Extraction device, process equipment and extraction method
By using the drive and rotating parts to drive the guard around the articulated seat during the wafer heat treatment, the annular body is raised, which solves the problems of stability and debugging time when picking and putting the wafer, and achieves high reliability and Save debugging time effect.
Patent Information
- Application Number
- CN202411595494.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-02-14
AI Technical Summary
During the wafer heat treatment process, it is difficult to ensure the stability and reliability of the wafer when picking and releasing the wafer. The prior art relies on the debugging of multiple hoisting mechanisms, resulting in low reliability and long debugging time.
An extraction device is provided, which drives the rotary member to rotate by a driving member, rotates the protective member about the hinge seat, lifts up the annular body, separates contact with the semiconductor workpiece, and provides an operating space for the robot.
It reduces the difficulty of controlling objects and control, saves debugging time, improves the reliability of the extraction device, and reduces the risk of falling or offsetting of the wafer during pick-up and placement.
Smart Images
Figure CN119447015A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of semiconductor processing technology, and in particular to an extraction device, process equipment and processing method. Background Art
[0002] Wafer thermal processing (also known as rapid thermal processing) is a key step in the semiconductor wafer manufacturing process. During the wafer thermal processing, a robot is usually used to pick and place the wafer. How to ensure the stability and reliability of the wafer during the picking and placing process is one of the research topics. Summary of the invention
[0003] The present invention provides an extraction device, process equipment and processing method.
[0004] According to one aspect of the present disclosure, there is provided an extraction device, comprising: a protective member, the protective member having an annular body and a connecting arm, the connecting arm being connected to the annular body, and the annular body being used to cooperate with a semiconductor workpiece; a first hinged seat, the first hinged seat being fixed at a first mounting position, the first hinged seat being hinged to the annular body; a rotating member, the rotating member being movably connected to the connecting arm at one end facing the protective member; a driving member, the driving member being movably connected to an end of the rotating member facing away from the connecting arm; the driving member drives the rotating member to rotate, so that the rotating member can provide a first force; under the first force, the connecting arm can move upward and drive the protective member to rotate around the first hinged seat, so that at least part of the annular body can be separated from the semiconductor workpiece; wherein the upward direction is opposite to the direction of gravity of the semiconductor workpiece.
[0005] In some embodiments, the first hinge seat is disposed near an edge of the annular body facing away from the connecting arm.
[0006] In some embodiments, the first articulated seats include a plurality of seats, at least two of which are symmetrically distributed about a preset straight line; wherein the preset straight line passes through the center point of the annular body and is parallel to the length direction of the connecting arm.
[0007] In some embodiments, the extraction device further includes: a second articulated seat, the second articulated seat is hinged to the middle part of the rotating member, and the second articulated seat is fixed at a second installation position.
[0008] In some embodiments, the rotating member is provided with a long groove; the long groove is arranged near one end of the rotating member toward the driving member; the long groove cooperates with the output end in the driving member, and the long groove is used to provide space for relative movement between the output end in the driving member and the rotating member.
[0009] In some embodiments, the driving member has a push rod, which is inserted into the long slot; the push rod is provided with a flange, which is located on the upper side of the rotating member, so that when the push rod moves downward, it can drive the rotating member to move downward toward the end of the push rod; the part of the push rod that extends downward from the long slot cooperates with a fixing nut, so that when the push rod moves upward, it can drive the rotating member to move upward toward the end of the push rod.
[0010] In some embodiments, the drive member comprises a linear drive.
[0011] In some embodiments, a curved surface is provided at one end of the rotating member facing the connecting arm, so that the rotating member cooperates with the connecting arm through the curved surface.
[0012] According to another aspect of the present disclosure, a process equipment is provided, comprising: an extraction device as described in any one of the above, and a robot; wherein a connecting arm of a protective member in the extraction device is spaced apart from the robot for picking up and placing semiconductor workpieces.
