Cleaning device for manufacturing semiconductor ceramic wafer

Abstract

The invention relates to the technical field of semiconductor ceramic chips, in particular to a cleaning device for manufacturing semiconductor ceramic chips, which comprises a cleaning box, a box door is hinged to the outer side of the cleaning box, a moving groove is formed in the bottom in the cleaning box, a moving block is in sliding fit in the moving groove, and a pushing assembly for driving the moving block to move left and right is arranged in the moving groove. The top of the moving block extends to the outer side of the moving groove, a placing plate is fixedly connected to the top of the extending end of the moving block, an adsorption assembly is arranged on the upper surface of the placing plate, and a first mounting groove, a second mounting groove and a third mounting groove which are arranged at equal intervals are sequentially formed in the top in the cleaning box from left to right; a flushing assembly is arranged in the second mounting groove, and a blow-drying assembly is arranged in the third mounting groove.

Description

Technical Field

[0001] The invention relates to the field of semiconductor ceramic sheets, and in particular to a cleaning device for manufacturing semiconductor ceramic sheets. Background Art

[0002] In the production and processing of semiconductor ceramic wafers, surface cleaning is a crucial link. Since semiconductor ceramic materials have special physical and chemical properties, the dirt on their surface not only affects the appearance quality of the product, but may also have adverse effects on its electrical and mechanical properties. Therefore, it is particularly important to develop an efficient, environmentally friendly, and automated semiconductor ceramic wafer cleaning device. Summary of the invention

[0003] In view of the above situation, in order to overcome the defects of the prior art, the purpose of the present invention is to provide a cleaning device for manufacturing semiconductor ceramic wafers, which has the advantage of solving the inefficiency problem existing in the prior cleaning technology. The device achieves efficient and thorough cleaning of the surface of the semiconductor ceramic wafer through a physical cleaning method.

[0004] The above technical objectives of the present invention are achieved through the following technical solutions: A cleaning device for manufacturing semiconductor ceramic wafers, comprising a cleaning box, a box door is hinged on the outside of the cleaning box, a moving groove is provided at the bottom of the cleaning box, a moving block is slidably matched in the moving groove, a pushing assembly for driving the moving block to move left and right is provided in the moving groove, the top of the moving block extends to the outside of the moving groove, a placement plate is fixedly connected to the top of the extended end of the moving block, an adsorption assembly is provided on the upper surface of the placement plate, a first installation groove, a second installation groove and a third installation groove are provided at equal intervals in the top of the cleaning box from left to right, a dust removal and anti-static assembly is provided in the first installation groove, the dust removal and anti-static assembly comprises a first lifting cylinder arranged in the first installation groove, a first lifting plate is fixedly connected to the bottom of the output end of the first lifting cylinder, a first bracket is provided at the bottom of the first lifting plate, a stable seat is fixedly connected between the two sides of the top of the first bracket and the first lifting plate, a rotating shaft is rotatably connected to the bottom of the first bracket, one end of the rotating shaft is connected to a servo motor through a coupling, a sponge is fixedly connected to the outside of the rotating shaft, an anti-static dust cloth is fixedly connected to the outside of the sponge, a flushing assembly is provided in the second installation groove, and a drying assembly is provided in the third installation groove.

[0005] By adopting the above technical solution, during operation, the operator places the ceramic piece on the upper surface of the placement plate, and fixes the ceramic piece by adsorption through the cooperation of the adsorption component. Then, the operator turns on the push component according to the operation requirements, and cooperates to push the moving block and the ceramic piece on the moving block horizontally from left to right through the first installation slot, the second installation slot and the third installation slot. When passing under the first installation slot, the operator turns on the first lifting cylinder according to the operation requirements, and cooperates with the output end to lift the first lifting plate and the first bracket at the bottom of the first lifting plate up and down to a suitable operating height until the anti-static dust removal at the bottom of the first bracket is The cloth contacts the surface of the ceramic piece. At this time, the operator turns on the servo motor to drive the shaft to rotate, so as to cooperate with the sponge on the outside of the shaft and the anti-static dust cloth to remove dust and static electricity from the surface of the ceramic piece. After completing the dust removal and anti-static operations, the operator turns on the first lifting cylinder and cooperates with the first lifting plate to raise the first bracket and other components to a suitable height. When the moving block and the ceramic piece on the moving block pass under the second mounting groove, the surface of the ceramic piece is further rinsed through the flushing component arranged in the second mounting groove. After completing the flushing operation, the surface of the ceramic piece is dried through the blow-drying component under the third mounting groove.

