Pick-up mechanism and chip feeding device

Abstract

The invention belongs to the technical field of chip bonding, and discloses a pickup mechanism and a chip feeding device. The picking mechanism comprises a main body, a sliding assembly, an adsorption structure and an elastic piece, the sliding assembly is slidably arranged in the main body, the top end of the sliding assembly and the inner side wall and the inner top wall of the main body define a pressurizing cavity, the adsorption structure is connected to the bottom end of the sliding assembly, and the pressurizing cavity has a pressurizing state and a pressure relief state; the two ends of the elastic piece abut against the body and the sliding assembly respectively. Before the chip is picked up, the pressurizing cavity is pressurized, and the pressure in the pressurizing cavity enables the sliding assembly to drive the adsorption structure to move in the direction away from the main body (namely, the adsorption structure gradually extends out); the chip is picked up after pressurization, once the ejection force of the ejection mechanism is too large, the pressurization cavity is controlled to release pressure, the sliding assembly drives the adsorption structure to move towards the direction close to the main body under the action of the elastic piece, namely, the adsorption structure gradually retracts, a certain avoiding space can be provided, and the chip is effectively prevented from being damaged.

Description

Technical Field

[0001] The present invention relates to the technical field of chip bonding, and in particular to a pickup mechanism and a chip loading device. Background Art

[0002] During the chip picking and loading process, the ejection mechanism is used to lift the bottom of the chip to separate it from the blue film at the bottom, and the picking mechanism is used to pick up the chip from above and move the chip to the loading position.

[0003] In the prior art, an ejection mechanism ejects the chip and pierces the blue film at the bottom of the chip, and a pickup mechanism sucks the chip from above; during the chip ejection and pickup process, the pickup mechanism sucks the top of the chip and the ejection mechanism pushes against the bottom of the chip. If the ejection force of the ejection mechanism is too large during pickup, the chip is easily damaged.

[0004] Therefore, it is urgently necessary to provide a picking mechanism and a chip loading device, which can retract a certain distance when the ejection force of the ejection mechanism is too large, thereby providing a certain avoidance space to prevent the chip from being damaged. Summary of the invention

[0005] The object of the present invention is to provide a pick-up mechanism and a chip loading device, which can retract a certain distance when the ejection force of the ejection mechanism is too large, thereby providing a certain avoidance space to prevent the chip from being damaged.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] The present invention provides a picking mechanism, which comprises:

[0008] A main body, a sliding component and an adsorption structure, wherein the sliding component is slidably arranged in the main body, the top of the sliding component and the inner top wall and inner side wall of the main body enclose a pressure chamber, the adsorption structure is connected to the bottom of the sliding component for adsorbing the chip, and the pressure chamber has a pressure-filled state and a pressure-release state;

[0009] An elastic member, two ends of which are respectively against the main body and the sliding assembly;

[0010] In the pressurized state, the sliding component drives the adsorption structure to move in a direction away from the main body and squeezes the elastic member; in the depressurized state, the sliding component drives the adsorption structure to move in a direction close to the main body under the action of the elastic member.

[0011] As an optional technical solution of a picking mechanism, the sliding assembly includes:

[0012] A pressure-bearing member, one side of the pressure-bearing member and the inner top wall and inner side wall of the main body enclose the pressure-charging cavity, and the elastic member presses against the other side of the pressure-bearing member;

[0013] A sliding member is slidably connected to the main body and fixed to the other side of the pressure-bearing member, and the sliding member is connected to the adsorption structure.

[0014] As an optional technical solution of a picking mechanism, the picking mechanism further includes a first guide cylinder, the first guide cylinder is fixed in the main body, and the sliding member is slidably disposed in the first guide cylinder.

[0015] As an optional technical solution of a picking mechanism, the main body includes:

[0016] A hollow base, wherein the sliding assembly is slidably disposed in the hollow base;

[0017] An upper cover is a detachable cover arranged on the top of the hollow base body. The upper cover, the hollow base body and the top of the sliding component enclose the pressure-charging chamber.

[0018] As an optional technical solution for a picking mechanism, the adsorption structure includes a base and an adsorption component, one side of the base is connected to the bottom end of the sliding component, and the adsorption component is arranged on the other side of the base for adsorbing the chip, and the base can close the bottom opening of the hollow substrate.

[0019] As an optional technical solution of the picking mechanism, it also includes a pressure detection component, which is arranged between the sliding component and the adsorption structure.

