Clamping jaw for automatic trimming and forming of semiconductor

Abstract

The invention provides a clamping jaw for automatic trimming and forming of a semiconductor, and relates to the field of sealing and testing processes of electric semiconductor integrated circuits, the clamping jaw comprises a connecting plate and a fixing plate, the bottom end of the fixing plate is fixedly provided with four linear bearings, and the bottom end of each linear bearing is fixedly connected with a guide column; the bottom ends of the four guide columns are jointly and fixedly connected with a fixed pressing plate, a parallel pneumatic claw is fixedly installed in the middle of the top end of the fixed pressing plate, the extending ends of the two sides of the parallel pneumatic claw are both fixedly connected with connecting blocks, and a gripper mechanism used for gripping a frame is fixedly installed on one side of the top end of each connecting block. The gripper mechanism comprises a first mounting frame fixedly connected to one side of the top end of the connecting block, four second mounting frames are arranged at the end, close to the parallel pneumatic claws, of the first mounting frame at equal intervals, and clamping claws are rotationally connected to the middles of inner cavities of the second mounting frames. And meanwhile, the situation of local deformation of the frame in the clamping process is also reduced.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor integrated circuit packaging and testing processes, and in particular to a clamping jaw for automatic semiconductor cutting and forming. Background Art

[0002] Semiconductor integrated circuits are core components of electronic products. They integrate active components such as transistors and diodes and passive components such as resistors and capacitors according to certain circuit interconnections, thereby completing specific circuit or system functions. With the development of my country's semiconductor integrated circuit industry, all process steps of integrated circuits have been fully automated. Semiconductor packaging cutting and forming technology plays an important role in the chip manufacturing process. For example, chip packaging frames are mostly transported in a "grip + track" manner on cutting and forming equipment, and some also use a "parallel air gripper push + track" method.

[0003] Deficiencies in the prior art: The conveying method in the prior art has the problem of insufficient material in the material box, which requires frequent manual intervention, reducing production capacity to a certain extent. Therefore, it is rarely used in the market. At the same time, it is easy to grab multiple materials when grabbing the material, especially when the plastic packaging body and the frame are thin and the frame is soft. The threaded clamp derived therefrom has a certain improvement in effect, but the above-mentioned problems also exist. On the other hand, the threaded clamp uses an ordinary cylindrical screw, and its clamping surface with the edge of the frame is relatively reduced, which may cause local deformation of the frame. Summary of the invention

[0004] The problem to be solved by the present invention is that the conveying method in the prior art has the problem that the material box is not filled with enough material, which requires frequent manual intervention, and the clamping surface with the edge of the frame is relatively reduced during use, which may cause local deformation of the frame.

[0005] In order to solve the above technical problems, the present invention provides a clamping jaw for automatic rib cutting and forming of semiconductors, comprising a connecting plate and a fixing plate fixedly installed on one side thereof, four linear bearings are fixedly installed on the bottom end of the fixing plate, the bottom end of each of the linear bearings is fixedly connected to a guide column, the bottom ends of the four guide columns are commonly fixedly connected to a fixed pressure plate, a parallel air gripper is fixedly installed on the middle of the top end of the fixed pressure plate, the extended ends on both sides of the parallel air gripper are fixedly connected to connecting blocks, and a gripping mechanism for grabbing a frame is fixedly installed on one side of the top end of the connecting block;

[0006] The gripping mechanism includes a first mounting frame fixedly connected to one side of the top end of the connecting block, four second mounting frames are equidistantly arranged at one end of the first mounting frame close to the parallel air claws, a clamping claw is rotatably connected to the middle part of the inner cavity of the second mounting frame, a groove is provided in the middle part of one side of the clamping claw close to the second mounting frame, and a first spring is fixedly connected to the inner cavity of the groove.

[0007] Preferably, one end of the second mounting bracket away from the first mounting bracket is fixedly connected to a limit mounting block, an adjustment block is provided in the middle of the limit mounting block, the position of the adjustment block corresponds to the position of the first spring, and one end of the first spring away from the clamp passes through the middle of the limit mounting block and is fixedly connected to the adjustment block.

[0008] Preferably, a pin is provided in the middle of the second mounting frame, and the clamp is connected to the second mounting frame via the pin.

[0009] Preferably, a plurality of tooth grooves are provided at the bottom end of the clamp, the plurality of tooth grooves are arranged in a stepped shape and the inner walls are arranged to be inclined, a plurality of grooves are provided at equal distances at both ends of the fixed pressure plate, the position of the clamp corresponds to the position of the groove, and the clamp is movably connected to the inner cavity of the groove.

