High-condensation back-to-back LED patch support and packaging process thereof

Abstract

The invention relates to the technical field of LED patch supports, in particular to a high-condensation back-to-back LED patch support. According to the technical scheme, the copper heat conduction support installation plate comprises a copper heat conduction support installation plate body, LED patch installation through grooves and LED patch installation base blocks, the multiple LED patch installation through grooves are formed in the copper heat conduction support installation plate body in a penetrating mode, the distances between the LED patch installation through grooves in the horizontal direction and the vertical direction are equal, and the LED patch installation base blocks are movably installed in the LED patch installation through grooves. According to the invention, the copper heat conduction bracket mounting plate main body, the LED patch mounting through groove, the LED patch mounting base block and the high-condensation LED patch main body are arranged, and the LED patch mounting base block slides into the LED patch mounting through groove, so that the high-condensation LED patch main body is mounted at the top of the copper heat conduction bracket mounting plate main body; and a worker can conveniently mount a plurality of high-condensation LED patch main bodies on the top of the copper heat-conducting bracket mounting plate main body.

Description

Technical Field

[0001] The invention relates to the technical field of LED patch brackets, in particular to a high-focusing back-to-back LED patch bracket and a packaging process thereof. Background Art

[0002] LED SMD lamps (SMD) are made of FPC circuit boards, LED lamps, and high-quality silicone casings. They are waterproof, safe and convenient to use with low-voltage DC power supply, and have various and bright luminous colors. They can resist UV aging, yellowing, and high temperatures when used outdoors. This product is widely used in building outline lights, quasi-decorative lighting in entertainment venues, and advertising decorative lighting.

[0003] In the prior art, there are the following problems: LED patches are small and convenient LED lights that are easy to use in different places in life, have strong focusing properties, and are highly energy-efficient. Currently, most LED patches need to be attached to power supply equipment and then connected to a power source for use, which is inconvenient for staff to operate and is not convenient to carry. Summary of the invention

[0004] The object of the present invention is to provide a high-concentration back-to-back LED patch bracket and a packaging process thereof to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-concentration back-to-back LED patch bracket, comprising a copper thermal conductive bracket mounting plate body, an LED patch mounting groove and an LED patch mounting base block, characterized in that: a plurality of LED patch mounting grooves are provided through the inside of the copper thermal conductive bracket mounting plate body, the horizontal and vertical spacings of the LED patch mounting grooves are equal, an LED patch mounting base block is movably installed inside the LED patch mounting groove, a high-concentration LED patch body is fixedly installed on the top of the LED patch mounting base block, a first slide groove is provided at the front end and the rear end inside the LED patch mounting groove, and a vertical stabilizing limit plate fixed to the LED patch mounting base block is slidably installed inside the first slide groove.

[0006] The staff slides the LED patch mounting base block into the interior of the LED patch mounting groove. At this time, the vertical stability limit plate slides into the interior of the first slide groove as the LED patch mounting base block slides into the interior of the LED patch mounting groove, so that the high-concentration LED patch body is more stably installed on the top of the copper thermal conductive bracket mounting plate body, which is convenient for the staff to install multiple high-concentration LED patch bodies on the top of the copper thermal conductive bracket mounting plate body, thereby making it convenient for the staff to carry the high-concentration LED patch bodies for work lighting, improving the convenience of carrying and installation for the staff, avoiding damage caused by scratching when the staff carries the LED patch, and improving the practicality of the device.

[0007] Preferably, a first fixed block is fixedly installed at the bottom of the LED patch installation base block, base limit blocks are movably installed on both sides of the first fixed block, and limit slots are provided at the bottom of both sides of the inner wall of the LED patch installation through slot. When the LED patch installation base block slides into the interior of the LED patch installation through slot, the base limit blocks on both sides of the first fixed block slide into the interior of the limit slot, so that the base limit blocks play a limiting role on the LED patch installation base block, so that the LED patch installation base block is fixedly installed inside the LED patch installation through slot, driving the high-concentration LED patch body to be installed on the top of the copper thermal conductive bracket mounting plate body, which is convenient for the installation operation of the staff and improves the staff's user experience.

