Display panel, manufacturing method thereof and display device

Abstract

The invention provides a display panel, a manufacturing method thereof and a display device, and relates to the technical field of display, the manufacturing method comprises the steps that an array substrate is provided, the array substrate comprises a display area and a hole area, and the hole area is surrounded by the display area; forming a light-emitting film layer on the array substrate; a first packaging layer is formed on the side, away from the array substrate, of the light-emitting film layer; etching the light-emitting film layer and the first packaging layer, and removing the parts of the light-emitting film layer and the first packaging layer in the hole region; a second packaging layer at least covering the light-emitting film layer and the etching section of the first packaging layer is formed on the side, away from the array substrate, of the first packaging layer and on the array substrate with the exposed hole area. The manufacturing method provided by the invention is beneficial to improving the use performance and the processing performance of the display device.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Hole in Active Area (HIAA) technology is widely used in display screens. By drilling a hole in a display screen, the display device can have more functions.

[0003] However, the display device with a hole in the display screen needs to further improve the performance / process performance. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a display panel and a manufacturing method thereof and a display device, so as to improve the use performance / process performance of the display device.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] In a first aspect, the present application provides a method for manufacturing a display panel, the manufacturing method comprising:

[0007] Providing an array substrate, the array substrate comprising a display area and a hole area, the display area surrounds the hole area;

[0008] forming a light-emitting film layer on the array substrate;

[0009] forming a first encapsulation layer on a side of the light-emitting film layer away from the array substrate;

[0010] Etching the light-emitting film layer and the first encapsulation layer to remove the portions of the light-emitting film layer and the first encapsulation layer in the hole area;

[0011] A second packaging layer is formed on the side of the first packaging layer facing away from the array substrate and on the array substrate where the hole area is exposed, at least covering the light-emitting film layer and the etched section of the first packaging layer.

[0012] Through the above technical solution, the manufacturing method provided by the present application performs etching after forming the first packaging layer. The first packaging layer can protect the part between the first packaging layer and the base substrate, and the etching process is used to remove the part of the first packaging layer in the hole area, which is convenient for subsequent processing of holes and packaging in the hole area. The manufacturing method provided by the present application also uses the second packaging layer to cover the first packaging layer and the array substrate exposed in the hole area, and can cover the etched section of the light-emitting film layer and the first packaging layer, which can prevent water and oxygen from invading the display area, and the process is simple and easy to implement. In addition, the manufacturing method provided by the present application does not need to set an isolation column, which can reduce the packaging area of ​​the hole area, which is conducive to reducing the size of the frame of the subsequent processing hole.

[0013] Therefore, the manufacturing method provided in the present application is conducive to improving the performance and process performance of the display device.

[0014] In some embodiments, before etching the light-emitting film layer and the first encapsulation layer to remove the light-emitting film layer and the first encapsulation layer in the hole area, the manufacturing method provided by the present application further includes:

[0015] A protective film layer is formed on a side of the first encapsulation layer in the display area away from the array substrate.

[0016] Optionally, the protective film layer is a photoresist layer.

[0017] Optionally, after etching the light-emitting film layer and the first packaging layer to remove the light-emitting film layer and the first packaging layer in the hole area, the manufacturing method provided in the present application further includes: removing the protective film layer on the side of the first packaging layer in the display area away from the array substrate.

[0018] In this way, the manufacturing method provided by the present application also uses a protective film to protect the display area, retains the portion of the first encapsulation layer in the display area, prevents the display area from being affected by etching, and enables the display area to have a good display effect. In addition, the manufacturing method provided by the present application can use the photoresist used for etching as a protective film, and the process is simple and easy to implement. Moreover, the manufacturing method provided by the present application removes the protective film layer on the side of the first encapsulation layer in the display area away from the array substrate, so that the protective film layer will not affect the subsequent process.

[0019] In some embodiments, after a second packaging layer is formed on the side of the first packaging layer facing away from the array substrate and on the array substrate where the hole area is exposed, covering at least the light-emitting film layer and the etched section of the first packaging layer, the manufacturing method provided in the present application further includes: cutting to form a through hole on the array substrate and the second packaging layer in the hole area.

