Production process of high-frequency communication chip type common mode inductor

Abstract

The invention discloses a high-frequency communication chip type common mode inductor production process, which comprises the following steps of: 1, placing and fixing a wire end of a first enameled wire on a pin on one side of a chip type common mode inductor framework, winding a middle column of the framework for a plurality of turns to form a first section of winding wire at the bottom layer, and pulling the distance of two times of the wire diameter; step 2, placing and fixing a wire end of a second enameled wire on an end pin on one side of a framework of the chip common mode inductor, winding a middle column of the framework for a plurality of turns to form a first section of winding wire on the surface layer, and pulling an interval of two times of the wire diameter; 3, after a proper amount of bonding glue is dispensed on the left shoulder and the right shoulder of the chip common mode inductor framework, the chip common mode inductor upper cover covers the chip common mode inductor framework to be assembled, bonded and fixed, and the complete high-frequency communication chip common mode inductor is formed; step 4, baking; and 5, testing network signal transmission. Normal transmission of network signals at a high frequency band can be ensured, and the technical difficulty that a chip common mode inductor can only be used for a low-frequency communication system is broken through.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic component production, and in particular relates to a production process of a high-frequency communication chip-type common-mode inductor. Background Art

[0002] As a bridge for data communication, chip common-mode inductors are widely used in network switches, routers, network cards, hubs, vehicle-mounted CAN BUS, FlaxRay, CAN-FD, A2B and vehicle-mounted Ethernet, playing the role of impedance matching and electromagnetic interference suppression. The production and manufacturing of chip common-mode inductors has now achieved full automatic production (automatic winding-spot welding-assembly-package testing); however, the most important winding process in the entire production process is relatively simple, resulting in the product communication frequency and quality failing to meet the high-frequency communication quality requirements.

[0003] At present, there are two main methods for making traditional chip common mode inductors in the communications industry: one is single-layer parallel winding (such as Figure 1 As shown in the figure), two enameled wires are wound in parallel on the core frame starting from one side and ending at the other side; the second is double-layer overlapping winding (as shown in the figure). Figure 2 As shown in the figure, an enameled wire is used to evenly wind from the starting point on one side of the core frame to the end on the other side, and then another enameled wire is used to evenly cover and wind from the starting point on one side of the core frame to the end on the other side. Both winding processes use scattered wires, resulting in a low coupling coefficient between the two differential lines on the chip common-mode inductor. The network characteristics exhibited will weaken sharply with the increase of frequency, and can only meet basic requirements in IEEE802.3ab (1000M Base-T) communication scenarios, and cannot meet the communication frequency standard requirements in higher frequency bands [such as IEEE802.3bz (2.5G / 5GBase-T), IEEE802.3an (10G Base-T) and IEEE802.3bw (100M Base-T1 automotive Ethernet)]. Summary of the invention

[0004] The purpose of the present invention is to provide a production process for a high-frequency communication chip common-mode inductor to solve the problems existing in the prior art.

[0005] To achieve the above object, the present invention provides the following technical solution: a production process of a high-frequency communication chip common-mode inductor, comprising the following steps:

[0006] Step 1: Place the end of the first enameled wire on the end pin on one side of the chip common mode inductor frame, and wind it multiple times on the middle column of the frame to form the first winding of the bottom layer, open a spacing of twice the wire diameter, and wind multiple times on the middle column of the frame to form the second winding of the bottom layer, and then place the tail of the second enameled wire on the end pin on one side of the chip common mode inductor frame to complete the first winding;

[0007] Step 2: Place and fix the end of the second enameled wire on the end pin on one side of the chip common mode inductor skeleton, and wind it multiple times on the middle column of the skeleton to form the first section of the surface winding, open a spacing of twice the wire diameter, and wind it multiple times on the middle column of the skeleton in turn to form the second section of the surface winding, and then place and fix the end of the second enameled wire on the end pin on one side of the chip common mode inductor skeleton to complete the second winding winding;