[0008] Preferably, the base limit block slides into and is installed inside the limit groove, and the bottom of the base limit block on the side away from each other is an inclined surface. Since the bottom of the base limit block is inclined, when the base limit block moves downward, the inclined surface contacts the inner wall of the LED patch installation groove, so that the base limit block automatically slides into the interior of the limit groove, which is convenient for the staff to install the LED patch installation base block and improves the installation convenience of the device.

[0009] Preferably, a shrinkage accommodating cavity is provided on both sides of the first fixing block, and the depth of the shrinkage accommodating cavity is twice the length of the base limiting block. When the first fixing block is installed into the LED patch installation slot, since the depth of the shrinkage accommodating cavity is twice the length of the base limiting block, the base limiting block is squeezed by the inner wall of the LED patch installation slot and shrinks toward the inside of the shrinkage accommodating cavity, so that the base limiting block can slide into the inside of the limiting slot conveniently, thereby improving the practicality of the device.

[0010] Preferably, a second fixing block is fixedly installed on one side of the base limiting blocks that are close to each other, and a limiting spring is fixedly installed on one side of the second fixing blocks that are close to each other inside the shrinkage accommodating cavity. Since the elastic force of the limiting spring acts on the second fixing block, when the LED patch installation base block slides into the LED patch installation through groove, the elastic potential energy of the limiting spring is converted into kinetic energy, so that the base limiting block automatically slides outward from the shrinkage accommodating cavity, and the base limiting block slides into the inside of the limiting groove, which is convenient for the staff to install.

[0011] Preferably, a second slide groove is provided at the front and rear ends of the inner wall of the shrinkage accommodating cavity, and a slide rod fixed to the second fixed block is slidably installed inside the second slide groove. When the base limit block is shrinking or sliding out of the shrinkage accommodating cavity, the slide rod slides inside the second slide groove, so that the base limit block moves more stably, thereby improving the stability of the device.

[0012] Preferably, a plurality of magnetic block installation slots are evenly provided at the front and rear ends of the copper heat-conducting bracket mounting plate body, a magnetic adsorption block is movably installed inside the magnetic block installation slot, and a magnetic block limiting plate is fixedly installed on the top of the magnetic adsorption block. The magnetic block limiting plate limits the magnetic adsorption block so that the magnetic adsorption block is fixedly installed inside the magnetic block installation slot. When the staff uses the high-concentration LED patch body, the magnetic adsorption block is adsorbed on the iron piece, so that the copper heat-conducting bracket mounting plate body drives the high-concentration LED patch body to be installed at the designated position, and then the electrical connection is performed, which makes it more convenient for the staff to use the high-concentration LED patch body and improves the practicality of the device.

[0013] A high-concentration back-to-back LED patch bracket packaging process includes the high-concentration back-to-back LED patch bracket of 1-7 above, including the following steps: Step 1. The packaging form of the high-concentration back-to-back LED SMD bracket mainly adopts the corresponding appearance size, heat dissipation measures and light output effect according to different application scenarios. The high-concentration back-to-back LED SMD bracket is subjected to chip inspection microscopy before packaging to check whether there is mechanical damage and pitting on the surface of the material, whether the chip size and electrode size meet the process requirements, and whether the electrode pattern is complete. The high-concentration back-to-back LED SMD bracket is expanded because the high-concentration back-to-back LED SMD bracket is still arranged closely and the spacing is small after dicing, which is convenient for subsequent packaging.

[0014] Step 2: The packaging of the high-concentration back-to-back LED patch bracket is in the form of potting. The potting process is to first inject liquid epoxy into the LED molding cavity, then insert the pressure-welded LED bracket, put it into the oven to allow the epoxy to cure, and then remove the high-concentration back-to-back LED patch bracket from the cavity to form it.

