Preparation method of flexible circuit board for new energy automobile and flexible circuit board

Abstract

The invention provides a preparation method of a flexible circuit board for a new energy automobile and the flexible circuit board. The method comprises the following steps: providing a reinforcing sheet base material, an adhesive and a first flexible circuit board for the new energy automobile; respectively pretreating the reinforcing sheet base material, the adhesive and the first flexible circuit board to obtain a pretreated reinforcing sheet base material, a pretreated adhesive and a second flexible circuit board; carrying out pressing treatment on the pretreated reinforcing sheet base material and the pretreated adhesive to obtain a reinforcing sheet base material with the adhesive; the reinforcing sheet base material with the glue is cut, and a target reinforcing sheet is obtained; and obtaining a target flexible circuit board for the new energy vehicle according to the target reinforcing sheet and the second flexible circuit board. According to the invention, not only can the reinforcing sheet substrate be prevented from being scratched, but also the qualified rate of a final product can be improved by utilizing the pre-treated reinforcing sheet substrate to manufacture the target flexible circuit board for the new energy automobile.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit boards, and also to a method for preparing a flexible circuit board for a new energy vehicle and a flexible circuit board. Background Art

[0002] Flexible circuit boards are made of polyimide or polyester film as a substrate. They are highly reliable and extremely flexible printed circuit boards. They have the characteristics of high wiring density, light weight, thin thickness and good bendability. Flexible circuit boards have a wide range of applications and are also needed in the manufacture of new energy vehicle batteries. In order to enhance the mechanical strength of flexible circuit boards and facilitate the connection and installation of components, it is often necessary to adhere reinforcing materials, such as PI (polyimide) reinforcing sheets, to the surface of flexible circuit boards. In the prior art, in order to facilitate production, the method of full glue reinforcement of PI is generally adopted. On the basis of PI material, a layer of full adhesive is applied or adhered to enhance its strength and stability. This method cannot meet the user's requirements for local adhesive backing, and it is easy to scratch the PI material, resulting in product defects. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a method for preparing a flexible circuit board for new energy vehicles and a flexible circuit board, so as to avoid scratches on the reinforcing sheet substrate and improve the product qualification rate.

[0004] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0005] The first aspect of the present invention provides a method for preparing a flexible circuit board for a new energy vehicle, comprising:

[0006] Provides reinforcing sheet substrates, adhesives and the first flexible circuit board for new energy vehicles;

[0007] Pre-treating the reinforcing sheet substrate, the adhesive and the first flexible circuit board respectively to obtain a pre-treated reinforcing sheet substrate, a pre-treated adhesive and a second flexible circuit board;

[0008] The pre-treated reinforcing sheet substrate and the pre-treated adhesive are pressed together to obtain an adhesive-attached reinforcing sheet substrate;

[0009] Cutting the adhesive reinforcement sheet substrate to obtain a target reinforcement sheet;

[0010] According to the target reinforcing sheet and the second flexible circuit board, a target flexible circuit board for new energy vehicles is obtained.

[0011] Optionally, a reinforcing sheet substrate, an adhesive, and a first flexible circuit board for new energy vehicles are provided, including:

[0012] Obtain demand data for flexible circuit boards for new energy vehicles;

[0013] Determine, according to the flexible circuit board demand data, reinforcement sheet substrate screening data, adhesive screening data, and first flexible circuit board screening data for new energy vehicles;

[0014] According to the reinforcing sheet substrate screening data, the adhesive screening data and the first flexible circuit board screening data for new energy vehicles, the reinforcing sheet substrate, the adhesive and the first flexible circuit board for new energy vehicles are determined.

[0015] Optionally, pre-treating the reinforcing sheet substrate to obtain a pre-treated reinforcing sheet substrate includes:

[0016] Provide protective film;

[0017] Cleaning the reinforcing sheet substrate to obtain a cleaned reinforcing sheet substrate;

[0018] According to preset protective film lamination parameters, the protective film and the cleaned reinforcing sheet substrate are laminated to obtain a pre-treated reinforcing sheet substrate.

[0019] Optionally, the adhesive is pretreated to obtain a pretreated adhesive, comprising:

[0020] Get preset die-cutting parameters;

[0021] According to the preset die-cutting parameters, the adhesive is placed in a die-cutting machine for cutting to obtain a pretreated adhesive.

[0022] Optionally, preprocessing the first flexible circuit board to obtain a second flexible circuit board includes:

[0023] Cleaning the first flexible circuit board to obtain a cleaned first flexible circuit board;

[0024] Performing surface treatment on the cleaned first flexible circuit board to obtain a surface-treated first flexible circuit board;

[0025] The surface-treated first flexible circuit board is screened according to preset screening conditions to obtain a second flexible circuit board.

[0026] Optionally, the pretreated reinforcing sheet substrate and the pretreated adhesive are pressed together to obtain an adhesive-attached reinforcing sheet substrate, comprising:

[0027] Obtaining preset pressing parameters and preset pressing methods;

[0028] According to the preset lamination method and the preset lamination parameters, the pretreated reinforcing sheet substrate and the pretreated adhesive are placed in a laminating machine for lamination treatment to obtain an adhesive-attached reinforcing sheet substrate.

