Annular semiconductor refrigeration structure

Abstract

An annular semiconductor refrigeration structure relates to the technical field of semiconductor refrigeration and comprises a cold end insulating tube, a hot end insulating tube and a tubular refrigeration body. The refrigeration body is sleeved with a cold-end insulating tube, and a hot-end insulating tube is inserted into the refrigeration body; the refrigerating body comprises a plurality of refrigerating units which are sequentially arranged at intervals, and each refrigerating unit comprises an annular N-type thermoelectric arm and an annular P-type thermoelectric arm which are arranged at intervals in a crossed mode; the outer walls of the annular N-type thermoelectric arm and the annular P-type thermoelectric arm of the same refrigeration unit are conductively communicated through a conductive sleeve, and an insulating pad is arranged between the annular N-type thermoelectric arm and the annular P-type thermoelectric arm in the conductive sleeve; in two adjacent refrigeration units, the annular P-type thermoelectric arm of one refrigeration unit is conductively communicated with the inner hole wall of the other annular N-type thermoelectric arm through a conductive tube; the mold is high in structural strength and easy to assemble, a refrigerating body with the diameter being about 1 mm can be produced, and therefore the application scene is greatly expanded.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor refrigeration, and in particular to an annular semiconductor refrigeration structure. Background Art

[0002] Semiconductor coolers are composed of multiple pairs of N-type and P-type semiconductor materials. Each pair of N-type and P-type semiconductor materials is connected by a metal sheet to form a thermocouple. There are no moving parts inside the thermoelectric cooler, but the transfer of heat energy is achieved through the direct action of electrical energy. It has been widely favored in application fields that require precise temperature control and equipment cooling. However, existing semiconductor coolers are mostly flat or block structures, which have great limitations on application scenarios.

[0003] A Chinese patent (publication number: CN113193104A) discloses a semiconductor heat pipe with a fan-shaped thermoelectric arm structure and a preparation method thereof; the patent includes an inner insulating heat pipe, an outer insulating heat pipe, a PN electric couple formed by a P-type semiconductor crystal and an N-type semiconductor crystal, and a heat conducting metal sheet formed by an upper side guide metal sheet and a lower side guide metal sheet; the P-type semiconductor crystal and the N-type semiconductor crystal are both fan-shaped, and the upper side guide metal sheet is connected to the outer insulating heat pipe through the P-type semiconductor crystal and the N-type semiconductor crystal; the lower side guide metal sheet is connected to the inner insulating heat pipe together with the P-type semiconductor crystal and the N-type semiconductor crystal; the patent forms a semiconductor heat pipe with a tubular structure, overcoming the problem that the existing thermoelectric cooler can only be made into a block structure; however, the P-type semiconductor crystal and the N-type semiconductor crystal in the patent are arranged in a ring direction along the inner insulating heat pipe, so that it cannot be made into a thinner linear structure, and the processing difficulty is large, and the production cost is high.

[0004] A Chinese patent (publication number: CN101556094A) discloses a semiconductor refrigeration element and a semiconductor refrigeration system; the semiconductor refrigeration element of the patent is cylindrical, with a through hole in the middle of the cylinder, one end of the electric couple pair is arranged inside the through hole, and the other end of the electric couple pair is arranged on the outer surface of the cylinder. The patent also arranges P-type semiconductor grains and N-type semiconductor grains in a circumferential direction to finally form a columnar structure with a through hole in the middle. Due to the volume and assembly process of P-type semiconductor grains and N-type semiconductor grains, it is also impossible to make a thinner columnar structure, and the overall structural strength is weak and the reliability is poor. Summary of the invention

[0005] In order to overcome the deficiencies in the background technology, the present invention discloses an annular semiconductor refrigeration structure.

[0006] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme: A ring-shaped semiconductor refrigeration structure comprises a cold end insulating tube, a hot end insulating tube and a tubular refrigeration body; the outer sleeve of the refrigeration body is provided with a cold end insulating tube, and the hot end insulating tube is inserted inside; the refrigeration body comprises a plurality of refrigeration units arranged in sequence at intervals, and the refrigeration units comprise ring-shaped N-type thermoelectric arms and ring-shaped P-type thermoelectric arms arranged crosswise at intervals; the outer walls of the ring-shaped N-type thermoelectric arms and the ring-shaped P-type thermoelectric arms of the same refrigeration unit are conductively connected through a conductive sleeve, and an insulating pad is provided between the corresponding ring-shaped N-type thermoelectric arms and the ring-shaped P-type thermoelectric arms in the conductive sleeve; in two adjacent refrigeration units, the ring-shaped P-type thermoelectric arm of one refrigeration unit is conductively connected with the inner hole wall of the other ring-shaped N-type thermoelectric arm through a conductive tube, and an insulating ring is provided on the tube body between the corresponding ring-shaped N-type thermoelectric arm and the ring-shaped P-type thermoelectric arm of the conductive tube.

