or 0.1-15 parts of an auxiliary agent; the filler is selected from one or more of carbon black, silica, alumina, magnesium oxide, zinc oxide, boron nitride, silicon carbide, talc, calcium carbonate, glass microspheres, graphite powder, metal powder, and polytetrafluoroethylene; the auxiliary agent is selected from one or more of a dehydrating agent, a flame retardant, a diluent, a pigment, an antioxidant, an adhesion promoter, a defoaming agent, a leveling agent, a thixotropic agent, a leveling agent, and an ion capture agent.

[0035] In some preferred embodiments, the composition A comprises 40-60 parts of 4-hydroxy-3-methoxybenzaldehyde, 5-10 parts of p-hydroxybenzaldehyde, 5-10 parts of p-methoxybenzaldehyde and 2-10 parts of trifluoroacetic acid; the composition B comprises 90-135 parts of a polythiol compound, 2-30 parts of a filler and 0.1-15 parts of an auxiliary agent; the filler comprises carbon black and silicon dioxide, and the auxiliary agent comprises a molecular sieve dehydrating agent.

[0036] The second aspect of the present invention provides a method for preparing the room temperature curable resin composition described in the first aspect, weighing each component according to the formula amount, mixing the benzaldehyde compound and the catalyst evenly to obtain composition A; and mixing the remaining components evenly to obtain composition B.

[0037] Furthermore, when the room temperature curable resin composition is used, composition A and composition B are mixed evenly and cured at room temperature.

[0038] A third aspect of the present invention provides a use of a room temperature curable resin composition in an adhesive or sealant for bonding or sealing industrial equipment and electronic devices.

[0039] Compared with the prior art, the present invention has the following beneficial effects:

[0040] The invention provides a room temperature curable resin composition, comprising a benzaldehyde compound, a catalyst and a polythiol compound having a rigid biphenyl structure and four flexible alkylthiol groups. The resin composition can be cured at room temperature, thereby reducing curing energy consumption, and can be suitable for bonding heat-sensitive materials; more importantly, the resin composition exhibits high bonding strength, high hydrophobicity and low water absorption after being cured at room temperature, still maintains high bonding strength after high temperature and high humidity aging, and has good chemical resistance under alkaline conditions, and can be used as an adhesive or sealant for bonding or packaging of industrial equipment and electronic components, which is beneficial to improving the performance and service life of equipment products.

[0041] The thiol curing agent used in the present invention has low preparation cost and is suitable for industrial mass production. In addition, the thiol curing agent is in liquid state at room temperature, has low viscosity, can be directly used as a curing agent in the curing process of the resin composition, realizes the room temperature curing of the benzaldehyde resin composition, and the internal stress and shrinkage degree generated during curing are small; compared with other thiol curing agents, the polythiol compound does not have an easily hydrolyzable group, and the benzaldehyde resin cured by it has a high cross-linking density and a hydrophobic structural unit, can effectively improve the bonding strength, chemical resistance and wet heat resistance of the resin composition after curing, and is more suitable for preparing adhesives, sealing materials, etc. for industrial equipment and electronic products used in wet and hot environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl prepared in Example 1 1 H-NMR spectrum;

[0043] Figure 2 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl prepared in Example 1 13 C-NMR;

[0044] Figure 3 This is the IR spectrum of 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl prepared in Example 1. DETAILED DESCRIPTION

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items. The symbol "-" between two numbers herein means "to", for example, "50-80 parts of benzaldehyde compounds" means "50 to 80 parts of benzaldehyde compounds".

