Wafer and ceramic ring landing edge detection method and vapor deposition equipment thereof

Abstract

The invention provides a method for wafer and ceramic ring landing edge detection and vapor deposition equipment thereof, and belongs to the technical field of semiconductor manufacturing, the vapor deposition equipment for wafer and ceramic ring landing edge detection comprises a cavity and a protection structure, an electrostatic chuck is installed in the cavity, three thimbles are installed in the electrostatic chuck, and the thimbles are arranged in the cavity. A temperature probe is installed in the electrostatic chuck, a ceramic ring body is installed in the cavity, inner ring helium and outer ring helium are installed on the periphery of the electrostatic chuck, and four limiting columns are installed in the ceramic ring body. When the wafer is overlapped with the limiting column, the upper computer immediately displays alarm prompt information and immediately stops the process step to be executed or the action of the manipulator, so that the serious consequence that the wafer is damaged and the electrostatic chuck is damaged is prevented; by monitoring the relative position of the wafer and the limiting column on the ceramic ring in real time, the wafer transfer position can be calibrated without opening a cavity, the particle risk is reduced, and the calibration efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to a method for detecting overlap between a wafer and a ceramic ring and a vapor deposition device thereof. Background Art

[0002] High-density plasma chemical vapor deposition is widely used in advanced processes below 0.25 microns due to its excellent hole filling ability, stable deposition quality, excellent electrical properties and low reaction temperature. The static electricity in the cathode assembly is used to receive and fix the wafer to ensure the precise progress of the process.

[0003] Through the electrodes embedded in the ceramic substrate, an electric field is formed after high voltage is applied, which induces induced charges of opposite polarity on the wafer. The principle of opposite charges attracts each other to generate electrostatic attraction, thereby fixing the wafer. After the process is completed, the high voltage on the electrostatic chuck needs to be turned off and desorption is performed, that is, the charge on the surface of the wafer is removed by plasma. The electrostatic chuck integrates a back helium cooling system and an internal coolant channel. During the process, helium is blown to the wafer through two circles of helium holes on the electrostatic chuck to achieve precise control of the process temperature. There is a ceramic ring on the outside of the electrostatic chuck. There is a gap of about 0.3mm between the ceramic ring and the electrostatic chuck. Four limit posts are evenly distributed on the inside of the ceramic ring. Under normal circumstances, the wafer is placed on the electrostatic chuck within the four limit posts. Before the process begins, when the vacuum manipulator places the wafer on the three ejector pins embedded in the electrostatic chuck, the ejector pins simultaneously descend at a uniform speed until the wafer fits the surface of the electrostatic chuck. After the process is completed, the ejector pins rise to lift the wafer. However, since the three ejector pins are all made of brittle ceramic materials, they may break during the wafer receiving and moving process, causing the wafer to tilt and shift laterally so that it rests on the limit column of the ceramic ring. During the process, the wafer may not be successfully adsorbed to the electrostatic chuck. At this time, the helium blown out of the helium hole on the electrostatic chuck will blow the wafer up briefly, and the position of the wafer is not controlled, and it may also rest on the limit column. If the above two situations occur and the wafer and the limit column are overlapped, since the equipment cannot monitor the relative position of the wafer and the limit column, the host computer will not display an alarm prompt message. At this time, there is a large gap between the wafer and the electrostatic chuck. A large amount of high-energy plasma generated by the start-up enters the gap and generates arc discharge on the electrostatic chuck, which is likely to cause the electrostatic chuck to break down or even melt, and cause fragments. In addition, after the process is completed, the phenomenon of insufficient desorption may occur. There is still a randomly distributed adsorption force between the wafer and the electrostatic chuck. When the ejector pin rises, the wafer instantly jumps up and moves laterally. In severe cases, the ejector pin may even be broken. At this time, if the vacuum robot performs the film removal action, the wafer may collide with the cavity wall or even the robot directly hits the wafer to cause fragments. Therefore, it is very important to monitor the relative position of the wafer and the upper limit column of the ceramic ring in real time to determine whether the wafer overlaps the limit column. In addition, the equipment often needs to re-calibrate the wafer position after replacing the robot or various accessories. The wafer position needs to be calibrated to the four limit columns. The conventional method is to open the cavity and cover it with a transparent cover, and observe with the naked eye whether the wafer has been placed in the limit column. However, opening the cavity will bring particle risks and the calibration efficiency is low. Therefore, if the relative position of the wafer and the upper limit column of the ceramic ring can be monitored in real time, the wafer position calibration can be performed without opening the cavity, reducing particle risks and improving calibration efficiency. In the prior art, there is currently no method to automatically monitor whether the wafer overlaps the ceramic ring limit column; for the overlapping inspection method, only a glass observation window with a diameter of 4 cm is set on the side wall of the cavity, and the glass observation window is used for observation with the naked eye; and when there is no glow emitted by the plasma, the cavity is a dark environment, which is difficult to observe directly; further, during normal delivery, it is not possible to judge in real time through the observation window with the naked eye whether the wafer overlap occurs. Summary of the invention

[0004] Based on the problems existing in the prior art, the present invention proposes a method for detecting the overlap between a wafer and a ceramic ring and a vapor deposition device thereof, which adopts the technical means of installing a Probe that can emit infrared light next to the limit column, thereby solving the current problem of being unable to automatically detect whether the wafer overlaps the limit column, and achieving the effect of reducing the ESC arcing risk and the risk of debris.

[0005] According to the first aspect of the technical solution of the present invention, the present invention provides a vapor deposition device for detecting the overlap between a wafer and a ceramic ring, which includes a cavity and a protective structure, an electrostatic suction cup is installed inside the cavity, three ejector pins are installed inside the electrostatic suction cup, a temperature probe is installed inside the electrostatic suction cup, a ceramic ring body is installed inside the cavity, an inner circle of helium and an outer circle of helium are respectively installed on the periphery of the electrostatic suction cup, four limit columns are installed inside the ceramic ring body, an edge ceramic ring is installed on the lower surface of the ceramic ring body, four infrared probes are installed inside the edge ceramic ring, and protective structures are provided on both sides of the cavity.

