Two-dimensional material wet transfer device and two-dimensional material wet transfer method

Abstract

The invention belongs to the technical field of two-dimensional material wet transfer, and discloses a two-dimensional material wet transfer device and a two-dimensional material wet transfer method. The two-dimensional material wet transfer device comprises a containing groove, a liquid inlet assembly and a liquid discharging assembly, an opening is formed in the top of the containing groove, a groove is formed in the bottom of the containing groove, the groove extends in the first direction, the first direction is the extending direction of the containing groove, the second direction is the width direction of the containing groove, and the second direction is perpendicular to the first direction; the width of the groove is larger than the maximum size of the original substrate in the second direction and smaller than the maximum size of the target substrate in the second direction; the liquid inlet assembly is arranged in or above one end of the containing groove and used for injecting liquid into the containing groove. The liquid discharging assembly is arranged at the other end of the containing groove and comprises a liquid discharging end, the liquid discharging end is arranged above the groove, and an opening in the side, close to the groove, of the liquid discharging end is flush with the highest liquid level face of the groove.

Description

Technical Field

[0001] The present invention relates to the technical field of two-dimensional material wet transfer, and in particular to a two-dimensional material wet transfer device and a two-dimensional material wet transfer method. Background Art

[0002] Two-dimensional material transfer is a technique that peels off a two-dimensional material (such as graphene or transition metal disulfide) from its original substrate (such as copper foil) and transfers it to a target substrate (such as silicon wafer, glass or polymer film). This technique has important applications in the fields of nanoelectronics, photonics and materials science. Common methods for transferring two-dimensional materials are: 1. Mechanical transfer method: Use tools such as tape to peel off the material from the original substrate and then transfer it to the target substrate. This method is suitable for relatively thick two-dimensional materials such as graphene; 2. Wet transfer: Adhere an original substrate containing a two-dimensional material on the surface to the target substrate, where the original substrate faces outward, and chemically etch the original substrate with an etching solution to achieve the transfer of the two-dimensional material from the original substrate to the target substrate. This method is suitable for the transfer of large-area two-dimensional materials; 3. Dry transfer: Use robotic arms or vacuum adsorption and other technologies to complete the transfer of two-dimensional materials in the absence of liquid media. This method can reduce residues and improve transfer quality.

[0003] In wet transfer, one of the important steps is to etch away the original substrate of the two-dimensional material (such as copper foil). After etching, the exposed two-dimensional material needs to be replaced by liquid, replacing the etching liquid with other wetting solvents, and the exposed two-dimensional material must never leave the liquid solvent (etching liquid or wetting solvent) to avoid surface tension destroying the two-dimensional material after leaving the liquid. Summary of the invention

[0004] The purpose of the present invention is to provide a two-dimensional material wet transfer device and a two-dimensional material wet transfer method to solve the problem of serious waste of replacement fluid in the prior art liquid replacement, improve the efficiency of liquid two-dimensional material transfer, and reduce the waste of replacement fluid.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] On the one hand, a two-dimensional material wet transfer device is provided, which is used to etch an original substrate so that the two-dimensional material on the original substrate is transferred to a target substrate, and the two-dimensional material wet transfer device comprises:

[0007] A receiving groove, wherein the receiving groove has an opening at the top and a groove is arranged at the bottom, the groove extends along a first direction, the first direction is the extension direction of the receiving groove, the second direction is the width direction of the receiving groove, and the second direction is perpendicular to the first direction; the width of the groove is greater than the maximum dimension of the original substrate along the second direction and the width of the groove is less than the maximum dimension of the target substrate along the second direction;

[0008] A liquid inlet assembly, which is disposed inside or above one end of the containing tank and is used to inject liquid into the containing tank;

[0009] A drainage component is arranged at the other end of the accommodating groove, and includes a drainage end head. The drainage end head is arranged above the groove, and the opening of the drainage end head on one side close to the groove is flush with the highest liquid level surface of the groove.

