Earphone pad and manufacturing method thereof
By adopting the design of ring-shaped soft pads and elastic surfaces in the headphone pads, the problem of loose cladding caused by degumming of the fixture is solved, and a more stable and simplified headphone pad production process is achieved.
Patent Information
- Application Number
- CN202310952103.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-31
- Publication Date
- 2025-02-14
AI Technical Summary
Due to the possibility of degumming of the fixtures, the cladding layer is easily loosened, affecting the stability and service life of the headphone pad.
The design of annular pads and elastic surfaces has an annular cavity that fits the annular pad, which is located inside the cavity, avoiding the use of additional fixing parts.
It reduces the production complexity and cost of headphone pads, avoids the possibility of loose coating, and improves the stability and user experience of headphone pads.
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Figure CN119450342A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of electronic products, and in particular relates to an earphone pad and a manufacturing method thereof. Background Art
[0002] In the field of audio equipment, headphones are widely used to provide a personalized listening experience. Headphones include two left and right housings containing speakers, which are placed close to the user's ears to directly transmit sound. In order to improve comfort and prevent the housing from directly contacting the user's ears, headphones are usually equipped with earphone pads. These earphone pads play a role of buffering and sealing, effectively reducing sound leakage, improving sound quality, and reducing the discomfort that may be caused by long-term use of headphones.
[0003] The current earphone pad design usually includes an annular pad and a coating layer coated on the surface of the annular pad. This design provides a good cushioning effect, but it also requires additional fixings to fix the annular pad and the coating layer together. For example, publication number CN114390386A discloses an earphone cover and an assembly method thereof, including an annular fixing, a cylindrical and elastic surface layer, and an annular buffer, wherein the fixing is connected to one end of the surface layer, and the other end of the surface layer passes through the central opening of the buffer and is connected to its own other end or the fixing to form a circular ring-shaped structure covering the buffer. This design not only increases the production complexity of the earphones, but may also affect the service life of the earphones. For example, if the fixing is not suitable or degummed due to excessive use, the coating may become loose, affecting the overall stability of the earphone pad and reducing the user experience.
[0004] Therefore, there are areas that need to be improved and optimized in the design and manufacture of earphone pads. An ideal earphone pad should have a stable structure, and at the same time, it should also have a simplified design and manufacturing process to reduce production costs and complexity. Summary of the invention
[0005] The technical problem to be solved by the present invention is: to provide an earphone pad and a manufacturing method thereof in view of the problem that the covering layer of the earphone pad in the prior art is easy to loosen due to the possibility of debonding of the fixing parts during use.
[0006] To solve the above technical problems, on the one hand, an embodiment of the present invention provides an earphone pad, including an annular cushion and an elastic surface layer, wherein the elastic surface layer has an annular cavity adapted to the annular cushion, and the annular cushion is located inside the cavity.
[0007] Optionally, the annular cushion is a sponge.
[0008] Optionally, the elastic surface layer is polyester.
[0009] On the other hand, another embodiment of the present invention provides a method for manufacturing an earphone pad, comprising the following steps:
[0010] Prepare a cylindrical polyester fabric and an annular profiling block for molding the cylindrical polyester fabric, wherein the annular profiling block has a plurality of positioning bosses;
[0011] One end of the cylindrical polyester cloth is passed through the positioning boss and fixed to the annular profiling block, and the other end is passed through the central opening of the annular profiling block, and then the annular profiling block is turned around along the surface of the annular profiling block, and is also passed through the positioning boss and fixed to the annular profiling block, so that the cylindrical polyester cloth completely covers the annular profiling block;
[0012] Putting the shaped block covered with the cylindrical polyester cloth into an oven for baking, and taking out the annular shaped block after baking to obtain a shaped polyester, wherein the shaped polyester has an annular cavity of the same size as the annular shaped block;
[0013] Prepare a ring-shaped sponge of the same size as the ring-shaped block;
[0014] The ring-shaped sponge is stuffed into the ring-shaped cavity of the molded polyester to obtain the earphone pad.