[0029] Optionally, the adhesive reinforcement sheet substrate is cut to obtain a target reinforcement sheet, including:

[0030] Get preset cutting parameters and transfer parameters;

[0031] Cutting the adhesive reinforcement sheet substrate according to the preset cutting parameters to obtain a first reinforcement sheet;

[0032] Screening the first reinforcing sheet according to a preset reinforcing sheet screening condition to obtain a second reinforcing sheet;

[0033] The second reinforcing sheet is transferred according to the transfer parameters to obtain a target reinforcing sheet.

[0034] Optionally, a target flexible circuit board for a new energy vehicle is obtained according to the target reinforcing sheet and the second flexible circuit board, including:

[0035] Performing positioning processing on the second flexible circuit board to obtain a second flexible circuit board with a positioning mark;

[0036] According to preset installation parameters, the target reinforcement sheet is installed on the second flexible circuit board with positioning marks to obtain a target flexible circuit board for new energy vehicles.

[0037] Optionally, the method further includes:

[0038] Get preset test conditions;

[0039] Testing the target flexible circuit board for the new energy vehicle according to the preset test conditions to obtain a test result;

[0040] The target flexible circuit board for the new energy vehicle is screened according to the preset qualification conditions and the test results to obtain a qualified flexible circuit board for the new energy vehicle.

[0041] A second aspect of the present invention provides a flexible circuit board for new energy vehicles, wherein the flexible circuit board for new energy vehicles is prepared by the method for preparing a flexible circuit board for new energy vehicles as described in any one of the above.

[0042] The above solution of the present invention includes at least the following beneficial effects:

[0043] The above scheme of the present invention pre-treats the provided reinforcing sheet substrate, adhesive and the first flexible circuit board for new energy vehicles respectively, then presses the pre-treated reinforcing sheet substrate and the pre-treated adhesive to obtain the adhesive-attached reinforcing sheet substrate, cuts the adhesive-attached reinforcing sheet substrate to obtain the target reinforcing sheet, and finally obtains the target flexible circuit board for new energy vehicles based on the target reinforcing sheet and the second flexible circuit board. This can not only prevent the reinforcing sheet substrate from being scratched, but also use the pre-treated reinforcing sheet substrate to make the target flexible circuit board for new energy vehicles, which can improve the qualified rate of the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a schematic flow chart of a method for preparing a flexible circuit board for new energy vehicles in an embodiment of the present invention. DETAILED DESCRIPTION

[0045] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0046] like Figure 1 As shown, an embodiment of the present invention provides a method for preparing a flexible circuit board for a new energy vehicle, comprising the following steps:

[0047] Step 101, providing a reinforcing sheet substrate, an adhesive, and a first flexible circuit board for a new energy vehicle;

[0048] Step 102, pre-treating the reinforcing sheet substrate, the adhesive and the first flexible circuit board respectively to obtain a pre-treated reinforcing sheet substrate, a pre-treated adhesive and a second flexible circuit board;

[0049] Step 103, laminating the pretreated reinforcing sheet substrate and the pretreated adhesive to obtain an adhesive-attached reinforcing sheet substrate;

[0050] Step 104, cutting the adhesive reinforcement sheet substrate to obtain a target reinforcement sheet;

[0051] Step 105 , obtaining a target flexible circuit board for new energy vehicles according to the target reinforcement sheet and the second flexible circuit board.

[0052] The method for preparing a flexible circuit board for a new energy vehicle proposed in an embodiment of the present invention pre-treats the provided reinforcing sheet substrate, adhesive and the first flexible circuit board for a new energy vehicle respectively, then press-treats the pre-treated reinforcing sheet substrate and the pre-treated adhesive to obtain a reinforcing sheet substrate with adhesive, cuts the reinforcing sheet substrate with adhesive to obtain a target reinforcing sheet, and finally obtains a target flexible circuit board for a new energy vehicle based on the target reinforcing sheet and the second flexible circuit board. This method can not only prevent the reinforcing sheet substrate from being scratched, but also use the pre-treated reinforcing sheet substrate to make the target flexible circuit board for a new energy vehicle, thereby improving the qualified rate of the final product.

[0053] In an optional embodiment of the present invention, step 101 includes:

[0054] Step 101, obtaining demand data of flexible circuit boards for new energy vehicles;

[0055] Specifically, the flexible circuit boards and reinforcing sheets used in new energy vehicles need to withstand greater mechanical stress, so the reinforcing sheets should have sufficient strength and rigidity; new energy vehicles will generate higher temperatures during operation, and the flexible circuit boards and reinforcing sheets used should be able to withstand a certain heat load to prevent deformation or failure due to high temperature; new energy vehicle components may be exposed to harsh environments, and the flexible circuit boards and reinforcing sheets should have good corrosion resistance to ensure their long-term stability; new energy vehicles have high requirements for space utilization, and flexible circuit boards and reinforcing sheets should be as light and thin as possible to adapt to compact designs; lightweighting is an important trend in new energy vehicles, and flexible circuit boards and reinforcing sheets should be as light as possible while meeting performance requirements; in order to reduce material costs, flexible circuit boards and reinforcing sheets should be controlled within a reasonable range to reduce overall manufacturing costs. The above requirements can be used as the demand data for flexible circuit boards for new energy vehicles, which is convenient for the subsequent determination of the reinforcing sheet substrate screening data, adhesive screening data, and the first flexible circuit board screening data for new energy vehicles, so as to facilitate the screening of the strong sheet substrate, adhesive, and the first flexible circuit board to meet user needs. Here, the flexible circuit board demand data for new energy vehicles may be provided by the user, or at least one of the flexible circuit board demand data for new energy vehicles may be selected according to the above requirements.

