Earphone

Abstract

The invention provides an earphone. The earphone comprises a main circuit board, a radiator and an extension floor, the radiator is arranged on the first surface of the main circuit board; the extension floor is arranged on the second surface of the main circuit board and is in common ground with the main circuit board; the first surface is a surface far away from a wearer, and the second surface is a surface facing the wearer.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a headset. Background Art

[0002] True Wireless Stereo (TWS) headphones have been widely loved by consumers since their birth. TWS headphones do not require wired connections. The left and right headphones form a stereo system through Bluetooth. They have excellent convenience and audio performance. Nowadays, they are the most popular headphones in the market besides traditional headphones. However, due to the absorption and shielding of signals by the human head, the radiation efficiency of the antenna in the headphones is low. Summary of the invention

[0003] The present application provides an earphone that can improve the radiation efficiency of an antenna in the earphone.

[0004] An embodiment of the present application provides a headset, comprising: a main circuit board, a radiator, and an extended floor;

[0005] The radiator is disposed on the first surface of the main circuit board;

[0006] The extended floor is disposed on the second surface of the main circuit board and shares a common ground with the main circuit board;

[0007] The first surface is a surface facing away from the wearer, and the second surface is a surface facing the wearer.

[0008] In the embodiment of the present application, the extended floorboard is made to share the ground with the main circuit board, so that the current flowing from the radiator to the ground layer of the main circuit board can further flow to the extended floorboard, which is conducive to extending the length of the current in the antenna in the headset, thereby improving the radiation efficiency of the antenna. At the same time, by arranging the radiator on the first surface of the main circuit board, and the extended floorboard is arranged on the second surface of the main circuit board, and the first surface is the surface away from the wearer, and the second surface is the surface facing the wearer, so that when the headset is in the wearing state, since the main circuit board and the extended floorboard are closer to the wearer than the radiator, it is conducive to further increasing the distance between the radiator and the wearer, thereby reducing the head model loss, thereby further improving the radiation efficiency of the antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is one of the structural schematic diagrams of the earphone provided in the embodiment of the present application;

[0010] Figure 2 This is the second structural schematic diagram of the earphone provided in the embodiment of the present application;

[0011] Figure 3 This is the third structural schematic diagram of the earphone provided in the embodiment of the present application;

[0012] Figure 4 This is the fourth structural schematic diagram of the earphone provided in the embodiment of the present application;

[0013] Figure 5 This is the fifth structural diagram of the earphone provided in the embodiment of the present application;

[0014] Figure 6 is a schematic diagram of the structure of the main circuit board in an embodiment of the present application;

[0015] Figure 7 is a comparison diagram of the radiation efficiency of the loop antenna in the embodiment of the present application and the traditional planar inverted F antenna;

[0016] Figure 8 is a schematic diagram of the flow state of the current generated in the loop antenna when the loop antenna is in a working state in one embodiment of the present disclosure;

[0017] Fig. 9 is a schematic diagram of the electric field distribution near the earphone when the above-mentioned extended floor is not provided in the earphone;

[0018] Fig.10 is a schematic diagram of the electric field distribution near the earphone after the above-mentioned extended floor is set in the earphone;

[0019] Fig.11 It is a comparison chart of the loss caused by the human body with and without the antenna extending the floor;

[0020] Fig.12 This is a comparison chart of antenna radiation efficiency with and without extended floor;

[0021] Fig.13 is a cross-sectional schematic diagram of a main circuit board in an embodiment of the present application;

[0022] Fig.14 It is a cross-sectional schematic diagram of the flexible circuit board in the embodiment of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0024] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0025] The earphones provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0026] See also Figure 1-5 , Figure 1-5 It is a structural schematic diagram of an earphone provided in an embodiment of the present application, the earphone includes a main circuit board 100, a radiator 300 and an extended floor 400; the radiator 300 is arranged on the first surface 107 of the main circuit board 100; the extended floor 400 is arranged on the second surface 108 of the main circuit board 100 and shares the same ground with the main circuit board 100; the first surface 107 is a surface away from the wearer, and the second surface 108 is a surface facing the wearer.

[0027] It can be understood that the radiator 300 is a radiator of an antenna in the earphone. The radiator 300 can be electrically connected to the main circuit board, so that a feed signal can be fed to the radiator 300 through the main circuit board 100, and at the same time, the radiator 300 can also be grounded through the grounding layer in the main circuit board 100, thereby forming an antenna structure. In this way, when the main circuit board 100 feeds a feed signal to the radiator 300, a current is formed in the radiator 300, and the current in the radiator 300 can flow to the grounding layer of the main circuit board 100.