[0010] As an optional technical solution for the two-dimensional material wet transfer device, a plurality of partitions are arranged in the receiving tank along the first direction, and the plurality of partitions separate the receiving tank into a liquid inlet tank, an etching tank and a liquid drainage tank along the first direction. The liquid inlet tank, the etching tank and the liquid drainage tank are connected through the groove.

[0011] As an optional technical solution for the two-dimensional material wet transfer device, at least two positioning posts are arranged in the etching groove, and corresponding positioning holes are arranged on the target substrate. The positioning holes can be sleeved on the positioning posts to limit the lateral movement of the target substrate in the groove.

[0012] As an optional technical solution for the two-dimensional material wet transfer device, the liquid inlet component includes a liquid inlet end, and the liquid inlet end is arranged inside or above the liquid inlet tank to inject the liquid into the containing tank.

[0013] As an optional technical solution for the two-dimensional material wet transfer device, the liquid inlet component also includes a liquid inlet pipe, which is connected to the liquid inlet end, and the liquid flows out from the liquid inlet end after passing through the liquid inlet pipe.

[0014] As an optional technical solution for the two-dimensional material wet transfer device, a plurality of the liquid inlet end and the liquid inlet tube are provided.

[0015] As an optional technical solution for the two-dimensional material wet transfer device, the drainage component also includes a drainage pipe, which is connected to the drainage end, and the liquid outside the groove is discharged after passing through the drainage end and the drainage pipe.

[0016] As an optional technical solution for the two-dimensional material wet transfer device, the two-dimensional material wet transfer device also includes a detection component. The containing tank is also separated into a liquid level tank by the partition. The detection component is arranged above the liquid level tank to detect the liquid level height in the containing tank.

[0017] On the other hand, a two-dimensional material wet transfer method is provided, which is applied to the above-mentioned two-dimensional material wet transfer device, comprising the following steps:

[0018] S1, arranging and placing the original substrate on one side of the target substrate, wherein the two-dimensional material on the surface of the original substrate faces the target substrate, and rolling and fixing the original substrate and the target substrate;

[0019] S2, opening the liquid inlet assembly, injecting etching liquid into the containing tank to a given liquid level, and then placing the target substrate with the side of the original substrate facing downward in the containing tank;

[0020] S3, waiting for a given time, so that the original substrate is completely etched by the etching solution, and the two-dimensional material is exposed and immersed in the etching solution;

[0021] S4, opening the liquid discharge assembly to discharge the etching liquid in the containing tank until the etching liquid reaches the highest liquid level in the groove, and at this time, the two-dimensional material is immersed in the etching liquid in the groove;

[0022] S5, opening the liquid inlet component, continuously injecting the replacement liquid from one end of the containing tank, the replacement liquid flows into the groove, opening the liquid discharge component to continuously discharge the liquid from the other end of the containing tank, and the two-dimensional material is immersed in the mixture of the etching liquid and the replacement liquid in the groove;

[0023] S6. Detect the content of the liquid component in the containing tank. When the content reaches the standard, close the liquid inlet component and the liquid discharge component to complete the wet transfer of the two-dimensional material.

[0024] As an optional technical solution for the two-dimensional material wet transfer method, step S20 is used to replace step S2;

[0025] S1, arranging and placing the original substrate on one side of the target substrate, wherein the two-dimensional material on the surface of the original substrate faces the target substrate, and rolling and fixing the original substrate and the target substrate;

[0026] S20, placing the target substrate with the original substrate facing downward in the containing tank, then opening the liquid inlet assembly to inject etching liquid into the containing tank to a given liquid level;

[0027] S3, waiting for a given time, so that the original substrate is completely etched by the etching solution, and the two-dimensional material is exposed and immersed in the etching solution;

[0028] S4, opening the liquid discharge assembly to discharge the etching liquid in the containing tank until the etching liquid reaches the highest liquid level in the groove, and at this time, the two-dimensional material is immersed in the etching liquid in the groove;

[0029] S5, opening the liquid inlet component, continuously injecting the replacement liquid from one end of the containing tank, the replacement liquid flows into the groove, opening the liquid discharge component to continuously discharge the liquid from the other end of the containing tank, and the two-dimensional material is immersed in the mixture of the etching liquid and the replacement liquid in the groove;

[0030] S6. Detect the content of the liquid component in the containing tank. When the content reaches the standard, close the liquid inlet component and the liquid discharge component to complete the wet transfer of the two-dimensional material.

