Semiconductor device active alignment device and alignment method thereof

Abstract

The invention provides a semiconductor device active alignment device and an alignment method thereof.The semiconductor device active alignment device comprises an alignment jig, an alignment execution mechanism and an alignment driving mechanism, and the alignment execution mechanism comprises a sliding deflector rod part, a sliding alignment part and a rotary alignment part; the sliding deflector rod part is used for converting motion in the vertical direction in the alignment driving mechanism into motion in the horizontal direction, so that the rotary alignment part is driven to rotate, and the sliding alignment part is further driven to do alignment motion in the horizontal direction; and the alignment jig is used for placing the semiconductor device and is driven by the sliding alignment part to complete alignment of the semiconductor device. The active alignment device of the semiconductor device and the alignment method thereof are simple and effective in structure, controllable in cost and suitable for large-scale production operation.

Description

Technical Field

[0001] The invention belongs to the field of integrated circuits, and in particular relates to an active alignment device for a semiconductor device and an alignment method thereof. Background Art

[0002] During the testing and sorting of semiconductor devices (such as packaged chips or bare chips), various transfer processes must be performed, such as transmission, testing, and sorting between processes or between carriers. In the above case, one or more semiconductor devices are placed in one or more positioning holes of a carrier (such as a device carrier, also called a shuttle, etc.). The semiconductor devices must be in the correct position in the positioning holes where they are placed. Otherwise, the subsequent transfer of semiconductor devices will not be successful. For example, if a misaligned semiconductor device fails to be placed in the correct position of the positioning hole, the subsequent transfer arm will not be able to remove the semiconductor device from the positioning hole, causing the entire machine to alarm and shut down, affecting the output of the entire machine; for example, during the testing of semiconductor devices, it is required to ensure that the probe of the test socket can be accurately aligned with the center of the pin of the semiconductor device. If it cannot be accurately aligned, the test result cannot be guaranteed, which seriously affects the test efficiency and output.

[0003] There are two existing solutions for the above situation: one is to improve the dimensional accuracy of the carrier positioning hole, reduce the opening size of the positioning hole, and try to ensure the consistency of the position of the semiconductor device after it is placed in the positioning hole. However, this method has many defects. The first is that the requirements for the positioning and placement of the loading and transferring arm are greatly increased, otherwise it is difficult to place the semiconductor device accurately into the positioning hole. The second is that due to the reduced opening size of the positioning hole, those semiconductor devices with upper tolerance sizes cannot be smoothly placed in the positioning hole. Although the size of semiconductor devices continues to shrink, the manufacturing tolerance of the device is still relatively large. The static alignment technology of placing semiconductor devices in the device carrier cannot be aligned and adjusted after the device is placed. Therefore, it is not a feasible solution for semiconductor devices with relatively small size but large manufacturing tolerance, which will cause material jamming and machine alarm. Another solution is to use visual inspection and mechanical alignment at the same time. First, use the visual system to check the appearance of the semiconductor device, and then send the calculated required position compensation information to the three motors in the X, Y and Theta directions that can act independently, thereby improving the accuracy of transplant positioning. This method has many defects. The first is that it is expensive and complex in structure, making it difficult to adapt to the requirements of testing multiple products in parallel. The second is that it is very inefficient, especially when multiple products are tested in parallel, which will seriously affect the output of the machine. Dynamic alignment technology can adapt to relatively small semiconductor devices, but visual inspection and mechanical alignment must be used at the same time. Traditional dynamic alignment technology requires a large number of hardware integrated cameras and alignment motors. Usually each alignment requires three motors to move in the X, Y, and Theta directions. For parallel testing of multiple or higher chips, multiple sets of visual systems and alignment motors are required. Such additional equipment not only greatly increases the cost, but also reduces the equipment throughput per hour (UPH). Summary of the invention

[0004] In view of this, the present invention aims to provide an active alignment device for semiconductor devices to solve the problems of low working efficiency and high testing cost in the prior art.

[0005] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0006] An active alignment device for a semiconductor device comprises an alignment fixture, an alignment actuator and an alignment drive mechanism.

[0007] The alignment actuator comprises a sliding lever part, a sliding alignment part and a rotating alignment part. The sliding lever part is used to convert the vertical movement in the alignment driving mechanism into the horizontal movement, thereby driving the rotating alignment part to rotate, and then driving the sliding alignment part to perform the horizontal alignment movement.