[0010] Preferably, an adjustment screw is provided at one end of one of the connecting blocks away from the gripping mechanism, the adjustment screw is located between the two connecting blocks, a locking nut is provided on the outer surface of the adjustment screw, pillars are fixedly connected to the middle parts of both ends of the connecting blocks, and a tension spring is commonly connected to the outer surfaces of the pillars on the same side of the two connecting blocks.

[0011] Preferably, the linear bearing and the guide column are both arranged in a rectangular array, the outer surface of the guide column is sleeved with a second spring, and the top end of the second spring is fixedly connected to the bottom end of the linear bearing.

[0012] Preferably, four connecting flanges are fixedly installed on the top of the fixed plate, a polyurethane gasket and a metal gasket are fixedly connected to the top of the connecting flange, the position of the linear bearing corresponds to the position of the connecting flange, and the top of the linear bearing is fixedly connected to the connecting flange.

[0013] Preferably, an air joint and an optical fiber pressing plate are fixedly mounted on one end of the connecting plate close to the fixing plate, and the optical fiber pressing plate is located above the fixing plate.

[0014] Preferably, a sensor mounting plate is fixedly mounted on one side of the top end of the fixed pressure plate, a fiber optic sensor is fixedly mounted on the top end of the sensor mounting plate, and a sensor protection spring is fixedly mounted on the top end of the fiber optic sensor.

[0015] Technical effects and advantages of the present invention:

[0016] 1. The present invention takes out the frame after chip packaging from the material box by providing a gripper mechanism. The stroke of the parallel air grippers is adjustable. The connecting blocks are pushed by the protruding ends on both sides of the parallel air grippers, and the connecting blocks drive the gripper mechanisms on both sides to move, which is convenient for debugging. The first spring force in the middle of the clamping jaws can also be adjusted to a certain extent. During use, the gripper mechanism descends, and the fixed pressure plate moves downward, pressing the frame and then continuing to move downward to ensure the flatness of the frame. At the same time, the accuracy of the frame position can be ensured, which is convenient for grasping and increases the stability during the grasping process. At the same time, the pressure of the fixed pressure plate is detected by the optical fiber sensor to avoid the frame being squeezed and deformed due to excessive pressure.

[0017] 2. The present invention is convenient to adjust by providing an adjustment screw to adjust the size of the spring force. When the gripping mechanism completes the gripping, the parallel air claws are closed. The length of the screws is adjusted according to the specific conditions of the frame. After the adjustment is completed, the screws are fixed by locking nuts to play a role of limiting. The frame can be effectively protected from excessive clamping force and local deformation of the frame during the clamping process is avoided, thereby better protecting the chip, reducing risks and costs, and improving production quality.

[0018] 3. The present invention provides a plurality of tooth grooves in a stepped manner at the bottom end of the clamping jaws. The inner walls of the tooth grooves are inclined and designed to have a certain angle. When clamping the first layer of frames, the frames of the lower layer can be avoided. During the closing process of the parallel air jaws, the clamping jaws gradually contact the edge of the frame, and the frame is stuck in a tooth groove of the clamping jaws. Then the frame presses against the clamping jaws to gradually compress the spring, thereby providing clamping force. This greatly improves the situation of previous mechanisms grabbing multi-layer frames, thereby ensuring the reliability of equipment operation, reducing the occasions for manual intervention, and reducing risks and costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0020] Figure 2 It is a schematic diagram of the structure of the gripper mechanism of the present invention.

[0021] Figure 3 For the present invention Figure 2 A schematic diagram of the enlarged structure in the middle.

[0022] Figure 4 It is a schematic diagram of the overall top view of the structure of the present invention.

[0023] Figure 5 It is a schematic diagram of the overall facade structure of the present invention.

[0024] Figure 6 The state diagram of the gripper mechanism of the present invention is shown in FIG. Figure 1 .

[0025] Figure 7The state diagram of the gripper mechanism of the present invention is shown in FIG. Figure 2 .

