In-situ detection device
By designing an in-position detection device that does not occupy additional pins, using conductive structures and detection devices to realize in-position detection of optical modules, the pin occupancy problem in the prior art is solved, and the accuracy and function of in-position detection are achieved. Consumption and saving.
Patent Information
- Application Number
- CN202310983946.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-04
- Publication Date
- 2025-02-14
AI Technical Summary
In existing optical communication devices, the optical module in-place detection scheme needs to occupy the pins of the gold finger and the optical module connector, which makes it unsuitable in scenarios where there is a large number of pins required.
A in-position detection device is designed, which includes a conductive structure, a detection device, a resistor and a power supply. In-position detection is achieved by electrically connecting the conductive structure to the detection device through the electrical connection of the conductive structure. The device detects a high level when the optical module is not inserted, and a low level when the optical module is inserted, and does not occupy the gold finger and the pins of the optical module connector.
It realizes accurate detection of whether the optical module is in place without occupancy of additional pins. It is suitable for scenarios where there are more or less pin counts and can save power consumption.
Smart Images
Figure CN119449165A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of optical communication technology, and in particular to a presence detection device. Background Art
[0002] The optical module works when inserted into the optical communication device. After the optical module is inserted into the optical communication device, the optical communication device powers on the corresponding port to supply power to the optical module. After the optical module is unplugged from the optical communication device, the optical communication device powers off the corresponding port to stop supplying power to the optical module. Thus, in order to save power consumption, it is necessary to accurately detect whether the optical module is inserted into the optical communication device, that is, to detect whether the optical module is in place.
[0003] In the related art, one of the pins of the gold finger is used as the in-place detection pin on the optical module side and is grounded inside the optical module. At the same time, a preset resistor is pulled up to the power supply between the optical module connector and the detection device. When the optical module is not inserted into the optical communication device, the detection device detects a high level, indicating that the optical module is not in place. After the optical module is inserted into the optical communication device, since the in-place detection pin is grounded, when it contacts the optical module connector, the detection device detects a low level, indicating that the optical module is in place.
[0004] In this in-place detection solution, since one pin of the gold finger and one pin of the optical module connector are respectively required, it is not suitable for scenarios where a large number of pins are required. Summary of the invention
[0005] The present disclosure provides an in-situ detection device, which can perform in-situ detection on an optical module without occupying gold fingers and pins of an optical module connector.
[0006] The present disclosure provides an on-site detection device, which includes a conductive structure, a detection device, a resistor and a power supply;
[0007] The conductive structure is electrically connected to the detection device, one end of the resistor is connected to the connection line between the conductive structure and the detection device, and the other end is electrically connected to the power supply;
[0008] When the optical module is not inserted into the optical module cage, the conductive structure is not grounded, and the detection device is used to detect a high level;
[0009] When the optical module is inserted into the optical module cage, the conductive structure is grounded through the housing of the optical module, and the detection device is used to detect a low level.
[0010] In the solution shown in the present disclosure, when the optical module is not inserted into the optical module cage, the conductive structure is not grounded, and the detection device detects a high level. When the optical module is inserted into the optical module cage, the conductive structure is grounded with the help of the optical module housing and the optical module cage, and the detection device detects a low level, thereby being able to accurately determine whether the optical module is in place without occupying the gold fingers and the pins of the optical module connector. It can be applicable to scenarios with a large number of pin requirements, and also to scenarios with a small number of pin requirements.
[0011] In one example, the housing of the optical module is a conductor; the conductive structure is insulated from the optical module cage, and the optical module cage is grounded;
[0012] When the optical module is not inserted into the optical module cage, the conductive structure is not electrically connected to the optical module cage, and the detection device is used to detect a high level;
[0013] When the optical module is inserted into the optical module cage, the housing of the optical module contacts the optical module cage and the conductive structure respectively, and the detection device is used to detect a low level.
[0014] In the solution shown in the present disclosure, by means of the grounding of the optical module cage and the mutual insulation of the conductive structure and the optical module cage, when the optical module is not inserted into the optical module cage, the conductive structure and the optical module cage are not electrically connected, so that the conductive structure is not grounded, and then the detection device can detect a high level. When the optical module is inserted into the optical module cage, the conductive structure is grounded through the outer shell of the optical module, so that the detection device detects a low level, and thus it can accurately determine whether the optical module is in place.
[0015] In one example, the conductive structure includes a reed, which is located on a side wall of the optical module cage opposite to the socket; the reed is used for interference rebound when the optical module is inserted into the optical module cage.
[0016] In the solution shown in the present disclosure, the reed is a structure of a conventional optical module cage. The in-situ detection of the optical module is realized with the help of the reed, and there is no need to improve the main structure of the optical module cage, which is easy to realize.
[0017] In one example, the conductive structure includes a first contact; the first contact is located on an inner wall of the light module cage.
