Device for electroless gold plating of flexible circuit board and electroless gold plating method thereof

Abstract

The invention discloses a flexible circuit board gold immersion device and a gold immersion method thereof, and relates to the technical field of circuit board processing. The device comprises a machine table, and a machine cover is fixed at the top end of the machine table; the traction moving mechanism drives the moving frame to transversely and horizontally move at the top end in the machine cover, the lifting adjusting mechanism drives the driving box to ascend and descend below the moving frame, and meanwhile the motor drives the clamping blocks to clamp circuit board raw materials. Therefore, automatic feeding and discharging of the circuit board can be achieved in the electroless gold plating process of the circuit board, and electroless gold plating soaking treatment is conducted on the circuit board through the electroless gold plating solution in the electroless gold plating solution pool; the temperature and the pH value of the electroless gold plating solution are adaptively adjusted through the temperature adjusting and controlling mechanism and the pH value adjusting and controlling mechanism respectively, and the spraying cleaning mechanism and the drying mechanism are arranged above the funnel water guide groove in the top end of the machine table respectively, so that the circuit board can be cleaned and dried in time after electroless gold plating treatment.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to a gold-plating device for a flexible circuit board and a gold-plating method thereof. Background Art

[0002] Flexible Printed Circuit (FPC) is a printed circuit board made of a flexible insulating substrate. It usually uses flexible materials such as polyimide (PI) or polyester (PET) as the substrate. It has good bendability and flexibility and can be bent, rolled and folded freely. Flexible circuit boards embed circuit designs on flexible and thin plastic sheets to achieve the purpose of stacking a large number of precision components in a narrow and limited space. Flexible circuit boards have been widely used in many fields due to their unique physical properties and application advantages, promoting the innovation and development of electronic products.

[0003] The gold plating process for flexible circuit boards refers to the process in which, during the production of flexible circuit boards, the circuit boards are immersed in gold through the corresponding gold plating device and the copper foil on the circuit boards is treated with chemical gold plating. The purpose of this treatment is to improve the corrosion resistance and conductivity of the circuit boards, and it also helps with subsequent welding and electrical connections. After the gold plating process is completed, a layer of golden metal layer will be formed on the copper foil surface of the FPC. This gold layer is not only beautiful, but also has good corrosion resistance and wear resistance, which can significantly improve the service life and reliability of the FPC.

[0004] Most of the existing gold-plating devices for flexible circuit boards have a single function and only have a single gold-plating immersion function for circuit boards. After gold-plating, the circuit boards need to be taken out and cleaned and dried respectively by other cleaning and drying equipment. Not only is the operation cumbersome, but it also reduces the overall gold-plating processing efficiency of the circuit boards. In addition, the intelligence level is low. During the gold-plating process, the pH value and temperature of the gold-plating solution cannot be automatically and adaptively adjusted, which is inconvenient to use. In addition, the automation level is not high, and the circuit boards cannot be automatically loaded and unloaded, which increases unnecessary labor costs. Therefore, the present invention proposes a gold-plating device for flexible circuit boards and a gold-plating method thereof to solve the problems existing in the prior art. Summary of the invention

[0005] In view of the above problems, the purpose of the present invention is to propose a device for gold plating on a flexible circuit board and a gold plating method thereof, so as to solve the problems that the existing device for gold plating on a flexible circuit board cannot clean and dry the circuit board in time after gold plating, resulting in low gold plating efficiency, and cannot automatically and adaptively adjust the pH value and temperature of the gold plating solution during the gold plating process, and cannot automatically load and unload the circuit board.

[0006] In order to achieve the purpose of the present invention, the present invention is implemented by the following technical solutions: a flexible circuit board gold-plating device, including a machine, a machine cover is fixed on the top of the machine, a raw material placement table and a finished product placement table are slidably connected on both sides of the top of the machine, and circuit board placement grooves are equidistantly provided on the top of the raw material placement table and the finished product placement table, and a moving frame driven to translate by a traction moving mechanism is slidably provided on the top of the inner top of the machine cover, a driving box driven to lift by a lifting adjustment mechanism is suspended below the moving frame, and clamps driven by a motor are symmetrically provided at the bottom of the driving box. Clamps are equidistantly connected to the opposite sides of the two groups of clamps, and a circuit board clamping groove is provided on the side of the clamp away from the clamp, and a gold-plating solution pool is fixed on the side of the top of the machine close to the raw material placement table, a temperature control mechanism is provided inside the gold-plating solution pool, and a pH value control mechanism connected to the gold-plating solution pool is provided at the bottom of the machine, a funnel water guide groove is provided on the side of the top of the machine close to the finished product placement table, a drainage pipe penetrating to the bottom of the machine is fixed at the bottom of the funnel water guide groove, and a spray cleaning mechanism and a drying mechanism are provided above the funnel water guide groove.