[0026] The accompanying drawings are marked as follows: 1. connecting plate; 2. fixing plate; 3. linear bearing; 4. guide column; 5. fixed pressure plate; 6. parallel air claw; 7. connecting block; 8. gripper mechanism; 81. first mounting frame; 82. second mounting frame; 83. clamping claw; 84. first spring; 85. limit mounting block; 86. adjustment block; 87. pin shaft; 9. adjustment screw; 10. locking nut; 11. pillar; 12. tension spring; 13. second spring; 14. connecting flange; 15. polyurethane gasket; 16. metal gasket; 17. air joint; 18. optical fiber pressure plate; 19. sensor mounting plate; 20. optical fiber sensor; 21. sensor protection spring. DETAILED DESCRIPTION

[0027] The present invention provides a semiconductor automatic cutting and forming clamping jaw, such as Figure 1 - Figure 7 As shown, it includes a connecting plate 1 and a fixing plate 2 fixedly installed on one side thereof, four linear bearings 3 are fixedly installed on the bottom end of the fixing plate 2, the bottom end of each linear bearing 3 is fixedly connected to a guide column 4, the bottom ends of the four guide columns 4 are commonly fixedly connected to a fixed pressure plate 5, a parallel air gripper 6 is fixedly installed in the middle of the top end of the fixed pressure plate 5, the protruding ends on both sides of the parallel air gripper 6 are fixedly connected to connecting blocks 7, a gripping mechanism 8 for grabbing the frame is fixedly installed on one side of the top end of the connecting block 7, the connecting block 7 is pushed by the protruding ends of the parallel air grippers 6, so that the connecting block 7 drives the gripping mechanism 8 to move to both sides.

[0028] Further, such as Figure 2 and Figure 3 As shown, the gripping mechanism 8 includes a first mounting frame 81 fixedly connected to one side of the top end of the connecting block 7, four second mounting frames 82 are equidistantly arranged at one end of the first mounting frame 81 close to the parallel air claw 6, a clamping claw 83 is rotatably connected to the middle of the inner cavity of the second mounting frame 82, a sink groove is provided in the middle of one side of the clamping claw 83 close to the second mounting frame 82, a first spring 84 is fixedly connected to the inner cavity of the sink groove, and the first spring 84 provides clamping force to the clamping claw 83.

[0029] Further, such as Figure 2 and Figure 3As shown, one end of the second mounting frame 82 away from the first mounting frame 81 is fixedly connected to the limiting mounting block 85, and an adjustment block 86 is provided in the middle of the limiting mounting block 85. The position of the adjustment block 86 corresponds to the position of the first spring 84. One end of the first spring 84 away from the clamping jaw 83 passes through the middle of the limiting mounting block 85 and is fixedly connected to the adjustment block 86. When the frame supports the clamping jaw 83, the first spring 84 is gradually compressed to provide a clamping force. The stability of the installation of the first spring 84 is ensured by the limiting mounting block 85, and the first spring 84 can be adjusted by the adjustment block 86.

[0030] Further, such as Figure 2 and Figure 3 As shown, a pin shaft 87 is provided in the middle of the second mounting frame 82 , and the clamping jaw 83 is connected to the second mounting frame 82 via the pin shaft 87 , so that the clamping jaw 83 can rotate in the inner cavity of the second mounting frame 82 via the pin shaft 87 .

[0031] Further, such as Figure 2 and Figure 5 As shown, a plurality of tooth grooves are provided at the bottom end of the clamping jaw 83, and the plurality of tooth grooves are arranged in a stepped shape and the inner wall is arranged to be inclined so as to form a certain angle. When clamping the first layer of the frame, the frame of the lower layer can be avoided. During the closing process of the parallel air claw 6, the clamping jaw 83 gradually contacts the edge of the frame, and the frame is stuck in a tooth groove of the clamping jaw 83. Then the frame supports the clamping jaw 83 to gradually compress the first spring 84, so as to provide a clamping force. When clamping the first layer of the frame, the frame of the lower layer can be avoided, which greatly improves the situation of the previous mechanism grabbing multi-layer frames. A plurality of grooves are provided at equal distances at both ends of the fixed pressure plate 5. The position of the clamping jaw 83 corresponds to the position of the groove, and the clamping jaw 83 is movably connected to the inner cavity of the groove.

[0032] Further, such as Figure 4 As shown, an adjusting screw 9 is provided at one end of one of the connecting blocks 7 away from the gripping mechanism 8, and the adjusting screw 9 is located between the two connecting blocks 7. A locking nut 10 is provided on the outer surface of the adjusting screw 9. When the gripping mechanism 8 completes the gripping, the parallel air claw 6 is closed. The length of the screw 9 is adjusted according to the specific situation of the frame. After the adjustment is completed, it is fixed by the locking nut 10 to play a limiting role, limiting the moving range of the two connecting blocks 7 so that they move to the position of the adjusting screw 9 and stop. This can effectively protect the frame from being subjected to too much clamping force, and avoid the situation where the clamping force is too large during the frame clamping process, resulting in local deformation, thereby better protecting the chip. Pillars 11 are fixedly connected to the middle parts of both ends of the connecting block 7, and the outer surfaces of the pillars 11 on the same side of the two connecting blocks 7 are commonly connected to a tension spring 12. When the two connecting blocks 7 move to both sides, the tension spring 12 is used to ensure the stability of the two connecting blocks 7 during the movement to both sides.