[0018] In one example, the conductive structure includes a second contact, and the bottom surface of the optical module cage includes a hollow area;
[0019] The second contact is fixed to a circuit board, and the circuit board is the circuit board to which the optical module cage is fixed;
[0020] The second contact passes through the hollow area and is electrically connected to the housing of the optical module.
[0021] In the solution shown in the present disclosure, the conductive structure is a contact, and the contact is fixed to the circuit board. There is no need to add a new contact to the optical module cage to achieve in-situ detection of the optical module.
[0022] In one example, the second contact is electrically connected to the detection device through wiring inside the circuit board. In this way, the second contact can be electrically connected to the detection device without the need for an external wire.
[0023] In one example, the second contact point is a protruding spring sheet.
[0024] In one example, the conductive structure includes a third contact, and the device further includes a spring;
[0025] The third contact and the spring are both located on the inner wall of the optical module cage, and the spring is grounded;
[0026] When the optical module is not inserted into the optical module cage, the third contact is not in contact with the spring, and the detection device is used to detect a high level;
[0027] When the optical module is not inserted into the optical module cage, the third contact is in contact with the spring, and the detection device is used to detect a low level.
[0028] In the solution shown in the present disclosure, the presence detection of the optical module is achieved by checking whether the contact point is in contact with the spring sheet.
[0029] In an example, the conductive structure and the optical module cage are insulated from each other, the optical module cage is grounded, and the elastic sheet is electrically connected to the optical module cage.
[0030] In one example, the electrical connection between the conductive structure and the detection device is achieved through an existing pin. The conductive structure is electrically connected to the detection device through a pin; the pin is the pin closest to the conductive structure among the pins used to fix the optical module cage on the circuit board.
[0031] In one example, the detection device is a complex programmable logic device (CPLD). BRIEF DESCRIPTION OF THE DRAWINGS
[0032] Figure 1 It is a schematic diagram of the structure of a traditional in-situ detection device;
[0033] Figure 2 It is a schematic diagram of the structure of a traditional in-situ detection device;
[0034] Figure 3 is a schematic diagram of the structure of an optical module provided by an exemplary embodiment of the present disclosure;
[0035] Figure 4It is a schematic diagram of a scenario of plugging and unplugging an optical module provided by an exemplary embodiment of the present disclosure;
[0036] Figure 5 It is a key principle diagram for implementing in-situ detection provided by an exemplary embodiment of the present disclosure;
[0037] Figure 6 is a structural schematic diagram of an on-site detection device provided by an exemplary embodiment of the present disclosure;
[0038] Figure 7 is a plan view of an optical module provided by an exemplary embodiment of the present disclosure being inserted into an optical module cage;
[0039] Figure 8 is a schematic diagram of a first contact provided by an exemplary embodiment of the present disclosure being located on a side wall of an optical module cage;
[0040] Fig. 9 is a schematic diagram of a first contact provided by an exemplary embodiment of the present disclosure being located on a bottom plane of an optical module cage;
[0041] Fig.10 is a side view of a second contact provided by an exemplary embodiment of the present disclosure;
[0042] Fig.11 is a plan view of an optical module provided by an exemplary embodiment of the present disclosure being inserted into an optical module cage;
[0043] Fig.12 is a three-dimensional schematic diagram of an in-situ detection device provided by an exemplary embodiment of the present disclosure;
[0044] Fig.13 is a schematic diagram of an exemplary embodiment of the present disclosure, in which a spring sheet and a third contact are located on a bottom plane and a side surface respectively;
[0045] Fig.14 It is a schematic diagram showing that a spring sheet and a third contact point provided by an exemplary embodiment of the present disclosure are both located on a bottom plane.
[0046] Illustration
[0047] 1. Conductive structure; 2. Detection device; 3. Resistance; 4. Power supply; 5. Shrapnel;
[0048] 01. Optical module; 02. Optical module cage; 03. Optical module connector; 04. Circuit board;
[0049] 11. reed; 12. first contact; 13. second contact; 14. third contact;
[0050] 21. Input terminal; 021. Hollow area. DETAILED DESCRIPTION
[0051] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.
[0052] Some terminology concepts involved in the embodiments of the present disclosure are explained below.
[0053] In-place detection refers to detecting whether the optical module is inserted into the optical communication device. When the optical module is inserted into the optical communication device, the optical module is in place. When the optical module is not inserted into the optical communication device, the optical module is not in place. In-place detection is the key basis for whether the optical communication device powers on the optical module. The optical communication device can be an optical line terminal (OLT), etc. When the optical module is in place in the optical communication device, the optical communication device supplies power to the optical module. When the optical module is not in place in the optical communication device, the optical communication device will power off the corresponding port, thereby achieving energy saving of the optical module. In addition, in-place detection is also the start of the optical communication device to perform the next operation, such as reading the optical module information.