[0028] The extended floor panel 400 and the main circuit board 100 share a common ground, that is, the ground layer in the main circuit board 100 and the extended floor panel 400 are electrically connected.

[0029] The first surface 107 is the surface away from the wearer, which specifically means that when the headset is in the wearing state, the first surface 107 is the surface of the main circuit board 100 away from the wearer, that is, when the headset is in the wearing state, the first surface 107 is the surface of the main circuit board 100 facing away from the wearer. Figure 3 and Figure 5The earphone may include an ear bag 500, and the ear bag 500 may include an in-ear earplug. When the earphone is in a wearing state, the user plugs the earplug into the ear. At this time, the first surface 107 of the main circuit board 100 is facing away from the wearer's face, and the second surface 108 of the main circuit board 100 is facing the wearer's face.

[0030] The above-mentioned earphone can be one of the Bluetooth earphones, for example, it can be one of the earphones with an antenna in the TWS earphone.

[0031] See also Figure 9-10 , Fig.10 FIG. 4 is a schematic diagram of the electric field distribution near the earphone after the above-mentioned extended floor 400 is set in the earphone, wherein: Fig.10 The area indicated by the rectangular box is the electric field entering the human body. Fig. 9 FIG. 4 is a schematic diagram of the electric field distribution near the earphone when the extended floor 400 is not provided in the earphone, wherein: Fig. 9 The area indicated by the rectangular box is the electric field entering the human body. Figure 9-10 It can be seen that, without the extension floor 400, a large part of the electric field will enter the human body, while the extension floor 400 changes the distribution of the electric field, which can significantly reduce the electric field entering the human body, thereby further reducing the loss of radiation performance caused by the human body. Fig.11 , which is a comparison diagram of the loss caused by the human body of the antenna with and without the extended floor 400, Fig.11 It can be seen that the human body loss can be reduced by 3dB by adding the extended floor 400. Fig.12 is a comparison diagram of antenna radiation efficiency with and without the extended floor 400, Fig.12 It can be seen that the radiation efficiency of the antenna with extended floor 400 is 3dB higher, which greatly improves the head model efficiency of the headset and improves the user experience.

[0032] In this embodiment, by making the extended floor 400 and the main circuit board 100 share the same ground, the current flowing from the radiator 300 to the ground layer of the main circuit board 100 can further flow to the extended floor 400, which is conducive to extending the length of the current in the antenna in the headset, thereby improving the radiation efficiency of the antenna. At the same time, by arranging the radiator 300 on the first surface 107 of the main circuit board 100, and the extended floor 400 on the second surface 108 of the main circuit board 100, and the first surface 107 is the surface away from the wearer, and the second surface 108 is the surface facing the wearer, when the headset is in the wearing state, since the main circuit board 100 and the extended floor 400 are closer to the wearer than the radiator 300, it is conducive to further increasing the distance between the radiator 300 and the human body, thereby reducing the head mode loss, thereby further improving the radiation efficiency of the antenna.

[0033] Optionally, the headset further includes a flexible circuit board 200, the main circuit board 100 includes a first signal layer 103 and a first ground layer 104, the flexible circuit board 200 includes a second ground layer 202, and the first ground layer 104 is electrically connected to the second ground layer 202, and the extended floor 400 is electrically connected to the second ground layer 202;

[0034] The first end 301 of the radiator 300 is electrically connected to the RF transceiver circuit 102 in the first signal layer 103 , and the second end 302 of the radiator 300 is electrically connected to the first ground layer 104 to form a loop antenna.

[0035] The above-mentioned RF transceiver circuit 102 can form the feed source (that is, the RF signal source) of the loop antenna, the first end 301 of the radiator 300 forms a feeding point, and the first signal layer 103 is electrically connected to the feeding point through the RF transceiver circuit 102 to feed the feeding signal into the radiator 300.

[0036] The first signal layer 103 and the first ground layer 104 may be stacked or located in the same plane. For example, a hollow area may be provided in the first ground layer 104, and the first signal layer 103 may be provided in the hollow area.

[0037] The flexible circuit board 200 may be a flexible circuit board 200 provided for installing related electrical components in the earphone. The first grounding layer 104 forms the floor of the main circuit board 100, the second grounding layer 202 forms the floor of the flexible circuit board 200, and the extended floor 400 is an additional floor provided for extending the current of the antenna in the earphone.

[0038] It is understandable that the radiator 300 can be bent so that the radiator 300 forms a radiator of a loop antenna.