[0008] The alignment fixture is used to place the semiconductor device, and the alignment of the semiconductor device is completed by driving the sliding alignment part.

[0009] Furthermore, the alignment jig includes two independently arranged jig units, the jig unit including a tray and a No. 1 alignment claw and a No. 2 alignment claw arranged above the tray, the tray is used to place semiconductor devices, and is fixedly connected to the alignment substrate at the bottom, the No. 1 alignment claw and the No. 2 alignment claw are both installed on a horizontal slider of a sliding alignment unit, and a positioning hole for placing the semiconductor device is formed between the No. 1 alignment claw and the No. 2 alignment claw.

[0010] Furthermore, the alignment actuator also includes an alignment substrate, and the alignment substrate is also provided with a mounting hole for mounting the alignment drive mechanism.

[0011] Furthermore, the sliding lever part and the sliding alignment part are symmetrically mounted on the alignment substrate, and a sliding lever part is mounted on one side of each sliding alignment part to form an alignment group, and the rotation alignment part is mounted above the alignment group.

[0012] Furthermore, the sliding lever portion includes a lever and lever sliding pins fixedly connected on both sides thereof, the lever sliding pin is used to be inserted into the No. 2 horizontal guide hole of the alignment substrate, and can slide horizontally along the No. 2 horizontal guide hole 323, wherein the top of one of the lever sliding pins is used to connect to the rotation alignment portion, and when the lever sliding pin moves, it can drive the rotation alignment portion to rotate.

[0013] Furthermore, the sliding alignment portion is a symmetrical structure, including two horizontal sliders, which are arranged opposite to each other and connected by two symmetrically positioned tension springs. Each horizontal slider is also provided with a horizontal sliding pin, and the alignment substrate is provided with a No. 1 horizontal guide hole for passing the horizontal sliding pin, so that the bottom of the horizontal sliding pin can slide in a horizontal direction on the alignment substrate, and the tops of the two horizontal sliders are respectively fixedly connected to a No. 1 alignment claw and a No. 2 alignment claw of a fixture unit.

[0014] Furthermore, the rotation alignment portion comprises a left-handed rotation lever and a right-handed rotation lever which are independently arranged from each other, and the left-handed rotation lever and the right-handed rotation lever are respectively installed above an alignment group through a bearing.

[0015] Furthermore, the left-handed rotating lever is a T-shaped structure, with a slot on each of the three sides, namely the first slot, the second slot and the third slot, and the second slot is in the opposite direction to the first slot, and the first slot and the third slot are arranged in the same direction, the first slot and the second slot are respectively connected to the two horizontal sliding pins on the first alignment group, and the third slot is connected to a lever sliding pin on the first alignment group; the right-handed rotating lever is a T-shaped structure, with a slot on each of the three sides, namely the fourth slot, the fifth slot and the sixth slot, and the fifth slot is in the opposite direction to the fourth slot, and the fourth slot and the sixth slot are arranged in the same direction; the fourth slot, the fifth slot are connected to the two horizontal sliding pins on the second alignment group, and the sixth slot is connected to a lever sliding pin on the second alignment group, and the slots of the first slot, the second slot, the fourth slot and the fifth slot are all changed into center distance slots.

[0016] Furthermore, the alignment drive mechanism includes a driver fixing base, a driving cam rod and a reset spring. The driver fixing base is fixedly connected to the mounting hole of the alignment substrate, and the driving cam rod is installed inside. The driving cam rod is driven by an external material picking suction head mechanism. A reset spring is installed at the bottom of the driving cam rod. The cam surface of the driving cam rod is in contact with the lever. The head of the driving cam rod is provided with a cam surface. The diameter of the cam surface is small in the middle and large at both ends. The slope of the cam surface can be adjusted according to the characteristics of different semiconductor devices.

[0017] Compared with the prior art, the semiconductor device active alignment device of the present invention has the following advantages:

[0018] (1) The semiconductor device active alignment device described in the present invention has a simple and effective structure, controllable cost, stable operation, easy implementation, easy promotion, and is suitable for large-scale production operations.

[0019] (2) The semiconductor device active alignment device described in the present invention can greatly improve the transplanting accuracy, greatly improve the machine stability, test accuracy, and machine efficiency, effectively reduce the risk of downtime, and thus reduce production costs.

[0020] (3) The active alignment device for semiconductor devices described in the present invention is better compatible with the tolerance of the product itself.