[0006] Preferably, the protective structure includes two connecting rails, the two connecting rails are fixedly connected to the cavity, the inner wall of the connecting rail is slidably connected with a round rod, the upper end of the round rod is fixedly connected with a connecting block, the ends of the two connecting blocks close to each other are fixedly connected with a protective plate, an acrylic perspective frame is installed inside the protective plate, a plurality of holes are opened on the upper surface of the connecting rail, the arc surface of the round rod is fixedly connected with a gasket, the arc surface of the round rod is slidably connected with a slip ring, the lower surface of the slip ring is fixedly connected with two plug rods, the plug rods are adapted to the holes, a spring is arranged inside the connecting rail, and the two ends of the spring are respectively fixedly connected to the round rod and the connecting rail.

[0007] Preferably, the inner wall of the slip ring is fixedly connected to a limit rod, the arc surface of the round rod is provided with a limit groove, and the limit groove is slidably connected to the limit rod. Preferably, the arc surface of the slip ring is provided with a plurality of anti-slip grooves, and the plurality of anti-slip grooves are evenly distributed on the slip ring. Preferably, the interior of the connecting rail is fixedly connected to a slide rod, the slide rod is slidably connected to the round rod, and the spring is sleeved on the arc surface of the slide rod.

[0008] Preferably, the upper surface of the cavity is provided with a taking-out structure, which includes a vertical rod, the vertical rod is fixedly connected to the cavity, the upper end of the vertical rod is rotatably connected to a swivel, the inner wall of the swivel is provided with a plurality of positioning grooves, the upper end of the vertical rod is slidably connected to an auxiliary rod, the upper end of the auxiliary rod is fixedly connected to a connecting pad, the lower surface of the connecting pad is fixedly connected to a plurality of positioning rods, the arc surface of the auxiliary rod is sleeved with a tension spring, the two ends of the tension spring are respectively fixedly connected to the connecting pad and the vertical rod, the arc surface of the swivel is fixedly connected to a connecting rod, the inner wall of the connecting rod is installed with a hydraulic rod, and the output end of the hydraulic rod is fixedly connected to a plurality of A plurality of traction rods are provided, wherein the lower end of the traction rod is fixedly connected with a circular ring, the lower end of the circular ring is fixedly connected with a plurality of fixing rods, the circular arc surface of the fixing rod is slidably connected with a lifting block, the interior of the lifting block is provided with two connecting grooves, the inner wall of the connecting groove is slidably connected with a clamping block, the interior of the connecting groove is provided with a resisting spring, the two ends of the resisting spring are respectively fixedly connected with the connecting groove and the clamping block, the circular arc surface of the fixing rod is provided with two clamping grooves, the clamping grooves are clamped with the connecting grooves, the ends of the plurality of lifting blocks close to each other are fixedly connected with a lifting plate, the interior of the cavity is fixedly connected with a plurality of fixing plates, and the lifting plate is placed on the fixing plate.

[0009] Preferably, a mounting rod is fixedly connected to the interior of the connecting groove, the mounting rod is slidably connected to the clamping block, and the resisting spring is sleeved on the arc surface of the mounting rod. An anti-slip sleeve is fixedly connected to the inner wall of the hanging block, and the cross section of the anti-slip sleeve is circular. A protective pad is fixedly connected to the upper surface of the lifting plate, and the protective pad is a rubber pad. The cross section of the connecting pad is circular, and the connecting pad is a rubber pad.

[0010] According to a second aspect of the technical solution of the present invention, the present invention provides a method for detecting overlap between a wafer and a ceramic ring, which comprises the following steps: Step S1, real-time monitoring of the relative position between the wafer and the limiting pillar; Step S2: If the wafer touches the limit column, the host computer immediately displays an alarm prompt message; Step S3, immediately stop the process step to be executed or the robot action to immediately stop; to prevent the serious consequences of wafer damage and electrostatic chuck damage.

[0011] Step S4, by real-time monitoring the relative position of the wafer and the upper limit pin on the ceramic ring, the wafer position calibration can be performed without opening a cavity, thereby reducing particle risk and improving calibration efficiency.

[0012] Compared with the prior art, the advantages and positive effects of the present invention are: 1. The present invention achieves the edge of the wafer and the limit column by setting the main structure. The host computer immediately displays an alarm prompt message, and the next process step or robot action to be executed is immediately stopped to prevent the serious consequences of wafer damage and electrostatic chuck damage. At the same time, by real-time monitoring the relative position of the wafer and the limit column on the ceramic ring, the wafer position calibration can be performed without opening a cavity, reducing the particle risk and improving the calibration efficiency.

[0013] 2. The present invention achieves the effect of conveniently protecting the interior of the cavity by setting a protective structure to prevent dust from entering the cavity when processing or inspecting wafers, and the internal situation can be observed through an acrylic perspective frame, which not only widens the observation field of view but also prevents dust from entering during wafer inspection or processing.

[0014] 3. The present invention achieves the convenience of taking out the wafers after inspection or processing by setting up the south zone structure, avoiding the inevitable contact of the wafers when the robot takes them out after inspection or processing. The wafers are easily damaged by bumps when the robot takes them out, and fingerprints will be left on the surface of the wafer when people take them out manually. The present device can directly lift the wafer upwards for removal, avoiding the links of large-scale transportation and reducing the probability of wafer damage.

[0015] 4. The present invention utilizes the principle that the reflectivity of infrared light emitted by the probe changes significantly depending on whether there is a wafer above the probe. By installing a probe next to the limit post, it is automatically determined whether the wafer touches the limit post, thereby reducing the arcing risk and fragmentation risk of the ESC.