[0013] According to another aspect of the present disclosure, there is provided a processing method based on any of the aforementioned extraction devices, comprising:
[0014] Controlling the driving member to drive the rotating member to rotate, so that the rotating member drives the protecting member to rotate around the first hinge seat to an inclined position;
[0015] Controlling the manipulator to grab the semiconductor workpiece at the current position, or placing the semiconductor workpiece at the current position;
[0016] Controlling the manipulator to leave the current position;
[0017] The driving member is controlled to drive the rotating member to rotate in the reverse direction; wherein, during the reverse rotation of the rotating member, the protective member can return to the initial position under the action of gravity.
[0018] The extraction device provided by the present disclosure has high reliability and helps save debugging time.
[0019] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure.
[0021] Figure 1 is a schematic diagram of an extraction device and a manipulator provided according to an embodiment of the present disclosure;
[0022] Figure 2 is a schematic diagram of an extraction device and a manipulator provided according to an embodiment of the present disclosure;
[0023] Figure 3 is a schematic diagram of an extraction device and a manipulator provided according to an embodiment of the present disclosure;
[0024] Figure 4 It is a flowchart of a processing method provided according to an embodiment of the present disclosure.
[0025] Description of reference numerals:
[0026] 100-protective member; 101-annular body; 102-connecting arm; 200-first hinged seat; 300-rotating member; 301-long slot; 400-driving member; 401-push rod; 500-second hinged seat; 600-workpiece; 700-manipulator. DETAILED DESCRIPTION
[0027] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.
[0028] In the related art, during the wafer heat treatment stage, when taking and placing wafers, the height of at least three lifting mechanisms used to support the wafers is usually controlled to cooperate with the robot. Among them, before taking and placing the wafers, it is usually necessary to debug multiple lifting mechanisms to ensure synchronous control of the movement of multiple lifting mechanisms, thereby ensuring that the wafer is always in a horizontal state. However, due to the limitations of the motor performance in each lifting mechanism, the reliability of the above method is low and the debugging time is long.
[0029] In order to overcome the above problems, the present embodiment provides an extraction device, which drives the rotating member to rotate through the driving member to push the protective member to rotate, so that the annular body in the protective member can be in a tilted state (rotated to an inclined position), and at least part of the annular body at this time can be separated from the semiconductor workpiece that cooperates with it and is in a horizontal state, so as to provide sufficient operating space for the manipulator to grab or release the wafer. In the above process, it is only necessary to control the driving member to tilt the protective member that cooperates with the wafer, and there is no need to use multiple lifting mechanisms to adjust the height of the wafer to cooperate with the manipulator, which reduces the control objects, reduces the control difficulty, and helps to save debugging time, thereby helping to improve reliability. Moreover, during the movement of the above-mentioned extraction device, the position of the wafer remains unchanged, which is also conducive to reducing or even avoiding the risk of the wafer slipping or offsetting during the placement process.
[0030] The structure, function and implementation process of the extraction device provided in this embodiment are described below with reference to the accompanying drawings. For ease of description, the gravity direction of the semiconductor workpiece is regarded as the bottom, and the direction opposite to the gravity direction is regarded as the top.
[0031] Figure 1 is a schematic diagram of the three-dimensional structure of an extraction device and a manipulator provided according to an embodiment of the present disclosure; Figure 2 is a top view schematic diagram of an extraction device and a manipulator provided according to an embodiment of the present disclosure; Figure 3 It is a side schematic diagram of an extraction device and a manipulator provided according to an embodiment of the present disclosure.
[0032] Please refer to Figures 1 to 3 The extraction device provided in this embodiment includes: a protective member 100, a first hinge seat 200, a rotating member 300 and a driving member 400.
[0033] The protective member 100 has an annular body 101 and a connecting arm 102, and the connecting arm 102 is connected to the annular body 101. The connecting arm 102 and the annular body 101 can be integrally arranged, or the connecting arm 102 is fixedly connected to the annular body 101. The annular body 101 can be a circular ring structure. The annular body 101 can cooperate with the semiconductor workpiece 600 to play a role in expanding the semiconductor workpiece 600, so as to facilitate the process of the semiconductor workpiece 600. The connecting arm 102 is arranged close to the edge of the annular body 101 toward the manipulator 700. The connecting arm 102 is roughly in the shape of an elongated strip; for example, the connecting arm 102 can be a prismatic structure or a cylindrical structure.