[0056] Step 102, determining reinforcement sheet substrate screening data, adhesive screening data, and first flexible circuit board screening data for new energy vehicles according to the flexible circuit board demand data;

[0057] Specifically, in order to adapt to the demand data of flexible circuit boards for new energy vehicles, screening conditions are set for the reinforcing sheet substrate, adhesive and the first flexible circuit board. For example, in a specific embodiment, the screening data for the reinforcing sheet substrate includes: the material is polyimide or polyester film (these materials have high strength, high heat resistance and good flexibility), the shortest length is not less than 350mm, and the total area is not less than 0.12 ; Adhesive screening data include: type is hot melt adhesive, main components are polymer resin, tackifier and antioxidant, etc., bonding strength is greater than 8MPa; The first flexible circuit board screening data for new energy vehicles include: material is copper foil, thickness is less than 0.2mm.

[0058] Step 103 , determining a reinforcing sheet substrate, an adhesive and a first flexible circuit board for a new energy vehicle according to the reinforcing sheet substrate screening data, the adhesive screening data and the first flexible circuit board screening data for a new energy vehicle.

[0059] Specifically, the provided reinforcing sheet substrate, adhesive and first flexible circuit board for new energy vehicles can be screened according to the reinforcing sheet substrate screening data, adhesive screening data and first flexible circuit board screening data for new energy vehicles. If the provided reinforcing sheet substrate meets the reinforcing sheet substrate screening data, the provided reinforcing sheet substrate can be used as the reinforcing sheet substrate for subsequent processing and production; if the provided adhesive meets the adhesive screening data, the provided adhesive can be used as an adhesive for subsequent processing and production; if the provided first flexible circuit board for new energy vehicles meets the first flexible circuit board screening data for new energy vehicles, the provided first flexible circuit board for new energy vehicles can be used as the first flexible circuit board for new energy vehicles for subsequent processing and production. By screening the provided reinforcing sheet substrate, adhesive and first flexible circuit board for new energy vehicles according to the reinforcing sheet substrate screening data, adhesive screening data and first flexible circuit board screening data for new energy vehicles, the user satisfaction and product qualification rate of the final product can be improved. For example, in a specific embodiment, the reinforcing sheet substrate is determined to be made of polyimide material with a size of 500mm×300mm; the components of the determined adhesive include polymer resin, tackifier and antioxidant, and the bonding strength is greater than 10MPa; the first flexible circuit board for new energy vehicles is determined to be a flexible circuit board with a copper foil thickness of 0.1mm.

[0060] In an optional embodiment of the present invention, the reinforcing sheet substrate is pretreated in step 102 to obtain a pretreated reinforcing sheet substrate, including:

[0061] Step 1021, providing a protective film;

[0062] Specifically, the protective film can be a 50 to 80g silicone protective film, which has good adhesion, temperature resistance and weather resistance. The function of the protective film is to protect the reinforcing sheet substrate from being scratched during the subsequent production process, thereby improving the product qualification rate and product performance.

[0063] Step 1022, cleaning the reinforcing sheet substrate to obtain a cleaned reinforcing sheet substrate;

[0064] Specifically, the reinforcing sheet substrate can be soaked in an organic solvent such as ethanol, acetone, etc. for 10 to 15 minutes to remove grease, dust and other stains. Then the soaked reinforcing sheet substrate can be placed in an ultrasonic cleaning machine to remove stains and clean surface stains and tiny particles by using the cavitation effect and acceleration effect of ultrasonic waves in the liquid. Through the above cleaning treatment, the cleanliness of the reinforcing sheet substrate and the accuracy of subsequent installation can be improved, and stains can be prevented from affecting subsequent installation and product performance.

[0065] Step 1023 , laminating the protective film and the cleaned reinforcing sheet substrate according to preset protective film laminating parameters to obtain a pre-treated reinforcing sheet substrate.

[0066] Specifically, the preset protective film laminating parameters may include: laminating speed of 0.5 to 2.0 m / min, laminating pressure of 0.1 to 0.5 MPa, and laminating temperature of 5°C to 40°C. According to the preset protective film laminating parameters, the protective film and the cleaned reinforcing sheet substrate are placed in a laminating device (such as a vacuum laminating machine or a roller laminating machine) for laminating, so that the protective film can be evenly adhered to the surface of the reinforcing sheet substrate, providing protection for the reinforcing sheet substrate and avoiding scratches on the reinforcing sheet substrate in subsequent processes. Here, the preset protective film laminating parameters can be adjusted according to the specific laminating device used to meet the actual situation, ensuring that the protective film can be evenly adhered to the surface of the reinforcing sheet substrate, and the laminating is smooth and free of bubbles.