[0015] Compared with the prior art, the present invention has the following beneficial effects: By providing a copper thermal conductive bracket mounting plate body, an LED patch mounting groove, an LED patch mounting base block and a high-concentration LED patch body, the LED patch mounting base block slides into the LED patch mounting groove, so that the high-concentration LED patch body is installed on the top of the copper thermal conductive bracket mounting plate body, which is convenient for the staff to install multiple high-concentration LED patch bodies on the top of the copper thermal conductive bracket mounting plate body, thereby making it convenient for the staff to carry the high-concentration LED patch bodies for work lighting, thereby improving the convenience of carrying and installation for the staff.

[0016] By providing a first slide groove and a vertical stability limit plate, when the LED patch mounting base block slides into and is installed inside the LED patch mounting through groove, the vertical stability limit plate slides into and is installed inside the first slide groove, thereby making the LED patch mounting base block more stably installed inside the LED patch mounting through groove, facilitating installation by staff and improving the stability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of a partial side cross-sectional structure of a main body of a copper heat-conducting bracket mounting plate of the present invention; Figure 3 This is a schematic diagram of the front view structure of the main body of the high-concentration LED patch of the present invention; Figure 4 It is a schematic diagram of the front cross-sectional structure of the first fixing block of the present invention; Figure 5 It is a schematic diagram of the top cross-sectional structure of the first fixing block of the present invention.

[0018] In the figure: 1. Copper thermal conductive bracket mounting plate body; 101. LED patch mounting groove; 102. LED patch mounting base block; 103. High-concentration LED patch body; 104. First slide groove; 105. Vertical stability limit plate; 106. First fixed block; 107. Base limit block; 108. Limit groove; 109. Contraction accommodating cavity; 2. Second fixed block; 201. Limit spring; 202. Second slide groove; 203. Slide rod; 204. Magnetic block mounting groove; 205. Magnetic adsorption block; 206. Magnetic block limit plate. Implementation

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0021] In the description of the present invention, it is necessary to understand that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "set" should be understood in a broad sense, for example, they can be fixedly connected or set, or detachably connected or set, or integrally connected or set. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Example

[0023] like Figure 1 , Figure 2 , Figure 3 Figure 4 and Figure 5 As shown, a high-concentration back-to-back LED patch bracket proposed by the present invention comprises a copper heat-conducting bracket mounting plate body 1, an LED patch mounting groove 101 and an LED patch mounting base block 102, characterized in that: a plurality of LED patch mounting grooves 101 are provided through the copper heat-conducting bracket mounting plate body 1, the horizontal and vertical spacings of the LED patch mounting grooves 101 are equal, an LED patch mounting base block 102 is movably installed inside the LED patch mounting groove 101, a high-concentration LED patch body 103 is fixedly installed on the top of the LED patch mounting base block 102, and a first slide groove 104 is provided at the front and rear ends of the LED patch mounting groove 101; A vertically stable limiting plate 105 fixed to the LED patch mounting base block 102 is slidably installed inside the first slide groove 104, a first fixed block 106 is fixedly installed at the bottom of the LED patch mounting base block 102, and base limiting blocks 107 are movably installed on both sides of the first fixed block 106, and limiting grooves 108 are provided at the bottom of both sides of the inner wall of the LED patch mounting through groove 101, and the base limiting blocks 107 slide into and are installed inside the limiting grooves 108. The bottom of the base limiting blocks 107 away from each other is an inclined surface, and shrinkage accommodating cavities 109 are provided on both sides of the first fixed block 106, and the depth of the shrinkage accommodating cavity 109 is twice the length of the base limiting block 107.

