Chip automatic test bench

Abstract

An automatic chip test bench comprises a rack, a mounting bench, a chip bench, an optical fiber bench, a probe bench, a horizontal camera assembly and a vertical camera assembly. The chip table is mounted on the mounting table, comprises a vacuum suction table and a push-pull rod, and is used for adsorbing and fixing a chip and pushing and pulling the chip to a specified position through the push-pull rod; the optical fiber tables are fixedly mounted on the mounting table through the six-axis electric displacement table, are symmetrically arranged on the two sides of the chip table and are used for clamping optical fibers and positioning and adjusting the optical fibers to designated positions; the probe stations are arranged on the two sides of the optical fiber station and are used for being in contact with the chip and carrying out testing and precise packaging; the horizontal camera assembly is fixed on the mounting table and is used for positioning the positions of the optical fiber and the chip in the vertical direction; and the vertical camera assembly is fixedly connected with the mounting table and is used for positioning the positions of the optical fiber and the chip in the horizontal direction. The invention overcomes the defects in the prior art, and provides the automatic chip test board which integrates waveguide and optical fiber mode field matching and accurate alignment test.

Description

Technical Field

[0001] The invention relates to the field of chip detection, and in particular to an automatic chip testing platform. Background Art

[0002] As the core component of electronic devices, chips are increasingly widely used and crucial in various electronic devices. Nowadays, when optical integrated devices are widely used in optical fiber communications, the problem of coupling, alignment and packaging of waveguides and optical fibers needs to be solved, that is, the process of aligning and connecting waveguide devices with optical fibers using high-precision adjustment frames. The accuracy of this process, that is, the alignment of the integrated waveguide and optical fiber, determines the coupling efficiency of the two.

[0003] The traditional method of manually operating a high-precision adjustment frame has very high technical requirements. The precise test of the micro-change signal as the operation criterion is the technical key. The corresponding micro-operation is very difficult. The existing technology has gradually realized the mechanization process for the alignment and connection operation of waveguide devices and optical fibers, but it is impossible to achieve efficient docking and detection of chips at the same time through a system.

[0004] Therefore, in order to obtain low-loss, high-efficiency and high-stability docking and detection effects, the present invention provides a chip automatic test bench that integrates mode field matching and precise alignment testing of waveguide and optical fiber. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings and deficiencies of the prior art and to provide a chip automatic test bench that integrates mode field matching and precise alignment testing of waveguides and optical fibers, thereby solving the problems in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is as follows: a chip automatic test station, including a rack, a mounting station, a chip station, an optical fiber station, a probe station, a horizontal camera assembly and a vertical camera assembly; The chip stage is installed on the mounting table, and includes a vacuum suction table and a push-pull rod, which is used to absorb and fix the chip and push and pull the chip to a specified position through the push-pull rod; The optical fiber table is fixedly mounted on the mounting table through a six-axis electric translation table and symmetrically arranged on both sides of the chip table to clamp the optical fiber and position and adjust the optical fiber to a specified position to achieve docking with the chip; The probe station is arranged on both sides of the optical fiber station to contact the chip and perform discharge detection; The horizontal camera assembly is fixedly connected to the camera assembly mounting plate to locate the positions of the optical fiber and the chip in the vertical direction; The vertical camera assembly is fixedly connected to the camera assembly mounting plate to locate the positions of the optical fiber and the chip in the horizontal direction.

[0007] The horizontal camera assembly and the vertical camera assembly obtain the position information of the specific waveguide on the chip in the horizontal and vertical directions and transmit it to the fiber optic station and the probe station. The fiber optic station and the probe station receive the position information to control the displacement of the optical fiber or the probe.

[0008] Preferably, the chip stage further comprises a rotating table, a ball-end screw and a positioning block, the rotating table being fixed between the slider and the vacuum suction table, the ball-end screw being fixed on the left side of the slider, the positioning block being arranged at the same height as the ball-end screw on the left side of the chip stage, and a card slot being arranged on the positioning block.

[0009] Preferably, the fiber optic table comprises a three-axis pressing station, a fiber optic clamp and a fiber optic pressing plate. The fiber optic table clamps the optical fiber through the fiber optic clamp and the fiber optic pressing plate, and controls the movement of the optical fiber through the three-axis pressing station.

[0010] Preferably, the probe station further comprises a magnetic seat, through which the probe station is mounted on a mounting plate.

[0011] Preferably, the probe station further comprises a probe clamp, and the probe clamp slides on the probe bracket through a slider and a slide rail structure to achieve movement of the probe.

[0012] Preferably, the mounting station comprises a mounting platform, on which a plurality of equally spaced screw holes are provided for positioning and mounting each component.

[0013] Preferably, a shock-absorbing platform is provided between the frame and the mounting platform to eliminate vibrations generated during the operation of the optical fiber platform and increase stability.