[0054] In a traditional in-situ detection solution, the in-situ detection is realized by using the gold finger of the optical module and the optical module connector to cooperate with each other, and the gold finger and the in-situ detection pin in the optical module connector are used to implement the in-situ detection. The optical module connector is a device used to plug the optical module in the optical communication equipment. Figure 1 , one of the pins of the gold finger of the optical module is used as the in-place detection pin on the module side and is grounded inside the optical module. At the same time, between the optical module connector and the detection chip, a preset resistor is pulled up to the power supply, and the optical module connector, resistor, power supply and detection chip are arranged on the circuit board. When the optical module is not inserted into the optical module connector, the input and output (IO) of the detection chip is pulled up by the resistor. At this time, the detection chip detects a high level, indicating that the optical module is not in place. When the optical module is inserted into the optical module connector, the in-place detection pin in the optical module is designed to be grounded. When it contacts the pin of the optical module connector, the IO of the detection chip is pulled to the ground, and the detection chip detects a low level, indicating that the optical module is in place.
[0055] Since it needs to occupy one pin of the gold finger and the optical module connector respectively, it is not suitable for scenarios with high pin requirements. For example, in the case of the coexistence of 50G passive optical network (PON), 10G PON and gigabit-capable PON (GPON), the number of pins required is relatively large. If the in-situ detection occupies one pin, it will affect the implementation of optical modules in the three modes of 50G PON, 10GPON and GPON.
[0056] In another traditional in-situ detection scheme, in-situ detection is implemented through software. Figure 2 , the in-place detection is realized through the signal detection (signal detect, SD) signal of PON. The in-place detection module periodically provides an in-place indication signal by continuously detecting the SD signal. When the optical module is not in place, the SD signal is pulled up to a high level by the resistor. When the optical module is in place, the control chip will output a reset signal to the optical module. During the period when the reset signal is valid, the optical module outputs a low level SD signal. Therefore, during the in-place detection cycle, if the SD signal is in a low level state, the optical module is in place, otherwise, if the SD signal continues to be a high level, the optical module is not in place.
[0057] Since the SD signal is an output signal of the optical module and can only be generated when the optical module is working, it is necessary to continuously supply power to the power supply port of the optical module to implement the presence detection. It may not be possible to save power consumption when the optical module is not in place.
[0058] The disclosed embodiment provides a presence detection device, which solves the problem of gold finger and optical module connector pin occupation, and uses the traditional presence detection pin for other functional pins of the optical module, which can adapt to optical module scenarios with a large number of pins. Moreover, when the presence detection device is used for presence detection, when the optical module is not inserted into the optical communication device, the optical communication device will not power the optical module, and the optical module will be powered only after it is inserted into the optical communication device, which can save power consumption.
[0059] Of course, the in-situ detection device in the embodiment of the present disclosure can also be applied to the optical module scenario with a small number of pin requirements, and the embodiment of the present disclosure is not limited thereto.
[0060] The application scenarios of the embodiments of the present disclosure are described below.
[0061] The in-situ detection device in the embodiment of the present disclosure can be applied to the related equipment of the optical module. For example, the related equipment includes a combined OLT of 10G PON and GPON, or a combo OLT of 50G PON, 10G PON and GPON, or an OLT of 50G PON, or an ONU.
[0062] In the process of evolving towards 50G PON, the OLT of 50G PON needs to be compatible with the existing 10G PON ONU and GPON ONU in the network. The optical module of OLT will have three modes of independent hardware, see Figure 3, the optical module includes gold fingers, 50G PON electrical chips, 10G PON electrical chips, GPON electrical chips and optical subassembly (OSA). The 50G PON electrical chip is used to process the electrical signals of 50G PON, the 10G PON electrical chip is used for the electrical signals of 10G PON, and the GPON electrical chip is used to process the electrical signals of GPON. The optical devices include 50G PON transceiver devices, 10G PON transceiver devices, GPON transceiver devices and wavelength division multiplexing (WDM) devices. The 50GPON transceiver devices are used to perform photoelectric conversion and electro-optical conversion on the signals of 50G PON, the 10G PON transceiver devices are used to perform photoelectric conversion and electro-optical conversion on the signals of 10G PON, and the GPON transceiver devices are used to perform photoelectric conversion and electro-optical conversion on the signals of GPON. The wavelength division multiplexing device is used for beam combining and beam splitting processing.
[0063] During the signal transmission process, the optical module receives the electrical signal sent by the optical communication equipment through the gold finger, and the gold finger transmits the electrical signal to the corresponding electrical chip. The electrical chip processes the received electrical signal and transmits it to the corresponding transceiver in the optical device. The transceiver converts the electrical signal into an optical signal, and the wavelength division multiplexing device combines optical signals of different wavelengths into one optical signal, which is transmitted through the connected transmission optical fiber.