[0016] 5. The present invention can perform wafer calibration without opening a cavity, avoiding the need to open a cavity to determine with the naked eye whether the wafer is within the limiting column, reducing particle risks and improving calibration efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A three-dimensional structural diagram of a wafer and ceramic ring overlap detection method and a vapor deposition device thereof is proposed for the present invention; Figure 2 The present invention proposes a wafer and ceramic ring overlap detection method and a vapor deposition device thereof Figure 1 Schematic diagram of some structures; Figure 3 The present invention proposes a wafer and ceramic ring overlap detection method and a vapor deposition device thereof Figure 1 Internal cross-sectional view of Figure 4 The present invention proposes a wafer and ceramic ring overlap detection method and a vapor deposition device thereof Figure 3 A magnified image of point A; Figure 5A method for detecting overlap between a wafer and a ceramic ring and a schematic diagram of a protective structure of a vapor deposition device thereof are proposed for the present invention; Figure 6 The present invention proposes a wafer and ceramic ring overlap detection method and a vapor deposition device thereof Figure 5 The enlarged view of point B; Figure 7 The present invention proposes a wafer and ceramic ring overlap detection method and a schematic diagram of the removal structure of a vapor deposition device; Figure 8 The present invention proposes a wafer and ceramic ring overlap detection method and a vapor deposition device thereof Figure 7 A schematic diagram of the side structure of Fig. 9 The present invention proposes a wafer and ceramic ring overlap detection method and a vapor deposition device thereof Figure 7 Schematic diagram of some structures; Fig.10 The present invention proposes a wafer and ceramic ring overlap detection method and a vapor deposition device thereof Figure 7 Schematic diagram of the local structure; Fig.11 The present invention proposes a wafer and ceramic ring overlap detection method and a vapor deposition device thereof Fig.10 Enlarged view of point C.

[0018] Legend: 1. Cavity; 2. Ejector pin; 3. Electrostatic chuck; 4. Temperature probe; 5. Ceramic ring body; 6. Inner ring helium; 7. Outer ring helium; 8. Limiting column; 9. Infrared probe; 10. Edge ceramic ring; 11. Protection structure; 1101. Protection plate; 1102. Acrylic perspective frame; 1103. Connecting rail; 1104. Socket; 1105. Connecting block; 1106. Gasket; 1107. Slip ring; 1108. Limiting rod; 1109. Limiting groove; 1110. Insert rod; 1111. Sliding rod; 1112. Spring; 1113. Anti-slip groove; 1114. Round rod; 12, taking out structure; 1201, vertical pole; 1202, traction rod; 1203, connecting pad; 1204, connecting rod; 1205, swivel; 1206, hydraulic rod; 1207, circular ring; 1208, fixing rod; 1209, protective pad; 1210, lifting plate; 1211, fixing plate; 1212, positioning rod; 1213, tension spring; 1214, auxiliary rod; 1215, positioning hole; 1216, lifting block; 1217, anti-slip sleeve; 1218, connecting groove; 1219, clamping groove; 1220, clamping block; 1221, mounting rod; 1222, resisting spring. DETAILED DESCRIPTION

[0019] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0020] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0021] In the prior art, when the wafer overlaps the limit post of the ceramic ring, the equipment cannot monitor and issue an alarm, which greatly increases the risk of wafer damage and electrostatic chuck damage. The present invention aims to develop a monitoring method to monitor the relative position of the wafer and the limit post in real time to prevent the serious consequences caused by the overlap of the wafer and the limit post. The present invention adopts the technical means of installing a probe that can emit infrared light next to the limit post, which solves the current problem of being unable to automatically detect whether the wafer overlaps the limit post, and achieves the effect of reducing the ESC arcing risk and the risk of debris.

[0022] The present invention provides a method for detecting overlap between a wafer and a ceramic ring, which comprises the following steps: Step S1, real-time monitoring of the relative position of the wafer and the limiting pillar; real-time monitoring of the relative position of the wafer and the limiting pillar by using the infrared light reflectivity detected by the Probe as the reference emissivity; Step S2: If the wafer touches the limit column, the host computer immediately displays an alarm prompt message; Step S3, immediately stop the process step to be executed or the robot action to immediately stop; to prevent the serious consequences of wafer damage and electrostatic chuck damage.

[0023] The present invention can calibrate the wafer position without opening a cavity by real-time monitoring the relative position of the wafer and the upper limit column on the ceramic ring, thereby reducing the particle risk and improving the calibration efficiency. Furthermore, a small hole is designed next to each of the four limit columns on the Cover Ring (ceramic ring body), and the small hole and the limit column are located on the same circumference. Below the Cover Ring is the edge ceramic ring (EdgeRing), which is evenly embedded with four probes that can emit infrared light. Its installation position is directly below the four small holes on the Cover Ring so that the infrared light emitted by the probe can pass through the small holes. Under normal circumstances, the wafer is within the four limit columns, that is, it will not be directly above the probe. At this time, the infrared light reflectivity detected by the probe is used as the reference emissivity. When the pin breaks and causes the wafer to slide, or the ESC fails to adsorb the wafer, causing the back helium to blow the wafer off, etc., any situation causes the wafer to be placed on the limit column, that is, directly above the probe, the infrared light reflectivity detected by the probe will increase significantly. Once this change is detected, the software control system immediately alarms and stops any operation that the device is performing or is about to perform.

[0024] On the other hand, the present invention provides a vapor deposition device for detecting the overlap between a wafer and a ceramic ring, which includes a cavity and a protective structure, an electrostatic chuck is installed inside the cavity, three ejector pins are installed inside the electrostatic chuck, a temperature probe is installed inside the electrostatic chuck, a ceramic ring body is installed inside the cavity, an inner circle of helium and an outer circle of helium are respectively installed on the periphery of the electrostatic chuck, four limit columns are installed inside the ceramic ring body, an edge ceramic ring is installed on the lower surface of the ceramic ring body, four infrared probes are installed inside the edge ceramic ring, and protective structures are provided on both sides of the cavity.