[0007] A further improvement is that the traction moving mechanism includes a reel fixed on the left and right sides of the top of the inner hood and a wire rope wound around the reel wheel at the output end of the reel, the end of the wire rope away from the reel is fixedly connected to the moving frame, concave frames are fixed on the front and back sides of the top of the inner hood, support plates are fixed on the front and back outer walls of the moving frame, and pulleys are symmetrically fixed to the bottom ends of the support plates, which are in contact with the top of the inner side of the concave frames.

[0008] A further improvement is that the lifting and lowering adjustment mechanism includes a first motor fixed to the top of the moving frame and a one-way screw rod rotatably connected to the inside of the moving frame and driven to rotate by the first motor, a threaded plate is threadedly sleeved on the one-way screw rod, a suspension rod is symmetrically fixed to the bottom end of the threaded plate that slides through the bottom end of the moving frame and is fixedly connected to the drive box, a protective box is fixed to the outside of the first motor, and a through groove adapted to the protective box is opened at the top of the hood.

[0009] A further improvement is that the output end of the motor passes through the inside of the drive box through a bearing and is fixed with a bidirectional screw rod, both sides of the bidirectional screw rod are threadedly sleeved with threaded blocks, the bottom end of the threaded block slides through the bottom end of the drive box and is fixedly connected to the splint.

[0010] A further improvement is that the temperature control mechanism includes a temperature sensor and a heating plate fixed to the inner wall of the gold solution pool, and the temperature sensor is electrically connected to the heating plate.

[0011] A further improvement is that a second motor is fixed to the bottom end of the gold solution pool, and an output end of the second motor penetrates into the gold solution pool through a sealed bearing and is fixed with a concave stirring rod.

[0012] A further improvement is that the pH value regulating mechanism includes a pH sensor fixed to the inner wall of the gold solution pool and an acid tank and an alkali tank fixed to the front and rear sides of the bottom of the machine, the acid tank and the alkali tank are connected to the gold solution pool through a first injection pipe and a second injection pipe, respectively, the first injection pipe and the second injection pipe are respectively installed with a first liquid pump and a second liquid pump, and the pH sensor is electrically connected to the first liquid pump and the second liquid pump.

[0013] Further improvements are: a water tank located below the drain pipe is suspended at the bottom of the machine, an impurity filter is fixed inside the water tank, the spray cleaning mechanism includes a spray box fixed to the inner walls of the front and rear sides of the hood and a water suction pipe fixed between the spray box and the water tank, a water pump is installed on the water suction pipe, and spray heads are equidistantly fixed on opposite sides of the two groups of spray boxes.

[0014] A further improvement is that the drying mechanism includes an air collecting box fixed to the inner walls on the front and rear sides of the hood and a hot air blower fixed to the outer walls on the front and rear sides of the hood, the output air outlet of the hot air blower passes through the air collecting box, and ventilation holes are equidistantly provided on opposite sides of the two groups of air collecting boxes.

[0015] Further improvements are: T-shaped slide bars are fixed at the bottom of the raw material placement table and the finished product placement table, T-shaped slide rails compatible with the T-shaped slide bars are opened on both sides of the top of the machine table, the T-shaped slide bars are slidably arranged in the T-shaped slide rails, and transparent observation windows are symmetrically fixed on the front and rear side walls of the machine cover.

[0016] A method for gold-plating a flexible circuit board gold-plating device, comprising the following steps: Step 1: The flexible circuit board raw material to be treated with gold is placed on the raw material placement table in advance. The traction moving mechanism is first used to drive the moving frame to move to the left to above the raw material placement table, and then the lifting and adjusting mechanism is used to drive the driving box to descend until the two sets of clamps are respectively descended to the front and rear sides of the flexible circuit board raw material, and then the motor is started to drive the two sets of clamps to move toward each other, and the clamping blocks are used to clamp and fix each flexible circuit board raw material, and then the lifting and adjusting mechanism is used to drive the driving box to rise, and the traction moving mechanism is used to drive the moving frame to move to the right to above the gold solution pool; Step 2: Then, the driving box is driven to descend by the lifting and adjusting mechanism until the flexible circuit board raw material is immersed in the chemical gold plating solution containing gold salt in the gold plating solution pool, and a layer of gold is deposited on the pre-plated layer of the flexible circuit board raw material through a chemical reduction reaction. At the same time, the temperature and pH value of the chemical gold plating solution are adaptively adjusted by the temperature control mechanism and the pH value control mechanism respectively. After the flexible circuit board raw material is immersed in the chemical gold plating solution for a preset time, the driving box is driven to rise by the lifting and adjusting mechanism until the flexible circuit board raw material is driven to separate from the chemical gold plating solution, the gold plating treatment is completed, and the flexible circuit board finished product is obtained; Step three: Then, the traction moving mechanism is used to drive the moving frame to continue to move to the right until the finished flexible circuit board is moved to above the funnel water guide groove, and then the lifting and adjusting mechanism is used to drive the driving box to descend until the finished flexible circuit board is lowered to the spray cleaning mechanism, and the spray cleaning mechanism is used to clean the finished flexible circuit board. Then, the lifting and adjusting mechanism is used to drive the driving box to rise until the finished flexible circuit board is raised to the drying mechanism, and the drying mechanism is used to dry the moisture on the surface of the finished flexible circuit board. Finally, the traction moving mechanism is used to drive the moving frame to move to the left to above the finished product placement table, and the lifting and adjusting mechanism is used to drive the driving box to descend until the finished flexible circuit board is lowered to the circuit board placement slot on the finished product placement table, and then the finished flexible circuit boards on the finished product placement table are collected together.

