Chip liquid cooling device
By designing a combined structure of the substrate and the liquid-cooled plate in the chip liquid-cooled device, and using the thermal insulation structure to block the heat exchange between different liquid-cooled runners, the problems of heat transfer and heat winding in the prior art are solved, and the problem of heat transfer and heat winding in the existing technology is realized. Efficient chip cooling.
Patent Information
- Application Number
- CN202411777917.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-02-14
AI Technical Summary
When existing chip liquid cooling devices cool multiple power areas or chips of AI chips, heat transfer and heat winding are prone to occur, resulting in a rise in chip temperature with low power and a decrease in chip temperature with high power, affecting chip life and cooling. efficiency.
A chip liquid-cooling device is designed, adopting a combined structure of substrate and liquid-cooling plate. By setting a separate chamber and flow channel on the liquid-cooling plate, and using a thermal insulation structure to block the heat between different liquid-cooling runners. Exchange, pass into different temperatures of fluid to dissipate heat to the chip or power area at different locations.
Through the design of the thermal insulation structure, heat transfer and thermal winding between chips corresponding to different liquid-cooled runners are reduced, thermal isolation of the chip is achieved, cooling system is optimized, and cooling efficiency is improved.
Smart Images
Figure CN119447063A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of liquid cooling devices, and in particular to a chip liquid cooling device. Background Art
[0002] High-performance AI chips usually have multiple chips or multiple power areas packaged inside. Each chip has different power, size, heat flux density, heat generation, and the maximum safe temperature it can withstand is also different. Existing chip liquid cooling devices use the same liquid cooling plate to cover and cool multiple power areas or multiple chips of an AI chip. Due to the thermal conductivity of the liquid cooling plate itself, when the liquid cooling plate exchanges heat with different chips or power areas, heat transfer and heat crosstalk are likely to occur between chips of different temperatures, causing the temperature of low-power chips to rise, exceeding the design specifications and affecting the life of the chip; the temperature of high-power chips will drop, the temperature margin is too large, and the liquid cooling plate is inefficient. Summary of the invention
[0003] The purpose of the present invention is to provide a chip liquid cooling device, which can simultaneously pass two fluids of different temperatures to dissipate heat for chips or power areas at different positions, and can reduce heat transfer and heat bypass problems, optimize the cooling system, and improve cooling efficiency.
[0004] To achieve this purpose, the present invention adopts the following technical scheme: a chip liquid cooling device, including a substrate, a liquid cooling plate and a connecting pipe assembly, a first liquid cooling zone and a second liquid cooling zone are provided on one side of the substrate; the liquid cooling plate is connected to the substrate, the liquid cooling plate is provided with a first chamber and a second chamber separated from each other, the first chamber forms a first opening on the bottom surface of the liquid cooling plate, the second chamber forms a second opening on the bottom surface of the liquid cooling plate, the first liquid cooling zone corresponds to covering the first opening to form a first liquid cooling channel, and the second liquid cooling zone corresponds to covering the second opening to form a second liquid cooling channel; the connecting pipe assembly includes a first water inlet pipe, a first water outlet pipe, a second water inlet pipe and a second water outlet pipe, the first water inlet pipe and the first water outlet pipe are respectively connected to the first liquid cooling channel, the second water inlet pipe and the second water outlet pipe are respectively connected to the second liquid cooling channel; wherein, the liquid cooling plate and the substrate are respectively provided with a heat insulation structure, and the heat insulation structure is located between the first liquid cooling channel and the second liquid cooling channel.
[0005] Preferably, the liquid cooling plate includes an upper plate body and a lower plate body located below the upper plate body, the upper plate body is provided with a first water inlet channel, a first water outlet channel, a second water inlet channel and a second water outlet channel, the first water inlet channel is connected to the first water inlet pipe, the first water outlet channel is connected to the first water outlet pipe, the second water inlet channel is connected to the second water inlet pipe, and the second water outlet channel is connected to the second water outlet pipe, the lower plate body is provided with a first water flow channel and a second water flow channel, the first water inlet channel is connected to the first water outlet channel through the first water flow channel to form the first chamber, and the second water inlet channel is connected to the second water outlet channel through the second water flow channel to form the second chamber.
[0006] Preferably, the heat insulation structure comprises a first hollow groove, which is opened on a side of the lower plate body facing the upper plate body and is located between the first water passage and the second water passage.