[0008] Step 3: After applying a proper amount of adhesive to each point on the left and right shoulders of the chip common-mode inductor frame, cover the chip common-mode inductor cover on the chip common-mode inductor frame for assembly and bonding and fixing to form a complete high-frequency communication chip common-mode inductor;

[0009] Step 4: Bake;

[0010] Step 5: Network signal transmission test.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: the high-frequency communication chip common-mode inductor of the patented invention, the winding method of the magnetic core skeleton mainly uses a single copper wire to be evenly arranged and wound multiple times on the middle column of the magnetic core skeleton in a certain direction, and then a distance of twice the wire diameter is pulled apart, and multiple turns are evenly arranged in sequence to form a wire group, and the repeated second winding is evenly arranged on the first winding of the chip common-mode inductor to complete the winding, and the lead end pins are welded and fixed and the upper cover is assembled and bonded to form a complete high-frequency communication chip common-mode inductor. The unique single winding is divided into two sections. After being evenly arranged and wound for multiple turns, the distance of twice the wire diameter is pulled apart and then multiple turns are wound backwards. Compared with the traditional scattered wire dense winding method, it has better coupling performance, reduces parasitic parameters and stray capacitance during high-frequency communication, and enhances transmission capacity, thereby reducing the loss during network signal transmission and enhancing the anti-interference ability of network signals. It can ensure the normal transmission of network signals in the high-frequency band, breaking through the technical difficulty that chip common-mode inductors can only be used in low-frequency communication systems, bringing chip common-mode inductors into new application areas, extending the life cycle of chip common-mode inductors, expanding their application areas, and enhancing the market value of chip common-mode inductors. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the state of completing step 1 in the present invention;

[0013] Figure 2 This is a schematic diagram of the state of completing step 2 in the present invention;

[0014] Figure 3 It is a schematic diagram of the state before and after assembly in step three of the present invention;

[0015] Figure 4 It is a high-frequency test data curve diagram of the chip common-mode inductor network signal transmission in the present invention;

[0016] Figure 5 It is a curve diagram of S parameter measured data of the chip common mode inductor in the present invention;

[0017] Figure 6 The figure is a curve diagram of measured impedance parameters of the chip common-mode inductor in the present invention.

[0018] In the figure: 1-chip common-mode inductor skeleton, 2-end pin 2, 3-end pin 3, 4-end pin 4, 5-end pin 5, 6-skeleton center column, 7-first enameled wire end, 8-second enameled wire end, 9-bottom layer first winding section, 10-bottom layer second winding section, 11-two times the wire diameter spacing, 12-adhesive, 13-chip common-mode inductor upper cover, 14-first enameled wire tail, 15-second enameled wire tail, 16-surface layer first winding section, 17-surface layer second winding section. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0020] A production process for a high-frequency communication chip common-mode inductor, characterized in that it comprises the following steps:

[0021] Step 1: Reference Figure 1 First, place the end of the first enameled wire 8 on the end pin 3 on one side of the chip common mode inductor skeleton 1, and wind it multiple times on the 6-skeleton middle column to form the 9-bottom layer first winding section, 11-pull a distance of twice the wire diameter, and wind it multiple times on the 6-skeleton middle column in turn to form the 10-bottom layer second winding section, and then place the 15-second enameled wire tail on the end pin 5 on one side of the chip common mode inductor skeleton 1 to complete the first winding.

[0022] Step 2: Reference Figure 2 , and then place the end of the second enameled wire 7 on the end pin 2 on one side of the chip common mode inductor skeleton 1, and after winding multiple turns on the 6-skeleton middle column, form the 16-surface first section winding, 11-pull a distance of twice the wire diameter, and wind multiple turns on the 6-skeleton middle column in turn to form the 17-surface second section winding, and then place the 14-second enameled wire tail on the end pin 4 on one side of the chip common mode inductor skeleton 1 to complete the second winding.

