Temperature measurement method and device, temperature measurement assembly, readable storage medium and chip

Abstract

The embodiment of the invention provides a temperature measurement method and device, a temperature measurement assembly, a readable storage medium and a chip, the temperature measurement method is used for the temperature measurement assembly, the temperature measurement assembly comprises a bearing plate and a resistive film located on one side of the bearing plate, the resistive film comprises a plurality of temperature measurement areas, each temperature measurement area is filled with a plurality of resistance wires, and the resistance wires are electrically connected with the bearing plate. The temperature measurement precision of the multiple resistance wires in the same temperature measurement area is different, the projections of any two temperature measurement areas on the bearing plate are not overlapped, and the temperature measurement method comprises the following steps: acquiring the electrical parameters of the multiple resistance wires in the same temperature measurement area; determining an acquisition temperature value corresponding to each resistance wire according to the electrical parameters; determining a reference temperature according to the plurality of acquired temperature values corresponding to one temperature measurement area; and adjusting the operation power of the heating coil according to the reference temperature. According to the scheme of the invention, the same temperature measurement area is detected through the resistance wires with different temperature measurement precisions during heating, and the detection precision can be improved.

Description

Technical Field

[0001] The present invention relates to the field of temperature measurement technology, and in particular to a temperature measurement method, a temperature measurement device, a temperature measurement component, a readable storage medium and a chip. Background Art

[0002] At present, when an induction cooker is heated, a temperature sensor is usually provided to detect the temperature in order to prevent dry burning. When the existing temperature sensor is detecting, the detection accuracy varies greatly when the temperature is in different ranges. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0004] In view of this, an embodiment of the first aspect of the present invention provides a temperature measurement method.

[0005] An embodiment of the second aspect of the present invention provides a temperature measuring device.

[0006] An embodiment of the third aspect of the present invention provides a temperature measurement component.

[0007] An embodiment of a fourth aspect of the present invention provides a readable storage medium.

[0008] An embodiment of the fifth aspect of the present invention provides a chip.

[0009] In order to achieve the above-mentioned purpose, an embodiment of the first aspect of the present invention provides a temperature measurement method for a temperature measurement component, the temperature measurement component includes a carrier plate and a resistance film and a heating coil located on one side of the carrier plate, the resistance film includes multiple temperature measurement areas, each temperature measurement area is filled with multiple resistance wires, the temperature measurement accuracy of the multiple resistance wires located in the same temperature measurement area is different, and the projections of any two temperature measurement areas on the carrier plate do not overlap, the temperature measurement method includes: obtaining electrical parameters of multiple resistance wires located in the same temperature measurement area; determining a collected temperature value corresponding to each resistance wire according to the electrical parameters; determining a reference temperature according to multiple collected temperature values ​​corresponding to one temperature measurement area; and adjusting the operating power of the heating coil according to the reference temperature.

[0010] According to the temperature measurement method proposed in the present invention, a temperature measurement component is used to measure the temperature of cookware on a carrying plate. The temperature measurement component mainly includes a carrying plate, a heating coil and a resistance film. The carrying plate is used to carry cooking utensils. The cooking utensils on the carrying plate are heated by the heating coil. During the heating process, since it is necessary to detect the temperature on the carrying plate to improve the safety of use, a resistance film is also provided. However, when the resistance film performs temperature detection, it mainly samples parameters such as voltage and current, and finally converts the parameters into temperature by calculating and analyzing the parameters, thereby realizing temperature detection.

[0011] Among them, this scheme sets up a resistance film and a heating coil on one side of the carrier plate at the same time. The resistance film is divided into multiple temperature measurement areas. The temperature is measured by a resistance wire in each temperature measurement area. It can be understood that the resistance wire is made of a thermistor material, and its resistance value can change with the change of temperature. Therefore, by detecting its resistance value, that is, the electrical parameter, the corresponding temperature value of the temperature measurement area can be detected. It should be emphasized that the detection accuracy of the resistance wire of a single material for different temperature ranges is different. Therefore, this scheme uses two or more resistance wires for temperature measurement in each temperature measurement area. By acquiring and analyzing the electrical parameters and collected temperature values ​​of each resistance wire, the reference temperature of the corresponding temperature measurement area can be determined, and then the operation of the heating coil can be adjusted according to the reference temperature to avoid overheating and rupture of the panel.

[0012] It should be added that when determining the reference temperature, multiple collected temperature values ​​in the same temperature measurement area may be different, so the corresponding reference temperature will be selected according to the specific differences. The reference temperature may be the average or median of the collected temperature values, or even any set value.

[0013] This solution improves the temperature measurement accuracy by utilizing the difference in temperature measurement accuracy of different materials in the same temperature range and combining multiple temperature sensing wires to measure temperature, thereby achieving accurate temperature measurement in different temperature ranges. The multiple temperature measurement areas in the resistance film contain multiple resistance wires. Through reasonable design and layout, more accurate temperature information can be provided, improving the accuracy and stability of temperature measurement.

[0014] The temperature measuring component can be used in induction cookers, electric ceramic cookers, etc.

[0015] In some technical solutions, optionally, determining the reference temperature according to multiple collected temperature values ​​corresponding to a temperature measurement area specifically includes: obtaining a first temperature threshold; determining the reference temperature according to a magnitude relationship between the multiple collected temperature values ​​and the first temperature threshold.