[0007] Preferably, a heat dissipation device is inserted into the hot end insulation tube.

[0008] Preferably, the heat dissipation device is a ventilation pipe or a water cooling pipe.

[0009] Preferably, the heat dissipation device is a heat conducting rod with heat dissipation fins at one end.

[0010] Preferably, the heat dissipation device is a heat pipe whose closed end is inserted into the hot end insulating tube, and the heat pipe contains a heat pipe medium; one end of the heat pipe extending out of the hot end insulating tube is connected to a heat dissipation housing.

[0011] Preferably, the heat pipe medium is a mixed liquid of one or more of ionized water, methanol, alcohol, acetone, and heat transfer oil.

[0012] Preferably, the heat dissipation housing is a flat plastic bag.

[0013] Preferably, the heat dissipation housing is filled with metal wires.

[0014] Preferably, the cold end insulation tube is a ceramic tube.

[0015] The method for preparing an annular semiconductor refrigeration structure comprises the following steps: S1. A conductive sleeve is disposed on the outer surface of a ring-shaped N-type thermoelectric arm, an insulating pad is inserted into the conductive sleeve, and then a ring-shaped P-type thermoelectric arm is inserted, so that the ring-shaped N-type thermoelectric arm and the ring-shaped P-type thermoelectric arm are both electrically conductive and fixedly connected to the conductive sleeve; S2, inserting one end of a conductive tube into the inner hole of the annular P-type thermoelectric arm of step S1, and making the conductive tube and the annular P-type thermoelectric arm conductive and fixedly connected; inserting an insulating ring into the body of the conductive tube, and then sleeved an annular N-type thermoelectric arm, and making the annular N-type thermoelectric arm and the conductive tube conductive and fixedly connected; S3, repeating the operations of steps S1 to S2 on the basis of the annular N-type thermoelectric arm added in step S2 to form a refrigeration body until the refrigeration body reaches the designed length; S4. Insert the hot end insulating tube into the refrigeration body and install the cold end insulating tube outside the refrigeration body.

[0016] Due to the adoption of the above-mentioned technical solution, the present invention has the following beneficial effects: The annular semiconductor refrigeration structure disclosed in the present invention has a simple structure and is easy to assemble. Since the annular N-type thermoelectric arm and the annular P-type thermoelectric arm are both annular structures, the difficulty of assembly can be effectively reduced, so that a refrigeration body with a diameter of about 1 mm can be produced, thereby greatly expanding the application scenarios; The insulating pad is tightly mounted on the inner hole of the conductive sleeve, and the annular N-type thermoelectric arm and the annular P-type thermoelectric arm at both ends of the insulating pad are tightly in contact with the insulating pad. The insulating pad provides support for the conductive sleeve while playing an insulating role, thereby improving the structural strength of the conductive sleeve; the insulating ring is tightly mounted on the conductive tube, and the annular N-type thermoelectric arm and the annular P-type thermoelectric arm at both ends of the insulating ring are tightly in contact with the insulating ring, which can prevent the conductive sleeve from accidentally bending during assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 is a schematic diagram of the structure of a first heat dissipation device; Figure 3 is a schematic diagram of the structure of a second heat dissipation device; Figure 4 Schematic diagram of the structure of the third heat dissipation device.

[0018] In the figure: 1. cold end insulating tube; 2. hot end insulating tube; 3. refrigeration body; 3-1. annular N-type thermoelectric arm; 3-2. annular P-type thermoelectric arm; 3-3. conductive sleeve; 3-4. conductive tube; 3-5. insulating pad; 3-6. insulating ring; 4. heat dissipation device; 4-1. heat pipe; 4-2. heat pipe medium; 4-3. heat dissipation shell; 4-4. metal wire. DETAILED DESCRIPTION

[0019] The present invention can be explained in detail through the following embodiments. The purpose of disclosing the present invention is to protect all technical improvements within the scope of the present invention. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", etc. indicating directions or positional relationships, they only correspond to the drawings of the present application for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction.