[0025] By adopting the above technical solution, the electrostatic chuck is assembled inside the cavity, and a temperature probe is embedded inside it to detect the temperature of the wafer in real time during the process. In addition, the electrostatic chuck is evenly embedded with three movable pins to place the wafer steadily on the surface of the electrostatic chuck and lift it off the surface. There are two circles of helium holes on the periphery of the electrostatic chuck. By adjusting the helium pressure, the temperature of the wafer during the process can be effectively controlled. There is a ceramic ring body around the electrostatic chuck, and there is a gap of about 0.3mm between the electrostatic chuck and the ceramic ring. There are four limit columns evenly distributed on the inside of the ceramic ring. Under normal circumstances, the wafer is placed on the electrostatic chuck. Inside the four limit columns, a small hole is designed next to each of the four limit columns on the ceramic ring body, and the small hole and the limit column are located on the same circumference. Below the ceramic ring body is an edge ceramic ring, which is evenly embedded with four infrared probes that can emit infrared light. Its installation position is directly below the four small holes on the ceramic ring body, so that the infrared light emitted by the infrared probe can pass through the small holes. Under normal circumstances, the wafer is within the four limit posts, that is, it is not directly above the infrared probe. At this time, the infrared light reflectivity detected by the infrared probe is used as the reference emissivity. When the ejector pin breaks and causes the wafer to slide, or the electrostatic chuck fails to adsorb the wafer, causing the helium on the back to blow the wafer off, etc., the wafer is placed on the limit posts, that is, directly above the infrared probe, and the infrared light reflectivity detected by the infrared probe will increase significantly. Once such a change is detected, the software control system will immediately alarm and stop any operation that the device is performing or is about to perform.

[0026] In one embodiment, the protective structure includes two connecting rails, the two connecting rails are fixedly connected to the cavity, the inner wall of the connecting rail is slidably connected with a round rod, the upper end of the round rod is fixedly connected with a connecting block, the ends of the two connecting blocks close to each other are fixedly connected with a protective plate, an acrylic perspective frame is installed inside the protective plate, a plurality of holes are opened on the upper surface of the connecting rail, the arc surface of the round rod is fixedly connected with a gasket, the arc surface of the round rod is slidably connected with a slip ring, the lower surface of the slip ring is fixedly connected with two plug rods, the plug rods are adapted to the holes, a spring is arranged inside the connecting rail, and the two ends of the spring are respectively fixedly connected to the round rod and the connecting rail. By adopting this preferred scheme, when the protective plate needs to be opened, the protective plate is pulled to move, the protective plate drives the acrylic perspective frame to move, the protective plate drives the two connecting blocks to move, the connecting block drives the round rod to move, the round rod drives the gasket to move, the round rod slides on the inner wall of the connecting rail, the round rod drives the spring to stretch, and after moving to the appropriate position, the slip ring is pulled to move, the slip ring slides on the arc surface of the round rod, the slip ring drives the insertion rod to move, and after moving to the appropriate position, the slip ring is pulled to drive the insertion rod to be inserted into the socket for fixing, when the cavity needs to be protected, the slip ring is pulled to move, the slip ring drives the insertion rod to separate from the socket, and then the spring contracts to drive the round rod to reset, the round rod drives the connecting block to move, the connecting block drives the protective plate to reset, and then the protective plate protects the cavity.

[0027] In one embodiment, the inner wall of the slip ring is fixedly connected to a limit rod, the arc surface of the round rod is provided with a limit groove, and the limit groove is slidably connected to the limit rod. With this preferred solution, the limit rod can limit the slip ring to prevent the slip ring from rotating when moving, thereby making it difficult to align the plug rod with the plug hole.

[0028] In one embodiment, the arc surface of the slip ring is provided with a plurality of anti-skid grooves, and the plurality of anti-skid grooves are evenly distributed on the slip ring. With this preferred solution, the anti-skid grooves can increase the friction between the hand and the slip ring, thereby preventing slipping when pulling the slip ring.

[0029] In one embodiment, a slide bar is fixedly connected to the interior of the connecting rail, the slide bar is slidably connected to the round bar, and the spring is sleeved on the arc surface of the slide bar. With this preferred solution, the slide bar can limit the spring, avoiding deformation of the spring during use, thereby increasing the service life of the spring.

[0030] In one embodiment, a take-out structure is provided on the upper surface of the cavity, and the take-out structure includes a vertical rod, the vertical rod is fixedly connected to the cavity, the upper end of the vertical rod is rotatably connected to a swivel, the inner wall of the swivel is provided with a plurality of positioning grooves, the upper end of the vertical rod is slidably connected to an auxiliary rod, the upper end of the auxiliary rod is fixedly connected to a connecting pad, the lower surface of the connecting pad is fixedly connected to a plurality of positioning rods, the arc surface of the auxiliary rod is sleeved with a tension spring, the two ends of the tension spring are respectively fixedly connected to the connecting pad and the vertical rod, the arc surface of the swivel is fixedly connected to a connecting rod, the inner wall of the connecting rod is installed with a hydraulic rod, and the output end of the hydraulic rod is fixedly connected There are several traction rods, the lower end of the traction rod is fixedly connected with a circular ring, the lower end of the circular ring is fixedly connected with several fixing rods, the circular arc surface of the fixing rod is slidably connected with a lifting block, two connecting grooves are provided inside the lifting block, the inner wall of the connecting groove is slidably connected with a clamping block, a resistance spring is arranged inside the connecting groove, the two ends of the resistance spring are respectively fixedly connected with the connecting groove and the clamping block, the circular arc surface of the fixing rod is provided with two clamping grooves, the clamping grooves are clamped with the connecting grooves, the ends of several lifting blocks close to each other are fixedly connected with lifting plates, and several fixing plates are fixedly connected inside the cavity, and the lifting plates are placed on the fixing plates. By adopting this preferred solution, when the wafer needs to be hoisted, the protective structure is first opened to remove the protective plate, and then the connecting pad is pulled to move, the connecting pad drives the auxiliary rod to move, the auxiliary rod slides on the inner wall of the vertical rod, the connecting pad drives the tension spring to stretch, the connecting pad drives the positioning rod and the positioning hole to separate, and then the swivel is rotated to move, the swivel drives the connecting rod to move, and after moving to the appropriate position, the connecting pad is released, the tension spring contracts to drive the positioning rod and the positioning hole to be connected and fixed, and then the hydraulic rod is started to operate, the hydraulic rod drives the traction rod to move, the traction rod drives the ring to move, and the ring drives the fixing rod to move. The lifting block is connected to the fixed rod, and then the hydraulic rod is started to retract, the hydraulic rod drives the traction rod to move, the traction rod drives the ring to move, the ring drives the fixed rod to move upward, the fixed rod drives the lifting block to move, the lifting block drives the lifting plate to move upward, the lifting plate lifts the wafer, and then removes the wafer, thereby completing the effect of taking out the wafer.

