Steam column with reduced cross-sectional area for increasing airflow

Abstract

The invention discloses a vapor column having a reduced cross-sectional area for increasing airflow, and particularly discloses a system comprising: an electronic component; a fan arranged to force air in a first direction; a stacked fin assembly; and a three-dimensional vapor chamber. The three-dimensional vapor chamber includes: a base thermally coupled to an electronic component; and a plurality of vapor columns extending outwardly from the base toward the stacked fin assembly. A first dimension in a first direction of a first vapor column included in the plurality of vapor columns is greater than a second dimension in a second direction perpendicular to the first direction of the first vapor column.

Description

Technical Field

[0001] Embodiments of the present disclosure relate generally to cooling solutions for computing devices and, more particularly, to cooling solutions including vapor columns having reduced cross-sectional areas. Background Art

[0002] High-performance electronic components such as advanced central processing units and graphics processing units generate relatively large amounts of heat during operation. This heat needs to be dissipated to prevent the components from overheating and operating at reduced performance levels. Cooling solutions that can effectively remove heat from the system enable electronic components to operate at higher speeds and higher performance levels. However, as the power and performance requirements of processing units continue to increase, traditional cooling solutions are limited by many factors, including the heat transfer properties of the materials and the geometric structures used to build these cooling solutions.

[0003] A method for cooling high-performance electronic components involves placing a heat sink and / or heat pipe in contact with the surface of the electronic component so that heat is removed from the component during operation. The heat is then dissipated by using one or more fans to force air to be above or around the heat sink and / or heat pipe. The amount of heat removed from the electronic component can be increased by increasing the speed of the fan, increasing the size of the fan, and / or increasing the number of fans so that the air is forced to be above or around the heat sink and / or heat pipe. However, increasing the fan speed will result in increased acoustic noise, which is undesirable in consumer products such as personal computers, and space limitations will limit the size or number of fans that can be used in a given computer system.

[0004] Another method of cooling high-performance electronic components involves implementing a heat sink assembly that includes a three-dimensional (3D) steam chamber that operates in conjunction with a stacked fin assembly and one or more fans. FIG. 1 shows a perspective view of a prior art 3D steam chamber 100 that can be implemented as part of a conventional heat sink assembly. As shown, the 3D steam chamber 100 includes: a steam chamber base 105 that contacts the electronic component (e.g., a processing unit) being cooled; and a plurality of cylindrical steam columns 110 that are attached to the base 105 and extend outward from the base 105 to direct heat toward and through a stacked fin assembly 115 attached to the 3D steam chamber 100. As shown in FIGS. 2 and 3 , which show a top view and a cross-sectional view, respectively, of the 3D steam chamber 100 of FIG. 1 , the cylindrical steam column 110 extends through the stacked fin assembly 115. One or more fans (not shown) are used to force air across the base 105 of the 3D vapor chamber 100 and through the stacked fin assembly 115 to further cool the electronic components. As further shown in FIG2 , the cylindrical vapor column 110 is circular such that the width (e.g., diameter) of the cylindrical vapor column 110 in the x-direction is equal to the length (e.g., diameter) of the cylindrical vapor column 110 in the z-direction.

[0005] Because the cylindrical steam columns 110 extend outward from the base 105 of the 3D steam chamber, the air forced across the base 105 of the 3D steam chamber 100 by one or more fans is obstructed by the cylindrical steam columns 110 and forced to flow around the cylindrical steam columns 110. That is, each corresponding cylindrical steam column 110 included in the three-dimensional steam chamber 100 obstructs the flow of air forced across the base 105, so that the forced air flows around the cylindrical steam columns 110 and through the channels formed between adjacent cylindrical steam columns 110. This obstruction causes a pressure drop across the base 105 of the 3D steam chamber 100 in the direction of air flow, which has the effect of reducing the amount of heat that the forced air can dissipate and remove from the electronic components. Although increasing the fan speed, increasing the fan size, and / or increasing the number of fans to force more air across the heat sink assembly can improve overall heat dissipation and cooling, as described above, these methods may increase acoustic noise in an undesirable manner or cannot be effectively implemented due to space limitations in a given computer system.

[0006] As noted above, what is needed in the art are more efficient techniques for removing heat from electronic components during operation. Summary of the invention

[0007] One embodiment of the present invention provides a system, the system includes an electronic component, a fan configured to force air to flow in a first direction, a stacked fin assembly, and a three-dimensional steam chamber. The three-dimensional steam chamber includes a base thermally coupled to the electronic component and a plurality of steam columns extending outward from the base toward the stacked fin assembly. A first dimension of a first steam column included in the plurality of steam columns along the first direction is greater than a second dimension of the first steam column along a second direction perpendicular to the first direction.

[0008] At least one technical advantage of the disclosed design over the prior art is that, in the disclosed design, the pressure drop across the 3D steam chamber in the cooling system can be reduced without increasing the fan speed, fan size or the number of fans forcing air through the steam chamber. In this regard, the steam column included in the disclosed design is configured so that the cross-sectional area of ​​each steam column is reduced in the direction perpendicular to the airflow across the 3D steam chamber base. Relative to the design of the prior art, by reducing the cross-sectional area of ​​each steam column in the direction of the airflow across the 3D steam chamber base, the overall impedance (impedance) experienced by the air generated by the steam column and flowing through the 3D steam chamber is reduced. Compared with the pressure drop experienced in the prior art design, the reduction in impedance causes the pressure drop across the 3D steam chamber to be reduced. Therefore, using the design of the present disclosure, the amount of heat that can be dissipated by the cooling system can be increased without increasing the fan speed, fan size or the number of fans implemented as part of the cooling system. These technical advantages provide one or more technical improvements to the prior art methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In such a manner that the above-recited features of the various embodiments can be understood in detail, the inventive concepts briefly summarized above may be described in more detail by reference to various embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the drawings illustrate only typical embodiments of the inventive concepts and are therefore not to be considered limiting of the scope in any way and that there may be other equally effective embodiments.