[0007] Preferably, the heat insulation structure further includes a second hollow groove, which passes through the upper plate body in a vertical direction and is correspondingly connected to the first hollow groove.
[0008] Preferably, the heat insulation structure further includes a third hollow groove, which is opened on a side of the base plate away from the lower plate body and is located between the first water passage and the second water passage.
[0009] Preferably, the third hollow groove is filled with a heat insulating member, and the bottom surface of the heat insulating member is flush with the bottom surface of the substrate.
[0010] Preferably, two second water passages are provided, and the two second water passages are symmetrically arranged on both sides of the first water passage, and the second liquid cooling zone, the second water inlet channel, the second water outlet channel and the second water passage are arranged in one-to-one correspondence.
[0011] Preferably, a first mounting block and a second mounting block are provided on the side of the liquid cooling plate facing away from the base plate, the first mounting block and the second mounting block are spaced apart along the flow direction of the fluid in the second water passage, the first mounting block is provided with a first distribution channel, the second water inlet pipe is connected to the two second water inlet channels through the first distribution channel, the second mounting block is provided with a second distribution channel, the second water outlet pipe is connected to the two second water outlet channels through the second distribution channel.
[0012] Preferably, the lower plate body is provided with a positioning groove, and the upper plate body is limited in the positioning groove and is welded and fixed to the lower plate body.
[0013] Preferably, the first liquid cooling zone is provided with a plurality of first shovel teeth arranged at intervals, and a gap for liquid to pass through exists between two adjacent first shovel teeth; and / or, the second liquid cooling zone is provided with a plurality of second shovel teeth arranged at intervals, and a gap for liquid to exist exists between two adjacent second shovel teeth.
[0014] Beneficial effects of the present invention: The first liquid cooling channel and the second liquid cooling channel formed between the substrate and the liquid cooling plate can be respectively fed with fluids of different temperatures, thereby dissipating heat for different chips or power areas corresponding to the first liquid cooling zone and the second liquid cooling zone. By setting up a heat insulation structure, heat exchange between the first liquid cooling channel and the second liquid cooling channel can be blocked, indirectly reducing the heat transfer and heat winding problems between the chips corresponding to the first liquid cooling channel and the second liquid cooling channel, achieving the purpose of thermal isolation of the chip, optimizing the cooling system, and improving the cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic structural diagram of the chip liquid cooling device of the present invention;
[0016] Figure 2 is an exploded view of the chip liquid cooling device of the present invention;
[0017] Figure 3 is a schematic structural diagram of the first liquid cooling channel of the present invention;
[0018] Figure 4 is a schematic structural diagram of the second liquid cooling channel of the present invention;
[0019] Figure 5 is a schematic diagram of the distribution of the first liquid cooling channel and the second liquid cooling channel of the present invention;
[0020] Figure 6 It is a schematic structural diagram of the first distribution channel of the present invention.
[0021] In the figure:
[0022] 100, substrate; 110, first liquid cooling zone; 111, first shovel teeth; 120, second liquid cooling zone; 121, second shovel teeth; 130, third hollow groove; 131, thermal insulation member;
[0023] 200, liquid cooling plate; 210, first chamber; 220, second chamber; 230, upper plate; 231, first water inlet channel; 2311, first through hole; 2312, first groove; 232, first water outlet channel; 233, second water inlet channel; 234, second water outlet channel; 235, second hollow groove; 236, fourth hollow groove; 240, lower plate; 241, first water passage; 2411, second through hole; 2412, third through hole; 2413, second groove; 242, second water passage; 2421, third groove; 2422, fourth groove; 243, first hollow groove; 244, positioning groove; 245, fifth hollow groove; 250, first mounting block; 251, first distribution channel; 260, second mounting block; 270, third mounting block; 271, third distribution channel; 272, fourth distribution channel;
[0024] 300, connecting pipe assembly; 310, first water inlet pipe; 320, first water outlet pipe; 330, second water inlet pipe; 340, second water outlet pipe; 350, pagoda joint. DETAILED DESCRIPTION
[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.
[0026] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0027] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0028] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.
[0029] Reference Figures 1 to 6 As shown, a chip liquid cooling device provided according to an embodiment of the present application includes a substrate 100, a liquid cooling plate 200 and a connecting pipe assembly 300. A first liquid cooling zone 110 and a second liquid cooling zone 120 are provided on one side of the substrate 100. Specifically, the first liquid cooling zone 110 and the second liquid cooling zone 120 are protruding structures with a specific shape and size limited to one side of the substrate 100.