[0031] In one embodiment, a mounting rod is fixedly connected to the interior of the connection groove, the mounting rod is slidably connected to the clamping block, and the resisting spring is sleeved on the arc surface of the mounting rod. With this preferred solution, the mounting rod can limit the resisting spring, thereby preventing the resisting spring from deforming during use and prolonging the service life of the resisting spring.

[0032] In one embodiment, the inner wall of the lifting block is fixedly connected with an anti-skid sleeve, and the cross section of the anti-skid sleeve is circular. With this preferred solution, the anti-skid sleeve can increase the friction between the lifting block and the fixing rod, thereby preventing the fixing rod from loosening when connected to the lifting block.

[0033] In one embodiment, a protective pad is fixedly connected to the upper surface of the lifting plate, and the protective pad is a rubber pad. With this preferred solution, the protective pad can protect the wafer and avoid the wafer from being damaged due to wear when the wafer is lifted.

[0034] In one embodiment, the cross section of the connection pad is circular, and the connection pad is a rubber pad. With this preferred solution, the rubber material can increase the friction between the hand and the connection pad to avoid slipping when pulling the connection pad.

[0035] In another embodiment, a vapor deposition device is provided, which includes a cavity, a pin, an electrostatic chuck, a temperature probe, a ceramic ring, an inner circle of helium, an outer circle of helium 7, a limit column and an infrared probe; the ESC is assembled inside the cavity, and a temperature probe (Probe) is embedded inside the cavity to detect the temperature of the wafer in real time during the process. In addition, the ESC is evenly embedded with three movable pins for stably placing the wafer on the surface of the ESC and lifting it off the surface. There are two circles of helium holes on the periphery of the ESC, and the temperature of the wafer during the process can be effectively controlled by adjusting the helium pressure. There is a Cover Ring (ceramic ring body) around the ESC, and there is a gap of about 0.3mm between the Cover Ring and the ESC. There are four limit columns evenly distributed on the inside of the ceramic ring. Under normal circumstances, the wafer is placed in the four limit columns when it is placed on the electrostatic chuck. A small hole is designed next to each of the four limit columns on the Cover Ring, and the small hole and the limit column are located on the same circumference. Below the Cover Ring is the EdgeRing, which has four infrared-emitting Probes evenly embedded inside. The EdgeRing is installed just below the four small holes on the Cover Ring so that the infrared light emitted by the Probes can pass through the small holes. Under normal circumstances, the wafer is within the four limit posts, that is, it is not directly above the Probes. At this time, the infrared light reflectivity detected by the Probes is used as the benchmark emissivity. When the Pin breaks and causes the wafer to slip, or the ESC fails to adsorb the wafer, causing the helium on the back to blow the wafer off, etc., causing the wafer to rest on the limit posts, that is, directly above the Probes, the infrared light reflectivity detected by the Probes will increase significantly. Once this change is detected, the software control system will immediately sound an alarm and stop any operation that the device is performing or is about to perform.

[0036] The detailed structure and working principle of the present invention are further explained below in conjunction with the accompanying drawings.

[0037] like Figure 1-Figure 11 As shown, the present invention provides a vapor deposition device for detecting the overlap between a wafer and a ceramic ring, including a cavity 1 and a protective structure 11, an electrostatic chuck 3 is installed inside the cavity 1, three ejector pins 2 are installed inside the electrostatic chuck 3, a temperature probe 4 is installed inside the electrostatic chuck 3, a ceramic ring body 5 is installed inside the cavity 1, an inner ring of helium 6 and an outer ring of helium 7 are installed on the periphery of the electrostatic chuck 3, four limit columns 8 are installed inside the ceramic ring body 5, an edge ceramic ring 10 is installed on the lower surface of the ceramic ring body 5, and four infrared probes 9 are installed inside the edge ceramic ring 10, protective structures 11 are provided on both sides of the cavity 1, and a removal structure 12 is provided on the upper surface of the cavity 1, and the electrostatic chuck 3 is assembled inside the cavity 1, and a temperature measuring probe is embedded inside it for real-time detection of the temperature of the wafer during the process. In addition, the electrostatic chuck 3 is evenly embedded with three movable ejector pins 2, which are used to stably place the wafer on the surface of the electrostatic chuck 3 and lift it off the surface. There are two circles of helium holes on the periphery of the electrostatic chuck 3. By adjusting the helium pressure, the temperature of the wafer during the process can be effectively controlled. There is a ceramic ring body 5 around the electrostatic chuck 3, and there is a gap of about 0.3mm between the electrostatic chuck 3 and the ceramic ring. Four limit posts 8 are evenly distributed on the inner side of the ceramic ring. Under normal circumstances, the wafer is placed on the electrostatic chuck 3. A small hole is designed next to each of the four limit posts 8 on the ceramic ring body 5, and the small hole and the limit post 8 are located on the same circumference. Below the ceramic ring body 5 is an edge ceramic ring 10, which is evenly embedded with four infrared probes 9 that can emit. Its installation position is directly below the four small holes on the ceramic ring body 5, so that the infrared light emitted by the infrared probe 9 can pass through the small holes. Under normal circumstances, the wafer is in the four limit posts 8, that is, it will not be directly above the infrared probe 9. At this time, the infrared light reflectivity detected by the infrared probe 9 is used as the reference emissivity. When the ejector pin 2 breaks and causes the wafer to slip, or the electrostatic chuck 3 fails to adsorb the wafer and causes the helium on the back to blow the wafer off course, etc., causing the wafer to rest on the limit column 8, that is, directly above the infrared probe 9, the infrared light reflectivity detected by the infrared probe 9 will increase significantly. Once such a change is detected, the software control system will immediately alarm and stop any operation that the device is performing or is about to perform.

[0038] The specific configuration and function of the protection structure 11 and the removal structure 12 will be described in detail below.