[0031] Beneficial effects of the present invention:

[0032] The present application discloses a two-dimensional material wet transfer device and a two-dimensional material wet transfer method, wherein the two-dimensional material wet transfer device includes a receiving tank, a liquid inlet component and a liquid discharge component, the receiving tank has an opening at the top and a groove is arranged at the bottom, the groove extends along a first direction, the first direction is the extension direction of the receiving tank, the second direction is the width direction of the receiving tank, and the second direction is perpendicular to the first direction; the width of the groove is larger than the maximum dimension of the original substrate along the second direction and smaller than the maximum dimension of the target substrate along the second direction; the liquid inlet component is arranged inside or above one end of the receiving tank, for injecting liquid into the receiving tank; the liquid discharge component is arranged at the other end of the receiving tank, including a liquid discharge end, the liquid discharge end is arranged above the groove, and the opening of the liquid discharge end close to the groove is flush with the highest liquid level surface of the groove. The present application sets a groove in the accommodating tank, and sets the groove width to match the original substrate and the target substrate respectively, so that the opening of the discharge end is flush with the highest liquid level of the groove, so as to ensure that there is liquid in the groove at all times and keep the two-dimensional material wet. When using the replacement liquid to replace the etching liquid, only the etching liquid in the replacement groove is used, which reduces the waste of the replacement liquid and improves the efficiency of stripping and transferring the two-dimensional material. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0034] Figure 1is an axonometric diagram of a two-dimensional material wet transfer device provided in an embodiment of the present invention;

[0035] Figure 2 is a top view of a two-dimensional material wet transfer device provided by an embodiment of the present invention;

[0036] Figure 3 is a schematic diagram of an original substrate and a target substrate provided by an embodiment of the present invention;

[0037] Figure 4 is a high liquid level schematic diagram of a two-dimensional material wet transfer device provided in an embodiment of the present invention;

[0038] Figure 5 is a low liquid level schematic diagram of a two-dimensional material wet transfer device provided in an embodiment of the present invention;

[0039] Figure 6 yes Figure 5 Enlarged view of point A in the middle;

[0040] Figure 7 yes Figure 5 Enlarged view of point B in the middle;

[0041] Figure 8 is a first flow chart of the two-dimensional material wet transfer method provided by an embodiment of the present invention;

[0042] Fig. 9 This is the second flow chart of the two-dimensional material wet transfer method provided in an embodiment of the present invention.

[0043] In the figure:

[0044] 1. Original substrate; 2. Target substrate; 3. Positioning hole;

[0045] 10. Receiving groove; 11. Groove; 12. Partition plate; 13. Liquid inlet groove; 131. Fixing block; 14. Etching groove; 141. Positioning column; 15. Liquid drain groove; 16. Liquid level groove;

[0046] 20. Liquid inlet assembly; 21. Liquid inlet terminal; 22. Liquid inlet pipe;

[0047] 30. Drain assembly; 31. Drain terminal; 32. Drain pipe;

[0048] 40. Detection components. DETAILED DESCRIPTION

[0049] Before any embodiments of the application are explained in detail, it is to be understood that the application is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the above drawings.

[0050] In this application, the terms "comprises", "includes", "has" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device that includes the element.

[0051] In this application, the term "and / or" is a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this application generally indicates that the related objects before and after are in an "and / or" relationship.

[0052] In the present application, the terms "connect", "combine", "couple", and "install" may refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, direct connection refers to two parts or components being connected together without the need for an intermediate piece, and indirect connection refers to two parts or components being connected to at least one intermediate piece respectively, and the two parts or components being connected via the intermediate piece. In addition, "connect" and "couple" are not limited to physical or mechanical connections or couplings, and may include electrical connections or couplings.

