Wafer cassette carrying robot and wafer cassette carrying method

Abstract

The invention provides a wafer box carrying robot which comprises a base, a wafer box carrying robot body and a control device. A drawing plate is arranged in the base, and the drawing plate is connected to the base in a sliding mode; the first moving assembly is connected to the drawing plate in a sliding manner; the second moving assembly is pivotally connected to the first moving assembly; the manipulator is pivotally connected to the second moving assembly and is used for carrying the wafer box; the loading frame is connected to the base, a positioning sleeve frame is arranged on the loading frame, and the positioning sleeve frame is used for placing a wafer box; when the drawing plate is located in the base, the moving direction of the second moving assembly, the extending direction of the mechanical arm and the extending direction of the drawing plate are parallel. When the drawing plate is drawn out of the base, the moving direction of the second moving assembly is perpendicular to the extending direction of the drawing plate, and the extending direction of the mechanical arm is parallel to the extending direction of the drawing plate. According to the invention, the carrying efficiency of the wafer box can be improved, and the safety and integrity of wafer transfer are ensured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer box transporting robot and a wafer box transporting method. Background Art

[0002] In the semiconductor field, wafers need to be placed in wafer boxes, and the wafer boxes are transported by a handling robot in units of wafer boxes. When the existing wafer box handling robot is in use, the manipulator on it is fixed and cannot be moved. When the carrying platform is lengthened to increase the transportation workload, the manipulator cannot transport wafer boxes at a distant location, resulting in low handling efficiency. Summary of the invention

[0003] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a wafer box handling robot and a wafer box handling method, so as to solve the problem of low wafer box handling efficiency in the prior art.

[0004] In order to achieve the above-mentioned object and other related objects, the present invention provides a wafer box handling robot, comprising: A base, wherein a drawer plate is arranged inside the base, and the drawer plate is slidably connected to the base; A first moving component, slidably connected to the drawer plate; A second moving assembly, pivotally connected to the first moving assembly; a robot arm pivotally connected to the second moving assembly, the robot arm being used for carrying a wafer box; and A loading rack connected to the base, wherein a positioning frame is provided on the loading rack, and the positioning frame is used to place a wafer box; Wherein, when the pull-out plate is located inside the base, the moving direction of the second moving assembly, the extending direction of the manipulator and the extending direction of the pull-out plate are parallel; When the pull-out plate is pulled out of the base, the moving direction of the second moving component is perpendicular to the extending direction of the pull-out plate, and the extending direction of the manipulator is parallel to the extending direction of the pull-out plate.

[0005] In one embodiment of the present invention, the manipulator comprises a connecting arm, a moving arm and a clamping arm; The connecting arm is connected to the second moving assembly, the moving arm is pivotally connected to the connecting arm, and the clamping arm is pivotally connected to the moving arm.

[0006] In one embodiment of the present invention, the clamping arm comprises: A fixing plate, wherein the fixing plate is provided with an arc-shaped groove; A first connecting rod is slidably connected in the first arc-shaped groove, and a first clamping plate is connected to the first connecting rod; and The second connecting rod is slidably connected in the second arc groove. The second connecting rod is connected with a second clamping plate. The first clamping plate and the second clamping plate are opposite to each other so as to clamp the wafer box.

[0007] In one embodiment of the present invention, the distance between the first arc groove and the second arc groove on the side close to the first clamping plate is recorded as a first distance, and the distance between the first arc groove and the second arc groove on the side away from the first clamping plate is recorded as a second distance, and the first distance is greater than the second distance; The center of a circle corresponding to the first arc-shaped groove and the center of a circle corresponding to the second arc-shaped groove are located on a side away from the first clamping plate.

[0008] In one embodiment of the present invention, the clamping arm further comprises: A first parallel plate, one end of which is pivotally connected to the first connecting rod, and the other end of which is fixedly connected to the first clamping plate; A second parallel plate, one end of which is pivotally connected to the second connecting rod, and the other end of which is fixedly connected to the second clamping plate; A first cross bar connected between the head end of the first parallel plate and the tail end of the second parallel plate; The second cross bar is connected between the tail end of the first parallel plate and the head end of the second parallel plate, and the center of the first cross bar is rotatably connected to the center of the second cross bar.