[0010] FIG. 1 shows a perspective view of a three-dimensional (3D) steam chamber implemented in a conventional cooling system according to the prior art;

[0011] FIG2 shows a top view of the 3D steam chamber of FIG1 ;

[0012] FIG3 shows a cross-sectional view of the 3D steam chamber of FIG1 ;

[0013] Figure 4 shows a perspective view of a cooling system according to various embodiments;

[0014] Figure 5 It shows the various embodiments Figure 4A perspective view of a cooling system;

[0015] Figure 6 According to various embodiments, Figure 4 A cross-sectional view of a 3D steam chamber implemented in a cooling system;

[0016] Figure 7 A method for Figure 4 Thermal resistance circuit of the cooling system;

[0017] Figure 8 It shows the various embodiments Figure 6 A top view of the 3D steam chamber;

[0018] Fig. 9 It shows the various embodiments Figure 6 A perspective view of a portion of a 3D steam chamber;

[0019] Figures 10A-10C shows top views of different exemplary steam column cross sections according to various embodiments; and

[0020] Fig.11 Exemplary pressure drop versus flow rate curves are shown for different cooling systems according to various embodiments. DETAILED DESCRIPTION

[0021] In the following description, numerous specific details are set forth to provide a more thorough understanding of various embodiments. However, it will be apparent to one skilled in the art that the inventive concept may be practiced without one or more of these specific details.

[0022] Figure 4A perspective view of a cooling system 400 according to various embodiments is shown. The cooling system 400 described herein is an electronic component for cooling a processing unit or other type of electronic component and / or device that generates heat during operation and needs cooling. In some examples, the cooling system 400 can be implemented in a computer system to cool one or more electronic components included in the computer system. It will be understood by those skilled in the art that the computer system including and / or implementing the cooling system 400 can be any type of technically feasible computer system, including but not limited to a server machine, a server platform, a desktop, a laptop, a handheld / mobile device, or a wearable device. In addition, when implemented and / or included in a computer system, the cooling system 400 can be used to cool one or more electronic components included in the computer system, such as a central processing unit (CPU), a graphics processing unit (GPU), a parallel processing unit, a switching device, a memory unit, a storage unit, and / or some other electronic components or devices. In addition, it will be understood by those skilled in the art that the cooling system 400 can also be used to cool other types of components or objects that generate heat during operation. For example, cooling system 400 may be implemented in and / or otherwise used to cool components other than electronic components included in computer systems and / or computing devices.

[0023] like Figure 4 As shown, the cooling system 400 includes a fan 405, a stacked fin assembly 410 and a three-dimensional (3D) steam chamber 600. The stacked fin assembly 410 is a heat sink including a plurality of heat conducting plates or fins spaced apart by air gaps. The 3D steam chamber 600 includes a steam chamber base 415 in contact with the electronic component 605 being cooled, and a plurality of steam columns 420 attached to the steam chamber base 415 and extending outward from the steam chamber base 415. As shown, the plurality of steam columns 420 extend through corresponding openings formed in the stacked fin assembly 410, and the stacked fin assembly 410 is separated from the 3D steam chamber 600 and attached to the 3D steam chamber 600. When attached to the 3D steam chamber 600, the stacked fin assembly 410 is in thermal contact with the plurality of steam columns 420. In some cases, the stacked fin assembly 410 and the 3D steam chamber 600 may be collectively referred to as a heat sink assembly.

[0024] like Figure 5 As shown, Figure 5A perspective view of a cooling system 400 in which a fan 405 is removed is shown, and a fan bracket 500 is used to attach the fan 405 to the stacked fin assembly 410. However, it will be appreciated by those skilled in the art that in some embodiments, the fan 405 is attached to the cooling system 400 in a different arrangement. In addition, although the cooling system 400 is shown as including a single fan 405, in some embodiments, the cooling system 400 includes more than one fan. For example, in some embodiments, the cooling system 400 includes two or more fans. In some embodiments, the cooling system 400 does not include a fan 405 directly attached to the stacked fin assembly 410. In such embodiments, the cooling system 400 includes one or more external fans and / or air movers outside the stacked fin assembly 410. In addition, in these embodiments, the stacked fin assembly 410 and / or the 3D steam chamber 600 are located in the path of the air forced by the one or more external fans and / or air movers.

[0025] In operation, the stacked fin assembly 410 and the 3D vapor chamber 600 work to dissipate heat from the electronic components 605 being cooled. In addition, the fan 405 forces air over the vapor chamber base 415 to further remove heat from the electronic components 605 by convection. Figure 4-6 and Figure 8-9 The direction in which the fan 405 forces air over the steam chamber base 415 is the z-direction, shown along coordinate axis 425. As will be described in more detail below, the air forced in the z-direction by the fan 405 flows between the fins in the stacked fin assembly 410 and around the steam column 420 extending through the stacked fin assembly 410.