[0034] Optionally, in order to avoid the robot 700 , the connecting arm 102 is located on one side of the robot 700 , and there is a preset distance between the connecting arm 102 and the robot 700 .
[0035] The first articulated seat 200 is fixed at the first installation position, and the first articulated seat 200 is articulated with the annular body 101. Under the first force, the connecting arm 102 can move upward and drive the protective member 100 to rotate around the first articulated seat 200, so that at least part of the annular body 101 can be separated from the semiconductor workpiece 600, providing sufficient operating space for the robot 700 to pick up and place the semiconductor workpiece 600.
[0036] The first installation position is the position in the chamber where the extraction device is located. The first hinge seat 200 can be specifically fixedly connected to the components around the first installation position, for example, it can be fastened to the components around the first installation position by a fastener.
[0037] In some examples, the first articulated seat 200 may include a first seat body and a first articulated shaft; the annular body 101 may be fixedly connected to a first sleeve, and the first articulated shaft and the first sleeve are rotatably matched. In order to reduce the generation of particles due to friction, the first articulated shaft and the first sleeve are matched through a rolling bearing. The first sleeve may be connected to the lower surface of the annular body 101.
[0038] In other examples, the first hinge seat 200 may include a first seat body, the first seat body is provided with a first shaft hole; the lower surface of the annular body 101 is fixedly connected with a first hinge shaft, and the first hinge shaft is rotatably matched with the first shaft hole. In order to reduce the generation of particles due to friction, the first hinge shaft and the first shaft hole are matched through a rolling bearing.
[0039] Optionally, the first hinge seat 200 is located at a side of the center of the protective member 100 away from the connecting arm 102, so that after the first force is removed, the protective member 100 can return to its original position under the action of its own gravity.
[0040] In other examples, the connection position of the first hinge seat 200 and the annular body 101 can be set according to actual needs. The annular body 101 can be connected to a first elastic reset member (not shown in the figure), and the first elastic reset member is used to force the protective member 100 to return to the initial position after the first force is cancelled. The first elastic reset member can be a torsion spring arranged between the first hinge seat 200 and the annular body 101; or the first elastic reset member can be a compression spring or a tension spring, and the setting position of the compression spring or the tension spring is set according to actual needs.
[0041] The connecting arm 102 is movably connected to the rotating member 300, and the rotating member 300 is connected to the driving member 400. In this way, when the driving member 400 drives the rotating member 300 to rotate, the rotating member 300 can push the connecting arm 102 to lift up, and then drive the annular body 101 to rotate around the first hinge seat 200, so that the annular body 101 is in an inclined state to prevent the annular body 101 from interfering with the robot 700 in picking up and placing the semiconductor workpiece 600.
[0042] The rotating member 300 may be a flat plate structure or a long strip structure. The portion of the rotating member 300 close to the connecting arm 102 is used to support the connecting arm 102. Exemplarily, the rotating member 300 is prism-shaped, and the dimension of the rotating member 300 along its transverse direction is greater than or equal to the dimension of the connecting arm 102 along this direction, so as to ensure the reliability of the connection between the rotating member 300 and the connecting arm 102; wherein the transverse direction of the rotating member 300 is perpendicular to its rotation direction.
[0043] The driving member 400 may include a driving structure capable of outputting linear motion; for example, the driving member 400 may include a linear driver (or electric push rod); for another example, the driving member 400 may include a cylinder, etc. In other examples, the driving member 400 may include a driving structure capable of outputting rotational motion and a transmission structure capable of converting rotational motion into linear motion.
