Flexible semiconductor refrigeration line

Abstract

A flexible semiconductor refrigeration line relates to the technical field of semiconductor refrigeration and comprises a cold-end flexible insulation pipe, a hot-end flexible insulation pipe and a pipeline-shaped flexible refrigeration body. A cold-end flexible insulating pipe is sleeved outside the flexible refrigerating body, and a hot-end flexible insulating pipe is inserted into the flexible refrigerating body; the flexible refrigerating body comprises a plurality of refrigerating units which are sequentially arranged at intervals, and each refrigerating unit comprises an annular N-type thermoelectric arm and an annular P-type thermoelectric arm which are arranged at intervals in a crossed mode; the outer walls of the annular N-type thermoelectric arm and the annular P-type thermoelectric arm of the same refrigeration unit are conductively communicated through a flexible conductive sleeve; in two adjacent refrigeration units, the annular P-type thermoelectric arm of one refrigeration unit is conductively communicated with the inner hole wall of the other annular N-type thermoelectric arm through a flexible conductive tube; the device is simple in structure, easy to assemble and low in production cost; the thin flexible semiconductor refrigeration line can be produced, so that the thin flexible semiconductor refrigeration line can be conveniently implanted into clothes or applied to other scenes needing flexible refrigeration bodies.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor refrigeration, in particular to a flexible semiconductor refrigeration line. Background Art

[0002] Semiconductor cooling, also known as thermoelectric cooling, works on the principle of the Peltier Effect. The Peltier effect refers to the phenomenon that when an electric current passes through a circuit composed of two different materials, heat absorption or heat release occurs at the joint. There are no moving parts inside the thermoelectric cooler, but the transfer of heat energy is achieved through the direct action of electrical energy. This unique design gives the thermoelectric cooler many advantages, such as light weight, compact size, high reliability, long service life, silent operation and rapid response. Therefore, it has been widely favored in application fields that require precise temperature control and equipment cooling. However, thermoelectric coolers are mostly block-shaped and have a hard structure; for wearable products, structural components are often required to have a certain degree of flexibility, which is also the main reason why existing thermoelectric coolers are difficult to apply to wearable products.

[0003] A Chinese patent (publication number: CN113193104A) discloses a semiconductor heat pipe with a fan-shaped thermoelectric arm structure and a preparation method thereof; the patent includes an inner insulating heat pipe, an outer insulating heat pipe, a PN electric couple formed by a P-type semiconductor crystal and an N-type semiconductor crystal, and a heat conducting metal sheet formed by an upper side guide metal sheet and a lower side guide metal sheet; the P-type semiconductor crystal and the N-type semiconductor crystal are both fan-shaped, and the upper side guide metal sheet is connected to the outer insulating heat pipe through the P-type semiconductor crystal and the N-type semiconductor crystal; the lower side guide metal sheet is connected to the inner insulating heat pipe together with the P-type semiconductor crystal and the N-type semiconductor crystal; the patent forms a semiconductor heat pipe with a tubular structure, overcoming the problem that the existing thermoelectric cooler can only be made into a block structure; however, the patent structure is still a hard structure, and its P-type semiconductor crystal and the N-type semiconductor crystal are arranged in a ring direction along the inner insulating heat pipe, so that it cannot be made into a thinner linear structure, and the processing difficulty is large, and the production cost is high. Summary of the invention

[0004] In order to overcome the deficiencies in the background technology, the present invention discloses a flexible semiconductor refrigeration line.

[0005] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme: A flexible semiconductor refrigeration line comprises a cold-end flexible insulating tube, a hot-end flexible insulating tube and a flexible refrigeration body in the shape of a pipeline; the flexible refrigeration body is sheathed with the cold-end flexible insulating tube on the outside and plugged with the hot-end flexible insulating tube on the inside; the flexible refrigeration body comprises a plurality of refrigeration units arranged in sequence at intervals, and the refrigeration units comprise annular N-type thermoelectric arms and annular P-type thermoelectric arms arranged crosswise at intervals; the outer walls of the annular N-type thermoelectric arms and the annular P-type thermoelectric arms of the same refrigeration unit are conductively connected through a flexible conductive sleeve; in two adjacent refrigeration units, the annular P-type thermoelectric arm of one refrigeration unit is conductively connected to the inner hole wall of the other annular N-type thermoelectric arm through a flexible conductive tube.