[0009] In one embodiment of the present invention, the clamping arm further comprises: A moving block connected to the first connecting rod and the second connecting rod; A power source, driving the moving block to move; Gears, racks are respectively arranged on the opposite sides of the first connecting rod and the second connecting rod, the rack on the first connecting rod is meshed with one of the gears, and the rack on the second connecting rod is meshed with the other gear.

[0010] In one embodiment of the present invention, a groove is provided on the pull-out plate, a rack is arranged in the groove, the first moving component includes a mounting block, a driving motor and a gear, the gear is connected to the bottom of the mounting block and meshes with the rack, and the driving motor drives the gear to rotate.

[0011] In one embodiment of the present invention, a vertical plate is connected to the base, and the loading frame is connected to two sides of the vertical plate.

[0012] In one embodiment of the present invention, when the pull-out plate is located inside the base, the connecting arm, the moving arm and the clamping arm are located on the same straight line.

[0013] The present invention further provides a wafer box transport method, using any of the wafer box transport robots described above, comprising: Pull the pull-out plate to the outside of the base, and rotate the second movable assembly so that the moving direction of the second movable assembly is perpendicular to the extending direction of the pull-out plate; Rotate the manipulator so that the extension direction of the manipulator is parallel to the extension direction of the pull-out plate; The robot grabs the target wafer box by moving the first moving component and the second moving component, and places the target wafer box on the positioning frame of the loading rack; When the robot carries a plurality of target wafer boxes to the positioning frame of the loading rack, or when the positioning frame of the loading rack is full of target wafer boxes, the robot is rotated so that the extension direction of the robot is perpendicular to the extension direction of the pull-out plate; The second moving assembly is rotated so that the moving direction of the second moving assembly is parallel to the extending direction of the pull-out plate, and the pull-out plate is pulled into the interior of the base.

[0014] As described above, the present invention provides a wafer box transport robot and a wafer box transport method, which can improve the transport efficiency of the wafer box and ensure the safety and integrity of wafer transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of a wafer box handling robot provided in an embodiment of the present invention without handling a wafer box.

[0016] Figure 2 A schematic diagram of a wafer box handling robot carrying a wafer box provided in an embodiment of the present invention.

[0017] Figure 3 A schematic diagram of a manipulator, a second moving assembly and a pull-out plate inside a wafer box handling robot provided in one embodiment of the present invention.

[0018] Figure 4 A schematic diagram of a manipulator, a second moving assembly and a pull-out plate on the outside of a wafer box handling robot provided in one embodiment of the present invention.

[0019] Figure 5 A schematic diagram of a manipulator and a second moving component provided in accordance with an embodiment of the present invention.

[0020] Figure 6A schematic diagram of a connecting arm and a second moving assembly of a manipulator provided in one embodiment of the present invention.

[0021] Figure 7 Another schematic diagram of the connecting arm and the second moving assembly of the manipulator provided in one embodiment of the present invention.

[0022] Figure 8 A schematic structural diagram of a clamping arm of a robot provided in one embodiment of the present invention.

[0023] Fig. 9 A schematic diagram of the steps of a wafer box transporting method provided by one embodiment of the present invention.

[0024] 10. base; 110. drawer plate; 111. groove; 112. rack; 120. vertical plate; 20. First moving assembly; 210. Mounting block; 220. Gear; 30. Second moving assembly; 40. Manipulator; 410. Connecting arm; 420. Moving arm; 430. Clamping arm; 431. Fixing plate; 4311. Arc groove; 432. First connecting rod; 433. Second connecting rod; 434. First clamping plate; 435. Second clamping plate; 436. First parallel plate; 4361. First cross rod; 4362. Slide; 437. Second parallel plate; 4371. Second cross rod; 438. Moving block; 439. Power source; 50. Loading rack; 510. Positioning frame; 60. Wafer box. DETAILED DESCRIPTION

[0025] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0026] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0027] In the following description, numerous details are discussed to provide a more thorough explanation of the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other embodiments, well-known structures and devices are shown in the form of block diagrams rather than in detail to avoid making the embodiments of the present invention difficult to understand.

[0028] See also Figures 1 to 9 The present invention provides a wafer box handling robot and a wafer box handling method, which can be applied to the field of semiconductor wafer handling, for example, between the processes of multiple wafers, the wafer box 60 is handled by the wafer box handling robot, thereby ensuring the safety and integrity of wafer transfer. A detailed description is given below through specific embodiments.

