Heat-conducting composite material, processing method thereof and electronic equipment

Abstract

The invention provides a heat-conducting composite material, a processing method thereof and electronic equipment, relates to the technical field of electronic products, and can improve the binding force of the heat-conducting composite material in the stacking direction of an internal multi-layer stacking structure and improve the mechanical structural strength. The heat-conducting composite material comprises a multi-layer stacked structure and a resin base material filled in the multi-layer stacked structure, wherein the multi-layer stacked structure comprises a first group of heat-conducting films and a first group of heat-conducting fiber felts. The first group of heat conduction films comprises at least one layer of heat conduction film, and when the heat conduction films are multiple, the multiple layers of heat conduction films are stacked. The first group of heat-conducting fiber felts is stacked on one side of the first group of heat-conducting films, the first group of heat-conducting fiber felts comprises at least one layer of first heat-conducting fiber felts, and when the number of the first heat-conducting fiber felts is multiple, the multiple layers of first heat-conducting fiber felts are stacked; and part of fibers of the first group of heat-conducting fiber felts extend into the first group of heat-conducting films.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a thermally conductive composite material and a processing method thereof, and an electronic device. Background Art

[0002] In electronic devices such as mobile phones, tablets and laptops, thermally conductive composite materials are used to form middle frames, inner frames, shells and other components. They have low density and excellent thermal conductivity, and can meet the lightweight and high heat dissipation requirements of electronic devices to a certain extent.

[0003] The thermally conductive composite material includes a multi-layer stacking structure and a resin substrate filled in the multi-layer stacking structure. The multi-layer stacking structure includes a plurality of stacked thermally conductive layers, wherein the bonding force between the layers within some of the thermally conductive layers and between the layers and the adjacent thermally conductive layers is weak, resulting in poor bonding force of the thermally conductive composite material in the stacking direction of the plurality of thermally conductive layers and low mechanical structure strength. Summary of the invention

[0004] The present application provides a thermally conductive composite material and a processing method thereof, and an electronic device, which can improve the bonding force of the thermally conductive composite material in the stacking direction of an internal multi-layer stacking structure and improve the mechanical structure strength.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, a thermally conductive composite material is provided. The thermally conductive composite material includes a multi-layer stacking structure and a resin substrate filled in the multi-layer stacking structure.

[0007] The multi-layer stacked structure includes a first group of thermally conductive films and a first group of thermally conductive fiber felts.

[0008] The first group of heat-conducting films includes at least one layer of first heat-conducting film. When the first heat-conducting film is multi-layered, the multi-layered first heat-conducting film is stacked.

[0009] The first group of heat-conductive fiber felts is stacked on one side of the first group of heat-conductive films, and the first group of heat-conductive fiber felts includes at least one layer of first heat-conductive fiber felts. When the first heat-conductive fiber felts are multi-layered, the multi-layer first heat-conductive fiber felts are stacked. Some fibers of the first group of heat-conductive fiber felts extend into the first group of heat-conductive films.

[0010] In this way, part of the fibers in the first group of heat-conductive fiber felts extending into the first group of heat-conductive films form an interlayer connection structure, which can increase the bonding force between the first group of heat-conductive fiber felts and the first group of heat-conductive films, between at least part of the first heat-conductive films in the first group of heat-conductive films, and between at least part of the first heat-conductive films, thereby improving the interlayer bonding force of the multi-layer stacking structure, inhibiting interlayer peeling, and enhancing the resistance to delamination damage and impact strength of the heat-conductive composite material. At the same time, part of the fibers extending into the first group of heat-conductive films form a heat-conducting path, which can strengthen the heat-conducting capacity of the multi-layer stacking structure in the stacking direction and improve the heat-conducting performance of the heat-conductive composite material.

[0011] In a possible implementation of the first aspect, the material of the first heat-conducting film may include at least one of graphite and graphene. Graphite and graphene have relatively large in-plane thermal conductivity coefficients, which may reach 1800 W / (m·K), and thus the thermal conductivity efficiency of the heat-conducting composite material in a direction parallel to the first heat-conducting film may be improved.

[0012] In a possible implementation of the first aspect, a needle punching process may be used to allow the above-mentioned part of the fibers of the first group of thermally conductive fiber felts to extend into the first group of thermally conductive films. By means of the needle punching process, by setting the needle punching density and the needle punching depth, more fibers on the first group of thermally conductive fiber felts may extend into the first group of thermally conductive films, which is beneficial to improving the interlayer bonding strength and thermal conductivity.

[0013] In a possible implementation of the first aspect, the multi-layer stacking structure also includes a first group of thermally conductive fiber cloths. The first group of thermally conductive fiber cloths are stacked on the side of the first group of thermally conductive fiber felts that is opposite to the first group of thermally conductive films, and the first group of thermally conductive fiber cloths includes at least one layer of first thermally conductive fiber cloths. When the first thermally conductive fiber cloths are multi-layered, the multiple layers of first thermally conductive fiber cloths are stacked. Since the extension direction of the fibers in the first group of thermally conductive fiber felts is not fixed, the free ends of some fibers in the first group of thermally conductive fiber felts can be inserted into the first group of thermally conductive fiber cloths, and are tightly combined with the first group of thermally conductive fiber cloths under the binding action of the resin substrate. Based on this, since the in-plane structural strength of the first group of thermally conductive fiber cloths is superior, the in-plane structural strength of the multi-layer stacking structure can be improved with the help of the first group of thermally conductive fiber cloths, thereby further improving the mechanical structural strength of the thermally conductive composite material.

[0014] At the same time, the first group of thermal conductive fiber felts also play a role in dispersing stress and toughening between the first group of thermal conductive fiber cloth and the first group of thermal conductive films, forming a bridging effect across the first group of thermal conductive fiber cloth and the first group of thermal conductive films, which can effectively improve the anti-destruction and impact toughness between the first group of thermal conductive fiber cloth and the first group of thermal conductive films.

[0015] In a possible implementation of the first aspect, the multi-layer stacking structure also includes a second group of thermally conductive fiber felts. The second group of thermally conductive fiber felts are stacked on the side of the first group of thermally conductive films that is opposite to the first group of thermally conductive fiber felts, and the second group of thermally conductive fiber felts includes at least one layer of second thermally conductive fiber felts. When the second thermally conductive fiber felts are multi-layered, the multi-layer second thermally conductive fiber felts are stacked. Some fibers of the second group of thermally conductive fiber felts extend into the first group of thermally conductive films. In this way, some fibers of the second group of thermally conductive fiber felts that extend into the first group of thermally conductive films also form an interlayer connection structure, which can further enhance the interlayer bonding force of the multi-layer stacking structure and increase the mechanical structural strength of the thermally conductive composite material.

[0016] In a possible implementation of the first aspect, the multi-layer stacking structure further includes a second group of heat-conductive fiber cloths. The second group of heat-conductive fiber cloths are stacked on the side of the second group of heat-conductive fiber felts that faces away from the first group of heat-conductive films, and the second group of heat-conductive fiber cloths includes at least one layer of second heat-conductive fiber cloths. When the second heat-conductive fiber cloths are multi-layered, the multi-layer second heat-conductive fiber cloths are stacked. With the aid of the second group of heat-conductive fiber cloths, the in-plane structural strength of the multi-layer stacking structure can be further improved, thereby further improving the mechanical structural strength of the heat-conductive composite material.

[0017] In a possible implementation of the first aspect, the multilayer stacking structure further includes a fiber line. The fiber line may be a thermally conductive fiber line or a non-thermal conductive fiber line. The fiber line includes a plurality of penetration portions, a plurality of first connection portions, and a plurality of second connection portions. Among them, the plurality of penetration portions are at least arrayed and arranged throughout the first group of thermally conductive films. The plurality of first connection portions and the first group of thermally conductive fiber felts are located on the same side of the first group of thermally conductive films, and the plurality of first connection portions are respectively connected between the plurality of penetration portions. The plurality of second connection portions are located on the side of the first group of thermally conductive films that is opposite to the first group of thermally conductive fiber felts, and the plurality of second connection portions are respectively connected between the plurality of penetration portions. In this way, with the aid of the fiber line, the bonding force between the layers in each first thermally conductive film in the first group of thermally conductive films and between the first thermally conductive films can be further increased, thereby effectively improving the interlayer bonding force of the multilayer stacking structure and improving the mechanical structural strength of the thermally conductive composite material.