[0017] The beneficial effects of the present invention are as follows: the present invention drives the moving frame to move horizontally at the top of the inner cover through the traction moving mechanism, and drives the driving box to move up and down below the moving frame through the lifting and adjusting mechanism, and at the same time drives the two groups of clamping plates to move toward each other through the motor, and uses the clamping blocks on the opposite sides of the two groups of clamping plates to clamp the circuit board raw materials, so that the circuit board can be automatically loaded and unloaded during the circuit board gold plating process, saving labor costs; The circuit board is immersed in the chemical gold plating solution in the chemical gold plating solution pool, and the temperature and pH value of the chemical gold plating solution are adaptively adjusted by the temperature control mechanism and the pH value control mechanism according to the actual needs of the chemical gold plating, so that the temperature and pH value of the chemical gold plating solution can always meet the actual needs of the chemical gold plating, ensuring the effect of the chemical gold plating, and the method is easy to use and has a high degree of intelligence; In addition, by arranging a spray cleaning mechanism and a drying mechanism above the funnel water guide trough on the top of the machine, the flexible circuit board gold-plating device is integrated with the gold-plating, cleaning and drying functions. It has rich functions, so that the circuit board can be cleaned and dried in time after the gold-plating treatment. The operation is simple, which improves the efficiency of the entire gold-plating processing of the circuit board to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the present invention; Figure 2 is a front view of the present invention; Figure 3 is a front cross-sectional view of the present invention; Figure 4 is a right side cross-sectional view of the gold solution pool of the present invention; Figure 5 is a cross-sectional view of a water storage tank of the present invention; Figure 6 is a cross-sectional view of a mobile frame of the present invention; Figure 7It is a side sectional view of a drive box of the present invention.