[0053] In the present application, it will be understood by those of ordinary skill in the art that relative terms (e.g., "about," "approximately," "substantially," etc.) used in conjunction with quantities or conditions include the values ​​and have the meaning indicated by the context. For example, the relative terms include at least the degree of error associated with the measurement of a specific value, the tolerances caused by manufacturing, assembly, and use associated with a specific value, and the like. Such terms should also be considered to disclose a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to plus or minus a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​that do not use relative terms should also be disclosed as specific values ​​with tolerances. In addition, "substantially" may refer to plus or minus a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) on the basis of the indicated angle when expressing a relative angular position relationship (e.g., substantially parallel, substantially perpendicular).

[0054] In this application, it will be understood by those skilled in the art that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0055] In the present application, the terms "upper", "lower", "left", "right", "front", "back" and other directional words are described based on the orientation and positional relationship shown in the accompanying drawings, and should not be understood as limiting the embodiments of the present application. In addition, in the context, it is also necessary to understand that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element. It should also be understood that directional words such as upper side, lower side, left side, right side, front side, back side, etc. not only represent the positive orientation, but can also be understood as the lateral orientation. For example, the bottom can include directly below, lower left, lower right, lower front, and lower back, etc.

[0056] Two-dimensional material transfer is a technology that peels off two-dimensional materials (such as graphene or transition metal disulfides) from their original substrates (such as copper foil) and transfers them to target substrates (such as silicon wafers, glass or polymer films). In wet transfer, one of the important steps is to etch away the original substrate of the two-dimensional material (such as copper foil). After etching, the exposed two-dimensional material needs to be immersed in other solvents and the exposed two-dimensional material cannot leave the liquid solvent (etching solution or immersion solvent) to avoid surface tension destroying the two-dimensional material after leaving the liquid.

[0057] In the prior art, a peristaltic pump is used to replace the etching liquid with a replacement liquid (the replacement liquid is flushed in, and an equal amount of etching liquid is pumped out from the other side at the same time) to ensure that the two-dimensional material does not leave the liquid solvent. However, in this method, manual monitoring of the entire transfer process (generally more than 3 hours) is required; and a large amount of replacement liquid needs to be added multiple times to replace the etching liquid; the replacement efficiency is low and the replacement liquid is seriously wasted.

[0058] To solve the above problems, see Figure 3 This embodiment provides a two-dimensional material wet transfer device, which is used to transfer the two-dimensional material on the original substrate 1 to the target substrate 2. The size of the original substrate 1 is smaller than the size of the target substrate 2, and the original substrate 1 is fixed to the target substrate 2. In this embodiment, the original substrate 1 is set to be square, and the target substrate 2 is set to be rectangular. There are 10 original substrates 1, which are evenly spaced along the extension direction of the target substrate 2; it should be noted that Figure 3The shapes and numbers of the original substrate 1 and the target substrate 2 are only for simple illustration and are not limited to square or rectangular. In other embodiments, as long as they can be easily arranged and attached, for example, the shape of the original substrate 1 can be circular; in addition, the number of original substrates 1 is not necessarily 10, and can be set according to specific needs (for example, n, n ≥ 1). By attaching multiple original substrates 1 at a time, the efficiency of transfer can be effectively improved. The side of the original substrate 1 containing the two-dimensional material faces the target substrate 2. The original substrate 1 and the target substrate 2 are pressed together using a roller press. The target substrate 2 is set as a polymer film, which is light in weight and can float on the surface of the liquid (etching solution and immersion solvent).