[0006] Preferably, it also includes a flexible heat dissipation device, which includes a flexible heat pipe with a closed end inserted into the hot end flexible insulating tube, and a heat pipe medium is contained in the flexible heat pipe; one end of the flexible heat pipe extending out of the hot end flexible insulating tube is connected to a flexible heat dissipation bag.

[0007] Preferably, the heat pipe medium is a mixed liquid of one or more of ionized water, methanol, alcohol, acetone, and heat transfer oil.

[0008] Preferably, the flexible heat dissipation bag is a flat plastic bag.

[0009] Preferably, the flexible heat dissipation bag is filled with metal wires for draining the heat pipe medium.

[0010] Preferably, the material of the hot end flexible insulating tube is one or more composite materials selected from the group consisting of PPS, PA6 / PA66, LCP, TPE, PC, PP, and PPA.

[0011] Preferably, the material of the cold end flexible insulating tube (1) is one or more composite materials selected from the group consisting of butadiene rubber (BR), chloroprene rubber (CR), polyvinyl alcohol (PVA), polyester (PET), polyimide (PI), and polyethylene naphthalate (PEN).

[0012] Preferably, the flexible conductive sleeve and the flexible conductive tube are metal tubes or flexible non-metallic conductive tubes made of flexible non-metallic conductive materials.

[0013] Preferably, the metal tube is a copper tube, and the gap between the annular N-type thermoelectric arm and the annular P-type thermoelectric arm corresponding to the copper tube is a corrugated tube structure; the flexible non-metallic conductive tube is a flexible graphene tube.

[0014] The method for preparing a flexible semiconductor refrigeration line comprises the following steps: S1. A flexible conductive sleeve is arranged outside a ring-shaped N-type thermoelectric arm, and a ring-shaped P-type thermoelectric arm is inserted into the other end of the flexible conductive sleeve. The ring-shaped P-type thermoelectric arm and the ring-shaped N-type thermoelectric arm are arranged at intervals, and the ring-shaped N-type thermoelectric arm and the ring-shaped P-type thermoelectric arm are both electrically conductive and fixedly connected to the flexible conductive sleeve; S2, inserting one end of a flexible conductive tube into the inner hole of the annular P-type thermoelectric arm of step S1, and making the flexible conductive tube and the annular P-type thermoelectric arm conductive and fixedly connected; sleeve another annular N-type thermoelectric arm on the other end of the flexible conductive tube, and making the annular N-type thermoelectric arm and the flexible conductive tube conductive and fixedly connected; S3, repeating the operations of steps S1 to S2 on the basis of the annular N-type thermoelectric arm of step S2 to form a flexible cooling body until the flexible cooling body reaches the designed length; S4. Insert the hot-end flexible insulating tube into the flexible refrigeration body, and install the cold-end flexible insulating tube outside the flexible refrigeration body.

[0015] Due to the adoption of the above-mentioned technical solution, the present invention has the following beneficial effects: A flexible semiconductor refrigeration wire disclosed in the present invention has a simple structure, is easy to assemble, and has a low production cost. Since both the annular N-type thermoelectric arm and the annular P-type thermoelectric arm are annular structures, they can be simply arranged linearly, and the production process is easy, thereby greatly reducing the production cost. By controlling the diameters of the annular N-type thermoelectric arm and the annular P-type thermoelectric arm, a thinner flexible semiconductor refrigeration wire can be produced, so that it is easy to implant into clothing, or be used in other scenarios where a flexible refrigeration body is required. The outer sleeve of the flexible refrigeration body is provided with a cold-end flexible insulating tube, and the inner sleeve is plugged with a hot-end flexible insulating tube. The cold-end flexible insulating tube and the hot-end flexible insulating tube not only play an insulating role, but also can be the skeleton and cover of the flexible refrigeration body to prevent the flexible refrigeration body from accidentally falling apart; in addition, the bending angle of the flexible refrigeration body can be limited to prevent the flexible refrigeration body from being excessively bent and unable to operate normally; In order to ensure the flexible function and heat dissipation performance of the flexible semiconductor refrigeration line, it also includes a flexible heat dissipation device, which includes a flexible heat pipe with a closed end inserted into a hot-end flexible insulating tube, and a heat pipe medium is contained in the flexible heat pipe; one end of the flexible heat pipe extending out of the hot-end flexible insulating tube is connected to a flexible heat dissipation bag; the flexible heat dissipation bag is a flat plastic bag, which occupies a small volume and can be well hidden in the refrigeration clothing when used in refrigeration clothing; the flexible heat dissipation bag is filled with metal wire, which can improve the heat dissipation effect and accelerate the cooling and liquefaction of the heat pipe medium on the one hand, and on the other hand, the metal wire can extend into the flexible heat pipe, thereby playing a drainage role, so that the liquefied heat pipe medium can quickly flow back to the flexible heat pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 3 It is a structural schematic diagram of a flexible heat dissipation device.