[0067] In an optional embodiment of the present invention, the adhesive is pretreated in step 102 to obtain a pretreated adhesive, including:

[0068] Step 1024, obtaining preset die-cutting parameters;

[0069] Specifically, the preset die-cutting parameters may include: a small hole diameter of 0.2 to 0.5 mm, a number of positioning holes of 2 to 3, a die-cutting depth of 0.5 to 1.5 mm, and a die-cutting speed of 3 to 30 m / min. The preset die-cutting parameters may be appropriately adjusted according to the thickness of the adhesive and the strength of the carrier material. For example, when the thickness of the adhesive is 0.5 mm and the strength of the carrier material is 50 to 100 MPa, the die-cutting depth is 0.5 to 0.6 mm and the die-cutting speed is 10 to 30 m / min. The die-cutting depth should be ensured to completely cut off the adhesive while avoiding excessive damage to the carrier material.

[0070] Step 1025: according to the preset die-cutting parameters, the adhesive is placed in a die-cutting machine for cutting to obtain a pretreated adhesive.

[0071] Specifically, two or three circular holes with a diameter of 0.2 to 0.5 mm are cut on the carrier film (or paper) as positioning holes, and positioning columns matching the positioning holes are installed at corresponding positions of the die-cutting machine. The adhesive is placed on the carrier film (or paper) and aligned with the positioning holes. The die-cutting machine is started so that the positioning columns accurately cover the positioning holes. The adhesive is cut according to the preset die-cutting shape and size. During the cutting process, the die-cutting machine cuts according to the die-cutting depth and die-cutting speed in the preset die-cutting parameters to avoid unnecessary damage to the adhesive.

[0072] In an optional embodiment of the present invention, pre-processing the first flexible circuit board in step 102 to obtain a second flexible circuit board includes:

[0073] Step 1026, cleaning the first flexible circuit board to obtain a cleaned first flexible circuit board;

[0074] Specifically, a cleaning agent (such as butyrolactone, carboxylic acid chelating agent) or a solvent is used to remove oil, dust and other impurities on the surface of the first flexible circuit board to enhance the adhesion between the subsequent reinforcing sheet substrate and the flexible circuit board; an air gun or a vacuum cleaner or other tool may also be used to further remove tiny particles and dust on the surface of the first flexible circuit board to ensure that the surface of the first flexible circuit board is clean and free of impurities.

[0075] Step 1027, performing surface treatment on the cleaned first flexible circuit board to obtain a surface-treated first flexible circuit board;

[0076] Specifically, the cleaned first flexible circuit board is placed in a processing chamber of a plasma processing device (such as a vacuum type plasma surface treatment device); preset surface treatment parameters such as vacuum degree (5Pa), power (0 to 2000W, 500W in a preferred embodiment), gas composition (argon Ar), gas flow rate (0 to 500SCCM, 200SCCM in a preferred embodiment), time (5 to 30 minutes, 15 minutes in a preferred embodiment) and other parameters are input into the plasma processing device, the device is started, and gas (such as argon, oxygen, etc.) is introduced into the processing chamber, and the gas is activated by heating, impact or electric field to form plasma; the cleaned first flexible circuit board is exposed to the plasma area, and the active particles in the plasma are allowed to react physically and chemically with the surface of the cleaned first flexible circuit board. These reactions include removing surface contaminants, changing surface chemical properties, and increasing surface roughness, thereby making the circuit board surface more active.

[0077] Step 1028 , screening the surface-treated first flexible circuit board according to preset screening conditions to obtain a second flexible circuit board.

[0078] Specifically, after surface treatment of the cleaned first flexible circuit board, the surface treated first flexible circuit board may be roughened to increase the surface area and adhesion points, thereby improving the adhesion of the reinforcing sheet in the subsequent process, which may be achieved by mechanical grinding, chemical etching or laser treatment. The preset screening conditions may include: the circuit board is free of damage and defects, and the first flexible circuit board that meets the preset screening conditions is used as the second flexible circuit board for the subsequent process to improve the product qualification rate and product performance.

[0079] In an optional embodiment of the present invention, step 103 includes:

[0080] Step 1031, obtaining preset lamination parameters and preset lamination method;

[0081] Specifically, the preset lamination parameters may include: a lamination parameter of 120 to 140° C., a lamination speed of 5 to 8 m / min. The preset lamination method may be a thermal lamination method.

[0082] Step 1032: according to the preset lamination method and the preset lamination parameters, the pre-treated reinforcing sheet substrate and the pre-treated adhesive are placed in a laminating machine for lamination to obtain an adhesive-attached reinforcing sheet substrate.

[0083] Specifically, a suitable laminating machine (such as a hot pressing bonding machine, a hot press machine, a vacuum hot press machine, etc.) can be selected according to the preset laminating method, and the preset laminating parameters can be converted into a format recognizable by the laminating machine. The converted preset laminating parameters are input into the laminating machine, so that the laminating machine performs laminating processing on the pre-treated reinforcing sheet substrate and the pre-treated adhesive according to the preset laminating parameters. It should be noted that the side of the pre-treated reinforcing sheet substrate with the protective film faces the laminating machine, and the other side contacts and is pressed with the pre-treated adhesive, which can effectively prevent the pre-treated reinforcing sheet substrate from being scratched, while ensuring the effectiveness of laminating the pre-treated reinforcing sheet substrate and the pre-treated adhesive.