[0020] In this way, the manufacturing method provided in the present application forms a through hole by cutting the array substrate and the second packaging layer in the hole area after forming the second packaging layer. The second packaging layer can be used to encapsulate the etched section of the light-emitting film layer and the first packaging layer to prevent water and oxygen from invading the display area from the side wall of the through hole.

[0021] In some embodiments, the area of ​​the through hole is smaller than the area of ​​the hole region, and the orthographic projection of the through hole on the array substrate does not overlap with the orthographic projection of the first packaging layer and the light-emitting film layer on the array substrate.

[0022] In this way, the edge of the through hole is spaced apart from the edge of the hole area, which can reserve a packaging position in the hole area so that the second packaging layer can fill the packaging position, thereby packaging the light-emitting film layer and the etched section of the first packaging layer, which is beneficial to improving the packaging effect.

[0023] In some embodiments, the hole region includes a transition region and a cutting region, wherein the transition region surrounds the cutting region, and the cutting region is used for cutting into a through hole.

[0024] In some embodiments, before forming a second encapsulation layer covering at least the light-emitting film layer and the etched section of the first encapsulation layer on a side of the first encapsulation layer away from the array substrate and on the array substrate where the hole area is exposed, the manufacturing method provided by the present application further includes:

[0025] A groove is formed on the array substrate where the hole area is exposed, and the second packaging layer fills the groove.

[0026] Optionally, the groove includes a first groove, the first groove extends along the edge of the hole area, the first groove is located in the hole area, and the edge of the cutting area is located on the bottom wall surface of the first groove, and / or the groove includes a second groove, the substrate base is provided with a second groove, the second groove extends along the edge of the hole area, and the second groove is located in the transition area.

[0027] In this way, the groove can resist the stress when cutting the through hole, and can avoid cracks in the array substrate to a certain extent.

[0028] In some embodiments, before forming the light-emitting film layer on the array substrate, the manufacturing method provided in the present application further includes: forming a blocking dam around the hole area of ​​the array substrate, and the light-emitting film layer is formed on a side of the blocking dam away from the array substrate.

[0029] In a second aspect, the present application provides a display panel, the display panel comprising:

[0030] The array substrate comprises a display area and a hole area, wherein the display area surrounds the hole area;

[0031] A light-emitting film layer is arranged on one side of the array substrate;

[0032] A first packaging layer is arranged on a side of the light-emitting film layer away from the array substrate; the light-emitting film layer and the first packaging layer have an etching section in the hole area;

[0033] The second packaging layer is arranged on the side of the first packaging layer away from the array substrate and on the array substrate where the hole area is exposed. The second packaging layer at least covers the light-emitting film layer and the etched section of the first packaging layer.

[0034] The display panel provided in the present application can use a first packaging layer to protect the portion between the first packaging layer and the base substrate. The display panel provided in the present application also uses a second packaging layer to cover the first packaging layer and the array substrate exposed in the hole area, and the second packaging layer can cover the etched section of the light-emitting film layer and the first packaging layer, which can prevent water and oxygen from invading the display area, and is beneficial to improving reliability.

[0035] Therefore, the display panel provided in the present application is helpful to improve the performance of the display device.

[0036] In some embodiments, the hole region includes a through hole that passes through the second packaging layer and the array substrate, the area of ​​the through hole is smaller than the area of ​​the hole region, and the orthographic projection of the through hole on the array substrate does not overlap with the orthographic projection of the first packaging layer and the light-emitting film layer on the array substrate.

[0037] Optionally, the hole region includes a transition region, and the transition region surrounds the through hole.

[0038] Optionally, a groove is arranged on the array substrate in the transition area.

[0039] Optionally, the display panel further includes a blocking dam, which is arranged at the periphery of the hole area and between the light-emitting film layer and the array substrate.