[0019] Among them: 1. Machine table; 2. Machine cover; 3. Raw material placement table; 4. Finished product placement table; 5. Circuit board placement slot; 6. Mobile rack; 7. Drive box; 8. Motor; 9. Clamp; 10. Clamp block; 11. Circuit board clamping slot; 12. Gold solution pool; 13. Funnel water guide trough; 14. Drain pipe; 15. Winding machine; 16. Wire rope; 17. Concave frame; 18. Support plate; 19. Pulley; 20. First motor; 21. One-way screw; 22. Threaded plate; 23. Hanging rod; 24. Protection box; 25. Two-way screw; 26. Threaded block; 27, temperature sensor; 28, heating plate; 29, second motor; 30, concave stirring rod; 31, pH sensor; 32, acid tank; 33, alkali tank; 34, first injection pipe; 35, second injection pipe; 36, first liquid pump; 37, second liquid pump; 38, water storage tank; 39, impurity filter; 40, spray box; 41, water pipe; 42, water pump; 43, spray head; 44, wind box; 45, hot air blower; 46, ventilation hole; 47, T-shaped slide; 48, T-shaped slide rail; 49, transparent observation window. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0021] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7The present embodiment provides a flexible circuit board metallization device, comprising a horizontally arranged machine table 1 and a machine cover 2 fixed to the top of the machine table 1 by bolts. The bottom of the machine table 1 is provided with a support frame so that the machine table 1 is supported on the ground. The left and right ends of the machine cover 2 are designed to be open. A raw material placement table 3 is slidably connected to the left side of the top of the machine table 1, and a finished product placement table 4 is slidably connected to the right side of the top of the machine table 1. The raw material placement table 3 and the finished product placement table 4 have the same structure and are both provided with circuit board placement grooves 5 equidistantly distributed at the top for placing flexible circuit boards. A moving frame 6 driven by a traction moving mechanism is slidably provided at the top of the inner part of the machine cover 2. A hollow driving box 7 is suspended below the moving frame 6, and the driving box 7 is driven by the lifting and adjusting mechanism on the moving frame 6 to move up and down. The driving box 7 A motor 8 is fixed to the rear outer wall by bolts, and a clamping plate 9 symmetrically distributed front and back is slidably provided at the bottom of the driving box 7, and the two groups of clamping plates 9 are driven by the motor 8 and move in opposite directions. The side walls of the two groups of clamping plates 9 on the opposite side are fixed with clamping blocks 10 distributed equidistantly. The side of the clamping block 10 away from the clamping plate 9 is provided with a circuit board clamping groove 11 for accommodating a flexible circuit board. The moving frame 6 is driven to move horizontally at the top of the hood 2 by a traction moving mechanism, and the driving box 7 is driven to move up and down under the moving frame 6 by a lifting and adjusting mechanism. At the same time, the two groups of clamping plates 9 are driven to move toward each other by the motor 8, and the clamping blocks 10 on the opposite side of the two groups of clamping plates 9 are used to clamp the circuit board raw materials, so that the automatic loading and unloading of the circuit board can be realized during the circuit board gold plating process; A gold plating solution pool 12 is fixed by bolts on the left side of the top of the machine 1. The gold plating solution pool 12 stores a chemical gold plating solution containing gold salt, which is used to perform gold plating on the raw materials of the flexible circuit board. A temperature control mechanism for automatically adjusting the temperature of the chemical gold plating solution is provided inside the gold plating solution pool 12. A pH value control mechanism for automatically adjusting the pH value of the chemical gold plating solution is provided at the bottom of the machine 1. The pH value control mechanism is connected to the gold plating solution pool 12. The circuit board is treated with gold plating by the chemical gold plating solution in the gold plating solution pool 12. According to the actual needs of gold plating, the temperature and pH value of the chemical gold plating solution are adaptively adjusted by the temperature control mechanism and the pH value control mechanism, so that the temperature and pH value of the chemical gold plating solution can always meet the actual needs of gold plating. A funnel water channel 13 with a design of being wide at the top and narrow at the bottom is provided on the right side of the top of the machine 1. A drain pipe 14 is fixed to the bottom of the funnel water channel 13, and the bottom of the drain pipe 14 passes through the bottom of the machine 1. A spray cleaning mechanism for cleaning the flexible circuit board after the gold treatment is provided above the funnel water channel 13, and a drying mechanism for drying the cleaned flexible circuit board is provided above the spray cleaning mechanism. By respectively arranging a spray cleaning mechanism and a drying mechanism above the funnel water channel 13 at the top of the machine 1, the flexible circuit board gold-plating device is integrated with the gold-plating, cleaning and drying functions, and is rich in functions, so that the circuit board can be cleaned and dried in time after the gold-plating treatment.

[0022] The traction moving mechanism includes a reel 15 and a wire rope 16, wherein the reel 15 is provided with two groups and is fixed to the left and right sides of the top of the inner part of the hood 2 by bolts, and the wire rope 16 is wound around the reel wheel at the output end of the reel 15, and the ends of the two wire ropes 16 away from the reel 15 are respectively fixedly connected to the left and right outer walls of the moving frame 6, and the front and rear sides of the top of the inner part of the hood 2 are fixed with a concave frame 17 by bolts, and the front and rear outer walls of the moving frame 6 are fixed with a support plate 18 by bolts, and the bottom end of the support plate 18 is symmetrically fixed with a pulley 19 by bolts, and the pulley 19 is in contact with the top of the inner side of the concave frame 17, so as to support the moving frame 6 and make it smoother during movement, and one group of the reel 15 drives the reel wheel at its output end to reel the wire rope 16, and the other group of the reel 15 drives the reel wheel at its output end to unwind the wire rope 16, thereby pulling the moving frame 6 to move horizontally through the traction of one reeling and one unwinding.

[0023] The lifting and lowering adjustment mechanism includes a first motor 20 and a one-way screw rod 21, wherein the first motor 20 is fixed to the top of the moving frame 6 by bolts, the one-way screw rod 21 is rotatably connected to the inside of the moving frame 6 by a bearing, the top of the one-way screw rod 21 passes through the top of the moving frame 6 through a bearing and is fixedly connected to the output end rotating shaft of the first motor 20, a threaded plate 22 located in the moving frame 6 is threadedly sleeved on the one-way screw rod 21, a suspension rod 23 is fixed to the bottom end of the threaded plate 22 by bolts, and the bottom end of the suspension rod 23 slides through the bottom end of the moving frame 6 and is fixed to the top end of the driving box 7 by bolts, the one-way screw rod 21 is driven to rotate by the first motor 20 to make the threaded plate 22 threadedly sleeved on the one-way screw rod 21 move up and down, and the driving box 7 is moved up and down by the suspension rod 23 during the lifting process of the threaded plate 22, a protection box 24 is fixed to the outside of the first motor 20, a through groove adapted to the protection box 24 is provided at the top of the hood 2, the protection box 24 is located in the through groove, and the protection box 24 is limited by the through groove, so that the moving frame 6 is more stable during movement.