[0015] The earphone pad provided by the embodiment of the present invention only includes an annular software layer and an elastic surface layer. Compared with the traditional earphone pad, this earphone pad avoids the use of additional fixing parts, thereby reducing the complexity and avoiding the possibility of the coating layer loosening. The present invention provides a method for making an earphone pad. Through the cylindrical polyester cloth and the annular profiling block, an earphone pad with a desired shape can be simply and effectively made, without the need for complicated equipment and processes, the production process is simple, and the production cost is relatively low. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 Schematic diagram of an annular profiling block provided in one embodiment of the present invention. DETAILED DESCRIPTION
[0017] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0018] Embodiment 1
[0019] This embodiment provides an earphone cushion, comprising an annular soft cushion and an elastic surface layer, characterized in that the elastic surface layer has an annular cavity adapted to the annular soft cushion, and the annular soft cushion is located inside the cavity.
[0020] Furthermore, the annular cushion is sponge.
[0021] Furthermore, the elastic surface layer is made of polyester.
[0022] Embodiment 2
[0023] This embodiment provides a method for manufacturing an earphone pad, comprising the following steps:
[0024] Prepare a cylindrical polyester fabric and an annular profiling block 1 for molding the cylindrical polyester fabric, wherein the annular profiling block 1 has a plurality of positioning bosses;
[0025] One end of the cylindrical polyester cloth is passed through the positioning boss and fixed to the annular profiling block 1, and the other end is passed through the central opening of the annular profiling block 1, and then the annular profiling block 1 is turned up along the surface of the annular profiling block 1, and is also passed through the positioning boss and fixed to the annular profiling block, so that the cylindrical polyester cloth completely covers the annular profiling block 1;
[0026] The annular profiling block 1 covered with the cylindrical polyester cloth is placed in an oven for baking at a temperature of 150° C. for 600 seconds. After the baking is completed, the annular profiling block is taken out to obtain a formed polyester having an annular cavity of the same size as the annular profiling block 1;
[0027] Prepare a ring-shaped sponge of the same size as the ring-shaped profiling block 1;
[0028] The ring-shaped sponge is stuffed into the ring-shaped cavity of the molded polyester to obtain the earphone pad.
[0029] Embodiment 3
[0030] This embodiment provides a method for manufacturing an earphone pad, comprising the following steps:
[0031] Prepare a cylindrical polyester fabric and an annular profiling block 1 for molding the cylindrical polyester fabric, wherein the annular profiling block 1 has a plurality of positioning bosses;
[0032] One end of the cylindrical polyester cloth is passed through the positioning boss and fixed to the annular profiling block 1, and the other end is passed through the central opening of the annular profiling block 1, and then the annular profiling block 1 is turned up along the surface of the annular profiling block, and is also passed through the positioning boss and fixed to the annular profiling block 1, so that the cylindrical polyester cloth completely covers the annular profiling block 1;
[0033] The annular profiling block 1 covered with the cylindrical polyester cloth is placed in an oven for baking at a temperature of 150° C. for 1800 seconds. After the baking is completed, the annular profiling block 1 is taken out to obtain a formed polyester having an annular cavity of the same size as the annular profiling block 1;
[0034] Prepare a ring-shaped sponge of the same size as the ring-shaped profiling block 1;
[0035] The ring-shaped sponge is stuffed into the ring-shaped cavity of the molded polyester to obtain the earphone pad.
[0036] Embodiment 4
[0037] This embodiment provides a method for manufacturing an earphone pad, comprising the following steps:
[0038] Prepare a cylindrical polyester fabric and an annular profiling block 1 for molding the cylindrical polyester fabric, wherein the annular profiling block 1 has a plurality of positioning bosses;
[0039] One end of the cylindrical polyester cloth is passed through the positioning boss and fixed to the annular profiling block 1, and the other end is passed through the central opening of the annular profiling block 1, and then the annular profiling block 1 is turned up along the surface of the annular profiling block 1, and the cylindrical polyester cloth is also passed through the positioning boss and fixed to the annular profiling block 1, so that the cylindrical polyester cloth completely covers the annular profiling block 1;
[0040] The annular profiling block 1 covered with the cylindrical polyester cloth is placed in an oven for baking at a temperature of 170° C. for 600 seconds. After the baking is completed, the annular profiling block is taken out to obtain a formed polyester having an annular cavity of the same size as the annular profiling block 1;
[0041] Prepare a ring-shaped sponge of the same size as the ring-shaped profiling block 1;
[0042] The ring-shaped sponge is stuffed into the ring-shaped cavity of the molded polyester to obtain the earphone pad.
