Resin composition, conductive modified plastic and preparation method thereof, and packaging material

Abstract

The embodiment of the invention discloses a resin composition, conductive modified plastic, a preparation method of the conductive modified plastic and a packaging material, and the resin composition comprises matrix resin, a conductive polymer and amorphous polymer particles, the weight percentage of the amorphous polymer particles is 1-10%; 1-10% by weight of amorphous polymer particles are added into a mixture of matrix resin and a conductive polymer, and the amorphous polymer particles can be enriched in a low-viscosity phase state in a blend system after a resin material is heated and molten, and can enter the conductive polymer which is easy to flow more easily; and the fluidity difference between the matrix resin and the conductive polymer in the resin material is effectively reduced, so that the mixing performance of the matrix resin and the conductive polymer is optimized during subsequent extrusion granulation, and uniform plastic particles are manufactured.

Description

Technical Field

[0001] The present application relates to the technical field of plastic materials, and in particular to a resin composition, a conductive modified plastic and a preparation method thereof, and a packaging material. Background Art

[0002] The semiconductor industry widely uses plastic products such as plastic packaging bags, trays, and carriers to assist in the transfer of chips in multiple production links and the packaging of final products. Most types of plastics are insulating materials (SR>10E13Ω), and static charges are easily accumulated on their surfaces. If the plastic material is not modified for antistatic properties, the static charges accumulated on its surface may break down and damage the chip. Therefore, the semiconductor industry has put forward clear antistatic or conductive requirements for plastic products.

[0003] In order to achieve the antistatic or conductive properties of plastic products, the industry usually adopts the method of adding an appropriate amount of conductive additives to the plastic substrate. These additives include conductive fibers (such as carbon fibers, steel fibers), conductive particles (such as metal powders, conductive carbon black, conductive carbon nanotubes), conductive additives (such as antistatic agents) and conductive polymers (such as PELECTRON AS, PelestatNC 6321, Ionphase U1). By adding these conductive additives, the surface resistance of plastic products can be effectively reduced to 10E9~10E11Ω to achieve the antistatic effect on the plastic surface, or 10E6~10E9Ω to achieve the conductive properties of the plastic surface. However, the color characteristics of conductive fibers or conductive particles are likely to affect the color of plastic products after dyeing. At the same time, during use, the conductive particles on the surface of plastic products are also at risk of wear and fall off. In contrast, the conductive polymer itself is light-colored, and its addition to ordinary plastics can meet the requirements for conductive properties without significantly affecting the color of the plastic products.

[0004] Conductive polymers are mostly polyamide polyether copolymers, and the recommended processing temperature range is set at 210°C to 250°C. Excessively high processing temperatures will trigger uncontrollable degradation of conductive polymers. When conductive polymers are directly mixed into engineering plastics with high viscosity and high processing temperatures such as PC, PC / ABS, PBT, PPO, and PEI, and mixed through a melt extrusion process, the poor compatibility between the resin components and the limitations of their respective processing windows often lead to difficulties in strand granulation during the production process, which in turn has an adverse effect on the stability of the conductive properties of the final product. Summary of the invention

[0005] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a resin composition, a conductive modified plastic and a preparation method thereof, and a packaging material to solve the problem that the compatibility between resin components in the resin material doped with a conductive polymer is poor, resulting in poor strand granulation effect during the production process and unstable conductive performance of the final product.

[0006] In a first aspect, the present application provides a resin composition, comprising: a base resin, a conductive polymer and non-crystalline polymer particles; the weight percentage of the non-crystalline polymer particles is 1-10%.

[0007] In one embodiment of the above resin composition, the weight percentage of the non-crystalline polymer particles is 2-6%.

[0008] By controlling the weight percentage of the non-crystalline polymer particles to 2-6%, the fluidity of the matrix resin and the conductive polymer is closer, the mixing effect is better, and the compatibility is better.

[0009] In one embodiment of the above resin composition, the particle size of the non-crystalline polymer particles is 0.2 μm-8 μm.

[0010] By controlling the particle size of the non-crystalline polymer particles to be between 0.2 and 8 μm, smaller non-crystalline polymer particles can better improve the viscosity of the conductive polymer.

[0011] In one embodiment of the above-mentioned resin composition, the non-crystalline polymer particles include rubber particles, at least one of talcum powder particles, mica powder particles and calcium carbonate powder particles.