[0024] The output end of the motor 8 passes through the interior of the drive box 7 through a bearing and is fixed with a bidirectional screw rod 25. Threaded blocks 26 are threadedly sleeved on both sides of the bidirectional screw rod 25 and the threaded connection directions are opposite. The bottom end of the threaded block 26 slides through the bottom end of the drive box 7 and is fixedly connected to the clamping plate 9 by bolts. The motor 8 drives the bidirectional screw rod 25 to rotate, so that the threaded blocks 26 on both sides of the bidirectional screw rod 25 move toward or in opposite directions, thereby driving the clamping plate 9 and the clamping block 10 to move toward or in opposite directions, thereby achieving clamping or releasing the clamping of the flexible circuit board.

[0025] The temperature control mechanism includes a temperature sensor 27 and a heating plate 28 with a built-in temperature control component, wherein the temperature sensor 27 is fixed to the left inner wall of the gold plating solution pool 12 by bolts, and two groups of heating plates 28 are respectively fixed to the inner walls of the front and rear sides of the gold plating solution pool 12, and the temperature sensor 27 is connected to the PLC control system of the device, and is used to start the heating plate 28 to heat the chemical gold plating solution when it is detected that the temperature of the chemical gold plating solution in the gold plating solution pool 12 is lower than a preset value, and when it is detected that the temperature of the chemical gold plating solution reaches the preset value, the heating plate 28 is turned off to avoid the temperature of the chemical gold plating solution from being too high, thereby realizing adaptive temperature control of the chemical gold plating solution (in this embodiment, only the temperature increase needs to be controlled, and no temperature reduction control is required).

[0026] A second motor 29 is fixed to the bottom of the chemical gold solution pool 12 by bolts. The output end shaft of the second motor 29 passes through the interior of the chemical gold solution pool 12 through a sealed bearing and is fixed with a concave stirring rod 30. The concave stirring rod 30 is designed in a concave shape. The concave stirring rod 30 is driven to rotate by the second motor 29 to stir the chemical gold plating solution so that the chemical components therein are more evenly distributed.

[0027] The pH value regulating mechanism comprises a pH sensor 31, an acid tank 32 and an alkali tank 33, wherein the pH sensor 31 is fixed to the inner wall of the right side of the chemical gold plating solution pool 12 by bolts, the acid tank 32 stores an acid solution for reducing the pH value of the chemical gold plating solution, and the alkali tank 33 stores an alkaline solution for increasing the pH value of the chemical gold plating solution, the acid tank 32 and the alkali tank 33 are respectively fixed to the front and rear sides of the bottom end of the machine 1 by bolts, and the first liquid injection pipe 34 and the second liquid injection pipe 35 are respectively fixed to the opposite sides of the acid tank 32 and the alkali tank 33, and the ends of the first liquid injection pipe 34 and the second liquid injection pipe 35 close to the chemical gold plating solution pool 12 are both penetrated into the chemical gold plating solution pool 12, and the first liquid injection pipe 34 is installed with The first liquid pump 36 and the second liquid injection pipe 35 are provided with a second liquid pump 37. The pH sensor 31 is connected to the PLC control system of the device, and is used to start the first liquid pump 36 when it is detected that the pH value of the chemical gold plating solution is higher than a preset value, so as to pump the acidic solution in the acid liquid tank 32 into the chemical gold solution pool 12 and mix it with the chemical gold plating solution, thereby appropriately reducing the pH value of the chemical gold plating solution. When it is detected that the pH value of the chemical gold plating solution is lower than a preset value, the second liquid pump 37 is started to pump the alkaline solution in the alkali liquid tank 33 into the chemical gold solution pool 12 and mix it with the chemical gold plating solution, thereby appropriately increasing the pH value of the chemical gold plating solution, thereby realizing adaptive regulation of the pH value of the chemical gold plating solution.

[0028] The bottom of the machine 1 is fixed with a water storage tank 38 for storing cleaning water by a hanging plate, and the water storage tank 38 is located below the drain pipe 14. The top of the water storage tank 38 is designed to be open, and an impurity filter 39 for filtering and intercepting impurities in the cleaning water is fixed by bolts inside. The spray cleaning mechanism includes a spray box 40 and a water suction pipe 41, wherein the spray box 40 is provided with two groups and is respectively fixed to the inner walls of the front and rear sides of the hood 2, and the water suction pipe 41 passes through the side wall of the hood 2 and is fixedly connected A water pump 42 is installed on the water pump pipe 41 between the spray box 40 and the water tank 38. Spray heads 43 equidistantly distributed are fixed on opposite sides of the two groups of spray boxes 40. The cleaning water in the water tank 38 is pumped into the spray box 40 through the water pump 42 and sprayed out through the spray head 43 to achieve spray cleaning of the flexible circuit board. The cleaned water flows into the water tank 38 along the funnel water guide 13 and the drain pipe 14, and can be reused after being filtered by the impurity filter 39.