[0018] In a possible implementation of the first aspect, a plurality of penetration portions are also arrayed and penetrated in the first group of thermally conductive fiber felts, the first group of thermally conductive fiber cloths, the second group of thermally conductive fiber felts, and the second group of thermally conductive fiber cloths. A plurality of first connection portions are located on the side of the first group of thermally conductive fiber cloths that faces away from the first group of thermally conductive fiber felts. A plurality of second connection portions are located on the side of the second group of thermally conductive fiber cloths that faces away from the second group of thermally conductive fiber felts. In this way, with the help of the fiber wires, the bonding force between the first group of thermally conductive films and the first group of thermally conductive fiber felts, between the first group of thermally conductive fiber felts and the first group of thermally conductive fiber cloths, between the second group of thermally conductive films and the second group of thermally conductive fiber felts, and between the second group of thermally conductive fiber felts and the second group of thermally conductive fiber cloths can be improved, thereby further increasing the mechanical structural strength of the thermally conductive composite material.

[0019] In a possible implementation of the first aspect, the first group of thermally conductive film arrays is provided with a plurality of through holes. A plurality of through portions are respectively accommodated in the plurality of through holes, and the diameter of the through holes is greater than the diameter of the through portions in the through holes. In this way, before setting the fiber line, a plurality of through holes can be pre-set on the first group of thermally conductive films, and in the process of setting the fiber line, the fiber line can be set along the through holes to reduce the required force, thereby reducing the difficulty of operation and saving costs. At the same time, the first group of thermally conductive films will not be damaged in the process of setting the fiber line.

[0020] In a possible implementation manner of the first aspect, the first thermally conductive fiber cloth and the second thermally conductive fiber cloth are woven cloth or unidirectional cloth.

[0021] In a possible implementation manner of the first aspect, the fibers in the first thermal conductive fiber cloth and the second thermal conductive fiber cloth include at least one of carbon fiber, graphite fiber, carbon nanotube fiber, graphene fiber, alumina fiber, silicon carbide fiber, silicon nitride fiber, and boron carbide fiber.

[0022] In a possible implementation manner of the first aspect, a thermally conductive filler is disposed in the resin substrate, and the thermally conductive filler includes at least one of nitride, carbide, oxide, metal, and carbon material.

[0023] In the second aspect, a thermally conductive composite material is provided, which includes a multilayer stacking structure and a resin substrate filled in the multilayer stacking structure. Among them, the multilayer stacking structure includes a first group of thermally conductive films and fiber lines. The first group of thermally conductive films includes at least one layer of a first thermally conductive film. When the first thermally conductive film is multilayer, the multilayer first thermally conductive film is stacked. The fiber line includes a plurality of through-portions, a plurality of first connecting portions and a plurality of second connecting portions. The plurality of through-portions are at least arrayed and arranged through the first group of thermally conductive films. The plurality of first connecting portions are located on one side of the first group of thermally conductive films, and the plurality of first connecting portions are respectively connected between the plurality of through-portions. The plurality of second connecting portions are located on the side of the first group of thermally conductive films that is opposite to the plurality of first connecting portions, and the plurality of second connecting portions are respectively connected between the plurality of through-portions.

[0024] In this way, with the help of fiber lines, the bonding strength between each layer in each first thermally conductive film in the first group of thermally conductive films and between each first thermally conductive film can be increased, thereby improving the interlayer bonding strength of the multilayer stacking structure, inhibiting interlayer peeling, and enhancing the thermally conductive composite material's resistance to delamination damage and impact strength.

[0025] In a possible implementation of the second aspect, the multilayer stacking structure also includes a first group of thermally conductive fiber cloths. The first group of thermally conductive fiber cloths are stacked on one side of the first group of thermally conductive films, and the first group of thermally conductive fiber cloths include at least one layer of first thermally conductive fiber cloths. When the first thermally conductive fiber cloth is multilayered, the multiple layers of first thermally conductive fiber cloths are stacked. Multiple penetration portions are also arrayed and penetrated in the first group of thermally conductive fiber cloths. Multiple first connecting portions are located on the side of the first group of thermally conductive fiber cloths that is opposite to the first group of thermally conductive films. In this way, with the help of the fiber line, the bonding force between the first group of thermally conductive films and the first group of thermally conductive fiber cloths can also be improved, further increasing the mechanical structural strength of the thermally conductive composite material. At the same time, since the in-plane structural strength of the first group of thermally conductive fiber cloths is superior, the in-plane structural strength of the multilayer stacking structure can be improved with the help of the first group of thermally conductive fiber cloths, thereby further suppressing interlayer peeling and enhancing the anti-delamination damage and impact resistance of the thermally conductive composite material.

[0026] In a possible implementation of the second aspect, the multilayer stacking structure further includes a second group of thermally conductive fiber cloths. The second group of thermally conductive fiber cloths are stacked on the side of the first group of thermally conductive films that is opposite to the first group of thermally conductive fiber cloths, and the second group of thermally conductive fiber cloths includes at least one layer of second thermally conductive fiber cloths. When the second thermally conductive fiber cloth is multilayer, the multilayer second thermally conductive fiber cloths are stacked. Multiple penetration portions are also arrayed and penetrated in the second group of thermally conductive fiber cloths. Multiple second connecting portions are located on the side of the second group of thermally conductive fiber cloths that is opposite to the first group of thermally conductive films. In this way, with the help of the fiber line, the bonding force between the first group of thermally conductive films and the second group of thermally conductive fiber cloths can also be improved, further inhibiting interlayer peeling, and enhancing the resistance to delamination damage and impact strength of the thermally conductive composite material. At the same time, since the in-plane structural strength of the second group of thermally conductive fiber cloths is superior, the in-plane structural strength of the multilayer stacking structure can be further improved with the help of the second group of thermally conductive fiber cloths, thereby further improving the mechanical structural strength of the thermally conductive composite material.

[0027] In a third aspect, an electronic device is also provided, which includes a middle frame, and the material of the middle frame is the thermally conductive composite material as described in any of the above technical solutions.

[0028] Since the electronic device provided in the present application includes a middle frame, and the material of the middle frame is the thermally conductive composite material as described in any of the above technical solutions, the structural strength of the middle frame can be improved.

[0029] In a fourth aspect, a method for processing a thermally conductive composite material is also provided, the processing method comprising:

[0030] A multilayer stacking structure is manufactured; wherein the multilayer stacking structure includes a first group of heat-conducting films and a first group of heat-conducting fiber felts; the first group of heat-conducting films includes at least one layer of a first heat-conducting film; when the first heat-conducting film is multi-layered, the multi-layer first heat-conducting films are stacked; the first group of heat-conducting fiber felts includes at least one layer of a first heat-conducting fiber felt; when the first heat-conducting fiber felt is multi-layered, the multi-layer first heat-conducting fiber felts are stacked; manufacturing the multilayer stacking structure includes:

[0031] Laminating a first group of thermally conductive fiber felts on one side of the first group of thermally conductive films;

[0032] Extending part of the fibers of the first group of thermally conductive fiber felt into the first group of thermally conductive films;

[0033] The multi-layer stacked structure is filled with a resin matrix.

[0034] In this way, part of the fibers in the first group of heat-conductive fiber felts extending into the first group of heat-conductive films form an interlayer connection structure, which can increase the bonding force between the first group of heat-conductive fiber felts and the first group of heat-conductive films, between at least part of the first heat-conductive films in the first group of heat-conductive films, and between at least part of the first heat-conductive films, thereby improving the interlayer bonding force of the multi-layer stacking structure, inhibiting interlayer peeling, and enhancing the resistance to delamination damage and impact strength of the heat-conductive composite material. At the same time, part of the fibers extending into the first group of heat-conductive films form a heat-conducting path, which can strengthen the heat-conducting capacity of the multi-layer stacking structure in the stacking direction and improve the heat-conducting performance of the heat-conductive composite material.

[0035] In a possible implementation of the fourth aspect, extending part of the fibers of the first group of thermally conductive fiber felts into the first group of thermally conductive films includes: extending part of the fibers of the first group of thermally conductive fiber felts into the first group of thermally conductive films using a needle punching process or a hydroentanglement process. The needle punching process and the hydroentanglement process are simple and can extend more fibers in the first group of thermally conductive fiber felts into the first group of thermally conductive films.

[0036] In a possible implementation of the fourth aspect, the multi-layer stacking structure further includes a second group of thermally conductive fiber felts, the second group of thermally conductive fiber felts includes at least one layer of second thermally conductive fiber felts, and when the second thermally conductive fiber felts are multiple layers, the multiple layers of second thermally conductive fiber felts are stacked. Based on this, manufacturing the multi-layer stacking structure further includes:

[0037] Laminating a second group of thermally conductive fiber felts on a side of the first group of thermally conductive films that faces away from the first group of thermally conductive fiber felts;

[0038] Part of the fibers of the second group of thermally conductive fiber felts are extended into the first group of thermally conductive films; wherein the first group of thermally conductive films, the first group of thermally conductive fiber felts and the second group of thermally conductive fiber felts form a first preform.

