Wafer platform and electron beam detection equipment

Abstract

The invention provides a wafer platform and electron beam detection equipment, the wafer platform comprises a seat body mechanism, a mounting piece, an electrostatic chuck, a reference mirror, a limiting piece and a first fixing assembly, the electrostatic chuck is used for bearing a wafer, and the mounting piece is connected to an isolation plate of the seat body mechanism and is used for positioning the wafer platform; one end of the limiting part is adjustably connected to the mounting part, the other end of the limiting part is connected to the reference mirror, so that the reference mirror is positioned on the mounting part, and the electrostatic chuck is adjustably connected to the isolation plate through the first fixing assembly. According to the structure, the limiting piece connected to the mounting piece and the reference mirror is adjustably connected to the mounting piece, and the electrostatic chuck is adjustably connected to the isolation plate through the first fixing assembly, so that the reference mirror and the electrostatic chuck can be independently subjected to position adjustment relative to the seat body mechanism; and the convenience of adjusting the position of the wafer platform is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor production technology, and in particular to a wafer platform and electron beam detection equipment. Background Art

[0002] Electron beam inspection equipment is a key device for detecting chip performance and defects in the semiconductor manufacturing process. In order to ensure accurate transmission and detection of wafers in the equipment, numerous reference structures need to be set up in the overall structure of the electron beam inspection equipment.

[0003] Among them, the wafer platform is an important component in the electron beam testing equipment, and its position adjustment is very important in the testing process. How to improve the convenience of wafer platform position adjustment has attracted more and more attention from technicians in this field. Summary of the invention

[0004] In view of the above problems, the present application provides a wafer platform and an electron beam detection device, and the position adjustment of the wafer platform is relatively convenient.

[0005] In a first aspect, some embodiments of the present application provide a wafer platform, which includes a base mechanism, a mounting member, a reference mirror, a limit member, an electrostatic suction cup and a first fixed component, wherein the base mechanism includes an isolation plate; the mounting member is connected to the isolation plate; the reference mirror is used to position the wafer platform; one end of the limit member is adjustably connected to the mounting member, and the other end is connected to the reference mirror to position the reference mirror on the mounting member; the electrostatic suction cup is used to carry the wafer; and the first fixed component adjustably connects the electrostatic suction cup to the isolation plate.

[0006] In the above structure, since the limit member connected to the mounting member and the reference mirror is adjustably connected to the mounting member, the first fixed component adjustably connects the electrostatic suction cup to the isolation plate, so that the reference mirror and the electrostatic suction cup can be individually adjusted in position relative to the base mechanism, which is beneficial to improving the convenience of position adjustment of the wafer platform.

[0007] According to the wafer platform provided in some embodiments of the present application, the first fixing component includes a first adjusting bolt and an elastic element. The first adjusting bolt passes through the electrostatic suction cup and the elastic element in sequence along the thickness direction of the electrostatic suction cup and is connected to the isolation plate. The elastic element is clamped between the electrostatic suction cup and the isolation plate.

[0008] According to the wafer platform provided in some embodiments of the present application, the first fixing assembly also includes a fixing seat, the fixing seat is fixed to the isolation plate, and the first adjusting bolt is connected to the fixing seat.

[0009] According to the wafer platform provided in some embodiments of the present application, the electrostatic chuck includes a stepped hole penetrating along the thickness direction of the electrostatic chuck, and the bolt head of the first adjusting bolt is located in the large diameter section of the stepped hole.

[0010] According to the wafer platform provided in some embodiments of the present application, the reference mirror is provided with a limiting groove, and at least a portion of the limiting member abuts against the inner wall of the limiting groove to press the reference mirror against the mounting member.

[0011] According to the wafer platform provided in some embodiments of the present application, the limiting member includes an elastic portion and a supporting portion protruding from the elastic portion, the elastic portion is adjustably connected to the mounting member, and the supporting portion supports the inner wall of the limiting groove.

[0012] According to the wafer platform provided in some embodiments of the present application, in the thickness direction of the reference mirror, the depth of the limiting groove is smaller than the height of the elastic portion protruding from the supporting portion.

[0013] According to the wafer platform provided in some embodiments of the present application, the inner wall surface of the limiting groove is configured as an arc-shaped surface, and at least a portion of the supporting portion is fitted in the limiting groove.

[0014] According to the wafer platform provided in some embodiments of the present application, a limiting hole is provided on the elastic part, a second adjusting bolt is passed through the limiting hole, the second adjusting bolt is connected to the mounting part, and the diameter of the limiting hole is configured to be larger than the diameter of the second adjusting bolt.