[0029] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 In one embodiment of the present invention, the present invention provides a wafer box handling robot, which may include a base 10, a first moving assembly 20, a second moving assembly 30, a manipulator 40 and a loading rack 50. The base 10 serves as the installation body of the wafer box handling robot. Specifically, the first moving assembly 20, the second moving assembly 30 and the manipulator 40 may be installed in the base 10, and the loading rack 50 may be installed on the top of the base 10.

[0030] Specifically, Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a drawer plate 110 may be provided inside the base 10, and the drawer plate 110 may be slidably connected to the base 10. The first movable assembly 20 may be slidably connected to the drawer plate 110, that is, the first movable assembly 20 may move on the drawer plate 110. The second movable assembly 30 is pivotally connected to the first movable assembly 20, that is, the second movable assembly 30 is rotationally connected to the first movable assembly 20, and the second movable assembly 30 may rotate relative to the first movable assembly 20.

[0031] Specifically, Figure 3 , Figure 4 As shown, the robot 40 can be pivotally connected to the second moving assembly 30, that is, the robot 40 and the second moving assembly 30 are rotationally connected, and the robot 40 can rotate relative to the second moving assembly 30. The second moving assembly 30 can drive the robot 40 to move, and the robot 40 can be used to carry the wafer box 60.

[0032] Specifically, Figure 1 , Figure 2As shown, the loading rack 50 is connected to the base 10 , and a positioning frame 510 may be provided on the loading rack 50 , and the wafer box 60 is transported to the positioning frame 510 by the robot 40 .

[0033] Specifically, Figure 3 , Figure 4 As shown, when the pull-out plate 110 is located inside the base 10, the moving direction of the second moving assembly 30, the extending direction of the manipulator 40 and the extending direction of the pull-out plate 110 are parallel. When the pull-out plate 110 is located outside the base 10, the moving direction of the second moving assembly 30 is perpendicular to the extending direction of the pull-out plate 110, and the extending direction of the manipulator 40 is parallel to the extending direction of the pull-out plate 110.

[0034] like Figure 3 , Figure 4 As shown, when the wafer box handling robot does not need to carry the wafer box 60, the first moving assembly 20, the second moving assembly 30 and the manipulator 40 can be stored in the base 10, so as to reduce the space. When the wafer box handling robot needs to carry the wafer box 60, the first moving assembly 20, the second moving assembly 30 and the manipulator 40 can be pulled out of the base 10, so as to carry out the wafer box 60.

[0035] See also Figure 1 , Figure 2 In one embodiment of the present invention, a vertical plate 120 is connected to the base 10, and the loading frame 50 is connected to both sides of the vertical plate 120. The second moving component 30 is an electric telescopic rod.

[0036] See also Figure 5 In one embodiment of the present invention, at least two robots 40 may be provided on the second moving assembly 30 to improve the handling efficiency of the wafer box 60 .

[0037] Specifically, Figure 5 As shown, the robot 40 may include a connecting arm 410, a moving arm 420 and a clamping arm 430. The connecting arm 410 is connected to the second moving assembly 30, the moving arm 420 is pivotally connected to the connecting arm 410, and the clamping arm 430 is pivotally connected to the moving arm 420.

[0038] For example, in a robot 40, the number of movable arms 420 may be at least two, for example, the first end of the first movable arm 420 may be rotatably connected to the connecting arm 410, the second end of the first movable arm 420 may be rotatably connected to the first end of the second movable arm 420, and the second end of the second movable arm 420 may be connected to the clamping arm 430.

[0039] like Figure 5As shown, driving motors (not shown) may be provided at the bottom of both ends of the moving arm 420, and the driving motors may be used to drive the moving arm 420 to rotate, so that the moving arm 420 drives the clamping arm 430 to move in a plane. The vertical upward movement of the clamping arm 430 is driven by the second moving assembly 30.

[0040] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, when the pull-out plate 110 is located inside the base 10 , the connecting arm 410 , the moving arm 420 and the clamping arm 430 are located on the same straight line.

[0041] See also Figure 8 In one embodiment of the present invention, the clamping arm 430 may include a fixing plate 431 , a first connecting rod 432 , a second connecting rod 433 , a first clamping plate 434 and a second clamping plate 435 .