[0033] Further, such as Figure 1 and Figure 5 As shown, the linear bearing 3 and the guide column 4 are arranged in a rectangular array, and the outer surface of the guide column 4 is sleeved with a second spring 13, the top end of the second spring 13 is fixedly connected to the bottom end of the linear bearing 3, and the second spring 13 increases the stability of the linear bearing 3 when it moves downward.

[0034] Further, such as Figure 1 and Figure 5 As shown, four connecting flanges 14 are fixedly installed on the top of the fixed plate 2, and a polyurethane gasket 15 and a metal gasket 16 are fixedly connected to the top of the connecting flange 14. The position of the linear bearing 3 corresponds to the position of the connecting flange 14, and the top of the linear bearing 3 is fixedly connected to the connecting flange 14. The stability of the installation of the linear bearing 3 is ensured by the connecting flange 14. The top of the linear bearing 3 is connected to the output end of the driving mechanism. The polyurethane gasket 15 and the metal gasket 16 can increase the tightness of the linear bearing 3 when connected. The driving mechanism provides power to make the fixed pressure plate 5 move downward. When the fixed pressure plate 5 moves downward, the gripper mechanism 8 also moves downward. The fixed pressure plate 5 presses the top of the frame and then continues to move downward to ensure the flatness of the frame. At the same time, the position of the frame is fixed for easy grasping.

[0035] Further, such as Figure 1 As shown, an air connector 17 and an optical fiber pressing plate 18 are fixedly installed on one end of the connecting plate 1 close to the fixing plate 2 , and the optical fiber pressing plate 18 is located above the fixing plate 2 .

[0036] Further, such as Figure 1 As shown, a sensor mounting plate 19 is fixedly installed on one side of the top of the fixed pressure plate 5, and a fiber optic sensor 20 is fixedly installed on the top of the sensor mounting plate 19. When the fixed pressure plate 5 moves downward and presses the top of the frame, the pressure of the fixed pressure plate 5 is detected by the fiber optic sensor 20 to prevent the frame from being squeezed and deformed due to excessive pressure. A sensor protection spring 21 is fixedly installed on the top of the fiber optic sensor 20 to protect the fiber optic sensor 20.

[0037] The working principle of the present invention is as follows: Figure 6As shown, before grabbing the material, the parallel air gripper 6 is in an open state, and the clamping claws 83 on both sides are in an "inverted eight" shape under the action of the first spring 84. The protruding ends on both sides of the parallel air gripper 6 push the connecting block 7, so that the gripping mechanisms 8 on both sides move to both sides, and are connected to the output end of the driving mechanism through the top of the linear bearing 3. The driving mechanism provides power to move the device as a whole downward. When moving downward, the linear bearing 3 moves downward along the position of the guide column 4, and the stability of the fixed pressure plate 5 is guaranteed by the second spring 13. When the gripping mechanism 8 moves downward, the fixed pressure plate 5 also moves downward, presses the top of the frame after the chip packaging is completed, and then continues to move downward. The flatness of the frame is guaranteed by the fixed pressure plate 5, and the position of the frame is fixed for easy grabbing. When the fixed pressure plate 5 presses the top of the frame, the optical fiber sensor 20 detects the pressure of the fixed pressure plate 5, and the sensor protection spring 21 protects the optical fiber sensor 20, as shown in FIG. Figure 7 As shown, after the fixation is completed, the parallel air claws 6 are closed. During the closing process of the parallel air claws 6, the clamping claws 83 gradually contact the edge of the frame, and the frame is stuck in a tooth groove of the clamping claws 83. The tooth grooves are arranged in a stepped shape and the inner wall is arranged to be inclined, so that it forms a certain angle, and can avoid the lower layer of the frame when clamping the first layer of the frame. Then the frame supports the clamping claws 83 to gradually compress the first spring 84 to provide clamping force, which greatly improves the situation of the previous mechanism grabbing multi-layer frames. After the grabbing is completed, the length of the screws 9 is adjusted according to the specific situation of the frame. After the adjustment, it is fixed by the locking nut 10, which plays a role of limiting, can effectively protect the frame from too much clamping force, and avoid local deformation during the frame clamping process, thereby better protecting the chip.