[0006] Further configuration: the adsorption component includes a suction cup arranged on the upper surface of the placement plate, one end of the suction cup is connected to a connecting pipe, the other end of the connecting pipe is connected to a vacuum generator, and the vacuum generator is fixedly connected to one side of the extension end of the moving block.

[0007] By adopting the above technical solution, during operation, the operator places the ceramic piece on the suction cup on the upper surface of the placement plate. At this time, the operator turns on the vacuum generator, and through the cooperation of the connecting pipe, the air in the suction cup is vacuumed to form a negative pressure. When the negative pressure adsorption force is greater than the contact force between the object and the surface, the ceramic piece will be tightly adsorbed on the suction cup.

[0008] Further configuration: the flushing component includes a second lifting cylinder arranged in a second mounting groove, a second lifting plate is fixedly connected to the bottom of the output end of the second lifting cylinder, a second bracket is fixedly connected to the bottom of the second lifting plate, a flushing pipe is fixedly connected to the bottom of the second bracket, a plurality of water outlets are provided at the bottom of the flushing pipe, a plurality of water outlets are connected to atomizing nozzles, one end of the flushing pipe is connected to a water receiving pipe, the other end of the water receiving pipe extends to the outside of the cleaning box, an extended end of the water receiving pipe is connected to a water tank, a water pump is placed in the water tank, and the extended end of the water receiving pipe is connected to the water outlet end of the water pump.

[0009] By adopting the above technical solution, when the ceramic piece passes under the second installation groove, the operator starts the second lifting cylinder according to the operation requirements, and cooperates with the second lifting plate at the output end to lift the second bracket up and down to a suitable height. Then the operator starts the water pump to pump the deionized water in the water tank to the water receiving pipe. Through the cooperation of the flushing pipe and the atomizing nozzle, the atomization cleaning operation of the surface of the ceramic piece is completed. The atomization spray cleaning can form tiny droplets, increase the contact area between the cleaning liquid and the surface of the semiconductor ceramic piece, thereby improving the cleaning effect. At the same time, the tiny droplets can penetrate into tiny gaps that are difficult to clean, which helps to remove stubborn stains. The use of deionized water for cleaning can effectively remove ions and organic matter on the surface and reduce damage to the ceramic piece. In addition, deionized water will not introduce new metal ions or other impurities, thereby ensuring the purity and performance of the ceramic piece. ‌ Further configuration: the blow-drying component includes a third lifting cylinder arranged in a third mounting groove, a third lifting plate is fixedly connected to the bottom of the output end of the third lifting cylinder, a third bracket is fixedly connected to the bottom of the third lifting plate, a high-pressure air blowing pipe is provided at the bottom of the third bracket, a plurality of air blowing holes are opened at the bottom of the high-pressure air blowing pipe, and the plurality of air blowing holes are all connected to an air nozzle, one end of the high-pressure air blowing pipe is connected to a high-pressure air supply pipe, the other end of the high-pressure air supply pipe extends to the outside of the cleaning box, and the extended end of the high-pressure air supply pipe is connected to a high-pressure air pump.

[0010] By adopting the above technical solution, after the atomization spray cleaning operation is completed, the ceramic piece passes under the third installation groove. At this time, the operator turns on the third lifting cylinder according to the operation requirements, and cooperates with the third lifting plate at the bottom of the output end to lift the third bracket up and down to an appropriate height. Then the operator turns on the high-pressure vacuum pump to suck in and compress the air, which enters the high-pressure blowing pipe through the high-pressure air supply pipe, and completes the high-pressure blowing cleaning operation on the surface of the ceramic piece through multiple air nozzles at the bottom of the high-pressure blowing pipe, thereby drying the atomized water droplets remaining on the surface of the ceramic piece, and at the same time blowing away other fine particles to ensure the cleanliness of the ceramic piece.

[0011] Further configuration: a transparent observation window is provided on the outer side of the box door.

