Testing system and testing device of semiconductor laser

Abstract

The invention discloses a test system and a test device of a semiconductor laser, the test system comprises a semiconductor laser chip, a heat dissipation plate and an injection mechanism, the injection mechanism injects heat conduction liquid into a placing area of the heat dissipation plate, and then the semiconductor laser chip is placed in the placing area of the heat dissipation plate. Therefore, a gap between the heat dissipation plate and the semiconductor laser chip can be filled with the heat conduction liquid, so that the heat dissipation performance of the test system is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor laser chips, and in particular to a testing system and a testing device for semiconductor lasers. Background Art

[0002] As the output power of semiconductor lasers increases, semiconductor laser chips will generate more waste heat during operation, which will greatly affect the performance parameter characterization of semiconductor laser chips. Therefore, when testing the performance of semiconductor lasers, the semiconductor laser test system is required to have higher heat dissipation performance. The heat dissipation of the semiconductor laser test system directly affects the accuracy of the performance parameters of the semiconductor laser test characterization. Therefore, a semiconductor laser test system with high heat dissipation performance is required. Summary of the invention

[0003] In order to solve the above technical problems, the present application provides a semiconductor laser test system, wherein the semiconductor laser includes a semiconductor laser chip, and the test system includes:

[0004] A heat sink, the semiconductor laser chip is arranged on the heat sink, the heat sink is used to dissipate heat for the semiconductor laser chip, and the heat sink has a placement area for placing the semiconductor laser chip;

[0005] The injection mechanism is arranged on one side of the heat sink and is used to inject the heat-conducting liquid into the placement area of ​​the heat sink so that the heat-conducting liquid evenly fills the space between the semiconductor laser chip and the heat sink.

[0006] Wherein, the injection mechanism comprises:

[0007] An injection assembly storing the heat-conducting liquid and used for injecting the heat-conducting liquid into the placement area of ​​the heat sink;

[0008] A moving component, the injection component is arranged on the moving component, and the moving component is used to move the injection component to the placement area of ​​the heat sink.

[0009] Wherein, the injection assembly comprises:

[0010] A syringe having a first accommodating chamber, wherein the first accommodating chamber is used to store the heat-conducting liquid;

[0011] A first motor is connected to the syringe and is used to control the syringe to inject the heat-conducting liquid into the area where the heat sink is placed and between the semiconductor laser chip.

[0012] Wherein, the mobile component comprises:

[0013] A guide rail arranged along a first direction;

[0014] A slider is arranged on the guide rail, and the injection assembly is fixed on the slider;

[0015] The second motor is connected to the slider and is used to drive the slider to move along the first direction so that the injection assembly is close to or away from the heat dissipation plate.

[0016] Wherein, the test system comprises:

[0017] An integrating sphere, disposed adjacent to the heat sink, and used for testing the semiconductor laser chip;

[0018] The power-on test mechanism is arranged above the heat sink and is used for performing a power-on test on the semiconductor laser chip.

[0019] Wherein, the placement area of ​​the heat sink is arranged close to the entrance of the integrating sphere.

[0020] Wherein, the test system further includes a photoelectric detector, the integrating sphere has a second accommodating cavity, and the photoelectric detector is arranged in the second accommodating cavity.

[0021] Wherein, the power-on test mechanism comprises:

[0022] A probe, used for performing a power-on test on the semiconductor laser chip;

[0023] A probe motion cylinder, the probe is arranged on the probe motion cylinder, and the probe motion cylinder is used to drive the probe to move along the second direction;

[0024] The probe rotation motion motor has a rotation shaft connected to the probe motion cylinder and is used to drive the probe motion cylinder to rotate around the axis of the rotation shaft to drive the probe to rotate.

[0025] Wherein, the power-on test mechanism also includes a power-on component, wherein:

[0026] The power-on component is disposed on the probe, and is used for powering the semiconductor laser chip through the probe when the probe contacts the semiconductor laser chip.

[0027] To solve the above problems, the present application also provides a semiconductor laser testing device, which includes the testing system and a clamping device as described above, and the clamping device is used to clamp the semiconductor laser chip to / from the placement area of ​​the heat sink.