[0016] In this technical solution, when determining the reference temperature, the reference temperature can be determined based on the size relationship between multiple collected temperature values ​​and the first temperature threshold value to provide a more accurate reference temperature value so as to adjust the operating power of the heating coil. Specifically, an initial temperature threshold, i.e., the first temperature threshold value, is first determined, which can be set according to the design requirements of the product or the needs of the user. Compare the multiple collected temperature values ​​with the first temperature threshold value to determine the size relationship of each collected temperature value relative to the first temperature threshold value. According to the size relationship between the multiple collected temperature values ​​and the first temperature threshold value, select the collected temperature value that meets the conditions as the reference temperature. The selection method of the reference temperature can be determined according to the set conditions, such as selecting the temperature value closest to the first temperature threshold value, selecting the highest or lowest temperature value, etc. Through the above steps, the reference temperature can be determined, and the reference temperature will be used to adjust the operating power of the heating coil to achieve precise temperature control and cooking effect.

[0017] In some technical schemes, optionally, the number of resistance wires in the same temperature measurement area is two, the multiple collected temperature values ​​include a first temperature value and a second temperature value, the reference temperature includes a main reference temperature and a secondary reference temperature, and the reference temperature is determined according to the size relationship between the multiple collected temperature values ​​and the first temperature threshold, specifically including: when the first temperature value and the second temperature value are not greater than the first temperature threshold, or when the first temperature value is less than the first temperature threshold and the second temperature value is greater than the first temperature threshold, the first temperature value is used as the main reference temperature and the second temperature value is used as the secondary reference temperature; when the first temperature value and the second temperature value are not less than the first temperature threshold, or when the first temperature value is greater than the first temperature threshold and the second temperature value is less than the first temperature threshold, the second temperature value is used as the main reference temperature and the first temperature value is used as the secondary reference temperature.

[0018] In this technical solution, two resistance wires are set in each temperature measurement area. Each resistance wire can adjust the corresponding resistance according to its own material characteristics under different temperatures in its own environment, so as to facilitate the subsequent monitoring of electrical signals to determine the temperature. In this solution, each temperature measurement area will output two temperature values ​​according to the two resistance wires, namely the first temperature value and the second temperature value. When determining the reference temperature, it can be realized according to the size relationship between the two collected temperature values ​​and the first temperature threshold. Specifically, it is divided into four cases. When the first temperature value is less than or equal to the first temperature threshold, and the second temperature value is less than or equal to the first temperature threshold, the first temperature value is defined as the main reference temperature, and the second temperature value is defined as the secondary reference temperature. When the first temperature value is less than the first temperature threshold, and the second temperature value is greater than the first temperature threshold, the first temperature value is defined as the main reference temperature, and the second temperature value is defined as the secondary reference temperature. When the first temperature value is greater than or equal to the first temperature threshold, and the second temperature value is greater than or equal to the first temperature threshold, the second temperature value is defined as the main reference temperature, and the first temperature value is defined as the secondary reference temperature. When the first temperature value is greater than the first temperature threshold and the second temperature value is less than the first temperature threshold, the second temperature value is defined as the main reference temperature and the first temperature value is defined as the secondary reference temperature. When the main reference temperature and the secondary reference temperature are determined, the operating power can be adjusted later.

[0019] In some technical schemes, the operating power of the heating coil is adjusted according to the reference temperature, specifically including: when the main reference temperature is within the normal temperature measurement range, adjusting the operating power of the heating coil according to the main reference temperature; when the main reference temperature is outside the normal temperature measurement range, adjusting the operating power of the heating coil according to the secondary reference temperature.

[0020] In this technical solution, when adjusting the operating power of the heating coil, a selection will be made based on whether the reference temperature is normal. If the main reference temperature is normal, that is, within the normal temperature measurement range, the operating power of the heating coil can be adjusted directly based on the main reference temperature and the pre-set heating rules. For example, if the main reference temperature is too high, the operating power will be reduced. However, if the main reference temperature is abnormal or fails, it is considered that the main reference temperature cannot be controlled normally, and the secondary reference temperature will be used to control the operating power, thereby achieving temperature measurement control.

[0021] In some technical solutions, optionally, there are two resistance wires in each temperature measurement area, and the two resistance wires are arranged parallel to each other.

[0022] In this technical solution, by setting two resistance wires in each temperature measurement area, dual temperature measurement can be performed, that is, two resistance wires measure temperature at the same time. By comparing the temperature measurement results of the two resistance wires, the error can be reduced and the accuracy of temperature measurement can be improved. Since there are two resistance wires for temperature measurement in each temperature measurement area, when one of the resistance wires fails or fails, the other resistance wire can still provide accurate temperature measurement data, thereby enhancing the reliability and stability of the entire temperature measurement system. The two resistance wires are arranged in parallel to each other to improve the anti-interference ability of the temperature measurement system to external interference. Since the two resistance wires measure temperature under the same environmental conditions, they are subject to similar environmental interference, so the influence of interference can be eliminated or reduced by comparing the temperature measurement results of the two, thereby improving the accuracy of temperature measurement.

[0023] Furthermore, the distance between the two resistance wires may be 1 mm, or any distance not greater than 10 mm.

[0024] In some technical solutions, optionally, the reference temperature includes a first reference value and a second reference value, and adjusting the operating power of the heating coil according to the reference temperature specifically includes: adjusting the operating power of the heating coil according to the first reference value and the second reference value.