[0039] like Figure 5 and Figure 6As shown, the protective structure 11 includes two connecting rails 1103, the two connecting rails 1103 are fixedly connected to the cavity 1, the inner wall of the connecting rail 1103 is slidably connected with a round rod 1114, the upper end of the round rod 1114 is fixedly connected with a connecting block 1105, the ends of the two connecting blocks 1105 close to each other are fixedly connected with a protective plate 1101, an acrylic perspective frame 1102 is installed inside the protective plate 1101, a plurality of jacks 1104 are opened on the upper surface of the connecting rail 1103, the arc surface of the round rod 1114 is fixedly connected with a gasket 1106, the arc surface of the round rod 1114 is slidably connected with a slip ring 1107, the lower surface of the slip ring 1107 is fixedly connected with two plug rods 1110, the plug rods 1110 are adapted to the plug holes 1104, and the connecting A spring 1112 is provided inside the connecting rail 1103, and the two ends of the spring 1112 are fixedly connected to the round rod 1114 and the connecting rail 1103 respectively. When the protective plate 1101 needs to be opened, the protective plate 1101 is pulled to move, and the protective plate 1101 drives the acrylic perspective frame 1102 to move, and the protective plate 1101 drives the two connecting blocks 1105 to move, and the connecting blocks 1105 drive the round rod 1114 to move, and the round rod 1114 drives the gasket 1106 to move, and the round rod 1114 slides on the inner wall of the connecting rail 1103, and the round rod 1114 drives the spring 1112 to stretch, and after moving to a suitable position, the slip ring 1107 is pulled to move, and the slip ring 1107 is moved on the arc surface of the round rod 1114. Sliding, the slip ring 1107 drives the plug rod 1110 to move, and after moving to the appropriate position, the slip ring 1107 is pulled to drive the plug rod 1110 to be inserted into the socket 1104 for fixing. When the cavity 1 needs to be protected, the slip ring 1107 is pulled to move, and the slip ring 1107 drives the plug rod 1110 to separate from the socket 1104, and then the spring 1112 contracts to drive the round rod 1114 to reset, and the round rod 1114 drives the connecting block 1105 to move, and the connecting block 1105 drives the protective plate 1101 to reset, and then the protective plate 1101 protects the cavity 1, and the inner wall of the slip ring 1107 is fixedly connected to the limit rod 1108, and the arc surface of the round rod 1114 is provided with a limit groove 1109, and the limit groove 1109 The sliding connection with the limit rod 1108 can limit the slip ring 1107 to prevent the slip ring 1107 from rotating when moving, thereby making it difficult to align the insertion rod 1110 with the insertion hole 1104. The arc surface of the slip ring 1107 is provided with a plurality of anti-skid grooves 1113, and the plurality of anti-skid grooves 1113 are evenly distributed on the slip ring 1107. The anti-skid grooves 1113 can increase the friction between the hand and the slip ring 1107 to prevent the slip when the slip ring 1107 is pulled. The interior of the connecting rail 1103 is fixedly connected with a sliding rod 1111, and the sliding rod 1111 is slidingly connected with the round rod 1114. The spring 1112 is sleeved on the arc surface of the sliding rod 1111, and the sliding rod 1111 can limit the spring 1112.This prevents the spring 1112 from deforming during use, thereby increasing the service life of the spring 1112.

[0040] The entire protective structure 11 has the effect of not only widening the observation field of view but also preventing dust from entering during wafer inspection or processing.

[0041] like Figures 7 to 11As shown, the taking-out structure 12 includes a vertical rod 1201, the vertical rod 1201 is fixedly connected to the cavity 1, the upper end of the vertical rod 1201 is rotatably connected to a swivel 1205, the inner wall of the swivel 1205 is provided with a plurality of positioning grooves, the upper end of the vertical rod 1201 is slidably connected to an auxiliary rod 1214, the upper end of the auxiliary rod 1214 is fixedly connected to a connecting pad 1203, the lower surface of the connecting pad 1203 is fixedly connected to a plurality of positioning rods 1212, the arc surface of the auxiliary rod 1214 is sleeved with a tension spring 1213, the two ends of the tension spring 1213 are respectively fixedly connected to the connecting pad 1203 and the vertical rod 1201, the arc surface of the swivel 1205 is fixedly connected to the connecting rod 1204, the inner wall of the connecting rod 1204 is provided with a hydraulic rod 1206 for outputting the hydraulic rod 1206 The outlet end is fixedly connected with a plurality of traction rods 1202, the lower end of the traction rod 1202 is fixedly connected with a ring 1207, the lower end of the ring 1207 is fixedly connected with a plurality of fixed rods 1208, the arc surface of the fixed rod 1208 is slidably connected with a lifting block 1216, the interior of the lifting block 1216 is provided with two connecting grooves 1218, the inner wall of the connecting groove 1218 is slidably connected with a clamping block 1220, the interior of the connecting groove 1218 is provided with a resist spring 1222, the two ends of the resist spring 1222 are respectively fixedly connected with the connecting groove 1218 and the clamping block 1220, the arc surface of the fixed rod 1208 is provided with two clamping grooves 1219, the clamping groove 1219 is clamped with the connecting groove 1218, and the ends of the plurality of lifting blocks 1216 close to each other are fixedly connected with Lifting plate 1210, several fixing plates 1211 are fixedly connected inside the cavity 1, and the lifting plate 1210 is placed on the fixing plate 1211. When the wafer needs to be hoisted, the protective structure 11 is first opened to remove the protective plate 1101, and then the connecting pad 1203 is pulled to move, and the connecting pad 1203 drives the auxiliary rod 1214 to move, and the auxiliary rod 1214 slides on the inner wall of the vertical rod 1201, and the connecting pad 1203 drives the tension spring 1213 to stretch, and the connecting pad 1203 drives the positioning rod 1212 and the positioning hole 1215 to separate, and then the rotating ring 1205 is rotated to move, and the rotating ring 1205 drives the connecting rod 1204 to move, and after moving to the appropriate position, the connecting pad 1203 is released, and the tension spring 1213 is released. The positioning rod 1212 is contracted and connected and fixed with the positioning hole 1215, and then the hydraulic rod 1206 is started to operate, the hydraulic rod 1206 drives the traction rod 1202 to move, the traction rod 1202 drives the ring 1207 to move, the ring 1207 drives the fixing rod 1208 to move, and then the fixing rod 1208 is inserted into the lifting block 1216, the fixing rod 1208 slides on the inner wall of the lifting block 1216, the fixing rod 1208 squeezes the card block 1220, the card block 1220 slides on the inner wall of the connecting groove 1218, the card block 1220 drives the resisting spring 1222 to contract, and after moving to the appropriate position, the resisting spring 1222 is stretched to drive the card block 1220 to be clamped into the card slot 1219 for fixation,Then the lifting block 1216 is connected to the fixed rod 1208, and then the hydraulic rod 1206 is started to retract, the hydraulic rod 1206 drives the traction rod 1202 to move, the traction rod 1202 drives the ring 1207 to move, the ring 1207 drives the fixed rod 1208 to move upward, the fixed rod 1208 drives the lifting block 1216 to move, the lifting block 1216 drives the lifting plate 1210 to move upward, the lifting plate 1210 lifts the wafer, and then removes the wafer, thereby completing the effect of taking out the wafer, the interior of the connecting groove 1218 is fixedly connected with the mounting rod 1221, the mounting rod 1221 is slidably connected with the clamping block 1220, the resisting spring 1222 is sleeved on the arc surface of the mounting rod 1221, the mounting rod 1221 can limit the resisting spring 1222, and avoid the resisting spring 12 22 is deformed during use, which increases the service life of the spring 1222. The inner wall of the lifting block 1216 is fixedly connected with an anti-skid cover 1217. The cross section of the anti-skid cover 1217 is circular. The anti-skid cover 1217 can increase the friction between the lifting block 1216 and the fixed rod 1208 to prevent the fixed rod 1208 from loosening when connected to the lifting block 1216. The upper surface of the lifting plate 1210 is fixedly connected with a protective pad 1209. The protective pad 1209 is a rubber pad. The protective pad 1209 can protect the wafer to prevent the wafer from being damaged due to wear when the wafer is lifted. The cross section of the connecting pad 1203 is circular. The connecting pad 1203 is a rubber pad. The rubber material can increase the friction between the hand and the connecting pad 1203 to prevent sliding when the connecting pad 1203 is pulled.