[0064] During the signal reception process, the optical module receives an optical signal through the connected transmission optical fiber. The wavelength division multiplexing device in the optical device splits the optical signal into optical signals of three wavelengths and sends them to the corresponding transceiver device. The transceiver device converts the received optical signal into an electrical signal and transmits it to the connected electrical chip. The electrical chip processes the received electrical signal (such as amplification) and transmits it to the gold finger. The gold finger transmits the electrical signal to the optical communication equipment.
[0065] In the case of implementing three-mode PON, the number of gold fingers of the optical module and the pins of the optical module connector will increase. The in-situ detection device of the embodiment of the present disclosure does not need to occupy the gold fingers and the pins of the optical module connector. The in-situ detection device is more suitable for application in three-mode PON. Of course, the in-situ detection device can also be used in any other PON that requires optical module in-situ detection.
[0066] In the embodiment of the present disclosure, the optical module needs to realize electrical characteristics and plug-in functions, and at least the following components are required: optical module 01, optical module cage 02, optical module connector 03 and circuit board 04, see Figure 4 A schematic diagram of the plugging and unplugging scenario of optical module 01 is provided.
[0067] The optical module connector 03 is located in the space enclosed by the optical module cage 02. The optical module connector 03 is an interface component for connecting the optical module, and is used to transmit electrical signals to the connected optical module to realize communication between the optical communication device and the optical module. The optical module cage 02 is fixed on the circuit board 04 through multiple pins, and the multiple pins are located on both sides of the optical module cage 02. The pins can be called fisheye pins. For example, the optical module connector of the first optical communication device is connected to the first optical module, and the optical module connector of the second optical communication device is connected to the second optical module. The first optical module and the second optical module are connected by an optical cable, thereby realizing optical communication between the first optical communication device and the second optical communication device.
[0068] The optical module 01 may be any one of a receiving optical module, a transmitting optical module or an integrated optical transceiver module.
[0069] The optical module 01 may be a hot-swappable optical module or a non-hot-swappable optical module.
[0070] The optical module 01 can be any type of optical module of a standard packaging type, such as a small form pluggable (SFP) optical module, a quad small form factor pluggable-double density (QSFP-DD) optical module, a 10G small form pluggable (XFP) optical module, a combined optical module of 10G PON and GPON, a combined optical module of 10G PON, 50G PON and GPON, etc.
[0071] The key principles of in-situ detection in the embodiments of the present disclosure are described below.
[0072] Before describing the structure of the in-situ detection device, the key principle of the in-situ detection is first described as a whole. In the embodiment of the present disclosure, the in-situ detection is realized based on the housing of the optical module 01 and the optical module cage 02. The key principle is shown in Figure 5 When the optical module 01 is not inserted into the optical module cage 02, it is equivalent to the in-position switch being disconnected, and the detection device 2 in the in-position detection device detects a high level, indicating that the optical module 01 is not in position. When the optical module 01 is inserted into the optical module cage 02, it is equivalent to the in-position switch being closed, and the detection device 2 in the in-position detection device detects a low level, indicating that the optical module 01 is in position.
[0073] The structure of the in-situ detection device in the embodiment of the present disclosure is described below.
[0074] The in-situ detection device includes a conductive structure 1, a detection device 2, a resistor 3 and a power supply 4. The conductive structure 1 has a conductive function, and the detection device 2 can detect high and low levels. The conductive structure 1 is electrically connected to the detection device 2, one end of the resistor 3 is connected to the connection line between the conductive structure 1 and the detection device 2, and the other end is electrically connected to the power supply 4. To achieve a pull-up effect, the resistance value of the resistor 3 can be selected to be in the kilo-ohm level, such as 5.1 kΩ, and the voltage value of the power supply 4 is also set based on actual needs, such as 3.3V.
[0075] When the optical module 01 is not inserted into the optical module cage 02, the conductive structure 1 is not grounded. The input terminal 21 of the detection device 2 detects a high level due to the pull-up of the resistor 3, indicating that the optical module 01 is not in place.
[0076] When the optical module 01 is inserted into the optical module cage 02, the conductive structure 1 is grounded through the housing of the optical module 01 and the optical module cage 02, the input end 21 of the detection device 2 is strongly pulled to the ground, and the detection device 2 detects a low level, indicating that the optical module 01 is in place.
[0077] In one example, the optical module cage 02 , the detection device 2 , the resistor 3 and the power supply 4 are fixed on the circuit board 04 .