[0015] According to the wafer platform provided in some embodiments of the present application, a groove is provided on the mounting member, and at least a portion of the reference mirror is disposed in the groove and abuts against an inner wall of the groove.

[0016] According to the wafer platform provided in some embodiments of the present application, along the thickness direction of the mounting member, the depth of the groove is greater than or equal to the height of the reference mirror.

[0017] According to the wafer platform provided in some embodiments of the present application, the seat body mechanism further includes a support and a mounting plate, and along the thickness direction of the isolation plate, the isolation plate and the support are respectively connected to opposite sides of the mounting plate;

[0018] The wafer platform also includes a plurality of leveling components arranged at intervals, and the mounting plate is locked relative to the support through the plurality of leveling components.

[0019] According to the wafer platform provided in some embodiments of the present application, the leveling assembly includes a third adjusting bolt, a locking nut and a locking bolt. The third adjusting bolt has an axial hole extending through it along its own axis. The support is provided with an adjustment hole extending through it along the thickness direction of the isolation plate. The third adjusting bolt is screwed and connected to the adjustment hole. The locking bolt passes through the axial hole and is threadedly connected to the mounting plate. The locking nut is screwed and sleeved on the outer periphery of the third adjusting bolt.

[0020] According to the wafer platform provided in some embodiments of the present application, the leveling assembly further includes a gasket, which is clamped between the bolt head of the locking bolt and the bolt head of the third adjusting bolt.

[0021] In a second aspect, some embodiments of the present application provide an electron beam detection device, which includes a process chamber, a scanning electron microscope and a wafer platform as provided in any of the above technical solutions; the wafer platform is arranged in the process chamber, and the scanning electron microscope is used to detect the wafer.

[0022] The technical solution provided by the embodiments of the present application brings at least the following beneficial effects:

[0023] The present application provides a wafer platform, which includes a seat body mechanism, a mounting member, an electrostatic chuck, a reference mirror, a stopper and a first fixed component, wherein the electrostatic chuck is used to carry a wafer, the mounting member is connected to an isolation plate of the seat body mechanism for positioning the wafer platform, one end of the stopper is adjustably connected to the mounting member, and the other end is connected to the reference mirror to position the reference mirror on the mounting member, and the first fixed component adjustably connects the electrostatic chuck to the isolation plate. In the above structure, since the stopper connected to the mounting member and the reference mirror is adjustably connected to the mounting member, and the first fixed component adjustably connects the electrostatic chuck to the isolation plate, the reference mirror and the electrostatic chuck can be individually adjusted relative to the seat body mechanism, which is conducive to improving the convenience of position adjustment of the wafer platform.

[0024] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not considered to be limitations of the present application. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings.

[0026] Figure 1 A schematic diagram of the structure of a wafer platform provided in some embodiments of the present application;

[0027] Figure 2 A schematic diagram of the internal structure of a first fixing component of a wafer platform provided in some embodiments of the present application;

[0028] Figure 3 A schematic diagram of the structure of a stopper of a wafer platform provided in some embodiments of the present application;

[0029] Figure 4 A schematic diagram of the structure of a stopper of a wafer platform provided in some other embodiments of the present application;

[0030] Figure 5A schematic diagram of the structure of a leveling assembly for a wafer platform provided in some embodiments of the present application.

[0031] In the attached picture:

[0032] 1. seat body mechanism; 11. isolation plate; 12. support; 121. adjustment hole; 13. mounting plate;

[0033] 2. Mounting piece; 21. Groove;

[0034] 3. Reference mirror; 31. Limiting groove;

[0035] 4. Limiting member; 41. Elastic portion; 411. Limiting hole; 42. Abutting portion;

[0036] 5. electrostatic suction cup; 51. bushing; 511. screw hole; 52. suction cup body;

[0037] 6. First fixing assembly; 61. First adjusting bolt; 62. Elastic element; 63. Fixing seat; 64. Disc spring pressure plate;

[0038] 7. Second adjusting bolt;

[0039] 8. Leveling assembly; 81. Third adjusting bolt; 811. Shaft hole; 82. Locking nut; 83. Locking bolt; 84. Gasket. DETAILED DESCRIPTION

[0040] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0041] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the embodiments of the present application should have the common meanings understood by technicians in the field to which the embodiments of the present application belong.

[0042] In the description of the embodiments of the present application, the orientations or positional relationships indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0043] In addition, the technical terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0044] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0045] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0046] Electron beam inspection equipment is a key device for detecting chip performance and defects in the semiconductor manufacturing process. In order to ensure accurate transmission and detection of wafers in the equipment, numerous reference structures need to be set up in the overall structure of the electron beam inspection equipment.