[0039] Specifically, since the loop antenna is a self-balancing antenna, the current of the loop antenna is mainly concentrated on the antenna branches, and the current of the loop antenna on the floor is weaker than that of the traditional antenna. However, the traditional antenna also has a strong current distribution on the floor. Figure 7 , which is a comparison of the radiation efficiency of the loop antenna and the traditional planar inverted F antenna. Figure 7 It can be seen that the radiation efficiency of the loop antenna is 1dB higher than that of the traditional PIFA.

[0040] In this embodiment, by electrically connecting the first ground layer 104 to the second ground layer 202, and electrically connecting the extended floor 400 to the second ground layer 202, the current transmitted from the radiator 300 to the first ground layer 104 can flow through the first ground layer 104 to the second ground layer 202, and then flow from the second ground layer 202 to the extended floor 400, which is conducive to extending the length of the current in the antenna, thereby improving the radiation efficiency of the antenna. At the same time, by forming a loop antenna in the earphone, compared with a traditional antenna (such as an inverted-F antenna (IFA) or a monopole antenna), the current of the loop antenna is mainly concentrated on the antenna branch, and the current of the loop antenna on the floor is weak, and the floor in the earphone is usually closer to the human body than the radiator. Therefore, compared with setting a traditional antenna in the earphone, forming a loop antenna in the earphone has lower head mode loss, which is conducive to further improving the radiation efficiency of the antenna in the earphone.

[0041] Optionally, the first grounding layer 104 also includes a grounding terminal 101, and the first grounding layer 104 is electrically connected to the second grounding layer 202 through the grounding terminal 101, the grounding terminal 101, the first end 301 of the radiator 300 and the second end 302 of the radiator 300 are arranged at intervals along the length direction of the circuit board; and the first end 301 of the radiator 300 is located between the grounding terminal 101 and the second end 302 of the radiator 300.

[0042] The ground terminal 101 may be a first ground pin (first GND pin). A circuit board in a conventional headset generally includes four pins for connecting a speaker to a battery. The four pins are: Spk+, Spk-, Bat+, Bat-, where Spk+ is Figure 6 The number 104 in Spk-i.e. Figure 6 The number 103 in Bat+ is Figure 6The number 105 in Bat-i.e. Figure 6 Reference number 106 in . Figure 6 In the embodiment of the present disclosure, a first GND pin can be added on the basis of the four pins, and the first GND pin can be set between the two Spk pins and the two Bat pins. Of course, the first GND pin can also be set on both sides of the above four pins. The first GND pin is added to facilitate the connection between the first ground layer 104 and the second ground layer 202. The second ground layer 202 can be provided with a second GND pin, and the second ground layer 202 can be electrically connected to the extended floor 400 through the second GND pin.

[0043] It is understandable that the flexible circuit board 200 may further include a second signal layer 201, and the second signal layer 201 may be stacked with the second ground layer 202, or the second signal layer 201 may be arranged on the same plane as the second ground layer 202. The second signal layer 201 may be electrically connected to the above-mentioned Spk+, Spk-, Bat+, Bat-, and the first GND pin at the same time, and it is understandable that the first GND pin is electrically connected to the second ground layer 202 through the second signal layer 201.

[0044] In addition, the earphone further includes a speaker and a battery, and at least one of the speaker and the battery is electrically connected to the second signal layer 201. For example, the speaker and the battery are electrically connected to the second signal layer 201, respectively, that is, the flexible circuit board 200 is a flexible circuit board 200 in the earphone for mounting the speaker and the battery. In this way, by reusing the flexible circuit board 200 in the earphone and changing the connection position between the flexible circuit board 200 and the main circuit board 100 (that is, changing the position of the ground terminal 101, that is, changing the outlet position of the flexible circuit board 200), the current length of the antenna is extended.

[0045] See also Figure 1 , part of the current formed in the radiator 300 can enter the first ground layer 104 from the second end 302 of the radiator 300. Since the first end 301 of the radiator 300 is located between the ground terminal 101 and the second end 302 of the radiator 300, in this way, to enter the first ground layer 104, it needs to be transmitted from one end of the first ground layer 104 to the other end to reach the ground terminal 101, and then enter the second ground layer 202 through the ground terminal 101, thereby further increasing the current length of the antenna in the headset.

[0046] Optionally, the ground terminal 101 is located at an end of the first ground layer 104 in the length direction.

[0047] The flexible circuit board 200 may include a conductive spring corresponding to the ground terminal 101, and the flexible circuit board 200 is electrically connected to the ground terminal 101 through the conductive spring, or the electrical connection between the flexible circuit board 200 and the ground terminal 101 may be established by direct welding (Hotbar). Figure 1 The ground terminal 101 is located at one end of the main circuit board 100 close to the ear bag 500 .