[0012] By selecting filler particles with a larger molecular weight, the adhesion between the conductive polymer and the matrix resin can be further improved.

[0013] In one embodiment of the above resin composition, the rubber particles are core-shell polymers;

[0014] The core-shell polymer is selected from at least one of a polymer with silicone and acrylate as core and methacrylate as shell, a polymer with butadiene rubber or styrene butadiene rubber as core and SAN as shell, and a polymer with styrene butadiene as core and MMA as shell.

[0015] In one embodiment of the above resin composition, the core particle size of the core-shell polymer presents a bimodal distribution, and the two peak values ​​are in the range of 80-120 nm and 350-450 nm respectively.

[0016] In one embodiment of the above-mentioned resin composition, the base resin is selected from at least one of ABS, SAN, PBT, PET, PCTG, PCCD, PMA and PC.

[0017] PC has high heat resistance and strong impact resistance; ABS, SAN, PBT, PET, PCTG, PCCD, and PMA resins improve compatibility and reduce processing temperature.

[0018] In one embodiment of the above-mentioned resin composition, the conductive polymer includes at least one of olefin resin, poly-polycarbonate, poly-polyurethane, and styrene resin.

[0019] It will not affect the color of the dyed plastic products and will not easily wear out or fall off.

[0020] In one embodiment of the above resin composition, the weight percentage of the conductive polymer is 10-20%.

[0021] By controlling the weight percentage of the conductive polymer in the resin composition to 10-20%, the conductive property of the plastic made of the resin composition can be effectively improved while satisfying the mechanical strength and impact resistance of the plastic made of the resin composition.

[0022] In a second aspect, the present application further provides a conductive modified plastic, comprising the resin composition as described in any one of the first aspects.

[0023] In a third aspect, the present application further provides a method for preparing a conductive modified plastic, using the resin composition as described in any one of the first aspects, the method comprising:

[0024] Adding non-crystalline polymer particles to a blend of a base resin and a conductive polymer and mixing them uniformly to obtain a target mixture;

[0025] The target mixture is heated to a preset manufacturing temperature and then extruded and granulated to obtain conductive modified plastic particles.

[0026] Conductive modified plastic particles with high uniformity, excellent conductivity and good subsequent dyeing effect can be successfully prepared.

[0027] In a fourth aspect, the present application further provides a packaging material, which is used to carry and package a semiconductor, and the packaging material uses the conductive modified plastic particles described in the third aspect.

[0028] The prepared packaging material has antistatic or conductive properties, meets the requirements of carrying and packaging semiconductors, and meets the requirements of color dyeing.

[0029] One or more of the above embodiments of the present application have at least one or more of the following beneficial effects: 1-10% by weight of non-crystalline polymer particles are added to the mixture of the matrix resin and the conductive polymer, and the non-crystalline polymer particles can be enriched in the phase with lower viscosity in the blend system after heating and melting the resin material, and can more easily enter the interior of the easy-flowing conductive polymer, effectively reducing the difference in fluidity between the matrix resin and the conductive polymer in the resin material, thereby optimizing the mixing performance of the matrix resin and the conductive polymer during subsequent extrusion granulation, and producing uniform plastic particles.

[0030] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. DETAILED DESCRIPTION

[0031] Some embodiments of the present application are described below. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the protection scope of the present application.

[0032] As described in the background technology, the plastic products used for semiconductor packaging need to meet the requirements of antistatic or conductivity. In order to avoid affecting the color of the plastic products after dyeing and to avoid the conductive particles on the surface of the plastic products from being worn and falling off, conductive polymers are usually added during plastic manufacturing to manufacture plastic products for semiconductors. However, when the conductive polymer is directly mixed into engineering plastics with high viscosity and high processing temperature, the compatibility of the conductive polymer with the matrix resin is poor, and the uniformity of the product produced during the subsequent strand granulation is poor, which leads to poor stability of the conductive performance of the final product.