[0047] Electron beam inspection equipment is a key device for testing chip performance and defects in the semiconductor manufacturing process. In order to ensure the accuracy of wafer transmission and detection in the equipment, a large number of reference structures need to be configured in the electron beam inspection equipment. Among them, the wafer platform is an important core component, and the reference structure set on it has a direct impact on the transmission and detection results.

[0048] When the wafer is transferred in the process chamber, the reference mirror of the wafer platform cooperates with the laser ruler outside the chamber to provide accurate positioning information for the wafer platform. The reference mirror in the wafer platform needs to be adjusted to make the positioning information accurate. In addition, the electrostatic chuck in the wafer platform is a component for carrying the wafer. It directly affects the positioning accuracy of the electron beam on the wafer surface and affects the imaging quality during the detection process. Therefore, various components in the wafer platform need to be complexly adjusted to ensure the smooth progress of the detection process. How to improve the convenience of wafer platform position adjustment is increasingly attracting the attention of technicians in this field.

[0049] In order to improve the convenience of position adjustment of a wafer platform, some embodiments of the present application provide a wafer platform, which includes a base mechanism, a mounting member, an electrostatic chuck, a reference mirror, a stopper and a first fixed component, wherein the electrostatic chuck is used to carry a wafer, the mounting member is connected to an isolation plate of the base mechanism for positioning the wafer platform, one end of the stopper is adjustably connected to the mounting member, and the other end is connected to the reference mirror to position the reference mirror on the mounting member, and the first fixed component adjustably connects the electrostatic chuck to the isolation plate. In the above structure, since the stopper connected to the mounting member and the reference mirror is adjustably connected to the mounting member, and the first fixed component adjustably connects the electrostatic chuck to the isolation plate, the reference mirror and the electrostatic chuck can be individually adjusted in position relative to the base mechanism, which is beneficial to improving the convenience of position adjustment of the wafer platform.

[0050] The wafer platform disclosed in the embodiment of the present application can be used for carrying wafers but is not limited to it, and can also be used for carrying other products that require precise transmission and detection. The position adjustment of the wafer platform is relatively convenient, which helps to improve the accuracy of the position adjustment.

[0051] Some embodiments of the present application provide a wafer platform, referring to Figure 1 The wafer platform includes a base mechanism 1, a mounting member 2, a reference mirror 3, a limit member 4, an electrostatic suction cup 5 and a first fixed component 6. The base mechanism 1 includes an isolation plate 11. The mounting member 2 is connected to the isolation plate 11. One end of the limit member 4 is adjustably connected to the mounting member 2, and the other end is connected to the reference mirror 3 to position the reference mirror 3 on the mounting member 2. The first fixed component 6 connects the electrostatic suction cup 5 to the isolation plate 11 in an adjustable manner.

[0052] The seat mechanism 1 may be a seat structure in the wafer platform, which may be used to install other components in the wafer platform. The seat mechanism 1 may bear the load of other components in the wafer platform and the wafer being transported.

[0053] The isolation plate 11 may be a device in the wafer platform for electrically isolating the electrostatic chuck 5 carrying the wafer. The isolation plate 11 may be made of a dielectric material such as epoxy resin, so that the isolation plate 11 not only has sufficient mechanical strength but also has good insulation performance, which is beneficial to reduce the possibility of the wafer being damaged due to electrical problems during the production process.

[0054] The mounting member 2 may be a component for mounting the reference mirror 3. By connecting the mounting member 2 to the isolation plate 11, not only the reference mirror 3 mounted on the mounting member 2 can be firmly mounted in the wafer platform, so that the reference mirror 3 is not easily displaced relative to other components in the wafer platform as the wafer platform moves, but also the mounting member 2 and the components connected thereto are electrically isolated by the isolation plate 11, which is conducive to reducing the possibility of damage to the mounting member 2 and the components connected thereto due to electrical problems.

[0055] The reference mirror 3 may be a device in the wafer platform for positioning the wafer platform, and is mounted and positioned on the mounting member 2. Exemplarily, two reference mirrors 3 are provided, and the two reference mirrors 3 are respectively arranged on two adjacent sides of the mounting member 2 and are arranged perpendicular to each other, and can cooperate with the detection device in the electronic detection equipment to realize the positioning of the wafer platform.