[0040] In a third aspect, the present application provides a display device, comprising the above-mentioned display panel. The display device provided by the present application has similar technical effects as the display panel of the above-mentioned embodiment, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0042] Figure 1 It is one of the partial cross-sectional structural schematic diagrams of a display panel in the related art;

[0043] Figure 2 The second schematic diagram of a partial cross-sectional structure of a display panel in the related art;

[0044] Figure 3 A schematic diagram of the structure of a display panel provided in an embodiment of the present application with through holes processed therein;

[0045] Figure 4 For along Figure 3 One of the cross-sectional structural diagrams of the AA line;

[0046] Figure 5 For along Figure 3 The second schematic diagram of the cross-sectional structure along the AA line;

[0047] Figure 6 One of the flow charts of the manufacturing method provided in the embodiment of the present application;

[0048] Figure 7The second flowchart of the manufacturing method provided in the embodiment of the present application;

[0049] Figure 8 A schematic diagram of the structure of a display panel provided in an embodiment of the present application without a through hole processed therein;

[0050] Fig. 9 for Figure 8 A partial enlarged view of point B in the middle;

[0051] Fig.10 For along Fig. 9 One of the cross-sectional structural diagrams of the CC line;

[0052] Fig.11 For along Fig. 9 The second schematic diagram of the cross-sectional structure of the CC line;

[0053] Fig.12 For along Fig. 9 The third schematic diagram of the cross-sectional structure of the CC line;

[0054] Fig.13 For along Fig. 9 The fourth schematic diagram of the cross-sectional structure of the CC line;

[0055] Fig.14 For along Fig. 9 The fifth schematic diagram of the cross-sectional structure of the CC line.

[0056] Among them, the reference numerals in the figure are:

[0057] 100-display panel; 11-first groove; 12-second groove; 13-third groove; 14-etching section; 101-display area; 102-hole area; 1021-cutting area; 1022-transition area; 103-cutting line; 110-through hole; 120-isolation column; 130-OLED evaporation material; 131-main part; 132-elevated part; 133-partitioning part; 140-blocking dam; 10-array substrate; 20-light-emitting film layer; 30-first encapsulation layer; 40-protective film layer; 50-second encapsulation layer; 60-encapsulation layer. DETAILED DESCRIPTION

[0058] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0059] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0060] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0061] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0062] Hole in Active Area (HIAA) technology is widely used in display screens. Holes are made in the display screen to allow light and sound to pass through, and touch buttons can be set at the holes, so that the display device can have more functions such as video, sound output, and touch control. The holes in the display screen need to be encapsulated to prevent external water and oxygen from invading the display screen and affecting the use effect of the display device. Therefore, the display device with holes in the display screen needs to further improve the performance / process performance.

[0063] In related art, please also refer to Figure 1 and Figure 2The display panel 100 includes an array substrate 10 and an OLED (Organic Light-Emitting Diode) evaporation material 130 disposed on the array substrate 10. The side of the OLED evaporation material 130 facing away from the array substrate 10 is encapsulated by an encapsulation layer 60. External water and oxygen are generally transmitted through the OLED evaporation material 130, and the OLED evaporation material 130 has poor flexibility and is easy to break. Therefore, in the related art, an isolation column 120 is provided at the encapsulation area of ​​the through hole 110, so that the OLED evaporation material 130 is disconnected to form a main body 131, a raised portion 132 and a partition portion 133 that do not contact each other. The raised portion 132 is located in the isolation column 120 and is higher than the main body 131 and the partition portion 133. The partition portion 133 is located between two adjacent isolation columns 120. In this way, the transmission path of water and oxygen can be isolated, thereby blocking external water and oxygen.

[0064] However, the reliability of the isolation column 120 is poor, and the isolation column 120 occupies a large space, increasing the frame size of the through hole 110. Therefore, it is necessary to improve the packaging method and packaging structure of the through hole 110.

[0065] In order to solve the above technical problems, the present application provides a display device, which can be a mobile phone, a television, a tablet computer, a laptop computer, a desktop computer, a vehicle-mounted display terminal, a wearable device, a human-computer interaction terminal device, etc.

[0066] The display device includes a display panel 100 and other film layers supported by the display panel 100. The other film layers may include a polarizing film, an optically clear adhesive (OCA), and the like.

[0067] See also Figure 3 The embodiment of the present application provides a display panel 100, on which a through hole 110 can be processed to realize camera, sound output, and touch functions, wherein the through hole 110 can be processed by a cutting process. After the through hole 110 is processed on the display panel 100, effective packaging is required at the through hole 110 to prevent external water and oxygen from invading the interior of the display panel 100 through the side wall of the through hole 110.