[0017] In the figure: 1. Flexible insulating tube at cold end; 2. Flexible insulating tube at hot end; 3. Flexible refrigeration body; 3-1. Annular N-type thermoelectric arm; 3-2. Annular P-type thermoelectric arm; 3-3. Flexible conductive sleeve; 3-4. Flexible conductive tube; 4. Flexible heat dissipation device; 4-1. Flexible heat pipe; 4-2. Heat pipe medium; 4-3. Flexible heat dissipation bag; 4-4. Metal wire. DETAILED DESCRIPTION

[0018] The present invention can be explained in detail through the following embodiments. The purpose of disclosing the present invention is to protect all technical improvements within the scope of the present invention. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", etc. indicating directions or positional relationships, they only correspond to the drawings of the present application for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction.

[0019] Combined with Figures 1 to 3 A flexible semiconductor refrigeration line comprises a cold-end flexible insulating tube 1, a hot-end flexible insulating tube 2 and a pipeline-shaped flexible refrigeration body 3; the flexible refrigeration body 3 is sheathed with the cold-end flexible insulating tube 1 on the outside, and the hot-end flexible insulating tube 2 is inserted inside. Figure 2 As shown, the cold-end flexible insulating tube 1 and the hot-end flexible insulating tube 2 not only play an insulating role, but also can be the skeleton and cover of the flexible refrigeration body 3 to prevent the flexible refrigeration body 3 from accidentally falling apart; in addition, the bending angle of the flexible refrigeration body 3 can be limited to prevent the flexible refrigeration body 3 from being excessively bent and unable to operate normally; the material of the hot-end flexible insulating tube 2 is one or more composite materials selected from PPS, PA6 / PA66, LCP, TPE, PC, PP, and PPA; the material of the cold-end flexible insulating tube 1 is one or more composite materials selected from butadiene rubber (BR), chloroprene rubber (CR), polyvinyl alcohol (PVA), polyester (PET), polyimide (PI), and polyethylene naphthalate (PEN).

[0020] Combined with Figure 1The flexible refrigeration body 3 includes a plurality of refrigeration units arranged in sequence at intervals, and the refrigeration unit includes an annular N-type thermoelectric arm 3-1 and an annular P-type thermoelectric arm 3-2 arranged at intervals and crosses; the outer walls of the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 of the same refrigeration unit are conductively connected through a flexible conductive sleeve 3-3; in two adjacent refrigeration units, the annular P-type thermoelectric arm 3-2 of one refrigeration unit is conductively connected with the inner hole wall of the other annular N-type thermoelectric arm 3-1 through a flexible conductive tube 3-4, that is, the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 are arranged according to NPN-PN-PN to form a pipeline structure; It should be noted that the bending angle of the flexible cooling body 3 needs to be limited during use to prevent the adjacent annular N-type thermoelectric arms 3-1 and annular P-type thermoelectric arms 3-2 from directly contacting and short-circuiting. The flexible conductive sleeve 3-3 and the flexible conductive tube 3-4 are flexible non-metallic conductive tubes made of metal tubes or flexible non-metallic conductive materials; if a metal tube is used, the metal tube is a copper tube, and the copper tube has a corrugated tube structure at the gap between the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2. The corrugated tube structure enables the copper tube to be bent repeatedly, thereby having good flexibility; if a flexible non-metallic conductive material is used, the flexible non-metallic conductive tube is a flexible graphene tube, which not only has good conductive properties, but also has good flexibility, which greatly increases the bending angle of the flexible refrigeration body 3.