[0059] Among them, see Figure 1-Figure 7 The two-dimensional material wet transfer device includes a receiving tank 10, a liquid inlet component 20 and a liquid discharge component 30. The receiving tank 10 has an opening at the top and a groove 11 is arranged at the bottom. The groove 11 extends along a first direction, the first direction is the extension direction of the receiving tank 10, and the second direction is the width direction of the receiving tank 10, and the second direction is perpendicular to the first direction; the width of the groove 11 is greater than the maximum dimension of the original substrate 1 along the second direction and the width of the groove 11 is less than the maximum dimension of the target substrate 2 along the second direction; in this embodiment, the width of the groove 11 is greater than the maximum dimension of the original substrate 1 The width of the groove 11 is smaller than the width of the target substrate 2, so that the exposed two-dimensional material is prevented from touching the edge of the groove 11, the original substrate 1 can be placed in the groove 11, and the target substrate 2 floats outside the groove 11; the liquid inlet component 20 is arranged inside or above one end of the receiving groove 10, and is used to inject liquid into the receiving groove 10; the liquid discharge component 30 is arranged at the other end of the receiving groove 10, including a liquid discharge terminal 31, the liquid discharge terminal 31 is arranged above the groove 11, and the opening of the liquid discharge terminal 31 close to the groove 11 is flush with the highest liquid level of the groove 11. By arranging the groove 11 in the receiving groove 10, and setting the width of the groove 11 to match the original substrate 1 and the target substrate 2 respectively, the opening of the liquid discharge terminal 31 is flush with the highest liquid level of the groove 11, so as to ensure that there is liquid in the groove 11 at all times, and the two-dimensional material is always immersed in the liquid. When the replacement liquid is used to replace the etching liquid, only the etching liquid in the replacement groove 11 is used, which reduces the waste of the replacement liquid and improves the efficiency of stripping and transferring the two-dimensional material.

[0060] Furthermore, a plurality of partitions 12 are arranged in the receiving tank 10 at intervals along the first direction, and the plurality of partitions 12 separate the receiving tank 10 into a liquid inlet tank 13, an etching tank 14 and a liquid discharge tank 15 along the first direction, and the liquid inlet tank 13, the etching tank 14 and the liquid discharge tank 15 are connected through the groove 11. Specifically, the partition 12 is fixedly connected to the side wall and the bottom of the receiving tank 10, and can be screwed or clamped. The area in the receiving tank 10 is divided by the partition 12. When liquid drips into the liquid inlet tank 13, since the liquid can only flow through the bottom groove 11, the adverse effects caused by liquid level fluctuations can be greatly avoided; the arrangement of the liquid discharge tank 15 is similar, and will not be repeated.

[0061] Furthermore, in order to prevent the target substrate 2 from drifting on the liquid surface during the etching process so that the position of the original substrate 1 deviates from the groove 11, at least two positioning posts 141 are provided in the etching groove 14, and positioning holes 3 are correspondingly provided on the target substrate 2. The positioning holes 3 can be sleeved on the positioning posts 141 to limit the lateral movement of the target substrate 2 in the groove 11, so that the projection of the target substrate 2 in the vertical direction is always located in the groove 11. In this embodiment, four positioning posts 141 are provided, and positioning holes 3 are provided at the four corners of the target substrate 2, and the positioning holes 3 are sleeved on the positioning posts 141.

[0062] Further, the liquid inlet assembly 20 includes a liquid inlet terminal 21, which is arranged inside or above the liquid inlet tank 13 to inject liquid into the containing tank 10. In this embodiment, the liquid inlet terminal 21 is arranged above the liquid inlet tank 13. Specifically, the liquid inlet assembly 20 also includes a liquid inlet pipe 22 and a first driving member, the liquid inlet pipe 22 is connected to the liquid inlet terminal 21, and the first driving member can drive the liquid to flow out of the liquid inlet terminal 21 after passing through the liquid inlet pipe 22. The first driving member can be a peristaltic pump or an electromagnetic pump, etc., which are not listed here one by one.

[0063] Furthermore, since etching liquid and different types of replacement liquid need to be added to the liquid inlet tank 13, multiple liquid inlet heads 21, liquid inlet tubes 22 and first driving members are provided. Specifically, a fixing block 131 is provided at the edge of the side wall of the liquid inlet tank 13, and multiple liquid inlet heads 21 are plugged into the fixing block 131, thereby being fixed above the liquid inlet tank 13.