[0023] Among them, the steps of automatic winding spot welding of the bottom product are:

[0024] Automatic winding parameter setting: winding wire diameter (0.035mm), number of winding coils (18 turns), winding direction, wire pulling spacing (0.1mm), number of winding sections (2 sections), spot welding temperature (lower limit 450℃-upper limit 550℃), spot welding time (0.3S);

[0025] 1. The first section of the bottom layer is automatically wound: It is made using an automatic winding spot welding machine. The I-shaped magnetic core (size specification: 3.2*2.5*1.6) is placed in the equipment to transfer the automatic winding station ①, as above. Figure 2 First, hang a single enameled wire 8 on the pad 3, and wind it counterclockwise along the middle column 6 of the magnetic core H skeleton for 18 turns (winding requirements: the wires are arranged tightly, without forks or crosses) to complete the first section of winding;

[0026] 2. The second section of the bottom layer is automatically wound: connect to the end of the first section, open the spacing 11 (0.1mm), wind counterclockwise along the middle column 6 of the core H skeleton, the number of turns: 18 turns, hang the single enameled wire tail 15 on the pad 5, and complete the second section of winding;

[0027] Bottom layer automatic spot welding: the enameled wire head 8 hung on the pad 3 and the enameled wire tail 15 of the pad 5 are welded and fixed to the pad by automatic spot welding (resistance welding), thus completing the bottom layer automatic winding spot welding production;

[0028] Automatic winding spot welding steps for surface products:

[0029] Automatic winding parameter setting: winding wire diameter (0.035mm), number of winding coils (18 turns), winding direction, wire pulling spacing (0.1mm), number of winding sections (2 sections), spot welding temperature (lower limit 450℃-upper limit 550℃), spot welding time (0.3S);

[0030] 1. The first section of the surface layer is automatically wound: It is made using an automatic winding spot welding machine. The finished bottom layer product is transferred to the automatic winding station ②, as shown above. Figure 3 First, hang a single enameled wire 7 on the pad 2, and wind it counterclockwise along the middle column 6 of the magnetic core H skeleton for 18 turns (winding requirements: the wires are arranged tightly, without forks or crosses) to complete the first section of winding;

[0031] 2. Automatic winding of the second section of the surface layer: connect to the end position of the first section winding, open the spacing 11 (0.1mm), wind counterclockwise along the middle column 6 of the magnetic core H skeleton, the number of turns: 18 turns, hang the single enameled wire tail 14 on the pad 4, and complete the second section winding;

[0032] 3. Automatic spot welding of the surface layer: the enameled wire head 7 hung on the pad 2 and the enameled wire tail 14 of the pad 4 are welded and fixed to the pad by automatic spot welding (resistance welding) to complete the automatic wire winding spot welding of the surface layer;

[0033] Step 3: Reference Figure 3 , transfer the products that have completed winding and spot welding to the equipment glue dispensing station for glue dispensing, apply two dots of glue on both sides of the back of the I-shaped magnetic core, and then align the I-piece magnetic core with the I-shaped magnetic core and assemble and fix them; after applying a proper amount of adhesive 12 on each point on the left and right shoulders of the chip common-mode inductor skeleton 1, cover the chip common-mode inductor top cover 13 on the chip common-mode inductor skeleton 1 for assembly and glue fixation to form a complete high-frequency communication chip common-mode inductor.

[0034] Step 4: Baking: The assembled and aligned products are transferred to the tunnel oven for baking at a temperature of 120°C for 90 minutes to complete the glue drying and bonding.

[0035] Step 5: Network signal transmission test; see Figure 4 The high-frequency test data table of the network signal transmission of the complete high-frequency communication chip common-mode inductor formed by implementing steps 1 to 4 (see Table 1) confirms that, especially at a frequency of 66MHz, the insertion loss value meets the IEEE802.3bw (100MBase-T1 automotive Ethernet)] OPEN ALLIANCE communication protocol standard IL≤-0.8dB.

[0036] Frequency (MHz) Insertion loss(dB) 1 -0.5 10 -0.5 33 -0.7 66 -1.0

[0037] Table 1

[0038] The S parameter measured data curve of the chip common mode inductor involved in the present invention is shown in FIG. Figure 5 ; The impedance parameter measured data curve of the chip common mode inductor involved in the present invention, refer to Figure 6 .