[0021] When in use, the flexible refrigeration body 3 is powered on according to the wiring method of the existing refrigeration semiconductor, and a heat dissipation component for dissipating heat for the flexible refrigeration body 3 is inserted into the hot-end flexible insulating tube 2, so that the refrigeration function of the flexible refrigeration body 3 can be utilized; for example, the flexible semiconductor refrigeration line is implanted in clothing as refrigeration clothing; since the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 are both annular structures, they can be simply arranged linearly, and the production process is easy, thereby greatly reducing the production cost; by controlling the diameters of the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2, a thinner flexible semiconductor refrigeration line can be produced, which is convenient for implantation in clothing or application in other scenarios requiring a flexible refrigeration body.

[0022] The preparation method of the flexible semiconductor refrigeration line comprises the following steps: S1. A flexible conductive sleeve 3-3 is disposed on the outer surface of an annular N-type thermoelectric arm 3-1, and an annular P-type thermoelectric arm 3-2 is inserted into the other end of the flexible conductive sleeve 3-3. The annular P-type thermoelectric arm 3-2 is spaced apart from the annular N-type thermoelectric arm 3-1, and the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 are both electrically conductive and fixedly connected to the flexible conductive sleeve 3-3; S2, insert one end of a flexible conductive tube 3-4 into the inner hole of the annular P-type thermoelectric arm 3-2 of step S1, and make the flexible conductive tube 3-4 and the annular P-type thermoelectric arm 3-2 conductive and fixedly connected; sleeve another annular N-type thermoelectric arm 3-1 on the other end of the flexible conductive tube 3-4, and make the annular N-type thermoelectric arm 3-1 and the flexible conductive tube 3-4 conductive and fixedly connected; S3, repeating the operations of steps S1 to S2 on the basis of the annular N-type thermoelectric arm 3-1 in step S2 to form a flexible cooling body 3 until the flexible cooling body 3 reaches the designed length; S4. Insert the hot-end flexible insulating tube 2 into the flexible refrigeration body 3, and install the cold-end flexible insulating tube 1 outside the flexible refrigeration body 3.

[0023] In order to ensure the flexible function and heat dissipation performance of the flexible semiconductor refrigeration line, a flexible heat dissipation device 4 is also included. Figure 3 As shown, the flexible heat dissipation device 4 comprises a flexible heat pipe 4-1 whose closed end is inserted into the hot-end flexible insulating tube 2, and the flexible heat pipe 4-1 contains a heat pipe medium 4-2; the heat pipe medium 4-2 is a mixed liquid of one or more of ionized water, methanol, alcohol, acetone, and heat-conducting oil; one end of the flexible heat pipe 4-1 extending out of the hot-end flexible insulating tube 2 is connected to a flexible heat dissipation bag 4-3; that is, the existing heat pipe technology is used to dissipate heat for the flexible refrigeration body 3, and the heat pipe medium 4-2 in the flexible heat pipe 4-1 absorbs the heat generated by the flexible refrigeration body 3 and then evaporates, and enters the flexible heat dissipation bag 4-3, is cooled and liquefied in the flexible heat dissipation bag 4-3, and then returns to the flexible heat pipe 4-1 along the tube core of the flexible heat pipe 4-1, and this cycle is repeated to achieve the purpose of dissipating heat for the flexible refrigeration body 3; The flexible heat dissipation bag 4-3 is a flat plastic bag that occupies a small volume and can be well hidden in the refrigeration clothing when used in the refrigeration clothing; the flexible heat dissipation bag 4-3 is filled with metal wire 4-4, which can improve the heat dissipation effect and accelerate the cooling and liquefaction of the heat pipe medium 4-2 on the one hand, and on the other hand, the metal wire 4-4 can extend into the flexible heat pipe 4-1, thereby playing a drainage role, so that the liquefied heat pipe medium 4-2 can quickly flow back to the flexible heat pipe 4-1.

[0024] The parts of the present invention that are not described in detail are prior art. It is obvious to those skilled in the art that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and it is intended that all changes that fall within the meaning and scope of equivalent elements are included in the present invention.