[0028] Beneficial effects of the present application: The test system provided by the present application includes a semiconductor laser chip, a heat sink and an injection mechanism. The semiconductor laser chip is placed in the placement area of ​​the heat sink. The injection mechanism injects heat-conducting liquid into the placement area of ​​the heat sink so that the heat-conducting liquid can fill the gap between the heat sink and the semiconductor laser chip, thereby improving the heat dissipation performance of the test system. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of the first embodiment of the test system of the present application;

[0030] Figure 2 It is a structural schematic diagram of the first embodiment of the operating table in the test system of the present application;

[0031] Figure numerals: test system 1; operating table 2; semiconductor laser chip 10; heat sink 20; injection mechanism 30; injection assembly 31; syringe 311; first motor 312; moving assembly 32; guide rail 321; slider 322; second motor 323; integrating sphere 40; powered test mechanism 50; probe 51; probe movement cylinder 52; probe rotation movement motor 53; rotation axis 531; first direction X; second direction Y. DETAILED DESCRIPTION

[0032] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some structures related to the present application are shown in the accompanying drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0033] The terms "first", "second", etc. in this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0034] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0035] See also Figure 1 , Figure 1 Schematic diagram of the structure of the first embodiment of the test system of the present application. Figure 1 As shown, the test system 1 provided by the present application includes a semiconductor laser chip 10 , a heat sink 20 and an injection mechanism 30 .

[0036] Among them, the semiconductor laser chip 10 is arranged on the heat sink 20, the heat sink 20 is used to dissipate heat for the semiconductor laser chip 10, and the heat sink 20 has a placement area for placing the semiconductor laser chip 10; the injection mechanism 30 is arranged on one side of the heat sink 20, and is used to inject heat-conducting liquid into the placement area of ​​the heat sink 20, and after the injection mechanism 30 injects the heat-conducting liquid into the placement area of ​​the heat sink 20, the semiconductor laser chip 10 is placed in the placement area, specifically, the semiconductor laser chip 10 is placed on the heat-conducting liquid in the placement area, so that the heat-conducting liquid evenly fills the space between the semiconductor laser chip 10 and the heat sink 20.

[0037] In one embodiment, the user may manually place the semiconductor laser chip 10 on the placement area; in another embodiment, the test system 1 may include a clamping mechanism, which is used to clamp the semiconductor laser chip 10 and place the semiconductor laser chip 10 on the placement area to improve the automation level of the test system 1. The present application does not limit how to place the semiconductor laser chip 10 on the placement area.

[0038] Among them, the heat sink 20 can be made of a high thermal conductivity material such as copper, and this application does not limit this; since the heat sink 20 and the semiconductor laser chip 10 cannot be completely fitted to dissipate heat at the microscopic level, in order to improve the heat dissipation performance of the test system 1, a thermal conductive liquid can be filled between the semiconductor laser chip 10 and the heat sink 20 to achieve better thermal conductivity. In this embodiment, the thermal conductive liquid is pure water, while in other embodiments, anhydrous alcohol or other thermal conductive liquid that can achieve thermal conductivity and does not pollute the semiconductor laser chip 10 can be selected for testing, and this application does not limit this.

[0039] A heat-conducting liquid is used to fill the space between the heat sink 20 and the semiconductor laser chip 10, so that the heat generated by the semiconductor laser chip 10 during operation can be better conducted to the heat sink 20 for heat dissipation, thereby improving the heat dissipation performance of the test system 1 and ensuring the accuracy of the performance parameters characterized by the test of the semiconductor laser chip 10.

[0040] Optionally, the injection mechanism 30 includes an injection component 31 and a moving component 32 .

[0041] The injection component 31 stores heat-conducting liquid and is used to inject the heat-conducting liquid into the placement area of ​​the heat sink 20 ; the injection component 31 is arranged on the moving component 32 , and the moving component 32 is used to move the injection component 31 to the placement area of ​​the heat sink 20 .

[0042] When the heat-conducting liquid needs to be injected, the moving component 32 drives the injection component 31 to be close to the placement area of ​​the heat sink 20; and after the injection component 31 completes the injection operation of the heat-conducting liquid, the moving component 32 drives the injection component 31 away from the placement area of ​​the heat sink 20.

[0043] The moving component 32 drives the injection component 31 to the placement area close to the heat sink 20 to complete the injection operation of the heat-conducting liquid, thereby realizing automatic liquid injection of the test system 1 without manual operation by the user, thereby improving the convenience of the test system 1 and enhancing the user experience.

[0044] Optionally, the injection assembly 31 includes a syringe 311 and a first motor 312 .