[0021] Another object of the present invention is to provide an alignment method for an active alignment device of a semiconductor device to solve the problems of low working efficiency and high testing cost in the prior art.

[0022] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0023] A method for aligning an active alignment device of a semiconductor device comprises the following stages:

[0024] In the first stage, when the material is to be discharged, in the absence of external force, the driving cam rod is in a high position under the action of the return spring, so that the No. 1 alignment claw and the No. 2 alignment claw are in an open state, and there is a large gap with the semiconductor device, which is convenient for placing the semiconductor device into the positioning hole;

[0025] In the second stage, during the active alignment phase, the material picking suction head mechanism will contact the top of the driving cam rod during the downward pressing process until it drives the No. 1 alignment claw and the No. 2 alignment claw to close, ensuring that the semiconductor device is pushed to the center of the positioning hole to achieve precise alignment;

[0026] In the third stage, the active release stage, the material picking suction head mechanism will continue to press down, driving the driving cam rod to continue to press down synchronously, until the No. 1 alignment claw and the No. 2 alignment claw make a symmetrical opening and closing action, and the material picking suction head mechanism will raise the semiconductor device to the set height without obstacles, ensuring that the semiconductor device is out of the restricted area of ​​the No. 1 alignment claw and the No. 2 alignment claw; the semiconductor device of the material picking suction head mechanism continues to be raised until the material picking suction head mechanism is completely separated from the driving cam rod, and the No. 1 alignment claw and the No. 2 alignment claw are opened to the maximum, waiting for the next material discharge action, so that the entire material discharge and material picking process can reciprocate.

[0027] The alignment method of the semiconductor device active alignment device has the same advantages as those of the above-mentioned semiconductor device active alignment device over the prior art, and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0029] Figure 1 A schematic diagram of an active alignment device for a semiconductor device according to an embodiment of the present invention;

[0030] Figure 2 A top view of the alignment fixture according to an embodiment of the present invention;

[0031] Figure 3 for Figure 2 AA section view;

[0032] Figure 4 A schematic diagram of an alignment actuator according to an embodiment of the present invention;

[0033] Figure 5 is a schematic diagram of an alignment substrate according to an embodiment of the present invention;

[0034] Figure 6 A schematic diagram of a left-hand rotating lever according to an embodiment of the present invention;

[0035] Figure 7 A schematic diagram of a right-hand rotating lever according to an embodiment of the present invention;

[0036] Figure 8 The working state of the left-hand rotating lever according to the embodiment of the present invention is shown in FIG. Figure 1 ;

[0037] Fig. 9 The working state of the left-hand rotating lever according to the embodiment of the present invention is shown in FIG. Figure 2 ;

[0038] Fig.10 is a cross-sectional view of an alignment drive mechanism according to an embodiment of the present invention;

[0039] Fig.11 This is a working state diagram of the alignment drive mechanism in the loading stage according to an embodiment of the present invention;

[0040] Fig.12 for Fig.11 Enlarged view of part A in the middle;

[0041] Fig.13 This is a working state diagram of the alignment drive mechanism in the active alignment stage according to an embodiment of the present invention;

[0042] Fig.14 for Fig.13 Enlarged view of middle part B;

[0043] Fig.15 A working state diagram of the alignment drive mechanism in the active release phase according to an embodiment of the present invention;

[0044] Fig.16 for Fig.15 Enlarged view of part C in the middle.

[0045] Description of reference numerals:

[0046] 1-semiconductor device; 2-alignment fixture; 21-No. 1 alignment claw; 22-No. 2 alignment claw; 23-and tray; 3-alignment actuator; 31-sliding lever; 311-lever; 312-lever sliding pin; 32-alignment substrate; 321-No. 1 horizontal guide hole; 322-mounting hole; 323-No. 2 horizontal guide hole; 33-sliding alignment part; 331-horizontal slider; 332-spring fixing pin; 333- Tension spring; 334-horizontal sliding pin; 34-rotation alignment part; 341-left-hand rotation lever; 3411-first slot; 3412-second slot; 3413-third slot; 342-right-hand rotation lever; 3421-fourth slot; 3422-fifth slot; 3423-sixth slot 3423; 4-alignment drive mechanism; 401-drive fixing base; 402-drive cam rod; 403-reset spring. DETAILED DESCRIPTION