[0030] The liquid cooling plate 200 is connected to the substrate 100, and the liquid cooling plate 200 is provided with a first chamber 210 and a second chamber 220 separated from each other. The first chamber 210 forms a first opening on the bottom surface of the liquid cooling plate 200, and the second chamber 220 forms a second opening on the bottom surface of the liquid cooling plate 200. The first liquid cooling zone 110 corresponds to the first opening to form a first liquid cooling channel, that is, the first liquid cooling zone 110 and the inner wall of the first liquid cooling channel are surrounded to form the first liquid cooling channel. The second liquid cooling zone 120 corresponds to the second opening to form a second liquid cooling channel, that is, the second liquid cooling zone 120 and the inner wall of the second liquid cooling channel are surrounded to form the second liquid cooling channel. Optionally, the first liquid cooling channel and the second liquid cooling channel can be two channels parallel to each other, or two channels staggered with each other, or two channels in which one surrounds the other. The user can design a suitable structural layout of the first liquid cooling channel and the second liquid cooling channel according to the layout of multiple chips or power areas packaged inside the AI chip, which will not be repeated here.
[0031] The connecting pipe assembly 300 includes a first water inlet pipe 310, a first water outlet pipe 320, a second water inlet pipe 330 and a second water outlet pipe 340. The first water inlet pipe 310 and the first water outlet pipe 320 are respectively connected to the first liquid cooling channel, and the second water inlet pipe 330 and the second water outlet pipe 340 are respectively connected to the second liquid cooling channel. Optionally, one end of the first water inlet pipe 310 away from the first liquid cooling channel, one end of the first water outlet pipe 320 away from the first liquid cooling channel, one end of the second water inlet pipe 330 away from the second liquid cooling channel, and one end of the second water outlet pipe 340 away from the second liquid cooling channel are all connected with a pagoda joint 350, so as to facilitate the user to connect an external liquid cooling source and ensure the connection stability and sealing between the pipes.
[0032] The liquid cooling plate 200 and the base plate 100 are respectively provided with a heat insulation structure, and the heat insulation structure is located between the first liquid cooling channel and the second liquid cooling channel.
[0033] It is understandable that the first liquid cooling channel and the second liquid cooling channel formed between the substrate 100 and the liquid cooling plate 200 can be respectively fed with fluids of different temperatures, thereby dissipating heat for different chips or power areas corresponding to the bottom of the first liquid cooling zone 110 (i.e., the area on the side of the substrate 100 away from the liquid cooling plate 200 and corresponding to the position of the first liquid cooling zone 110) and the bottom of the second liquid cooling zone 120 (i.e., the area on the side of the substrate 100 away from the liquid cooling plate 200 and corresponding to the position of the first liquid cooling zone 110). By setting up a heat insulation structure, heat exchange between the first liquid cooling channel and the second liquid cooling channel can be blocked, indirectly reducing the heat transfer and heat winding problems between the chips corresponding to the first liquid cooling channel and the second liquid cooling channel, achieving the purpose of thermal isolation of the chip, ensuring that the chip or power area with poor heat-bearing capacity will not be subjected to high temperatures exceeding its own carrying capacity, and ensuring that the high-power chip is cooled in time, optimizing the cooling system, and improving the cooling efficiency.
[0034] Reference Figures 1 to 4 As shown, it can be understood that the liquid cooling plate 200 includes an upper plate body 230 and a lower plate body 240 located below the upper plate body 230, and the upper plate body 230 is provided with a first water inlet channel 231, a first water outlet channel 232, a second water inlet channel 233 and a second water outlet channel 234, and the first water inlet channel 231, the first water outlet channel 232, the second water inlet channel 233 and the second water outlet channel 234 are separated from each other.
[0035] The first water inlet channel 231 is connected to the first water inlet pipe 310, the first water outlet channel 232 is connected to the first water outlet pipe 320, the second water inlet channel 233 is connected to the second water inlet pipe 330, and the second water outlet channel 234 is connected to the second water outlet pipe 340. The lower plate body 240 is provided with a first water passage 241 and a second water passage 242 separated from each other. The first water inlet channel 231 is connected to the first water outlet channel 232 through the first water passage 241 to form a first chamber 210, and the second water inlet channel 233 is connected to the second water outlet channel 234 through the second water passage 242 to form a second chamber 220.