[0024] The working principle of a high-concentration back-to-back LED patch bracket based on Example 1 is as follows: first, the staff slides the LED patch mounting base block 102 into the LED patch mounting through groove 101. At this time, the vertical stability limit plate 105 slides into the first slide groove 104 as the LED patch mounting base block 102 slides into the LED patch mounting through groove 101, so that the high-concentration LED patch body 103 is more stably installed on the top of the copper thermal conductive bracket mounting plate body 1. At this time, since the bottom of the base limit block 107 is inclined, the inclined surface of the base limit block 107 contacts the inner wall of the LED patch mounting through groove 101 during the downward movement; Since the depth of the shrinkage accommodating cavity 109 is twice the length of the base limiting block 107, the base limiting block 107 is squeezed by the inner wall of the LED patch installation slot 101 and shrinks toward the inside of the shrinkage accommodating cavity 109. When the LED patch installation base block 102 slides into the LED patch installation slot 101, the base limiting blocks 107 on both sides of the first fixing block 106 slide into the limiting groove 108, so that the base limiting blocks 107 limit the LED patch installation base block 102, so that the LED patch installation base block 102 is fixedly installed in the LED patch installation slot 101. The high-concentration LED patch body 103 is driven to be installed on the top of the copper thermal conductive bracket mounting plate body 1, which is convenient for the staff to install operations, and it is convenient for the staff to install multiple high-concentration LED patch bodies 103 on the top of the copper thermal conductive bracket mounting plate body 1, so that it is convenient for the staff to carry the high-concentration LED patch body 103 for work lighting, and during use, the copper thermal conductive bracket mounting plate body 1 can better perform copper thermal conduction and heat dissipation treatment on the high-concentration LED patch body 103, improve the heat dissipation effect of the high-concentration LED patch body 103, improve the convenience of carrying and installation for the staff, and avoid damage caused by scratching when the staff carries the LED patch. Example

[0025] like Figure 1 , Figure 4 and Figure 5As shown, a high-focusing back-to-back LED patch bracket proposed by the present invention, compared with the first embodiment, this embodiment also includes: a second fixed block 2 is fixedly installed on the side where the base limit blocks 107 are close to each other, a limit spring 201 is fixedly installed on the side where the second fixed block 2 is close to each other in the shrinkage accommodating cavity 109, and a second slide groove 202 is provided at the front and rear ends of the inner wall of the shrinkage accommodating cavity 109, and a slide rod 203 fixed to the second fixed block 2 is slidably installed inside the second slide groove 202, a plurality of magnetic block installation slots 204 are evenly penetrated at the front and rear ends of the copper thermal conductive bracket mounting plate body 1, a magnetic adsorption block 205 is movably installed inside the magnetic block installation slot 204, and a magnetic block limit plate 206 is fixedly installed on the top of the magnetic adsorption block 205.

[0026] In this embodiment, Figure 1 As shown, when the staff uses the high-concentration LED patch body 103, the magnetic adsorption block 205 is adsorbed on the iron part, so that the copper heat-conducting bracket mounting plate body 1 drives the high-concentration LED patch body 103 to be installed at the designated position, and then the power connection is made, which makes it more convenient for the staff to use the high-concentration LED patch body 103 and improves the practicality of the device. Figure 4 and Figure 5 As shown, due to the elastic force of the limit spring 201 acting on the second fixed block 2, when the LED patch mounting base block 102 slides into the LED patch mounting groove 101, the elastic potential energy of the limit spring 201 is converted into kinetic energy, so that the base limit block 107 automatically slides out to the outside of the shrinkage accommodating cavity 109, and the base limit block 107 slides into the interior of the limit groove 108, which is convenient for the staff to install. During the process of the base limit block 107 shrinking or sliding out of the shrinkage accommodating cavity 109, the slide bar 203 slides inside the second slide groove 202, so that the base limit block 107 moves more stably, thereby improving the stability of the device. The magnetic block limit plate 206 limits the magnetic adsorption block 205, so that the magnetic adsorption block 205 is fixedly installed inside the magnetic block mounting groove 204.

[0027] A high-concentration back-to-back LED patch bracket packaging process includes the high-concentration back-to-back LED patch bracket described in 1-7 above, characterized in that it includes the following steps: Step 1. The packaging form of the high-concentration back-to-back LED SMD bracket mainly adopts the corresponding appearance size, heat dissipation measures and light output effect according to different application scenarios. The high-concentration back-to-back LED SMD bracket is subjected to chip inspection microscopy before packaging to check whether there is mechanical damage and pitting on the surface of the material, whether the chip size and electrode size meet the process requirements, and whether the electrode pattern is complete. The high-concentration back-to-back LED SMD bracket is expanded because the high-concentration back-to-back LED SMD bracket is still arranged closely and the spacing is small after dicing, which is convenient for subsequent packaging.