[0025] In this technical solution, the reference temperature is two, and adjusting the operating power of the heating coil according to the first reference value and the second reference value can achieve more accurate temperature control. Specifically, the first reference value and the second reference value can be obtained according to the reference temperature determined by multiple collected temperature values, and these two reference values ​​may represent different temperature ranges or different target temperatures. According to the first reference value and the second reference value, the operating power of the heating coil is adjusted accordingly. The specific adjustment method can be determined according to actual needs and design rules, such as adjusting the power according to the relative size of the reference value, or using a certain algorithm to dynamically adjust the power according to the reference value. In general, by adjusting the operating power of the heating coil according to the first reference value and the second reference value, the temperature can be more accurately controlled within the target range, thereby improving the cooking effect and the reliability of the product. Such an adjustment method can adapt to the needs of different temperature ranges and provide more flexible and accurate temperature control capabilities.

[0026] In some technical schemes, optionally, it also includes: a control unit, which is arranged on the second side of the carrier plate, and the control unit is spaced apart from the carrier plate; wherein the two ends of each resistance wire extend to the radial inner side and the radial outer side of the temperature measuring area respectively, and the resistance wire in each temperature measuring area leads outwardly to two lead ends, one of the two lead ends is grounded, and the other is electrically connected to the control unit.

[0027] In this technical solution, a control unit is provided on one side of the inner surface, and multiple temperature measurement areas are provided on the inner side of the carrier plate, and temperature is detected in each temperature measurement area through a resistance wire electrically connected to the control unit, thereby obtaining the resistance value of the resistance wire in the temperature measurement area, and according to the corresponding relationship between the resistance value and the temperature, the temperature in a specific area of ​​the carrier plate can be detected. In particular, the resistance wire in the present application is divided into multiple independent temperature measurement areas, that is, the projections of any two temperature measurement areas on the carrier plate do not overlap, so that by obtaining information from the resistance wire filled in each temperature measurement area, the temperature value or temperature change value in each temperature measurement area can be determined, which greatly improves the position accuracy of temperature detection on the carrier plate.

[0028] Furthermore, the temperature measurement area can be in the shape of a ring with inner and outer nesting, or in the shape of a sector arranged on a circumference.

[0029] It should be noted that by distributing the resistance wires in different temperature measurement areas, the temperature in each temperature measurement area can be obtained through the resistance value of the resistance wires arranged in the area. The use of a planar temperature measurement component can greatly improve the temperature measurement effect.

[0030] Among them, the resistance wire is a temperature-sensitive material, and its resistance value will also change when the temperature changes.

[0031] For each temperature measurement area, a resistance wire is arranged inside. In order to facilitate the lead-in, the two ends of each resistance wire are lead-in ends, one of which is used to be electrically connected to the control unit, and the other is used to be grounded, that is, the electric potential is 0. Through the above wiring method, the number of wiring harnesses can be greatly reduced, which is convenient for wiring.

[0032] It can be understood that multiple resistors are connected in parallel, and the resistance value change of each resistor is independent and is not affected by each other.

[0033] An embodiment of the second aspect of the present invention provides a temperature measuring device for a temperature measuring component, the temperature measuring component includes a carrier plate and a resistance film located on one side of the carrier plate, the resistance film includes multiple temperature measuring areas, each temperature measuring area is filled with multiple resistance wires, the temperature measurement accuracy of the multiple resistance wires located in the same temperature measuring area is different, and the projections of any two temperature measuring areas on the carrier plate do not overlap, the temperature measuring device includes: an acquisition module, used to acquire electrical parameters of multiple resistance wires located in the same temperature measuring area; a conversion module, used to determine a collected temperature value corresponding to each resistance wire according to the electrical parameters; a temperature determination module, used to determine a reference temperature according to multiple collected temperature values ​​corresponding to a temperature measuring area; an adjustment module, used to adjust the operating power of the heating coil according to the reference temperature.

[0034] The temperature measuring device proposed in the present invention mainly includes an acquisition module, a conversion module, a temperature determination module and an adjustment module. The temperature measuring device is used for a temperature measuring component for measuring the temperature of cookware on a carrying plate. The temperature measuring component mainly includes a carrying plate, a heating coil and a resistance film. The carrying plate is used to carry cooking utensils. Under the action of the heating coil, the cooking utensils on the carrying plate will be heated. During the heating process, since it is necessary to detect the temperature on the carrying plate to improve the safety of use, a resistance film is also provided. However, when the resistance film performs temperature detection, it mainly samples its voltage, current and other parameters, and finally converts them into temperature by calculating and analyzing the parameters, thereby realizing temperature detection.

[0035] Among them, this scheme sets up a resistance film and a heating coil on one side of the carrier plate at the same time. The resistance film is divided into multiple temperature measurement areas. The temperature is measured by a resistance wire in each temperature measurement area. It can be understood that the resistance wire is made of a thermistor material, and its resistance value can change with the change of temperature. Therefore, by detecting its resistance value, that is, the electrical parameter, the corresponding temperature value of the temperature measurement area can be detected. It should be emphasized that the detection accuracy of the resistance wire of a single material for different temperature ranges is different. Therefore, this scheme uses two or more resistance wires for temperature measurement in each temperature measurement area. By acquiring and analyzing the electrical parameters and collected temperature values ​​of each resistance wire, the reference temperature of the corresponding temperature measurement area can be determined, and then the operation of the heating coil can be adjusted according to the reference temperature to avoid overheating and rupture of the panel.