[0084] In an optional embodiment of the present invention, step 104 includes:

[0085] Step 1041, obtaining preset cutting parameters and transfer parameters;

[0086] Specifically, the preset cutting parameters can be set according to the selected cutting equipment. The cutting equipment in this embodiment is a laser cutting machine, and the corresponding preset cutting parameters may include: laser power of 200W, cutting speed of 10 mm per second, focus position of 0.5 mm from the surface of the adhesive reinforcing sheet substrate, auxiliary gas of nitrogen, flow rate of 10 liters per minute, cutting path of continuous cutting along the edge of the adhesive reinforcing sheet substrate, etc. The preset cutting parameters can not only achieve fast cutting and precise cutting, but also keep the cutting surface flat, improve production efficiency while ensuring cutting quality, and use auxiliary gas to help cutting. The auxiliary gas can blow away the heat and smoke generated by cutting, and protect the cutting surface from oxidation. In this embodiment, the auxiliary gas is nitrogen, and the flow rate is 10 liters per minute to ensure the cleanliness and flatness of the cutting surface. In this embodiment, the cutting path is continuous cutting along the edge of the adhesive reinforcing sheet substrate to ensure that the reinforcing sheet after cutting has a regular shape and accurate size. The transfer parameters include the type of transfer medium. The transfer parameters in this embodiment include 3 to 5 g of acrylic film. The transfer parameters are for transferring the reinforcing sheet to the transfer medium for storage and subsequent use.

[0087] Step 1042, cutting the adhesive reinforcement sheet substrate according to the preset cutting parameters to obtain a first reinforcement sheet;

[0088] Specifically, the preset cutting parameters can be converted into control parameters that can be recognized by the laser cutting machine, and then the control parameters can be input into the laser cutting machine, so that the laser cutting machine cuts the adhesive reinforcement sheet substrate according to the preset cutting parameters to obtain a first reinforcement sheet that meets the required size (such as length, width, thickness, etc.) and shape.

[0089] Step 1043, screening the first reinforcing sheet according to a preset reinforcing sheet screening condition to obtain a second reinforcing sheet;

[0090] Specifically, the preset reinforcing sheet screening conditions may include: preset length, preset width, preset thickness, preset shape, flatness, no burrs, etc. The first reinforcing sheet is screened according to the preset reinforcing sheet screening conditions. If the length of the first reinforcing sheet meets the preset length in the preset reinforcing sheet screening conditions, the width of the first reinforcing sheet meets the preset width in the preset reinforcing sheet screening conditions, the thickness of the first reinforcing sheet meets the preset thickness in the preset reinforcing sheet screening conditions, the shape of the first reinforcing sheet meets the preset shape in the preset reinforcing sheet screening conditions, and the first reinforcing sheet is flat and has no burrs, then the first reinforcing sheet can be used as the second reinforcing sheet for subsequent processing. The purpose of screening the first reinforcing sheet is to avoid the subsequent process of the problematic or unqualified first reinforcing sheet, so as to improve production efficiency and product quality.

[0091] Step 1044: perform transfer processing on the second reinforcing sheet according to the transfer parameters to obtain a target reinforcing sheet.

[0092] Specifically, the second reinforcing sheet is transferred to a 3 to 5 g acrylic film and rolled up with a 25 UM isolation film to prevent scratches on the surface and poor appearance. The second reinforcing sheet is transferred to a transfer medium and stored as a target reinforcing sheet to prevent scratches on the reinforcing sheet and affect the appearance. The second reinforcing sheet is rolled up to obtain a target reinforcing sheet, which is convenient for carrying and storing the target reinforcing sheet and is also convenient for subsequent use, thereby improving production efficiency.

[0093] In an optional embodiment of the present invention, step 105 includes:

[0094] Step 1051, positioning the second flexible circuit board to obtain a second flexible circuit board with positioning marks;

[0095] Specifically, the second flexible circuit board can be positioned according to a preset position, and a positioning mark can be made on the second flexible circuit board to facilitate subsequent installation of the reinforcing sheet on the second flexible circuit board according to the positioning mark, thereby improving production efficiency and the accuracy of reinforcing sheet installation.

[0096] Step 1052 , according to preset installation parameters, the target reinforcement sheet is installed on the second flexible circuit board with the positioning mark to obtain a target flexible circuit board for new energy vehicles.

[0097] Specifically, the preset installation parameters may include a pressure of 10 to 100 psi, a temperature of 80 to 180°C, and a time of 10 to 40 minutes. The target reinforcement sheet is placed at the positioning mark on the second flexible circuit board with the positioning mark. The lamination equipment presses the target reinforcement sheet and the second flexible circuit board with the positioning mark according to the above preset installation parameters. The target reinforcement sheet is firmly combined with the second flexible circuit board with the positioning mark through the adhesive on the target reinforcement sheet to obtain the target flexible circuit board for new energy vehicles.