[0042] Specifically, an arc groove 4311 is provided on the fixing plate 431. The first connecting rod 432 is slidably connected in the first arc groove 4311, and the first clamping plate 434 is connected to the first connecting rod 432. The second connecting rod 433 is slidably connected in the second arc groove 4311, and the second clamping plate 435 is connected to the second connecting rod 433. The first clamping plate 434 and the second clamping plate 435 are opposite to each other to clamp the wafer box 60. When the first connecting rod 432 and the second connecting rod 433 are moving, they will move along the arc groove 4311, so that the first connecting rod 432 and the second connecting rod 433 are moving, so that the distance between the first clamping plate 434 and the second clamping plate 435 is changed. The distance between the first clamping plate 434 and the second clamping plate 435 can be increased or decreased, and wafer boxes 60 of different sizes can be clamped and transported.

[0043] In addition, if Figure 8 As shown, the first connecting rod 432 and the second connecting rod 433 may be provided with arc grooves 4311, and the fixing plate 431 may be provided with two corresponding limiting posts, which are inserted into the arc grooves 4311. When the first connecting rod 432 and the second connecting rod 433 are moving, they will be restricted by the limiting posts, so that the first connecting rod 432 and the second connecting rod 433 move closer to or farther from each other, thereby changing the distance between the first clamping plate 434 and the second clamping plate 435.

[0044] See also Figure 8In one embodiment of the present invention, the distance between the first arc groove 4311 and the second arc groove 4311 on the side close to the first clamping plate 434 is recorded as the first distance. The distance between the first arc groove 4311 and the second arc groove 4311 on the side away from the first clamping plate 434 is recorded as the second distance. The first distance is greater than the second distance. The center of the circle corresponding to the first arc groove 4311 and the center of the circle corresponding to the second arc groove 4311 are located on the side away from the first clamping plate 434.

[0045] See also Figure 8 In one embodiment of the present invention, the first connecting rod 432 and the second connecting rod 433 move along the arc groove 4311 during the movement, so that the first connecting rod 432 and the second connecting rod 433 move closer to or farther from each other during the movement, thereby changing the distance between the first clamping plate 434 and the second clamping plate 435. The distance between the first clamping plate 434 and the second clamping plate 435 can be increased or decreased, so that wafer boxes 60 of different sizes can be clamped and transported.

[0046] However, since the first clamping plate 434 and the second clamping plate 435 are directly moved under the action of the first connecting rod 432 and the second connecting rod 433, the first clamping plate 434 and the second clamping plate 435 are not always parallel to each other. Since the wafer box 60 is in the shape of a rectangular parallelepiped, the first clamping plate 434 and the second clamping plate 435 may be unevenly applied to the wafer box 60, thereby causing damage to the wafers in the wafer box 60. Therefore, it is necessary to keep the first clamping plate 434 and the second clamping plate 435 parallel to each other.

[0047] See also Figure 8 In one embodiment of the present invention, the clamping arm 430 may further include a first parallel plate 436 , a second parallel plate 437 , a first cross bar 4361 , and a second cross bar 4371 .

[0048] One end of the first parallel plate 436 is pivotally connected to the first connecting rod 432 , and the other end of the first parallel plate 436 is fixedly connected to the first clamping plate 434 .

[0049] Specifically, one end of the second parallel plate 437 is pivotally connected to the second connecting rod 433 , and the other end of the second parallel plate 437 is fixedly connected to the second clamping plate 435 .

[0050] Specifically, one end of the first cross bar 4361 is slidably connected to the first parallel plate 436, and the other end of the first cross bar 4361 is rotatably connected to an end of the second parallel plate 437 close to the second connecting rod 433. Figure 8As shown, a slide groove 4362 may be opened on the first parallel plate 436, one end of the first cross rod 4361 may be slidably connected to the slide groove 4362 of the first parallel plate 436, and the other end of the first cross rod 4361 may be rotatably connected to one end of the second parallel plate 437 close to the second connecting rod 433.

[0051] Specifically, one end of the second cross bar 4371 is slidably connected to the second parallel plate 437, and the other end of the second cross bar 4371 is rotatably connected to one end of the first parallel plate 436 close to the first connecting rod 432, and the center of the first cross bar 4361 is rotatably connected to the center of the second cross bar 4371. Figure 8 As shown, a slide groove 4362 may be opened on the second parallel plate 437, one end of the second cross rod 4371 may be slidably connected to the slide groove 4362 of the second parallel plate 437, and the other end of the second cross rod 4371 may be rotatably connected to one end of the first parallel plate 436 close to the first connecting rod 432.