[0042] The effect achieved by the entire taking-out structure 12 is that the wafer can be directly lifted upward for taking out, thereby avoiding the link of large-scale transportation and reducing the probability of wafer damage.

[0043] The overall working principle is as follows: 1. The electrostatic chuck 3 is assembled inside the cavity 1, and a temperature probe is embedded inside the cavity 1 for real-time detection of the temperature of the wafer during the process. In addition, the electrostatic chuck 3 is evenly embedded with three movable ejector pins 2 for stably placing the wafer on the surface of the electrostatic chuck 3 and lifting it off the surface. There are two circles of helium holes on the periphery of the electrostatic chuck 3. By adjusting the helium pressure, the temperature of the wafer during the process can be effectively controlled. There is a ceramic ring body 5 around the electrostatic chuck 3, and there is a gap of about 0.3mm between the electrostatic chuck 3. Four limiting columns 8 are evenly distributed on the inside of the ceramic ring. Under normal circumstances, the wafer is placed on the electrostatic chuck 3. A small hole is designed next to each of the four limiting columns 8 on the ceramic ring body 5, and the small hole and the limiting column 8 are located on the same circumference. Below the ceramic ring body 5 is an edge ceramic ring 10, which is evenly embedded with four infrared probes 9 that can emit infrared light. Its installation position is directly below the four small holes on the ceramic ring body 5, so that the infrared light emitted by the infrared probe 9 can pass through the small holes. Under normal circumstances, the wafer is within the four limit posts 8, that is, it is not directly above the infrared probe 9. At this time, the infrared light reflectivity detected by the infrared probe 9 is used as the reference emissivity. When the ejector pin 2 breaks and causes the wafer to slide, or the electrostatic chuck 3 fails to adsorb the wafer, causing the helium gas on the back to blow the wafer off, etc., the wafer is placed on the limit posts 8, that is, directly above the infrared probe 9. The infrared light reflectivity detected by the infrared probe 9 will increase significantly. Once such a change is detected, the software control system will immediately alarm and stop any operation that the device is performing or is about to perform.

[0044] 2. When the protective plate 1101 needs to be opened, pull the protective plate 1101 to move, the protective plate 1101 drives the acrylic perspective frame 1102 to move, the protective plate 1101 drives the two connecting blocks 1105 to move, the connecting block 1105 drives the round rod 1114 to move, the round rod 1114 drives the gasket 1106 to move, the round rod 1114 slides on the inner wall of the connecting rail 1103, the round rod 1114 drives the spring 1112 to stretch, and after moving to the appropriate position, pull the slip ring 1107 to move, the slip ring 1107 slides on the arc surface of the round rod 1114, the slip ring 1107 drives the insertion rod 1110 to move, and after moving to the appropriate position, pull the slip ring 1107 to drive the insertion rod 1110 to be inserted into the jack 1104 for fixing, and when the cavity 1 needs to be protected, pull the slip ring 1107 107 moves, the slip ring 1107 drives the insertion rod 1110 to separate from the socket 1104, then the spring 1112 contracts and drives the round rod 1114 to reset, the round rod 1114 drives the connecting block 1105 to move, the connecting block 1105 drives the protective plate 1101 to reset, and then the protective plate 1101 protects the cavity 1, the limiting rod 1108 can limit the slip ring 1107 to prevent the slip ring 1107 from rotating when moving, which makes it difficult to align the insertion rod 1110 with the socket 1104, the anti-slip groove 1113 can increase the friction between the hand and the slip ring 1107 to avoid sliding when pulling the slip ring 1107, the sliding rod 1111 can limit the spring 1112 to prevent the spring 1112 from deforming when in use, thereby increasing the service life of the spring 1112.