[0029] The drying mechanism includes an air collecting box 44 and a hot air blower 45, wherein the air collecting box 44 is provided with two groups and is respectively fixed to the inner walls of the front and rear sides of the hood 2 by bolts, and the hot air blower 45 is provided with two groups and is respectively fixed to the outer walls of the front and rear sides of the hood 2, and the output end air outlet of the hot air blower 45 penetrates into the air collecting box 44, and the two groups of air collecting boxes 44 are provided with equidistantly distributed ventilation holes 46 on the opposite sides. The hot air blower 45 blows hot air into the air collecting box 44, and the hot air is evenly blown into the hood 2 through the ventilation holes 46 to achieve drying of the flexible circuit board.

[0030] T-shaped slide bars 47 are welded and fixed at the bottom ends of the raw material placement table 3 and the finished product placement table 4. T-shaped slide rails 48 are opened on the left and right sides of the top of the machine table 1, and the T-shaped slide rails 48 are adapted to the T-shaped slide bars 47. The T-shaped slide bars 47 are slidably arranged in the T-shaped slide rails 48 to realize the sliding connection between the raw material placement table 3 and the finished product placement table 4 and the machine table 1, so that the raw material placement table 3 and the finished product placement table 4 can be appropriately slid and displaced at the top of the machine table 1. Transparent observation windows 49 symmetrically distributed on the front and rear side walls of the machine hood 2 are fixed to facilitate observation of the internal situation of the machine hood 2. Example

[0031] This embodiment provides a method for gold-plating a flexible circuit board gold-plating device, comprising the following steps: Step 1: The flexible circuit board raw material to be treated with gold is pre-placed in the circuit board placement groove 5 on the raw material placement table 3. The traction moving mechanism is first used to drive the moving frame 6 to move to the left until the driving box 7 under the moving frame 6 moves to the top of the raw material placement table 3, and then the lifting and adjusting mechanism is used to drive the driving box 7 to descend until the two groups of clamping plates 9 on the front and rear sides of the bottom of the driving box 7 descend to the front and rear sides of the flexible circuit board raw material. Then, the motor 8 is started to drive the two groups of clamping plates 9 to move toward each other. During the process of the clamping plates 9 moving toward each other, the clamping blocks 10 symmetrically distributed front and back are used to clamp each flexible circuit board raw material on the raw material placement table 3. Then, the lifting and adjusting mechanism is used to drive the driving box 7 to rise and reset, so that the clamped flexible circuit board raw material rises synchronously, and the traction moving mechanism is used to drive the moving frame 6 to move to the right until the flexible circuit board raw material is driven to move to the top of the gold solution pool 12, that is, the automatic loading of the flexible circuit board raw material is realized; Step 2: Then, the driving box 7 is driven to descend by the lifting and adjusting mechanism until the flexible circuit board raw material is immersed in the chemical gold plating solution containing gold salt in the gold plating solution pool 12, and a layer of gold is deposited on the pre-plated layer of the flexible circuit board raw material by a chemical reduction reaction (this reaction is a prior art for circuit board gold plating treatment, and will not be described in detail), and at the same time, the temperature and pH value of the chemical gold plating solution are adaptively adjusted by the temperature control mechanism and the pH value control mechanism to meet the actual gold plating treatment requirements. After the flexible circuit board raw material is immersed in the chemical gold plating solution for a preset time, the lifting and adjusting mechanism is used to drive the driving box 7 to rise and reset until the flexible circuit board raw material is driven to leave the chemical gold plating solution, that is, the gold plating treatment is completed, and a flexible circuit board finished product is obtained; Step 3: Then, the finished flexible circuit board is left to stand for a preset time to drain the chemical gold plating solution on its surface, and then the traction moving mechanism is used to drive the moving frame 6 to drive the driving box 7 below it to continue to move to the right, until the finished flexible circuit board after the gold treatment moves to the top of the funnel water guide groove 13, and then the lifting and adjusting mechanism is used to drive the driving box 7 to descend, until the finished flexible circuit board clamped under the driving box 7 descends to the position of the spray cleaning mechanism, and at this time, the spray cleaning mechanism is used to clean the finished flexible circuit board, and the cleaning water is discharged from the drain pipe 14 at the bottom of the funnel water guide groove 13, and then the lifting and adjusting mechanism is used to drive the driving box 7 to rise, until the finished flexible circuit board clamped under the driving box 7 is The finished flexible circuit board rises to the position of the drying mechanism. At this time, the drying mechanism is used to dry the moisture on the surface of the cleaned flexible circuit board product to complete the continuous processing of gold treatment, cleaning and drying. Finally, the traction moving mechanism is used to drive the moving frame 6 to move to the left until the dried flexible circuit board product is moved to the top of the finished product placement table 4. At this time, the lifting and adjusting mechanism is used to drive the driving box 7 to descend until the flexible circuit board product falls into the circuit board placement slot 5 on the finished product placement table 4, and then the motor 8 is started to drive the two sets of clamps 9 to move toward each other to release the clamping block 10 from clamping the flexible circuit board product, thereby realizing automatic unloading, and repeating the above steps until the gold treatment of all flexible circuit boards is completed.

