Power-on cutting jig and cutting method

By designing a power-on cutting tool, the memory alloy wire of the integrated substrate of the OIS module is energized by using the PIN needle mold to straighten it, which solves the problems of memory alloy wire damage and high-temperature treatment safety risks during laser cutting. Improve cutting efficiency and production capacity.

CN119457483APending Publication Date: 2025-02-18GALAXYCORE SHANGHAI
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Patent Information

Application Number
CN202411778202.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2025-02-18

AI Technical Summary

Technical Problem

When laser cutting of the integrated substrate of the OIS module, the memory alloy wire will cause position interference between the cutting position and the memory alloy wire in a relaxed state, causing memory alloy wire damage. The existing process requires a high-temperature platform to straighten the memory alloy wire. , inefficient and security risks.

Method used

Design a power-on cutting tool to energize the memory alloy wire of the product to be cut through the PIN needle mold to straighten it and avoid high temperature treatment.

Benefits of technology

By powering on, the memory alloy wire is straightened, which solves the problem of memory alloy wire damage during laser cutting, avoids the safety risks of high-temperature treatment, and improves cutting efficiency and production capacity.

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Abstract

The invention discloses a power-on cutting jig and a cutting method, and the power-on cutting jig comprises a power-on jig and at least one PIN needle die which is arranged on the power-on jig and is electrically connected with memory alloy wires of a plurality of products to be cut and the power-on jig; wherein the product to be cut is an integrated substrate of the OIS module; and the electrifying jig is used for electrifying the memory alloy wire of the to-be-cut product through the PIN needle mold, so that the memory alloy wire is straightened. The processing technology can be simplified, the laser cutting difficulty is reduced, and the product reliability is improved.
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Description

Technical Field

[0001] The present invention relates to the field of precision manufacturing technology, and in particular to an electric cutting jig and a cutting method. Background Art

[0002] In smart devices such as mobile phones, camera modules with optical image stabilization functions are becoming more and more common.

[0003] The optical image stabilization module (OIS module) provided in the camera module generally includes an integrated substrate, which includes a fixed substrate and a movable substrate that can be partially disconnected, and a memory alloy wire connected to the fixed substrate and the movable substrate respectively. After the integrated substrate completes the relevant assembly process, the fixed substrate and the movable substrate need to be separated by laser cutting. There is position interference between the cutting position and the memory alloy wire. At room temperature, the memory alloy is loose and the position is not fixed. The memory alloy wire will be damaged when the laser cuts the product.

[0004] In order to avoid damage to the memory alloy during laser cutting, the memory alloy wire needs to be straightened and fixed. The existing process is to straighten the memory alloy wire by heating it to 80°C. The integrated substrate needs to be placed on a high-temperature platform at 80°C (when the platform is 80°C, it takes 45 seconds for a 1.2mm thick product memory alloy to go from relaxation to straightening). The thickness of the integrated substrate will directly affect the time it takes for the memory alloy to go from relaxation to straightening, which is inefficient. There are also certain safety risks in high-temperature environments. Summary of the invention

[0005] The purpose of the present invention is to provide an electric cutting jig and a cutting method, so as to simplify the processing technology, reduce the difficulty of laser cutting, improve the production capacity and reduce the installation risk.

[0006] In order to achieve the above objectives, the present invention is implemented by the following technical solutions:

[0007] A power-on cutting jig comprises: a power-on jig and at least one PIN needle mold, which is arranged on the power-on jig and is electrically connected to a plurality of memory alloy wires of products to be cut and the power-on jig respectively; wherein the products to be cut are integrated substrates of an OIS module; the power-on jig is used to energize the memory alloy wires of the products to be cut through the PIN needle mold to straighten the memory alloy wires.