[0078] Among them, when the optical module 01 is inserted into the optical module cage 02, there are three ways for the conductive structure 1 to be grounded through the outer shell of the optical module 01 and the optical module cage 02. The first way is: the conductive structure 1 and the optical module cage 02 are insulated from each other. "Insulated from each other" means that when the conductive structure 1 and the optical module cage 02 are in direct contact, there will be no electrical conduction, and the optical module cage 02 is grounded. The outer shell of the optical module 01 and the optical module cage 02 are both conductors, and the outer shell of the optical module 01 is in direct contact with the conductive structure 1 and the optical module cage 02 respectively. In other words: the outer shell of the optical module 01 is in contact with the optical module cage 02 to achieve electrical conduction, the outer shell of the optical module 01 is grounded, and the outer shell of the optical module 01 is in contact with the conductive structure 1, so that the conductive structure 1 is grounded, so that the input end 21 of the detection device 2 is strongly pulled to the ground, and the detection device 2 detects a low level, indicating that the optical module 01 is in place. In this way, when the optical module 01 is not inserted into the optical module cage 02, the conductive structure 1 and the optical module cage 02 are not electrically connected, and the conductive structure 1 is not grounded. The input terminal 21 of the detection device 2 detects a high level due to the pull-up of the resistor 3, indicating that the optical module 01 is not in place.
[0079] The second method is: the conductive structure 1 and the optical module cage 02 are insulated from each other, and the optical module cage 02 is grounded. The in-place detection device also includes a spring 5, which is electrically connected to the optical module cage 02. When the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 makes the spring 5 contact the conductive structure 1. Since the spring 5 is grounded, the conductive structure 1 is grounded, and the detection device 2 detects a low level, indicating that the optical module 01 is in place. In this way, when the optical module 01 is not inserted into the optical module cage 02, the spring 5 is not in contact with the conductive structure 1, and the conductive structure 1 is not grounded. The input end 21 of the detection device 2 detects a high level because of the pull-up of the resistor 3, indicating that the optical module 01 is not in place.
[0080] The third method is: the conductive structure 1 and the optical module cage 02 are insulated from each other. The in-place detection device also includes a spring 5, which is directly grounded. When the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 makes the spring 5 contact the conductive structure 1. Since the spring 5 is grounded, the conductive structure 1 is grounded, and the detection device 2 detects a low level, indicating that the optical module 01 is in place. In this way, when the optical module 01 is not inserted into the optical module cage 02, the spring 5 is not in contact with the conductive structure 1, and the conductive structure 1 is not grounded. The input end 21 of the detection device 2 detects a high level because of the pull-up of the resistor 3, indicating that the optical module 01 is not in place.
[0081] 1. In the first mode, there are many structures of the on-site detection device, and three feasible structures are provided below.
[0082] 1. A first structure of the in-situ detection device. In the first structure, a reed on the inner wall of a conventional optical module cage 02 is used as a conductive structure 1. There are two reeds on the inner wall of the conventional optical module cage 02. The two reeds are used for interference rebound when the optical module 01 is inserted into the optical module cage 02. The two reeds are located on the side wall of the optical module cage 02 opposite to the socket position and close to the top surface of the optical module cage 02. In practice, the positions of the two reeds may be different for optical module cages 02 of different specifications.
[0083] Figure 6 A structural schematic diagram of an on-site detection device is provided. Figure 7 Provides optical module 01 insertion Figure 6 A schematic plan view of the optical module cage 02 is shown.
[0084] See also Figure 6 and Figure 7 , the conductive structure 1 includes a reed 11. The reed 11 may include one reed or two reeds on the inner wall of the optical module cage 02, and may be designed according to actual needs. The reed 11 and the optical module cage 02 are insulated from each other, which means that when the reed 11 is in direct contact with the optical module cage 02, there is no electrical conduction, and the reed 11 also extends outward to be electrically connected to the detection device 2.
[0085] When the optical module 01 is not inserted into the optical module cage 02, the reed 11 is suspended (ie, not in contact with the housing of the optical module 01), and the input end 21 of the detection device 2 detects a high level due to the pull-up of the resistor 3, indicating that the optical module 01 is not in place.
[0086] When the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 first contacts the optical module cage 02, so that the outer shell of the optical module 01 is grounded. The optical module 01 continues to go deeper into the optical module cage 02. When the optical module 01 is inserted into place and contacts the reed 11, since the outer shell of the optical module 01 is grounded, the reed 11 is grounded, and the detection device 2 is pulled down to the ground by the reed 11, and a low level is detected, indicating that the optical module 01 is in place.
[0087] It should be noted that when the reed 11 is one of the reeds on the inner wall of the optical module cage 02 , the other reed is integrated with the optical module cage 02 body and grounded, or the other reed is not integrated with the optical module cage 02 body.
[0088] In one example, the reed 11 is sprayed with insulating paint to achieve mutual insulation between the reed 11 and the optical module cage 02 .
[0089] In another example, a sleeve is designed for the reed 11 to achieve mutual insulation between the reed 11 and the optical module cage 02 .
[0090] In one example, the optical module cage 02 is fixed on the circuit board 04 through multiple pins, the reed 11 is connected to one of the pins, and the pin is connected to the detection device 2, so that the reed 11 is electrically connected to the detection device 2. For example, the pin is the pin closest to the reed 11.
[0091] In the first structure, the on-site detection is realized by means of the reed in the conventional optical module cage 02 without adding other conductive structures 1, and the manufacturing process is simple.