[0039] In this way, part of the fibers in the second group of thermally conductive fiber felts extending into the first group of thermally conductive films also form an interlayer connection structure, which can further enhance the interlayer bonding force of the multilayer stacking structure and increase the mechanical structural strength of the thermally conductive composite material.

[0040] In a possible implementation of the fourth aspect, the multi-layer stacking structure further includes a first group of thermally conductive fiber cloths and a second group of thermally conductive fiber cloths. The first group of thermally conductive fiber cloths includes at least one layer of first thermally conductive fiber cloths. When the first thermally conductive fiber cloths are multi-layered, the multi-layered first thermally conductive fiber cloths are stacked. The second group of thermally conductive fiber cloths includes at least one layer of second thermally conductive fiber cloths. When the second thermally conductive fiber cloths are multi-layered, the multi-layered second thermally conductive fiber cloths are stacked. Making the multi-layer stacking structure further includes:

[0041] Laminating a first group of heat-conductive fiber cloths on a side of the first group of heat-conductive fiber felts that faces away from the first group of heat-conductive films;

[0042] The second group of thermal conductive fiber cloth is stacked on the side of the second group of thermal conductive fiber felt facing away from the first group of thermal conductive film; wherein the first group of thermal conductive film, the first group of thermal conductive fiber felt, the second group of thermal conductive fiber felt, the first group of thermal conductive fiber cloth and the second group of thermal conductive fiber cloth constitute a second preform.

[0043] Since the extension direction of the fibers in the first group of thermally conductive fiber felts and the second group of thermally conductive fiber felts is not fixed, the free ends of some fibers in the first group of thermally conductive fiber felts can be inserted into the first group of thermally conductive fiber cloths to be tightly combined with the first group of thermally conductive fiber cloths; the free ends of some fibers in the second group of thermally conductive fiber felts can be inserted into the second group of thermally conductive fiber cloths to be tightly combined with the second group of thermally conductive fiber cloths. Based on this, since the first group of thermally conductive fiber cloths and the second group of thermally conductive fiber cloths can have better in-plane structural strength, the in-plane structural strength of the multilayer stacking structure can be improved by means of the first group of thermally conductive fiber cloths and the second group of thermally conductive fiber cloths, thereby further improving the mechanical structural strength of the thermally conductive composite material.

[0044] In a possible implementation manner of the fourth aspect, the multi-layer stacking structure further includes a fiber line. The fiber line includes a plurality of penetration portions, a plurality of first connection portions, and a plurality of second connection portions.

[0045] Based on this, making a multi-layer stacked structure also includes:

[0046] The fiber line is at least arranged on the first group of thermally conductive films, so that a plurality of penetration portions are at least arranged in an array and penetrate the first group of thermally conductive films, a plurality of first connecting portions and the first group of thermally conductive fiber felts are located on the same side of the first group of thermally conductive films, and a plurality of first connecting portions are respectively connected between the plurality of penetration portions, and a plurality of second connecting portions are located on a side of the first group of thermally conductive films that is away from the first group of thermally conductive fiber felts, and are respectively connected between the plurality of penetration portions.

[0047] In this way, with the help of fiber lines, the bonding strength between each layer in each first thermally conductive film in the first group of thermally conductive films and between each first thermally conductive film can be further increased, thereby effectively improving the interlayer bonding strength of the multi-layer stacking structure and improving the mechanical structural strength of the thermally conductive composite material.

[0048] In a possible implementation manner of the fourth aspect, disposing the fiber wire at least on the first group of thermally conductive films includes:

[0049] The fiber lines are arranged at least on the first group of heat-conducting films by using a stitching process.

[0050] The stitching process includes but is not limited to warp knitting and quilting. The stitching process is simple, easy to operate, highly efficient, and has a neat structure after forming.

[0051] In a possible implementation of the fourth aspect, before stacking the first group of thermally conductive fiber cloths on a side of the first group of thermally conductive fiber felts facing away from the first group of thermally conductive films, filling the multilayer stacked structure with a resin substrate includes:

[0052] Filling a first portion of the resin matrix into the first preform, so that the first preform and the first portion of the resin matrix form a third preform;

[0053] Filling the first group of thermally conductive fiber cloth with a second portion of resin matrix, so that the first group of thermally conductive fiber cloth and the second portion of resin matrix form a fourth preform;

[0054] Filling the second group of thermally conductive fiber cloth with a third portion of resin matrix, so that the second group of thermally conductive fiber cloth and the third portion of resin matrix form a fifth preform;

[0055] Based on this, the first group of thermally conductive fiber cloths are stacked on the side of the first group of thermally conductive fiber felts facing away from the first group of thermally conductive films, including:

[0056] The fourth preform is stacked on one side of the third preform, and the first group of thermally conductive fiber cloths are located on the side of the first group of thermally conductive fiber felts facing away from the first group of thermally conductive films;

[0057] The second group of heat-conductive fiber cloths are stacked on the side of the second group of heat-conductive fiber felts facing away from the first group of heat-conductive films, including:

[0058] The fifth preform is stacked and arranged on the side of the third preform facing away from the fourth preform, and the second group of thermally conductive fiber cloths are located on the side of the second group of thermally conductive fiber felts facing away from the first group of thermally conductive films;

[0059] After the second group of heat-conductive fiber cloths are stacked on the side of the second group of heat-conductive fiber felts facing away from the first group of heat-conductive films, the resin matrix is ​​filled in the multi-layer stacked structure, further comprising:

[0060] The first portion of the resin base material in the third preform, the second portion of the resin base material in the fourth preform, and the third portion of the resin base material in the fifth preform are formed into one body.

[0061] In this way, in the process of manufacturing the multi-layer stacking structure, the resin matrix is ​​filled in the multi-layer stacking structure, so that the resin matrix can be fully filled in the multi-layer stacking structure to ensure the structural strength of the thermally conductive composite material.

[0062] In a fifth aspect, a method for processing a thermally conductive composite material is also provided, the processing method comprising:

[0063] A multilayer stacking structure is manufactured; wherein the multilayer stacking structure includes a first group of heat-conducting films and a fiber line; the first group of heat-conducting films includes at least one first heat-conducting film, and when the first heat-conducting film is multilayered, the multilayer first heat-conducting films are stacked; the fiber line includes a plurality of penetration portions, a plurality of first connecting portions, and a plurality of second connecting portions; manufacturing the multilayer stacking structure includes:

[0064] The fiber line is at least arranged on the first group of heat-conducting films, and a plurality of penetration portions are at least arranged in an array and penetrate the first group of heat-conducting films, a plurality of first connecting portions are located on one side of the first group of heat-conducting films, and the plurality of first connecting portions are respectively connected between the plurality of penetration portions, a plurality of second connecting portions are located on a side of the first group of heat-conducting films that is opposite to the plurality of first connecting portions, and the plurality of second connecting portions are respectively connected between the plurality of penetration portions;

[0065] The multi-layer stacked structure is filled with a resin matrix.

[0066] In this way, with the help of fiber lines, the bonding strength between each layer in each first thermally conductive film in the first group of thermally conductive films and between each first thermally conductive film can be increased, thereby improving the interlayer bonding strength of the multilayer stacking structure and improving the mechanical structural strength of the thermally conductive composite material.

[0067] In a possible implementation of the fifth aspect, the multi-layer stacking structure further includes a first group of thermally conductive fiber cloths. The first group of thermally conductive fiber cloths includes at least one layer of first thermally conductive fiber cloths. When the first thermally conductive fiber cloths are multi-layered, the multi-layers of the first thermally conductive fiber cloths are stacked; the fiber wires are at least arranged before the first group of thermally conductive films, and the manufacturing of the multi-layer stacking structure further includes:

[0068] Laminating a first group of thermally conductive fiber cloths on one side of the first group of thermally conductive films;

[0069] Arranging the fiber wire at least on the first group of thermally conductive films comprises:

[0070] The fiber line is at least arranged on the first group of thermally conductive films and the first group of thermally conductive fiber cloths, and a plurality of penetration portions are arrayed and penetrated in the first group of thermally conductive films and the first group of thermally conductive fiber cloths, a plurality of first connecting portions are located on a side of the first group of thermally conductive fiber cloths facing away from the first group of thermally conductive films, and the plurality of first connecting portions are respectively connected between the plurality of penetration portions, a plurality of second connecting portions are located on a side of the first group of thermally conductive films facing away from the first group of thermally conductive fiber cloths, and the plurality of second connecting portions are respectively connected between the plurality of penetration portions.