[0020] Embodiment 1, in combination with Figure 1A ring-shaped semiconductor refrigeration structure comprises a cold-end insulating tube 1, a hot-end insulating tube 2 and a tubular refrigeration body 3; the cold-end insulating tube 1 is sleeved on the outside of the refrigeration body 3, and the hot-end insulating tube 2 is inserted inside; the three-layer structure of the hot-end insulating tube 2, the refrigeration body 3 and the cold-end insulating tube 1 can effectively ensure the overall structural strength and avoid accidental bending; according to needs, the cold-end insulating tube 2 is a ceramic tube, and the ceramic tube must have good thermal conductivity and insulation properties, such as silicon carbide ceramic tube, silicon nitride ceramic tube or alumina ceramic tube, these ceramic tubes not only have good thermal conductivity and insulation properties, but also can enhance the overall structural strength to prevent the refrigeration body 3 from accidentally bending and failing to operate normally.

[0021] The refrigeration body 3 includes a plurality of refrigeration units arranged in sequence at intervals, and the refrigeration unit includes annular N-type thermoelectric arms 3-1 and annular P-type thermoelectric arms 3-2 arranged at intervals and crosses; the outer walls of the annular N-type thermoelectric arms 3-1 and the annular P-type thermoelectric arms 3-2 of the same refrigeration unit are conductively connected through a conductive sleeve 3-3, and an insulating pad 3-5 is provided between the corresponding annular N-type thermoelectric arms 3-1 and the annular P-type thermoelectric arms 3-2 in the conductive sleeve 3-3, and the insulating pad 3-5 can prevent the annular N-type thermoelectric arms 3-1 and the annular P-type thermoelectric arms 3-2 of the same refrigeration unit from accidentally directly contacting each other during assembly or later use, thereby preventing a short circuit; It should be noted that in order to reduce the gap between the outer wall of the refrigeration body 3 and the inner wall of the cold end insulation tube 1, the conductive sleeve 3-3 adopts a thin-walled tube structure with a wall thickness of 0.05mm to 0.5mm; the insulating pad 3-5 is tightly set with the inner hole of the conductive sleeve 3-3, and the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 at both ends of the insulating pad 3-5 are tightly in contact with the insulating pad 3-5. The insulating pad 3-5 provides support for the conductive sleeve 3-3 while playing an insulating role, thereby improving the structural strength of the conductive sleeve 3-3; It should be noted that the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 can achieve conductive connection after being tightly plugged with the conductive sleeve 3-3. In order to further improve reliability, the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 are tightly plugged with the conductive sleeve 3-3 and then connected by conductive adhesive bonding or soldering; In two adjacent refrigeration units, the annular P-type thermoelectric arm 3-2 of one refrigeration unit is electrically connected to the inner hole wall of the other annular N-type thermoelectric arm 3-1 through a conductive tube 3-4, and the conductive tube 3-4 is provided with an insulating ring 3-6 corresponding to the tube body between the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2. The insulating ring 3-6 can prevent the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 in the two adjacent refrigeration units from accidentally directly contacting each other during the assembly process or the later use process, thereby causing a short circuit; It should be noted that in order to reduce the gap between the inner wall of the refrigeration body 3 and the outer wall of the hot end insulation tube 2, the conductive tube 3-4 adopts a thin-walled tube structure with a wall thickness of 0.05mm to 0.5mm; the insulating ring 3-6 is tightly sleeved with the conductive tube 3-4, and the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 at both ends of the insulating ring 3-6 are tightly in contact with the insulating ring 3-6, which can prevent the conductive sleeve 3-3 from being accidentally bent during the assembly process; It should be noted that the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 can achieve conductive connection after being tightly fitted with the conductive tube 3-4. In order to further improve reliability, the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 are tightly fitted with the conductive tube 3-4 and then connected by conductive adhesive bonding or soft soldering.

[0022] When in use, the power supply is connected to the cooling body 3 according to the existing wiring method of the refrigeration semiconductor, and the heat dissipation component for dissipating the heat for the flexible cooling body 3 is inserted into the hot end flexible insulating tube 2, so that the refrigeration function of the cooling body 3 can be utilized; it should be noted that since the annular N-type thermoelectric arm 3-1 and the annular P-type thermoelectric arm 3-2 are both in a ring structure, the difficulty of assembly can be effectively reduced, so that a cooling body 3 with a diameter of about 1 mm can be produced, thereby greatly expanding the application scenarios.