[0092] 2. The second structure of the in-situ detection device In the second structure, in-situ detection is achieved by adding contacts to the original structure of the optical module cage 02 , and the contacts can be understood as independent patches on the inner wall of the optical module cage 02 .
[0093] The conductive structure 1 includes a first contact 12 . The first contact 12 is located on the inner wall of the optical module 2 . When the optical module 01 is inserted into the optical module cage 02 , the housing of the optical module 01 can contact the first contact 12 .
[0094] When the optical module 01 is not inserted into the optical module cage 02, the first contact 12 is suspended (ie, not in contact with the housing of the optical module 01), and the input end 21 of the detection device 2 detects a high level due to the pull-up of the resistor 3, indicating that the optical module 01 is not in place.
[0095] When the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 first contacts the optical module cage 02, so that the outer shell of the optical module 01 is grounded. The optical module 01 continues to go deeper into the optical module cage 02. When the outer shell of the optical module 01 contacts the first contact 12, since the outer shell of the optical module 01 is grounded, the first contact 12 is grounded, and the detection device 2 is pulled down to the ground by the first contact 12, and a low level is detected, indicating that the optical module 01 is in place.
[0096] It should be noted that the first contact 12 can be located at any position on the inner wall of the optical module cage 02, so that when the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 contacts the first contact 12, and the height of the first contact 12 should also be set appropriately, and the height should enable the optical module 01 to be inserted into the optical module cage 02. Figure 8 A schematic diagram is provided in which the first contact 12 is located on the side wall of the optical module cage 02 . Fig. 9 A schematic diagram is provided in which the first contact 12 is located on the bottom plane of the optical module cage 02 .
[0097] In one example, the first contact 12 is a protruding spring sheet.
[0098] In one example, the optical module cage 02 is fixed on the circuit board 04 through a plurality of pins, the first contact 12 is connected to one of the pins, and the pin is connected to the detection device 2, so that the first contact 12 is electrically connected to the detection device 2. For example, the pin is the pin closest to the first contact 12.
[0099] 3. The third structure of the in-situ detection device. In the third structure, in-situ detection is achieved by adding contacts on the circuit board 04, see Figures 10 to 12 , Fig.10 shows a side view of the second contact 13, Fig.11 A schematic plan view showing the insertion of the optical module 01 into the optical module cage 02 is shown. Fig.12 The circuit board 04 is a printed circuit board (PCB).
[0100] The conductive structure 1 includes a second contact 13. The bottom plane of the optical module cage 02 includes a hollow area 021, which is the surface where the optical module cage 02 contacts the circuit board 04. The hollow area 021 is a hollow area of the bottom plane of the conventional optical module cage 02, or a hollow area specially designed for setting the second contact 13. The second contact 13 is fixed to the circuit board 04, which is the circuit board to which the optical module cage 02 is fixed.
[0101] It should be noted that, in the case of a specially designed hollow area 021, the size of the hollow area 021 matches that of the second contact 13, so that the second contact 13 can pass through the hollow area 021, and the height of the second contact 13 is higher than the bottom plane of the optical module cage 02, that is, the height d of the second contact 13 above the bottom plane is greater than a certain value, so that when the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 can contact the second contact 13, but d should not be too large to prevent the optical module 01 from being unable to be inserted into the optical module cage 02.
[0102] When the optical module cage 02 is in contact with the second contact 13, the optical module cage 02 is insulated from the second contact 13. For example, the size of the hollow area 021 is relatively small, the edge of the hollow area 021 is in contact with the second contact 13, and the second contact 13 is sprayed with insulating material, so that the optical module cage 02 and the second contact 13 are insulated from each other.
[0103] When the optical module cage 02 and the second contact 13 do not contact each other, the optical module cage 02 and the second contact 13 are spatially isolated and insulated from each other. For example, the size of the hollow area 021 is relatively large, and the edge of the hollow area 021 and the second contact 13 do not contact each other.
[0104] When the optical module 01 is not inserted into the optical module cage 02, the second contact 13 is suspended (ie, not in contact with the housing of the optical module 01), and the input end 21 of the detection device 2 detects a high level due to the pull-up of the resistor 3, indicating that the optical module 01 is not in place.
[0105] When the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 first contacts the optical module cage 02, so that the outer shell of the optical module 01 is grounded, and the optical module 01 continues to go deeper into the optical module cage 02. When the optical module 01 contacts the second contact 13, since the outer shell of the optical module 01 is grounded, the second contact 13 is grounded, and the detection device 2 detects a low level, indicating that the optical module 01 is in place.
[0106] In one example, the second contact 13 is a raised spring sheet, the height of which is slightly higher than the bottom plane of the optical module cage 02 , ensuring that the optical module 01 can contact the second contact 13 after being inserted into the optical module cage 02 .