[0038] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.

Claims

1. A semiconductor automatic cutting and forming clamp, comprising a connecting plate (1) and a fixing plate (2) fixedly mounted on one side thereof, characterized in that: Four linear bearings (3) are fixedly mounted on the bottom end of the fixed plate (2), and the bottom end of each linear bearing (3) is fixedly connected to a guide column (4), and the bottom ends of the four guide columns (4) are commonly fixedly connected to a fixed pressure plate (5), and a parallel air gripper (6) is fixedly mounted on the middle of the top end of the fixed pressure plate (5), and the protruding ends on both sides of the parallel air gripper (6) are fixedly connected to connecting blocks (7), and a gripper mechanism (8) for grabbing the frame is fixedly mounted on one side of the top end of the connecting block (7); The gripping mechanism (8) comprises a first mounting frame (81) fixedly connected to one side of the top end of the connecting block (7); four second mounting frames (82) are equidistantly arranged at one end of the first mounting frame (81) close to the parallel air claw (6); a clamping claw (83) is rotatably connected to the middle of the inner cavity of the second mounting frame (82); a sink groove is provided in the middle of one side of the clamping claw (83) close to the second mounting frame (82); and a first spring (84) is fixedly connected to the inner cavity of the sink groove.

2. A semiconductor automatic cutting and forming clamp according to claim 1, characterized in that: One end of the second mounting frame (82) away from the first mounting frame (81) is fixedly connected to a limit mounting block (85); an adjustment block (86) is provided in the middle of the limit mounting block (85); the position of the adjustment block (86) corresponds to the position of the first spring (84); one end of the first spring (84) away from the clamping claw (83) passes through the middle of the limit mounting block (85) and is fixedly connected to the adjustment block (86).

3. A semiconductor automatic cutting and forming clamp according to claim 1, characterized in that: A pin shaft (87) is provided in the middle of the second mounting frame (82), and the clamping claw (83) is connected to the second mounting frame (82) via the pin shaft (87).

4. A semiconductor automatic cutting and forming clamp according to claim 1, characterized in that: The bottom end of the clamping jaw (83) is provided with a plurality of tooth grooves, the plurality of tooth grooves are arranged in a stepped manner and the inner wall is arranged to be inclined, and the two ends of the fixed pressure plate (5) are provided with a plurality of grooves at equal distances, the position of the clamping jaw (83) corresponds to the position of the groove, and the clamping jaw (83) is movably connected to the inner cavity of the groove.

5. The semiconductor automatic cutting and forming clamp according to claim 1, characterized in that: An adjusting screw (9) is provided at one end of one of the connecting blocks (7) away from the gripping mechanism (8), the adjusting screw (9) is located between the two connecting blocks (7), a locking nut (10) is provided on the outer surface of the adjusting screw (9), pillars (11) are fixedly connected to the middle of both ends of the connecting blocks (7), and a tension spring (12) is commonly connected to the outer surfaces of the pillars (11) on the same side of the two connecting blocks (7).

6. A semiconductor automatic cutting and forming clamp according to claim 1, characterized in that: The linear bearing (3) and the guide column (4) are both arranged in a rectangular array. The outer surface of the guide column (4) is sleeved with a second spring (13), and the top end of the second spring (13) is fixedly connected to the bottom end of the linear bearing (3).

7. A semiconductor automatic cutting and forming clamp according to claim 1, characterized in that: Four connecting flanges (14) are fixedly mounted on the top of the fixing plate (2), a polyurethane gasket (15) and a metal gasket (16) are fixedly connected to the top of the connecting flange (14), the position of the linear bearing (3) corresponds to the position of the connecting flange (14), and the top of the linear bearing (3) is fixedly connected to the connecting flange (14).

8. The semiconductor automatic cutting and forming clamp according to claim 1, characterized in that: An air joint (17) and an optical fiber pressing plate (18) are fixedly mounted on one end of the connecting plate (1) close to the fixing plate (2), and the optical fiber pressing plate (18) is located above the fixing plate (2).

9. A semiconductor automatic cutting and forming clamp according to claim 1, characterized in that: A sensor mounting plate (19) is fixedly mounted on one side of the top end of the fixed pressure plate (5), an optical fiber sensor (20) is fixedly mounted on the top end of the sensor mounting plate (19), and a sensor protection spring (21) is fixedly mounted on the top end of the optical fiber sensor (20).

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