[0026] Figure 6 A cross-sectional view of a 3D steam chamber 600 included in a cooling system 400 is shown according to various embodiments. For illustrative purposes, a stacked fin assembly 410 attached to the 3D steam chamber 600 is also shown in the cross-sectional view of the 3D steam chamber 600. The cross-sectional view of the 3D steam chamber 600 is taken along the xy plane and perpendicular to the z direction relative to the coordinate axis 425, and the fan 405 forces air in the z direction over the steam chamber base 415. As shown, the steam chamber base 415 includes a bottom surface 610 and a top surface 615. The bottom surface 610 of the steam chamber base 415 is arranged to contact the electronic component 605 cooled by the cooling system 400.

[0027] The steam column 420 is attached to the top surface 615 of the steam chamber base 415 and extends outward from the top surface 615 of the steam chamber base 415 so that the corresponding interior space of the steam column 420 is connected to the interior space of the steam chamber base 415. The combined interior space of the steam chamber base 415 and the steam column 420 can be referred to as the steam space 620 of the 3D steam chamber 600. A wick material 625 is provided between the steam space 620 and the outer shell 630 of the 3D steam chamber 600. The outer shell 630 of the 3D steam chamber 600, which can be formed of a thermally conductive material such as copper, forms the exterior of the steam chamber base 415 and the steam column 420. The wick material 625 arranged along the inner surface of the outer shell 630 can be implemented as one or more of a sintered core, a slot core, a mesh / bundled fiber core, or other types of wicks.

[0028] During operation of the cooling system 400, heat dissipated by the electronic components 605 is input or introduced into the 3D vapor chamber 600 via conduction through the bottom surface 610 of the vapor chamber base 415. This introduction of heat into the 3D vapor chamber 600 causes the liquid carried by the wick material 625 to vaporize and diffuse throughout the vapor space 620 away from the electronic components 605. As the vapor diffuses throughout the vapor space 620, for example, throughout the interior of the vapor chamber base 415 and / or throughout the interior of the vapor column 420, the vapor condenses on the fins of the stacked fin assembly 410. Heat is then removed from the condensate formed on the fins of the stacked fin assembly 410 by the fan 405, which forces air in the z-direction above the vapor chamber base 415 and through the stacked fin assembly 410. Capillary forces in the wick material 625 then return the condensate formed on the fins of the stacked fin assembly 410, and the cooling process is repeated.

[0029] As described above, air forced by the fan 405 over the steam chamber base 415 and through the stacked fin assembly 410 helps remove heat from the stacked fin assembly 410. However, when the air is forced to flow through the stacked fin assembly 410, the airflow is hindered by the steam column 420 protruding through the stacked fin assembly 410. For example, relative to the coordinate axis 425, the steam column 420 extends in the x and y directions, thereby hindering the airflow forced by the fan 405 in the z direction perpendicular to the x and y directions. The dimension of the steam column 420 extending along the x direction (e.g., along the x-axis) can be referred to as the width of the steam column 420, and the dimension of the steam column 420 extending along the y direction (e.g., along the y-axis) can be referred to as the height of the steam column 420.

[0030] When air forced in the z-direction by fan 405 over steam chamber base 415 is obstructed by steam columns 420, the air is redirected to flow through flow channels 635 formed between adjacent steam columns 420. However, as described above with respect to prior art 3D steam chamber 100, when steam columns 420 obstruct the flow of air in the z-direction such that air is forced to flow through flow channels 635 formed between adjacent steam columns 420, a drop in air pressure over steam chamber base 415 occurs in the z-direction. As the drop in air pressure across steam chamber base 415 increases, the amount of heat that can be dissipated via air convection forced by fan 405 decreases.

[0031] Although increasing the speed of fans 405, increasing the size of fans 405, and / or increasing the number of fans 405 to force more air across the heat sink assembly will improve overall heat dissipation and cooling, as described above, these approaches may increase acoustic noise in an undesirable manner or may not be effectively implemented due to space constraints of a given computer system. Therefore, in order to increase the amount of heat dissipated by cooling system 400 through convection, the design of 3D vapor chamber 600 is intended to reduce the air pressure drop above vapor chamber base 415 in the z-direction.

[0032] The air pressure drop in the z-direction across the vapor chamber base 415 can be determined using the Darcy-Weisbach equation, as shown below in Equation 1:

[0033]

[0034] Where ΔP is the air pressure drop across the steam chamber base 415 in the z direction, f is the airflow coefficient, L is the length of the flow channel 635 through which the air is forced, v is the velocity of the airflow through the flow channel 635, ρ is the density of the air, and D H is the hydraulic diameter of the flow channel 635. With respect to the coordinate axis 425, the hydraulic diameter (eg, width) of the flow channel 635 formed between adjacent steam columns 420 is equal to the distance between adjacent steam columns 420 in the x direction (eg, along the x axis).

[0035] As shown in Formula 1 above, the air pressure drop across the steam chamber base 415 in the z direction is inversely proportional to the hydraulic diameter of the flow channel 635 formed between adjacent steam columns 420. Therefore, the air pressure drop across the steam chamber base 415 in the z direction can be reduced by increasing the hydraulic diameter of the flow channel 635 formed between adjacent steam columns 420. When the cooling system 400 is modeled as a thermal resistance circuit, a similar conclusion can be drawn about the relationship between the hydraulic diameter of the flow channel 635 and the air pressure drop across the steam chamber base 415.