[0056] The stopper 4 may be a component used to position the reference mirror 3 on the mounting member 2 and to adjust the position of the reference mirror 3 relative to the mounting member 2. One end of the stopper 4 is adjustably connected to the mounting member 2, which may mean that the connection position of the end of the stopper 4 on the mounting member 2 can be changed, so that the relative position of the reference mirror 3 positioned by the stopper 4 on the mounting member 2 can be adjusted.

[0057] By adjustably connecting one end of the limiter 4 to the mounting member 2 and the other end to the reference mirror 3 , the position adjustment of the limiter 4 relative to the mounting member 2 can drive the reference mirror 3 to adjust its position relative to the mounting member 2 .

[0058] The electrostatic chuck 5 may be a chuck used to directly carry the wafer and contact the wafer in the wafer platform, and the electrostatic chuck 5 may be located on the side of the mounting member 2 away from the isolation plate 11, so that the wafer can be carried on the side of the electrostatic chuck 5 away from the isolation plate 11. The electrostatic chuck 5 uses electrostatic adsorption technology, and the adsorption force is uniform, and local force is not easy to occur during adsorption.

[0059] The first fixing component 6 may be a component for connecting the electrostatic chuck 5 to the isolation plate 11, and the electrostatic chuck 5 can be firmly connected to the isolation plate 11. The electrostatic chuck 5 is connected to the isolation plate 11 in an adjustable position by using the first fixing component 6, so that the distance between the wafer on the electrostatic chuck 5 and the external device can be adjusted, which is conducive to enabling the electron beam detection device to obtain a better detection effect.

[0060] In the above structure, since the limit member 4 connected to the mounting member 2 and the reference mirror 3 is adjustably connected to the mounting member 2, the first fixing component 6 adjustably connects the electrostatic suction cup 5 to the isolation plate 11, so that the reference mirror 3 and the electrostatic suction cup 5 can be individually adjusted in position relative to the base mechanism 1, which is beneficial to improving the convenience of position adjustment of the wafer platform.

[0061] In some embodiments, reference Figure 2 The first fixing assembly 6 includes a first adjusting bolt 61 and an elastic element 62. The first adjusting bolt 61 passes through the screw hole 511 of the electrostatic suction cup 5 and the elastic element 62 in sequence along the thickness direction of the electrostatic suction cup 5 and is connected to the isolation plate 11. The elastic element 62 is clamped between the electrostatic suction cup 5 and the isolation plate 11.

[0062] The first adjusting bolt 61 can be used to connect the electrostatic chuck 5 to the bolt on the isolation plate 11. By connecting the electrostatic chuck 5 to the isolation plate 11 using the first adjusting bolt 61, it is not only convenient to connect the electrostatic chuck 5 to the isolation plate 11, but also convenient to disassemble the electrostatic chuck 5 from the isolation plate 11, so that the relative position of the electrostatic chuck 5 and the isolation plate 11 can be adjusted.

[0063] The elastic element 62 may be a device for making the first fixing assembly 6 have an elastic restoring force, which enables the electrostatic chuck 5 to be kept pressed by the first adjusting bolt 61 under the action of the elastic restoring force when the first adjusting bolt 61 in the first fixing assembly 6 is loosened, thereby reducing the risk of the electrostatic chuck 5 shaking or dislocating relative to the isolation plate 11. Exemplarily, the elastic element 62 may be a coil spring, a disc spring, or an elastic washer, so that the elastic element 62 can provide an elastic restoring force along the axial direction of the first adjusting bolt 61, so that the electrostatic chuck 5 can be kept pressed by the first adjusting bolt 61 under the action of the elastic restoring force.

[0064] The first adjusting bolt 61 passes through the screw hole 511 and the elastic element 62 of the electrostatic suction cup 5 in sequence along the thickness direction of the electrostatic suction cup 5 and is connected to the isolation plate 11. It may mean that the electrostatic suction cup 5 is provided with a screw hole 511, and the screw hole 511 passes through the electrostatic suction cup 5 in the thickness direction of the electrostatic suction cup 5, and the threaded rod of the first adjusting bolt 61 passes through the screw hole 511 and the elastic element 62 in sequence along the thickness direction of the electrostatic suction cup 5 and is then screwed to the isolation plate 11, and the bolt head of the first adjusting bolt 61 is pressed against the electrostatic suction cup 5.