[0071] In this way, the fiber line can also improve the bonding force between the first group of thermally conductive films and the first group of thermally conductive fiber cloths, further increasing the mechanical structural strength of the thermally conductive composite material. At the same time, since the first group of thermally conductive fiber cloths have a better in-plane structural strength, the first group of thermally conductive fiber cloths can be used to improve the in-plane structural strength of the multi-layer stacked structure, thereby further improving the mechanical structural strength of the thermally conductive composite material.

[0072] In a possible implementation of the fifth aspect, the multi-layer stacking structure further includes a second group of heat-conducting fiber cloths. The second group of heat-conducting fiber cloths includes at least one layer of second heat-conducting fiber cloths. When the second heat-conducting fiber cloths are multi-layered, the multi-layer second heat-conducting fiber cloths are stacked. The fiber line is at least arranged before the first group of heat-conducting films, and the production of the multi-layer stacking structure further includes:

[0073] Laminating a second group of heat-conducting fiber cloths on a side of the first group of heat-conducting films that faces away from the first group of heat-conducting fiber cloths;

[0074] Arranging the fiber wire at least on the first group of thermally conductive films comprises:

[0075] The fiber wire is arranged on the first group of thermally conductive films, the first group of thermally conductive fiber cloths, and the second group of thermally conductive fiber cloths, and a plurality of penetration portions are arrayed and penetrated in the first group of thermally conductive films, the first group of thermally conductive fiber cloths, and the second group of thermally conductive fiber cloths, a plurality of first connecting portions are located on a side of the first group of thermally conductive fiber cloths facing away from the first group of thermally conductive films, and a plurality of first connecting portions are respectively connected between the plurality of penetration portions, a plurality of second connecting portions are located on a side of the second group of thermally conductive fiber cloths facing away from the first group of thermally conductive films, and a plurality of second connecting portions are respectively connected between the plurality of penetration portions.

[0076] In this way, the fiber line can also improve the bonding force between the first group of thermally conductive films and the second group of thermally conductive fiber cloths, further increasing the mechanical structural strength of the thermally conductive composite material. At the same time, since the second group of thermally conductive fiber cloths have a better in-plane structural strength, the second group of thermally conductive fiber cloths can be used to further improve the in-plane structural strength of the multi-layer stacked structure, thereby further improving the mechanical structural strength of the thermally conductive composite material. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] Figure 1 A three-dimensional diagram of an electronic device in an unfolded state provided by some embodiments of the present application;

[0078] Figure 2 for Figure 1 A schematic diagram of a partial exploded structure of the electronic device shown;

[0079] Figure 3 for Figure 1 A schematic diagram of the structure of the electronic device shown in the folded state;

[0080] Figure 4 for Figure 1 A front view of a middle frame of the electronic device shown;

[0081] Figure 5 for Figure 4 The cross-sectional structure diagram of the middle frame along the AA direction is shown;

[0082] Figure 6 for Figure 5 The middle frame shown is a partial enlarged view of area I;

[0083] Figure 7 for Figure 6 A three-dimensional diagram of a multi-layer stacked structure in the middle frame shown;

[0084] Figure 8 A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0085] Fig. 9 for Figure 8 A schematic diagram of the cross-sectional structure of the multi-layer stacked structure shown;

[0086] Fig.10 A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0087] Fig.11 for Fig.10 A schematic diagram of the cross-sectional structure of the multi-layer stacked structure shown;

[0088] Fig.12 A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0089] Fig.13 A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0090] Fig.14 A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0091] Fig.15 A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0092] Fig.16 A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0093] Fig.17 A flow chart of a method for processing a thermally conductive composite material provided in some embodiments of the present application;

[0094] Fig.18 A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0095] Fig.19A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0096] Fig. 20 A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0097] Fig.21 A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0098] Fig. 22 A three-dimensional diagram of a multi-layer stacked structure provided in some other embodiments of the present application;

[0099] Fig.23 A flow chart of a method for processing a thermally conductive composite material provided in some embodiments of the present application. DETAILED DESCRIPTION

[0100] In the embodiments of the present application, the terms "first", "second", "third", "fourth", "fifth", "sixth", and "seventh" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", "third", "fourth", "fifth", "sixth", and "seventh" may explicitly or implicitly include one or more of the features.

[0101] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0102] The present application provides a thermally conductive composite material and a processing method thereof, and an electronic device. To facilitate the description of the following embodiments, some professional terms involved in the embodiments of the present application are first introduced before introducing the embodiments of the present application, specifically:

[0103] Thermally conductive fiber cloth: It is a sheet structure formed by connecting thermally conductive fibers through processes such as weaving or resin impregnation. The fibers in each area of ​​the sheet structure are regularly arranged and highly oriented, and the surface of the thermally conductive fiber cloth is relatively flat. Thermally conductive fiber cloth includes but is not limited to woven cloth and unidirectional cloth. The fibers in the thermally conductive fiber cloth include but are not limited to at least one of carbon fiber, graphite fiber, carbon nanotube fiber, graphene fiber, alumina fiber, silicon carbide fiber, silicon nitride fiber, and boron carbide fiber.

[0104] Thermally conductive fiber felt: refers to a sheet structure made of thermally conductive fibers with unfixed extension directions bonded together chemically or physically. Each area in the sheet structure is porous and mesh-like, the fibers are arranged in a disordered manner, and the surface of the thermally conductive fiber felt is relatively rough. The fibers in the thermally conductive fiber felt and the fibers in the thermally conductive fiber cloth can be selected from the same range of materials.

[0105] Woven fabric: refers to a sheet structure formed by weaving thermal conductive fibers. Woven structures include but are not limited to plain weave, twill weave, and satin weave.

[0106] Unidirectional fabric: refers to a sheet of thermal conductive fibers arranged in one direction, with resin used to fix the positions of the thermal conductive fibers.

[0107] In electronic devices such as mobile phones, tablets and laptops, components such as the middle frame, inner frame, and shell are not only used to transfer internal heat to the surface to achieve heat dissipation, but also to protect internal electronic components from external impact. Therefore, these components need to have both high thermal conductivity and high mechanical structural strength.

[0108] In order to meet the above requirements, the present application uses a thermally conductive composite material to form these components, and the thermally conductive composite material includes a multi-layer stacking structure and a resin substrate filled in the multi-layer stacking structure. The multi-layer stacking structure includes a plurality of stacked thermally conductive layers, and the thermal conductivity of the thermally conductive layer is large, which can improve the thermal conductivity of the thermally conductive composite material. A connection structure extending along the stacking direction is also provided in the plurality of thermally conductive layers to increase the bonding force between the plurality of thermally conductive layers and improve the mechanical structural strength of the thermally conductive composite material.

[0109] The thermally conductive composite material provided by the present application will be described in detail below with reference to the accompanying drawings. Prior to this, application scenarios of the thermally conductive composite material will be firstly introduced.

[0110] The thermally conductive composite material is applied to electronic devices, and the electronic devices may be user equipment (UE) or terminal devices, etc. For example, the electronic devices may be portable android devices (PAD), laptop computers, personal digital assistants (PDA), handheld devices with wireless communication functions, computing devices, vehicle-mounted devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, wireless terminals in smart homes, and other mobile terminals or fixed terminals. The following embodiments are exemplified by taking the electronic device as a folding screen device, and the folding screen device may be, for example, a mobile phone.

[0111] See also Figure 1 and Figure 2 , Figure 1 A three-dimensional diagram of an electronic device 10 in an unfolded state provided in some embodiments of the present application, Figure 2 for Figure 1 A schematic diagram of a partial exploded structure of the electronic device 10 shown. The electronic device 10 is approximately in the shape of a rectangular flat plate in the unfolded state. In order to facilitate the description of the embodiments below, an XYZ coordinate system is established for the electronic device 10 in the unfolded state, and the length direction of the electronic device 10 is defined as the X-axis direction, the width direction of the electronic device 10 is defined as the Y-axis direction, and the thickness direction of the electronic device 10 is defined as the Z-axis direction. It can be understood that the coordinate system setting of the electronic device 10 can be flexibly set according to actual needs, and no specific limitation is made here. In some other embodiments, the shape of the electronic device 10 in the unfolded state can also be a square flat plate, a circular flat plate, an elliptical flat plate, etc.

[0112] The electronic device 10 includes a folding screen 1 and a supporting device 2 .

[0113] The foldable screen 1 is used to display information such as images and videos. The foldable screen 1 can be an organic light-emitting diode (OLED) screen, a micro organic light-emitting diode (micro organic light-emitting diode) screen, a quantum dot light emitting diode (QLED) screen, a liquid crystal display (LCD), etc.