[0020] As an optional technical solution of a picking mechanism, the picking mechanism further includes a pressure controller, and the pressure controller is used to control the air pressure value of the pressure-charging chamber;

[0021] And / or, the picking mechanism further includes a rotating assembly, and the rotating assembly is connected to the main body.

[0022] The present invention provides a chip loading device, which comprises a base, an ejection mechanism and the above-mentioned pickup mechanism, wherein the ejection mechanism and the pickup mechanism are both arranged on the base, and the pickup mechanism is located above the ejection mechanism.

[0023] As an optional technical solution for a chip loading device, the ejection mechanism includes an ejection component and a drive component, the drive component is used to drive the ejection component to move toward the direction close to the pickup mechanism, and the drive component is a voice coil motor.

[0024] As an optional technical solution of the chip loading device, the ejection mechanism is slidably arranged on the base along the first direction;

[0025] And / or, the chip loading device further comprises an auxiliary component, the picking mechanism is slidably disposed on the auxiliary component along a first direction, and the auxiliary component is slidably disposed on the base along a second direction.

[0026] Beneficial effects:

[0027] The present invention provides a picking mechanism, which includes a main body, a sliding component, an adsorption structure and an elastic member. The sliding component is slidably arranged in the main body, the top of the sliding component and the inner side wall and the inner top wall of the main body enclose a pressure chamber, the adsorption structure is connected to the bottom of the sliding component for adsorbing chips, and the pressure chamber has a pressure state and a pressure relief state; the two ends of the elastic member are respectively against the main body and the sliding component; in the pressure state, the sliding component drives the adsorption structure to move in a direction away from the main body and squeezes the elastic member, and in the pressure relief state, the sliding component drives the adsorption structure to move in a direction close to the main body under the action of the elastic member. Before picking up the chip, the pressure chamber is charged, and the pressure in the pressure chamber causes the sliding component to drive the adsorption structure to move in a direction away from the main body (i.e., gradually extend); after charging, the chip is picked up, once the ejection force of the ejection mechanism is too large, the pressure in the pressure chamber is controlled to be relieved, and under the action of the elastic member, the sliding component drives the adsorption structure to move in a direction close to the main body (i.e., gradually retract), which can provide a certain avoidance space and effectively prevent the chip from being damaged.

[0028] The present invention provides a chip loading device, which includes a base, an ejection mechanism and the above-mentioned pick-up mechanism, wherein the ejection mechanism and the pick-up mechanism are both arranged on the base, and the pick-up mechanism is located above the ejection mechanism. By arranging the pick-up mechanism with a pressurized cavity, an avoidance space can be provided during the chip ejection and pick-up process to prevent the chip from being damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a partial structural schematic diagram of a chip loading device provided by an embodiment of the present invention from a first viewing angle;

[0030] Figure 2 is a partial structural schematic diagram of a chip loading device provided by an embodiment of the present invention from a second viewing angle;

[0031] Figure 3 is a cross-sectional view of a pickup mechanism (with a pressure detection component) provided in an embodiment of the present invention;

[0032] Figure 4 is a cross-sectional view of a pickup mechanism (without a pressure detection component) provided by an embodiment of the present invention

[0033] Figure 5 is a structural schematic diagram of an ejection mechanism provided by an embodiment of the present invention;

[0034] Figure 6 It is a cross-sectional view of the ejection mechanism provided by the embodiment of the present invention.

[0035] In the figure:

[0036] 1. Pick-up mechanism; 11. Main body; 111. Hollow base; 112. Upper cover; 113. Pressurized chamber; 12. Sliding component; 121. Pressure-bearing member; 122. Sliding member; 13. Adsorption structure; 131. Base; 132. Adsorption component; 14. Elastic member; 15. First guide cylinder; 16. Pressure detection component; 17. Rotating component; 18. Gap;

[0037] 2. Ejection mechanism; 21. Ejection assembly; 211. Ejector pin; 212. Ejector rod; 213. Elevating platform; 214. Lifting plate; 22. Driving assembly; 23. Base plate; 24. Quick release assembly; 25. Blue film vacuum; 26. Shell; 27. Second guide cylinder;

[0038] 3. Base; 4. Auxiliary parts; 5. Gas line connector. DETAILED DESCRIPTION

[0039] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0040] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0043] like Figures 1 to 6 As shown, this embodiment provides a picking mechanism and a chip loading device, the chip loading device includes a base 3, an ejection mechanism 2 and a picking mechanism 1, the ejection mechanism 2 and the picking mechanism 1 are both arranged on the base 3, and the picking mechanism 1 is located above the ejection mechanism 2.