[0065] By clamping the elastic element 62 between the electrostatic suction cup 5 and the isolation plate 11, after the first adjusting bolt 61 is pre-tightened, the elastic element 62 is compressed and deformed and can use its elastic restoring force to provide a force for the electrostatic suction cup 5 and the isolation plate 11 to move away from each other, so that the bolt head of the first adjusting bolt 61 keeps pressing on the electrostatic suction cup 5; moreover, after the first adjusting bolt 61 is loosened, the elastic element 62 can still use its elastic restoring force to push the electrostatic suction cup 5 away from the isolation plate 11, which not only realizes the position adjustment of the electrostatic suction cup 5 relative to the isolation plate 11, but also enables the bolt head of the first adjusting bolt 61 to continue to keep pressing on the electrostatic suction cup 5, thereby reducing the risk of shaking or dislocation of the electrostatic suction cup 5 relative to the isolation plate 11.

[0066] Exemplarily, the elastic element 62 is a disc spring, and a disc spring pressure plate 64 is sandwiched between the disc spring and the electrostatic suction cup 5 or the disc spring and the isolation plate 11. The disc spring pressure plate 64 can make the elastic restoring force of the disc spring act more evenly on the electrostatic suction cup 5 and the isolation plate 11, which is beneficial to improve the pre-tightening effect of the first adjusting bolt 61 on the electrostatic suction cup 5.

[0067] Exemplarily, the electrostatic suction cup 5 includes a suction cup body 52 and a bushing 51 fixed to each other, and the first connecting hole is opened in the bushing 51, so that the first adjusting bolt 61 directly contacts the bushing 51 without contacting the suction cup body 52, thereby reducing the occurrence of dangers such as the first adjusting bolt 61 squeezing the suction cup body 52.

[0068] In some embodiments, the first fixing assembly 6 further includes a fixing seat 63 , the fixing seat 63 is fixed to the isolation plate 11 , and the first adjusting bolt 61 is connected to the fixing seat 63 .

[0069] The fixing seat 63 may be a component for connecting the first adjusting bolt 61 to the isolation plate 11. By fixing the fixing seat 63 to the isolation plate 11 and screwing the first adjusting bolt 61 to the fixing seat 63, the first adjusting bolt 61 can be firmly connected to the isolation plate 11.

[0070] Exemplarily, the fixing seat 63 may be fixed to the isolation plate 11 by gluing.

[0071] In some embodiments, the screw hole 511 is a stepped hole, the bolt head of the first adjusting bolt 61 is located in the large diameter section of the stepped hole, and the top surface of the bolt head is lower than the top surface of the electrostatic chuck 5 .

[0072] By setting the screw hole 511 as a stepped hole, the bolt head of the first adjusting bolt 61 is located in the large diameter section of the stepped hole, and the top surface of the bolt head is lower than the top surface of the electrostatic suction cup 5, so that the first adjusting bolt 61 is not easy to protrude from the surface of the electrostatic suction cup 5, which facilitates the mounting of the wafer on the surface of the electrostatic suction cup 5 and helps to reduce the possibility of damage to the wafer.

[0073] In some embodiments, reference Figure 3 The reference mirror 3 is provided with a limiting groove 31 , and at least a portion of the limiting member 4 abuts against the inner wall of the limiting groove 31 to press the reference mirror 3 against the mounting member 2 .

[0074] The limiting groove 31 may be a groove 21 formed by inward depression of the outer surface of the reference mirror 3. By making at least a part of the limiting member 4 abut against the inner wall of the limiting groove 31, the limiting member 4 can not only position the reference mirror 3 through the part of the limiting member 4 extending into the limiting groove 31, but also exert a pressing force on the reference mirror 3 so that the reference mirror 3 is pressed tightly against the mounting member 2.

[0075] In some embodiments, the limiting member 4 includes an elastic portion 41 and a supporting portion 42 protruding from the elastic portion 41 . The elastic portion 41 is adjustably connected to the mounting member 2 , and the supporting portion 42 is supported against the inner wall of the limiting groove 31 .

[0076] The elastic portion 41 may be a portion that can be elastically deformed, and the abutting portion 42 may be a portion protruding from the elastic portion 41 and used to abut against the inner wall of the limiting groove 31. By connecting the elastic portion 41 to the mounting member 2 and elastically deforming the elastic portion 41 to provide a force for the abutting portion 42, the abutting portion 42 keeps abutting against the inner wall of the limiting groove 31.

[0077] By connecting the elastic portion 41 to the mounting member 2 in an adjustable manner, the abutting portion 42 abuts against the inner wall of the limiting groove 31 , so that the connection position of the limiting member 4 on the mounting member 2 can be adjusted.

[0078] In some embodiments, reference Figure 4 In the thickness direction of the reference mirror 3 , the depth of the limiting groove 31 is smaller than the height of the supporting portion 42 protruding from the elastic portion 41 .