[0023] The method for preparing an annular semiconductor refrigeration structure comprises the following steps: S1. A conductive sleeve 3-3 is disposed on the outer sleeve of a ring-shaped N-type thermoelectric arm 3-1, an insulating pad 3-5 is inserted into the conductive sleeve 3-3, and then a ring-shaped P-type thermoelectric arm 3-2 is inserted, so that the ring-shaped N-type thermoelectric arm 3-1 and the ring-shaped P-type thermoelectric arm 3-2 are both conductive and fixedly connected to the conductive sleeve 3-3; S2, insert one end of a conductive tube 3-4 into the inner hole of the annular P-type thermoelectric arm 3-2 of step S1, and make the conductive tube 3-4 and the annular P-type thermoelectric arm 3-2 conductive and fixedly connected; insert an insulating ring 3-6 into the body of the conductive tube 3-4, and then sleeve an annular N-type thermoelectric arm 3-1, and make the annular N-type thermoelectric arm 3-1 and the conductive tube 3-4 conductive and fixedly connected; S3, repeating the operations of steps S1 to S2 on the basis of the annular N-type thermoelectric arm 3-1 added in step S2 to form a refrigeration body 3 until the refrigeration body 3 reaches the designed length; S4. Insert the hot end insulating tube 2 into the refrigeration body 3, and install the cold end insulating tube 1 outside the refrigeration body 3.

[0024] Embodiment 2: In order to ensure the normal operation of the annular semiconductor refrigeration structure, a heat dissipation device 4 is inserted into the hot end insulating tube 2.

[0025] The heat dissipation device 4 can adopt a variety of different structures according to different usage scenarios, which are as follows: The first type: the heat dissipation device 4 is a ventilation pipe or a water cooling pipe, such as Figure 2 As shown; when a ventilation pipe is used, the ventilation pipe can be inserted into the hot-end insulating pipe 2, and a fan is connected to one end of the ventilation pipe. Cold air is sent into the ventilation pipe through the fan, and the cold air exchanges heat with the ventilation pipe, and the ventilation pipe exchanges heat with the hot-end insulating pipe 2, so as to achieve the purpose of heat dissipation for the hot end of the refrigeration body 3; when a water-cooling pipe is used, a water-cooling pipe can be inserted into the hot-end insulating pipe 2, so that the water-cooling pipe is connected to the circulating pump machine to cool the circulating water, the cooling circulating water exchanges heat with the water-cooling pipe, and the water-cooling pipe exchanges heat with the hot-end insulating pipe 2, so as to achieve the purpose of heat dissipation for the hot end of the refrigeration body 3.

[0026] The second type: the heat dissipation device 4 is a heat conducting rod with a heat dissipation fin at one end, such as Figure 3 As shown, the heat dissipation device 4 does not require an additional power source. It exchanges heat with the hot end insulating tube 2 through the heat conducting rod to transfer heat to the heat dissipation fins. The heat dissipation fins exchange heat with the air and cool naturally, thereby achieving the purpose of dissipating heat for the hot end of the refrigeration body 3. The heat dissipation fins are copper fins, aluminum fins or steel fins. Copper fins are preferred because of their superior heat dissipation performance.

[0027] The third type: the heat dissipation device 4 comprises a heat pipe 4-1 with a closed end inserted into the hot end insulating tube 2, and the heat pipe 4-1 contains a heat pipe medium 4-2, such as Figure 4 As shown; the heat pipe medium 4-2 is a mixed liquid of one or more of ionized water, methanol, alcohol, acetone, and heat transfer oil; one end of the heat pipe 4-1 extending from the hot end insulation tube 2 is connected to a heat dissipation shell 4-3; that is, the existing heat pipe technology is used to dissipate heat for the refrigeration body 3, and the heat pipe medium 4-2 in the heat pipe 4-1 absorbs the heat generated by the refrigeration body 3 and evaporates, and enters the heat dissipation shell 4-3, is cooled and liquefied in the heat dissipation shell 4-3, and then returns to the heat pipe 4-1 along the tube core of the heat pipe 4-1, and the cycle is repeated to achieve the purpose of dissipating heat for the refrigeration body 3; it should be noted that the heat dissipation device 4 also does not need to add an additional power source; The heat dissipation shell 4-3 is a flat plastic bag that occupies a small volume; the heat dissipation shell 4-3 is filled with metal wires 4-4, which can improve the heat dissipation effect and accelerate the cooling and liquefaction of the heat pipe medium 4-2 on the one hand, and on the other hand, the metal wires 4-4 can extend into the heat pipe 4-1, thereby playing a drainage role, so that the liquefied heat pipe medium 4-2 can quickly flow back into the heat pipe 4-1.