[0036] Figure 7 A thermal resistance circuit 700 of the cooling system 400 is shown. As shown, the thermal resistance circuit 700 includes the equivalent thermal resistance of the components included in the cooling system 400. For example, the thermal resistance circuit 700 includes the equivalent thermal resistance R of the base or bottom of the electronic component 605 (e.g., silicon chip) being cooled. silicon-b , the equivalent thermal resistance R of the housing or top of the electronic component 605 being cooled silicon-c , the equivalent thermal resistance R of the thermal interface between the cooled electronic component 605 and the 3D vapor chamber 600 TIM , the equivalent thermal resistance R of the 3D vapor chamber 600 VC , the equivalent thermal resistance R of the stacked fin assembly 410 HS , and the equivalent thermal resistance R of the air forced over the vapor chamber base 415 by the fan 405 to remove heat from the stacked fin assembly 410 Convective .

[0037] In addition, the thermal resistance circuit 700 represents the corresponding temperature of the components included in the cooling system 400. For example, the temperature T b represents the temperature of the bottom of the electronic component 605 to be cooled, and the input temperature T of the thermal resistance circuit 700 j represents the temperature of the electronic component 605 being cooled, and the temperature T c represents the temperature of the top of the electronic component 605 being cooled, and the temperature T TIM represents the thermal interface temperature between the silicon coating of the cooled electronic component 605 and the 3D vapor chamber 600, and the temperature T VC represents the temperature of the 3D steam chamber 600, temperature T HS represents the temperature of the stacked fin assembly 410, the output temperature T ∞ represents the temperature of the air that is forced by the fan 405 over the vapor chamber base 415 and through the stacked fin assembly 410 to remove heat from the stacked fin assembly 410 .

[0038] The amount of heat removed from the stacked fin assembly 410 by convection by air forced over the steam chamber base 415 can be determined using Equation 2 below.

[0039]

[0040] Where Q Convective is the heat removed from the stacked fin assembly 410 by the air forced in the z-direction by the fan 405 over the vapor chamber base 415, R Convective is the equivalent thermal resistance of the air forced by fan 405 in the z direction over the vapor chamber base 415, T HSis the temperature of the stacked fin assembly 410, and T ∞ is the temperature of the air forced by fan 405 in the z-direction over vapor chamber base 415.

[0041] As shown in Equation 3 below, the equivalent thermal resistance R of the air forced by fan 405 in the z direction over vapor chamber base 415 is Convective Inversely proportional to the mass flow rate of air forced by fan 405 in the z-direction over vapor chamber base 415 .

[0042]

[0043] Where m is the mass flow rate of air forced in the z direction by the fan 405 above the steam chamber base 415, and Cp is the specific heat capacity of the air. Using Formula 4 below, the mass flow rate of air forced in the z direction by the fan 405 above the steam chamber base 415 can be expressed as a function of the velocity of the forced air as it flows through the flow channel 635 formed between adjacent steam columns 420, the cross-sectional area of ​​the flow channel 635, and the air density.

[0044] m=ρvA (4)

[0045] Wherein m is the mass flow rate flowing through the flow channel 635 , ρ is the density of air, v is the velocity of air flowing through the flow channel 635 , and A is the cross-sectional area of ​​the flow channel 635 .

[0046] When Equations 2-4 are combined with Equation 5 (as shown below), it is apparent that the amount of heat removed from the stacked fin assembly 410 by the air forced in the z-direction by the fan 405 over the vapor chamber base 415 is proportional to the cross-sectional area of ​​the flow channel 635. That is, as the cross-sectional area of ​​the flow channel 635 increases, the amount of heat removed from the stacked fin assembly 410 by the air forced in the z-direction by the fan 405 over the vapor chamber base 415 increases.

[0047] Q Convective =ρvAC p (T HS -T ∞ ) (5)

[0048] Where Q Convective is the amount of heat removed from the stacked fin assembly 410 by the air forced in the z direction by the fan 405 over the steam chamber base 415, ρ is the density of the air, v is the velocity of the air flowing through the flow channel 635, A is the cross-sectional area of ​​the flow channel 635, C p is the specific heat capacity of air, T HS is the temperature of the stacked fin assembly 410, T∞ is the temperature of the air forced by fan 405 in the z-direction over vapor chamber base 415.

[0049] As described above with respect to Equations 1-5, increasing the hydraulic diameter of the flow channel 635 formed between adjacent steam columns 420 and / or the cross-sectional area of ​​the flow channel 635 formed between adjacent steam columns 420 reduces the air pressure drop in the z-direction above the steam chamber base 415 and increases the amount of heat removed from the stacked fin assembly 410 by the air forced in the z-direction by the fan 405 above the steam chamber base 415. Since the hydraulic diameter of the flow channel 635 formed between adjacent steam columns 420 is equal to the distance between adjacent steam columns 420 in the x-direction, the hydraulic diameter of the flow channel 635 formed between adjacent steam columns 420 is inversely proportional to the respective widths of the adjacent steam columns 420. For example, as the respective widths of the adjacent steam columns 420 increase (e.g., the steam columns 420 extend in the x-direction), the hydraulic diameter of the flow channel 635 formed between adjacent steam columns 420 decreases. Conversely, when the corresponding widths of adjacent steam columns 420 decrease (e.g., the size of the steam columns 420 decreases in the x-direction), the hydraulic diameter of the flow channel 635 formed between adjacent steam columns 420 increases. Therefore, the hydraulic diameter of the flow channel 635 formed between adjacent steam columns 420 can be increased by reducing the widths of the adjacent steam columns 420. In some embodiments, the hydraulic diameter of the flow channel 635 formed between adjacent steam columns 420 is designed to be greater than the corresponding widths of the adjacent steam columns 420.