[0044] The picking mechanism 1 includes a main body 11, a sliding component 12, an adsorption structure 13 and an elastic member 14. The sliding component 12 is slidably arranged in the main body 11. The top of the sliding component 12 and the inner side wall and the inner top wall of the main body 11 enclose a pressure chamber 113. The adsorption structure 13 is connected to the bottom of the sliding component 12 for adsorbing chips. The pressure chamber 113 has a pressure-charging state and a pressure-releasing state. The two ends of the elastic member 14 are respectively against the main body 11 and the sliding component 12. In the pressure-charging state, the sliding component 12 drives the adsorption structure 13 to move in a direction away from the main body 11 and squeezes the elastic member 14. In the pressure-releasing state, the sliding component 12 drives the adsorption structure 13 to move in a direction close to the main body 11 under the action of the elastic member 14.

[0045] By providing a pick-up mechanism 1 with a pressurized chamber 113, before picking up the chip, the pressurized chamber 113 is pressurized, and the pressure in the pressurized chamber 113 causes the sliding component 12 to drive the adsorption structure 13 to move in a direction away from the main body 11 (i.e., gradually extend out); after pressurization, the chip is picked up, and once the ejection force of the ejection mechanism 2 is too large, the pressurized chamber 113 is controlled to release pressure, and under the action of the elastic member 14, the sliding component 12 drives the adsorption structure 13 to move in a direction close to the main body 11 (i.e., gradually retract), which can provide a certain avoidance space and effectively prevent the chip from being damaged.

[0046] In this embodiment, the first direction is a vertical direction, and the second direction is a horizontal direction; the picking mechanism 1 and the ejecting mechanism 2 are arranged at intervals along the first direction, and the picking mechanism 1 is located directly above the ejecting mechanism 2 .

[0047] Optionally, the picking mechanism 1 further comprises a pressure controller, which is used to control the air pressure value of the pressure-charging chamber 113. The pressure controller is set to control the air pressure value in the pressure-charging chamber 113 so as to charge and release the pressure.

[0048] The working principle of the pressure controller is based on the pressure sensor and the transmission circuit. It detects the medium pressure signal through a high-precision and high-stability sensor and converts the signal into an electrical signal for processing. Before the picking mechanism 1 picks up the chip, the pressure controller connects the circuit to pressurize the pressure chamber 113 until the pressure value in the pressure chamber 113 reaches the preset value; during the chip ejection and picking process, when the ejection force of the ejection mechanism 2 is too large or fluctuates, the controller and the micro switch are used to release the pressure.

[0049] Optionally, the picking mechanism 1 further includes a rotating assembly 17, and the rotating assembly 17 is connected to the main body 11. The picking mechanism 1 picks up the chip from above, and then needs to drive the chip up and flip the chip 180°, and then move the chip to the loading position. By setting the rotating assembly 17, under the action of the rotating assembly 17, the main body 11 can be flipped, and the sliding assembly 12, the adsorption structure 13, and the elastic member 14 will flip accordingly, thereby completing the chip flipping operation.

[0050] Specifically, the main body 11 includes a hollow base 111 and an upper cover 112, the sliding assembly 12 is slidably arranged in the hollow base 111, the upper cover 112 is detachably arranged on the top of the hollow base 111, and the upper cover 112, the hollow base 111 and the top of the sliding assembly 12 enclose a pressure chamber 113. By providing the hollow base 111 and the upper cover 112 that are detachably connected, it is convenient to install the elastic member 14 and the sliding assembly 12 in the main body 11.

[0051] In this embodiment, the hollow base 111 is provided with a top opening and a bottom opening; the sliding assembly 12 can move up and down along the first direction; the upper cover 112 is fixed to the top of the hollow base 111 by bolts, and the upper cover 112 closes the top opening of the hollow base 111; the upper cover 112 is provided with an air circuit connector 5 connected to the pressurizing chamber 113, and the air circuit connector 5 is connected to the pressure controller through a pipeline.

[0052] See also Figure 3 The upper cover 112 is provided with a groove, the size of which is smaller than the size of the opening at the top of the hollow base 111; when the sliding component 12 moves to the point where the top surface is flush with the top of the hollow base 111, the top surface of the sliding component 12 will abut against the upper cover 112, and at this time, the sliding component 12 closes the groove and encloses the pressure chamber 113 at the groove. It is understandable that, in order to ensure sealing, a sealing member, such as a rubber sealing ring, may be provided between the upper cover 112 and the hollow base 111.