[0014] The beneficial effects of the present invention are as follows: the device fixes the chip by vacuum adsorption of the chip stage, and replaces manual positioning and alignment testing of the chip by an optical fiber stage, a probe stage and a camera assembly, thereby improving the test efficiency and the accuracy of alignment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, without paying creative labor, other drawings obtained based on these drawings still belong to the scope of the present invention.

[0016] Figure 1 This is a schematic diagram of the overall structure of a chip automatic test bench of the present invention; Figure 2 for Figure 1 Left side view of the structure; Figure 3 for Figure 1 A schematic diagram of the structure of the mounting platform in the structure; Figure 4 for Figure 1 A schematic diagram of the structure of the chip stage in the structure; Figure 5 for Figure 1 A schematic diagram of the structure of the optical fiber table in the structure; Figure 6 for Figure 1 Schematic diagram of the structure of the probe station in the structure; Figure 7 for Figure 1 A schematic diagram of the structure of the horizontal camera assembly in the structure; Figure 8 for Figure 1 Schematic diagram of the structure of the vertical camera assembly in the structure.

[0017] In the figure: 1-frame; 2-vibration damping platform; 3-mounting table; 301-mounting platform; 302-vertical plate; 303-probe station mounting plate; 304-camera assembly mounting plate; 4-chip table; 401-base; 402-linear guide; 403-slider; 404-first limit block; 405-ball screw; 406-second limit block; 407-positioning block; 407a-slot; 408-rotating table; 409-vacuum suction table; 410-push-pull rod; 5-fiber optic table; 501-six-axis electric translation table; 502-pressing table mounting plate; 503-three-axis pressing table; 504-fiber optic fixture; 505-fiber optic pressing plate; 6-probe platform; 601-magnetic seat; 602-first three-dimensional adjustment platform; 603-probe bracket; 604-probe clamp; 605-probe; 7-horizontal camera assembly; 701-second three-dimensional adjustment platform; 702-first camera bracket; 703-first camera; 704-first lens; 8-vertical camera assembly; 801-third three-dimensional adjustment platform; 802-second camera bracket; 803-second camera; 804-second lens; DETAILED DESCRIPTION In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings.

[0018] It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are for distinguishing two non-identical entities with the same name or non-identical parameters. It can be seen that "first" and "second" are only for the convenience of expression and should not be understood as limitations on the embodiments of the present invention. The subsequent embodiments will not explain this one by one.

[0019] The directions and positions mentioned in the present invention, such as up, down, front, back, left, right, inside, outside, top, bottom, side, etc., are only directions or positions with reference to the drawings. Therefore, the directions and positions used are used to explain and understand the present invention, but are not intended to limit the scope of protection of the present invention.

[0020] Example: The present invention provides a chip automatic test bench, which is mainly used for automatic coupling, alignment and packaging of chip waveguides and optical fibers, so as to achieve low-loss, high-efficiency and high-stability testing and packaging effects.

[0021] See also Figures 1 to 3 In an embodiment of the present invention, the chip automatic test station includes a frame 1, a damping table 2, a mounting table 3, a chip table 4, an optical fiber table 5, a probe table 6, a horizontal camera assembly 7 and a vertical camera assembly 8. The mounting table 3 includes a mounting platform 301 fixedly mounted with the damping table 2, a vertical plate 302 arranged on the mounting platform 301, a probe table mounting plate 303 arranged on both sides of the vertical plate 302, and a camera assembly mounting plate 304 placed flat on the upper end of the vertical plate; a number of screw holes are equidistantly arranged on the mounting platform 301, and the positional relationship between the various components can be adjusted according to actual conditions. In addition, in this embodiment, the connection between each component and the mounting table 3 is screw connection unless otherwise specified.

[0022] Specifically, in this embodiment, the shock absorbing platform 2 is installed between the frame 1 and the mounting platform 3, and the chip platform 4 is arranged in the center of the mounting platform 3. As for the specific position of the chip platform on the mounting platform, there is no specific restriction here, and it can be set according to the actual operation situation. Specifically, in this embodiment, the chip platform is arranged in the center of the mounting platform, and the optical fiber platform 5 installed on the mounting platform 301 is symmetrically arranged on both sides. The probe platform 6 is fixed on the probe platform mounting plate 303 of the mounting platform 3 by magnetic attraction, and the horizontal camera assembly 7 and the vertical camera assembly 8 are fixedly installed on the camera assembly mounting plate 304; after the chip is set on the chip platform 4, after the position information of the target waveguide on the chip is obtained by the horizontal and vertical camera assemblies, the optical fiber platforms 5 arranged on both sides send the clamped optical fiber to the corresponding position on the chip through a series of operations, and then the probe platform 6 performs a discharge test between the two, and the horizontal camera assembly 7 and the vertical camera assembly 8 are used to shoot the vertical and horizontal pictures between the optical fiber and the chip. The following is the specific process of the horizontal camera assembly 7 and the vertical camera assembly 8 obtaining the position information: The horizontal camera assembly 7 and the vertical camera assembly 8 obtain the position information of a specific waveguide on the chip in the horizontal and vertical directions and transmit it to the fiber optic station 5 and the probe station 6. The fiber optic station 5 and the probe station 6 receive the position information to control the displacement of the optical fiber or the probe. Specifically, a three-dimensional coordinate system with a certain point on the chip as the origin can be established through the position information obtained by the camera assembly, and the coordinates of the waveguide to be docked in the coordinate system can be obtained, and the obtained coordinates can be fed back to the control mechanism of the fiber optic station and the probe station to realize accurate position identification and accurate docking through the following device for controlling displacement.