[0050] However, if the volume of the vapor space 620 and / or the wick material 625 in the vapor column 420 is also reduced, then simply reducing the width of the vapor column 420 will result in a reduced performance level of the vapor column 420. For example, due to the reduction in the volume of the vapor space 620 within the interior of the vapor column 420 and / or the amount of wick material 625 in the vapor column 420, the efficiency of the vapor column 420 in diffusing heat away from the electronic component 605 will be reduced. Therefore, in order to prevent the performance degradation caused by reducing the internal volume of the vapor column 420, the vapor column 420 included in the 3D vapor chamber 600 is designed so that the width of the vapor column 420 is reduced while increasing the length of the vapor column 420. In some embodiments, the length of each vapor column 420 included in the 3D vapor chamber 600 is greater than the width of each vapor column 420 included in the 3D vapor chamber 600. In some embodiments, only some of the vapor columns 420 included in the 3D vapor chamber 600 have a length greater than their width.

[0051] Figure 84 shows a top view of a 3D steam chamber 600 with the stacked fin assembly 410 removed according to various embodiments. The length of the steam column 420 is the dimension of the steam column extending in the z-direction (eg, along the z-axis) relative to the coordinate axis 425. Figure 8 As shown, the length of each steam column 420 is greater than the width of each steam column 420. Figure 8 In the example shown, the length of each steam column 420 is approximately 10.66 mm and the width of each steam column 420 is approximately 4 mm. Therefore, the length of each steam column 420 is approximately 265% greater than the width of each steam column 420. Those skilled in the art will appreciate that the length of 10.66 mm and the width of 4 mm are just two non-limiting examples of the dimensions of the steam column 420. In addition, those skilled in the art will appreciate that the length-to-width ratio of the steam column 420 may be designed to be different from Figure 8 Aspect ratios as shown in the examples.

[0052] In some embodiments, the length of steam column 420 is greater than 265% of the width of steam column 420. For example, in some embodiments, the length of steam column 420 is greater than 300%, greater than 350%, greater than 400%, or greater than other percentage amounts of the width of steam column 420. In some embodiments, the length of steam column 420 is less than 265% of the width of steam column 420. For example, in some embodiments, the length of steam column 420 is greater than 250%, greater than 200%, greater than 150%, or greater than other percentage amounts of the width of steam column 420. In some embodiments, the length of steam column 420 is designed to be greater than the width of steam column 420 by at least a minimum percentage (e.g., 100%, 150%, 200%, etc.).

[0053] Since the length of the steam column 420 is the dimension of the steam column 420 extending in the z-direction (e.g., along the z-axis), the length of the steam column 420 is the dimension of the steam column 420 parallel to the direction (e.g., the z-direction) along which the fan 405 forces air over the steam chamber base 415 to cool the stacked fin assembly 410. Therefore, increasing the length of the steam column 420 in the z-direction does not hinder the flow of the forced air as it flows through the flow channel 635. Therefore, by reducing the width of the steam column 420 in the x-direction and increasing the length of the steam column 420 in the z-direction, the 3D steam chamber 600 achieves the above-mentioned advantages of the flow channel 635 due to the increased hydraulic diameter without adversely affecting the heat dissipation capabilities of the steam column 420.

[0054] Fig. 9 A perspective view of a portion of a 3D steam chamber 600 is shown with the stacked fin assembly 410 removed in accordance with various embodiments. Fig. 9, the outlines of the first and second cross-sectional areas 900, 905 of the flow channel 635 and the steam column 420 are shown. Although the first cross-sectional area 900 is shown only with respect to one of the steam columns 420, those skilled in the art will understand that the description of the first cross-sectional area 900 is equally applicable to Fig. 9 Similarly, although the second cross-sectional area 905 is shown with respect to only one of the steam columns 420, a person skilled in the art will appreciate that the description of the second cross-sectional area 905 is also applicable to the other steam columns 420. Fig. 9 The other steam column 420 is shown in FIG.

[0055] With respect to coordinate axis 425, first cross-sectional area 900 is parallel to yz plane. Therefore, first cross-sectional area 900 is parallel to the direction (e.g., z direction) along which fan 405 forces air above steam chamber base 415. In addition, first cross-sectional area 900 represents the size of the portion of steam column 420 that does not hinder the flow of air forced above steam chamber base 415 by fan 405. The value of first cross-sectional area 900 is equal to the product of the length of steam column 420 and the height of steam column 420. Second cross-sectional area 905 is parallel to xy plane. Therefore, second cross section 905 is perpendicular to the direction (e.g., z direction) along which fan 405 forces air above steam chamber base 415. Therefore, second cross-sectional area 905 represents the portion of steam column 420 that hinders the flow of air forced above steam chamber base 415 by fan 405. The value of second cross-sectional area 905 is equal to the product of the width of steam column 420 and the height of steam column 420.