[0068] Please also read Figure 3 and Figure 4 The display panel 100 provided in the present application includes an array substrate, the array substrate includes a display area 101 and a hole area 102 , the display area 101 surrounds the hole area 102 , and the display panel 100 can be used to process a through hole 110 in the hole area 102 .

[0069] In some embodiments, the area of ​​the through hole 110 is smaller than the area of ​​the hole region 102, and the edge of the through hole 110 is spaced apart from the edge of the hole region 102, that is, the orthographic projection of the through hole on the array substrate does not overlap with the orthographic projection of the first packaging layer and the light-emitting film layer on the array substrate. In this way, the edge of the through hole 110 is spaced apart from the edge of the hole region 102, and a packaging position can be reserved in the hole region 102, which is conducive to improving the packaging effect.

[0070] In some embodiments, the hole area 102 includes a transition area 1022 and a cutting area 1021, wherein the transition area 1022 is located between the cutting area 1021 and the display area 101, and the transition area 1022 surrounds the cutting area 1021, and the display panel 100 cuts and processes the through hole 110 in the cutting area 1021. The above-mentioned packaging position is located in the transition area 1022.

[0071] In other words, the hole region 102 includes the transition region 1022 and the through hole 110 , and the transition region 1022 surrounds the through hole 110 .

[0072] Exemplarily, an outer peripheral edge of the transition area 1022 is connected to an edge of the display area 101 , and an inner peripheral edge of the transition area 1022 is connected to an edge of the cutting area 1021 .

[0073] It should be noted that the display area 101 , the hole area 102 , and the transition area 1022 and the cutting area 1021 in the hole area 102 are areas divided on the display panel 100 for the convenience of describing, and do not belong to the actual structure.

[0074] It can be understood that the edge of the through hole 110 is the edge of the cutting area 1021 , and the edge of the hole area 102 is the outer peripheral edge of the transition area 1022 .

[0075] See also Figure 4 In some embodiments, the display panel 100 provided in the embodiment of the present application also includes a light-emitting film layer 20, which is formed on one side of the array substrate 10 in the thickness direction, and the light-emitting film layer 20 is located in the display area 101. The array substrate 10 can be made of materials such as glass (Glass) and polyimide (PI, Polyimide).

[0076] It is understandable that the array substrate 10 may also be provided with a driving circuit for driving the light-emitting film layer 20 to emit light. Under the drive of the driving circuit, the light-emitting film layer 20 may be excited to emit light.

[0077] In some embodiments, the display panel 100 provided in the embodiment of the present application further includes a blocking dam 140 (DAM), which is disposed at the periphery of the hole area 102 and between the array substrate 10 and the light-emitting film layer 20. The blocking dam 140 is disposed around the through hole 110 to prevent the light-emitting film layer 20 from overflowing.

[0078] For example, the light-emitting film layer 20 may be an OLED (Organic Light-Emitting Diode) film layer or other film layers that can emit light, wherein the OLED film layer may include a cathode, an anode, and an electron transport layer, a light-emitting layer, a hole transport layer, etc. located between the cathode and the anode.

[0079] See also Figure 4 In some embodiments, the display panel 100 provided in the embodiment of the present application further includes a first encapsulation layer 30, which is located on the side of the light-emitting film layer 20 away from the array substrate 10, and the first encapsulation layer 30 is located in the display area 101. The first encapsulation layer 30 can protect the portion between the first encapsulation layer 30 and the array substrate 10 (for example, the light-emitting film layer 20). Among them, the light-emitting film layer 20 and the first encapsulation layer 30 have an etched section 14 in the hole area.

[0080] Optionally, the display panel 100 provided in the embodiment of the present application further includes a second encapsulation layer 50, which is located on the side of the first encapsulation layer 30 away from the array substrate 10, and the second encapsulation layer 50 is located in the display area 101 and the transition area 1022. The second encapsulation layer 50 is disposed on the array substrate 10 exposed in the hole area 102, that is, the second encapsulation layer 50 is combined with the array substrate 10 in the transition area 1022. The second encapsulation layer 50 in the transition area 1022 partially blocks the cutting area 1021 and the display area 101, and covers the first encapsulation layer 30 and the etched section 14 when the light-emitting film layer 20 is cut, thereby isolating the light-emitting film layer 20 and the first encapsulation layer 30 from external water and oxygen, preventing external water and oxygen from invading the display area, which is beneficial to improving reliability.