[0033] In order to solve the above problems, the present application creatively proposes a resin composition, a conductive modified plastic and a preparation method thereof, and a packaging material. For the resin composition used in the manufacture of plastics, 1-10% by weight of non-crystalline polymer particles are added to the mixture of the base resin and the conductive polymer. The non-crystalline polymer particles can be enriched in the phase with lower viscosity in the blend system after heating and melting the resin material, and can more easily enter the interior of the easy-flowing conductive polymer, effectively reducing the fluidity difference between the base resin and the conductive polymer in the resin material, thereby optimizing the mixing performance of the base resin and the conductive polymer during subsequent extrusion granulation, and producing uniform plastic particles.

[0034] The present application will be described in detail below through specific embodiments.

[0035] The embodiment of the present application provides a resin composition, comprising: a base resin, a conductive polymer and non-crystalline polymer particles; the weight percentage of the non-crystalline polymer particles is 1-10%.

[0036] Non-crystalline polymer particles refer to polymer particles whose molecules are arranged in a disordered manner when solid. They have no obvious melting point and become soft but not melted when heated to a certain temperature. As the temperature increases, the fluidity of the non-crystalline polymer particles increases.

[0037] Adding 1-10% by weight of non-crystalline polymer particles to the mixture of the base resin and the conductive polymer, the non-crystalline polymer particles can be enriched in the phase with lower viscosity in the blend system after heating and melting the resin material, and are more likely to enter the conductive polymer that is easy to flow, effectively reducing the fluidity difference between the base resin and the conductive polymer in the resin material, thereby optimizing the mixing performance of the base resin and the conductive polymer during subsequent extrusion granulation, and producing uniform plastic particles. When the weight percentage of the non-crystalline polymer particles is greater than 10%, the flow difference between the base resin and the conductive polymer is greater than when the non-crystalline polymer particles are not added, and the compatibility is worse.

[0038] Optionally, the weight percentage of the non-crystalline polymer particles is 2-6%. By controlling the weight percentage of the non-crystalline polymer particles to be 2-6%, the fluidity of the matrix resin and the conductive polymer is closer, the mixing effect is better, and the compatibility is better.

[0039] Optionally, the particle size of the non-crystalline polymer particles is 0.2 μm-8 μm. By controlling the particle size of the non-crystalline polymer particles to be 0.2-8 μm, smaller non-crystalline polymer particles can better improve the viscosity of the conductive polymer.

[0040] Optionally, the non-crystalline polymer particles include rubber particles, at least one of talcum powder particles, mica powder particles and calcium carbonate powder particles. Selecting filler particles with a larger molecular weight can further improve the adhesion between the conductive polymer and the matrix resin.

[0041] Optionally, the rubber particles are core-shell polymers;

[0042] The core-shell polymer is selected from at least one of a polymer with silicone and acrylate as core and methacrylate as shell, a polymer with butadiene rubber or styrene butadiene rubber as core and SAN as shell, and a polymer with styrene butadiene as core and MMA as shell.

[0043] Optionally, the core particle size of the core-shell polymer presents a bimodal distribution, with two peak values ​​ranging from 80-120 nm and 350-450 nm, respectively.

[0044] Optionally, the matrix resin includes at least one selected from ABS, SAN, PBT, PET, PCTG, PCCD, PMA, and PC and ABS.

[0045] PC (polycarbonate resin) has high heat resistance and strong impact resistance; ABS (terpolymer of acrylonitrile (A)-butadiene (B)-styrene (S)), SAN (acrylonitrile-styrene copolymer), PBT (polybutylene terephthalate), PET (polyethylene glycolterephthalate), PCTG (amorphous copolyester, such as 1,4-cyclohexanedimethanol (CHDM)), PCCD (poly (1,4-cyclohexanedicarboxylic acid-1,4-cyclohexane dimethanol ester)), PMA (Poly (maleic acid), propylene glycol monomethyl ether acetate) resins improve compatibility and reduce processing temperature.

[0046] Optionally, the conductive polymer includes at least one of olefin resin, poly-polycarbonate, poly-polyurethane, and styrene resin. It does not affect the color of the plastic product after dyeing and is not easy to wear and fall off. Exemplarily, the conductive polymer uses PELECTRON AS, Pelestat NC 6321, Ionphase U1, etc.

[0047] Optionally, the weight percentage of the conductive polymer is 10-20%. By controlling the weight percentage of the conductive polymer in the resin composition to 10-20%, the conductive properties of the plastic made of the resin composition can be effectively improved while satisfying the mechanical strength and impact resistance of the plastic made of the resin composition.