[0079] By making the depth of the limiting groove 31 in the thickness direction of the reference mirror 3 smaller than the height of the supporting portion 42 protruding from the elastic portion 41 in the thickness direction of the reference mirror 3, the supporting portion 42 can support at least part of the elastic member away from the surface of the reference mirror 3 when it is abutted against the inner wall of the limiting groove 31, so that the elastic portion 41 undergoes elastic deformation, and the supporting portion 42 can maintain abutment against the inner wall of the limiting groove 31.

[0080] In some embodiments, the inner wall surface of the limiting groove 31 is configured as an arc-shaped surface, and at least a portion of the supporting portion 42 is fitted in the limiting groove 31 .

[0081] By configuring the inner wall surface of the limiting groove 31 as an arc-shaped surface and making at least a portion of the abutting portion 42 cooperate with the limiting groove 31, not only can the abutting portion 42 be relatively tight with the inner wall surface of the limiting groove 31, but also the possibility of a gap between the abutting portion 42 and the inner wall surface of the limiting groove 31 can be reduced, which is beneficial to reducing the risk of shaking or dislocation of the reference mirror 3 relative to the mounting member 2.

[0082] Exemplarily, the limiting groove 31 may be configured as a hemispherical groove 21 , the inner wall surface of which is configured as a spherical surface, and the abutting portion 42 is configured as a hemispherical shape, and the abutting portion 42 cooperates and extends into the limiting groove 31 .

[0083] In some embodiments, a limiting hole 411 is provided on the elastic portion 41 , a second adjusting bolt 7 is passed through the limiting hole 411 , the second adjusting bolt 7 is connected to the mounting member 2 , and a diameter of the limiting hole 411 is configured to be larger than a diameter of the second adjusting bolt 7 .

[0084] The limiting hole 411 may be a hole-shaped structure for the limiting member 4 to be connected to the mounting member 2. By inserting the threaded rod of the second adjusting bolt 7 through the limiting hole 411, the bolt head of the second adjusting bolt 7 is pressed against the elastic portion 41, and the threaded rod of the second adjusting bolt 7 is threadedly connected to the mounting member 2, so that the second adjusting bolt 7 is detachably connected to the mounting member 2.

[0085] By configuring the diameter of the limiting hole 411 to be larger than the diameter of the second adjusting bolt 7, the position of the threaded rod of the second adjusting bolt 7 can be adjusted in the limiting hole 411, so that the elastic part 41 can be adjusted in the plane direction perpendicular to the axial direction of the limiting hole 411, thereby enabling the reference mirror 3 to be adjusted in the plane direction perpendicular to the axial direction of the limiting hole 411.

[0086] Exemplarily, the axial direction of the limiting hole 411 is configured to be arranged in the same direction as the thickness direction of the electrostatic chuck 5 , so that the reference mirror 3 can be positionally adjusted along a planar direction perpendicular to the thickness direction of the electrostatic chuck 5 .

[0087] In some embodiments, a groove 21 is provided on the mounting member 2 , at least a portion of the reference mirror 3 is disposed in the groove 21 and abuts against an inner wall of the groove 21 , and the groove 21 is communicated with a side surface of the mounting member 2 .

[0088] The groove 21 may be a groove-shaped structure formed by depression on the surface of the mounting member 2 near the electrostatic chuck 5, which is used to accommodate the reference mirror 3. By arranging at least part of the reference mirror 3 in the groove 21, the height of the reference mirror 3 protruding from the mounting member 2 can be reduced, which is conducive to reducing the possibility of interference or collision between the reference mirror 3 and the device outside the wafer platform.

[0089] By connecting the groove 21 with the side of the mounting member 2, the reference mirror 3 in the groove 21 can be exposed to the external environment, so that the detection device in the electronic detection equipment can cooperate with the reference mirror 3 from the outside of the side of the mounting member 2 to realize the positioning of the wafer platform.

[0090] Exemplarily, there are two grooves 21, which are arranged perpendicular to each other and are respectively connected to two adjacent side surfaces of the mounting member 2, so that the reference mirror 3 in the groove 21 can be exposed to the external environment from the two adjacent side surfaces of the mounting member 2, so that the detection device in the electronic detection equipment can cooperate with the reference mirror 3 from the outside of the two adjacent side surfaces of the mounting member 2 to realize the positioning of the wafer platform.

[0091] In some embodiments, along the thickness direction of the reference mirror 3 , the depth of the groove 21 is greater than or equal to the height of the reference mirror 3 .