[0107] In one example, the second contact 13 is connected to the detection device 2 through wiring inside the circuit board 04 , thereby achieving electrical connection with the detection device 2 .
[0108] Alternatively, the optical module cage 02 is fixed on the circuit board 04 through a plurality of pins, the second contact 13 is connected to one of the pins, and the pin is connected to the detection device 2, so that the second contact 13 is electrically connected to the detection device 2. For example, the pin is the pin closest to the second contact 13.
[0109] 2. In the second method, the optical module cage 02 is grounded, and the optical module cage 02 is electrically connected to the spring 5. After the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 makes the spring 5 contact with the conductive structure 1, so that the conductive structure 1 is grounded. Fig.13 and Fig.14 Schematic diagram of the in-situ detection scheme shown. Fig.13 is a schematic diagram showing that the spring 5 and the third contact 14 are located on the bottom plane and the side, respectively. Fig.14 It is a schematic diagram showing that the spring piece 5 and the third contact 14 are both located on the bottom plane.
[0110] The conductive structure 1 includes a third contact 14 , and the in-situ detection device also includes a spring 5 . The third contact 14 and the spring 5 are both located on the inner wall of the optical module cage, and the third contact 14 and the optical module cage 02 are insulated from each other.
[0111] When the optical module 01 is not inserted into the optical module cage 02, the third contact 14 is not in contact with the spring 5, and the processing is in a separated state. The input end 21 of the detection device 2 detects a high level because of the pull-up of the resistor 3, indicating that the optical module 01 is not in place.
[0112] When the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 first contacts the optical module cage 02, so that the outer shell of the optical module 01 is grounded. The optical module 01 continues to go deeper into the optical module cage 02, and the outer shell of the optical module 01 contacts and squeezes the spring 5, so that the spring 5 contacts the third contact 14. When the outer shell of the optical module 01 contacts the spring 5, the spring 5 is grounded, so that the third contact 14 is also grounded, and the detection device 2 detects a low level, indicating that the optical module 01 is in place. Alternatively, the spring 5 is electrically conductive with the optical module cage 02, and the spring 5 is also grounded. When the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 contacts and squeezes the spring 5, so that the spring 5 contacts the third contact 14, and the spring 5 is grounded, so that the third contact 14 is also grounded, and the detection device 2 detects a low level, indicating that the optical module 01 is in place.
[0113] It should be noted that Fig.13 and Fig.14 These are two exemplary solutions. In the second embodiment, as long as the spring sheet 5 and the third contact 14 can contact each other when the optical module 01 is inserted into the optical module cage 02, the spring sheet 5 and the third contact 14 can be located at any position on the inner wall of the optical module cage 02. For example, the spring sheet 5 and the third contact 14 are both located on the side of the optical module cage 02.
[0114] The implementation principle of the spring piece 5 and the third contact 14 at other positions is the same as Fig.13 and Fig.14 The implementation principles are the same and will not be listed one by one.
[0115] 3. In the third mode, the spring 5 itself is grounded, and the optical module cage 02 may or may not be grounded. After the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 makes the spring 5 contact with the conductive structure 1, so that the conductive structure 1 is grounded.
[0116] The conductive structure 1 includes a third contact 14 , and the in-situ detection device also includes a spring 5 . The third contact 14 and the spring 5 are both located on the inner wall of the optical module cage, and the third contact 14 and the optical module cage 02 are insulated from each other.
[0117] When the optical module 01 is not inserted into the optical module cage 02, the third contact 14 is not in contact with the spring 5, and the processing is in a separated state. The input end 21 of the detection device 2 detects a high level because of the pull-up of the resistor 3, indicating that the optical module 01 is not in place.
[0118] When the optical module 01 is inserted into the optical module cage 02, the outer shell of the optical module 01 contacts and squeezes the spring sheet 5, so that the spring sheet 5 contacts the third contact 14. Since the spring sheet 5 is grounded, the third contact 14 is also grounded, and the detection device 2 detects a low level, indicating that the optical module 01 is in place.
[0119] In one example, in the second manner and the third manner, the optical module cage 02 is fixed on the circuit board 04 through a plurality of pins, the third contact 14 is connected to one of the pins, and the one pin is connected to the detection device 2, so that the third contact 14 is electrically connected to the detection device 2. For example, the one pin is the pin closest to the third contact 14.
[0120] In one example, in the first to third modes, the detection device 2 is a CPLD. This is only an example. Any device that can detect high and low levels can be used as the detection device 2, and the embodiments of the present disclosure are not limited thereto.
[0121] As can be seen from the above, in the first and second modes, the in-situ detection device is used, with the help of the grounding of the optical module cage 02 and the mutual insulation between the conductive structure 1 and the optical module cage 02, so that when the optical module 01 is not in place, the detection device 2 detects a high level, and when the optical module 01 is in place, the detection device 2 detects a low level, and it can accurately determine whether the optical module 01 is in place. In the third mode, the in-situ detection device is used, with the help of the contact between the spring 5 and the conductive structure 1, so that when the optical module 01 is not in place, the detection device 2 detects a high level, and when the optical module 01 is in place, the detection device 2 detects a low level, and it can accurately determine whether the optical module 01 is in place.