[0046] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0047] The sources of some of the raw materials used in the following examples and comparative examples are as follows:

[0048]

[0049]

[0050] The structure of commercial polythiol PEMP is shown below:

[0051]

[0052] The preparation of the biphenyl type polythiol compound 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl used in the following examples and comparative examples is as follows:

[0053] (1) 18.6 g of 4,4'-dihydroxybiphenyl and 36.3 g of allyl bromide were dissolved in 250 mL of acetone, and then 55.3 g of anhydrous potassium carbonate and 2.6 g of 18-crown ether-6 were added, and the mixture was stirred at 80° C. for 15 h under N2 protection. After filtering, the solvent and excess raw materials in the filtrate were removed by reduced pressure distillation, and the mixture was washed with water and dried to obtain a first intermediate product;

[0054] (2) heating 26.6 g of the first intermediate product to 200° C. under N2 protection for 13 h, and purifying to obtain a second intermediate product;

[0055] (3) 26.6 g of the second intermediate product and 36.3 g of allyl bromide were dissolved in 250 mL of acetone, 55.3 g of anhydrous potassium carbonate and 2.6 g of 18-crown ether-6 were added, and the mixture was stirred at 70° C. for 10 h under N2 protection. After filtering, the solvent and excess raw materials in the filtrate were removed by reduced pressure distillation, and the filtrate was washed with water and dried to obtain a third intermediate product;

[0056] (4) 34.7 g of the third intermediate product and 45.7 g of thioacetic acid were dissolved in 300 mL of tetrahydrofuran, and 3.3 g of azobisisobutyronitrile was added, and then stirred at 80° C. for 20 h under N2 protection. After filtering, the solvent and excess raw materials in the filtrate were removed by reduced pressure distillation, and the filtrate was washed with water and dried to obtain a fourth intermediate product;

[0057] (5) 65.1 g of the fourth intermediate product and 10 g of concentrated hydrochloric acid were dissolved in 150 mL of tetrahydrofuran and 150 mL of methanol, and the mixture was stirred and reacted at 80° C. for 30 h under N2 protection. After filtering, the solvent and excess raw materials in the filtrate were removed by vacuum distillation, and the mixture was washed with water and dried to obtain a liquid product 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl. Its H NMR spectrum, C NMR spectrum and IR spectrum were as follows: Figure 1-3 As shown, 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl was prepared.

[0058] Example 1

[0059] The present embodiment provides a room temperature curable resin composition, including composition A and composition B. In parts by mass, composition A contains 47 parts of 4-hydroxy-3-methoxybenzaldehyde, 8 parts of 4-hydroxybenzaldehyde, 8 parts of 4-methoxybenzaldehyde, and 6 parts of trifluoroacetic acid, and composition B contains 100 parts of a polythiol compound 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl, 0.1 parts of carbon black, 5 parts of gaseous silica, and 5 parts of a dehydrating agent (Additive TI).

[0060] The raw materials of components A and B are respectively mixed evenly at room temperature, and then degassing is performed, and the discharged materials are dividedly packaged into sealed double tubes A and B to obtain a resin composition.

[0061] Examples 2-13 and Comparative Examples 1-3

[0062] Examples 2-13 and Comparative Examples 1-3 respectively provide a room temperature curable resin composition, which differs from Example 1 only in that the type or content of the benzaldehyde compound, catalyst and / or curing agent in the resin composition formula is different, and the rest are the same.

[0063] The types of benzaldehyde compounds, catalysts and curing agents in the room temperature curable resin compositions prepared in Examples 1-13 and Comparative Examples 1-3 are shown in Table 1 below, wherein the thiol curing agent A is a homemade biphenyl type polythiol compound 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl, the thiol curing agent B is 5,5'-bis(3-mercaptopropyl)-2,2'-bis(3-mercaptopropoxy)biphenyl, and the thiol curing agent C is a commercial polythiol PEMP:

[0064] Table 1

[0065]

[0066] In the table, a / b is the molar ratio of aldehyde functional groups to thiol functional groups in the resin composition.

[0067] Performance Testing

[0068] The performance tests of the resin compositions prepared in the above examples and comparative examples are as follows:

[0069] Curing conditions: The resin compositions prepared in the examples and comparative examples were extruded from double-tube packaging using a dispensing machine, mixed in a static mixer, and then cured at room temperature for 24 hours to obtain cured samples.