[0045] The injector 311 has a first accommodating chamber in which the heat-conducting liquid is stored; the first motor 312 is connected to the injector 311 to control the injector 311 to inject the heat-conducting liquid into the placement area of ​​the heat sink 20 and between the semiconductor laser chip 10 .

[0046] Among them, the heat-conducting liquid fills the first containing chamber of the syringe 311, and the first motor 312 can reduce the volume of the first containing chamber to eject the heat-conducting liquid through the injection port (not shown) of the syringe 311 and inject it into the placement area of ​​the heat sink 20; for example, the user pre-sets the heat-conducting liquid ejected by the syringe 311 at one time to be 0.1mL, that is, the first motor 312 needs to reduce the volume of the first containing chamber by 0.1mL during the operation of injecting the heat-conducting liquid once, so that 0.1mL of the heat-conducting liquid is injected into the heat sink 20; in other embodiments, the amount of heat-conducting liquid injected by the syringe 311 at one time can be set by the user, and this application does not impose any restrictions on this.

[0047] The first motor 312 controls the amount of heat-conducting liquid injected by the syringe 311, so that the injected heat-conducting liquid will not soak into the surface of the semiconductor laser chip 10 away from the heat sink 20 after the semiconductor laser chip 10 is placed on the heat-conducting liquid due to too much, or too little heat-conducting liquid will not completely fill the gap between the heat sink 20 and the semiconductor laser chip 10 after the semiconductor laser chip 10 is placed on the heat-conducting liquid, thereby affecting the heat dissipation performance of the test system 1. The first motor 312 can accurately control the injection amount of the heat-conducting liquid, so as to better achieve the high heat dissipation performance of the test system 1 of the present application.

[0048] Optionally, the moving assembly 32 includes a guide rail 321 , a slider 322 and a second motor 323 .

[0049] Among them, the guide rail 321 is set along the first direction X; the slider 322 is set on the guide rail 321, and the injection assembly 31 is fixed on the slider 322; the second motor 323 is connected to the slider 322, and is used to drive the slider 322 to move along the first direction X so that the injection assembly 31 is close to or away from the heat sink 20.

[0050] The first direction X is the direction in which the injection assembly 31 approaches the heat dissipation plate 20 .

[0051] The second motor 323 drives the slider 322 to move along the first direction X. The slider 322 is fixedly connected to the injection assembly 31 so that the injection assembly 31 is close to the heat sink 20 to inject the heat-conducting liquid, thereby realizing the convenience of operating the injection assembly 31 and improving the user experience.

[0052] Optionally, the testing system 1 includes an integrating sphere 40 and a powered testing mechanism 50 .

[0053] The integrating sphere 40 is disposed adjacent to the heat sink 20 for testing the performance of the semiconductor laser chip 10 ; the power-on test mechanism 50 is disposed above the heat sink 20 for performing a power-on test on the semiconductor laser chip.

[0054] In order to better explain the test system 1 of this application, please refer to Figure 2 , Figure 2 It is a structural schematic diagram of the first embodiment of the operating console of the test system of the present application.

[0055] Optionally, the placement area of ​​the heat sink 20 is arranged close to the entrance of the integrating sphere 40 .

[0056] Among them, the placement area of ​​the heat sink 20 is set close to the entrance of the integrating sphere 40, which can better ensure that the light beam generated by the semiconductor laser chip 10 placed on the placement area of ​​the heat sink 20 enters the integrating sphere 40. The integrating sphere 40 can better receive the light beam generated by the semiconductor laser chip 10, ensuring the accuracy of the performance parameters characterized by the test of the semiconductor laser chip 10.

[0057] Optionally, the testing system 1 further includes a photoelectric detector (not shown).

[0058] The integrating sphere 40 has a second accommodating cavity, and the photoelectric detector is disposed in the second accommodating cavity.

[0059] Specifically, the light beam generated by the semiconductor laser chip 10 enters the second accommodating cavity through the entrance of the integrating sphere 40 , and the photodetector in the second accommodating cavity receives the light beam and detects the parameters of the light beam to obtain the performance parameters of the semiconductor laser chip 10 for testing and characterization.

[0060] Optionally, the powered testing mechanism 50 includes a probe 51 , a probe movement cylinder 52 , and a probe rotation movement motor 53 .