[0114] The folding screen 1 has a display surface, which is exposed to present images, videos and other information to the user. The folding screen 1 includes a first folding screen portion 11, a second folding screen portion 12 and a third folding screen portion 13, and the third folding screen portion 13 is connected between the first folding screen portion 11 and the second folding screen portion 12. Figure 1 In the electronic device 10 shown, the folding screen 1 is in the unfolded state, and the first folding screen part 11, the third folding screen part 13, and the second folding screen part 12 are arranged in sequence along the X-axis direction, so that the electronic device 10 is folded in the horizontal direction. In some other embodiments, when the folding screen 1 is in the unfolded state, the first folding screen part 11, the third folding screen part 13, and the second folding screen part 12 can also be arranged in sequence along the Y-axis direction. In this way, the electronic device 10 is folded in the longitudinal direction. When the folding screen 1 is in the unfolded state, a large screen display can be achieved to provide users with richer information and bring users a better user experience.

[0115] At least the third folding screen portion 13 of the folding screen 1 is a flexible screen structure. In this way, the third folding screen portion 13 can be bent and deformed after being subjected to external force, so that the folding screen 1 is Figure 1 The first folding screen portion 11 and the second folding screen portion 12 of the folding screen 1 can be a flexible screen structure, can also be a hard screen structure, can also be a partially flexible screen structure and a partially hard screen structure, which is not specifically limited here.

[0116] See also Figure 3 , Figure 3 for Figure 1The schematic diagram of the structure of the electronic device 10 shown is in a folded state, and the folding screen 1 in the electronic device 10 is also in a folded state. Specifically, when the folding screen 1 is in a folded state, the first folding screen part 11 and the second folding screen part 12 of the folding screen 1 are approximately parallel and opposite. Among them, the angle θ between the first folding screen part 11 and the second folding screen part 12 is within 30°, and the first folding screen part 11 and the second folding screen part 12 can be considered to be approximately parallel. The first folding screen part 11 and the second folding screen part 12 are opposite to each other means that the display surface of the first folding screen part 11 and the display surface of the second folding screen part 12 face each other.

[0117] The supporting device 2 is located on the side of the folding screen 1 facing away from the display surface, and the supporting device 2 is used to support the folding screen 1 .

[0118] The support device 2 includes a first housing 21, a second housing 22 and a hinge mechanism 23. The first housing 21 carries the first folding screen portion 11, and the second housing 22 carries the second folding screen portion 12. The hinge mechanism 23 is connected between the first housing 21 and the second housing 22, and carries the third folding screen portion 13. The hinge mechanism 23 is used to realize the rotation between the second housing 22 and the first housing 21, so as to support the folding of the folding screen 1 between the unfolded state and the folded state.

[0119] When the electronic device 10 is in the folded state, please continue to refer to Figure 3 The supporting device 2 is protected outside the folding screen 1, and the folding screen 1 is invisible to the user, which can prevent the folding screen 1 from being scratched by hard objects. The folding screen device is an inward-folding folding screen device, and the size of the electronic device 10 is reduced, which is convenient to carry.

[0120] In the above embodiment, optionally, the first shell 21 and the second shell 22 may include a middle frame and a back cover connected together. The above-mentioned first folding screen part 11 is carried on the middle frame of the first shell 21, and the second folding screen part 12 is carried on the middle frame of the second shell 22. The back cover of the first shell 21 is located on the side of the middle frame of the first shell 21 facing away from the first folding screen part 11, and the back cover of the second shell 22 is located on the side of the middle frame of the second shell 22 facing away from the second folding screen part 12. A first accommodating cavity is formed between the middle frame of the first shell 21 and the back cover, and a second accommodating cavity is formed between the middle frame and the back cover of the second shell 22. The first accommodating cavity and the second accommodating cavity are used to accommodate components such as circuit boards, camera modules, speaker modules, arrays, batteries, etc.

[0121] In the above embodiment, the back cover of the first shell 21 and the back cover of the second shell 22 can be replaced by a display screen (such as an LCD display screen). The hinge mechanism 23 can be specifically connected between the middle frame of the first shell 21 and the middle frame of the second shell 22.

[0122] Based on the above embodiments, the thermally conductive composite material can be used to form the middle frame or back shell of the electronic device 10. The following embodiments are exemplified by using the thermally conductive composite material to form the middle frame K of the electronic device 10.

[0123] For examples, see Figure 4 and Figure 5 , Figure 4 for Figure 1 The front view of the middle frame of the electronic device 10 is shown, and the middle frame is the middle frame K of the first shell 21. Figure 5 for Figure 4 The cross-sectional structure diagram of the middle frame along the AA direction is shown. In this embodiment, the middle frame K is formed by the thermal conductive composite material 100.

[0124] See also Figure 6 , Figure 6 for Figure 5 The middle frame is a partial enlarged view of area I. The thermal conductive composite material 100 includes a multi-layer stacking structure 102 and a resin matrix 101 filled in the multi-layer stacking structure 102 .

[0125] Specifically, the resin substrate 101 can be filled in the gaps between layers of the multi-layer stacking structure 102 , or can be filled in the gaps within layers of the multi-layer stacking structure 102 , similar to “concrete”, to ensure the structural strength of the thermal conductive composite material 100 .

[0126] The resin substrate 101 may be a thermosetting resin or a thermoplastic resin. The thermosetting resin includes but is not limited to at least one of bismaleimide resin, epoxy resin, phenolic resin, urea-formaldehyde resin, melamine-formaldehyde resin and polyurethane; the thermoplastic resin includes but is not limited to at least one of polyester, polyamide, polycarbonate, polyethylene, polypropylene, polyphenylene ether, polysulfone, polyetheretherketone and polyoxymethylene.

[0127] A thermally conductive filler 103 is provided in the resin substrate 101 to enhance the thermal conductivity of the resin substrate 101. Optionally, the thermally conductive filler 103 includes but is not limited to at least one of nitrides, carbides, oxides, metals, and carbon materials. Among them, nitrides include but are not limited to at least one of boron nitride, aluminum nitride, and silicon nitride, carbides include but are not limited to silicon carbide, oxides include but are not limited to at least one of aluminum oxide, magnesium oxide, and zinc oxide, and carbon materials include but are not limited to at least one of carbon nanotubes, carbon fiber powder, graphite, graphene, graphene oxide, and carbon black.

[0128] The form of the thermal conductive filler 103 includes but is not limited to at least one of particles, powders, whiskers and lamellar structures. The thermal conductive filler 103 may be dispersed in the resin substrate 101 .

[0129] It is understandable that the proportion of the thermally conductive filler 103 in the resin substrate 101 affects the thermal conductivity and structural strength of the resin substrate 101. Specifically, the greater the proportion of the thermally conductive filler 103 in the resin substrate 101, the better the thermal conductivity, while the weaker the bonding force between the various parts in the resin substrate 101, and the lower the mechanical structural strength. On the contrary, the smaller the proportion of the thermally conductive filler 103 in the resin substrate 101, the worse the thermal conductivity, while the stronger the bonding force between the various parts in the resin substrate 101, and the higher the mechanical structural strength.

[0130] Based on this, optionally, the proportion of the thermally conductive filler 103 in the resin substrate 101 can be greater than or equal to 5%, and less than or equal to 60%. Among them, the proportion of the thermally conductive filler 103 in the resin substrate 101 = (mass of the thermally conductive filler 103 × 100%) / (mass of the resin substrate 101 + mass of the thermally conductive filler 103). Specifically, the proportion of the thermally conductive filler 103 in the resin substrate 101 can be 5%, 10%, 20%, 30%, 40%, 50% or 60%. When the proportion of the thermally conductive filler 103 is within this range, the thermal conductivity and mechanical structure strength of the resin substrate 101 can be taken into account at the same time.

[0131] The multi-layer stacked structure 102 forms a heat conduction channel to improve the heat conduction efficiency of the thermally conductive composite material 100 .

[0132] See also Figure 7 , Figure 7 for Figure 6 The three-dimensional diagram of the multi-layer stacking structure 102 in the middle frame is shown. The multi-layer stacking structure 102 includes a first group of thermal conductive fiber cloth 1021 , a second group of thermal conductive fiber cloth 1022 and a first group of thermal conductive films 1023 .

[0133] The first group of heat-conducting fiber cloth 1021 includes at least one layer of first heat-conducting fiber cloth. "At least one layer" means one layer or more. When the first group of heat-conducting fiber cloth 1021 includes multiple layers of first heat-conducting fiber cloth, the multiple layers of first heat-conducting fiber cloth are stacked. This embodiment and the following embodiments are exemplified by the first group of heat-conducting fiber cloth 1021 including one layer of first heat-conducting fiber cloth, which cannot be regarded as a special limitation to the present application.