[0122] In the disclosed embodiment, the in-situ detection based on the optical module cage 02 and the periphery is implemented, which can omit the dedicated in-situ detection pin defined by the protocol, thereby maximizing the pin utilization, which is not only suitable for scenarios with high pin requirements, but also for scenarios with low pin requirements.
[0123] Moreover, the device for in-place detection according to the embodiment of the present disclosure does not rely on the output signal of the optical module 01. Therefore, it is not necessary to power the optical module 01. Thus, when the optical module 01 is not in place, the port for powering the optical module 01 can be turned off to save power consumption.
[0124] Moreover, the in-situ detection solution is to make a small improvement on the optical module cage 02, and the cost will not increase significantly. It is a low-cost in-situ detection solution.
[0125] Moreover, the in-place detection scheme is a hardware-implemented in-place detection of the optical module 01, and has a fast response speed. At the moment when the optical module 01 is inserted into the optical module cage 02 or pulled out from the optical module cage 02, the detection device 2 detects the electrical level, and an indication information of the optical module being in place can be given, so that whether the optical module 01 is in place can be quickly detected.
[0126] In the present disclosure, the terms "first" and "second" and the like are used to distinguish between identical or similar items having substantially the same effects and functions. It should be understood that there is no logical or temporal dependency between "first" and "second", nor is the quantity and execution order limited. It should also be understood that although the following description uses the terms first and second, etc. to describe various elements, these elements should not be limited by the terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of various examples, the first contact may be referred to as the second contact, and similarly, the second contact may be referred to as the first contact. Both the first contact and the second contact may be contacts, and in some cases, may be separate and different contacts.
[0127] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present disclosure.
Claims
1. An in-situ detection device, characterized in that: The device comprises a conductive structure (1), a detection device (2), a resistor (3) and a power source (4); The conductive structure (1) is electrically connected to the detection device (2); one end of the resistor (3) is connected to the connection line between the conductive structure (1) and the detection device (2), and the other end is electrically connected to the power supply (4); When the optical module is not inserted into the optical module cage, the conductive structure (1) is not grounded, and the detection device (2) is used to detect a high level; When the optical module is inserted into the optical module cage, the conductive structure (1) is grounded through the housing of the optical module, and the detection device (2) is used to detect a low level.
2. The device according to claim 1, characterized in that The housing of the optical module is a conductor; the conductive structure (1) and the optical module cage are insulated from each other, and the optical module cage is grounded; When the optical module is not inserted into the optical module cage, the conductive structure (1) is not electrically connected to the optical module cage, and the detection device (2) is used to detect a high level; When the optical module is inserted into the optical module cage, the housing of the optical module contacts the optical module cage and the conductive structure (1) respectively, and the detection device (2) is used to detect a low level.
3. The device according to claim 2, characterized in that The conductive structure (1) comprises a reed (11), and the reed (11) is located on a side wall of the optical module cage opposite to the socket position; The spring sheet (11) is used for interference rebound when the optical module is inserted into the optical module cage.
4. The device according to claim 2, characterized in that The conductive structure (1) comprises a first contact (12); The first contact point (12) is located on the inner wall of the optical module cage.
5. The device according to claim 2, characterized in that The conductive structure (1) includes a second contact (13), and the bottom surface of the optical module cage includes a hollow area; The second contact (13) is fixed to a circuit board, and the circuit board is the circuit board to which the optical module cage is fixed; The second contact (13) passes through the hollow area and is electrically connected to the housing of the optical module.
6. The device according to claim 5, characterized in that The second contact (13) is electrically connected to the detection device (2) through wiring inside the circuit board.
7. The device according to claim 5 or 6, characterized in that The second contact point (13) is a protruding spring sheet.
8. The device according to claim 1, characterized in that The conductive structure (1) comprises a third contact (14), and the device further comprises a spring (5); The third contact (14) and the spring sheet (5) are both located on the inner wall of the optical module cage, and the spring sheet (5) is grounded; When the optical module is not inserted into the optical module cage, the third contact (14) is not in contact with the spring (5), and the detection device (2) is used to detect a high level; When the optical module is not inserted into the optical module cage, the third contact (14) contacts the spring (5), and the detection device (2) is used to detect a low level.
9. The device according to claim 8, characterized in that The conductive structure (1) is insulated from the optical module cage, and the optical module cage is grounded; The spring sheet (5) is electrically connected to the optical module cage.
10. The device according to any one of claims 1 to 5, characterized in that The conductive structure (1) is electrically connected to the detection device (2) via a pin; The pin is the pin closest to the conductive structure (1) among the pins used to fix the optical module cage on the circuit board.