[0036] It should be added that when determining the reference temperature, multiple collected temperature values ​​in the same temperature measurement area may be different, so the corresponding reference temperature will be selected according to the specific differences. The reference temperature may be the average or median of the collected temperature values, or even any set value.

[0037] This solution improves the temperature measurement accuracy by utilizing the difference in temperature measurement accuracy of different materials in the same temperature range and combining multiple temperature sensing wires to measure temperature, thereby achieving accurate temperature measurement in different temperature ranges. The multiple temperature measurement areas in the resistance film contain multiple resistance wires. Through reasonable design and layout, more accurate temperature information can be provided, improving the accuracy and stability of temperature measurement.

[0038] The temperature measuring component can be used in induction cookers, electric ceramic cookers, etc.

[0039] An embodiment of the third aspect of the present invention provides a temperature measuring component, comprising: a carrying plate; a resistor film, located on one side of the carrying plate, the resistor film comprising multiple temperature measuring areas, each temperature measuring area being filled with multiple resistance wires, the temperature measuring accuracy of the multiple resistance wires located in the same temperature measuring area is different, and the projections of any two temperature measuring areas on the carrying plate do not overlap; a heating coil, located on a side of the resistor film away from the carrying plate, the heating coil being connected to the AC power; a control unit, the control unit being electrically connected to the resistor film, and the control unit also comprising the temperature measuring device provided by the above-mentioned embodiment of the second aspect.

[0040] An embodiment of another aspect of the present invention provides a temperature measurement component, which includes a processor, a memory, and a program or instruction stored in the memory and executable on the processor, and when the program or instruction is executed by the processor, the steps of the method of the first aspect are implemented.

[0041] An embodiment of the fourth aspect of the present invention provides a readable storage medium, on which a program or instruction is stored, and when the program or instruction is executed by a processor, the steps of the method of the first aspect are implemented.

[0042] An embodiment of the fifth aspect of the present invention provides a chip, the chip includes a processor and a communication interface, the communication interface and the processor are coupled, and the processor is used to run programs or instructions to implement the steps of the method of the first aspect.

[0043] Additional aspects and advantages of the present invention will become apparent from the following description or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A schematic flow chart of a temperature measurement method according to an embodiment of the present application is shown;

[0045] Figure 2 A schematic flow chart of a temperature measurement method according to an embodiment of the present application is shown;

[0046] Figure 3 A schematic flow chart of a temperature measurement method according to an embodiment of the present application is shown;

[0047] Figure 4 A schematic structural diagram of a temperature measuring device according to an embodiment of the present application is shown;

[0048] Figure 5 A schematic diagram of the structure of a temperature measurement component according to an embodiment of the present application is shown;

[0049] Figure 6 A schematic diagram of the structure of a temperature measurement component according to an embodiment of the present application is shown;

[0050] Figure 7A schematic diagram of the structure of a resistor film according to an embodiment of the present application is shown;

[0051] Figure 8 A schematic flow chart of a temperature measurement method according to an embodiment of the present application is shown.

[0052] in, Figures 4 to 7 The corresponding relationship between the reference numerals and the component names is as follows:

[0053] 1109: memory; 1110: processor; 900: temperature measuring device; 901: acquisition module; 902: conversion module; 903: temperature determination module; 904: adjustment module; 1000: temperature measuring component; 1001: carrier plate; 1002: heating coil; 1003: resistance film; 1004: resistance wire; 1005: temperature measuring area; 1006: control unit. DETAILED DESCRIPTION

[0054] In order to more clearly understand the above-mentioned purposes, features and advantages of the embodiments of the present invention, the embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0055] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the embodiments of the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited to the specific embodiments disclosed below.

[0056] The following is combined with Figures 1 to 8 , the temperature measurement method and device, temperature measurement component, readable storage medium and chip provided in the embodiments of the present application are described in detail through specific embodiments and their application scenarios.

[0057] This embodiment provides a temperature measurement method for Figure 6 and Figure 7 The temperature measuring component 1000 shown in the figure includes a carrier plate 1001 and a resistance film 1003 and a heating coil 1002 located on one side of the carrier plate. The resistance film 1003 includes a plurality of temperature measuring regions 1005. Each temperature measuring region 1005 is filled with a plurality of resistance wires 1004. The temperature measuring precision of the plurality of resistance wires 1004 located in the same temperature measuring region 1005 is different. The projections of any two temperature measuring regions 1005 on the carrier plate 1001 do not overlap. The temperature measuring method is as follows: Figure 1 As shown, including:

[0058] Step S102: obtaining electrical parameters of multiple resistance wires located in the same temperature measurement area;

[0059] Step S104: determining the collected temperature value corresponding to each resistance wire according to the electrical parameters;

[0060] Step S106: determining a reference temperature according to a plurality of collected temperature values ​​corresponding to a temperature measurement area;

[0061] Step S108: adjusting the operating power of the heating coil according to the reference temperature.

[0062] The temperature measurement method provided in this embodiment is applied to a temperature measuring component for measuring the temperature of cookware on a carrying plate. The temperature measuring component mainly includes a carrying plate, a heating coil and a resistance film. The carrying plate is used to carry cooking utensils. The cooking utensils on the carrying plate are heated by the heating coil. During the heating process, since it is necessary to detect the temperature on the carrying plate to improve the safety of use, a resistance film is also provided. However, when the resistance film performs temperature detection, it mainly samples parameters such as voltage and current, and finally converts the parameters into temperature by calculating and analyzing the parameters, thereby realizing temperature detection.