[0047] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0048] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0049] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0050] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0051] An active alignment device for a semiconductor device, such as Figures 1 to 16 As shown, it includes an alignment fixture 2, an alignment actuator 3 and an alignment drive mechanism 4. The alignment actuator 3 includes a sliding lever portion 31, a sliding alignment portion 33 and a rotational alignment portion 34. The sliding lever portion 31 is used to convert the vertical movement in the alignment drive mechanism 4 into a horizontal movement, thereby driving the rotational alignment portion 34 to rotate, and then driving the sliding alignment portion 33 to perform horizontal alignment movement. The alignment fixture 2 is used to place the semiconductor device 1, and the sliding alignment portion 33 drives the semiconductor device 1 to align.

[0052] The semiconductor device 1 is a semiconductor chip to be aligned, and the device includes but is not limited to semiconductor chips in the form of GBA, QFN, etc. The example shows a method for aligning two semiconductor devices 1 at the same time, but this solution can be extended from two semiconductor devices 1 to multiple semiconductor devices 1 for active alignment at the same time.

[0053] The alignment jig 2 is a jig customized according to the appearance characteristics of the semiconductor device 1 to be aligned. When semiconductor devices 1 of different specifications and appearance characteristics need to be aligned, in the entire mechanism, only the alignment jig 2 needs to be replaced accordingly to complete the rapid replacement, which ensures the needs of rapid machine modification for large-scale production and greatly saves the time for product switching.

[0054] The alignment jig 2 includes two independently arranged jig units.

[0055] The fixture unit includes a tray 23 and a No. 1 alignment claw 21 and a No. 2 alignment claw 22 arranged above the tray 23. The tray 23 is used to place the semiconductor device 1 and is fixedly connected to the alignment substrate 32 at the bottom. The No. 1 alignment claw 21 and the No. 2 alignment claw 22 are both installed on the horizontal slider 331 of the sliding alignment unit 33, and a positioning hole for placing the semiconductor device 1 is formed between the No. 1 alignment claw 21 and the No. 2 alignment claw 22. The No. 1 alignment claw 21 and the No. 2 alignment claw 22 can be quickly replaced according to the appearance characteristics of the semiconductor device 1 to be aligned, and the tray 23 can be quickly replaced according to the depth characteristics of the semiconductor device 1. These structures are designed and developed to better meet the mass production of semiconductor devices 1 of various specifications.

[0056] During normal operation, when the semiconductor device 1 to be aligned is placed into the tray 23, the first alignment claw 21 and the second alignment claw 22 will perform an alignment action, thereby pushing the semiconductor device 1 to the center position of the positioning hole, and then allowing the material suction head mechanism to take away the semiconductor device 1.

[0057] The alignment actuator 3 comprises an alignment substrate 32 and a sliding lever portion 31 and a sliding alignment portion 33 mounted thereon. A rotation alignment portion 34 is further mounted above the sliding lever portion 31 and the sliding alignment portion 33 .

[0058] The sliding lever portion 31 is used to convert the vertical movement in the alignment drive mechanism 4 into horizontal movement, thereby driving the rotating alignment portion 34 to rotate, and then driving the sliding alignment portion 33 to perform horizontal alignment movement, and finally completing the entire opening and closing alignment action.

[0059] The alignment substrate 32 is a symmetrical structure, with a mounting hole 322 on the top for mounting the alignment drive mechanism 4 , and a first horizontal guide hole 321 and a second horizontal guide hole 323 .

[0060] The sliding lever part 31 includes a lever 311 and lever sliding pins 312 fixedly connected to the two sides thereof. The lever sliding pins 312 are used to be inserted into the second horizontal guide hole 323 of the alignment substrate 2 and can slide horizontally along the second horizontal guide hole 323. The top of one of the lever sliding pins 312 is used to connect the rotation alignment part 34, and when the lever sliding pin 312 moves, it can drive the rotation alignment part 34 to rotate.

[0061] Preferably, the alignment actuator 3 is a symmetrical structure. Two sliding alignment parts 33 are symmetrically mounted on the alignment substrate 32, and a sliding lever part 31 is mounted on one side of each sliding alignment part 33 to form an alignment group.