[0098] In an optional embodiment of the present invention, the method further comprises:

[0099] Step 106, obtaining preset test conditions;

[0100] Specifically, the preset test conditions include a test method and a test type. In a specific embodiment, the preset test conditions include:

[0101] Appearance inspection: check whether there are scratches, stains, bubbles and other defects on the surface of the target flexible circuit board used in new energy vehicles, and check whether the reinforcement sheet is firmly attached to the second flexible circuit board without falling off or warping.

[0102] Electrical performance test: Use a continuity tester to detect the continuity between the lines on the target flexible circuit board used in new energy vehicles to ensure that there is no open circuit or short circuit.

[0103] Insulation resistance test: Use an insulation resistance meter to test the insulation resistance value between each line on the target flexible circuit board used in new energy vehicles to ensure that it meets the preset safety standards.

[0104] The withstand voltage test applies high voltage according to the preset pressure to detect whether the insulation performance of the target flexible circuit board used in new energy vehicles is good under high voltage conditions.

[0105] Mechanical performance tests, such as bending test: repeatedly bending the target flexible circuit board for new energy vehicles to check whether the reinforcing sheet falls off or whether the target flexible circuit board for new energy vehicles is broken; such as tensile test: measuring the mechanical strength of the target flexible circuit board for new energy vehicles under preset tensile conditions to ensure that it will not be damaged when subjected to a certain tensile force; peel strength test: testing the adhesion between the reinforcing sheet and the second flexible circuit board to ensure that the reinforcing sheet will not fall off easily;

[0106] Environmental adaptability tests, such as high temperature test: placing the target flexible circuit board for new energy vehicles in a high temperature environment to check whether its performance has changed; such as low temperature test: placing the target flexible circuit board for new energy vehicles in a low temperature environment to check whether it can work normally under low temperature conditions; such as wet heat test: placing the target flexible circuit board for new energy vehicles in a high humidity and high temperature environment to check its corrosion resistance; such as salt spray test: placing the target flexible circuit board for new energy vehicles in a salt spray environment to check its resistance to salt spray corrosion.

[0107] Reliability tests, such as vibration tests: simulating the vibration environment that new energy vehicles may encounter during driving, and checking the structural integrity and performance stability of the target flexible circuit boards used in new energy vehicles; such as impact tests: simulating the impact environment of new energy vehicles in extreme situations such as collision or falling, and checking the impact resistance of the target flexible circuit boards used in new energy vehicles.

[0108] Step 107, testing the target flexible circuit board for the new energy vehicle according to the preset test conditions to obtain a test result;

[0109] Specifically, the target flexible circuit board for new energy vehicles is tested according to the above test method, and the test conditions, test results, etc. are recorded as test results. For example, the test results of the appearance inspection of the target flexible circuit board for new energy vehicles may include: appearance inspection, the surface of the target flexible circuit board for new energy vehicles has no scratches, stains, bubbles and other defects, and the reinforcing sheet is firmly attached without falling off or warping. It is convenient to screen qualified flexible circuit boards according to the test results in the future, and improve the screening efficiency.

[0110] Step 108 , screening the target flexible circuit boards for new energy vehicles according to preset qualification conditions and the test results to obtain qualified flexible circuit boards for new energy vehicles.

[0111] Specifically, the preset qualified conditions can be set corresponding to the preset test conditions. For example, if the preset test conditions include appearance inspection, the preset qualified conditions include appearance qualified conditions, such as the flexible circuit board surface has no scratches, stains, bubbles and other defects, the reinforcing sheet is firmly attached, and there is no falling off or warping. If the appearance inspection result in the test result is consistent with the appearance qualified condition in the preset qualified condition, the corresponding target flexible circuit board for new energy vehicles is determined as a qualified flexible circuit board for new energy vehicles. In this embodiment, only appearance inspection is taken as an example, and other inspection or test methods are similar, which will not be repeated here.

[0112] A specific embodiment of the method for preparing a flexible circuit board for a new energy vehicle according to an embodiment of the present invention includes:

[0113] Step 111, providing a reinforcing sheet substrate, an adhesive, and a first flexible circuit board for a new energy vehicle;

[0114] According to the demand data of flexible circuit boards for new energy vehicles, the screening data of reinforcement sheet substrates, adhesives and the first flexible circuit boards for new energy vehicles are determined, and then the reinforcement sheet substrates, adhesives and the first flexible circuit boards for new energy vehicles that meet the demand are screened out.

[0115] Step 112, preprocessing;

[0116] After cleaning the reinforcing sheet substrate, a protective film is laminated on the reinforcing sheet substrate according to preset protective film laminating parameters, and the protective film provides protection for the reinforcing sheet substrate to prevent the reinforcing sheet substrate from being scratched in subsequent processes. According to preset die-cutting parameters, the adhesive is placed in a die-cutting machine for cutting; the first flexible circuit board is cleaned, surface treated and screened to obtain a second flexible circuit board that meets the preset screening conditions.

[0117] Step 113, laminating the pretreated reinforcing sheet substrate and the pretreated adhesive;

[0118] According to the preset laminating parameters and the preset laminating method, the laminating machine performs laminating treatment on the pre-treated reinforcing sheet substrate and the pre-treated adhesive, so that the pre-treated reinforcing sheet substrate and the pre-treated adhesive are combined together.