[0063] Among them, this scheme sets up a resistance film and a heating coil on one side of the carrier plate at the same time. The resistance film is divided into multiple temperature measurement areas. The temperature is measured by a resistance wire in each temperature measurement area. It can be understood that the resistance wire is made of a thermistor material, and its resistance value can change with the change of temperature. Therefore, by detecting its resistance value, that is, the electrical parameter, the corresponding temperature value of the temperature measurement area can be detected. It should be emphasized that the detection accuracy of the resistance wire of a single material for different temperature ranges is different. Therefore, this scheme uses two or more resistance wires for temperature measurement in each temperature measurement area. By acquiring and analyzing the electrical parameters and collected temperature values ​​of each resistance wire, the reference temperature of the corresponding temperature measurement area can be determined, and then the operation of the heating coil can be adjusted according to the reference temperature to avoid overheating and rupture of the panel.

[0064] It should be added that when determining the reference temperature, multiple collected temperature values ​​in the same temperature measurement area may be different, so the corresponding reference temperature will be selected according to the specific differences. The reference temperature may be the average or median of the collected temperature values, or even any set value.

[0065] This solution improves the temperature measurement accuracy by utilizing the difference in temperature measurement accuracy of different materials in the same temperature range and combining multiple temperature sensing wires to measure temperature, thereby achieving accurate temperature measurement in different temperature ranges. The multiple temperature measurement areas in the resistance film contain multiple resistance wires. Through reasonable design and layout, more accurate temperature information can be provided, improving the accuracy and stability of temperature measurement.

[0066] The temperature measuring component can be used for flat heating appliances such as induction cookers, electric ceramic cookers, and electromagnetic heating kettles.

[0067] In one embodiment, multiple resistance wires made of different materials may be selected, and the temperature measurement accuracy of the resistance wires in the same temperature measurement area may be different, including but not limited to materials with different sensitivities in different temperature ranges due to different compositions or inconsistent proportions of effective temperature measuring substances.

[0068] In another embodiment, resistance wires of the same material may be used, and different voltage-dividing resistors may be used to make the temperature sensitivities of the two temperature sensing wires different in different temperature ranges, thereby improving the temperature measurement accuracy.

[0069] In a specific embodiment, a temperature measuring resistor film is printed on a support panel (ie, a support plate), and the resistor film is made of two different materials according to Figure 7 The shown printed parallel groups of temperature sensing wires are combined. One group of temperature sensing wires consists of two temperature sensing wires (i.e. resistance wires). The distance between the two temperature sensing wires is 1mm. The section close to the center of the circle is the common end. The common ends of the two temperature sensing wires are connected, and the ends away from the center of the circle are respectively connected to the two pins of the sampling chip. To ensure that the temperature data of various parts of the panel can be evenly collected, 8 groups of temperature sensing wires are used here.

[0070] Here, one temperature sensing line (the sampling conversion temperature is marked as T1) has high temperature accuracy below the limit temperature T, and the other temperature sensing line (the sampling conversion temperature is marked as T2) has high temperature accuracy above the limit temperature T. Figure 8 As shown, including:

[0071] Step S1: start heating;

[0072] Step S2: collecting temperature data of two resistance films and converting them into temperatures T1 and T2 respectively;

[0073] Step S3: comparing the collected temperature data with the preset limit temperature T;

[0074] Four possible situations are listed here. If any of them is established, proceed to the next step;

[0075] Step S4.1: T1, T2 is less than or equal to the limit temperature T;

[0076] Step S4.2: T1, T2 is greater than or equal to the limit temperature T;

[0077] Step S4.3: T1 is greater than T, and T2 is less than T;

[0078] Step S4.4: T1 is less than T, T2 is greater than T;

[0079] Step S5: According to the judgment situation, corresponding to the settings in the program, select the main reference temperature and the secondary reference temperature. Here is an example, in accordance with situation S4.1, T1 is the main reference temperature and T2 is the secondary reference temperature; in accordance with situation S4.2, T2 is the main reference temperature and T1 is the secondary reference temperature, in accordance with situation S4.3; T1 is the main reference temperature and T2 is the secondary reference temperature, in accordance with situation S4.4; T2 is the main reference temperature and T1 is the secondary reference temperature.

[0080] S6: Control the heating process according to the main reference temperature. When the main reference temperature is abnormal or fails, switch to controlling the heating process according to the secondary reference temperature.

[0081] Furthermore, in different temperature ranges, the weights of the rerouted temperature sensing lines can be set according to the sampling accuracy of the temperature sensing lines. For example, between 50°C and 100°C, the weight of temperature sensing line 1 is set to 0.8 and the weight of temperature sensing line 2 is set to 0.2 to improve the sampling accuracy.

[0082] In one embodiment, Figure 2 As shown, determining the reference temperature according to multiple collected temperature values ​​corresponding to a temperature measurement area includes: step S1062: obtaining a first temperature threshold; step S1064: determining the reference temperature according to the magnitude relationship between the multiple collected temperature values ​​and the first temperature threshold.