[0062] The sliding alignment part 33 is a symmetrical structure, including a tension spring 333, a horizontal sliding pin 334 and two horizontal sliders 331. The two horizontal sliders 331 are arranged opposite to each other and connected by two symmetrically positioned tension springs 333. Each horizontal slider 331 is also provided with a horizontal sliding pin 334. The alignment substrate 32 is provided with a No. 1 horizontal guide hole 321 for passing the horizontal sliding pin 334, so that the bottom of the horizontal sliding pin 334 can slide in the horizontal direction on the alignment substrate 32. The tops of the two horizontal sliders 331 are fixedly connected to the No. 1 alignment claw 21 and the No. 2 alignment claw 22 of a fixture unit.

[0063] Preferably, the tension spring 333 is connected to the horizontal slider 331 via a spring fixing pin 332. Two sets of tension springs 333 are installed at the bottom 332 of the spring fixing pin, thereby ensuring that the two horizontal sliders 331 have opposite traction forces in the horizontal direction.

[0064] The rotation alignment part 34 includes a left-handed rotation lever 341 and a right-handed rotation lever 342 . The left-handed rotation lever 341 and the right-handed rotation lever 342 are respectively installed above an alignment group through a bearing.

[0065] When the sliding lever part 31 transmits the horizontal motion to the rotation alignment part 34, the left rotation lever 341 and the right rotation lever 342 respectively perform rotation motion. The left rotation lever 341 and the right rotation lever 342 are provided with variable center distance grooves, which will drive the sliding alignment part 33 to perform horizontal alignment motion.

[0066] Preferably, the left-handed rotating lever 341 is a T-shaped structure, and a notch is provided on each of the three sides, namely, the first notch 3411, the second notch 3412 and the third notch 3413, and the second notch 3412 is in the opposite direction to the first notch 3411, and the first notch 3411 and the third notch 3413 are arranged in the same direction. The first notch 3411 and the second notch 3412 are respectively connected to the two horizontal sliding pins 334 on the first alignment group, and the third notch 3413 is connected to a lever sliding pin 312 on the first alignment group;

[0067] The right-handed rotating lever 342 is a T-shaped structure, and a notch is provided on each of the three sides, namely the fourth notch 3421, the fifth notch 3422 and the sixth notch 3423, and the fifth notch 3422 is in the opposite direction to the fourth notch 3421, and the fourth notch 3421 and the sixth notch 3423 are arranged in the same direction; the fourth notch 3421 and the fifth notch 3422 are connected to two horizontal sliding pins on the second alignment group, and the sixth notch 3423 is connected to a lever sliding pin on the second alignment group. The first notch 3411, the second notch 3412, the fourth notch 3421 and the fifth notch 3422 are all arc-shaped, that is, variable center distance notches.

[0068] Because the top of the horizontal sliding pin 334 is in contact with the variable center distance grooves of the left-handed rotating lever 341 and the right-handed rotating lever 342, when the left-handed rotating lever 341 and the right-handed rotating lever 342 rotate at the same time, the two opposite horizontal sliding blocks 331 will be driven to perform horizontal opening and closing actions. Because the left-handed rotating lever 341 and the right-handed rotating lever 342 are mirror images of each other, the working principle of the left-handed rotating lever 341 is now explained as an example. For specific structural descriptions, please refer to Figures 6 to 9 When the left-handed rotating lever 341 rotates counterclockwise around the central axis, it will drive the first slot 3411 and the second slot 3412 on both sides to rotate counterclockwise. Because the variable center distance slot design is adopted, the distance from the slot to the center changes from N to M, and the difference between them is the opening and closing distance Δ designed by us, so the two horizontal sliders 331 corresponding to the first slot 3411 and the second slot 3412 will slide with the horizontal sliding pin 334 to make a closing action with a distance of Δ. This solution uses this feature to complete the key action of active alignment. We can customize the variable center distance slot according to the outer tolerance size of the semiconductor device 1, that is, customize the size of Δ.

[0069] The alignment drive mechanism 4 includes a drive fixed base 401, a drive cam rod 402 and a return spring 403. The drive fixed base 401 is fixedly connected to the mounting hole 322 of the alignment substrate 32, and the drive cam rod 402 is installed inside. The drive cam rod 402 is driven by an external material picking suction head mechanism. The return spring 403 is installed at the bottom of the drive cam rod 402, and the cam surface of the drive cam rod 402 is in contact with the shift rod 311.