[0064] Furthermore, the liquid discharge assembly 30 further includes a liquid discharge pipe 32 and a second driving member, the liquid discharge pipe 32 is connected to the liquid discharge terminal 31, and the second driving member can drive the liquid outside the groove 11 to be discharged through the liquid discharge terminal 31 and the liquid discharge pipe 32. Specifically, the liquid discharge terminal 31 is configured to have a square funnel opening, and the opening width of the liquid discharge terminal 31 is greater than the width of the groove 11. The second driving member can be a peristaltic pump or an electromagnetic pump, etc., which are not listed here one by one.

[0065] Furthermore, the two-dimensional material wet transfer device also includes a detection component 40. In order to facilitate the installation of the detection component 40, the receiving tank 10 is also separated into a liquid level tank 16 by a partition 12. The detection component 40 is arranged above the liquid level tank 16 to detect the liquid level in the receiving tank 10. Specifically, to prevent the etching liquid and the replacement liquid from being contaminated, the detection component 40 detects in a non-contact manner, and the detection component 40 can select ultrasonic detection or electromagnetic wave detection. The detection component 40 is used to monitor the liquid level, thereby monitoring the peeling and transfer process, and improving the degree of automation of the peeling and transfer of the two-dimensional material.

[0066] Furthermore, a sensor is arranged near the drainage component 30 to detect the characteristics of the liquid in the groove 11, such as conductivity, so as to judge the liquid content in the groove 11. When the replacement fluid content in the groove 11 reaches the standard, a signal is sent to immediately stop the introduction of the replacement fluid to avoid wasting the replacement fluid.

[0067] Furthermore, the first driving member, the second driving member, the detection assembly 40 and the sensor are all communicatively connected to realize full automation in the two-dimensional material peeling and transfer process, saving time for manual monitoring and improving the efficiency of the two-dimensional material peeling and transfer.

[0068] This embodiment also provides a two-dimensional material wet transfer method, see Figure 8 , applied to a two-dimensional material wet transfer device, comprising the following steps:

[0069] S1, arranging the original substrate 1 and placing it on one side of the target substrate 2, wherein the two-dimensional material on the surface of the original substrate 1 faces the target substrate 2, and rolling and fixing the original substrate 1 and the target substrate 2;

[0070] S2, opening the liquid inlet assembly 20, injecting the etching liquid into the containing tank 10 to a given liquid level, and then placing the target substrate 2 with the original substrate 1 facing downward into the containing tank 10;

[0071] S3, waiting for a given time, so that the original substrate 1 is completely etched by the etching solution, and the two-dimensional material is exposed and immersed in the etching solution;

[0072] S4, opening the liquid discharge assembly 30 to discharge the etching liquid in the containing tank 10 until the etching liquid reaches the highest liquid level in the groove 11, and the two-dimensional material is now immersed in the etching liquid in the groove 11;

[0073] S5, opening the liquid inlet assembly 20, continuously injecting the replacement liquid from one end of the receiving tank 10, the replacement liquid flows into the groove 11, opening the liquid discharge assembly 30 to continuously discharge the liquid from the other end of the receiving tank 10, and the two-dimensional material is immersed in the mixture of the etching liquid and the replacement liquid in the groove 11;

[0074] S6. Detect the content of the liquid component in the containing tank 10. When the content reaches the standard, close the liquid inlet assembly 20 and the liquid discharge assembly 30 to complete the wet transfer of the two-dimensional material.