[0036] Specifically, refer to Figure 2 and Figure 3As shown, the upper plate body 230 is provided with a first through hole 2311 and a first groove 2312. The first groove 2312 is located on the side of the upper plate body 230 facing the lower plate body 240 (the opening of the first groove 2312 is the first opening). The first groove 2312 is connected to the first through hole 2311 and forms a first water inlet channel 231 that passes through both sides of the upper plate body 230. The structure of the first water outlet channel 232 can refer to the previous description of the first water inlet channel 231 and will not be repeated here. The lower plate body 240 is provided with a second through hole 2411, a third through hole 2412 and a second groove 2413. The second through hole 2411 matches the shape of the first groove 2312, the third through hole 2412 matches the shape of the first water outlet channel 232, and the second through hole 2411 and the third through hole 2412 are arranged at intervals along the first direction. The second groove 2413 is located on the side of the lower plate body 240 away from the upper plate body 230 and matches the shape of the first liquid cooling zone 110. The second through hole 2411 and the third through hole 2412 are respectively connected with the second groove 2413 to form a first water passage 241. After the upper plate body 230 is connected to the lower plate body 240, the first groove 2312 is correspondingly connected with the first through hole 2311, and the first water outlet channel 232 is correspondingly connected with the second through hole 2411, thereby realizing the connection between the first water inlet channel 231 and the first water outlet channel 232. At this time, the first cooling liquid a introduced from the first water inlet pipe 310 flows in the first water passage 241 along the first direction from the second through hole 2411 to the third through hole 2412, and finally leaves the liquid cooling plate 200 through the first water inlet channel 231 and the first water outlet pipe 320.
[0037] Reference Figure 2 and Figure 4 As shown, the second water inlet channel 233 and the second water outlet channel 234 are located on the same side of the first water inlet channel 231 (or the first water outlet channel 232) and are arranged at intervals along the first direction. Two third grooves 2421 are arranged at intervals along the first direction on the side of the lower plate body 240 facing the upper plate body 230. The two third grooves 2421 are arranged at intervals along the first direction. A fourth groove 2422 (the opening of the fourth groove 2422 is the second opening) is arranged on the side of the lower plate body 240 away from the upper plate body 230. The fourth groove 2422 extends along the first direction. Both ends of the fourth groove 2422 are respectively connected with the two third grooves 2421 to form a second water passage 242. After the upper plate body 230 is connected to the lower plate body 240, the second water inlet channel 233 and the second water outlet channel 234 are respectively connected with the two third grooves 2421, thereby realizing the connection between the second water inlet channel 233 and the second water outlet channel 234. At this time, the second cooling liquid b introduced from the second water inlet pipe 330 flows in the second water passage 242 along the first direction from the second water inlet channel 233 to the second water outlet channel 234, and finally leaves the liquid cooling plate 200 through the second water inlet channel 233 and the second water outlet pipe 340.
[0038] By setting the upper plate body 230 and the lower plate body 240, the first chamber 210 and the second chamber 220 are split into respective hole groove structures set on the upper plate body 230 and the lower plate body 240, thereby simplifying the structure of the first chamber 210 and the second chamber 220, facilitating the design and processing of the liquid cooling plate 200, and reducing the production cost of the liquid cooling plate 200.
[0039] Furthermore, the lower plate body 240 is provided with a positioning groove 244 , and the positioning groove 244 matches the shape of the upper plate body 230 . The upper plate body 230 is limited in the positioning groove 244 and is welded and fixed to the lower plate body 240 .
[0040] By setting the positioning groove 244, the positioning groove 244 can position the upper plate body 230, so as to realize the rapid alignment between the first water inlet channel 231, the first water outlet channel 232 and the first water passage 241, and between the second water inlet channel 233, the second water outlet channel 234 and the second water passage 242, and can ensure the welding accuracy between the upper plate body 230 and the lower plate body 240 and the overall structural strength of the liquid cooling plate 200.
[0041] Reference Figure 4 and Figure 5 As shown, it can be understood that there are two second water passages 242, and the two second water passages 242 are symmetrically arranged on both sides of the first water passage 241 in the second direction, and the second liquid cooling zone 120, the second water inlet channel 233, the second water outlet channel 234 and the second water passage 242 are arranged one by one, and the second direction, the first direction and the vertical direction are perpendicular to each other.