[0083] When determining the reference temperature, the reference temperature can be determined based on the size relationship between multiple collected temperature values ​​and the first temperature threshold value to provide a more accurate reference temperature value so as to adjust the operating power of the heating coil. Specifically, an initial temperature threshold, i.e., the first temperature threshold, is first determined, which can be set according to the design requirements of the product or the needs of the user. Compare the multiple collected temperature values ​​with the first temperature threshold value to determine the size relationship of each collected temperature value relative to the first temperature threshold value. According to the size relationship between the multiple collected temperature values ​​and the first temperature threshold value, select the collected temperature value that meets the conditions as the reference temperature. The selection method of the reference temperature can be determined according to the set conditions, such as selecting the temperature value closest to the first temperature threshold value, selecting the highest or lowest temperature value, etc. Through the above steps, the reference temperature can be determined, and the reference temperature will be used to adjust the operating power of the heating coil to achieve precise temperature control and cooking effect.

[0084] In a specific embodiment, the number of resistance wires in each temperature measurement area is two, and the two resistance wires are arranged in parallel with each other. By arranging two resistance wires in each temperature measurement area, dual temperature measurement can be performed, that is, the two resistance wires measure the temperature at the same time. By comparing the temperature measurement results of the two resistance wires, the error can be reduced and the accuracy of the temperature measurement can be improved. Since there are two resistance wires for temperature measurement in each temperature measurement area, when one of the resistance wires fails or fails, the other resistance wire can still provide accurate temperature measurement data, thereby enhancing the reliability and stability of the entire temperature measurement system. The two resistance wires are arranged in parallel with each other to improve the anti-interference ability of the temperature measurement system to external interference. Since the two resistance wires measure temperature under the same environmental conditions, they are subject to similar environmental interference, so the influence of interference can be eliminated or reduced by comparing the temperature measurement results of the two, thereby improving the accuracy of temperature measurement.

[0085] Furthermore, the distance between the two resistance wires may be 1 mm, or any distance not greater than 10 mm.

[0086] In one embodiment, the reference temperature includes a first reference value and a second reference value. Figure 3 As shown, the reference temperature is determined according to the size relationship between multiple collected temperature values ​​and the first temperature threshold, specifically including: step S1066: when the first temperature value and the second temperature value are not greater than the first temperature threshold, or when the first temperature value is less than the first temperature threshold and the second temperature value is greater than the first temperature threshold, the first temperature value is used as the main reference temperature and the second temperature value is used as the secondary reference temperature; step S1068: when the first temperature value and the second temperature value are not less than the first temperature threshold, or when the first temperature value is greater than the first temperature threshold and the second temperature value is less than the first temperature threshold, the second temperature value is used as the main reference temperature and the first temperature value is used as the secondary reference temperature.

[0087] In each temperature measurement area, two resistance wires are set. Each resistance wire can adjust the corresponding resistance according to its own material characteristics and the different temperatures in its own environment, so as to facilitate the subsequent monitoring of the electrical signal to determine the temperature. In this scheme, each temperature measurement area will output two temperature values ​​according to the two resistance wires, namely the first temperature value and the second temperature value. When determining the reference temperature, it can be realized according to the size relationship between the two collected temperature values ​​and the first temperature threshold. Specifically, it is divided into four cases. When the first temperature value is less than or equal to the first temperature threshold, and the second temperature value is less than or equal to the first temperature threshold, the first temperature value is defined as the main reference temperature, and the second temperature value is defined as the secondary reference temperature. When the first temperature value is less than the first temperature threshold and the second temperature value is greater than the first temperature threshold, the first temperature value is defined as the main reference temperature and the second temperature value is defined as the secondary reference temperature. When the first temperature value is greater than or equal to the first temperature threshold and the second temperature value is greater than or equal to the first temperature threshold, the second temperature value is defined as the main reference temperature and the first temperature value is defined as the secondary reference temperature. When the first temperature value is greater than the first temperature threshold and the second temperature value is less than the first temperature threshold, the second temperature value is defined as the main reference temperature and the first temperature value is defined as the secondary reference temperature. When the main reference temperature and the auxiliary reference temperature are determined, the operating power can be adjusted subsequently.

[0088] Adjusting the operating power of the heating coil according to the main reference temperature and the auxiliary reference temperature can achieve more accurate temperature control. Specifically, according to the reference temperature determined by multiple collected temperature values, the main reference temperature and the auxiliary reference temperature can be obtained, and these two reference values ​​may represent different temperature ranges or different target temperatures. According to the main reference temperature and the auxiliary reference temperature, the operating power of the heating coil is adjusted accordingly. The specific adjustment method can be determined according to actual needs and design rules, such as adjusting the power according to the relative size of the reference value, or using a certain algorithm to dynamically adjust the power according to the reference value. In general, by adjusting the operating power of the heating coil according to the main reference temperature and the auxiliary reference temperature, the temperature can be more accurately controlled within the target range, thereby improving the cooking effect and product reliability. Such an adjustment method can adapt to the needs of different temperature ranges and provide more flexible and accurate temperature control capabilities.

[0089] Optionally, the operating power of the heating coil is adjusted according to the reference temperature, specifically including: step S1082: when the main reference temperature is within the normal temperature measurement range, adjusting the operating power of the heating coil according to the main reference temperature; when the main reference temperature is outside the normal temperature measurement range, adjusting the operating power of the heating coil according to the secondary reference temperature.