[0008] Optionally, the power-on fixture includes: a positioning base plate, on which a first positioning groove and a second positioning groove are provided; the first positioning groove is used to accommodate and position the product to be cut; the second positioning groove is used to accommodate and position the PIN needle mold; at least one adapter plate is arranged on the positioning base plate and is electrically connected to the PIN needle mold; the adapter plate is used to energize the memory alloy wire through the PIN needle mold according to the received control signal.

[0009] Optionally, a third positioning groove is provided on the positioning base plate, and the third positioning groove is located below the second positioning groove; the third positioning groove is used to accommodate and position the adapter plate.

[0010] Optionally, it further includes: a pressing plate, which is covered on the positioning base plate and is used to press the product to be cut on the positioning base plate so that the memory alloy wire of the product to be cut is effectively in contact with the PIN needle mold.

[0011] Optionally, a plurality of cutting windows are provided on the pressing plate, and each of the cutting windows is directly opposite to the corresponding integrated substrate of the product to be cut, so that the cutting position of the integrated substrate can be cut through the cutting window.

[0012] Optionally, the PIN needle mold includes a probe fixing block, and a plurality of probes (PIN needles) arranged on the probe fixing block; the probes are in contact with pads of the memory alloy wires on the corresponding integrated substrate.

[0013] Optionally, a plurality of fixing holes are respectively provided at the edges of the pressing plate and the positioning base plate, and a fastening connection between the pressing plate and the positioning base plate is achieved through corresponding fixing members and the fixing holes.

[0014] On the other hand, the present invention also provides a product cutting method, which is implemented by using the power-on cutting jig as described above, placing several products to be cut on the power-on jig in turn, and making effective contact with the PIN needle mold; starting the power-on jig to power on the memory alloy wire of the product to be cut through the PIN needle mold, and the memory alloy wire of all the products to be cut is straightened and fixed; then all the products to be cut are laser cut.

[0015] Optionally, the products to be cut are placed on the positioning base plate in sequence, and then the pressing plate is placed above the products to be cut and is tightly connected to the positioning base plate to achieve effective contact between the pads of the memory alloy wires of the products to be cut and the probes of the PIN needle mold. Then, the adapter plate is powered on to straighten and fix the memory alloy wires of all the products to be cut. After that, the cutting positions of the integrated substrates of all the products to be cut are laser cut through the cutting window on the pressing plate.

[0016] Optionally, the time for the memory alloy wires of all the products to be cut to be stretched and fixed is less than or equal to 1 second.

[0017] The present invention has at least the following technical effects:

[0018] The electric cutting jig provided by the present invention energizes the memory alloy wire of the product to be cut so as to straighten the memory alloy wire, thereby solving the problem that the memory alloy wire is damaged when the product is subsequently cut because the cutting position and the memory alloy wire interfere with each other when the memory alloy wire is in a relaxed state. Furthermore, since the memory alloy wire is transformed from a relaxed state to a straightened state by energizing, the product to be cut can be prevented from being in a high temperature environment, preventing the high temperature from damaging the components of the product to be cut and causing safety risks.

[0019] In addition, by energizing the memory alloy wire to change from a relaxed state to a stretched state, the memory alloy wires of all products to be cut can be stretched and fixed instantly (for example, less than or equal to 1 second), thereby improving cutting efficiency and productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of a partial cross-sectional structure of an electric cutting fixture provided by one embodiment of the present invention;

[0021] Figure 2 A schematic structural diagram of an integrated substrate to be cut provided in one embodiment of the present invention;

[0022] Figure 3 A schematic diagram of the overall structure of an electric cutting fixture provided by an embodiment of the present invention;

[0023] Figure 4 A schematic diagram of the structure of a positioning base plate provided by an embodiment of the present invention;

[0024] Figure 5 A schematic diagram of the structure of a pressing plate provided in one embodiment of the present invention;

[0025] Figure 6 A schematic diagram of the structure of a PIN needle mold provided by an embodiment of the present invention;

[0026] Figure 7 A schematic structural diagram of an adapter plate provided in one embodiment of the present invention. DETAILED DESCRIPTION