[0012] By adopting the above technical solution, the transparent observation window is provided to facilitate the operator to observe the cleaning operation.

[0013] Further configuration: the pushing assembly includes fixed seats arranged on both sides of the moving groove, a screw rod is rotatably connected between the fixed seats, the moving block is matched and connected to the outside of the screw rod, one end of the screw rod extends to the outside of the moving groove, and the extended end of the screw rod is connected to a driving motor through a coupling.

[0014] By adopting the above technical solution, during operation, the operator turns on the drive motor according to the operation requirements to drive the screw to rotate. At this time, the moving block on the screw and other components on the moving block cooperate with the moving groove to move horizontally left and right, and cooperate with other components to complete the cleaning operation.

[0015] In summary, the present invention has the following beneficial effects: The present invention is equipped with a dust removal and anti-static component. When the ceramic sheet passes under the first installation groove, the operator starts the first lifting cylinder according to the operation requirements, and cooperates with the output end to lift the first lifting plate and the first bracket at the bottom of the first lifting plate up and down to a suitable working height, until the anti-static dust cloth at the bottom of the first bracket contacts the surface of the ceramic sheet. At this time, the operator starts the servo motor to drive the rotating shaft to rotate, so as to cooperate with the sponge on the outside of the rotating shaft and the anti-static dust cloth to remove dust and static electricity from the surface of the ceramic sheet.

[0016] The present invention has a flushing component. When the ceramic piece passes under the second mounting groove, the operator turns on the second lifting cylinder according to the operation requirements, and cooperates with the second lifting plate at the output end to lift the second bracket up and down to a suitable height. Then the operator turns on the water pump to pump the deionized water in the water tank to the water receiving pipe. Through the cooperation of the flushing pipe and the atomizing nozzle, the atomization cleaning operation of the surface of the ceramic piece is completed. The atomization spray cleaning can form tiny droplets, increase the contact area between the cleaning liquid and the surface of the semiconductor ceramic piece, thereby improving the cleaning effect. At the same time, the tiny droplets can penetrate into tiny gaps that are difficult to clean, which helps to remove stubborn stains. The use of deionized water for cleaning can effectively remove ions and organic matter on the surface and reduce damage to the ceramic piece. In addition, deionized water will not introduce new metal ions or other impurities, thereby ensuring the purity and performance of the ceramic piece.

[0017] The present invention has a blow-drying component. After the atomizing spray cleaning operation is completed, the ceramic piece passes under the third mounting groove. At this time, the operator turns on the third lifting cylinder according to the operation requirements, and cooperates with the third lifting plate at the bottom of the output end to lift the third bracket up and down to a suitable height. Then the operator turns on the high-pressure vacuum pump to suck in and compress the air, which enters the high-pressure blowing pipe through the high-pressure air supply pipe, and completes the high-pressure blowing cleaning operation on the surface of the ceramic piece through multiple air nozzles at the bottom of the high-pressure blowing pipe, thereby drying the atomized water droplets remaining on the surface of the ceramic piece, and at the same time blowing away other fine particles to ensure the cleanliness of the ceramic piece. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application, but do not constitute an improper limitation of the present invention. In the drawings: Figure 1 It is a front view of the present invention; Figure 2It is a main structural schematic diagram of the present invention.

[0019] In the figure, 1, cleaning box; 2, box door; 3, moving slot; 4, moving block; 5, pushing assembly; 6, placing plate; 7, adsorption assembly; 8, first mounting slot; 9, second mounting slot; 10, third mounting slot; 11, dust removal and antistatic assembly; 12, first lifting cylinder; 13, first lifting plate; 14, first bracket; 15, stable seat; 16, rotating shaft; 17, servo motor; 18, sponge; 19, antistatic dust cloth; 20, flushing assembly; 21, drying assembly; 22, suction cup; 23, connecting pipe; 24. Vacuum generator; 25. Second lifting cylinder; 26. Second lifting plate; 27. Second bracket; 28. Flushing pipe; 29. ​​Water outlet; 30. Atomizing nozzle; 31. Water connecting pipe; 32. Water tank; 33. Water pump; 34. Third lifting cylinder; 35. Third lifting plate; 36. Third bracket; 37. High-pressure air blowing pipe; 38. Air blowing hole; 39. Air nozzle; 40. High-pressure air supply pipe; 41. High-pressure air pump; 42. Transparent observation window; 43. Fixed seat; 44. Screw rod; 45. Drive motor. DETAILED DESCRIPTION

[0020] The above and other technical contents, features and effects of the present invention are described in detail below with reference to the attached Figure 1 To Attachment Figure 2 The detailed description of the embodiments will clearly show that the structural contents mentioned in the following embodiments are all based on the drawings in the specification.