[0052] As can be seen from the above, under the action of the first cross bar 4361 and the second cross bar 4371, and under the action of the first connecting bar 432 and the second connecting bar 433, the first parallel plate 436 and the second parallel plate 437 form two sides of a parallelogram, and the first cross bar 4361 and the second cross bar 4371 form two diagonal lines of another parallelogram. Thus, the first parallel plate 436 and the second parallel plate 437 are always in a parallel state, so that the wafer box 60 can be clamped and transported more adaptably.

[0053] See also Figure 8 In one embodiment of the present invention, the clamping arm 430 may further include a moving block 438, a power source 439 and a gear 220. Specifically, the moving block 438 is connected to the first connecting rod 432 and the second connecting rod 433.

[0054] The power source 439 is connected to the moving block 438, and the output end of the power source 439 drives the moving block 438 to move. A rack 112 is provided on the first connecting rod 432 and the second connecting rod 433 on the side close to each other. The rack 112 on the first connecting rod 432 meshes with one gear 220, and the rack 112 on the second connecting rod 433 meshes with another gear 220.

[0055] Specifically, the power source 439 drives the moving block 438 to move, and the movement of the moving block 438 can drive the first connecting rod 432 and the second connecting rod 433 to move. Since the rack 112 on the first connecting rod 432 is engaged with a gear 220, and the rack 112 on the second connecting rod 433 is engaged with another gear 220, the first connecting rod 432 and the second connecting rod 433 can move smoothly.

[0056] See also Figure 3 , Figure 4 In one embodiment of the present invention, a groove 111 is provided on the pull-out plate 110, and a rack 112 is provided in the groove 111. The first moving assembly 20 includes a mounting block 210, a driving motor (not shown in the figure) and a gear 220. The gear 220 is connected to the bottom of the mounting block 210 and meshes with the rack 112. The driving motor drives the gear 220 to rotate, thereby realizing the movement of the mounting block 210 on the pull-out plate 110. During the movement of the mounting block 210, the second moving assembly 30 on the mounting block 210 also moves. Under the action of the second moving assembly 30, the second moving assembly 30 can further drive the manipulator 40 to move. After clamping the wafer box 60, the manipulator 40 can clamp and carry the wafer box 60 under the action of the first moving assembly 20 and the second moving assembly 30.

[0057] See also Fig. 9 In one embodiment of the present invention, a wafer box handling method is proposed, which uses the above-mentioned wafer box handling robot and may include the following steps.

[0058] Step S10: Pull the pull-out plate to the outside of the base, and rotate the second movable assembly so that the moving direction of the second movable assembly is perpendicular to the extending direction of the pull-out plate.

[0059] Step S20, rotating the manipulator so that the extension direction of the manipulator is parallel to the extension direction of the pull-out plate.

[0060] Step S30 , the robot grabs the target wafer box through the movement of the first moving component and the second moving component, and places the target wafer box on the positioning frame of the loading rack.

[0061] Step S40, after the robot carries multiple target wafer boxes to the positioning frame of the loading rack, or after the positioning frame of the loading rack is fully loaded with target wafer boxes, the robot is rotated so that the extension direction of the robot is perpendicular to the extension direction of the pull-out plate.

[0062] Step S50, rotating the second movable assembly so that the moving direction of the second movable assembly is parallel to the extending direction of the pull-out plate, and pulling the pull-out plate into the interior of the base.

[0063] It can be seen that, through the above-mentioned wafer box handling method, when the wafer box handling robot does not need to carry the wafer box 60, the first moving assembly 20, the second moving assembly 30 and the manipulator 40 can be stored in the base 10, so as to reduce the space. When the wafer box handling robot needs to carry the wafer box 60, the first moving assembly 20, the second moving assembly 30 and the manipulator 40 can be pulled out of the base 10, so as to carry out the wafer box 60.