Claims

1. A flexible semiconductor refrigeration line, characterized by: The invention comprises a cold-end flexible insulating tube (1), a hot-end flexible insulating tube (2) and a flexible refrigeration body (3) in the form of a pipeline; the flexible refrigeration body (3) is provided with a cold-end flexible insulating tube (1) on the outside and is plugged with a hot-end flexible insulating tube (2) on the inside; the flexible refrigeration body (3) comprises a plurality of refrigeration units arranged in sequence at intervals, and the refrigeration units comprise annular N-type thermoelectric arms (3-1) and annular P-type thermoelectric arms (3-2) arranged in an intersecting manner; the outer walls of the annular N-type thermoelectric arms (3-1) and the annular P-type thermoelectric arms (3-2) of the same refrigeration unit are electrically connected via a flexible conductive sleeve (3-3); and in two adjacent refrigeration units, the annular P-type thermoelectric arm (3-2) of one refrigeration unit is electrically connected to the inner hole wall of the other annular N-type thermoelectric arm (3-1) via a flexible conductive tube (3-4).

2. The flexible semiconductor refrigeration line according to claim 1, characterized in that: It also comprises a flexible heat dissipation device (4), the flexible heat dissipation device (4) comprising a flexible heat pipe (4-1) whose closed end is inserted into a hot-end flexible insulating tube (2), and a heat pipe medium (4-2) is contained in the flexible heat pipe (4-1); one end of the flexible heat pipe (4-1) extending out of the hot-end flexible insulating tube (2) is connected to a flexible heat dissipation bag (4-3).

3. The flexible semiconductor refrigeration line according to claim 2, characterized in that: The heat pipe medium (4-2) is a mixed liquid of one or more of ionized water, methanol, alcohol, acetone, and heat transfer oil.

4. The flexible semiconductor refrigeration line according to claim 2, characterized in that: The flexible heat dissipation bag (4-3) is a flat plastic bag.

5. The flexible semiconductor refrigeration line according to claim 2 or 4, characterized in that: The flexible heat dissipation bag (4-3) is filled with metal wires (4-4).

6. The flexible semiconductor refrigeration line according to claim 1, characterized in that: The material of the hot end flexible insulating tube (2) is one or more composite materials selected from the group consisting of PPS, PA6 / PA66, LCP, TPE, PC, PP, and PPA.

7. The flexible semiconductor refrigeration line according to claim 1, characterized in that: The material of the cold end flexible insulating tube (1) is one or more composite materials selected from the group consisting of butadiene rubber (BR), chloroprene rubber (CR), polyvinyl alcohol (PVA), polyester (PET), polyimide (PI), and polyethylene naphthalate (PEN).

8. The flexible semiconductor refrigeration line according to claim 1, characterized in that: The flexible conductive sleeve (3-3) and the flexible conductive tube (3-4) are metal tubes or flexible non-metallic conductive tubes made of flexible non-metallic conductive materials.

9. The flexible semiconductor refrigeration line according to claim 8, characterized in that: The metal tube is a copper tube, and the gap between the copper tube corresponding to the annular N-type thermoelectric arm (3-1) and the annular P-type thermoelectric arm (3-2) is a corrugated tube structure; the flexible non-metallic conductive tube is a flexible graphene tube.

10. The flexible semiconductor refrigeration line according to claim 1, characterized in that: The preparation method of the flexible semiconductor refrigeration line comprises the following steps: S1. A flexible conductive sleeve (3-3) is disposed on the outer surface of an annular N-type thermoelectric arm (3-1), and an annular P-type thermoelectric arm (3-2) is inserted into the other end of the flexible conductive sleeve (3-3). The annular P-type thermoelectric arm (3-2) and the annular N-type thermoelectric arm (3-1) are arranged at intervals, and the annular N-type thermoelectric arm (3-1) and the annular P-type thermoelectric arm (3-2) are both electrically conductive and fixedly connected to the flexible conductive sleeve (3-3); S2, inserting one end of a flexible conductive tube (3-4) into the inner hole of the annular P-type thermoelectric arm (3-2) of step S1, and making the flexible conductive tube (3-4) and the annular P-type thermoelectric arm (3-2) conductive and fixedly connected; sleeve another annular N-type thermoelectric arm (3-1) on the other end of the flexible conductive tube (3-4), and making the annular N-type thermoelectric arm (3-1) and the flexible conductive tube (3-4) conductive and fixedly connected; S3, repeating the operations of steps S1 to S2 on the basis of the annular N-type thermoelectric arm (3-1) of step S2 to form a flexible refrigeration body (3), until the flexible refrigeration body (3) reaches a designed length; S4. Insert the hot-end flexible insulating tube (2) into the flexible refrigeration body (3), and install the cold-end flexible insulating tube (1) outside the flexible refrigeration body (3).

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