[0119] Step 114, cutting the adhesive reinforcement sheet substrate;

[0120] Specifically, the preset cutting parameters are converted into control parameters that can be recognized by the laser cutting machine, and then the control parameters are input into the laser cutting machine, so that the laser cutting machine cuts the adhesive reinforcement sheet substrate according to the preset cutting parameters to obtain a first reinforcement sheet that meets the requirements. The first reinforcement sheet is screened according to the preset reinforcement sheet screening conditions to obtain a second reinforcement sheet. The second reinforcement sheet is then transferred to a 3 to 5g acrylic adhesive film, and a 25UM isolation film is added to roll it up for easy storage, storage and use, and to prevent surface scratches and poor appearance.

[0121] Among them, the laser cutting machine can identify the control parameter of laser power as the percentage of laser power in the preset cutting parameters, which can be The laser power in the preset cutting parameters is converted into a laser power control parameter that can be recognized by the laser cutting machine, where P is the laser power control parameter that can be recognized by the laser cutting machine. For the laser power in the preset cutting parameters, It is the maximum laser power of the laser cutting machine.

[0122] according to Adjust the cutting speed in the preset cutting parameters, where V is the cutting speed control parameter that the laser cutting machine can identify. is the cutting speed in the preset cutting parameters, and k is the preset speed coefficient, which can be adjusted according to the thickness of the adhesive reinforcement sheet substrate. For example, if the thickness of the adhesive reinforcement sheet substrate is 0.5mm, the coefficient can be adjusted to 1, indicating that the cutting speed in the preset cutting parameters is the same as the maximum cutting speed of the laser cutting machine; if the thickness of the adhesive reinforcement sheet substrate is 10mm, the coefficient can be adjusted to 0.6 or 0.7, indicating that the preset speed needs to be reduced to ensure the cutting quality.

[0123] according to Adjust the auxiliary gas flow rate in the preset cutting parameters, where M is the auxiliary gas flow rate control parameter that can be recognized by the laser cutting machine (the gas supply system of the laser cutting machine). is the auxiliary gas flow rate in the preset cutting parameters, h is the preset flow coefficient, h can be determined according to the material of the adhesive reinforcement sheet substrate and the type of auxiliary gas. For example, if the type of auxiliary gas is nitrogen and the material of the adhesive reinforcement sheet substrate is stainless steel, h can be set to 1, indicating that the gas supply system of the laser cutting machine can accept the auxiliary gas flow rate in the preset cutting parameters.

[0124] according to Adjust the focus position in the preset cutting parameters, where F is the focus position control parameter that can be recognized by the laser cutting machine. is the focal position in the preset cutting parameters, is the adjustment amount, which means to move the focus slightly away from the nozzle to adjust the thickness of the adhesive reinforcement sheet substrate. For example, if the thickness of the adhesive reinforcement sheet substrate is 1mm, then Set to 2mm.

[0125] The above-mentioned preset cutting parameters and the conversion of the preset cutting parameters into control parameters that can be recognized by the laser cutting machine fully consider the material, thickness and actual conditions of the cutting equipment of the adhesive reinforcement sheet substrate being cut, which is not only conducive to improving the cutting accuracy, but also improving the cutting efficiency and product qualification rate.

[0126] Step 115 , obtaining a target flexible circuit board for new energy vehicles according to the target reinforcing sheet and the second flexible circuit board.

[0127] The second flexible circuit board can be positioned in the following manner: capturing an image of the second flexible circuit board; denoising the image of the second flexible circuit board to obtain a denoised image; extracting feature points from the denoised image to obtain feature point data (the feature point data can be extracted using edge detection); determining the installation position of the reinforcement sheet based on the feature point data (the feature point data can be matched with a preset template to obtain a matching feature point pair, calculating the offset between the feature point data and the position of the reinforcement sheet in the preset template, such as a translation offset or a rotation offset, and applying the offset to the position of the reinforcement sheet in the preset template to obtain an accurate installation position of the reinforcement sheet); positioning the second flexible circuit board based on the installation position of the reinforcement sheet to obtain a second flexible circuit board with a positioning mark.

[0128] After positioning the second flexible circuit board, the target reinforcing sheet is installed on the second flexible circuit board with the positioning mark according to preset installation parameters to obtain the target flexible circuit board for new energy vehicles.

[0129] Step 116, obtaining qualified products after testing.

[0130] The target flexible circuit board for new energy vehicles is tested according to preset test conditions, and then the target flexible circuit board for new energy vehicles is screened according to preset qualified conditions and test results to obtain qualified flexible circuit boards for new energy vehicles.

[0131] The method for preparing a flexible circuit board for new energy vehicles proposed in an embodiment of the present invention prevents the reinforcing sheet from being scratched and affecting the appearance in subsequent processes by providing a protective film on the reinforcing sheet substrate, thereby avoiding poor performance problems and being conducive to improving the product's qualification rate and performance.

[0132] An embodiment of the present invention further provides a flexible circuit board for a new energy vehicle, and the flexible circuit board for a new energy vehicle is prepared by the method for preparing a flexible circuit board for a new energy vehicle as described in any one of the above embodiments.

[0133] The flexible circuit board for new energy vehicles in the embodiment of the present invention is prepared by adopting the preparation method of the flexible circuit board for new energy vehicles as described in any one of the above embodiments. It not only has a good appearance, but also has the performance that can meet the expected requirements, and has the advantages of saving costs and improving safety.