[0039] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention.

Claims

1. A production process for high-frequency communication chip common-mode inductors, characterized in that: The following steps are involved: Step 1: Place the end of the first enameled wire on the end pin on one side of the chip common mode inductor frame, and wind it multiple times on the middle column of the frame to form the first winding of the bottom layer, open a spacing of twice the wire diameter, and wind multiple times on the middle column of the frame to form the second winding of the bottom layer, and then place the tail of the second enameled wire on the end pin on one side of the chip common mode inductor frame to complete the first winding; Step 2: Place and fix the end of the second enameled wire on the end pin on one side of the chip common mode inductor skeleton, and wind it multiple times on the middle column of the skeleton to form the first section of the surface winding, open a spacing of twice the wire diameter, and wind it multiple times on the middle column of the skeleton in turn to form the second section of the surface winding, and then place and fix the end of the second enameled wire on the end pin on one side of the chip common mode inductor skeleton to complete the second winding winding; Step 3: After applying a proper amount of adhesive to each point on the left and right shoulders of the chip common-mode inductor frame, cover the chip common-mode inductor cover on the chip common-mode inductor frame for assembly and bonding and fixing to form a complete high-frequency communication chip common-mode inductor; Step 4: Bake; Step 5: Network signal transmission test.

2. The production process of a high-frequency communication chip common-mode inductor according to claim 1, characterized in that: In the steps 1 and 2, the automatic winding parameters are set as follows: winding wire diameter 0.035 mm, winding coil number 18 turns, winding direction, wire pulling spacing 0.1 mm, winding segment number 2 segments, spot welding temperature 450° C.-550° C., spot welding time 0.3S; The first section of automatic winding of the bottom layer: It is made using an automatic winding spot welding machine. The I-shaped magnetic core is placed in the automatic winding station of the equipment. A single enameled wire is hung on the welding pad first, and the number of turns is 18 in a counterclockwise direction along the middle column of the magnetic core H skeleton, completing the first section of winding. The second section of the bottom layer is automatically wound: connect to the end of the first section, open the spacing, and wind 18 turns counterclockwise along the middle column of the magnetic core H skeleton. Hang the tail of the single enameled wire on the pad to complete the second section of winding; Bottom layer automatic spot welding: Use automatic spot welding to weld the enameled wire head and the enameled wire tail hanging on the pad to fix the enameled wire to the pad, and complete the bottom layer automatic winding spot welding production.

3. The production process of a high-frequency communication chip common-mode inductor according to claim 2 is characterized in that: The first section of automatic winding of the surface layer: It is made using an automatic winding spot welding machine. The finished bottom layer product is transferred to the automatic winding station. First, a single enameled wire is hung on the welding pad and wound counterclockwise along the middle column of the magnetic core H skeleton for 18 turns to complete the first section of winding. The second section of the surface layer is automatically wound: connect to the end of the first section of winding, open the spacing, and wind 18 turns counterclockwise along the middle column of the magnetic core H skeleton. Hang the tail of the single enameled wire on the pad to complete the second section of winding; Automatic surface spot welding: Use automatic spot welding to weld the enameled wire head and the enameled wire tail on the pad to fix the enameled wire to the pad to complete the automatic wire winding spot welding production.

4. The production process of a high-frequency communication chip common-mode inductor according to claim 3 is characterized in that: Step 4 and step 5: transfer the finished products to the equipment glue dispensing station for glue dispensing. Apply two dots of glue on both sides of the back of the I-shaped magnetic core, and then align and assemble the I-shaped magnetic core with the I-shaped magnetic core. The glue dispensing time is 0.2S, the glue dispensing pressure is 0.05Mpa, and the glue dispensing temperature is 40℃±5°. The assembled and aligned products are transferred to a tunnel oven for baking at a temperature of 120°C for 90 minutes to complete the glue drying and bonding.

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