[0075] Further, see Fig. 9 In this embodiment, step S20 may be used to replace step S2;

[0076] S1, arranging the original substrate 1 and placing it on one side of the target substrate 2, wherein the two-dimensional material on the surface of the original substrate 1 faces the target substrate 2, and rolling and fixing the original substrate 1 and the target substrate 2;

[0077] S20, placing the target substrate 2 with the original substrate 1 facing downward in the receiving tank 10, then opening the liquid inlet assembly 20, and injecting etching liquid into the receiving tank 10 to a given liquid level;

[0078] S3, waiting for a given time, so that the original substrate 1 is completely etched by the etching solution, and the two-dimensional material is exposed and immersed in the etching solution;

[0079] S4, opening the liquid discharge assembly 30 to discharge the etching liquid in the containing tank 10 until the etching liquid reaches the highest liquid level in the groove 11, and the two-dimensional material is now immersed in the etching liquid in the groove 11;

[0080] S5, opening the liquid inlet assembly 20, continuously injecting the replacement liquid from one end of the receiving tank 10, the replacement liquid flows into the groove 11, opening the liquid discharge assembly 30 to continuously discharge the liquid from the other end of the receiving tank 10, and the two-dimensional material is immersed in the mixture of the etching liquid and the replacement liquid in the groove 11;

[0081] S6. Detect the content of the liquid component in the containing tank 10. When the content reaches the standard, close the liquid inlet assembly 20 and the liquid discharge assembly 30 to complete the wet transfer of the two-dimensional material.

[0082] Through the two-dimensional material wet transfer method, the two-dimensional material is immersed in the liquid throughout the process. When the replacement liquid is injected, the replacement liquid flows along the groove 11. Since the original substrate 1 is arranged along the extension direction of the groove 11, the transfer efficiency is greatly improved. When the replacement liquid is used to replace the etching liquid, only the etching liquid in the groove 11 is replaced, which reduces the waste of the replacement liquid and improves the efficiency of the wet transfer of the two-dimensional material.

[0083] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A two-dimensional material wet transfer device, used for etching an original substrate (1) to transfer the two-dimensional material on the original substrate (1) to a target substrate (2), characterized in that: The two-dimensional material wet transfer device comprises: A receiving groove (10), wherein the receiving groove (10) has an opening at the top and a groove (11) is arranged at the bottom, wherein the groove (11) extends along a first direction, wherein the first direction is the extension direction of the receiving groove (10), and the second direction is the width direction of the receiving groove (10), wherein the second direction is perpendicular to the first direction; the width of the groove (11) is greater than the maximum dimension of the original substrate (1) along the second direction and the width of the groove (11) is less than the maximum dimension of the target substrate (2) along the second direction; a liquid inlet component (20), the liquid inlet component (20) being arranged inside or above one end of the containing tank (10) and being used for injecting liquid into the containing tank (10); A liquid discharge component (30), the liquid discharge component (30) being arranged at the other end of the containing groove (10), comprising a liquid discharge end (31), the liquid discharge end (31) being arranged above the groove (11), and an opening of the liquid discharge end (31) on a side close to the groove (11) being flush with the highest liquid level surface of the groove (11).

2. The two-dimensional material wet transfer device according to claim 1, characterized in that: A plurality of partitions (12) are arranged in the containing groove (10) at intervals along the first direction, and the plurality of partitions (12) separate the containing groove (10) into a liquid inlet groove (13), an etching groove (14) and a liquid discharge groove (15) along the first direction; the liquid inlet groove (13), the etching groove (14) and the liquid discharge groove (15) are connected via the groove (11).

3. The two-dimensional material wet transfer device according to claim 2, characterized in that: At least two positioning posts (141) are arranged in the etching groove (14), and a positioning hole (3) is correspondingly arranged on the target substrate (2), and the positioning hole (3) can be sleeved on the positioning post (141) to limit the lateral movement of the target substrate (2) in the groove (11).

4. The two-dimensional material wet transfer device according to claim 2, characterized in that: The liquid inlet assembly (20) comprises a liquid inlet end head (21), and the liquid inlet end head (21) is arranged inside or above the liquid inlet groove (13) to inject the liquid into the containing groove (10).