[0027] The following is a further detailed description of an electric cutting fixture and a cutting method proposed by the present invention in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that can be produced by the present invention and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0028] like Figure 1 As shown, this embodiment provides an electric cutting fixture, including: an electric fixture 20; at least one PIN needle mold 30, which is arranged on the electric fixture 20 and is electrically connected to a plurality of memory alloy wires (not shown in the figure) of the products 10 to be cut and the electric fixture 20; wherein the product to be cut is an integrated substrate of the OIS module (refer to Figure 2 The power-on fixture 20 is used to energize the memory alloy wire of the product to be cut 10 through the PIN needle mold 30 to straighten the memory alloy wire.

[0029] like Figure 2 As shown, the OIS module provided in the camera module generally includes an integrated substrate 11, which includes a fixed substrate 12 and a movable substrate 13 that can be partially disconnected, and memory alloy wires respectively connected to the fixed substrate 12 and the movable substrate 13. After the integrated substrate 11 completes the relevant assembly process, the fixed substrate 12 and the movable substrate 13 need to be laser cut and separated, and there are multiple cutting positions 14, which are located near the memory alloy wire. At room temperature, the memory alloy wire is loose and the position is not fixed. Directly cutting the cutting position 14 may damage the memory alloy wire.

[0030] The electric cutting fixture provided in this embodiment has a simple structure, and the memory alloy wire of the product to be cut is electrified to make the memory alloy wire straight, thereby solving the problem that the memory alloy wire is damaged when the product is cut later due to interference between the cutting position and the memory alloy wire when the memory alloy wire is in a relaxed state. And because the memory alloy wire is transformed from a relaxed state to a straightened state by electrification, the product to be cut can be prevented from being in a high temperature environment, preventing the high temperature from damaging the components of the product to be cut and causing safety risks.

[0031] In this embodiment, if Figure 3 and Figure 4 As shown, the power-on fixture 20 includes: a positioning base plate 41, on which a first positioning groove 412 and a second positioning groove 413 are provided; the first positioning groove 412 is used to accommodate and position the product 10 to be cut; the second positioning groove 413 is used to accommodate and position the PIN needle mold 30; at least one adapter plate 50 is arranged on the positioning base plate 41, which is electrically connected to the PIN needle mold 30; the adapter plate 50 is used to energize the memory alloy wire through the PIN needle mold 30 according to the received control signal.

[0032] Please continue to refer to Figure 4 As shown, a third positioning groove 414 is provided on the positioning base plate 41 , and the third positioning groove 414 is located below the second positioning groove 413 ; the third positioning groove 414 is used to accommodate and position the adapter plate 50 .

[0033] In this embodiment, if Figure 5 As shown, the upper electric cutting fixture also includes: a pressing plate 40, which is covered on the positioning base plate 41 and is used to press the product 10 to be cut on the positioning base plate 41 so that the memory alloy wire of the product 10 to be cut is effectively in contact with the PIN needle mold 30 (i.e., ensuring that the memory alloy wire is electrically conductive).

[0034] In this embodiment, please continue to refer to Figure 5 As shown, the pressing plate 40 is provided with a plurality of cutting windows 401 , and each of the cutting windows 401 is directly opposite to the corresponding integrated substrate of the product 10 to be cut, so that the cutting position 14 of the integrated substrate can be cut through the cutting window 401 .

[0035] Combination Figure 4 and Figure 5 As shown, the edges of the pressing plate 40 and the positioning base plate 41 are respectively provided with a plurality of fixing holes (refer to Figure 4 Winning bid number 411 and Figure 5 As shown in the figure by reference numeral 402, the fastening connection between the pressing plate 40 and the positioning base plate 41 is achieved through corresponding fixing members and the fixing holes.