[0081] It is understood that the first encapsulation layer 30 and the second encapsulation layer 50 are both made of inorganic materials, such as silicon oxide (SiO), silicon nitride (SiN) and the like.

[0082] In this way, the display panel 100 provided in the embodiment of the present application can avoid the intrusion of external water and oxygen, and there is no need to set the isolation column 120, which is beneficial to improving reliability and reducing the frame size at the through hole 110.

[0083] See also Figure 5 In some embodiments, the array substrate 10 is provided with a groove, and the groove is located in the hole area 102. Exemplarily, the groove may be located in the transition area 1022.

[0084] Optionally, the groove may include a first groove 11, and the first groove 11 extends along the edge of the hole area 102. The first groove 11 is located in the hole area 102 and at the junction of the cutting area 1021 and the transition area 1022, that is, the edge of the cutting area 1021 is located at the bottom wall surface of the first groove 11. In this way, when the display panel 100 of the present application is processed into the through hole 110 in the cutting area 1021, the first groove 11 can resist the stress generated during cutting, and can prevent the display panel 100 from generating cracks under the influence of the cutting stress.

[0085] Exemplarily, the first groove 11 may extend along the edge of the cutting area 1021 for one circle. Of course, the first groove 11 may also extend for half a circle, 1 / 3 of a circle, etc.

[0086] Please continue reading Figure 5 In some embodiments, the groove may further include a second groove 12, the second groove 12 extends along the edge of the hole area 102, and the second groove 12 is located in the transition area 1022. In this way, when the display panel 100 of the present application is processed into the through hole 110 in the cutting area 1021, the second groove 12 can further resist the stress generated during cutting, and can further prevent the display panel 100 from generating cracks under the influence of the cutting stress.

[0087] Exemplarily, the second groove 12 can extend along the edge of the hole area 102 for a circle. There can be multiple second grooves 12, and the multiple second grooves 12 are arranged in sequence. Exemplarily, there are two second grooves 12. Of course, the first groove 11 can also extend half a circle, 1 / 3 of a circle, etc.

[0088] The following describes a method for manufacturing the display panel 100 according to an embodiment of the present application.

[0089] Please continue reading Figures 6 to 14 , the manufacturing method provided in the embodiment of the present application includes:

[0090] S1, providing an array substrate 10. The array substrate 10 can be made of materials such as glass and polyimide (PI).

[0091] Please also read Figure 7 , Figure 8 , Fig. 9 and Fig.10The array substrate 10 includes a display area 101 and a hole area 102. The hole area 102 includes a transition area 1022 and a cutting area 1021. The transition area 1022 is located between the cutting area 1021 and the display area 101, and the transition area 1022 surrounds the cutting area 1021. The display panel 100 cuts and processes the through hole 110 in the cutting area 1021. Exemplarily, the outer peripheral edge of the transition area 1022 is connected to the edge of the display area 101, and the inner peripheral edge of the transition area 1022 is connected to the edge of the cutting area 1021.

[0092] The inner edge of the transition zone 1022 and the edge of the cutting zone 1021 meet at the cutting line 103. The manufacturing method provided in the embodiment of the present application can cut and process the through hole 110 along the cutting line 103. The cutting line 103 is a virtual line to illustrate the cutting position of the through hole 110 for easy understanding.

[0093] It should be noted that the display area 101 , the hole area 102 , and the transition area 1022 and the cutting area 1021 in the hole area 102 are areas divided on the display panel 100 for the convenience of describing, and do not belong to the actual structure.

[0094] S2 , forming a barrier dam 140 around the hole area 102 of the array substrate 10 .

[0095] S3, see Figure 6 and Fig.10 , a light-emitting film layer 20 is formed on the array substrate 10, and the light-emitting film layer 20 may be an OLED film layer or other film layer that can emit light. It is understood that the array substrate 10 may also be provided with a driving circuit for driving the light-emitting film layer 20 to emit light, and under the driving of the driving circuit, the light-emitting film layer 20 may be excited to emit light. The blocking dam 140 is provided around the through hole 110 to prevent the light-emitting film layer 20 from overflowing.