[0045] 3. When the wafer needs to be hoisted, first open the protection structure 11 and remove the protection plate 1101, then pull the connection pad 1203 to move, the connection pad 1203 drives the auxiliary rod 1214 to move, the auxiliary rod 1214 slides on the inner wall of the vertical rod 1201, the connection pad 1203 drives the tension spring 1213 to stretch, the connection pad 1203 drives the positioning rod 1212 and the positioning hole 1215 to separate, then rotate the swivel 1205 to move, the swivel 1205 drives the connecting rod 1204 to move, and after moving to the appropriate position, release the connection pad 1203, and the tension spring 1213 is The contraction drives the positioning rod 1212 to connect and fix with the positioning hole 1215, and then the hydraulic rod 1206 is started to operate, the hydraulic rod 1206 drives the traction rod 1202 to move, the traction rod 1202 drives the ring 1207 to move, the ring 1207 drives the fixing rod 1208 to move, and then the fixing rod 1208 is inserted into the lifting block 1216, the fixing rod 1208 slides on the inner wall of the lifting block 1216, the fixing rod 1208 squeezes the block 1220, the block 1220 slides on the inner wall of the connecting groove 1218, and the block 1220 drives the spring 1222 to contract. After moving to the appropriate position, the resisting spring 1222 is stretched to drive the card block 1220 to be fixed in the card slot 1219, and then the lifting block 1216 is connected to the fixing rod 1208, and then the hydraulic rod 1206 is started to be retracted, the hydraulic rod 1206 drives the traction rod 1202 to move, the traction rod 1202 drives the ring 1207 to move, the ring 1207 drives the fixing rod 1208 to move upward, the fixing rod 1208 drives the lifting block 1216 to move, the lifting block 1216 drives the lifting plate 1210 to move upward, the lifting plate 1210 lifts the wafer, and then the wafer is removed, and then the wafer is removed. In order to complete the effect of taking out the wafer, the mounting rod 1221 can limit the spring 1222 to prevent the spring 1222 from being deformed during use, thereby increasing the service life of the spring 1222; the anti-slip sleeve 1217 can increase the friction between the lifting block 1216 and the fixed rod 1208 to prevent the fixed rod 1208 from loosening when connected to the lifting block 1216; the protective pad 1209 can protect the wafer to prevent damage to the wafer due to wear when the wafer is lifted; the rubber material can increase the friction between the hand and the connecting pad 1203 to prevent sliding when the connecting pad 1203 is pulled.

[0046] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A vapor deposition device for detecting overlap between a wafer and a ceramic ring, comprising a chamber (1) and a protective structure (11), characterized in that: An electrostatic chuck (3) is installed inside the cavity (1), three ejector pins (2) are installed inside the electrostatic chuck (3), and a temperature probe (4) is installed inside the electrostatic chuck (3).

2. The vapor deposition device for detecting overlap between a wafer and a ceramic ring according to claim 1, characterized in that: A ceramic ring body (5) is installed inside the cavity (1), an inner ring of helium (6) and an outer ring of helium (7) are installed on the periphery of the electrostatic chuck (3), four limit columns (8) are installed inside the ceramic ring body (5), an edge ceramic ring (10) is installed on the lower surface of the ceramic ring body (5), four infrared probes (9) are installed inside the edge ceramic ring (10), and protective structures (11) are provided on both sides of the cavity (1).

3. The vapor deposition device for detecting overlap between a wafer and a ceramic ring according to claim 2, characterized in that: The protective structure (11) comprises two connecting rails (1103), the two connecting rails (1103) being fixedly connected to the cavity (1), the inner walls of the connecting rails (1103) being slidably connected to round rods (1114), the upper ends of the round rods (1114) being fixedly connected to connecting blocks (1105), and the ends of the two connecting blocks (1105) close to each other being fixedly connected to protective plates (1101).

4. The vapor deposition device for detecting overlap between a wafer and a ceramic ring according to claim 3, characterized in that: An acrylic perspective frame (1102) is installed inside the protective plate (1101), a plurality of insertion holes (1104) are provided on the upper surface of the connecting rail (1103), a gasket (1106) is fixedly connected to the arc surface of the round rod (1114), a slip ring (1107) is slidably connected to the arc surface of the round rod (1114), and two insertion rods (1110) are fixedly connected to the lower surface of the slip ring (1107).

5. The vapor deposition device for detecting overlap between a wafer and a ceramic ring according to claim 4, characterized in that: The insertion rod (1110) is matched with the insertion hole (1104), and a spring (1112) is provided inside the connecting rail (1103), and two ends of the spring (1112) are respectively fixedly connected to the round rod (1114) and the connecting rail (1103).

6. The vapor deposition device for detecting overlap between a wafer and a ceramic ring according to claim 4, characterized in that: The inner wall of the slip ring (1107) is fixedly connected to a limit rod (1108); the arc surface of the round rod (1114) is provided with a limit groove (1109); the limit groove (1109) is slidably connected to the limit rod (1108).

7. The vapor deposition device for detecting overlap between a wafer and a ceramic ring according to claim 6, characterized in that: The arc surface of the slip ring (1107) is provided with a plurality of anti-slip grooves (1113), and the plurality of anti-slip grooves (1113) are evenly distributed on the slip ring (1107).

8. The vapor deposition device for detecting overlap between a wafer and a ceramic ring according to claim 5, characterized in that: A sliding rod (1111) is fixedly connected inside the connecting rail (1103), the sliding rod (1111) is slidably connected to the round rod (1114), and the spring (1112) is sleeved on the arc surface of the sliding rod (1111).

9. The vapor deposition device for detecting overlap between a wafer and a ceramic ring according to claim 1, characterized in that: The upper surface of the cavity (1) is provided with a removal structure (12), the removal structure (12) comprising a vertical rod (1201), the vertical rod (1201) being fixedly connected to the cavity (1), the upper end of the vertical rod (1201) being rotatably connected to a swivel (1205).

10. A method for detecting overlap between a wafer and a ceramic ring, comprising the following steps: Step S1, real-time monitoring of the relative position between the wafer and the limiting pillar; Step S2: If the wafer touches the limit column, the host computer immediately displays an alarm prompt message; Step S3, immediately stop the process step to be executed or the robot movement immediately stops.

Images