[0032] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A device for metallizing a flexible circuit board, comprising a machine (1), characterized in that: A cover (2) is fixed on the top of the machine platform (1), and a raw material placement table (3) and a finished product placement table (4) are slidably connected to both sides of the top of the machine platform (1), and circuit board placement grooves (5) are equidistantly provided on the tops of the raw material placement table (3) and the finished product placement table (4). A moving frame (6) driven to move in translation by a traction moving mechanism is slidably provided on the top of the inner top of the cover (2), and a driving box (7) driven to move up and down by a lifting adjustment mechanism is suspended below the moving frame (6), and clamps (9) driven to move by a motor (8) are symmetrically provided at the bottom of the driving box (7), and clamping blocks (10) are equidistantly connected to opposite sides of two groups of clamping plates (9). A circuit board clamping groove (11) is provided on a side of the clamping block (10) away from the clamping plate (9); a gold solution pool (12) is fixed on a side of the top of the machine (1) close to the raw material placement table (3); a temperature control mechanism is provided inside the gold solution pool (12); a pH value control mechanism connected to the gold solution pool (12) is provided at the bottom of the machine (1); a funnel water guide groove (13) is provided on a side of the top of the machine (1) close to the finished product placement table (4); a drainage pipe (14) is fixed at the bottom of the funnel water guide groove (13) and runs through the bottom of the machine (1); a spray cleaning mechanism and a drying mechanism are provided above the funnel water guide groove (13).

2. The device for gold-plating a flexible circuit board according to claim 1, characterized in that: The traction moving mechanism comprises a reel (15) fixed to the left and right sides of the top of the inner part of the machine cover (2) and a steel wire rope (16) wound around a reel wheel at the output end of the reel (15); one end of the steel wire rope (16) away from the reel (15) is fixedly connected to the moving frame (6); concave frames (17) are fixed to the front and rear sides of the top of the inner part of the machine cover (2); support plates (18) are fixed to the outer walls of the front and rear sides of the moving frame (6); and pulleys (19) are symmetrically fixed to the bottom ends of the support plates (18) and are in contact with the inner top ends of the concave frames (17).

3. The device for gold-plating a flexible circuit board according to claim 1, characterized in that: The lifting and lowering adjustment mechanism comprises a first motor (20) fixed to the top of the moving frame (6) and a one-way screw rod (21) rotatably connected to the inside of the moving frame (6) and driven to rotate by the first motor (20); a threaded plate (22) is threadedly sleeved on the one-way screw rod (21); a suspension rod (23) is symmetrically fixed at the bottom end of the threaded plate (22) and slides through the bottom end of the moving frame (6) and is fixedly connected to the driving box (7); a protection box (24) is fixed to the outside of the first motor (20); and a through groove adapted to the protection box (24) is provided at the top end of the hood (2).

4. The device for gold-plating a flexible circuit board according to claim 1, characterized in that: The output end of the motor (8) passes through the interior of the drive box (7) through a bearing and is fixed with a bidirectional screw rod (25). Both sides of the bidirectional screw rod (25) are threadedly sleeved with thread blocks (26). The bottom end of the thread block (26) slides through the bottom end of the drive box (7) and is fixedly connected to the clamping plate (9).

5. The device for gold-plating a flexible circuit board according to claim 1, characterized in that: The temperature control mechanism comprises a temperature sensor (27) and a heating plate (28) fixed to the inner wall of the gold solution pool (12); the temperature sensor (27) is electrically connected to the heating plate (28); a second motor (29) is fixed to the bottom end of the gold solution pool (12); an output end of the second motor (29) penetrates into the interior of the gold solution pool (12) through a sealed bearing and is fixed with a concave stirring rod (30).