[0044] When using the extraction device provided in this embodiment, when taking and placing wafers, the driving member 400 can be controlled to drive the rotating member 300 to rotate, so that the rotating member 300 drives the protective member 100 to rotate around the first hinge seat 200 to an inclined position; the manipulator 700 is controlled to grab the semiconductor workpiece 600 at the current position, or to place the semiconductor workpiece 600 at the current position; after grabbing or placing the semiconductor workpiece 600, the manipulator 700 is controlled to leave the current position; the driving member 400 is controlled to drive the rotating member 300 to rotate in the opposite direction; wherein, during the process of the rotating member 300 rotating in the opposite direction, the protective member 100 can return to its initial position under the action of gravity. When the protective member 100 is in the initial position, it is approximately in a horizontal state.
[0045] The present embodiment provides an extraction device, which drives the rotating member 300 to rotate through the driving member 400 to push the protective member 100 to rotate, so that the annular body 101 in the protective member 100 can be in a tilted state, and at least part of the annular body 101 can be separated from the semiconductor workpiece 600 that cooperates with it and is in a horizontal state, providing sufficient operating space for the manipulator 700 to grab or release the semiconductor workpiece 600; in the above process, it is only necessary to control the driving member 400 to tilt the protective member 100 that cooperates with the semiconductor workpiece 600, and there is no need to use multiple lifting mechanisms to adjust the height of the semiconductor workpiece 600 to cooperate with the manipulator 700, which reduces the control objects, reduces the control difficulty, and helps to save debugging time, so that the extraction device has higher reliability.
[0046] In some embodiments, in order to prevent the annular body 101 in a tilted state from interfering with the semiconductor workpiece 600 and other components, the first articulated seat 200 is disposed near the edge of the annular body 101 away from the connecting arm 102. Exemplarily, the connecting arm 102 and the robot 700 that moves to the current position and is ready to pick up and place the semiconductor workpiece 600 are located on the opposite side of the first articulated seat 200; Figure 2 and Figure 3 As shown, the connecting arm 102 and the manipulator 700 are close to the left edge of the annular body 101 , and the first articulated seat 200 is close to the right edge of the annular body 101 .
[0047] Furthermore, through the above arrangement, the first hinge seat 200 is relatively far away from the center of the protective member 100, which is conducive to the protective member 100 returning to the initial position under the action of its own gravity.
[0048] Optionally, the annular body 101 has an inner side facing the workpiece 600 and an outer side away from the workpiece 600. The inner side of the annular body 101 has a reference point; along the length direction parallel to the connecting arm 102, the distance between the reference point and the connecting arm 102 is the largest. The first articulated seat 200 is located outside the reference point, or the first articulated seat 200 is located on a tangent passing through the reference point.
[0049] In other examples, the first hinge seat 200 may also be located inside the reference point as long as the annular body 101 does not interfere with the semiconductor workpiece 600 and other components.
[0050] In some embodiments, in order to improve the stability of the protective element 100, the first hinge seat 200 includes a plurality of first hinge seats 200, and the central axes of the first hinge axes in the plurality of first hinge seats 200 coincide with each other. At least two of the first hinge seats 200 are symmetrically distributed about a preset straight line; wherein the preset straight line passes through the center point of the annular body 101 and is parallel to the length direction of the connecting arm 102.
[0051] Exemplarily, there are two first articulated seats 200, and the two first articulated seats 200 are symmetrically distributed about a preset straight line. Alternatively, there are three first articulated seats 200, two of which are symmetrically distributed about a preset straight line, and another first articulated seat 200 can be located on the preset straight line. Alternatively, the first articulated seats 200 include four, two of which are symmetrically distributed about a preset straight line, and a first articulated seat 200 is respectively arranged near the two first articulated seats 200. Of course, the specific number of the first articulated seats 200 is not limited thereto, and this embodiment is only used as an example.
[0052] In some embodiments, the extraction device further includes: a second articulated seat 500, the second articulated seat 500 is articulated with the rotating member 300, and the second articulated seat 500 is fixed at the second installation position.