[0134] It should be noted that in the device / method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present invention. In addition, the steps of performing the above series of processes can naturally be performed in chronological order according to the order of description, but do not necessarily need to be performed in chronological order. Some steps can be performed in parallel, crosswise or independently of each other.

[0135] It should be noted that, in the above-mentioned embodiments, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include one..." do not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the implementation of the above-mentioned embodiments is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0136] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for preparing a flexible circuit board for new energy vehicles, characterized in that: include: Provides reinforcing sheet substrates, adhesives and the first flexible circuit board for new energy vehicles; Pre-treating the reinforcing sheet substrate, the adhesive and the first flexible circuit board respectively to obtain a pre-treated reinforcing sheet substrate, a pre-treated adhesive and a second flexible circuit board; The pre-treated reinforcing sheet substrate and the pre-treated adhesive are pressed together to obtain an adhesive-attached reinforcing sheet substrate; Cutting the adhesive reinforcement sheet substrate to obtain a target reinforcement sheet; According to the target reinforcing sheet and the second flexible circuit board, a target flexible circuit board for new energy vehicles is obtained.

2. The method for preparing a flexible circuit board for new energy vehicles according to claim 1, characterized in that: Provides reinforcing sheet substrates, adhesives and the first flexible circuit board for new energy vehicles, including: Obtain demand data for flexible circuit boards for new energy vehicles; Determine, according to the flexible circuit board demand data, reinforcement sheet substrate screening data, adhesive screening data, and first flexible circuit board screening data for new energy vehicles; According to the reinforcing sheet substrate screening data, the adhesive screening data and the first flexible circuit board screening data for new energy vehicles, the reinforcing sheet substrate, the adhesive and the first flexible circuit board for new energy vehicles are determined.

3. The method for preparing a flexible circuit board for new energy vehicles according to claim 1, characterized in that: The reinforcing sheet substrate is pretreated to obtain a pretreated reinforcing sheet substrate, comprising: Provide protective film; Cleaning the reinforcing sheet substrate to obtain a cleaned reinforcing sheet substrate; According to preset protective film lamination parameters, the protective film and the cleaned reinforcing sheet substrate are laminated to obtain a pre-treated reinforcing sheet substrate.

4. The method for preparing a flexible circuit board for new energy vehicles according to claim 1, characterized in that: The adhesive is pretreated to obtain a pretreated adhesive, comprising: Get preset die-cutting parameters; According to the preset die-cutting parameters, the adhesive is placed in a die-cutting machine for cutting to obtain a pretreated adhesive.

5. The method for preparing a flexible circuit board for new energy vehicles according to claim 1, characterized in that: Preprocessing the first flexible circuit board to obtain a second flexible circuit board includes: Cleaning the first flexible circuit board to obtain a cleaned first flexible circuit board; Performing surface treatment on the cleaned first flexible circuit board to obtain a surface-treated first flexible circuit board; The surface-treated first flexible circuit board is screened according to preset screening conditions to obtain a second flexible circuit board.

6. The method for preparing a flexible circuit board for new energy vehicles according to claim 1, characterized in that: The pre-treated reinforcing sheet substrate and the pre-treated adhesive are pressed together to obtain an adhesive-attached reinforcing sheet substrate, comprising: Obtaining preset pressing parameters and preset pressing methods; According to the preset lamination method and the preset lamination parameters, the pretreated reinforcing sheet substrate and the pretreated adhesive are placed in a laminating machine for lamination treatment to obtain an adhesive-attached reinforcing sheet substrate.

7. The method for preparing a flexible circuit board for new energy vehicles according to claim 1, characterized in that: The adhesive reinforcement sheet substrate is cut to obtain a target reinforcement sheet, comprising: Get preset cutting parameters and transfer parameters; Cutting the adhesive reinforcement sheet substrate according to the preset cutting parameters to obtain a first reinforcement sheet; Screening the first reinforcing sheet according to a preset reinforcing sheet screening condition to obtain a second reinforcing sheet; The second reinforcing sheet is transferred according to the transfer parameters to obtain a target reinforcing sheet.

8. The method for preparing a flexible circuit board for new energy vehicles according to claim 1, characterized in that: According to the target reinforcing sheet and the second flexible circuit board, a target flexible circuit board for new energy vehicles is obtained, including: Performing positioning processing on the second flexible circuit board to obtain a second flexible circuit board with a positioning mark; According to preset installation parameters, the target reinforcement sheet is installed on the second flexible circuit board with positioning marks to obtain a target flexible circuit board for new energy vehicles.

9. The method for preparing a flexible circuit board for new energy vehicles according to claim 1, characterized in that: Also includes: Get preset test conditions; Testing the target flexible circuit board for the new energy vehicle according to the preset test conditions to obtain a test result; The target flexible circuit board for the new energy vehicle is screened according to the preset qualification conditions and the test results to obtain a qualified flexible circuit board for the new energy vehicle.

10. A flexible circuit board for new energy vehicles, characterized in that: The flexible circuit board for new energy vehicles is prepared by the method for preparing a flexible circuit board for new energy vehicles as claimed in any one of claims 1 to 9.

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