[0061] Among them, the probe 51 is used to perform power-on testing on the semiconductor laser chip 10; and the probe 51 is arranged on the probe motion cylinder 52, and the probe motion cylinder is used to drive the probe 51 to move along the second direction Y; the rotating shaft 531 of the probe rotation motion motor 53 is connected to the probe motion cylinder 52, and is used to drive the probe motion cylinder 52 to rotate around the axis of the rotating shaft 531 to drive the probe 51 to rotate.

[0062] The second direction Y is the direction in which the probe 51 approaches the semiconductor laser chip 10 vertically; the probe rotation motor 53 drives the probe motion cylinder 52 to rotate close to the semiconductor laser chip 10, so as to realize the rotation of the probe 51 close to the semiconductor laser chip 10; and when the probe 51 is above the semiconductor laser chip 10, the probe rotation motor 53 stops running. At this time, the probe motion cylinder 52 drives the probe 51 to move close to the semiconductor laser chip 10 in a direction perpendicular to the semiconductor laser chip 10 until the probe 51 contacts the semiconductor laser chip 10.

[0063] The probe motion cylinder 52 and the probe rotation motion motor 53 drive the probe 51 to approach the semiconductor laser chip 10, and stop the operation after the probe 51 contacts the semiconductor laser chip 10. It is ensured that the probe 51 contacts the semiconductor laser chip 10 and does not press the semiconductor laser chip 10 to damage the semiconductor laser chip 10, so that the safety of the test system 1 is higher.

[0064] Specifically, when the semiconductor laser chip 10 is placed on the placement area, the probe rotation motion motor 53 drives the probe motion cylinder 52 and the probe 51 to rotate close to the semiconductor laser chip 10, and when the probe 51 is directly above the semiconductor laser chip 10, the probe motion cylinder 52 drives the probe 51 to move downward to contact the semiconductor laser chip 10, and the semiconductor laser chip 10 is powered on for testing. After the semiconductor laser chip 10 is tested, the probe motion cylinder 52 drives the probe 51 to move upward, and the probe rotation motion motor 53 drives the probe motion cylinder 52 and the probe 51 to rotate away from the semiconductor laser chip 10, freeing up space near the semiconductor laser chip 10. It is convenient for the user or the clamping device in the test system 1 to unload and load the semiconductor laser chip 10, and the injection mechanism 30 to inject heat-conducting liquid into the placement area, avoiding collision of devices in the test system 1, and improving the safety of the test system 1.

[0065] Optionally, the power-on test mechanism 50 further includes a power-on component (not shown).

[0066] The power-on component is disposed on the probe 51 and is used to power the semiconductor laser chip 10 through the probe 51 when the probe 51 contacts the semiconductor laser chip 10 , so that the semiconductor laser chip 10 emits a light beam for testing.

[0067] In summary, the test system 1 of the present application is composed of a semiconductor laser chip 10, a heat sink 20, an injection mechanism 30, an integrating sphere 40 and a power-on test mechanism 50. The heat sink 20 is used to dissipate heat for the semiconductor laser chip 10, and a heat-conducting liquid is filled between the heat sink 20 and the semiconductor laser chip 10 to improve the heat dissipation performance of the test system 1. The moving component 32 drives the injection component 31 to inject the heat-conducting liquid close to the heat sink 20, and the first motor 312 controls the amount of the heat-conducting liquid injected by the injector 311, so that the heat-conducting liquid can better dissipate heat for the semiconductor laser chip 10, ensuring the high heat dissipation performance of the test system 1. The probe motion cylinder 52 and the probe rotation motion motor 53 drive the probe 51 to move, and when in contact with the semiconductor laser chip 10, the semiconductor laser chip 10 is powered on for testing, ensuring that the probe 51 accurately moves to the working position to power on the semiconductor laser chip 10, ensuring the safety and stability of the test system 1, and improving the user experience.

[0068] In order to better implement the test of the semiconductor laser chip 10, the present application also provides a semiconductor laser testing device (not shown), including the above-mentioned testing system 1 and a clamping device (not shown).

[0069] The clamping device is used to clamp the semiconductor laser chip 10 to / from the placement area of ​​the heat sink 20 .