[0042] By setting two second water passages 242, the two second water passages 242 are correspondingly connected with the two second water inlet channels 233, the two second water outlet channels 234 and the two second water passages 242, two second chambers 220 can be formed, and the two second chambers 220 cooperate with the two second liquid cooling zones 120 to form two second liquid cooling channels on both sides of the first liquid cooling channel. The two second liquid cooling channels can evenly dissipate heat for other chips around the chip below the first liquid cooling channel, further improving the cooling efficiency of the chip liquid cooling device.
[0043] Reference Figure 2 and Figure 5 As shown, it can be understood that the heat insulation structure includes a first hollow groove 243, which is opened on a side of the lower plate body 240 facing the upper plate body 230 and is located between the first water passage 241 and the second water passage 242.
[0044] By setting the first hollow groove 243, the air in the first hollow groove 243 can prevent the first cooling liquid a in the first water channel 241 or the second cooling liquid b in the second water channel 242 from undergoing heat exchange, thereby preventing the temperature of the lower-temperature cooling liquid from rising, further optimizing the cooling system, and improving the cooling efficiency of the chip liquid cooling device.
[0045] Furthermore, the heat insulation structure also includes a second hollow groove 235, which passes through the upper plate body 230 in the vertical direction and is correspondingly connected to the first hollow groove 243, that is, there are two second hollow grooves 235, one of which is located between the first water inlet channel 231 (or the first water outlet channel 232) and the second water inlet channel 233, and the other second hollow groove 235 is located between the first water inlet channel 231 (or the first water outlet channel 232) and the second water outlet channel 234.
[0046] By setting the second hollow groove 235, the air in the second hollow groove 235 can avoid entering the first liquid-cooling channel, the first cooling liquid a, and entering the second liquid-cooling channel, the second cooling liquid b for heat exchange on the upper plate body 230, thereby ensuring that the inlet temperatures of the first cooling liquid a and the second cooling liquid b will not fluctuate, thereby ensuring the subsequent heat exchange performance of the first cooling liquid a and the second cooling liquid b.
[0047] Reference Figure 5 As shown, it can be understood that the heat insulation structure also includes a third hollow groove 130 , which is opened on a side of the base plate 100 away from the lower plate body 240 and is located between the first water passage 241 and the second water passage 242 .
[0048] By providing the third hollow groove 130, the third hollow groove 130 can prevent the heat exchange or heat bypass of the substrate 100 itself from affecting the cooling of the chip, effectively improve the independence of the first liquid cooling channel and the second liquid cooling channel, and further improve the cooling efficiency of the chip liquid cooling device.
[0049] Furthermore, the third hollow groove 130 is filled with a heat insulating member 131 . The heat insulating member 131 is made of epoxy resin glue with low thermal conductivity or other low thermal conductivity materials. The bottom surface of the heat insulating member 131 is flush with the bottom surface of the substrate 100 .
[0050] The side of the lower plate 240 facing away from the upper plate 230 is the side where the substrate 100 contacts the chip (thermal paste is usually applied between the substrate 100 and the chip). By providing the thermal insulation 131, the problem of uneven application of the thermal paste and then the third hollow groove 130, and unsatisfactory heat conduction effect can be avoided, and the working stability of the chip liquid cooling device is improved. At the same time, the thermal insulation 131 is flush with the bottom surface of the substrate 100, that is, the thermal insulation 131 is in contact with the chip, which can increase the contact area between the substrate 100 and the chip, ensure that the pressure of the substrate 100 on the chip is uniform everywhere, and further improve the cooling efficiency of the chip liquid cooling device.
[0051] Reference Figure 1 and Figure 6 As shown, it can be understood that a first mounting block 250 and a second mounting block 260 are provided on the side of the liquid cooling plate 200 facing away from the base plate 100, and the first mounting block 250 and the second mounting block 260 are arranged at intervals along the flow direction of the fluid in the second water passage 242, and the first mounting block 250 is provided with a first distribution channel 251, and the second water inlet pipe 330 is connected to the two second water inlet channels 233 through the first distribution channel 251, and the second mounting block 260 is provided with a second distribution channel, and the second water outlet pipe 340 is connected to the two second water outlet channels 234 through the second distribution channel.