[0134] Similarly, the second group of thermally conductive fiber cloth 1022 includes at least one layer of second thermally conductive fiber cloth. When the second group of thermally conductive fiber cloth 1022 includes multiple layers of second thermally conductive fiber cloth, the multiple layers of second thermally conductive fiber cloth are stacked. This embodiment and the following embodiments are exemplified by the second group of thermally conductive fiber cloth 1022 including one layer of second thermally conductive fiber cloth, which cannot be regarded as a special limitation to the present application.

[0135] The first group of thermally conductive films 1023 is stacked between the first group of thermally conductive fiber cloths 1021 and the second group of thermally conductive fiber cloths 1022 .

[0136] The first group of heat-conductive films 1023 includes at least one layer of first heat-conductive film. When the first group of heat-conductive films 1023 includes multiple layers of first heat-conductive films, the multiple layers of first heat-conductive films are stacked, and the stacking direction of the multiple layers of first heat-conductive films is consistent with the stacking direction of the first group of heat-conductive fiber cloth 1021, the first group of heat-conductive films 1023, and the second group of heat-conductive fiber cloth 1022.

[0137] When the first group of thermally conductive fiber cloths 1021 includes multiple layers of first thermally conductive fiber cloths, the stacking direction of the multiple layers of first thermally conductive fiber cloths is consistent with the stacking direction of the first group of thermally conductive fiber cloths 1021, the first group of thermally conductive films 1023, and the second group of thermally conductive fiber cloths 1022. Similarly, when the second group of thermally conductive fiber cloths 1022 includes multiple layers of second thermally conductive fiber cloths, the stacking direction of the multiple layers of second thermally conductive fiber cloths is consistent with the stacking direction of the first group of thermally conductive fiber cloths 1021, the first group of thermally conductive films 1023, and the second group of thermally conductive fiber cloths 1022.

[0138] In some embodiments, the material of the first thermally conductive film may include at least one of graphite and graphene. Graphite and graphene have relatively large in-plane thermal conductivity coefficients, which can reach 1800 W / (m·K), thus improving the thermal conductivity efficiency of the thermally conductive composite material 100 in a direction parallel to the first thermally conductive film.

[0139] In some other embodiments, the material of the first heat-conducting film may also be a metal film, and the material of the metal film includes but is not limited to copper, copper alloy, aluminum, aluminum alloy and magnesium alloy.

[0140] The following embodiments are introduced on the basis that the material of the first thermally conductive film is at least one of graphite and graphene. Graphite has a lamellar structure and the layers are easily peeled off. The detailed structure of the graphene film is similar to the detailed structure of the graphite film, resulting in a small bonding force between the layers in the first thermally conductive film and between two adjacent first thermally conductive films, that is, a small interlayer bonding force.

[0141] On the basis of the above, please continue to refer to Figure 7 The multi-layer stacked structure 102 is provided with a plurality of through holes 1024 in an array. The plurality of through holes 1024 can be formed by a needle punching process or a Z-pin process, and a thermal conductive material is provided in the plurality of through holes 1024. The thermal conductive material includes but is not limited to the above-mentioned resin substrate with the thermal conductive filler 103 added thereto.

[0142] In this way, with the help of the thermally conductive material in the through hole 1024, the bonding strength between the layers inside the first group of thermally conductive films 1023 in the multi-layer stacking structure 102, between the first group of thermally conductive films 1023 and the first group of thermally conductive fiber cloths 1021, and between the first group of thermally conductive films 1023 and the second group of thermally conductive fiber cloths 1022 can be improved, thereby improving the interlayer bonding strength and interlayer peeling strength of the thermally conductive composite material 100.

[0143] However, when the through holes 1024 are formed by needle punching or Z-pin process, the fibers in the first group of thermally conductive fiber cloths 1021 and the second group of thermally conductive fiber cloths 1022 will inevitably be damaged, resulting in defects such as fiber breakage, burrs, continuity, and decreased arrangement regularity, thereby damaging the in-plane structural strength of the thermally conductive composite material 100, making it difficult to take into account both the in-plane structural strength and the interlayer bonding strength, resulting in a decrease in the mechanical structural strength and elastic modulus of the thermally conductive composite material 100.

[0144] In some other embodiments, see Figure 8 and Fig. 9 , Figure 8 A three-dimensional diagram of a multi-layer stacked structure 102 provided in some embodiments of the present application, Fig. 9 for Figure 8 The cross-sectional structure diagram of the multi-layer stacked structure 102 is shown. In this embodiment, the multi-layer stacked structure 102 includes a first group of thermally conductive films 1023 and a first group of thermally conductive fiber felts 1025 .

[0145] The structure of the first group of thermally conductive films 1023 may be the same as the first group of thermally conductive films 1023 provided in any of the aforementioned embodiments, and will not be described in detail herein.

[0146] The thickness of the first group of thermally conductive films 1023 may be greater than or equal to 20 μm and less than or equal to 200 μm. In this way, the thickness of the multi-layer stacked structure 102 may not be significantly increased, while having better in-plane thermal conductivity.

[0147] The first group of thermally conductive fiber felts 1025 includes at least one layer of first thermally conductive fiber felt. When the first thermally conductive fiber felts are multiple layers, the multiple layers of first thermally conductive fiber felts are stacked. In this embodiment and the following embodiments, the first group of thermally conductive fiber felts 1025 includes one layer of first thermally conductive fiber felt for exemplary description, which cannot be regarded as a special limitation to the present application.

[0148] The first group of thermally conductive fiber felts 1025 is stacked on one side of the first group of thermally conductive films 1023. When the first thermally conductive films in the first group of thermally conductive films 1023 are multiple layers, the stacking direction of the multiple layers of the first thermally conductive films is consistent with the stacking direction of the first group of thermally conductive fiber felts 1025 and the first group of thermally conductive films 1023.

[0149] When the first group of thermally conductive fiber felts 1025 includes multiple layers of first thermally conductive fiber felts, the stacking direction of the multiple layers of first thermally conductive fiber felts is also consistent with the stacking direction of the first group of thermally conductive fiber felts 1025 and the first group of thermally conductive films 1023 .

[0150] The first group of thermally conductive fiber felts 1025 may be continuous fiber felts or discontinuous fiber felts, and there is no specific limitation on the weight and thickness of the first group of thermally conductive fiber felts 1025. The length of the fibers in the first group of thermally conductive fiber felts 1025 may be selected between 1 mm and 10 mm.

[0151] In some embodiments, the weight of the first group of thermally conductive fiber felts 1025 may be greater than or equal to 10 g / m 2 , and less than or equal to 100g / m 2 For example, the weight of the first group of thermally conductive fiber felt 1025 is 20 g / m 2 , with a thickness of 0.02 mm. In this way, the thickness of the first group of thermally conductive fiber felts 1025 is relatively small, and will not significantly affect the thickness of the multi-layer stacked structure 102 .

[0152] Please refer to Fig. 9 , some fibers a of the first group of thermally conductive fiber felts 1025 extend into the first group of thermally conductive films 1023 .

[0153] In this way, part of the fibers a in the first group of thermally conductive fiber felts 1025 extending into the first group of thermally conductive films 1023 form a connection structure in the stacking direction (i.e., the Z direction), which can increase the bonding force between the first group of thermally conductive fiber felts 1025 and the first group of thermally conductive films 1023, between at least part of the first thermally conductive films in the first group of thermally conductive films 1023, and between at least part of the first thermally conductive films, thereby improving the interlayer bonding force of the multilayer stacking structure 102, inhibiting interlayer peeling, and enhancing the anti-delamination damage and impact strength of the thermally conductive composite material 100. At the same time, part of the fibers extending into the first group of thermally conductive films 1023 form a thermally conductive path, which can strengthen the thermal conductivity of the multilayer stacking structure 102 in the stacking direction and improve the thermal conductivity of the thermally conductive composite material 100.

[0154] In some embodiments, a needle punching process can be used to make the above-mentioned part of the fibers a of the first group of thermally conductive fiber felts 1025 extend into the first group of thermally conductive films 1023. With the aid of the needle punching process, by setting the needle punching density and the needle punching depth, more fibers on the first group of thermally conductive fiber felts 1025 can be extended into the first group of thermally conductive films 1023, which is beneficial to improving the interlayer bonding force and thermal conductivity. Moreover, the needle punching process is simple, the process is stable, and the operation is convenient. In some other embodiments, a water spunlace process can also be used to make the above-mentioned part of the fibers a of the first group of thermally conductive fiber felts 1025 extend into the first group of thermally conductive films 1023. This application does not make specific limitations on this.