[0053] Furthermore, the sliding assembly 12 includes a pressure-bearing member 121 and a sliding member 122. One side of the pressure-bearing member 121 and the inner top wall and inner side wall of the main body 11 enclose a pressure chamber 113. The elastic member 14 presses the other side of the pressure-bearing member 121. The sliding member 122 is slidably connected to the main body 11 and fixed to the other side of the pressure-bearing member 121. The sliding member 122 is connected to the adsorption structure 13. After the pressure chamber 113 is pressurized, the pressure-bearing member 121 is pressurized and transmits the pressure to the sliding member 122. The sliding member 122 slides up and down in the main body 11, and the pressure-bearing member 121 and the adsorption structure 13 move together with the sliding member 122. By setting the pressure-bearing member 121 and the sliding member 122, the pressure-bearing member 121 and the inner top wall and inner side wall of the main body 11 enclose a pressure chamber 113, and the air pressure value in the pressure chamber 113 is used to control the position of the adsorption structure 13. In this embodiment, the sliding member 122 and the pressure-bearing member 121 are connected by bolts.

[0054] Optionally, the picking mechanism 1 further includes a first guide cylinder 15, the first guide cylinder 15 is fixed in the main body 11, and the sliding member 122 is slidably arranged in the first guide cylinder 15. By arranging the first guide cylinder 15 in the main body 11, the first guide cylinder 15 and the sliding member 122 are slidably matched to limit the sliding direction of the sliding member 122.

[0055] In this embodiment, the hollow base 111 is provided with an internal space with an I-shaped cross-section, the first guide cylinder 15 is embedded and fixed in the hollow base 111, the sliding member 122 is slidably passed through the first guide cylinder 15 and coincides with the axis of the first guide cylinder 15; the first guide cylinder 15 is inserted into the bottom opening of the hollow base 111, and the first guide cylinder 15 is fixed to the inner wall of the hollow base 111 by bolts.

[0056] Specifically, the pressure-bearing member 121 is in the shape of a flat plate, the elastic member 14 is sleeved on the outside of the sliding member 122 , and two ends of the elastic member 14 respectively abut against the pressure-bearing member 121 and the hollow base 111 .

[0057] Optionally, the adsorption structure 13 includes a base 131 and an adsorption assembly 132. One side of the base 131 is connected to the bottom end of the sliding assembly 12. The adsorption assembly 132 is arranged on the other side of the base 131 for adsorbing the chip. The base 131 can close the bottom opening of the hollow substrate 111. By providing the base 131 and the adsorption assembly 132, when the pressure chamber 113 is pressurized, the sliding assembly 12 extends from the main body 11, and a gap 18 is formed between the base 131 and the hollow substrate 111 (see Figure 3 ); When the pressure chamber 113 is completely depressurized, the sliding assembly 12 retracts to the innermost side of the main body 11, and the gap 18 disappears. At this time, the base 131 can close the bottom opening of the hollow base 111, and the upper cover 112, the hollow base 111 and the base 131 enclose a closed space (see Figure 4 ), which can effectively prevent impurities from entering and protect internal components.

[0058] In this embodiment, the adsorption component 132 includes a chip fixture for picking up chips of a specific size. A chip vacuum is provided at the center of the chip fixture, and the chip vacuum can absorb the chip.

[0059] In order to monitor the change of force in the process of chip ejection and picking up in real time, the picking mechanism 1 also includes a pressure detection component 16, which is arranged between the sliding component 12 and the adsorption structure 13; the pressure detection component 16 can be a pressure sensor. By arranging the pressure detection component 16 between the sliding component 12 and the adsorption structure 13, during the process of ejection and picking up the chip, the ejection force on the chip can be transmitted to the pressure detection component 16 through the adsorption structure 13, and the pressure detection component 16 can monitor the change of the ejection force in real time, which is convenient for real-time control.

[0060] See also Figure 1 and Figure 2 The ejection mechanism 2 is slidably disposed on the base 3 along a first direction; the chip loading device further comprises an auxiliary member 4, the pickup mechanism 1 is slidably disposed on the auxiliary member 4 along a first direction, and the auxiliary member 4 is slidably disposed on the base 3 along a second direction. By slidingly disposing the ejection mechanism 2 and the pickup mechanism 1, the relative positions of the pickup mechanism 1 and the ejection mechanism 2 are adjustable, so as to facilitate the ejection and pickup of the chip.