[0036] Specifically, the pressure plate 40 is provided with a first fixing hole 402, and the positioning base plate 41 is provided with a second fixing hole 411 opposite to the first fixing hole 402. When the pressure plate 40 is covered on the positioning base plate 41, the first fixing hole 402 and the second fixing hole 411 are aligned, and the pressure plate 40 and the positioning base plate 41 are fastened by screws passing through the first fixing hole 402 and the second fixing hole 411.

[0037] Optionally, the pressing plate 40 may be made of stainless steel, which is easy to prepare.

[0038] In this embodiment or some other embodiments, please continue to refer to Figure 4 As shown, the positioning base plate 41 is also provided with a third fixing hole 410, and the pressure plate 40 is provided with a blind hole opposite to it (not shown in the figure). A screw penetrates the third fixing hole 410 and stops in the corresponding blind hole to achieve a fastening connection between the pressure plate 40 and the positioning base plate 41.

[0039] The main function of the positioning base plate 41 is to effectively position the product to be cut so that the PAD point of the product to be cut can be effectively aligned with the probe of the PIN needle mold 30 .

[0040] In this embodiment, if Figure 6 As shown, the PIN needle mold 30 includes a probe fixing block 31, and a plurality of probes 32 arranged on the probe fixing block 31; the probes 32 are connected to the corresponding pads ( Figure 2 (not shown) contact.

[0041] In this embodiment, please continue to refer to Figure 4 and Figure 6 As shown, a positioning hole 311 and a fourth fixing hole 310 are also provided on the edge of the probe fixing block 31; and a positioning guide rod and a fastening hole corresponding thereto are provided on the second positioning groove 413. When the PIN needle mold 30 is installed on the positioning base plate 41, the probe fixing block 31 is placed in the second positioning groove 413, and the positioning guide rod penetrates the positioning hole 311 to realize the positioning of the probe fixing block 31, and the corresponding fastener penetrates the fastening hole and the fourth fixing hole 310 to realize the fixing of the probe fixing block 31 on the second positioning groove 413, thereby realizing the installation of the PIN needle mold 30.

[0042] In this embodiment or some other embodiments, as Figure 7 As shown, the adapter board 50 includes a PCB board 51, and a control circuit 52 disposed on the PCB board 51 and connected to an external power source;

[0043] and an electrode pin 53 connected to the control circuit 52, the electrode pin 53 being electrically connected to the probe 32. The PCB board 51 is also provided with a mounting hole 54, through which the adapter board 50 is fixed in the corresponding third positioning groove 414. It can be understood that the control circuit 52 can achieve the purpose of controlling the power supply of the PIN needle mold according to the control signal input from the outside, and the present invention does not limit its specific logic circuit structure.

[0044] In this embodiment or some other embodiments, the adapter plate 50 and the PIN needle mold 30 are multiple and the number is the same as the number of the first positioning grooves 412 on the positioning base plate 41, for example, four, and the adapter plate 50 and the PIN needle mold 30 are arranged one by one. In this way, multiple products 10 to be cut can be processed at the same time, for example, four products 10 to be cut can be electrically cut at the same time, which can improve the production efficiency of the product.

[0045] On the other hand, the present embodiment also provides a method for cutting a product, which is implemented by using the power-on cutting jig as described above, placing several products to be cut on the power-on jig in turn, and making effective contact with the PIN needle mold; starting the power-on jig to power on the memory alloy wire of the product to be cut through the PIN needle mold, and the memory alloy wire of all the products to be cut is straightened and fixed; then all the products to be cut are laser cut.

[0046] In this embodiment, the products to be cut are placed on the positioning base plate in sequence, and then the pressing plate is placed above the products to be cut and is tightly connected to the positioning base plate to achieve effective contact between the pads of the memory alloy wires of the products to be cut and the probes of the PIN needle mold. Then, the adapter plate is powered on to straighten and fix the memory alloy wires of all the products to be cut. After that, the cutting positions of the integrated substrates of all the products to be cut are laser cut through the cutting window on the pressing plate.