[0021] Exemplary embodiments of the present invention will be described below with reference to the accompanying drawings.

[0022] Embodiment 1: A cleaning device for manufacturing a semiconductor ceramic wafer, such as Figure 1 , 2As shown, it includes a cleaning box 1, a box door 2 is hinged on the outside of the cleaning box 1, a transparent observation window 42 is opened on the outside of the box door 2, a moving groove 3 is opened at the bottom of the cleaning box 1, a moving block 4 is slidably matched in the moving groove 3, and a pushing component 5 for driving the moving block 4 to move left and right is provided in the moving groove 3, the pushing component 5 includes fixed seats 43 arranged on both sides of the moving groove 3, and a screw rod 44 is rotatably connected between the fixed seats 43, the moving block 4 is matched and connected to the outside of the screw rod 44, one end of the screw rod 44 extends to the outside of the moving groove 3, and the extended end of the screw rod 44 is connected to a driving motor 45 through a coupling, the top of the moving block 4 extends to the outside of the moving groove 3, and the top of the extended end of the moving block 4 is fixedly connected to a placement plate 6, and an adsorption component 7 is provided on the upper surface of the placement plate 6, and the adsorption component 7 includes a suction cup 22 arranged on the upper surface of the placement plate 6, and one end of the suction cup 22 is connected to a connecting pipe 23, and the connecting pipe 2 The other end is connected with a vacuum generator 24, which is fixedly connected to one side of the extended end of the moving block 4. The top of the cleaning box 1 is provided with a first mounting groove 8, a second mounting groove 9, and a third mounting groove 10 arranged at equal intervals from left to right. The first mounting groove 8 is provided with a dust removal and anti-static component 11. The dust removal and anti-static component 11 includes a first lifting cylinder 12 arranged in the first mounting groove 8. The bottom of the output end of the first lifting cylinder 12 is fixedly connected with a first lifting plate 13. The bottom of the first lifting plate 13 is provided with a first bracket 14. The top sides of the first bracket 14 are fixedly connected with a stabilizing seat 15 between the first lifting plate 13 and the two sides. The bottom of the first bracket 14 is rotatably connected with a rotating shaft 16. One end of the rotating shaft 16 is connected with a screw rod 44 through a coupling. The outer side of the rotating shaft 16 is fixedly connected with a sponge 18, and the outer side of the sponge 18 is fixedly connected with an anti-static dust cloth 19.

[0023] like Figure 1 As shown, a flushing assembly 20 is provided in the second mounting groove 9, and the flushing assembly 20 includes a second lifting cylinder 25 arranged in the second mounting groove 9, a second lifting plate 26 is fixedly connected to the bottom of the output end of the second lifting cylinder 25, a second bracket 27 is fixedly connected to the bottom of the second lifting plate 26, a flushing pipe 28 is fixedly connected to the bottom of the second bracket 27, a plurality of water outlets 29 are provided at the bottom of the flushing pipe 28, and a plurality of water outlets 29 are connected to atomizing nozzles 30, one end of the flushing pipe 28 is connected to a water receiving pipe 31, and the other end of the water receiving pipe 31 extends to the outside of the cleaning box 1, an extended end of the water receiving pipe 31 is connected to a water tank 32, a water pump 33 is placed in the water tank 32, and an extended end of the water receiving pipe 31 is connected to the water outlet end of the water pump 33.

[0024] like Figure 1As shown, the third mounting groove 10 is provided with a blow-drying component 21, and the blow-drying component 21 includes a third lifting cylinder 34 arranged in the third mounting groove 10, and the third lifting plate 35 is fixedly connected to the bottom of the output end of the third lifting cylinder 34, and the third bracket 36 is fixedly connected to the bottom of the third lifting plate 35. A high-pressure blowing pipe 37 is provided at the bottom of the third bracket 36, and a plurality of blowing holes 38 are opened at the bottom of the high-pressure blowing pipe 37. The plurality of blowing holes 38 are all connected to an air nozzle 39, and one end of the high-pressure blowing pipe 37 is connected to a high-pressure air supply pipe 40, and the other end of the high-pressure air supply pipe 40 extends to the outside of the cleaning box 1, and the extending end of the high-pressure air supply pipe 40 is connected to a high-pressure vacuum pump 41.