[0070] The main function of the driver fixing base 401 is to fix the entire alignment drive mechanism 4 on the alignment substrate 21, and then drive the driving cam rod 402 to move downward through the external material picking suction head mechanism (not shown), and the cam surface on the driving cam rod 402 contacts the lever 311, and the lever 311 is connected to the horizontal slider 331 through the left-hand rotating lever 341 and the right-hand rotating lever 342. Because there are two tensioning springs 333 at the bottom of the horizontal slider 331 on the upper and lower sides, the head of the lever 311 will eventually be in contact with the cam surface of the driving cam rod 402. The bottom of the driving cam rod 402 is supported by a reset spring 403. In the absence of external force, the driving cam rod 402 will be pushed up to a high position, thereby ensuring that the alignment mechanism can restore itself after completing one alignment action and prepare for the next alignment action.

[0071] The head of the driving cam rod 402 is designed with a cam surface, the diameter of the cam surface is small in the middle and large at both ends, and its slope can be adjusted according to the characteristics of different semiconductor devices. By designing different cam surface diameters, the opening and closing speed and opening and closing range of the alignment mechanism can be controlled. The cam surface is designed to have a structure with a small middle part and large at both ends, so that the alignment mechanism can achieve three actions of opening and closing in one pressing process. In this way, accurate alignment is achieved without any influence on the subsequent grasping action.

[0072] An alignment method of an active alignment device for a semiconductor device is divided into three stages: the first stage is a material loading stage, the second stage is an active alignment stage, and the third stage is an active release stage:

[0073] In the first stage, when there is no external force, the driving cam rod 402 is in a high position (idle position) under the action of the return spring 403. Fig.11As shown. Because the lever sliding pin 312 on the side close to the driving cam rod 402 contacts the cam surface of the driving cam rod 402, the lever 311 is pushed to the upper and lower sides, and the other set of lever sliding pins 312 away from the driving cam rod 402 contacts the left-hand rotating lever 341 and the right-hand rotating lever 342, so that the lever drives the left-hand rotating lever 341 and the right-hand rotating lever 342 to rotate clockwise and counterclockwise respectively. Because the left-hand rotating lever 341 and the right-hand rotating lever 342 are designed with variable center distance grooves, as the left-hand rotating lever 341 and the right-hand rotating lever 342 rotate, the center distance increases, thereby driving the horizontal sliding pin 334 to move horizontally, thereby driving the No. 1 alignment claw 21 and the No. 2 alignment claw 22 to open. As shown Fig.11 shown.

[0074] At this point, the material-waiting action is completed and the material is waiting for the loading mechanism to load the material. Because the No. 1 alignment claw 21 and the No. 2 alignment claw 22 are in the open state at this time, there is a large gap between the semiconductor device 1 and the No. 1 alignment claw 21 and the No. 2 alignment claw 22, and the opening size is much larger than the tolerance size of the semiconductor device 1, which is convenient for the loading suction head (not shown) to put the semiconductor device 1 into the positioning hole, which can greatly reduce the positioning accuracy requirements for the loading mechanism, and at the same time, the stability of loading on the machine is greatly improved. After the loading mechanism completes the loading action, the semiconductor device 1 is placed in the positioning hole and transported to the test position, the second stage of work begins, that is, the active alignment stage.

[0075] The second stage is the active alignment stage, such as Fig.13As shown, the material picking suction head mechanism (not shown) will contact the top of the driving cam rod 402 during the pressing material picking process, thereby driving the driving cam rod 402 to perform a pressing action synchronously. As the pressing material picking action proceeds, the driving cam rod 402 is pressed down to the middle section, and the cam surface diameter of the driving cam rod 402 gradually changes from large to small. At the same time, under the action of multiple tension springs 333, the two levers 311 will be pushed to the middle side, and the left-handed rotating lever 341 and the right-handed rotating lever 342 will rotate counterclockwise and clockwise respectively. As the rotating lever rotates, the center distance becomes smaller, and the horizontal sliding pin 334 is driven to move horizontally, thereby driving the first alignment claw 21 and the second alignment claw 22 to perform a closing action. Because the fixture body adopts a completely symmetrical design, and the two rotating levers are also designed symmetrically, the movement of the fixture body is completely symmetrical, thereby ensuring that the center of the semiconductor device 1 placed in the material discharge cavity can be accurately aligned to the center of the cavity. As the closing action is completed, the semiconductor device 1 is pushed to the center of the entire positioning hole, thereby completing the active alignment work. At this time, the material picking suction head mechanism starts the material picking action, ensuring the accuracy and effectiveness of the material picking position. The suction head will use vacuum suction or grasping and other actions to complete the fixation of the semiconductor device 1, but at this time the material picking suction head will not have an extraction action, but wait for the next active release stage.