[0092] By making the depth of the groove 21 in the thickness direction of the reference mirror 3 greater than or equal to the height of the reference mirror 3 in the thickness direction of the reference mirror 3, the reference mirror 3 can be located as a whole in the groove 21 without extending out of the groove 21, which is beneficial to reducing the possibility of interference or collision between the reference mirror 3 and devices outside the wafer platform.

[0093] In some embodiments, the base mechanism 1 also includes a support 12 and a mounting plate 13. Along the thickness direction of the isolation plate 11, the isolation plate 11 and the support 12 are respectively connected to opposite sides of the mounting plate 13; the wafer platform also includes a plurality of leveling components 8 arranged at intervals, and the mounting plate 13 is relatively locked to the support 12 through the plurality of leveling components 8.

[0094] The support 12 may be a seat structure in the seat mechanism 1 , which is used to carry other components in the wafer platform and to transfer the load of other components in the wafer platform to the device supporting the wafer platform.

[0095] The mounting plate 13 may be a component connected to the support 12, and is used to carry the isolation plate 11. By connecting the isolation plate 11 and the support 12 to two opposite sides of the mounting plate 13 along the thickness direction of the isolation plate 11, respectively, the isolation plate 11 can be adjusted by adjusting the mounting plate 13, thereby achieving the leveling of the reference mirror 3 connected to the mounting member 2.

[0096] The leveling component 8 may be a component in the wafer platform for leveling the mounting plate 13. By providing a plurality of leveling components 8 arranged at intervals, and locking the mounting plate 13 relative to the support 12 through the plurality of leveling components 8, the plurality of leveling components 8 can be adjusted to different degrees to adjust the level of the mounting plate 13 relative to the support 12.

[0097] Exemplarily, three leveling assemblies 8 are provided, and the three leveling assemblies 8 are arranged at equal intervals around the central axis of the mounting plate 13, so that the three leveling assemblies 8 can adjust the horizontal condition of the mounting plate 13 relative to the support 12 by making adjustments to different degrees, which is beneficial to improving the convenience of adjusting the mounting plate 13.

[0098] In some embodiments, reference Figure 5 The leveling assembly 8 includes a third adjusting bolt 81, a locking nut 82 and a locking bolt 83. The third adjusting bolt 81 has an axial hole 811 extending through it along its own axis. The support 12 is provided with an adjusting hole 121 extending through the thickness direction of the isolation plate 11. The third adjusting bolt 81 is screwed and connected to the adjusting hole 121. The locking bolt 83 passes through the axial hole 811 and is threadedly connected to the mounting plate 13. The locking nut 82 is screwed and sleeved on the outer periphery of the third adjusting bolt 81.

[0099] The third adjusting bolt 81 may be a bolt for adjusting the mounting plate 13, and the mounting plate 13 may be adjusted by lifting the mounting plate 13. The shaft hole 811 may be a hole-shaped structure in the third adjusting bolt 81, which penetrates the third adjusting bolt 81 along the axial direction.

[0100] The adjustment hole 121 may be a hole-shaped structure provided on the isolation plate 11 , which penetrates the isolation plate 11 along the thickness direction of the isolation plate 11 .

[0101] The third adjusting bolt 81 is screwed into the adjusting hole 121 , so that the third adjusting bolt 81 can be connected to the support 12 and the third adjusting bolt 81 can be screwed into the adjusting hole 121 to move axially along the adjusting hole 121 to lift the mounting plate 13 , thereby adjusting the mounting plate 13 .

[0102] By passing the threaded rod of the locking bolt 83 through the axial hole 811 and being threadedly connected to the mounting plate 13, the bolt head of the locking bolt 83 presses the end of the third adjusting bolt 81 away from the mounting plate 13, so that the locking bolt 83 can drive the mounting plate 13 to be pressed against the third adjusting bolt 81, so that the third adjusting bolt 81 maintains its resistance to the mounting plate 13.

[0103] The locking nut 82 is screwed onto the outer circumference of the third adjusting bolt 81 and locked to the support 12, so that the third adjusting bolt 81 can be locked to the support 12, reducing the possibility of displacement of the third adjusting bolt 81 due to vibration and other factors during use, which is beneficial to improving the reliability of the wafer platform.

[0104] Exemplarily, the support 12, the mounting plate 13, the isolation plate 11, the mounting member 2 and the electrostatic chuck 5 may be arranged in sequence from bottom to top along the vertical direction.