[0090] When adjusting the operating power of the heating coil, the selection will be made based on whether the reference temperature is normal. If the main reference temperature is normal, that is, within the normal temperature measurement range, the operating power of the heating coil can be adjusted directly based on the main reference temperature and the pre-set heating rules. For example, if the main reference temperature is too high, the operating power will be reduced. However, if the main reference temperature is abnormal or fails, it is considered that the main reference temperature cannot be controlled normally, and the secondary reference temperature will be used to control the operating power, thereby achieving temperature measurement control.

[0091] In one embodiment, in terms of hardware, a control unit is provided on one side of the inner surface, and multiple temperature measurement areas are provided on the inner side of the carrier plate, and temperature is detected in each temperature measurement area through a resistance wire electrically connected to the control unit, thereby obtaining the resistance value of the resistance wire in the temperature measurement area, and according to the corresponding relationship between the resistance value and the temperature, the temperature in a specific area of ​​the carrier plate can be detected. In particular, the resistance wire in the present application is divided into multiple independent temperature measurement areas, that is, the projections of any two temperature measurement areas on the carrier plate do not overlap, so that by obtaining information from the resistance wire filled in each temperature measurement area, the temperature value or temperature change value in each temperature measurement area can be determined, which greatly improves the position accuracy of temperature detection on the carrier plate.

[0092] Furthermore, the temperature measurement area can be in the shape of a ring with inner and outer nesting, or in the shape of a sector arranged on a circumference.

[0093] It should be noted that by distributing the resistance wires in different temperature measurement areas, the temperature in each temperature measurement area can be obtained through the resistance value of the resistance wires arranged in the area. The use of a planar temperature measurement component can greatly improve the temperature measurement effect.

[0094] Among them, the resistance wire is a temperature-sensitive material, and its resistance value will also change when the temperature changes.

[0095] For each temperature measurement area, a resistance wire is arranged inside. In order to facilitate the lead-in, the two ends of each resistance wire are lead-in ends, one of which is used to be electrically connected to the control unit, and the other is used to be grounded, that is, the electric potential is 0. Through the above wiring method, the number of wiring harnesses can be greatly reduced, which is convenient for wiring.

[0096] It can be understood that multiple resistors are connected in parallel, and the resistance value change of each resistor is independent and is not affected by each other.

[0097] like Figure 4 As shown, the embodiment of the present application provides a temperature measuring device 900. The temperature measuring device 900 includes an acquisition module 901, a conversion module 902, a temperature determination module 903 and an adjustment module 904.

[0098] Among them, the acquisition module 901 is used to obtain the electrical parameters of multiple resistance wires located in the same temperature measurement area; the conversion module 902 is used to determine the collected temperature value corresponding to each resistance wire according to the electrical parameters; the temperature determination module 903 is used to determine the reference temperature according to the multiple collected temperature values ​​corresponding to a temperature measurement area; the adjustment module 904 is used to adjust the operating power of the heating coil according to the reference temperature.

[0099] The temperature measuring device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems, which are not specifically limited in the embodiment of the present application.

[0100] The temperature measuring device provided in the embodiment of the present application can achieve Figures 1 to 3 To avoid repetition, the various processes implemented by the method embodiment are not described here.

[0101] Alternatively, if Figure 6 and Figure 7 As shown, the embodiment of the present application also provides a temperature measuring component 1000, including a carrier plate 1001; a resistor film 1003, located on one side of the carrier plate 1001, the resistor film 1003 includes a plurality of temperature measuring areas 1005, each temperature measuring area 1005 is filled with a plurality of resistor wires 1004, the temperature measuring accuracy of the plurality of resistor wires 1004 located in the same temperature measuring area 1005 is different, and the projections of any two temperature measuring areas 1005 on the carrier plate 1001 do not overlap; a heating coil 1002, located on a side of the resistor film 1003 away from the carrier plate 1001, the heating coil 1002 is connected to the AC power; a control unit 1006, the control unit 1006 is electrically connected to the resistor film 1003, and the control unit 1006 also includes the temperature measuring device provided in the above-mentioned second aspect embodiment.

[0102] Alternatively, if Figure 5 As shown, the embodiment of the present application also provides a temperature measurement component 1000, including a processor 1110, a memory 1109, and a program or instruction stored in the memory 1109 and executable on the processor 1110. When the program or instruction is executed by the processor 1110, each process of the embodiment of the above-mentioned temperature measurement method is implemented, and the same technical effect can be achieved. To avoid repetition, it will not be described here.

[0103] It should be noted that the temperature measurement component in the embodiment of the present application includes the above-mentioned electronic equipment and non-electronic equipment.

[0104] Among them, the processor 1110 is used to obtain the electrical parameters of multiple resistance wires located in the same temperature measurement area; determine the collected temperature value corresponding to each resistance wire according to the electrical parameters; determine the reference temperature according to multiple collected temperature values ​​corresponding to a temperature measurement area; and adjust the operating power of the heating coil according to the reference temperature.

[0105] Optionally, the processor 1110 is configured to obtain a first temperature threshold; and determine a reference temperature according to a magnitude relationship between a plurality of collected temperature values ​​and the first temperature threshold.

[0106] Optionally, the processor 1110 is configured to adjust the operating power of the heating coil according to the first reference value and the second reference value.