[0070] Specifically, the moving component 32 drives the injection component 31 to move to the placement area of ​​the heat sink 20, and the first motor 312 controls the injector 311 to inject the heat-conducting liquid into the placement area of ​​the heat sink 20. After the injection component 31 completes the injection operation of the heat-conducting liquid, the moving component 32 drives the injection component 31 to move away from the heat sink 20; the clamping device clamps the semiconductor laser chip 10 to the placement area of ​​the heat sink 20, so that the heat-conducting liquid fills the gap between the heat sink 20 and the semiconductor laser chip 10, thereby improving the heat dissipation performance of the test device;

[0071] The probe rotary motion motor 53 and the probe motion cylinder 52 drive the probe 51 to contact the semiconductor laser chip 10. When the probe 51 contacts the semiconductor laser chip 10, the power-on component powers the semiconductor laser chip 10 through the probe 51, and the semiconductor laser chip 10 generates a light beam. The light beam enters the second accommodating cavity through the entrance of the integrating sphere 40 and is received by the photodetector, which detects the characteristics of the light beam. After obtaining the performance parameters characterized by the semiconductor laser test, the probe rotary motion motor 53 and the probe motion cylinder 52 drive the probe 51 to move away from the semiconductor laser chip 10, and the clamping device clamps the semiconductor laser chip 10 that has completed the test away from the test system 1.

[0072] Different from the prior art, the testing device provided in the present application is composed of a testing system 1 with high heat dissipation performance and a clamping device, which realizes the automation of the test of the semiconductor laser chip 10, improves the convenience of the testing device, and enhances the user experience.

[0073] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A semiconductor laser testing system, characterized in that: The semiconductor laser comprises a semiconductor laser chip, and the testing system comprises: A heat sink, the semiconductor laser chip is arranged on the heat sink, the heat sink is used to dissipate heat for the semiconductor laser chip, and the heat sink has a placement area for placing the semiconductor laser chip; The injection mechanism is arranged on one side of the heat sink and is used to inject the heat-conducting liquid into the placement area of ​​the heat sink so that the heat-conducting liquid evenly fills the space between the semiconductor laser chip and the heat sink.

2. The test system according to claim 1, characterized in that: The injection mechanism comprises: An injection assembly storing the heat-conducting liquid and used for injecting the heat-conducting liquid into the placement area of ​​the heat sink; A moving component, the injection component is arranged on the moving component, and the moving component is used to move the injection component to the placement area of ​​the heat sink.

3. The test system according to claim 2, characterized in that: The injection assembly comprises: A syringe having a first accommodating chamber, wherein the first accommodating chamber is used to store the heat-conducting liquid; A first motor is connected to the syringe and is used to control the syringe to inject the heat-conducting liquid into the area where the heat sink is placed and between the semiconductor laser chip.

4. The test system according to claim 2, characterized in that: The mobile assembly comprises: A guide rail arranged along a first direction; A slider is arranged on the guide rail, and the injection assembly is fixed on the slider; The second motor is connected to the slider and is used to drive the slider to move along the first direction so that the injection assembly is close to or away from the heat dissipation plate.

5. The test system according to any one of claims 1 to 4, characterized in that: The test system comprises: An integrating sphere, disposed adjacent to the heat sink, and used for testing the semiconductor laser chip; The power-on test mechanism is arranged above the heat sink and is used for performing a power-on test on the semiconductor laser chip.

6. The test system according to claim 5, characterized in that: The placement area of ​​the heat sink is arranged close to the entrance of the integrating sphere.

7. The test system according to claim 5, characterized in that: The testing system further includes a photoelectric detector. The integrating sphere has a second accommodating cavity. The photoelectric detector is disposed in the second accommodating cavity.

8. The test system according to claim 5, characterized in that: The power-on test mechanism comprises: A probe, used for performing a power-on test on the semiconductor laser chip; A probe motion cylinder, the probe is arranged on the probe motion cylinder, and the probe motion cylinder is used to drive the probe to move along the second direction; The probe rotation motion motor has a rotation shaft connected to the probe motion cylinder and is used to drive the probe motion cylinder to rotate around the axis of the rotation shaft to drive the probe to rotate.

9. The test system according to claim 8, characterized in that: The power-on test mechanism also includes a power-on component, wherein: The power-on component is disposed on the probe, and is used for powering the semiconductor laser chip through the probe when the probe contacts the semiconductor laser chip.

10. A semiconductor laser testing device, characterized in that: The testing device comprises the testing system according to any one of claims 1 to 9 and a clamping device, wherein the clamping device is used to clamp the semiconductor laser chip to / from the placement area of ​​the heat sink.

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