[0070] Bonding strength (MPa): The resin compositions prepared in the above embodiments and comparative examples were respectively coated on sheets to prepare test samples with a bonding area of ​​25.4 mm × 5 mm and a thickness of the adhesive layer of 0.1 mm. The test samples were cured respectively, and then the two sheets of the completely cured samples were pulled apart in opposite directions using a universal testing machine and tested at an ambient temperature of 25°C. The measured force values ​​were recorded as strength (MPa). The cured samples were subjected to heating and humidification conditions of 85°C / 85%RH / 750h, and the shear bonding strength (MPa) of the samples was tested again at an ambient temperature of 25°C and recorded.

[0071] Chemical resistance: The resin compositions prepared in the above examples and comparative examples were made into block samples with a size of 20×10×5 mm, and then the test samples were cured. The completely cured samples were placed in a 10wt% sodium hydroxide aqueous solution and soaked at 80°C for 48h. The samples were taken out and dried and weighed to calculate the mass loss rate (%).

[0072] Water drop angle (°): The resin compositions obtained in the above embodiments and comparative examples were added into a syringe, and a fully automatic water drop angle tester was used to perform a water drop angle test. The sitting drop method was adopted, the amount of glue was 3 μL, and a PCB board with a dyne value of 30-32 was used as the substrate. After the sample was dropped onto the substrate, the water drop angle data was read after standing for 5 seconds. Five samples were tested in each group of embodiments, and the final test results were averaged to obtain the water drop angle of the resin composition.

[0073] Water absorption rate (%): The resin compositions prepared in the above embodiments and comparative examples are made into block samples with a size of 20×10×5 mm, and then the test samples are cured. The completely cured samples are placed in 80°C distilled water and soaked at 80°C for 24 hours. The samples are taken out and weighed, and their water absorption rate is calculated according to the corresponding formula. Waterabosoption=(mt-m0) / m0; wherein m0 is the original mass of the sample, and mt is the mass of the sample after t time.

[0074] The above test results are shown in Table 2 below:

[0075] Table 2

[0076]

[0077]

[0078] As shown in Table 2, compared with Comparative Example 1, the resin composition prepared by using a polythiol compound having a rigid biphenyl structure and four flexible alkyl mercapto groups as a curing agent not only has high bonding strength after curing, but also can maintain high bonding strength after high humidity and high heat aging test, showing excellent resistance to moisture and heat. In addition, the resin composition prepared in Comparative Example 1 is placed in a 10wt% sodium hydroxide aqueous solution after curing, and is completely dissolved after soaking at 80°C for 48h, while the resin compositions prepared in Examples 1-13 are placed in a 10wt% sodium hydroxide aqueous solution after curing, and are taken out after soaking under the same conditions, and the mass loss is less than 7%, from which it can be seen that the resin composition provided by the present invention has excellent alkali resistance. In addition, it can be seen from the test results of the water drop angle and water absorption that compared with the resin composition prepared in Comparative Example 1, the resin compositions prepared in Examples 1-13 have a larger water drop angle and a lower water absorption after being cured at room temperature.

[0079] It can be seen from Examples 3 and 12 that the type of catalyst affects the bonding strength, moisture and heat resistance, chemical resistance, etc. of the resin composition after curing. Compared with Example 12, the resin composition prepared with trifluoroacetic acid as a catalyst (Example 3) has a higher bonding strength, chemical resistance and lower water absorption after curing; and it can be seen from Examples 3 and 13 that the substitution position of the mercapto alkyl chain on the phenyl group in the polythiol compound affects the bonding strength and chemical resistance of the resin composition after curing, among which the resin composition cured with the ortho-substituted polythiol compound as a curing agent has significantly better bonding strength, chemical resistance and low water absorption.

[0080] In addition, it can be seen from Examples 1-7 and Comparative Examples 2 and 3 that the ratio of aldehyde functional groups to thiol functional groups in the resin composition will affect the bonding strength, moisture and heat resistance, and chemical resistance of the adhesive layer after curing. When the ratio of the two is controlled to be in the range of 1: (1.6-2.4), the room temperature bonding strength of the adhesive layer of the resin composition prepared in Examples 1-7 after room temperature curing is not less than 14.5 MPa, and after being treated under heating and humidification conditions of 85°C / 85%RH / 750h, the bonding strength is not less than 1 2.0MPa; more preferably, a resin composition in which the ratio of aldehyde functional groups to thiol functional groups is in the range of 1:(1.8-2.2) (Examples 1-5), which has better room temperature bonding strength and moisture and heat resistance, and the mass loss under alkaline conditions is less than 5%, and the hydrophobicity is better; in the above embodiments, when the ratio of aldehyde functional groups to thiol functional groups is 1:2 (Example 1), the prepared resin composition has the best properties after curing, such as bonding strength, moisture and heat resistance, chemical resistance, and hydrophobicity.