[0096] S4, see Figure 6 and Fig.10 , a first encapsulation layer 30 is formed on the side of the light-emitting film layer 20 away from the array substrate 10. The first encapsulation layer 30 can be made of inorganic materials such as silicon oxide (SiO) and silicon nitride (SiN), and the first encapsulation layer 30 can protect the light-emitting film layer 20. It can be understood that the manufacturing method of the embodiment of the present application forms the first encapsulation layer 30 using a chemical vapor deposition (CVD) process.

[0097] S5, see Figure 6 and Fig.11A protective film layer 40 is formed on the side of the first encapsulation layer 30 of the display area 101 away from the array substrate 10, wherein the protective film layer 40 can protect the light-emitting film layer 20 and the first encapsulation layer 30 to prevent subsequent etching steps from damaging the light-emitting film layer 20 and the first encapsulation layer 30. Optionally, the protective film layer 40 can be a photoresist layer (not shown in the figure).

[0098] For example, see Figure 7 The step of forming the protective film layer 40 in the display area 101 includes:

[0099] S51, applying photoresist on a side of the first encapsulation layer 30 away from the array substrate 10;

[0100] S52 , exposing and developing the photoresist on the side of the first encapsulation layer 30 away from the array substrate 10 , so that the photoresist forms a protective film layer 40 .

[0101] After the photoresist is developed, there are holes corresponding to the hole area 102, so that the subsequent etching step can remove the portion of the first encapsulation layer 30 in the hole area 102 and the portion of the light-emitting film layer 20 in the hole area 102. The manufacturing method provided in the embodiment of the present application does not require specially designed processing equipment, and can be processed using photolithography equipment and exposure and development equipment. The process is simple and easy to implement.

[0102] S6, see Fig.12 , the light-emitting film layer 20 and the first encapsulation layer 30 are etched to remove the portions of the light-emitting film layer 20 and the first encapsulation layer 30 in the hole area 102 , so as to subsequently encapsulate the hole area 102 and form the through hole 110 .

[0103] S7, see Fig.12 , remove the protective film layer 40 on the side of the first encapsulation layer 30 of the display area 101 away from the array substrate 10 to prevent the protective film layer 40 from affecting subsequent processes.

[0104] S8, forming a groove on the array substrate 10 exposed in the hole area 102. Exemplarily, the groove may include a first groove 11. Exemplarily, the groove may also include a second groove 12. Exemplarily, the groove may also include a third groove 13.

[0105] S9, see Fig.13, on the side of the first encapsulation layer 30 away from the array substrate 10, and on the array substrate 10 where the hole area 102 is exposed, a second encapsulation layer 50 is formed that at least covers the light-emitting film layer 20 and the etched section 14 of the first encapsulation layer 30. The second encapsulation layer 50 can prevent water and oxygen from invading the display area 101 from the side wall of the through hole 110. Among them, the second encapsulation layer 50 can also be made of inorganic materials such as silicon oxide (SiO) and silicon nitride (SiN), and the part of the second encapsulation layer 50 in the hole area 102 can be directly combined with the array substrate 10 in the hole area 102, so as to encapsulate the hole area 102, and prevent water and oxygen from invading the display area 101. It can be understood that the manufacturing method of the embodiment of the present application uses a chemical vapor deposition (CVD) process to form the second encapsulation layer 50.

[0106] It is understandable that before forming the second encapsulation layer 50, an organic glue (not shown in the figure) can be coated on the first encapsulation layer 30, which can make the second encapsulation layer 50 and the first encapsulation layer 30 more firmly bonded, thereby improving the subsequent encapsulation reliability of the second encapsulation layer 50.

[0107] It is understandable that the manufacturing method provided in the embodiment of the present application can utilize inkjet printing (IJP) technology to perform organic glue coating.