[0107] An embodiment of the present application also provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, each process of the above-mentioned temperature measurement method embodiment is implemented, and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0108] The processor is the processor in the electronic device in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a computer read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0109] An embodiment of the present application further provides a chip, which includes a processor and a communication interface, the communication interface and the processor are coupled, and the processor is used to run programs or instructions to implement the various processes of the above-mentioned temperature measurement method embodiment, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0110] It should be understood that the chip mentioned in the embodiments of the present application can also be called a system-level chip, a system chip, a chip system or a system-on-chip chip, etc.

[0111] According to the temperature measurement method, device, temperature measurement component, readable storage medium and chip provided by the present invention, the same temperature measurement area can be detected by using resistance wires with different temperature measurement accuracies during heating, thereby improving the detection accuracy.

[0112] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0113] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “front” and “back” are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the present invention.

[0114] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0115] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A temperature measurement method, characterized in that: Used for a temperature measuring component, the temperature measuring component includes a bearing plate and a resistance film and a heating coil located on one side of the bearing plate, the resistance film includes a plurality of temperature measuring areas, each of the temperature measuring areas is filled with a plurality of resistance wires, the temperature measuring accuracy of the plurality of resistance wires located in the same temperature measuring area is different, and the projections of any two temperature measuring areas on the bearing plate do not overlap, and the temperature measuring method includes: Acquiring electrical parameters of a plurality of resistance wires located in the same temperature measurement area; Determine a collected temperature value corresponding to each of the resistance wires according to the electrical parameters; Determine a reference temperature according to a plurality of collected temperature values ​​corresponding to one of the temperature measurement areas; The operating power of the heating coil is adjusted according to the reference temperature.

2. The temperature measurement method according to claim 1, characterized in that: The determining of the reference temperature according to the plurality of collected temperature values ​​corresponding to one of the temperature measurement areas specifically includes: Obtaining a first temperature threshold; The reference temperature is determined according to a magnitude relationship between the plurality of collected temperature values ​​and the first temperature threshold.

3. The temperature measurement method according to claim 2, characterized in that: The number of resistance wires in the same temperature measurement area is two, the multiple collected temperature values ​​include a first temperature value and a second temperature value, the reference temperature includes a main reference temperature and a secondary reference temperature, and the reference temperature is determined according to the magnitude relationship between the multiple collected temperature values ​​and the first temperature threshold, specifically including: When the first temperature value and the second temperature value are not greater than the first temperature threshold, or when the first temperature value is less than the first temperature threshold and the second temperature value is greater than the first temperature threshold, the first temperature value is used as the main reference temperature and the second temperature value is used as the secondary reference temperature; When the first temperature value and the second temperature value are not less than the first temperature threshold, or when the first temperature value is greater than the first temperature threshold and the second temperature value is less than the first temperature threshold, the second temperature value is used as the main reference temperature and the first temperature value is used as the secondary reference temperature.

4. The temperature measurement method according to claim 3, characterized in that: The step of adjusting the operating power of the heating coil according to the reference temperature specifically includes: When the main reference temperature is within a normal temperature measurement range, adjusting the operating power of the heating coil according to the main reference temperature; When the primary reference temperature is outside a normal temperature measurement range, the operating power of the heating coil is adjusted according to the secondary reference temperature.

5. The temperature measurement method according to any one of claims 1 to 4, characterized in that: Also includes: A control unit is disposed on the second side of the carrying plate, and the control unit is spaced apart from the carrying plate; Among them, the two ends of each resistance wire extend to the radial inner side and the radial outer side of the temperature measuring area respectively, and the resistance wire in each temperature measuring area leads outward with two lead ends, one of the two lead ends is grounded, and the other is electrically connected to the control unit.

6. A temperature measuring device, characterized in that: Used for a temperature measuring component, the temperature measuring component includes a bearing plate and a resistance film and a heating coil located on one side of the bearing plate, the resistance film includes a plurality of temperature measuring areas, each of the temperature measuring areas is filled with a plurality of resistance wires, the temperature measuring accuracy of the plurality of resistance wires located in the same temperature measuring area is different, and the projections of any two temperature measuring areas on the bearing plate do not overlap, the temperature measuring device includes: An acquisition module, used for acquiring electrical parameters of a plurality of resistance wires located in the same temperature measurement area; A conversion module, used to determine a collected temperature value corresponding to each of the resistance wires according to the electrical parameters; A temperature determination module, used to determine a reference temperature according to a plurality of collected temperature values ​​corresponding to one of the temperature measurement areas; An adjustment module is used to adjust the operating power of the heating coil according to the reference temperature.

7. A temperature measuring component, characterized in that: include: Loading plate; A resistance film is located on one side of the carrier plate, the resistance film includes a plurality of temperature measurement areas, each of the temperature measurement areas is filled with a plurality of resistance wires, the temperature measurement accuracy of the plurality of resistance wires located in the same temperature measurement area is different, and the projections of any two temperature measurement areas on the carrier plate do not overlap; A heating coil is located on a side of the resistance film away from the carrier plate, and the heating coil is connected to the mains; A control unit, the control unit is electrically connected to the resistance film, and the control unit includes the temperature measuring device according to claim 6.

8. A temperature measuring component, characterized in that: The method comprises a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of the temperature measurement method as described in any one of claims 1 to 5.

9. A readable storage medium, characterized in that: The readable storage medium stores a program or instruction, and when the program or instruction is executed by a processor, the steps of the temperature measurement method according to any one of claims 1 to 5 are implemented.

10. A chip, characterized in that: The chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is used to run a program or instruction to implement the steps of the temperature measurement method according to any one of claims 1 to 5.

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