[0043] Embodiment 5
[0044] This embodiment provides a method for manufacturing an earphone pad, comprising the following steps:
[0045] Prepare a cylindrical polyester fabric and an annular profiling block 1 for molding the cylindrical polyester fabric, wherein the annular profiling block 1 has a plurality of positioning bosses;
[0046] One end of the cylindrical polyester cloth is passed through the positioning boss and fixed to the annular profiling block 1, and the other end is passed through the central opening of the annular profiling block 1, and then the annular profiling block 1 is turned around along the surface of the annular profiling block 1, and is also passed through the positioning boss and fixed to the annular profiling block 1, so that the cylindrical polyester cloth completely covers the annular profiling block 1;
[0047] The annular profiling block 1 covered with the cylindrical polyester cloth is placed in an oven for baking at a temperature of 170° C. for 1800 seconds. After the baking is completed, the annular profiling block 1 is taken out to obtain a formed polyester having an annular cavity of the same size as the annular profiling block 1;
[0048] Prepare a ring-shaped sponge of the same size as the ring-shaped profiling block 1;
[0049] The ring-shaped sponge is stuffed into the ring-shaped cavity of the molded polyester to obtain the earphone pad.
[0050] Embodiment 6
[0051] This embodiment provides a method for manufacturing an earphone pad, comprising the following steps:
[0052] Prepare a cylindrical polyester fabric and an annular profiling block 1 for molding the cylindrical polyester fabric, wherein the annular profiling block 1 has a plurality of positioning bosses;
[0053] One end of the cylindrical polyester cloth is passed through the positioning boss and fixed to the annular profiling block 1, and the other end is passed through the central opening of the annular profiling block 1, and then the annular profiling block 1 is turned around along the surface of the annular profiling block 1, and is also passed through the positioning boss and fixed to the annular profiling block 1, so that the cylindrical polyester cloth completely covers the annular profiling block 1;
[0054] The annular profiling block 1 covered with the cylindrical polyester cloth is placed in an oven for baking at a temperature of 160° C. for 1800 seconds. After the baking is completed, the annular profiling block 1 is taken out to obtain a formed polyester having an annular cavity of the same size as the annular profiling block 1;
[0055] Prepare a ring-shaped sponge of the same size as the ring-shaped profiling block 1;
[0056] The ring-shaped sponge is stuffed into the ring-shaped cavity of the molded polyester to obtain the earphone pad.
[0057] Table 1 below shows the molding effects of the molded polyester in Examples 2 to 5:
[0058]
[0059]
[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. An earphone pad, comprising a ring-shaped soft pad and an elastic surface layer, characterized in that: The elastic surface layer has an annular cavity adapted to the annular cushion, and the annular cushion is located inside the cavity.
2. The earphone pad according to claim 1, characterized in that The annular soft cushion is a sponge.
3. The earphone pad according to claim 1, characterized in that The elastic surface layer is made of polyester.
4. A method for making an earphone pad, characterized in that: The following steps are involved: Prepare a cylindrical polyester fabric and an annular profiling block for molding the cylindrical polyester fabric, wherein the annular profiling block has a plurality of positioning bosses; One end of the cylindrical polyester cloth is passed through the positioning boss and fixed to the annular profiling block, and the other end is passed through the central opening of the annular profiling block, and then the annular profiling block is turned around along the surface of the annular profiling block, and is also passed through the positioning boss and fixed to the annular profiling block, so that the cylindrical polyester cloth completely covers the annular profiling block; Putting the shaped block covered with the cylindrical polyester cloth into an oven for baking, and taking out the annular shaped block after baking to obtain a shaped polyester, wherein the shaped polyester has an annular cavity of the same size as the annular shaped block; Prepare a ring-shaped sponge of the same size as the ring-shaped block; The ring-shaped sponge is stuffed into the ring-shaped cavity of the molded polyester to obtain the earphone pad.
5. The method according to claim 4, characterized in that: The baking temperature is 150° C. to 170° C., and the baking time is 600 seconds to 1800 seconds.
6. The method according to claim 5, characterized in that: The baking temperature is 170° C., and the baking time is 1800 seconds.
Citation Information
Patent Citations
Earphone sleeve and assembling method thereof
CN114390386A