[0076] The third stage is the active release stage, please refer to Fig.15. In this stage, the material picking suction head mechanism will continue to press down, thereby driving the driving cam rod 402 to continue to press down synchronously. As the pressing material picking action proceeds, the driving cam rod 402 is pressed down from the middle section to the rear section, and the cam surface diameter of the driving cam rod 402 gradually changes from small to large. At the same time, under the action of multiple tension springs 333, the two levers 311 will be pushed to both sides again, and the left-handed rotating lever 341 and the right-handed rotating lever 342 will rotate clockwise and counterclockwise respectively. As the rotating lever rotates, the center distance increases, and the horizontal sliding pin 334 is driven to move horizontally, thereby driving the No. 1 alignment claw 21 and the No. 2 alignment claw 22 to open (note here that the gap between the No. 1 alignment claw 21 and the No. 2 alignment claw 22 is much smaller than the gap opened in the waiting stage. The opening action is designed here so that the semiconductor device 1 will not be disturbed by any external friction during the lifting process of the material picking suction head, ensuring the accurate lifting of the semiconductor device 1 without any impact on the material picking accuracy). At this stage, the pick-up suction head mechanism (not shown) will raise the semiconductor device 1 to a certain height to ensure that the semiconductor device 1 is out of the restricted area of ​​the No. 1 alignment claw 21 and the No. 2 alignment claw 22. After the driving cam rod 402 is compressed to the last section, the pick-up suction head (not shown) begins to perform a micro-lifting action. Note that at this time, because the No. 1 alignment claw 21 and the No. 2 alignment claw 22 are in the open state, the pick-up suction head only needs to be lifted a small distance to make the semiconductor device 1 out of the control area of ​​the No. 1 alignment claw 21 and the No. 2 alignment claw 22, thereby completing the final pick-up action. After that, the entire pick-up suction head mechanism performs a lifting action. Because the semiconductor device 1 has completely left the control area of ​​the No. 1 alignment claw 21 and the No. 2 alignment claw 22 at this time, the subsequent opening and closing actions of the No. 1 alignment claw 21 and the No. 2 alignment claw 22 will not affect the accurate alignment of the semiconductor device 1. With the completion of the lifting action of the pick-up suction head mechanism, it is also separated from the driving cam rod 402. The driving cam rod 402 will be restored to the high position under the action of the return spring 403, and the No. 1 alignment claw 21 and the No. 2 alignment claw 22 will be opened to the maximum, waiting for the next material discharge action.

[0077] At this point the entire action process completes the cycle.

[0078] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor device active alignment device, characterized in that: It includes an alignment fixture, an alignment actuator and an alignment drive mechanism. The alignment actuator comprises a sliding lever part, a sliding alignment part and a rotating alignment part. The sliding lever part is used to convert the vertical movement in the alignment driving mechanism into the horizontal movement, thereby driving the rotating alignment part to rotate, and then driving the sliding alignment part to perform the horizontal alignment movement. The alignment fixture is used to place the semiconductor device, and the alignment of the semiconductor device is completed by driving the sliding alignment part.

2. The active alignment device for semiconductor devices according to claim 1, characterized in that: The alignment fixture includes two independently arranged fixture units, which include a tray and a No. 1 alignment claw and a No. 2 alignment claw arranged above it. The tray is used to place semiconductor devices and is fixedly connected to the alignment substrate at the bottom. The No. 1 alignment claw and the No. 2 alignment claw are both installed on the horizontal slider of the sliding alignment unit, and a positioning hole for placing the semiconductor device is formed between the No. 1 alignment claw and the No. 2 alignment claw.

3. The active alignment device for semiconductor devices according to claim 1, characterized in that: The alignment actuator also includes an alignment substrate, and the alignment substrate is also provided with a mounting hole for mounting the alignment drive mechanism.

4. The active alignment device for semiconductor devices according to claim 3, characterized in that: The sliding lever part and the sliding alignment part are symmetrically mounted on the alignment substrate, and one side of each sliding alignment part is mounted with a sliding lever part to form an alignment group, and the rotation alignment part is mounted above the alignment group.