[0056] Since the length of steam column 420 is greater than the width of steam column 420, the value of first cross-sectional area 900 of steam column 420 is greater than the value of second cross-sectional area 905 of steam column 420. Thus, the cross-sectional area of ​​steam column 420 that is parallel to the direction in which fan 405 forces air over steam chamber base 415 is greater than the cross-sectional area of ​​steam column that is perpendicular to the direction in which fan 405 forces air over steam chamber base 415. In other words, the cross-sectional area of ​​steam column 420 that impedes the flow of air forced over steam chamber base 415 by fan 405 (e.g., second cross-sectional area 905) is reduced relative to the cross-sectional area of ​​steam column 420 that does not impede the flow of air forced over steam chamber base 415 by fan 405 (e.g., first cross-sectional area 900).

[0057] Figure 6 , Figure 8 , Fig. 9 The steam column 420 shown is generally flat and rectangular. For example, the steam column 420 is shaped like a rectangular prism with rounded edge surfaces. Fig. 10AA top view of a cross-section of a steam column 420A implemented as a rectangular prism having rounded edges or curved edge surfaces is shown. As shown, the cross-section of the steam column 420A is generally rectangular in shape, and therefore, the base of the steam column 420A is generally rectangular. However, the edge surfaces 1005A, 1005B of the steam column 420A extending in the x-direction have a convex curvature relative to the interior of the steam column 420A. Curving the edge surfaces 1005A, 1005B in this manner improves the aerodynamic performance of the steam column 420A, such that when air is forced in the z-direction above the steam chamber base 415 by the fan 405, the curved edge surface 1005A provides less obstruction to air flowing in the z-direction than a straight or flat edge surface would. As shown Fig. 10A As shown, edge surfaces 1010A, 1010B of the vapor column 420A that are generally parallel to the z-direction along which air is forced over the vapor chamber base 415 are flattened and / or straight.

[0058] Fig. 10B A top view of a cross section of a generally teardrop-shaped steam column 420B is shown. The base of the steam column 420B is teardrop-shaped so that the first edge surface 1015 of the steam column 420B extending in the x direction has a convex curvature facing the direction along which the fan 405 forces air to flow above the steam chamber base 41. The steam column 420B further includes edge surfaces 1020A, 1020B extending in the z direction and joined at apex 1025. As shown, the length of the teardrop-shaped steam column 420B is greater than the width of the teardrop-shaped steam column 420B. Compared with other shapes that can be used to implement the steam column 420, the teardrop-shaped steam column 420B has less resistance to air flow in the z direction. Fig. 10C A top view of a generally elliptical cross-section of steam column 420C is shown. That is, the base of steam column 420C is elliptical. As shown, the length of elliptical steam column 420C is greater than the width of elliptical steam column 420C.

[0059] Those skilled in the art will understand that Figures 10A-10CThe steam column shapes shown are only a few non-limiting examples of shapes that can be used to implement the steam column 420 included in the 3D steam chamber 600. In addition, those skilled in the art will understand that any feasible shape in which the length of the steam column 420 is greater than the width of the steam column 420 can be used to implement the steam column 420 included in the 3D steam chamber 600. For example, in some embodiments in which the steam column 420 has a generally rectangular shape (e.g., steam column 420A), the edge surfaces 1005A, 1005B of the steam column 420A are flat, so that the base of the steam column 420A is a rectangle with straight sides. As another example, in some embodiments, the edge surfaces 1010A, 1010B of the steam column 420A are curved.

[0060] Fig.11 A graph 1100 is shown that includes exemplary pressure drop versus flow rate for different cooling systems. A first curve 1105 included in the graph 1100 is associated with the performance of a cooling system including a prior art 3D steam chamber 100. In particular, the first curve 1105 represents the amount of air pressure drop that occurs when a fan included in the cooling system forces air over the base 105 and through the stacked fin assembly 115 across the base 105 of the prior art 3D steam chamber 100 and through the stacked fin assembly 115 attached to the prior art 3D steam chamber 100. As described above, the steam column 110 included in the prior art 3D steam chamber 100 has a cylindrical shape, and the width of the cylindrical steam column 110 and the length of the steam column 110 are both equal to the diameter of the steam column 110. Fig.11 In the example shown, when the cooling system is operated to achieve the pressure drop versus flow rate performance indicated by the first curve 1105, the diameter of each cylindrical steam column 110 implemented in the prior art 3D steam chamber 100 is 8 millimeters.

[0061] A second curve 1110 included in the graph 1100 is associated with the performance of the cooling system 400 including the 3D vapor chamber 600 described herein. In particular, the second curve 1110 represents the amount of air pressure drop across the vapor chamber base 415 and the stacked fin assembly 410 in the direction (e.g., the z-direction) along which the fan 405 forces air above the vapor chamber base 415 and through the stacked fin assembly 410. As described above, the respective lengths of the vapor columns 420 included in the 3D vapor chamber 600 are greater than the respective widths of the vapor columns 420. Fig.11In the example shown, when the cooling system 400 is operated to obtain the performance of the pressure drop and flow rate indicated by the second curve 1110, each steam column 420 implemented in the 3D steam chamber 600 is generally rectangular in shape, such as the shape of the steam column 420A. In addition, when the cooling system 400 is operated to obtain the performance of the pressure drop and flow rate indicated by the second curve 1110, each steam column 420 implemented in the 3D steam chamber 600 has a length of 10.66 mm and a width of 4 mm. Therefore, the cross-sectional area of ​​the steam column 420 in the direction of the airflow of the rectangular shape with a width of 4 mm is about 50% smaller than the cross-sectional area in the direction of the airflow of the cylindrical steam column 110 with a diameter of 8 mm.