[0155] In some embodiments, please refer to Fig. 9 , the above-mentioned part of fibers of the first group of thermally conductive fiber felts 1025 penetrates the first group of thermally conductive films 1023. In this way, with the help of the above-mentioned part of fibers, the bonding force between each layer in each first thermally conductive film in the first group of thermally conductive films 1023 and between each first thermally conductive film can be increased, thereby effectively improving the interlayer bonding force of the multi-layer stacking structure 102 and improving the mechanical structural strength of the thermally conductive composite material 100.

[0156] In order to further enhance the interlayer bonding strength of the multilayer stacked structure 102, in some embodiments, see Fig.10 and Fig.11 , Fig.10 A three-dimensional diagram of a multi-layer stacked structure 102 provided in some embodiments of the present application, Fig.11 for Fig.10 The cross-sectional structure diagram of the multi-layer stacked structure 102 is shown. In this embodiment, the multi-layer stacked structure 102 includes a second group of thermally conductive fiber felts 1026 in addition to the first group of thermally conductive films 1023 and the first group of thermally conductive fiber felts 1025 .

[0157] The second group of thermally conductive fiber felt 1026 includes at least one layer of second thermally conductive fiber felt. When the second thermally conductive fiber felt is multi-layered, the multi-layer second thermally conductive fiber felt is stacked. This embodiment and the following embodiments are exemplified by the second group of thermally conductive fiber felt 1026 including one layer of second thermally conductive fiber felt.

[0158] The second group of thermally conductive fiber felts 1026 is located on a side of the first group of thermally conductive films 1023 that is opposite to the first group of thermally conductive fiber felts 1025 , and is stacked with the first group of thermally conductive films 1023 .

[0159] When the second group of thermally conductive fiber felts 1026 includes multiple layers of second thermally conductive fiber felts, the stacking direction of the multiple layers of second thermally conductive fiber felts is consistent with the stacking direction of the first group of thermally conductive fiber felts 1025 , the first group of thermally conductive films 1023 , and the second group of thermally conductive fiber felts 1026 .

[0160] The structural form of the second group of thermal conductive fiber felts 1026 may be the same as that of the first group of thermal conductive fiber felts 1025 , and will not be described in detail herein.

[0161] Please refer to Fig.11 , some fibers b of the second group of thermal conductive fiber felts 1026 extend into the first group of thermal conductive films 1023 .

[0162] In this way, part of the fibers b in the second group of thermally conductive fiber felts 1026 extending into the first group of thermally conductive films 1023 also form a Z-direction connection structure, which can increase the bonding force between the second group of thermally conductive fiber felts 1026 and the first group of thermally conductive films 1023, between at least part of the first thermally conductive films in the first group of thermally conductive films 1023, and between at least part of the first thermally conductive films, thereby further improving the interlayer bonding force of the multilayer stacking structure 102 and increasing the mechanical structural strength of the thermally conductive composite material 100. At the same time, part of the fibers extending into the first group of thermally conductive films 1023 form a thermally conductive path, which can strengthen the thermal conductivity of the multilayer stacking structure in the stacking direction and improve the thermal conductivity of the thermally conductive composite material 100.

[0163] In some embodiments, a needle punching process or a hydroentanglement process may also be used to allow the above-mentioned part of the fibers of the second group of thermal conductive fiber felts 1026 to extend into the first group of thermal conductive films 1023 .

[0164] In some embodiments, please refer to Fig.11 , the above-mentioned part of fibers b of the second group of thermally conductive fiber felts 1026 penetrates the first group of thermally conductive films 1023. In this way, with the help of this part of fibers, the bonding force between each layer in each first thermally conductive film in the first group of thermally conductive films 1023 and between each first thermally conductive film can be increased, thereby effectively improving the interlayer bonding force of the multi-layer stacking structure 102 and improving the mechanical structural strength of the thermally conductive composite material 100.

[0165] In some embodiments, please refer to Fig.11 , the above-mentioned part of the fibers a of the first group of thermally conductive fiber felts 1025 pass through the first group of thermally conductive films 1023 and extend into the second group of thermally conductive fiber felts 1026 to be connected with the fibers in the second group of thermally conductive fiber felts 1026. And / or, the above-mentioned part of the fibers b of the second group of thermally conductive fiber felts 1026 pass through the first group of thermally conductive films 1023 and extend into the first group of thermally conductive fiber felts 1025 to be connected with the fibers in the first group of thermally conductive fiber felts 1025. Thus, anchoring the first group of thermally conductive films 1023 can further increase the bonding force between the first group of thermally conductive films 1023 and the first group of thermally conductive fiber felts 1025, between the first group of thermally conductive films 1023 and the second group of thermally conductive fiber felts 1026, between the layers in each first thermally conductive film in the first group of thermally conductive films 1023, and between each first thermally conductive film, thereby improving the mechanical structural strength of the thermally conductive composite material 100.

[0166] It can be known that the factors affecting the mechanical structural strength of the thermally conductive composite material 100 include not only the interlayer bonding force of the multilayer stacked structure 102 , but also the in-plane structural strength of the multilayer stacked structure 102 .

[0167] On the basis of the above-mentioned embodiments, in order to further improve the in-plane structural strength of the multi-layer stacked structure 102 on the basis of improving the inter-layer bonding strength of the multi-layer stacked structure 102, in some embodiments, refer to Fig.12 , Fig.12 A three-dimensional diagram of a multilayer stacked structure 102 provided in some other embodiments of the present application. In this embodiment, in addition to the first group of thermally conductive films 1023, the first group of thermally conductive fiber felts 1025, and the second group of thermally conductive fiber felts 1026, the multilayer stacked structure 102 also includes a first group of thermally conductive fiber cloths 1021. In other embodiments, the multilayer stacked structure 102 described in this embodiment may not be provided with the second group of thermally conductive fiber felts 1026.

[0168] The first group of thermally conductive fiber cloths 1021 is the same as the first group of thermally conductive fiber cloths 1021 described in any of the above embodiments, and will not be described in detail herein.

[0169] The first group of thermally conductive fiber cloths 1021 is located on a side of the first group of thermally conductive fiber felts 1025 that is opposite to the first group of thermally conductive films 1023 , and is stacked with the first group of thermally conductive fiber felts 1025 .

[0170] Since the extension direction of the fibers in the first group of thermally conductive fiber felts 1025 is not fixed, the free ends of some fibers in the first group of thermally conductive fiber felts 1025 can be inserted into the first group of thermally conductive fiber cloths 1021, and are tightly combined with the first group of thermally conductive fiber cloths 1021 under the binding action of the resin substrate 101. Based on this, since the first group of thermally conductive fiber cloths 1021 have a better in-plane structural strength, the in-plane structural strength of the multilayer stacking structure 102 can be improved by means of the first group of thermally conductive fiber cloths 1021, thereby further improving the mechanical structural strength of the thermally conductive composite material 100.

[0171] At the same time, the first group of thermal conductive fiber felts 1025 also play a role in dispersing stress and enhancing toughness between the first group of thermal conductive fiber cloth 1021 and the first group of thermal conductive film 1023, forming a bridging effect across the first group of thermal conductive fiber cloth 1021 and the first group of thermal conductive film 1023, which can effectively improve the anti-destruction and impact toughness between the first group of thermal conductive fiber cloth 1021 and the first group of thermal conductive film 1023.

[0172] Moreover, the first group of thermally conductive fiber cloths 1021 can be laminated on the side of the first group of thermally conductive fiber felts 1025 facing away from the first group of thermally conductive films 1023 after a needle punching process or a hydroentanglement process is used to make some fibers of the first group of thermally conductive fiber felts 1025 extend into the first group of thermally conductive films 1023. In this way, the in-plane structural strength and surface roughness of the first group of thermally conductive fiber cloths 1021 can be avoided from being damaged, the structural strength of the thermally conductive composite material 100 can be ensured, the surface roughness of the thermally conductive composite material 100 will not be increased, and the appearance of the middle frame, inner frame, shell and other components will not be affected.

[0173] On the basis of the above embodiments, in order to further improve the in-plane structural strength of the multi-layer stacked structure 102, in some embodiments, refer to Fig.13 , Fig.13 A three-dimensional diagram of a multilayer stacked structure 102 provided in some other embodiments of the present application. In this embodiment, the multilayer stacked structure 102 includes, in addition to the first group of thermally conductive films 1023, the first group of thermally conductive fiber felts 1025, the second group of thermally conductive fiber felts 1026 and the first group of thermally conductive fiber cloths 1021, a second group of thermally conductive fiber cloths 1022.

[0174] The second group of thermally conductive fiber cloths 1022 is the same as the second group of thermally conductive fiber cloths 1022 described in any of the above embodiments, and will not be described in detail herein.