[0052] By providing the first mounting block 250 and the second mounting block 260, the chip liquid cooling device can pass the second cooling liquid b into the two second water inlet channels 233 through the same second water inlet pipe 330, and can receive the second cooling liquid b flowing out of the two second water outlet channels 234 through the same second water outlet pipe 340. The structure of the chip liquid cooling device is simplified, and the subsequent pipeline connection of the chip liquid cooling device is convenient.
[0053] It should be noted that the heat insulation structure also includes two fourth hollow grooves 236 and two fifth hollow grooves 245. The two fourth hollow grooves 236 are respectively located below the first mounting block 250 and the second mounting block 260 and pass through both sides of the upper plate body 230. The two fifth hollow grooves 245 are respectively located below the two fourth hollow grooves 236 and are correspondingly connected to the two fourth hollow grooves 236. By setting the fourth hollow groove 236 and the fifth hollow groove 245, the first hollow groove 243, the second hollow groove 235, the fourth hollow groove 236 and the fifth hollow groove 245 cooperate to separate the first liquid cooling channel from other liquid cooling plate 200 components by air, so as to achieve the purpose of thermal isolation between the first liquid cooling channel and the second liquid cooling channel, greatly improve the independence of the first liquid cooling channel, and improve the utilization rate of the first cooling liquid a and the second cooling liquid b.
[0054] Optionally, two first water inlet channels 231 are provided, and the two first water inlet channels 231 are spaced apart along the first direction, and the first water outlet channel 232 is located between the two first water inlet channels 231. A third mounting block 270 is provided on the side of the liquid cooling plate 200 away from the base plate 100, and the third mounting block 270 is provided with a third distribution channel 271 and a fourth distribution channel 272. The first water inlet pipe 310 is connected to the first water inlet channel 231 through the third distribution channel 271, and the first water outlet pipe 320 is connected to the two first water inlet channels 231 through the fourth distribution channel 272. The connection structure between the first mounting block 250, the second mounting block 260, the third mounting block 270 and the upper plate body 230 can refer to the above description of the connection between the upper plate body 230 and the lower plate body 240, and will not be repeated here.
[0055] Reference Figure 5 and Figure 6 As shown, it can be understood that the first liquid cooling zone 110 is provided with a plurality of first shovel teeth 111, the first shovel teeth 111 are vertically arranged upward and abut against the top wall of the first water passage 241 (i.e., the bottom wall of the second groove 2413), the plurality of first shovel teeth 111 are arranged at intervals along the second direction, and there is a gap between two adjacent first shovel teeth 111 for liquid to pass through; or, the second liquid cooling zone 120 is provided with a plurality of second shovel teeth 121, the second shovel teeth 121 are vertically arranged upward and abut against the top wall of the second water passage 242 (i.e., the bottom wall of the fourth groove 2422), the plurality of second shovel teeth 121 are arranged at intervals along the second direction, and a gap for liquid to exist is formed between two adjacent second shovel teeth 121; or, the first liquid cooling zone 110 is provided with a plurality of first shovel teeth 111, and the second liquid cooling zone 120 is provided with a plurality of second shovel teeth 121.
[0056] By providing the first shovel teeth 111 and the second shovel teeth 121, the contact area between the first cooling liquid a and the second cooling liquid b and the inner wall of the substrate 100 can be increased, thereby increasing the convection heat dissipation area, and greatly improving the heat exchange efficiency of the first cooling liquid a and the second cooling liquid b. Optionally, the number of teeth, tooth thickness, tooth spacing and other parameters of the first shovel teeth 111 and the second shovel teeth 121 can be set according to the heat dissipation efficiency required by the chip. The structural arrangement of the first shovel teeth 111 and the second shovel teeth 121 is not specifically limited, as long as the chip can be quickly cooled.
[0057] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.