[0053] The second installation position is the position in the chamber where the extraction device is located. The second hinge seat 500 can be fixedly connected to the components around the second installation position, for example, it can be fastened to the components around the second installation position by a fastener.
[0054] In order to reduce the movement amplitude of the rotating member 300 toward the end of the connecting arm 102, the second hinge seat 500 can be hinged to the middle of the long rotating member 300. Exemplarily, the second hinge seat 500 can include a second seat body and a second hinge shaft; the middle of the rotating member 300 can be provided with a second shaft hole, and the second hinge shaft is rotatably matched with the second shaft hole. In order to reduce the generation of particles due to friction, the second hinge shaft and the second shaft hole are matched through a rolling bearing.
[0055] In other examples, a second sleeve is fixedly connected to the lower surface of the rotating member 300, and the second hinge shaft is rotatably matched with the second sleeve.
[0056] It is understandable that when the rotating member 300 is a plate-shaped structure with a preset width, there may be a plurality of second hinge seats 500 to improve the stability of the rotating member 300 .
[0057] In other embodiments, the rotating member 300 may also be hinged to the push rod 401 in the driving member 400 , so that the end of the rotating member 300 facing the connecting arm 102 can swing upward or downward.
[0058] In some embodiments, the rotating member 300 is provided with a long slot 301; the length direction of the long slot 301 is parallel to the length direction of the rotating member 300. The long slot 301 is provided near one end of the rotating member 300 facing the driving member 400; the long slot 301 cooperates with the output end of the driving member 400, and the long slot 301 is used to provide space for relative movement between the output end of the driving member 400 and the rotating member 300.
[0059] In some examples, the long slot 301 can be set vertically through the rotating member 300; the push rod 401 in the driving member 400 is inserted into the long slot 301; the part of the push rod 401 extending downward from the long slot 301 cooperates with the fixing nut. In this way, during the upward movement of the push rod 401, the rotating member 300 can be driven to return to its initial position, which is conducive to the protective member 100 returning to its initial position under the action of its own gravity. When the rotating member 300 is in the initial position, it is approximately in a horizontal state.
[0060] Optionally, the push rod 401 may be provided with a flange, the diameter of which is larger than the diameter of the portion of the push rod 401 that passes through the long slot 301, so as to ensure that when the push rod 401 moves downward, it can drive the rotating member 300 to rotate. The distance between the lower end of the flange and the upper end of the nut can be set according to actual needs, as long as it can ensure that the push rod 401 can drive the rotating member 300 to rotate in the opposite direction when it rises or falls.
[0061] In some examples, the flange has a preset length along the axial direction of the push rod 401 , and the specific length of the flange can be set according to actual needs.
[0062] In other examples, the push rod 401 has a threaded section and a non-threaded section, the threaded section is located above the non-threaded section, the diameter of the non-threaded section is larger than the diameter of the threaded section, and the non-threaded section serves as a flange; the threaded section is inserted into the long slot 301, and the portion of the threaded section extending downward from the long slot 301 cooperates with the fixing nut. In this way, when the push rod 401 moves downward, the lower end surface of the non-threaded section facing the threaded section can drive the rotating member 300 to rotate.
[0063] In some other examples, the push rod 401 is a screw rod, which cooperates with two fixing nuts, and the two fixing nuts are respectively located on the upper and lower sides of the rotating member 300; the fixing nut located above the rotating member 300 can be used as a flange.
[0064] In this example, the long slot 301 can provide a certain degree of freedom, and the vertical movement of the push rod 401 can drive the rotating member 300 to rotate, so that the end of the rotating member 300 facing the connecting arm 102 can rotate upward or downward.