[0062] As the speed of the fan blowing air over the base 105 of the prior art 3D vapor chamber 100 and through the stacked fin assembly 115 increases, the amount of air pressure drop across the base 105 of the prior art 3D vapor chamber 100 and through the stacked fin assembly 115 increases, as shown by the first curve 1105. Similarly, as the speed of the fan 405 blowing air over the vapor chamber base 415 and through the stacked fin assembly 410 in the z-direction increases, the amount of air pressure drop across the vapor chamber base 415 and the stacked fin assembly 410 in the z-direction increases, as shown by the second curve 1110. However, when comparing the first curve 1105 to the second curve 1110, it is apparent that the air pressure drop across the 3D steam chamber 600 (including the flat, generally rectangular-shaped steam column 420) and the stacked fin assembly 410 is less than the air pressure drop across the prior art 3D steam chamber 100 (including the cylindrical steam column 110) and the stacked fin assembly 115. As described above, the amount of air pressure drop across the corresponding 3D steam chamber base is inversely proportional to the amount of heat that can be dissipated by the corresponding cooling system through convection. Therefore, as shown in the first curve 1105 and the second curve 1110, reducing the cross-sectional area of ​​each steam column 420 in the direction of airflow across the steam chamber base 415 can cause the cooling system 400 to dissipate more heat through convection than a cooling system including the prior art 3D steam chamber 100.

[0063] In summary, a cooling system for cooling electronic components such as processing units. The cooling system also includes a stacked fin assembly and a three-dimensional steam chamber. The three-dimensional steam chamber includes a base thermally coupled to the electronic component, and a plurality of steam columns extending outward from the base toward the stacked fin assembly. The cooling system also includes a fan arranged to force air in a first direction above the base of the three-dimensional steam chamber. A first steam column included in the plurality of steam columns has a first dimension parallel to the first direction along which the fan forces air above the base of the three-dimensional steam chamber. The first dimension of the first steam column is also greater than a second dimension of the first steam column along a second direction perpendicular to the first direction along which the fan forces air above the base of the three-dimensional steam chamber.

[0064] Compared to the prior art, at least one technical advantage of the disclosed design is that, in the disclosed design, the pressure drop across the three-dimensional steam chamber in the cooling system can be reduced without increasing the fan speed, fan size or the number of fans forcing air through the steam chamber. In this regard, the steam column included in the disclosed design is configured so that the cross-sectional area of ​​each steam column is reduced in the direction perpendicular to the airflow across the base of the 3D steam chamber. By reducing the cross-sectional area of ​​each steam column in the direction of the airflow across the base of the 3D steam chamber, the overall impedance experienced by the air generated by the steam column and flowing through the 3D steam chamber is reduced relative to the existing design. Compared with the pressure drop experienced in the prior art design, the reduction in impedance causes the pressure drop across the 3D steam chamber to be reduced. Therefore, using the disclosed design, the amount of heat dissipated by the cooling system can be increased without increasing the fan speed, fan size or the number of fans implemented as a part of the cooling system.

[0065] 1. According to some embodiments, a system comprises: an electronic component; a fan arranged to force air in a first direction; a stacked fin assembly; and a three-dimensional steam chamber, the three-dimensional steam chamber comprising: a base thermally coupled to the electronic component; and a plurality of steam columns extending outward from the base toward the stacked fin assembly, wherein a first steam column included in the plurality of steam columns has a first dimension along the first direction that is greater than a second dimension of the first steam column along a second direction perpendicular to the first direction.

[0066] 2. The system of clause 1, wherein a first cross-sectional area of ​​the first column of steam is parallel to the first direction and is greater than a second cross-sectional area of ​​the first column of steam that is perpendicular to the first direction.

[0067] 3. The system of clause 1 or clause 2, wherein a first surface of the first steam column perpendicular to the first direction has a convex curvature.

[0068] 4. The system of any of clauses 1-3, wherein the first vapor column comprises a rectangular prism.

[0069] 5. The system of any one of clauses 1-4, wherein the base of the first steam column has an oval shape.

[0070] 6. The system of any of clauses 1-5, wherein the base of the first steam column has a teardrop shape.

[0071] 7. A system as described in any of clauses 1-6, wherein a second steam column included in the plurality of steam columns is arranged adjacent to the first steam column, and air forced by the fan in a first direction flows through a channel defined between the first steam column and the second steam column.

[0072] 8. The system of any of clauses 1-7, wherein the hydraulic diameter of the channel is inversely proportional to the second dimension of the first steam column.

[0073] 9. The system of any of clauses 1-8, wherein the fan forces air in the first direction over the base of the three-dimensional steam chamber.

[0074] 10. According to some embodiments, a heat sink assembly includes: a stacked fin assembly; and a three-dimensional steam chamber, the three-dimensional steam chamber including: a base, the base including a bottom surface and a top surface; a plurality of steam columns, the plurality of steam columns extending outward from the top surface of the base toward the stacked fin assembly, wherein a first cross-sectional area of ​​a first steam column among the plurality of steam columns is greater than a second cross-sectional area of ​​the first steam column; and a steam space defined within the base and the plurality of steam columns.

[0075] 11. The heat sink assembly of clause 10, wherein the first cross-section is perpendicular to the second cross-section.

