Method for removing adhesive of AMB copper-clad ceramic plate

Abstract

The invention discloses a method for removing bonding substances of an AMB copper-clad ceramic plate, and the method comprises the following specific steps: S1, selecting aluminum oxide or glass particles as a sand blasting material, carrying out sand blasting treatment, and cleaning the AMB copper-clad ceramic plate after sand blasting so as to remove residues generated in the sand blasting process; s2, brush wires are tightly arranged and fixed to a roller shaft to form a grinding brush, and the AMB copper-clad ceramic plate is polished and brushed; s3, carrying out annealing treatment on the AMB copper-clad ceramic plate; s4, etching the copper layer to a brazing layer by using a mixed solution of copper chloride and hydrochloric acid, etching the brazing layer by using an acidic etching solution, and removing the solder exposed after the pattern is etched on the AMB copper-clad ceramic plate; s5, a small amount of residual welding flux is removed through a chemical method, the use of chemicals is reduced, waste liquid and waste gas generated when the AMB copper-clad ceramic plate bonding substance is removed are reduced, and the method is environmentally friendly and convenient to use.

Description

Technical Field

[0001] The invention belongs to the technical field of copper-clad ceramic boards, and in particular relates to a method for removing adhesives from AMB copper-clad ceramic boards. Background Art

[0002] AMB copper-clad ceramic boards are a further development of DBC technology. They utilize a small amount of active elements in the solder to react with the ceramic to form a reaction layer wetted by the liquid solder, thereby achieving a ceramic-metal bond. Active metal solder is first printed on the ceramic surface, then clamped with oxygen-free copper and soldered at high temperature in a vacuum brazing furnace. After the bonding is complete, the substrate is wet-etched with a similar process to PCBs to create circuitry on the surface. Finally, the surface is plated to produce a reliable product. AMB copper-clad ceramic boards achieve bonding through a chemical reaction between the ceramic and active metal solder paste at high temperatures, resulting in a stronger bond and better reliability. However, this method is costly, has limited suitable solder, and significantly impacts solder reliability.

[0003] The current method for removing the adhesive on AMB copper-clad ceramic boards is to use direct etching, which uses chemical solutions to react with solder to achieve the purpose of removal. This method consumes a lot of chemicals and is not environmentally friendly. Summary of the Invention

[0004] Purpose of the invention: The purpose of the present invention is to address the deficiencies in the prior art and provide a method for removing adhesives from AMB copper-clad ceramic boards.

[0005] A method for removing adhesive from an AMB copper-clad ceramic plate, comprising the following steps: S1. Select aluminum oxide or glass particles as the sandblasting material, sandblast the AMB copper-clad ceramic plate, and clean the AMB copper-clad ceramic plate after sandblasting to remove the residues produced during the sandblasting process; S2. The brush filaments are closely arranged and fixed on the roller to form an abrasive brush, and the AMB copper-clad ceramic plate is subjected to a grinding and brushing process; S3. The AMB copper-clad ceramic plate is annealed at a temperature of 550°C for 3.5 hours to reduce the hardness after being attacked by external forces; S4. Etching the copper layer to the brazing layer using a mixed solution of copper chloride and hydrochloric acid, etching the brazing layer using an acidic etching solution to remove the solder exposed after etching the AMB copper-clad ceramic board pattern; S5. Use chemical method to remove the remaining small amount of solder.

[0006] A further improvement of the present invention is that in step S1, after the sandblasting is completed, a combination of a ceramic brush wheel and a non-woven fabric is used to improve the roughness of the AMB copper-clad ceramic board.

[0007] A further improvement of the present invention is that the raw materials selected for the ceramic brush wheel include abrasive, modified epoxy resin, phenolic resin, whisker and foaming agent, and the raw materials are mixed and stirred evenly.

[0008] A further improvement of the present invention is that the mixed raw materials are put into a mold for hot pressing, and then cooled and demolded to form a preformed ceramic resin grinding disc.

[0009] A further improvement of the present invention is that the surface of the preformed ceramic resin grinding disc is cleaned, and then the back of the ceramic resin grinding disc is evenly coated with glue and molded with vulcanized rubber to enhance the performance and durability of the grinding disc.