[0023] See also Figure 4 In this embodiment, the chip stage 4 includes a base 401 , a slider 403 , a linear guide rail 402 , a first limit block 404 , and a second limit block 406 . The chip stage 4 is arranged on the mounting platform 301 through a base 401, a linear guide 402 is arranged on the upper end of the base 401, a ball screw 405 is arranged on the upper end of the slider 403, a first limit block 404 is arranged on the right side of the linear guide 402, and a second limit block 406 is arranged on the left side at the same height as the ball screw 405, the slider 403 is arranged on the linear guide 402, and is limited to sliding between the first and second sliders; the second limit block 406 is also provided with a positioning block 407 in the horizontal direction close to the slider 403, and the positioning block 407 also includes a slot 407a; the chip stage 4 also includes a rotating table 408, a vacuum suction table 409 and a push-pull rod 410, the vacuum suction table 409 is arranged on the rotating table 408, the rotating table 408 is arranged above the slider 403 and is coaxially connected to the slider 403, and the push-pull rod 410 is arranged on the right side of the slider 403.

[0024] Specifically, the push-pull rod 410 pulls the slider 403 out to Figure 4 The chip is manually placed on the vacuum suction table 409 at the ejection position shown. The vacuum suction table 409 fixes the chip by vacuum adsorption. Then the pull rod 410 pushes the slider 403 to slide on the linear guide 402. The elastic ball on the ball screw 405 and the slot 407a on the positioning block 407 are used for positioning. Then the rotating table 408 can adjust the direction of the chip for subsequent operations.

[0025] See also Figure 5In this embodiment, the optical fiber stage 5 includes a six-axis electric displacement stage 501, a pressure stage mounting plate 502, a three-axis pressure stage 503, an optical fiber clamp 504, and an optical fiber pressing plate 505. The optical fiber stage 5 is mounted on the mounting platform 301 through the six-axis electric displacement stage 501 and is arranged on both sides of the chip stage 4. The six-axis electric displacement stage 501 is provided with a pressure stage mounting plate 502, the pressure stage 503 is installed on the pressure stage mounting plate 502, the pressure stage 503 is provided with an optical fiber clamp 504, and the optical fiber clamp 504 is provided with an optical fiber pressing plate 505.

[0026] Specifically, the fiber optic table 5 on both sides of the chip table 4 clamps the optical fiber through the fiber optic clamp 504. After the optical fiber is pressed and fixed by the fiber optic pressing plate 505, the three-axis pressing station 503 has high positioning accuracy. The six-axis electric translation table 501 can realize precise position control on six degrees of freedom (three linear axes of X, Y, and Z and three rotation axes of θx, θy, and θz rotating around these three axes) and is used in conjunction with the three-axis pressing station 503, combined with the fiber optic coaxial alignment technology to achieve precise automatic coupling with the chip; the six-axis electric translation table 501 and the three-axis pressing station 503 are existing technologies and can be directly purchased by technicians in this field.

[0027] See also Figure 6 In this embodiment, the probe station 6 includes a magnetic seat 601, a first three-dimensional adjustment platform 602, a probe bracket 603, a probe clamp 604 and a probe 605. The probe station 6 is fixed to the probe station mounting plate 303 by magnetic attraction through the magnetic seat 601, the upper end of the magnetic seat 601 is connected to the first three-dimensional adjustment platform 602, the probe bracket 603 is fixed to the side of the first three-dimensional adjustment platform 602 and extends outward for a section, and the head is connected and installed with a probe clamp 604, and the probe clamp 604 is clamped with a probe 605.

[0028] Specifically, the magnetic seat 601 is magnetically attracted to the probe station mounting plate 303. When the probe clamp 604 clamps the probe 605 and the positions of the optical fiber and the chip are confirmed, the position of the probe 605 relative to the optical fiber and the chip is adjusted up and down and left and right through the first three-dimensional adjustment platform 602 and the probe bracket 603, and then subsequent actions are performed.