[0028] The parts of the present invention that are not described in detail are prior art. It is obvious to those skilled in the art that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and it is intended that all changes that fall within the meaning and scope of equivalent elements are included in the present invention.

Claims

1. A ring-shaped semiconductor refrigeration structure, characterized in that: The invention comprises a cold end insulating tube (1), a hot end insulating tube (2) and a tubular refrigeration body (3); the cold end insulating tube (1) is provided on the outside of the refrigeration body (3), and the hot end insulating tube (2) is inserted inside; the refrigeration body (3) comprises a plurality of refrigeration units arranged in sequence at intervals, and the refrigeration units comprise annular N-type thermoelectric arms (3-1) and annular P-type thermoelectric arms (3-2) arranged in an intersecting manner; the outer walls of the annular N-type thermoelectric arms (3-1) and the annular P-type thermoelectric arms (3-2) of the same refrigeration unit are connected by a conductive sleeve (3-3) The conductive sleeve (3-3) is provided with an insulating pad (3-5) between the corresponding annular N-type thermoelectric arm (3-1) and the annular P-type thermoelectric arm (3-2); in two adjacent refrigeration units, the annular P-type thermoelectric arm (3-2) of one refrigeration unit is conductively connected to the inner hole wall of the other annular N-type thermoelectric arm (3-1) through a conductive tube (3-4), and the conductive tube (3-4) is provided with an insulating ring (3-6) between the corresponding annular N-type thermoelectric arm (3-1) and the annular P-type thermoelectric arm (3-2).

2. The annular semiconductor refrigeration structure according to claim 1, characterized in that: A heat dissipation device (4) is inserted into the hot end insulation tube (2).

3. The annular semiconductor refrigeration structure according to claim 2, characterized in that: The heat dissipation device (4) is a ventilation pipe or a water cooling pipe.

4. The annular semiconductor refrigeration structure according to claim 2, characterized in that: The heat dissipation device (4) is a heat conducting rod with a heat dissipation fin at one end.

5. The annular semiconductor refrigeration structure according to claim 2, characterized in that: The heat dissipation device (4) is a heat pipe (4-1) whose closed end is inserted into the hot end insulating tube (2), and a heat pipe medium (4-2) is contained in the heat pipe (4-1); one end of the heat pipe (4-1) extending out of the hot end insulating tube (2) is connected to a heat dissipation housing (4-3).

6. The annular semiconductor refrigeration structure according to claim 5, characterized in that: The heat pipe medium (4-2) is a mixed liquid of one or more of ionized water, methanol, alcohol, acetone, and heat transfer oil.

7. The annular semiconductor refrigeration structure according to claim 5, characterized in that: The heat dissipation housing (4-3) is a flat plastic bag.

8. The annular semiconductor refrigeration structure according to claim 5 or 7, characterized in that: The heat dissipation housing (4-3) is filled with metal wires (4-4).

9. The annular semiconductor refrigeration structure according to claim 1, characterized in that: The cold end insulation tube (2) is a ceramic tube.

10. The annular semiconductor refrigeration structure according to claim 1, characterized in that: The preparation method of the annular semiconductor refrigeration structure comprises the following steps: S1. A conductive sleeve (3-3) is disposed on the outer surface of a ring-shaped N-type thermoelectric arm (3-1), an insulating pad (3-5) is inserted into the conductive sleeve (3-3), and then a ring-shaped P-type thermoelectric arm (3-2) is inserted, so that the ring-shaped N-type thermoelectric arm (3-1) and the ring-shaped P-type thermoelectric arm (3-2) are both conductively connected to the conductive sleeve (3-3) and fixedly connected; S2, inserting one end of a conductive tube (3-4) into the inner hole of the annular P-type thermoelectric arm (3-2) of step S1, and making the conductive tube (3-4) and the annular P-type thermoelectric arm (3-2) conductive and fixedly connected; inserting an insulating ring (3-6) into the body of the conductive tube (3-4), and then sleeved an annular N-type thermoelectric arm (3-1), and making the annular N-type thermoelectric arm (3-1) and the conductive tube (3-4) conductive and fixedly connected; S3, repeating the operations of steps S1 to S2 on the basis of the annular N-type thermoelectric arm (3-1) added in step S2 to form a refrigeration body (3), until the refrigeration body (3) reaches a designed length; S4. Insert the hot end insulating tube (2) into the refrigeration body (3), and install the cold end insulating tube (1) outside the refrigeration body (3).

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