[0025] In the embodiment of the present invention, during operation, the operator places the ceramic piece on the suction cup 22 on the upper surface of the placement plate 6. At this time, the operator turns on the vacuum generator 24, and through the cooperation of the connecting pipe 23, the air in the suction cup 22 is vacuumed to form a negative pressure. When the negative pressure adsorption force is greater than the contact force between the object and the surface, the ceramic piece will be tightly adsorbed on the suction cup 22. Then the operator turns on the driving motor 45 according to the operation requirements to drive the screw 44 to rotate. At this time, the moving block 4 on the screw 44 and the ceramic piece on the moving block 4 cooperate with the moving groove 3 to move horizontally from left to right through the first Below the first installation slot 8, the second installation slot 9 and the third installation slot 10, when passing below the first installation slot 8, the operator turns on the first lifting cylinder 12 according to the operation requirements, and cooperates with the output end to lift the first lifting plate 13 and the first bracket 14 at the bottom of the first lifting plate 13 up and down to a suitable operating height, until the antistatic dust cloth 19 at the bottom of the first bracket 14 contacts the surface of the ceramic sheet. At this time, the operator turns on the servo motor 17 to drive the rotating shaft 16 to rotate, so as to cooperate with the sponge 18 on the outside of the rotating shaft 16 and the antistatic dust cloth 19 to remove dust and static electricity from the surface of the ceramic sheet; When the ceramic piece passes under the second mounting groove 9, the operator turns on the second lifting cylinder 25 according to the operation requirements, and cooperates with the second lifting plate 26 at the output end to lift the second bracket 27 up and down to a suitable height. Then the operator turns on the water pump 33 to pump the deionized water in the water tank 32 to the water receiving pipe 31, and completes the atomization cleaning operation on the surface of the ceramic piece through the cooperation of the flushing pipe 28 and the atomizing nozzle 30. The atomization spray cleaning can form tiny droplets, increase the contact area between the cleaning liquid and the surface of the semiconductor ceramic piece, thereby improving the cleaning effect. At the same time, the tiny droplets can penetrate into the tiny gaps that are difficult to clean, which helps to remove stubborn stains. The use of deionized water for cleaning can effectively remove ions and organic matter on the surface and reduce damage to the ceramic piece. In addition, deionized water will not introduce new metal ions or other impurities, thereby ensuring the purity and performance of the ceramic piece. After the atomization spray cleaning operation is completed, the ceramic piece passes under the third mounting slot 10. At this time, the operator turns on the third lifting cylinder 34 according to the operation requirements, and cooperates with the third lifting plate 35 at the bottom of the output end to lift the third bracket 36 up and down to a suitable height. Then the operator turns on the high-pressure vacuum pump 41 to suck in and compress the air, which enters the high-pressure blowing pipe 37 through the high-pressure air supply pipe 40, and completes the high-pressure blowing cleaning operation on the surface of the ceramic piece through multiple air nozzles 39 at the bottom of the high-pressure blowing pipe 37, thereby drying the atomized water droplets remaining on the surface of the ceramic piece, and at the same time blowing away other fine particles to ensure the cleanliness of the ceramic piece.

[0026] The above is a further detailed description of the present invention in combination with a specific implementation method, and it cannot be determined that the specific implementation of the present invention is limited to this; for technical personnel in the technical field to which the present invention belongs and related technical fields, based on the technical solution of the present invention, the expansion and replacement of operating methods and data should all fall within the protection scope of the present invention.