Claims
1. A chip liquid cooling device, characterized in that: include: A substrate (100) having a first liquid cooling zone (110) and a second liquid cooling zone (120) on one side; A liquid cooling plate (200) connected to the substrate (100), the liquid cooling plate (200) being provided with a first chamber (210) and a second chamber (220) separated from each other, the first chamber (210) forming a first opening on the bottom surface of the liquid cooling plate (200), the second chamber (220) forming a second opening on the bottom surface of the liquid cooling plate (200), the first liquid cooling zone (110) correspondingly covering the first opening to form a first liquid cooling channel, and the second liquid cooling zone (120) correspondingly covering the second opening to form a second liquid cooling channel; A connecting pipe assembly (300), comprising a first water inlet pipe (310), a first water outlet pipe (320), a second water inlet pipe (330) and a second water outlet pipe (340), wherein the first water inlet pipe (310) and the first water outlet pipe (320) are respectively connected to the first liquid cooling channel, and the second water inlet pipe (330) and the second water outlet pipe (340) are respectively connected to the second liquid cooling channel; Wherein, the liquid cooling plate (200) and the base plate (100) are respectively provided with a heat insulation structure, and the heat insulation structure is located between the first liquid cooling channel and the second liquid cooling channel.
2. The chip liquid cooling device according to claim 1, characterized in that: The liquid cooling plate (200) comprises an upper plate body (230) and a lower plate body (240) located below the upper plate body (230); the upper plate body (230) is provided with a first water inlet channel (231), a first water outlet channel (232), a second water inlet channel (233) and a second water outlet channel (234); the first water inlet channel (231) is connected to the first water inlet pipe (310); the first water outlet channel (232) is connected to the first water outlet pipe (320); the second water inlet channel (233) is connected to the second water inlet pipe (334); 0), the second water outlet channel (234) is connected to the second water outlet pipe (340), the lower plate body (240) is provided with a first water passage channel (241) and a second water passage channel (242), the first water inlet channel (231) is connected to the first water outlet channel (232) through the first water passage channel (241) to form the first chamber (210), and the second water inlet channel (233) is connected to the second water outlet channel (234) through the second water passage channel (242) to form the second chamber (220).
3. The chip liquid cooling device according to claim 2, characterized in that: The heat insulation structure comprises a first hollow groove (243), wherein the first hollow groove (243) is opened on a side of the lower plate body (240) facing the upper plate body (230) and is located between the first water passage (241) and the second water passage (242).
4. The chip liquid cooling device according to claim 3, characterized in that: The heat insulation structure further comprises a second hollow groove (235), wherein the second hollow groove (235) passes through the upper plate body (230) in a vertical direction and is correspondingly connected to the first hollow groove (243).
5. The chip liquid cooling device according to claim 4, characterized in that: The heat insulation structure further comprises a third hollow groove (130), wherein the third hollow groove (130) is formed on a side of the base plate (100) away from the lower plate body (240) and is located between the first water passage (241) and the second water passage (242).
6. The chip liquid cooling device according to claim 5, characterized in that: The third hollow groove (130) is filled with a heat insulating member (131), and the bottom surface of the heat insulating member (131) is flush with the bottom surface of the substrate (100).
7. The chip liquid cooling device according to any one of claims 2 to 6, characterized in that: Two second water passages (242) are provided, and the two second water passages (242) are symmetrically arranged on both sides of the first water passage (241), and the second liquid cooling area (120), the second water inlet channel (233), the second water outlet channel (234) and the second water passages (242) are arranged in a one-to-one correspondence.
8. The chip liquid cooling device according to claim 7, characterized in that: A first mounting block (250) and a second mounting block (260) are provided on a side of the liquid cooling plate (200) facing away from the base plate (100); the first mounting block (250) and the second mounting block (260) are arranged at intervals along the flow direction of the fluid in the second water passage (242); the first mounting block (250) is provided with a first distribution channel (251); the second water inlet pipe (330) is connected to the two second water inlet channels (233) through the first distribution channel (251); the second mounting block (260) is provided with a second distribution channel; the second water outlet pipe (340) is connected to the two second water outlet channels (234) through the second distribution channel.
9. The chip liquid cooling device according to any one of claims 2 to 6, characterized in that: The lower plate body (240) is provided with a positioning groove (244), and the upper plate body (230) is limitedly located in the positioning groove (244) and is welded and fixed to the lower plate body (240).
10. The chip liquid cooling device according to any one of claims 1 to 6, characterized in that: The first liquid cooling zone (110) is provided with a plurality of first shovel teeth (111) arranged at intervals, and a gap for liquid to pass through exists between two adjacent first shovel teeth (111); and / or the second liquid cooling zone (120) is provided with a plurality of second shovel teeth (121) arranged at intervals, and a gap for liquid to exist is formed between two adjacent second shovel teeth (121).