[0048] In this embodiment, by arranging the ground terminal 101 at the end of the length direction of the first ground layer 104, the transmission length of the current entering the first ground layer 104 in the first ground layer 104 can be further delayed, which is conducive to further increasing the current length of the antenna in the headset. Figure 8 , is a schematic diagram of the flow state of the current generated in the loop antenna when the loop antenna is in a working state in one embodiment of the present disclosure. Specifically, the flow path of the current entering the first ground layer 104 from the second end 302 of the radiator 300 is as follows: Figure 8 The transmission path is indicated by the arrow in the figure, that is, it is first transmitted from one end of the length direction of the first ground layer 104 to the other end, and is transmitted from the top of the first ground layer 104 to the flexible circuit board 200, and then transmitted from the flexible circuit board 200 to the extended floor 400, and is transmitted from one end of the extended floor 400 to the other end.

[0049] Optionally, the extended floor 400 is in the shape of a strip plate, and the length of the extended floor 400 matches the length of the first grounding layer 104 .

[0050] Specifically, the length of the extended floor 400 matches the length of the first grounding layer 104, which may mean that the length of the extended floor 400 may be equal to the length of the first grounding layer 104. Alternatively, the length of the extended floor 400 matches the length of the first grounding layer 104, which may mean that the length of the extended floor 400 is slightly less than the length of the first grounding layer 104.

[0051] In addition, the ratio of the width of the extended floor 400 to the width of the first grounding layer 104 is in the range of 0.5 to 1. Specifically, when the ratio of the width of the extended floor 400 to the width of the first grounding layer 104 is less than 0.5, the effect of the extended floor 400 will be reduced. Therefore, by making the ratio of the width of the extended floor 400 to the width of the first grounding layer 104 in the range of 0.5 to 1, it is helpful to avoid the effect of the extended floor 400 from being reduced. At the same time, by making the length of the first grounding layer 104 slightly less than or equal to the length of the first grounding layer 104, and making the ratio of the width of the extended floor 400 to the width of the first grounding layer 104 in the range of 0.5 to 1, the size of the extended floor 400 can be prevented from exceeding the size range of the main circuit board 100. In this way, the orthographic projection of the extended floor 400 on the main circuit board 100 can be located inside the main circuit board 100. In this way, the extended floor 400 can be added without increasing the size of the earphone.

[0052] Optionally, the earphone further comprises a shell, the shell comprises an ear bag 500 and an ear rod, and the ear bag 500 is connected to the ear rod, the main circuit board 100 is arranged in the shell, the radiator 300 is arranged in the ear rod, and the flexible circuit board 200 is arranged in the ear bag 500;

[0053] The extended floor 400 is disposed in the ear rod, and the extended floor 400 is attached to the inner wall of the ear rod; or, the extended floor 400 is disposed in the ear bag 500, and the extended floor 400 is attached to the inner wall of the ear bag 500.

[0054] It can be understood that a portion of the main circuit board 100 can be located in the ear bag 500, and at the same time, another portion of the main circuit board 100 can be located in the ear stem.

[0055] The ear bag 500 is an ellipsoidal shell in the earphone for mounting the earplug, and correspondingly, the ear rod is a rod-shaped shell connected to the ear bag 500, and the relevant control buttons in the earphone can be arranged on the ear rod.

[0056] In this embodiment, the extended floor 400 is attached to the inner wall of the ear rod, or the extended floor 400 is attached to the inner wall of the ear bag 500 , so as to achieve installation and fixation of the extended floor 400 .

[0057] Optionally, the radiator 300 is located on a side of the first ground layer 104 facing away from the ear bag 500 .

[0058] In this implementation, since the side of the first grounding layer 104 facing the ear bag 500 is closer to the human body, by locating the radiator 300 on the side of the first grounding layer 104 facing away from the ear bag 500, it is beneficial to further increase the distance between the radiator 300 and the human body, thereby reducing the head mode loss.

[0059] Optionally, the extended floor 400 is a serpentine plate.

[0060] See also Figure 3 When the extended floor 400 is bonded to the inner wall of the ear bag 500, by setting the extended floor 400 as a serpentine plate, it is helpful to further reduce the size of the extended floor 400, and further reduce the installation space inside the earphone occupied by the extended floor 400.

[0061] Optionally, see Figure 3-4 , the radiator 300 includes at least three strip segments 303, the at least three strip segments 303 are arranged at intervals along the width direction of the main circuit board 100, and the at least three strip segments 303 are sequentially connected end to end to form a serpentine radiator;

[0062] Alternatively, see Figure 1-2 The radiator 300 includes at least three strip segments 303, and the at least three strip segments 303 are arranged at intervals along the length direction of the main circuit board 100, and the at least three strip segments 303 are connected end to end in sequence to form a serpentine radiator.