[0065] In other examples, the long slot 301 can be a blind hole, that is, the long slot 301 is not arranged to penetrate the rotating member 300 in the vertical direction, and the part of the push rod 401 near the lower end can be inserted into the long slot 301; this is convenient for the push rod 401 to push the rotating member 300 to move when it moves downward; wherein, the part of the push rod 401 near the lower end can be provided with a conical tapered section; along the downward direction, the diameter of the tapered section of the push rod 401 gradually decreases. When the push rod 401 moves upward, the rotating member 300 can return to the initial position under the action of its own gravity and the gravity of the protective member 100; or, the rotating member 300 is connected to a second elastic reset member (not shown in the figure), and the second elastic reset member can include a compression spring connected to the rotating member 300, and the compression spring is arranged near the end of the rotating member 300 facing the push rod 401, so that when the push rod 401 moves upward, the rotating member 300 can return to the initial position under the action of the second elastic reset member.
[0066] In some embodiments, a smooth curved surface is provided at one end of the rotating member 300 facing the connecting arm 102 , so that the rotating member 300 cooperates with the connecting arm 102 through the curved surface to reduce wear caused by friction between the rotating member 300 and the connecting arm 102 .
[0067] In some examples, a ball bearing may be installed in the rotating member 300 , and the ball bearing is disposed near one end of the rotating member 300 facing the connecting arm 102 , so that the rotating member 300 is in rolling contact with the connecting arm 102 through the ball bearing.
[0068] In some examples, the rotating member 300 may have a limiting groove, and the connecting arm 102 is partially movable toward the rotating member 300 in the limiting groove. The above arrangement can avoid the problem of the connecting arm 102 and the rotating member 300 being separated due to relative deviation between the connecting arm 102 and the rotating member 300.
[0069] The bottom wall of the limiting groove is provided with a smooth curved surface at a portion facing the rotating member 300. Alternatively, a ball bearing is installed in the limiting groove so that the ball bearing can roll in contact with the connecting arm 102.
[0070] This embodiment also provides a process equipment, including an extraction device and a robot 700. The extraction device is the extraction device in any of the above embodiments. The connecting arm 102 in the extraction device and the robot 700 for picking up and placing the semiconductor workpiece 600 are spaced apart to prevent the extraction device from interfering with the movement of the robot 700.
[0071] This embodiment also provides a processing method, which is implemented based on the extraction device in any of the above embodiments. The similarities between this embodiment and the above embodiments are not repeated here.
[0072] Figure 4 is a flowchart of a processing method provided according to an embodiment of the present disclosure. Figure 4 The processing method provided in this embodiment includes the following steps:
[0073] S401, controlling the driving member to drive the rotating member to rotate, so that the rotating member drives the protecting member to rotate around the first hinge seat to an inclined position;
[0074] S402, controlling the manipulator to grab the semiconductor workpiece at the current position, or placing the semiconductor workpiece at the current position;
[0075] S403, controlling the manipulator to leave the current position;
[0076] S404, controlling the driving member to drive the rotating member to rotate in the reverse direction; wherein, during the reverse rotation of the rotating member, the protective member can return to the initial position under the action of gravity.
[0077] When grabbing the wafer, after the driving member drives the protective member to rotate around the first hinge seat to an inclined position through the rotating member, the robot is controlled to move to the current position of the wafer (i.e., the current position) and grab the wafer; after grabbing the wafer, the robot is controlled to leave the current position; after the robot leaves the current position, the driving member is controlled to drive the rotating member to rotate in the opposite direction; wherein, during the reverse rotation of the rotating member, the protective member can return to the initial position under the action of gravity.
[0078] When releasing the wafer, after the driving member drives the protective member to rotate around the first hinge seat to an inclined position through the rotating member, the robot is controlled to move to the position for placing the wafer (i.e., the current position) and place the wafer; after placing the wafer, the robot is controlled to leave the current position; after the robot leaves the current position, the driving member is controlled to drive the rotating member to rotate in the opposite direction; wherein, during the process of the rotating member rotating in the opposite direction, the protective member can return to its initial position under the action of gravity.
[0079] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0080] In the description of the present disclosure, it is necessary to understand that the terms "up", "down", "left", "right", "top", "bottom", "inside", "outside", "axial", "longitudinal", "lateral", "vertical", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.