[0108] S10, forming a through hole 110 by cutting on the array substrate 10 and the second packaging layer 50 in the hole area 102, wherein the hole area 102 includes a transition area 1022 and a cutting area 1021, wherein the transition area 1022 is located between the cutting area 1021 and the display area 101, and the transition area 1022 surrounds the cutting area 1021, and the manufacturing method provided in the embodiment of the present application cuts and processes the through hole 110 in the cutting area 1021.

[0109] Exemplarily, the area of ​​the through hole 110 is smaller than the area of ​​the hole region 102, and the orthographic projection of the through hole 110 on the array substrate 10 does not overlap with the orthographic projection of the first encapsulation layer 30 and the light-emitting film layer 20 on the array substrate. That is, the edge of the through hole 110 is spaced a certain distance from the edge of the hole region 102. In this way, the edge of the through hole 110 is spaced a certain distance from the edge of the hole region 102, and a packaging position can be reserved in the hole region 102, so that the second encapsulation layer 50 has a certain packaging area in the hole region 102, and the second encapsulation layer 50 can fill the packaging position, thereby encapsulating the light-emitting film layer 20 and the etched section 14 of the first encapsulation layer 30, which is conducive to improving the packaging effect.

[0110] Exemplarily, the outer edge of the transition area 1022 is connected to the edge of the display area 101, and the inner edge of the transition area 1022 is connected to the edge of the cutting area 1021. After the through hole 110 is processed by the manufacturing method of the embodiment of the present application, light and sound can pass through the through hole 110, and a touch button can also be set at the through hole 110.

[0111] It is understandable that the through hole 110 can be processed by a cutting process. The inventors have found that cutting stress is generated when the through hole 110 is cut, which can easily cause cracks in the display panel 100. The manufacturing method of the present application sets a groove on the array substrate 10. The groove can resist the cutting stress to a certain extent, thereby preventing the display panel 100 from cracking.

[0112] See also Fig.14 , exemplarily, the groove may include a first groove 11, the first groove 11 extends along the edge of the hole area 102, the first groove 11 is located in the hole area 102, and is located at the junction of the cutting area 1021 and the transition area 1022, that is, the edge of the cutting area 1021 is located at the bottom wall of the first groove 11. In the manufacturing method of the present application, when the cutting area 1021 is processed into a through hole 110, the first groove 11 can resist the stress generated during cutting, and can prevent the display panel 100 from generating cracks under the influence of the cutting stress. Among them, the first groove 11 can extend along the edge of the cutting area 1021 for a circle.

[0113] Exemplarily, the groove may further include a second groove 12, the second groove 12 extends along the edge of the hole area 102, and the second groove 12 is located in the transition area 1022. In this way, when the cutting area 1021 is processed into the through hole 110 in the manufacturing method of the present application, the second groove 12 can further resist the stress generated during cutting, and can further prevent the display panel 100 from cracking under the influence of the cutting stress. The second groove 12 can extend along the edge of the hole area 102 for a circle.

[0114] Exemplarily, the groove may further include a third groove 13, the third groove 13 extends along the edge of the hole area 102, and the third groove 13 is located in the cutting area 1021. When the cutting area 1021 is processed into a through hole 110 in the manufacturing method of the present application, the third groove 13 may also resist the stress generated during cutting to a certain extent. The third groove 13 may also extend along the edge of the hole area 102 for a circle.

[0115] The manufacturing method provided in the embodiment of the present application uses an etching process to remove the first encapsulation layer 30 and the light-emitting film layer 20 in the hole area 102, so as to facilitate the subsequent processing of holes and packaging in the hole area 102. The manufacturing method provided in the embodiment of the present application also uses a protective film layer 40 to protect the display area 101, protect the first encapsulation layer 30 and the light-emitting film layer 20 in the display area 101, and prevent the display area 101 from being affected by etching, so that the display area 101 has a good display effect.

[0116] Optionally, the manufacturing method provided in the embodiment of the present application allows the second encapsulation layer 50 to be directly combined with the array substrate 10 in the hole area 102. The second encapsulation layer 50 is used for encapsulation, which can prevent water and oxygen from invading the display area 101, and the process is simple and easy to implement. In addition, the manufacturing method provided in the present application does not need to set the isolation column 120, which can reduce the packaging area of ​​the hole area 102, which is conducive to reducing the size of the frame of the subsequent processing hole. Therefore, the manufacturing method provided in the present application is conducive to improving the performance and process performance of the display device.