[0061] In this embodiment, the auxiliary part 4 is plate-shaped, the picking mechanism 1 is slidably arranged on one side of the auxiliary part 4 along the first direction, and the other side of the auxiliary part 4 is slidably connected to the base 3 along the second direction; the chip loading device also includes a support arm, one end of the support arm is connected to the ejection mechanism 2, and the other end of the support arm is slidably connected to the base 3 along the first direction.

[0062] See also Figure 5 and Figure 6 The ejection mechanism 2 includes an ejection component 21 and a driving component 22. The driving component 22 is used to drive the ejection component 21 to move toward the pickup mechanism 1. The driving component 22 is a voice coil motor.

[0063] In the prior art, the ejection mechanism often uses a cam structure to achieve lifting and lowering movement. Its ejection force is large and friction debris will be generated during the movement process, which can easily cause the chip to break. When encountering motion fluctuations, it is easy to wear the ejection component and damage the chip. In this embodiment, a voice coil motor is used as a driving component 22. The driving component 22 drives the ejection component 21 to move along the first direction, replacing the cam structure for lifting. On the one hand, the force given is elastic and variable. On the other hand, the voice coil motor drive is a floating drive. The voice coil motor drive itself can monitor the ejection force and can adaptively adjust the ejection force. Once abnormal overpressure occurs, the voice coil motor can be controlled to quickly retract the ejection component 21.

[0064] When the chip is over-pressurized during the ejection and picking process, the picking mechanism 1 can provide a certain escape space, and the ejection mechanism 2 can quickly retract the ejection component 21 by controlling the voice coil motor, that is, the picking mechanism 1 and the ejection mechanism 2 can both quickly play a protective role to minimize chip damage; through the coordination of the picking mechanism 1 and the ejection mechanism 2 in the material picking process, the force data of a chip from picking to loading can be automatically fitted through algorithms and force control, and the respective force measurements of the picking mechanism 1 and the ejection mechanism 2 when they are in contact can also be calibrated. If abnormal force data is encountered, it can be automatically marked to facilitate a judgment of the material in the next step.

[0065] Specifically, the ejection mechanism 2 includes a shell 26 and a substrate 23, the shell 26 is arranged on the top of the substrate 23, the driving component 22 is arranged on the substrate 23, the ejection component 21 is arranged in the shell 26, and a blue film vacuum 25 is arranged on the top of the shell 26 for adsorbing chips.

[0066] In this embodiment, the ejection assembly 21 includes an ejector pin 211, an ejector rod 212, and an ejection platform 213. The ejector rod 212 is slidably disposed in the housing 26. The ejector pin 211 is disposed on the top of the ejector rod 212. The ejection platform 213 is connected to the driving assembly 22 and is located below the ejector rod 212. The ejection assembly 21 also includes a lifting plate 214. The driving assembly 22 drives the ejection platform 213 to move along a first direction through the lifting plate 214. The driving assembly 22 controls the ejection platform 213 to gradually approach the bottom of the ejector rod 212 along the first direction, and then the ejection platform 213 lifts the ejector rod 212 and the ejector pin 211 upward.

[0067] Optionally, the ejection mechanism 2 further includes a second guide cylinder 27, which is embedded and fixed in the housing 26, and the ejector rod 212 is slidably inserted into the second guide cylinder 27; the ejection mechanism 2 further includes a quick release assembly 24, and the ejector rod 212 is slidably matched with the quick release assembly 24 and connected to the base plate 23 through the quick release assembly 24. The second guide cylinder 27 can accurately limit the moving direction of the ejector rod 212; the quick release assembly 24 can flexibly replace the ejector rod 212 and the ejector pin 211, which is suitable for loading different chips.

[0068] The following is the specific use process of the picking mechanism 1 and the chip loading device:

[0069] The driving component 22 is started to drive the lifting platform 213 to rise in the first direction. The lifting platform 213 lifts the ejector rod 212 and drives the ejector pin 211 to rise. The blue film vacuum 25 sucks the chip from the bottom. Before the picking mechanism 1 picks up the chip, the pressure is charged into the pressure chamber 113. The pressure in the pressure chamber 113 causes the sliding component 12 to drive the adsorption structure 13 to move in a direction away from the main body 11 (i.e., gradually extend), and form a gap 18 between the base 131 and the hollow substrate 111. After the pressure is charged, the adsorption component 132 of the picking mechanism 1 adsorbs and picks up the chip from the top, and the ejector pin 211 slightly lifts the chip from the bottom, thereby separating the chip from the bottom blue film. Once During this process, when the ejection force of the ejection mechanism 2 is too large or fluctuates, the pressure chamber 113 is controlled to release pressure. Under the action of the elastic member 14, the sliding component 12 drives the adsorption structure 13 to move toward the direction close to the main body 11 (that is, gradually retract). As the adsorption structure 13 moves, the gap 18 gradually decreases. If the base 131 contacts the hollow substrate 111 and closes the bottom opening of the hollow substrate 111, the gap 18 disappears, thereby providing a certain avoidance space and effectively preventing the chip from being damaged. After the chip is separated from the bottom blue film, the picking mechanism 1 uses the rotating component 17 to drive the chip to rotate, flips the chip 180°, and then moves the chip to the loading position.

[0070] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. Pick-up mechanism, characterized in that, include: A main body (11), a sliding component (12) and an adsorption structure (13), wherein the sliding component (12) is slidably disposed in the main body (11), the top end of the sliding component (12) and the inner top wall and inner side wall of the main body (11) enclose a pressure chamber (113), the adsorption structure (13) is connected to the bottom end of the sliding component (12) for adsorbing chips, and the pressure chamber (113) has a pressure-filled state and a pressure-release state; An elastic member (14), two ends of which respectively abut against the main body (11) and the sliding assembly (12); In the pressurized state, the sliding component (12) drives the adsorption structure (13) to move in a direction away from the main body (11) and squeezes the elastic member (14); in the depressurized state, the sliding component (12) drives the adsorption structure (13) to move in a direction close to the main body (11) under the action of the elastic member (14).

2. The picking mechanism according to claim 1, characterized in that: The sliding assembly (12) comprises: A pressure-bearing member (121), one side of the pressure-bearing member (121) and the inner top wall and inner side wall of the main body (11) enclosing the pressure-charging chamber (113), and the elastic member (14) pressing against the other side of the pressure-bearing member (121); A sliding member (122) is slidably connected to the main body (11) and fixed to the other side of the pressure-bearing member (121); the sliding member (122) is connected to the adsorption structure (13).

3. The picking mechanism according to claim 2, characterized in that: The picking mechanism further comprises a first guide cylinder (15), the first guide cylinder (15) being fixed in the main body (11), and the sliding member (122) being slidably disposed through the first guide cylinder (15).

4. The pickup mechanism according to claim 1, characterized in that: The main body (11) comprises: A hollow base (111), wherein the sliding assembly (12) is slidably disposed in the hollow base (111); An upper cover (112) is detachably disposed on the top of the hollow base (111); the upper cover (112), the hollow base (111) and the top of the sliding assembly (12) enclose the pressure-charging chamber (113).

5. The picking mechanism according to claim 4, characterized in that: The adsorption structure (13) comprises a base (131) and an adsorption component (132); one side of the base (131) is connected to the bottom end of the sliding component (12); the adsorption component (132) is arranged on the other side of the base (131) for adsorbing the chip; and the base (131) is capable of closing the bottom end opening of the hollow substrate (111).

6. The pickup mechanism according to claim 1, characterized in that: It also comprises a pressure detection component (16), wherein the pressure detection component (16) is arranged between the sliding component (12) and the adsorption structure (13).

7. The pickup mechanism according to claim 1, characterized in that: The picking mechanism further comprises a pressure controller, wherein the pressure controller is used to control the air pressure value of the pressure-charging chamber (113); And / or, the picking mechanism further comprises a rotating assembly (17), wherein the rotating assembly (17) is connected to the main body (11).

8. A chip loading device, characterized in that: It comprises a base (3), an ejection mechanism (2) and a picking mechanism according to any one of claims 1 to 7, wherein the ejection mechanism (2) and the picking mechanism are both arranged on the base (3), and the picking mechanism is located above the ejection mechanism (2).

9. The chip loading device according to claim 8, characterized in that: The ejection mechanism (2) comprises an ejection component (21) and a drive component (22), wherein the drive component (22) is used to drive the ejection component (21) to move in a direction close to the pickup mechanism, and the drive component (22) is a voice coil motor.

10. The chip loading device according to claim 8, characterized in that: The ejection mechanism (2) is slidably arranged on the base (3) along a first direction; And / or, the chip loading device further comprises an auxiliary component (4), the picking mechanism is slidably arranged on the auxiliary component (4) along a first direction, and the auxiliary component (4) is slidably arranged on the base (3) along a second direction.

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