[0047] In this embodiment, the time for the memory alloy wires of all the products to be cut to be straightened and fixed is less than or equal to 1 second.

[0048] It can be seen that in this embodiment, after the positioned product to be cut (the product to be cut placed in the first positioning groove) is pressed together with a pressing plate, the PAD and PIN needle of the product to be cut are effectively contacted, and then the PIN needle is energized through the adapter plate to drive the memory alloy wire to be powered on separately, so that the memory alloy wire can be quickly straightened within 1 second, thereby simplifying the processing technology, reducing the difficulty of laser cutting, making it more mass-producible, and making the product more reliable.

[0049] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0050] In the description of the present invention, it should be understood that the terms "center", "height", "thickness", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0051] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0053] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. An electric cutting jig, characterized in that: include: Power on the fixture, At least one PIN needle mold, which is arranged on the power-on fixture and is electrically connected to the memory alloy wires of a plurality of products to be cut and the power-on fixture respectively; wherein the products to be cut are integrated substrates of the OIS module; The power-on fixture is used to energize the memory alloy wire of the product to be cut through the PIN needle mold to straighten the memory alloy wire.

2. The electric cutting tool according to claim 1, characterized in that: The power-on fixture comprises: a positioning base plate, on which a first positioning groove and a second positioning groove are provided; The first positioning groove is used to accommodate and position the product to be cut; The second positioning groove is used to accommodate and position the PIN needle mold; At least one adapter plate is arranged on the positioning base plate and is electrically connected to the PIN needle mold; the adapter plate is used to energize the memory alloy wire through the PIN needle mold according to the received control signal.

3. The electric cutting tool according to claim 2, characterized in that: The positioning bottom plate is provided with a third positioning groove, and the third positioning groove is located below the second positioning groove; The third positioning groove is used to accommodate and position the adapter plate.

4. The electric cutting tool according to claim 3, characterized in that: Also includes: A pressing plate is covered on the positioning base plate and is used to press the product to be cut on the positioning base plate so that the memory alloy wire of the product to be cut is effectively in contact with the PIN needle mold.

5. The electric cutting tool according to claim 4, characterized in that: The pressing plate is provided with a plurality of cutting windows, each of which is directly opposite to the corresponding integrated substrate of the product to be cut, so that the cutting position of the integrated substrate can be cut through the cutting window.

6. The electric cutting tool according to claim 1, characterized in that: The PIN needle mold comprises a probe fixing block and a plurality of probes arranged on the probe fixing block; the probes are in contact with the pads of the memory alloy wires on the corresponding integrated substrate.

7. The electric cutting tool according to claim 4, characterized in that: A plurality of fixing holes are respectively arranged at the edges of the pressing plate and the positioning base plate, and a fastening connection between the pressing plate and the positioning base plate is achieved through corresponding fixing members and the fixing holes.

8. A method for cutting a product, characterized in that: The method is implemented by using the electric cutting jig as described in any one of claims 1 to 7. Placing a plurality of products to be cut on the power-on fixture in sequence, and making effective contact with the PIN needle mold; The power-on fixture is started to power on the memory alloy wire of the product to be cut through the PIN needle mold, and all the memory alloy wires of the product to be cut are straightened and fixed; Afterwards, all products to be cut are laser cut.

9. The method for cutting a product as claimed in claim 8, characterized in that: The products to be cut are sequentially placed on the positioning base plate, and then the pressing plate is placed above the products to be cut and is tightly connected to the positioning base plate, so that the pad of the memory alloy wire of the products to be cut is effectively contacted with the probe of the PIN needle mold; Then, the adapter board is powered on to straighten and fix all the memory alloy wires of the products to be cut; Afterwards, laser cutting is performed on the cutting positions of all the integrated substrates of the products to be cut through the cutting window on the pressing plate.

10. The method for cutting a product as claimed in claim 8, characterized in that: The time for straightening and fixing the memory alloy wires of all the products to be cut is less than or equal to 1 second.