[0081] In addition, the terms "first", "second", etc. used in the embodiments of the present disclosure are only used for descriptive purposes and should not be understood as indicating or implying relative importance, or implicitly indicating the number of technical features indicated in the embodiments. Therefore, the features defined by the terms "first", "second", etc. in the embodiments of the present disclosure may explicitly or implicitly indicate that at least one of the features is included in the embodiment. In the description of the present disclosure, the word "multiple" means at least two or two or more, such as two, three, four, etc., unless otherwise clearly and specifically defined in the embodiments.
[0082] In the present disclosure, unless otherwise clearly specified or limited in the embodiments, the terms "installed", "connected", "connected" and "fixed" etc. appearing in the embodiments should be understood in a broad sense. For example, the connection can be a fixed connection, a detachable connection, or an integrated connection. It can be understood that it can also be a mechanical connection, an electrical connection, etc.; of course, it can also be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements, or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific implementation situation.
[0083] In the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0084] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.
Claims
1. An extraction device, comprising: A protective member, the protective member having an annular body and a connecting arm, the connecting arm being connected to the annular body, and the annular body being used to cooperate with a semiconductor workpiece; A first hinge seat, the first hinge seat is fixed at a first installation position, and the first hinge seat is hinged to the annular body; A rotating member, wherein one end of the rotating member facing the protective member is movably connected to the connecting arm; A driving member, the driving member being movably connected to an end of the rotating member away from the connecting arm; The driving member drives the rotating member to rotate, so that the rotating member can provide a first force; Under the first force, the connecting arm can move upward and drive the protective member to rotate around the first hinge seat, so that at least part of the annular body can be separated from the semiconductor workpiece; wherein the upward direction is opposite to the gravity direction of the semiconductor workpiece.
2. The extraction device according to claim 1, wherein: The first hinge seat is arranged close to the edge of the annular body away from the connecting arm.
3. The extraction device according to claim 1, wherein: The first articulated seats include a plurality of seats, at least two of which are symmetrically distributed about a preset straight line; wherein the preset straight line passes through the center point of the annular body and is parallel to the length direction of the connecting arm.
4. The extraction device according to claim 1, further comprising: A second hinged seat, the second hinged seat is hinged to the middle part of the rotating member, and the second hinged seat is fixed at a second installation position.
5. The extraction device according to claim 1, wherein: The rotating member is provided with a long groove; the long groove is arranged near one end of the rotating member facing the driving member; the long groove cooperates with the output end in the driving member, and the long groove is used to provide space for relative movement between the output end in the driving member and the rotating member.
6. The extraction device according to claim 5, wherein: The driving member has a push rod, and the push rod is inserted into the long slot; The push rod is provided with a flange, and the flange is located on the upper side of the rotating member, so that when the push rod moves downward, it can drive the rotating member to move downward toward the end of the push rod; The portion of the push rod extending downward from the long slot cooperates with the fixing nut, so that when the push rod moves upward, it can drive the rotating member to move upward toward the end of the push rod.
7. The extraction device according to claim 1, wherein: The drive member comprises a linear drive.
8. The extraction device according to claim 1, wherein: A curved surface is provided at one end of the rotating member facing the connecting arm, so that the rotating member cooperates with the connecting arm through the curved surface.
9. A process equipment comprising: An extraction device and a robot as described in any one of claims 1 to 8; wherein the connecting arm of the protective member in the extraction device is spaced apart from the robot for picking up and placing semiconductor workpieces.
10. A processing method based on the extraction device according to any one of claims 1 to 8, comprising: Controlling the driving member to drive the rotating member to rotate, so that the rotating member drives the protecting member to rotate around the first hinge seat to an inclined position; Controlling the manipulator to grab the semiconductor workpiece at the current position, or placing the semiconductor workpiece at the current position; Controlling the manipulator to leave the current position; The driving member is controlled to drive the rotating member to rotate in the reverse direction; wherein, during the reverse rotation of the rotating member, the protective member can return to the initial position under the action of gravity.