5. The two-dimensional material wet transfer device according to claim 4, characterized in that: The liquid inlet assembly (20) further comprises a liquid inlet pipe (22), wherein the liquid inlet pipe (22) is in communication with the liquid inlet end (21), and the liquid flows out from the liquid inlet end (21) after passing through the liquid inlet pipe (22).

6. The two-dimensional material wet transfer device according to claim 5, characterized in that: The liquid inlet end (21) and the liquid inlet pipe (22) are both provided in plurality.

7. The two-dimensional material wet transfer device according to any one of claims 2 to 6, characterized in that: The liquid discharge component (30) further comprises a liquid discharge pipe (32), wherein the liquid discharge pipe (32) is connected to the liquid discharge end head (31), and the liquid outside the groove (11) is discharged through the liquid discharge end head (31) and the liquid discharge pipe (32).

8. The two-dimensional material wet transfer device according to any one of claims 2 to 6, characterized in that: The two-dimensional material wet transfer device also includes a detection component (40), and the containing tank (10) is also separated into a liquid level tank (16) by the partition (12). The detection component (40) is arranged above the liquid level tank (16) and is used to detect the liquid level height in the containing tank (10).

9. A two-dimensional material wet transfer method, applied to the two-dimensional material wet transfer device according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, arranging the original substrate (1) and placing it on one side of the target substrate (2), wherein the two-dimensional material on the surface of the original substrate (1) faces the target substrate (2), and rolling and fixing the original substrate (1) and the target substrate (2); S2, opening the liquid inlet assembly (20), injecting etching liquid into the containing tank (10) to a given liquid level, and then placing the target substrate (2) with the side of the original substrate (1) facing downwards into the containing tank (10); S3, waiting for a given time, so that the original substrate (1) is completely etched by the etching solution, and the two-dimensional material is exposed and immersed in the etching solution; S4, opening the liquid discharge component (30) to discharge the etching liquid in the containing groove (10) until the etching liquid reaches the highest liquid level in the groove (11), and at this time, the two-dimensional material is immersed in the etching liquid in the groove (11); S5, opening the liquid inlet component (20), continuously injecting the replacement liquid from one end of the containing tank (10), and the replacement liquid flows into the groove (11), opening the liquid discharge component (30) to continuously discharge the liquid from the other end of the containing tank (10), and the two-dimensional material is immersed in the mixed liquid of the etching liquid and the replacement liquid in the groove (11); S6. Detecting the content of the liquid component in the containing tank (10). When the content reaches the standard, closing the liquid inlet component (20) and the liquid discharge component (30) to complete the wet transfer of the two-dimensional material.

10. The two-dimensional material wet transfer method according to claim 9, characterized in that: Replace step S2 with step S20; S1, arranging the original substrate (1) and placing it on one side of the target substrate (2), wherein the two-dimensional material on the surface of the original substrate (1) faces the target substrate (2), and rolling and fixing the original substrate (1) and the target substrate (2); S20, placing the target substrate (2) with the original substrate (1) on its side facing downward in the receiving tank (10), then opening the liquid inlet assembly (20) and injecting etching liquid into the receiving tank (10) to a given liquid level; S3, waiting for a given time, so that the original substrate (1) is completely etched by the etching solution, and the two-dimensional material is exposed and immersed in the etching solution; S4, opening the liquid discharge component (30) to discharge the etching liquid in the containing groove (10) until the etching liquid reaches the highest liquid level in the groove (11), and at this time, the two-dimensional material is immersed in the etching liquid in the groove (11); S5, opening the liquid inlet component (20), continuously injecting the replacement liquid from one end of the containing tank (10), and the replacement liquid flows into the groove (11), opening the liquid discharge component (30) to continuously discharge the liquid from the other end of the containing tank (10), and the two-dimensional material is immersed in the mixed liquid of the etching liquid and the replacement liquid in the groove (11); S6. Detecting the content of the liquid component in the containing tank (10). When the content reaches the standard, closing the liquid inlet component (20) and the liquid discharge component (30) to complete the wet transfer of the two-dimensional material.

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