[0105] In some embodiments, the leveling assembly 8 further includes a gasket 84 , which is sandwiched between the bolt head of the locking bolt 83 and the bolt head of the third adjusting bolt 81 .

[0106] The gasket 84 may be a component for applying a pre-tightening force to the bolt head of the locking bolt 83 on the third adjusting bolt 81. By sandwiching the gasket 84 between the bolt head of the locking bolt 83 and the bolt head of the third adjusting bolt 81, the gasket 84 can use its own elastic restoring force to keep the bolt head of the locking bolt 83 pressed on the third adjusting bolt 81, which is conducive to reducing the possibility of the locking bolt 83 loosening.

[0107] Some embodiments of the present application provide an electron beam detection device, which includes a process chamber, a scanning electron microscope and a wafer platform provided by the above technical solution, wherein the wafer platform is arranged in the process chamber, and the scanning electron microscope is used to detect the wafer.

[0108] Exemplarily, the process chamber is connected to a front-end conveying module for wafers, which conveys wafers to be inspected onto a wafer platform in the process chamber. The scanning electron microscope is used to scan the wafers placed on the wafer platform in order to inspect the wafers.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A wafer platform, characterized in that: include: The seat mechanism includes a separation plate; A mounting member connected to the isolation plate; A reference mirror, used to position the wafer platform; A position-limiting member, one end of which is adjustably connected to the mounting member, and the other end of which is connected to the reference mirror, so as to position the reference mirror on the mounting member; Electrostatic chuck, used to hold the wafer; The first fixing assembly connects the electrostatic chuck to the isolation plate in an adjustable manner.

2. The wafer platform according to claim 1, characterized in that: The first fixing assembly includes a first adjusting bolt and an elastic element. The first adjusting bolt passes through the screw hole of the electrostatic suction cup and the elastic element in sequence along the thickness direction of the electrostatic suction cup and is connected to the isolation plate. The elastic element is clamped between the electrostatic suction cup and the isolation plate.

3. The wafer platform according to claim 2, characterized in that: The first fixing assembly also includes a fixing seat, the fixing seat is fixed to the isolation plate, and the first adjusting bolt is connected to the fixing seat.

4. The wafer platform according to claim 2, characterized in that: The screw hole is a stepped hole, the bolt head of the first adjusting bolt is located in the large diameter section of the stepped hole, and the top surface of the bolt head is lower than the top surface of the electrostatic chuck.

5. The wafer platform according to claim 1, characterized in that: The reference mirror is provided with a limiting groove, and at least a part of the limiting member abuts against the inner wall of the limiting groove to press the reference mirror against the mounting member; the limiting member includes an elastic portion and a supporting portion protruding from the elastic portion, the elastic portion is adjustably connected to the mounting member, and the supporting portion abuts against the inner wall of the limiting groove.

6. The wafer platform according to claim 5, characterized in that: In the thickness direction of the reference mirror, the depth of the limiting groove is smaller than the height of the supporting portion protruding from the elastic portion.

7. The wafer platform according to claim 5, characterized in that: The inner wall surface of the limiting groove is configured as an arc-shaped surface, and at least a part of the abutting portion is matched in the limiting groove.

8. The wafer platform according to claim 5, characterized in that: The mounting member is provided with a groove, and at least a portion of the reference mirror is arranged in the groove and abuts against the inner wall of the groove.

9. The wafer platform according to claim 8, characterized in that: Along the thickness direction of the reference mirror, the depth of the groove is greater than or equal to the height of the reference mirror, and the groove is connected to the side surface of the mounting member.

10. The wafer platform according to claim 1, characterized in that: The seat body mechanism further comprises a support and a mounting plate, wherein along the thickness direction of the isolation plate, the isolation plate and the support are respectively connected to opposite sides of the mounting plate; The wafer platform further comprises a plurality of leveling components arranged at intervals, and the mounting plate is locked relative to the support through the plurality of leveling components.

11. The wafer platform according to claim 10, characterized in that: The leveling assembly includes a third adjusting bolt, a locking nut and a locking bolt. The third adjusting bolt has an axial hole extending through it along its own axis. The support is provided with an adjustment hole extending through the thickness direction of the isolation plate. The third adjusting bolt is screwed and connected to the adjustment hole. The locking bolt passes through the axial hole and is threadedly connected to the mounting plate. The locking nut is screwed and sleeved on the outer periphery of the third adjusting bolt.

12. An electron beam testing device, characterized in that: include: The wafer platform according to any one of claims 1 to 11; A process chamber, wherein the wafer platform is arranged in the process chamber, Scanning electron microscope, used to inspect wafers.

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