Claims

1. A cleaning device for manufacturing semiconductor ceramic wafers, comprising a cleaning box (1), characterized in that: The cleaning box (1) is hingedly provided with a box door (2) on the outside, the cleaning box (1) is provided with a moving groove (3) at the bottom, a moving block (4) is slidably fitted in the moving groove (3), a pushing assembly (5) for driving the moving block (4) to move left and right is provided in the moving groove (3), the top of the moving block (4) extends to the outside of the moving groove (3), a placement plate (6) is fixedly connected to the top of the extended end of the moving block (4), an adsorption assembly (7) is provided on the upper surface of the placement plate (6), the top of the cleaning box (1) is provided with a first installation groove (8), a second installation groove (9), and a third installation groove (10) which are arranged at equal intervals from left to right, the first installation groove (8) is provided with a dust removal and antistatic assembly (11), and the dust removal and antistatic assembly (11) includes an assembly arranged at A first lifting cylinder (12) is in the first installation groove (8), the output end bottom of the first lifting cylinder (12) is fixedly connected to a first lifting plate (13), the first lifting plate (13) is provided with a first bracket (14) at the bottom, the top two sides of the first bracket (14) are fixedly connected to a stabilizing seat (15) between the first lifting plate (13), the bottom of the first bracket (14) is rotatably connected to a rotating shaft (16), one end of the rotating shaft (16) is connected to a screw rod (44) through a coupling, a sponge (18) is fixedly connected to the outside of the rotating shaft (16), and an anti-static dust removal cloth (19) is fixedly connected to the outside of the sponge (18), a flushing component (20) is provided in the second installation groove (9), and a drying component (21) is provided in the third installation groove (10).

2. A cleaning device for manufacturing semiconductor ceramic wafers according to claim 1, characterized in that: The adsorption assembly (7) comprises a suction cup (22) arranged on the upper surface of the placement plate (6); one end of the suction cup (22) is connected to a connecting pipe (23); the other end of the connecting pipe (23) is connected to a vacuum generator (24); and the vacuum generator (24) is fixedly connected to one side of the extension end of the moving block (4).

3. A cleaning device for manufacturing semiconductor ceramic wafers according to claim 1, characterized in that: The flushing assembly (20) comprises a second lifting cylinder (25) arranged in a second mounting groove (9); a second lifting plate (26) is fixedly connected to the bottom of the output end of the second lifting cylinder (25); a second bracket (27) is fixedly connected to the bottom of the second lifting plate (26); a flushing pipe (28) is fixedly connected to the bottom of the second bracket (27); a plurality of water outlets (29) are provided at the bottom of the flushing pipe (28); each of the plurality of water outlets (29) is connected to an atomizing nozzle (30); one end of the flushing pipe (28) is connected to a water receiving pipe (31); the other end of the water receiving pipe (31) extends to the outside of the cleaning box (1); an extended end of the water receiving pipe (31) is connected to a water tank (32); a water pump (33) is placed in the water tank (32); and an extended end of the water receiving pipe (31) is connected to the water outlet end of the water pump (33).

4. A cleaning device for manufacturing semiconductor ceramic wafers according to claim 1, characterized in that: The blow-drying assembly (21) comprises a third lifting cylinder (34) arranged in a third mounting groove (10); a third lifting plate (35) is fixedly connected to the bottom of the output end of the third lifting cylinder (34); a third bracket (36) is fixedly connected to the bottom of the third lifting plate (35); a high-pressure air blowing pipe (37) is provided at the bottom of the third bracket (36); a plurality of air blowing holes (38) are provided at the bottom of the high-pressure air blowing pipe (37); the plurality of air blowing holes (38) are all connected to an air nozzle (39); one end of the high-pressure air blowing pipe (37) is connected to a high-pressure air supply pipe (40); the other end of the high-pressure air supply pipe (40) extends to the outside of the cleaning box (1); and the extended end of the high-pressure air supply pipe (40) is connected to a high-pressure air pump (41).

5. A cleaning device for manufacturing semiconductor ceramic wafers according to claim 1, characterized in that: A transparent observation window (42) is provided on the outer side of the box door (2).

6. A cleaning device for manufacturing semiconductor ceramic wafers according to claim 1, characterized in that: The push assembly (5) comprises fixed seats (43) arranged on both sides of the movable groove (3), a screw rod (44) is rotatably connected between the fixed seats (43), the movable block (4) is matched and connected to the outside of the screw rod (44), one end of the screw rod (44) extends to the outside of the movable groove (3), and the extended end of the screw rod (44) is connected to a driving motor (45) via a coupling.

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