[0029] See also Figure 7 and Figure 8, the horizontal camera assembly 7 includes a second three-dimensional adjustment platform 701, a first camera bracket 702, a first camera 703 and a first lens 704; the vertical camera assembly 8 includes a third three-dimensional adjustment platform 801. The horizontal camera assembly 7 and the vertical camera assembly 8 are connected and fixed to the camera assembly mounting plate 304 through the second three-dimensional adjustment platform 701 and the third three-dimensional adjustment platform 801 respectively, the upper end of the first camera bracket 802 is connected and fixed to the second three-dimensional adjustment platform 701, the first lens 704 is arranged on the lower end of the first camera bracket 802 on the same side as the second three-dimensional adjustment platform 701, and the first camera 703 is fixedly installed on the other side; the vertical camera assembly 8 also includes a second camera bracket 802, a second camera 803 and a second lens 804, the right end of the second camera bracket 802 is connected and fixed to the upper end of the third three-dimensional adjustment platform 801, after the second camera 803 and the second lens 804 are connected and fixed, they are connected and fixed to the second camera bracket 802 through the round hole opened at the left end of the second camera bracket 802, and the second lens 804 faces the chip stage 5.

[0030] Specifically, after the horizontal camera assembly 7 and the vertical camera assembly 8 are installed on the camera assembly mounting plate 304, the positions of the first lens 704 and the second lens 804 are adjusted through the second three-dimensional adjustment platform 701 and the third three-dimensional adjustment platform 801, so that the two are respectively facing the rear and above the chip stage 4, so as to shoot the position of the optical fiber and the chip in the height direction and the horizontal plane, determine the position information of the target waveguide on the chip, and then transmit it to the other components to realize linkage.

[0031] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.

Claims

1. A chip automatic test bench, comprising a frame (1), a mounting table (3), a chip table (4), an optical fiber table (5), a probe table (6), a horizontal camera assembly (7) and a vertical camera assembly (8); The chip stage (4) is mounted on the mounting stage (3), and comprises a vacuum suction table (409) and a push-pull rod (410), which is used to absorb and fix the chip and push and pull the chip to a specified position through the push-pull rod (410); The optical fiber table (5) is fixedly mounted on the mounting table (3) via a six-axis electric translation table (501), and is symmetrically arranged on both sides of the chip table (4) to clamp the optical fiber and position and adjust the optical fiber to a specified position to achieve docking with the chip; The probe station (6) is arranged on both sides of the optical fiber station (5) to contact the chip and perform discharge detection; The horizontal camera assembly (7) is fixedly connected to the camera assembly mounting plate (304) to locate the positions of the optical fiber and the chip in the vertical direction; The vertical camera assembly (8) is fixedly connected to the camera assembly mounting plate (304) to locate the position of the optical fiber and the chip in the horizontal direction; The horizontal camera assembly (7) and the vertical camera assembly (8) obtain the position information of a specific waveguide on the chip in the horizontal and vertical directions and transmit it to the optical fiber stage (5) and the probe stage (6); the optical fiber stage (5) and the probe stage (6) receive the position information to control the displacement of the optical fiber or the probe.

2. The chip automatic test station according to claim 1, characterized in that: The chip stage (4) comprises a rotating stage (408), a ball screw (405) and a positioning block (407); the rotating stage (408) is fixed between the slider (403) and the vacuum suction table (409); the ball screw (405) is fixed on the left side of the slider (403); the positioning block (407) and the ball screw (405) are arranged on the left side of the chip stage (4) at the same height; and a slot (407a) is arranged on the positioning block (407).

3. The chip automatic test station according to claim 1, characterized in that: The optical fiber table (5) comprises a three-axis pressure table (503), an optical fiber clamp (504) and an optical fiber pressing plate (505); the optical fiber table (5) clamps the optical fiber through the optical fiber clamp (504) and the optical fiber pressing plate (505), and controls the movement of the optical fiber through the three-axis pressure table (503).

4. The chip automatic test station according to claim 1, characterized in that: The probe station (6) further comprises a magnetic seat (601), and is mounted on the probe station mounting plate (303) via the magnetic seat (601).

5. The chip automatic test station according to claim 1, characterized in that: The probe station (6) further comprises a probe clamp (604), wherein the probe clamp (604) slides on the probe bracket (603) via a slider and a slide rail structure.

6. The chip automatic test station according to claim 1, characterized in that: The mounting platform comprises a mounting platform (301), and a plurality of equally spaced screw holes are provided on the mounting platform (301) for positioning and mounting various components.

7. The chip automatic test station according to claim 1, characterized in that: It also includes a shock absorbing platform (2) arranged between the frame (1) and the mounting platform (3).

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