[0010] A further improvement of the present invention is that in step S4, in the mixed solution of copper chloride and hydrochloric acid, the concentration of copper chloride is 150-100 g / L, the concentration of hydrochloric acid is 2.7-3 mol / L, the etching temperature is 36-39° C., and the etching time is 35 min.

[0011] A further improvement of the present invention is that in step S4, the acidic etching solution includes 520 g / L ferric chloride, 4 mol / L hydrochloric acid, 35 g / L sodium hypochlorite, and 0.15 g / L benzotriazole.

[0012] A further improvement of the present invention is that, in step S2, the diameter of the brush filaments is in the range of 0.1-0.5 mm.

[0013] A further improvement of the present invention is that the brush filaments are metal brush filaments, and the metal brush filaments include stainless steel wires and copper-clad steel wires.

[0014] Compared with the prior art, the method for removing adhesives from AMB copper-clad ceramic boards provided by the present invention achieves at least the following beneficial effects: The present invention adopts a combined process of sandblasting, abrasion brushing, annealing, and chemical etching, which can remove the solder exposed after the AMB copper-clad ceramic plate is etched. By using a quick and environmentally friendly sandblasting method, most of the solder is removed. A ceramic brush and a non-woven fabric combination abrasion brushing are used to improve the high roughness of the copper surface after sandblasting. Annealing is used to reduce the high hardness generated by external force attack. Finally, a chemical method is used to remove a small amount of residual solder, thereby reducing the use of chemicals and reducing the waste liquid and waste gas generated when removing the adhesive of the AMB copper-clad ceramic plate. It is environmentally friendly and convenient. DETAILED DESCRIPTION

[0015] Various exemplary embodiments of the present invention will now be described in detail. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions, and values ​​set forth in these embodiments do not limit the scope of the present invention. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0016] Techniques, methods, and apparatus known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and apparatus should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0017] A method for removing adhesive from an AMB copper-clad ceramic plate, comprising the following steps: S1. Select aluminum oxide or glass particles as the sandblasting material, sandblast the AMB copper-clad ceramic plate, and clean the AMB copper-clad ceramic plate after sandblasting to remove the residues produced during the sandblasting process; S2. The brush filaments are closely arranged and fixed on the roller to form an abrasive brush, and the AMB copper-clad ceramic plate is subjected to a grinding and brushing process; S3. The AMB copper-clad ceramic plate is annealed at a temperature of 550°C for 3.5 hours to reduce the hardness after being attacked by external forces; S4. Etching the copper layer to the brazing layer using a mixed solution of copper chloride and hydrochloric acid, etching the brazing layer using an acidic etching solution to remove the solder exposed after etching the AMB copper-clad ceramic board pattern; S5. Use chemical method to remove the remaining small amount of solder.

[0018] A further improvement of the present invention is that in step S1, after the sandblasting is completed, a combination of a ceramic brush wheel and a non-woven fabric is used to improve the roughness of the AMB copper-clad ceramic board.

[0019] A further improvement of the present invention is that the raw materials selected for the ceramic brush wheel include abrasive, modified epoxy resin, phenolic resin, whisker and foaming agent, and the raw materials are mixed and stirred evenly.

[0020] A further improvement of the present invention is that the mixed raw materials are put into a mold for hot pressing, and then cooled and demolded to form a preformed ceramic resin grinding disc.

[0021] A further improvement of the present invention is that the surface of the preformed ceramic resin grinding disc is cleaned, and then the back of the ceramic resin grinding disc is evenly coated with glue and molded with vulcanized rubber to enhance the performance and durability of the grinding disc.

[0022] A further improvement of the present invention is that in step S4, in the mixed solution of copper chloride and hydrochloric acid, the concentration of copper chloride is 150-100 g / L, the concentration of hydrochloric acid is 2.7-3 mol / L, the etching temperature is 36-39° C., and the etching time is 35 min.

[0023] A further improvement of the present invention is that in step S4, the acidic etching solution includes 520 g / L ferric chloride, 4 mol / L hydrochloric acid, 35 g / L sodium hypochlorite, and 0.15 g / L benzotriazole.