[0064] In summary, the wafer box handling robot and wafer box handling method disclosed in the present invention can improve the handling efficiency of the wafer box and ensure the safety and integrity of wafer transfer. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0065] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer box handling robot, characterized in that: include: A base, wherein a drawer plate is arranged inside the base, and the drawer plate is slidably connected inside the base; A first moving component, slidably connected to the drawer plate; A second moving assembly, pivotally connected to the first moving assembly; A robot arm, pivotally connected to the second moving assembly, the robot arm being used for carrying a wafer box; as well as A loading rack connected to the base, the loading rack being provided with a positioning frame for placing a wafer box; Wherein, when the pull-out plate is located inside the base, the moving direction of the second moving assembly, the extending direction of the manipulator and the extending direction of the pull-out plate are parallel; When the pull-out plate is located outside the base, the moving direction of the second moving assembly is perpendicular to the extending direction of the pull-out plate, and the extending direction of the manipulator is parallel to the extending direction of the pull-out plate.

2. The wafer box handling robot according to claim 1, characterized in that: The manipulator comprises a connecting arm, a moving arm and a clamping arm; The connecting arm is connected to the second moving assembly, the moving arm is pivotally connected to the connecting arm, and the clamping arm is pivotally connected to the moving arm.

3. The wafer box handling robot according to claim 2, characterized in that: The clamping arm comprises: A fixing plate, wherein the fixing plate is provided with an arc-shaped groove; A first connecting rod is slidably connected in the first arc-shaped groove, and a first clamping plate is connected to the first connecting rod; and The second connecting rod is slidably connected in the second arc groove. The second connecting rod is connected with a second clamping plate. The first clamping plate and the second clamping plate are opposite to each other so as to clamp the wafer box.

4. The wafer box handling robot according to claim 3, characterized in that: On a side close to the first clamping plate, the distance between the first arc groove and the second arc groove is recorded as a first distance, and on a side far from the first clamping plate, the distance between the first arc groove and the second arc groove is recorded as a second distance, and the first distance is greater than the second distance; The center of a circle corresponding to the first arc-shaped groove and the center of a circle corresponding to the second arc-shaped groove are located on a side away from the first clamping plate.

5. The wafer box transport robot according to claim 3 or 4, characterized in that: The clamping arm further comprises: A first parallel plate, one end of which is pivotally connected to the first connecting rod, and the other end of which is fixedly connected to the first clamping plate; A second parallel plate, one end of which is pivotally connected to the second connecting rod, and the other end of which is fixedly connected to the second clamping plate; A first cross rod, one end of which is slidably connected to the first parallel plate, and the other end of which is rotatably connected to an end of the second parallel plate close to the second connecting rod; The second cross bar has one end slidably connected to the second parallel plate and the other end rotationally connected to one end of the first parallel plate close to the first connecting rod, and the center of the first cross bar is rotationally connected to the center of the second cross bar.

6. The wafer box handling robot according to claim 3, characterized in that: The clamping arm further comprises: A moving block connected to the first connecting rod and the second connecting rod; A power source, an output end of which is connected to the moving block to drive the moving block to move; Gear, a rack is provided on one side of the first connecting rod and the second connecting rod close to each other, the rack on the first connecting rod is meshed with one of the gears, and the rack on the second connecting rod is meshed with the other of the gears.

7. The wafer box transport robot according to claim 1, characterized in that: The pull-out plate is provided with a groove, in which a rack is arranged. The first moving assembly includes a mounting block, a driving motor and a gear. The gear is connected to the bottom of the mounting block and meshes with the rack. The driving motor drives the gear to rotate.

8. The wafer box transport robot according to claim 1, characterized in that: A vertical plate is connected to the base, and the loading frame is connected to two sides of the vertical plate.

9. The wafer box transport robot according to claim 2, characterized in that: When the pull-out plate is located inside the base, the connecting arm, the moving arm and the clamping arm are located on the same straight line.

10. A wafer box transporting method, using the wafer box transporting robot according to any one of claims 1 to 9, characterized in that: include: Pull the pull-out plate to the outside of the base, and rotate the second movable assembly so that the moving direction of the second movable assembly is perpendicular to the extending direction of the pull-out plate; Rotate the manipulator so that the extension direction of the manipulator is parallel to the extension direction of the pull-out plate; The robot grabs the target wafer box by moving the first moving component and the second moving component, and places the target wafer box on the positioning frame of the loading rack; When the robot carries a plurality of target wafer boxes to the positioning frame of the loading rack, or when the positioning frame of the loading rack is full of target wafer boxes, the robot is rotated so that the extension direction of the robot is perpendicular to the extension direction of the pull-out plate; The second moving assembly is rotated so that the moving direction of the second moving assembly is parallel to the extending direction of the pull-out plate, and the pull-out plate is pulled into the interior of the base.

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