[0048] The embodiments of the present application also provide a conductive modified plastic, including the resin composition provided in any one of the above embodiments.

[0049] The conductive modified plastic may also include other components such as plasticizers, defoamers, weathering modifiers, etc., which can be adjusted according to actual needs, and this application does not impose any specific restrictions on this.

[0050] The present application also provides a method for preparing a conductive modified plastic, using the resin composition provided in any one of the above embodiments, the method comprising:

[0051] S1. Add non-crystalline polymer particles to the blend of base resin and conductive polymer and mix them evenly to obtain a target mixture.

[0052] S2, heating the target mixture to a preset manufacturing temperature and then extruding and granulating the mixture to obtain conductive modified plastic particles.

[0053] The embodiment of the present application further provides a packaging material, which is used to carry and package a semiconductor, and the packaging material uses the conductive modified plastic particles provided in the above embodiment.

[0054] The technical solution of the present application is further described in detail below in conjunction with specific embodiments. It should be understood that the following embodiments are only used to explain the present invention and are not used to limit the present invention.

[0055] The conductive modified plastic prepared in the following embodiment includes a resin composition, which includes a base resin, a conductive polymer and non-crystalline polymer particles. The following table shows the specific components and addition amounts (weight percentage) of the base resin, conductive polymer and non-crystalline polymer particles in the resin composition in the embodiments and comparative examples. Among them: NA means that it is impossible to draw a strip, NOK means that the melt viscosity is unstable and the thickness of the strip is uneven, resulting in different particle sizes; OK means that the strip drawing and granulation are smooth and the particle size is uniform.

[0056] Table 1

[0057]

[0058] Table 2

[0059]

[0060]

[0061] Result analysis:

[0062] As shown in Table 1 and Table 2, when 1-10% non-crystalline polymer particles are added to the blend of the matrix resin and the conductive polymer, the strand granulation effect is better. When no non-crystalline polymer particles are added or the weight percentage of the added non-crystalline polymer particles is greater than 10%, the strand granulation effect may even fail.

[0063] In the description of this specification, the materials used are commercially available materials unless otherwise specified. The description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0064] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0065] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A resin composition, characterized in that include: Base resin, conductive polymer and non-crystalline polymer particles; the weight percentage of the non-crystalline polymer particles is 1-10%.

2. The resin composition according to claim 1, characterized in that The weight percentage of the non-crystalline polymer particles is 2-6%.

3. The resin composition according to claim 1, characterized in that The particle size of the non-crystalline polymer particles is 0.2 μm-8 μm.

4. The resin composition according to claim 1, characterized in that The non-crystalline polymer particles include rubber particles, at least one of talcum powder particles, mica powder particles and calcium carbonate powder particles.

5. The resin composition according to claim 4, characterized in that The rubber particles are core-shell polymers; The core-shell polymer is selected from at least one of a polymer with silicone and acrylate as core and methacrylate as shell, a polymer with butadiene rubber or styrene butadiene rubber as core and SAN as shell, and a polymer with styrene butadiene as core and MMA as shell.

6. The resin composition according to claim 5, characterized in that The core particle size of the core-shell polymer presents a bimodal distribution, and the ranges of the two peaks are 80-120nm and 350-450nm respectively.

7. The resin composition according to claim 1, characterized in that The matrix resin is selected from at least one of ABS, SAN, PBT, PET, PCTG, PCCD, PMMA and PC.

8. The resin composition according to claim 1, characterized in that The conductive polymer includes at least one of olefin resin, poly-polycarbonate, poly-polyurethane and styrene resin.

9. The resin composition according to claim 1, characterized in that The weight percentage of the conductive polymer is 10-20%.

10. A conductive modified plastic, characterized in that: The invention comprises the resin composition as claimed in any one of claims 1 to 9.

11. A method for preparing a conductive modified plastic, characterized in that: Using the resin composition according to any one of claims 1 to 9, the method comprises: Adding non-crystalline polymer particles to a blend of a base resin and a conductive polymer and mixing them uniformly to obtain a target mixture; The target mixture is heated to a preset manufacturing temperature and then extruded and granulated to obtain conductive modified plastic particles.

12. A packaging material, characterized in that: The packaging material is used for carrying and packaging a semiconductor, and the packaging material adopts the conductive modified plastic particles as claimed in claim 11.

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