5. The active alignment device for semiconductor devices according to claim 2, characterized in that: The sliding lever portion includes a lever and lever sliding pins fixedly connected on both sides thereof. The lever sliding pin is used to be inserted into the No. 2 horizontal guide hole of the alignment substrate and can slide horizontally along the No. 2 horizontal guide hole 323. The top of one of the lever sliding pins is used to connect the rotation alignment portion, and when the lever sliding pin moves, it can drive the rotation alignment portion to rotate.

6. The active alignment device for a semiconductor device according to claim 5, characterized in that: The sliding alignment part is a symmetrical structure, including two horizontal sliders, which are arranged opposite to each other and connected by two symmetrically positioned tension springs. Each horizontal slider is also provided with a horizontal sliding pin, and the alignment substrate is provided with a No. 1 horizontal guide hole for passing the horizontal sliding pin, so that the bottom of the horizontal sliding pin can slide in the horizontal direction on the alignment substrate. The tops of the two horizontal sliders are respectively fixedly connected to a No. 1 alignment claw and a No. 2 alignment claw of a fixture unit.

7. The active alignment device for a semiconductor device according to claim 6, characterized in that: The rotation alignment part comprises a left-handed rotation lever and a right-handed rotation lever which are independently arranged. The left-handed rotation lever and the right-handed rotation lever are respectively installed above an alignment group through a bearing.

8. The active alignment device for semiconductor devices according to claim 7, characterized in that: The left-hand rotating lever is a T-shaped structure, with a slot on each of the three sides, namely the first slot, the second slot and the third slot, and the second slot is in the opposite direction to the first slot, and the first slot and the third slot are arranged in the same direction, the first slot and the second slot are respectively connected to the two horizontal sliding pins on the first alignment group, and the third slot is connected to a lever sliding pin on the first alignment group; the right-hand rotating lever is a T-shaped structure, with a slot on each of the three sides, namely the fourth slot, the fifth slot and the sixth slot, and the fifth slot is in the opposite direction to the fourth slot, and the fourth slot and the sixth slot are arranged in the same direction; the fourth slot, the fifth slot are connected to the two horizontal sliding pins on the second alignment group, and the sixth slot is connected to a lever sliding pin on the second alignment group, and the slots of the first slot, the second slot, the fourth slot and the fifth slot are all changed into center distance slots.

9. The active alignment device for semiconductor devices according to claim 5, characterized in that: The alignment drive mechanism includes a driver fixing base, a driving cam rod and a reset spring. The driver fixing base is fixedly connected to the mounting hole of the alignment substrate, and the driving cam rod is installed inside. The driving cam rod is driven by an external material picking suction head mechanism. A reset spring is installed at the bottom of the driving cam rod. The cam surface of the driving cam rod is in contact with the lever. The head of the driving cam rod is provided with a cam surface. The diameter of the cam surface is small in the middle and large at both ends. The slope of the cam surface can be adjusted according to the characteristics of different semiconductor devices.

10. An alignment method for an active alignment device for a semiconductor device according to any one of claims 1 to 9, characterized in that: It includes the following stages: In the first stage, when the material is to be discharged, in the absence of external force, the driving cam rod is in a high position under the action of the return spring, so that the No. 1 alignment claw and the No. 2 alignment claw are in an open state, and there is a large gap with the semiconductor device, which is convenient for placing the semiconductor device into the positioning hole; In the second stage, during the active alignment phase, the material picking suction head mechanism will contact the top of the driving cam rod during the downward pressing process until it drives the No. 1 alignment claw and the No. 2 alignment claw to close, ensuring that the semiconductor device is pushed to the center of the positioning hole to achieve precise alignment; In the third stage, the active release stage, the material picking suction head mechanism will continue to press down, driving the driving cam rod to continue to press down synchronously, until the No. 1 alignment claw and the No. 2 alignment claw make a symmetrical opening and closing action, and the material picking suction head mechanism will raise the semiconductor device to the set height without obstacles, ensuring that the semiconductor device is out of the restricted area of ​​the No. 1 alignment claw and the No. 2 alignment claw; the semiconductor device of the material picking suction head mechanism continues to be raised until the material picking suction head mechanism is completely separated from the driving cam rod, and the No. 1 alignment claw and the No. 2 alignment claw are opened to the maximum, waiting for the next material discharge action, so that the entire material discharge and material picking process can reciprocate.

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