[0081] The above-described embodiments are only preferred examples for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or changes made by those skilled in the art based on the present invention are within the protection scope of the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. A room temperature curable resin composition, characterized in that: The resin composition comprises composition A and composition B; in terms of mass fractions, the composition A comprises 50-80 parts of a benzaldehyde compound and 2-10 parts of a catalyst, and the composition B comprises at least 90-135 parts of a polythiol compound; The benzaldehyde compound is an aromatic compound containing at least one aldehyde group on the benzene ring; The structure of the polythiol compound is as follows: Among them, R 1 C 2-18 The alkylene group, R 2 For-R 3 -SH, R 3 C 2-18 of alkylene.

2. The room temperature curable resin composition according to claim 1, characterized in that: The benzaldehyde compound is selected from one or more of benzaldehyde, p-hydroxybenzaldehyde, p-aminobenzaldehyde, vanillin, p-methoxybenzaldehyde, 4-hydroxy-3-methoxybenzaldehyde, p-nitrobenzaldehyde, m-nitrobenzaldehyde, 2-thienylbenzaldehyde and 2-furylbenzaldehyde.

3. The room temperature curable resin composition according to claim 2, characterized in that: The benzaldehyde compounds at least include p-hydroxybenzaldehyde, p-methoxybenzaldehyde and 4-hydroxy-3-methoxybenzaldehyde; Preferably, the mass ratio of 4-hydroxy-3-methoxybenzaldehyde to p-hydroxybenzaldehyde and p-methoxybenzaldehyde in the resin composition is (40-60):(5-10):(5-10).

4. The room temperature curable resin composition according to claim 1, characterized in that: The polythiol compound is a compound represented by the following general structural formula: Among them, R 1 C 2-18 The alkylene group, R 2 For-R 3 -SH, R 3 C 2-18 of alkylene.

5. The room temperature curable resin composition according to claim 1, characterized in that: The molar ratio of the aldehyde functional group to the thiol functional group in the resin composition is 1:(1.6-2.4).

6. The room temperature curable resin composition according to claim 5, characterized in that: The molar ratio of the aldehyde functional group to the thiol functional group in the resin composition is 1:(1.8-2.2).

7. The room temperature curable resin composition according to claim 1, characterized in that: The catalyst is selected from one or more of an acidic catalyst, a basic catalyst, an organic photocatalyst, a phase transfer catalyst, and a metal catalyst; preferably, the catalyst is trifluoroacetic acid.

8. The room temperature curable resin composition according to claim 1, characterized in that: The composition B further comprises 2-30 parts of filler and / or 0.1-15 parts of auxiliary agent; The filler is selected from one or more of carbon black, silicon dioxide, aluminum oxide, magnesium oxide, zinc oxide, boron nitride, silicon carbide, talc, calcium carbonate, glass microspheres, graphite powder, metal powder, and polytetrafluoroethylene; The auxiliary agent is selected from one or more of a dehydrating agent, a flame retardant, a diluent, a pigment, an antioxidant, an adhesion promoter, a defoaming agent, a leveling agent, a thixotropic agent, a leveling agent, and an ion capture agent.

9. A method for preparing the room temperature curable resin composition according to any one of claims 1 to 8, characterized in that: Weigh each component according to the formula amount, mix the benzaldehyde compound and the catalyst evenly to obtain a composition A; The remaining components were mixed uniformly to obtain composition B.

10. Use of the room temperature curable resin composition according to any one of claims 1 to 8 in an adhesive or sealant for bonding or sealing industrial equipment and electronic devices.

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