[0028] Step 2: The packaging of the high-concentration back-to-back LED patch bracket is in the form of potting. The potting process is to first inject liquid epoxy into the LED molding cavity, then insert the pressure-welded LED bracket, put it into the oven to allow the epoxy to cure, and then remove the high-concentration back-to-back LED patch bracket from the cavity to form it.

[0029] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0030] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A high-concentration back-to-back LED patch bracket, comprising a copper heat-conducting bracket mounting plate body (1), an LED patch mounting groove (101) and an LED patch mounting base block (102), characterized in that: A plurality of LED patch installation slots (101) are provided through the copper heat-conducting bracket installation plate body (1), the horizontal and vertical spacings of the LED patch installation slots (101) are equal, an LED patch installation base block (102) is movably installed inside the LED patch installation slot (101), a high-concentration LED patch body (103) is fixedly installed on the top of the LED patch installation base block (102), a first slide slot (104) is provided at the front end and the rear end inside the LED patch installation slot (101), and a vertical stable limit plate (105) fixed to the LED patch installation base block (102) is slidably installed inside the first slide slot (104).

2. A high-concentration back-to-back LED patch bracket according to claim 1, characterized in that: A first fixing block (106) is fixedly mounted on the bottom of the LED patch mounting base block (102), base limiting blocks (107) are movably mounted on both sides of the first fixing block (106), and limiting grooves (108) are provided at the bottom of both sides of the inner wall of the LED patch mounting through groove (101).

3. A high-concentration back-to-back LED patch bracket according to claim 2, characterized in that: The base limiting block (107) slides into and is installed in the limiting groove (108), and the bottom of the base limiting block (107) on the side away from each other is an inclined surface.

4. A high-concentration back-to-back LED patch bracket according to claim 2, characterized in that: The first fixing block (106) is provided with a shrinkage accommodating cavity (109) on both sides, and the depth of the shrinkage accommodating cavity (109) is twice the length of the base limiting block (107).

5. The high-concentration back-to-back LED patch bracket according to claim 4, characterized in that: A second fixing block (2) is fixedly mounted on one side of the base limiting blocks (107) that are close to each other, and a limiting spring (201) is fixedly mounted on one side of the second fixing blocks (2) that are close to each other inside the contraction accommodating cavity (109).

6. A high-concentration back-to-back LED patch bracket according to claim 5, characterized in that: A second sliding groove (202) is provided at the front and rear ends of the inner wall of the shrinkage accommodating cavity (109), and a sliding rod (203) fixed to the second fixing block (2) is slidably mounted inside the second sliding groove (202).

7. The high-concentration back-to-back LED patch bracket according to claim 1, characterized in that: A plurality of magnetic block installation slots (204) are evenly provided at the front and rear ends of the copper heat-conducting bracket installation plate body (1), a magnetic adsorption block (205) is movably installed inside the magnetic block installation slot (204), and a magnetic block limiting plate (206) is fixedly installed on the top of the magnetic adsorption block (205).

8. A high-concentration back-to-back LED patch bracket packaging process, comprising the high-concentration back-to-back LED patch bracket described in 1-7 above, characterized in that: The steps include: Step 1: The packaging form of the high-concentration back-to-back LED patch bracket mainly adopts the corresponding external dimensions, heat dissipation measures and light output effects according to different application scenarios. The high-concentration back-to-back LED patch bracket is subjected to chip inspection and microscopic inspection before packaging to check whether there is mechanical damage and pitting on the surface of the material, whether the chip size and electrode size meet the process requirements, and whether the electrode pattern is complete. The expansion is convenient for subsequent packaging because the high-concentration back-to-back LED patch bracket is still arranged closely and the spacing is very small after dicing. Step 2: The packaging of the high-concentration back-to-back LED patch bracket adopts the form of potting. The potting process is to first inject liquid epoxy into the LED molding cavity, then insert the pressed and welded LED bracket, put it into the oven to let the epoxy solidify, and then remove the high-concentration back-to-back LED patch bracket from the cavity to form it.

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