6. The device for gold-plating a flexible circuit board according to claim 1, characterized in that: The pH value regulating mechanism comprises a pH sensor (31) fixed to the inner wall of the gold solution pool (12) and an acid liquid tank (32) and an alkali liquid tank (33) fixed to the front and rear sides of the bottom of the machine (1); the acid liquid tank (32) and the alkali liquid tank (33) are connected to the gold solution pool (12) via a first liquid injection pipe (34) and a second liquid injection pipe (35), respectively; a first liquid pump (36) and a second liquid pump (37) are installed on the first liquid injection pipe (34) and the second liquid injection pipe (35), respectively; and the pH sensor (31) is electrically connected to the first liquid pump (36) and the second liquid pump (37).

7. The device for gold-plating a flexible circuit board according to claim 1, characterized in that: A water storage tank (38) located below the drainage pipe (14) is suspended at the bottom end of the machine (1), an impurity filter screen (39) is fixed inside the water storage tank (38), and the spray cleaning mechanism comprises a spray box (40) fixed to the inner walls of the front and rear sides of the machine cover (2) and a water suction pipe (41) fixed between the spray box (40) and the water storage tank (38), a water suction pump (42) is installed on the water suction pipe (41), and spray heads (43) are fixed at equal distances on opposite sides of the two groups of spray boxes (40).

8. The device for gold-plating a flexible circuit board according to claim 1, characterized in that: The drying mechanism comprises an air collecting box (44) fixed to the front and rear inner walls of the hood (2) and a hot air blower (45) fixed to the front and rear outer walls of the hood (2), the air outlet of the output end of the hot air blower (45) passes through the air collecting box (44), and ventilation holes (46) are equidistantly provided on opposite sides of the two sets of air collecting boxes (44).

9. The device for gold-plating a flexible circuit board according to claim 1, characterized in that: The bottom ends of the raw material placement table (3) and the finished product placement table (4) are both fixed with T-shaped slide bars (47), the top sides of the machine table (1) are both provided with T-shaped slide rails (48) adapted to the T-shaped slide bars (47), the T-shaped slide bars (47) are slidably arranged in the T-shaped slide rails (48), and transparent observation windows (49) are symmetrically fixed to the front and rear side walls of the machine cover (2).

10. A gold-plating method for a flexible circuit board gold-plating device as claimed in claim 1, characterized in that: The following steps are involved: Step 1: The flexible circuit board raw material to be treated with gold is placed on the raw material placement table (3) in advance, and the traction moving mechanism is used to drive the moving frame (6) to move to the left to the top of the raw material placement table (3), and then the lifting and adjusting mechanism is used to drive the driving box (7) to descend until the two groups of clamping plates (9) are respectively descended to the front and rear sides of the flexible circuit board raw material, and then the motor (8) is started to drive the two groups of clamping plates (9) to move towards each other, and the clamping blocks (10) are used to clamp and fix each flexible circuit board raw material, and then the lifting and adjusting mechanism is used to drive the driving box (7) to rise, and the traction moving mechanism is used to drive the moving frame (6) to move to the right to the top of the gold solution pool (12); Step 2: Then, the driving box (7) is driven downward by the lifting and adjusting mechanism until the flexible circuit board raw material is immersed in the chemical gold plating solution containing gold salt in the gold plating solution pool (12), and a layer of gold is deposited on the pre-plated layer of the flexible circuit board raw material through a chemical reduction reaction. At the same time, the temperature and pH value of the chemical gold plating solution are adaptively adjusted by the temperature control mechanism and the pH value control mechanism respectively. After the flexible circuit board raw material is immersed in the chemical gold plating solution for a preset time, the driving box (7) is driven upward by the lifting and adjusting mechanism until the flexible circuit board raw material is driven to separate from the chemical gold plating solution, and the gold plating treatment is completed to obtain a finished flexible circuit board; Step 3: Then, the traction moving mechanism is used to drive the moving frame (6) to continue to move rightward until the finished flexible circuit board is moved to the top of the funnel water guide groove (13), and then the lifting and adjusting mechanism is used to drive the driving box (7) to descend until the finished flexible circuit board is descended to the spray cleaning mechanism, and the finished flexible circuit board is cleaned by the spray cleaning mechanism. Then, the lifting and adjusting mechanism is used to drive the driving box (7) to rise until the finished flexible circuit board is ascended to the drying mechanism, and the drying mechanism is used to dry the moisture on the surface of the finished flexible circuit board. Finally, the traction moving mechanism is used to drive the moving frame (6) to move leftward to the top of the finished product placement table (4), and the lifting and adjusting mechanism is used to drive the driving box (7) to descend until the finished flexible circuit board is descended to the circuit board placement groove (5) on the finished product placement table (4), and then the finished flexible circuit boards on the finished product placement table (4) are collected together.

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