[0076] 12. The heat sink assembly of clause 10 or clause 11, wherein the second vapor column included in the plurality of vapor columns is disposed adjacent to the first vapor column; and wherein a channel is defined between the first vapor column and the second vapor column.

[0077] 13. The radiator assembly of any of clauses 10-12, wherein a hydraulic diameter of the passage is inversely proportional to the second cross-sectional area of ​​the first vapor column.

[0078] 14. The radiator assembly of any of clauses 10-13, wherein the hydraulic diameter of the channel is greater than a dimension of the first steam column.

[0079] 15. The radiator assembly of any of clauses 10-14, wherein a dimension of the first vapor column is perpendicular to the first cross-section.

[0080] 16. The heat sink assembly of any of clauses 10-15, wherein the base of the first vapor column has a teardrop shape.

[0081] 17. According to some embodiments, a three-dimensional steam chamber includes: a base, the base including a bottom surface and a top surface; a plurality of steam columns, the plurality of steam columns extending outward from the top surface of the base toward a stacked fin assembly, wherein a first cross-sectional area of ​​a first steam column among the plurality of steam columns is greater than a second cross-sectional area of ​​the first steam column; and a steam space defined within the base and the plurality of steam columns.

[0082] 18. The three-dimensional steam chamber of clause 17, wherein the first cross section is perpendicular to the second cross section.

[0083] 19. The three-dimensional steam chamber of clause 17 or clause 18, wherein a first surface of the first steam column has a convex curvature and a second surface of the first steam column is flat.

[0084] 20. The three-dimensional vapor chamber of any of clauses 17-19, wherein the first surface of the first vapor column extends in a first direction, and the second surface of the first vapor column extends in a second direction perpendicular to the first direction.

[0085] Any claim elements recited in any claim and / or any combination of claim elements described in this application belong in any manner to the intended scope of the invention and protection.

[0086] The description of the various embodiments has been presented for purposes of illustration, but is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.

[0087] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. A system comprising: Electronic components; a fan arranged to force air in a first direction; Stacked fin assembly; as well as A three-dimensional steam chamber, the three-dimensional steam chamber comprising: a base thermally coupled to the electronic component; as well as A plurality of steam columns extend outwardly from the base toward the stacked fin assembly, wherein a first steam column included in the plurality of steam columns has a first dimension along the first direction greater than a second dimension of the first steam column along a second direction perpendicular to the first direction. 2 . The system of claim 1 , wherein a first cross-sectional area of ​​the first column of steam is parallel to the first direction and is greater than a second cross-sectional area of ​​the first column of steam that is perpendicular to the first direction.

3. The system of claim 1, wherein a first surface of the first vapor column perpendicular to the first direction has a convex curvature.

4. The system of claim 1, wherein the first vapor column comprises a rectangular prism.

5. The system of claim 1, wherein the base of the first steam column has an oval shape.

6. The system of claim 1, wherein the base of the first steam column has a teardrop shape.

7. The system of claim 1, wherein a second steam column included in the plurality of steam columns is disposed adjacent to the first steam column, and air forced in a first direction by the fan flows through a channel defined between the first steam column and the second steam column.

8. The system of claim 7, wherein the hydraulic diameter of the channel is inversely proportional to the second dimension of the first steam column.

9. The system of claim 1, wherein the fan forces air in the first direction over a base of the three-dimensional vapor chamber.

10. A heat sink assembly comprising: Stacked fin assembly; as well as A three-dimensional steam chamber, the three-dimensional steam chamber comprising: a base, the base comprising a bottom surface and a top surface; a plurality of steam columns extending outwardly from the top surface of the base toward the stacked fin assembly, wherein a first cross-sectional area of ​​a first steam column of the plurality of steam columns is greater than a second cross-sectional area of ​​the first steam column; and A vapor space is defined within the base and the plurality of steam columns.

11. The heat sink assembly of claim 10, wherein the first cross-section is perpendicular to the second cross-section.

12. The heat sink assembly of claim 10, wherein the second vapor column included in the plurality of vapor columns is disposed adjacent to the first vapor column; and Wherein a passage is defined between the first steam column and the second steam column.

13. The heat sink assembly of claim 12, wherein a hydraulic diameter of said passage is inversely proportional to said second cross-sectional area of ​​said first vapor column.

14. The heat sink assembly of claim 12, wherein the hydraulic diameter of the passage is greater than a dimension of the first vapor column.

15. The heat sink assembly of claim 14, wherein a dimension of the first vapor column is perpendicular to the first cross-section.

16. The heat sink assembly of claim 10, wherein the base of the first vapor column has a teardrop shape.

17. A three-dimensional steam chamber comprising: a base, the base comprising a bottom surface and a top surface; a plurality of steam columns extending outwardly from the top surface of the base toward the stacked fin assembly, wherein a first cross-sectional area of ​​a first steam column of the plurality of steam columns is greater than a second cross-sectional area of ​​the first steam column; and A vapor space is defined within the base and the plurality of steam columns.

18. The three-dimensional vapor chamber of claim 17, wherein the first cross section is perpendicular to the second cross section.

19. The three-dimensional vapor chamber of claim 17, wherein a first surface of the first vapor column has a convex curvature and a second surface of the first vapor column is flat.

20. The three-dimensional vapor chamber of claim 19, wherein the first surface of the first vapor column extends in a first direction, and the second surface of the first vapor column extends in a second direction perpendicular to the first direction.

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