[0117] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for manufacturing a display panel, characterized in that: The method comprises: Providing an array substrate, the array substrate comprising a display area and a hole area, the display area surrounding the hole area; forming a light-emitting film layer on the array substrate; forming a first encapsulation layer on a side of the light-emitting film layer away from the array substrate; Etching the light-emitting film layer and the first encapsulation layer to remove portions of the light-emitting film layer and the first encapsulation layer in the hole area; A second packaging layer is formed on a side of the first packaging layer facing away from the array substrate and on the array substrate where the hole area is exposed, at least covering the light-emitting film layer and the etched section of the first packaging layer.

2. The method according to claim 1, characterized in that Before etching the light-emitting film layer and the first encapsulation layer to remove the portions of the light-emitting film layer and the first encapsulation layer in the hole area, the method further includes: forming a protective film layer on a side of the first encapsulation layer in the display area away from the array substrate; Preferably, the protective film layer is a photoresist layer; Preferably, after etching the light-emitting film layer and the first encapsulation layer to remove the portions of the light-emitting film layer and the first encapsulation layer in the hole area, the method further comprises: The protective film layer on a side of the first encapsulation layer in the display area facing away from the array substrate is removed.

3. The method according to claim 1 or 2, characterized in that After forming a second encapsulation layer at least covering the light-emitting film layer and the etched section of the first encapsulation layer on a side of the first encapsulation layer away from the array substrate and on the array substrate where the hole area is exposed, the method further comprises: Through holes are formed by cutting on the array substrate and the second packaging layer in the hole area.

4. The method according to claim 3, characterized in that The area of ​​the through hole is smaller than the area of ​​the hole region, and the orthographic projection of the through hole on the array substrate does not overlap with the orthographic projections of the first encapsulation layer and the light-emitting film layer on the array substrate.

5. The method according to claim 4, characterized in that The hole area includes a transition area and a cutting area, wherein the transition area surrounds the cutting area, and the cutting area is used for cutting into the through hole.

6. The method according to claim 5, characterized in that Before forming a second encapsulation layer at least covering the light-emitting film layer and the etched section of the first encapsulation layer on a side of the first encapsulation layer away from the array substrate and on the array substrate where the hole area is exposed, the method further comprises: forming a groove on the array substrate where the hole area is exposed, and filling the groove with the second packaging layer; Preferably, the groove comprises a first groove, the first groove extends along the edge of the hole area, the first groove is located in the hole area, and the edge of the cutting area is located on the bottom wall surface of the first groove. And / or, the groove includes a second groove, the second groove extends along an edge of the hole area, and the second groove is located in the transition area.

7. The method according to claim 1, characterized in that Before forming the light-emitting film layer on the array substrate, the method further includes: A blocking dam is formed at the periphery of the hole area of ​​the array substrate, and the light-emitting film layer is formed on a side of the blocking dam away from the array substrate.

8. A display panel, characterized in that: The display panel comprises: An array substrate comprises a display area and a hole area, wherein the display area surrounds the hole area; A light-emitting film layer is disposed on one side of the array substrate; A first packaging layer is arranged on a side of the light-emitting film layer away from the array substrate; the light-emitting film layer and the first packaging layer have an etched section in the hole area; The second packaging layer is arranged on a side of the first packaging layer away from the array substrate and on the array substrate where the hole area is exposed, and the second packaging layer at least covers the light-emitting film layer and the etched section of the first packaging layer.

9. The display panel according to claim 8, wherein: The hole region includes a through hole penetrating the second packaging layer and the array substrate, the area of ​​the through hole is smaller than the area of ​​the hole region, and the orthographic projection of the through hole on the array substrate does not overlap with the orthographic projection of the first packaging layer and the light-emitting film layer on the array substrate; Preferably, the hole region includes a transition region, and the transition region surrounds the through hole; Preferably, a groove is provided on the array substrate in the transition area; Preferably, the display panel further comprises a blocking dam, wherein the blocking dam is arranged at the periphery of the hole area and located between the light emitting film layer and the array substrate.

10. A display device, characterized in that: Comprising the display panel as claimed in claim 9.

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