[0024] A further improvement of the present invention is that, in step S2, the diameter of the brush filaments is in the range of 0.1-0.5 mm.

[0025] A further improvement of the present invention is that the brush filaments are metal brush filaments, and the metal brush filaments include stainless steel wires and copper-clad steel wires.

[0026] In summary, the present invention provides a method for removing adhesives from AMB copper-clad ceramic boards, which adopts a combined process of sandblasting, grinding, annealing, and chemical etching to remove the solder exposed after the AMB copper-clad ceramic board is etched. Most of the solder is removed by using a quick and environmentally friendly sandblasting method, and a combination of ceramic brushes and non-woven fabrics is used to improve the higher roughness. Annealing is used to reduce the higher hardness generated by external force attack. Finally, a chemical method is used to remove a small amount of residual solder, reducing the use of chemicals and reducing the waste liquid and waste gas generated when removing the adhesives from the AMB copper-clad ceramic board, which is economical and environmentally friendly.

[0027] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present invention or exceeding the scope of the appended claims.

Claims

1. A method for removing adhesive from AMB copper-clad ceramic boards, characterized in that: The specific steps include: S1. Select aluminum oxide or glass particles as the sandblasting material, sandblast the AMB copper-clad ceramic plate, and clean the AMB copper-clad ceramic plate after sandblasting to remove the residues produced during the sandblasting process; S2. The brush wires are closely arranged and fixed on the roller to form a grinding brush, and the AMB copper-clad ceramic plate is subjected to grinding and brushing treatment; S3. The AMB copper-clad ceramic plate is annealed at a temperature of 550°C for 3.5 hours to reduce the hardness after being attacked by external forces; S4. Etching the copper layer to the solder layer using a mixed solution of cupric chloride and hydrochloric acid, etching the solder layer using an acidic etching solution, and removing the solder exposed after the AMB copper-clad ceramic board is etched; S5. Use chemical method to remove the small amount of residual solder.

2. A method for removing adhesive from AMB copper-clad ceramic board according to claim 1, characterized in that: In the step S1, after the sandblasting is completed, a combination of a ceramic brush wheel and a non-woven fabric is used to improve the roughness of the AMB copper-clad ceramic board.

3. A method for removing adhesive from AMB copper-clad ceramic board according to claim 2, characterized in that: The raw materials selected for the ceramic brush wheel include abrasive, modified epoxy resin, phenolic resin, whisker and foaming agent, and the raw materials are mixed and stirred evenly.

4. A method for removing adhesive from AMB copper-clad ceramic board according to claim 3, characterized in that: The mixed raw materials are put into a mold for hot pressing, and then cooled and demolded to form a preformed ceramic resin grinding disc.

5. A method for removing adhesive from AMB copper-clad ceramic board according to claim 4, characterized in that: The surface of the preformed ceramic resin grinding disc is cleaned, and then the back of the ceramic resin grinding disc is evenly coated with glue and molded with vulcanized rubber to enhance the performance and durability of the grinding disc.

6. A method for removing adhesive from AMB copper-clad ceramic board according to claim 1, characterized in that: In step S4, in the mixed solution of cupric chloride and hydrochloric acid, the concentration of cupric chloride is 150-100 g / L, the concentration of hydrochloric acid is 2.7-3 mol / L, the etching temperature is 36-39° C., and the etching time is 35 min.

7. A method for removing adhesive from AMB copper-clad ceramic board according to claim 1, characterized in that: In step S4, the acidic etching solution includes 520 g / L ferric chloride, 4 mol / L hydrochloric acid, 35 g / L sodium hypochlorite, and 0.15 g / L benzotriazole.

8. A method for removing adhesive from AMB copper-clad ceramic board according to claim 1, characterized in that: In step S2, the diameter of the brush filaments is in the range of 0.1-0.5 mm.

9. A method for removing adhesive from AMB copper-clad ceramic board according to claim 8, characterized in that: The brush wires are metal brush wires, which include stainless steel wires and copper-clad steel wires.