[0063] See also Figure 2 , Figure 2 The direction indicated by the double-headed arrow a in FIG. 1 is the width direction of the main circuit board 100. Figure 2 The direction indicated by the double-headed arrow b in FIG. 1 is the length direction of the main circuit board 100 .

[0064] In this embodiment, the radiator 300 is wound to form a winding structure in a serpentine shape, so that the length of the radiator 300 can be further increased, thereby improving the signal radiation or signal reception effect of the radiator 300.

[0065] Optionally, the earphone also includes a shell, a speaker and a battery, the shell includes an ear bag 500 and an ear rod, and the ear bag 500 is connected to the ear rod, the main circuit board 100 is arranged in the shell, the radiator 300 is arranged in the ear rod, and the flexible circuit board 200 is arranged in the ear bag 500; the extended floor 400 is arranged in the ear bag 500, and the extended floor 400 is attached to the inner wall of the ear bag 500, the flexible circuit board 200 also includes a second signal layer 201, and at least one of the speaker and the battery is electrically connected to the second signal layer 201.

[0066] In this implementation, the current length of the antenna is extended by reusing the flexible circuit board 200 in the earphone and changing the connection position between the flexible circuit board 200 and the main circuit board 100.

[0067] Another embodiment of the present disclosure provides a true wireless stereo headset, comprising a first headset and a second headset, wherein at least one of the first headset and the second headset is the headset described in the above embodiment.

[0068] In this implementation, since at least one of the first earphone and the second earphone in the true wireless stereo earphone is the earphone described in the above embodiment, the true wireless stereo earphone can implement each process of the earphone in the above embodiment and has the same beneficial effects. To avoid repetition, it will not be described here.

[0069] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A headset, characterized in that: include: Main circuit board, radiators and extended floorboards; The radiator is disposed on the first surface of the main circuit board; The extended floor is disposed on the second surface of the main circuit board and shares a common ground with the main circuit board; The first surface is a surface facing away from the wearer, and the second surface is a surface facing the wearer.

2. The earphone according to claim 1, characterized in that The headset further comprises a flexible circuit board, the main circuit board comprises a first signal layer and a first ground layer, the flexible circuit board comprises a second ground layer, the first ground layer is electrically connected to the second ground layer, and the extended floor is electrically connected to the second ground layer; The first end of the radiator is electrically connected to the radio frequency transceiver circuit in the first signal layer, and the second end of the radiator is electrically connected to the first ground layer to form a loop antenna.

3. The earphone according to claim 2, characterized in that The first grounding layer also includes a grounding terminal, and the first grounding layer is electrically connected to the second grounding layer through the grounding terminal, the grounding terminal, the first end of the radiator and the second end of the radiator are arranged at intervals along the length direction of the circuit board; and the first end of the radiator is located between the grounding terminal and the second end of the radiator.

4. The earphone according to claim 3, characterized in that: The ground terminal is located at an end portion in the length direction of the first ground layer.

5. The earphone according to claim 2, characterized in that: The extended floor is in the shape of a strip plate, and the length of the extended floor matches the length of the first grounding layer.

6. The earphone according to claim 5, characterized in that The ratio of the width of the extended floor to the width of the first ground layer ranges from 0.5 to 1.

7. The earphone according to claim 1, characterized in that The earphone further comprises a shell, the shell comprises an ear bag and an ear rod, and the ear bag is connected to the ear rod, the main circuit board is arranged in the shell, and the radiator is arranged in the ear rod; The extended floor is arranged in the ear rod, and the extended floor is attached to the inner wall of the ear rod.

8. The earphone according to claim 7, characterized in that: The extended floor is a serpentine plate body.

9. The earphone according to claim 1, characterized in that The radiator comprises at least three strip segments, the at least three strip segments are arranged at intervals along the width direction of the main circuit board, and the at least three strip segments are sequentially connected end to end to form a serpentine radiator; Alternatively, the radiator comprises at least three strip segments, the at least three strip segments are arranged at intervals along the length direction of the main circuit board, and the at least three strip segments are sequentially connected end to end to form a serpentine radiator.

10. The earphone according to claim 2, characterized in that The earphone also includes a shell, a speaker and a battery. The shell includes an ear bag and an ear rod, and the ear bag is connected to the ear rod. The main circuit board is arranged in the shell, and the radiator is arranged in the ear rod; the extended floor is arranged in the ear bag, and the extended floor is attached to the inner wall of the ear bag. The flexible circuit board also includes a second signal layer, and at least one of the speaker and the battery is electrically connected to the second signal layer.

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