[0175] The second group of thermal conductive fiber cloths 1022 is located on a side of the second group of thermal conductive fiber felts 1026 facing away from the first group of thermal conductive films 1023 , and is stacked with the second group of thermal conductive fiber felts 1026 .

[0176] Since the extension direction of the fibers in the second group of thermally conductive fiber felts 1026 is not fixed, the free ends of some fibers in the second group of thermally conductive fiber felts 1026 can be inserted into the second group of thermally conductive fiber cloths 1022, and are tightly combined with the second group of thermally conductive fiber cloths 1022 under the binding action of the resin substrate 101. Based on this, since the second group of thermally conductive fiber cloths 1022 have a better in-plane structural strength, the in-plane structural strength of the multilayer stacked structure 102 can be further improved by means of the second group of thermally conductive fiber cloths 1022, thereby further improving the mechanical structural strength of the thermally conductive composite material 100.

[0177] At the same time, the second group of thermal conductive fiber felts 1026 can also improve the resistance to delamination damage and impact toughness between the second group of thermal conductive fiber cloths 1022 and the first group of thermal conductive films 1023 .

[0178] Moreover, it can also avoid damaging the in-plane structural strength and surface roughness of the second group of thermal conductive fiber cloths 1022, ensure the structural strength of the thermal conductive composite material 100, and will not increase the surface roughness of the thermal conductive composite material 100, while not affecting the appearance of components such as the middle frame, inner frame, and shell.

[0179] In some embodiments, the first thermally conductive fiber cloth in the first group of thermally conductive fiber cloths 1021 and the second thermally conductive fiber cloth in the second group of thermally conductive fiber cloths 1022 may be selected to be woven cloth or unidirectional cloth.

[0180] When at least one of the first thermally conductive fiber cloth and the second thermally conductive fiber cloth is a woven cloth, the in-plane parts of the woven cloth have a certain structural strength, which can improve the in-plane structural strength of the multilayer stacked structure 102 and improve the in-plane strength and tensile modulus of the thermally conductive composite material 100.

[0181] When the first thermally conductive fiber cloth and the second thermally conductive fiber cloth are both woven cloths, the arrangement direction of the fibers in the first thermally conductive fiber cloth and the arrangement direction of the corresponding fibers in the second thermally conductive fiber cloth can be set in parallel, that is, the staggered angle is 0°. In this way, the in-plane bonding strength of the multilayer stacked structure 102 can be improved to a certain extent. When the first thermally conductive fiber cloth and the second thermally conductive fiber cloth are both woven cloths, the arrangement direction of the fibers in the first thermally conductive fiber cloth and the arrangement direction of the corresponding fibers in the second thermally conductive fiber cloth can also be staggered, and the staggered angle includes but is not limited to 30°, 45°, 60° or 90°, etc. In this way, the structural strength of the multilayer stacked structure 102 in more directions in the plane can be further improved, and the structural strength of the thermally conductive composite material 100 can be improved.

[0182] When the first thermally conductive fiber cloth and the second thermally conductive fiber cloth are both unidirectional cloths, the thermally conductive fibers in the first thermally conductive fiber cloth and the thermally conductive fibers in the second thermally conductive fiber cloth can be arranged in parallel, that is, the staggered angle is 0°. In this way, the structural strength of the multi-layer stacked structure 102 in the plane along the extension direction of the thermally conductive fibers can be improved. When the first thermally conductive fiber cloth and the second thermally conductive fiber cloth are unidirectional cloths, the thermally conductive fibers in the first thermally conductive fiber cloth and the thermally conductive fibers in the second thermally conductive fiber cloth can also be staggered, and the staggered angle includes but is not limited to 30°, 45°, 60° or 90°, etc. In this way, the structural strength of the multi-layer stacked structure 102 in multiple directions in the plane can be improved, and the in-plane strength and tensile modulus of the thermally conductive composite material 100 can be improved.

[0183] In some other embodiments, when the first group of thermally conductive fiber cloth 1021 includes multiple layers of first thermally conductive fiber cloth, the multiple layers of first thermally conductive fiber cloth may all be woven cloth, or all be unidirectional cloth, or one part may be woven cloth and the other part may be unidirectional cloth. When the multiple layers of first thermally conductive fiber cloth are all woven cloth, the corresponding thermally conductive fibers in the multiple layers of first thermally conductive fiber cloth may be arranged in parallel or in an interlaced manner. When the multiple layers of first thermally conductive fiber cloth are all unidirectional cloth, the thermally conductive fibers in the multiple layers of first thermally conductive fiber cloth may be arranged in parallel or in an interlaced manner.

[0184] Similarly, when the second group of thermally conductive fiber cloth 1022 includes multiple layers of second thermally conductive fiber cloth, the multiple layers of second thermally conductive fiber cloth may all be woven cloth, or all be unidirectional cloth, or one part may be woven cloth and the other part may be unidirectional cloth. When the multiple layers of second thermally conductive fiber cloth are all woven cloth, the corresponding thermally conductive fibers in the multiple layers of second thermally conductive fiber cloth may be arranged in parallel or in an interlaced manner. When the multiple layers of second thermally conductive fiber cloth are all unidirectional cloth, the thermally conductive fibers in the multiple layers of second thermally conductive fiber cloth may be arranged in parallel or in an interlaced manner.

[0185] In some embodiments, see Fig.14 , Fig.14 A three-dimensional diagram of a multilayer stacked structure 102 provided for some other embodiments of the present application. In addition to the above-mentioned first group of thermally conductive films 1023, the first group of thermally conductive fiber felts 1025, the second group of thermally conductive fiber felts 1026, the first group of thermally conductive fiber cloths 1021, and the second group of thermally conductive fiber cloths 1022, the multilayer stacked structure 102 may also include a second group of thermally conductive films 1028 and a third group of thermally conductive fiber felts 1029. The second group of thermally conductive films 1028 are stacked between the second group of thermally conductive fiber felts 1026 and the second group of thermally conductive fiber cloths 1022, and the third group of thermally conductive fiber felts 1029 are stacked between the second group of thermally conductive films 1028 and the second group of thermally conductive fiber cloths 1022. Increasing the number of layers of thermally conductive materials in the thermally conductive composite material 100 is conducive to improving thermal conductivity. The thermally conductive fiber cloths form the outermost layers on both sides of the multilayer stacked structure 102, which can ensure the structural strength of the multilayer stacked structure 102.

[0186] In some other embodiments, see Fig.15 , Fig.15A three-dimensional diagram of a multilayer stacked structure 102 provided in some other embodiments of the present application. In addition to the first group of thermally conductive films 1023, the first group of thermally conductive fiber felts 1025, the second group of thermally conductive fiber felts 1026, the first group of thermally conductive fiber cloths 1021, and the second group of thermally conductive fiber cloths 1022, the multilayer stacked structure 102 may also include a second group of thermally conductive films 1028, a third group of thermally conductive fiber felts 1029, a fourth group of thermally conductive fiber felts 1030, and a third group of thermally conductive fiber cloths 1031. The third group of heat-conductive fiber felt 1029 is stacked on the side of the second group of heat-conductive fiber cloth 1022 facing away from the second group of heat-conductive fiber felt 1026, the second group of heat-conductive film 1028 is stacked on the side of the third group of heat-conductive fiber felt 1029 facing away from the second group of heat-conductive fiber cloth 1022, the fourth group of heat-conductive fiber felt 1030 is stacked on the side of the second group of heat-conductive film 1028 facing away from the third group of heat-conductive fiber felt 1029, and the third group of heat-conductive fiber cloth 1031 is stacked on the side of the fourth group of heat-conductive fiber felt 1030 facing away from the second group of heat-conductive film 1028. In this way, the number of layers of heat-conductive material in the heat-conductive composite material 100 can also be increased, which is conducive to improving the thermal conductivity. The heat-conductive fiber cloth forms the outermost layers on both sides of the multi-layer stacking structure 102, which can ensure the structural strength of the multi-layer stacking structure 102.

[0187] On the basis of the above embodiments, in order to further enhance the interlayer bonding strength of the multilayer stacked structure 102, in some embodiments, refer to Fig.16 , Fig.16 The three-dimensional diagram of the multilayer stacking structure 102 provided in some embodiments of the present application. In this embodiment, the multilayer stacking structure 102 further includes a fiber line 1027. The fiber line 1027 can be a heat-conducting fiber line or a non-heat-conducting fiber line, which is not specifically limited in the present application.

[0188] The fiber line 1027 includes a plurality of penetration portions 1027a, a plurality of first connection portions 1027b, and a plurality of second connection portions 1027c.

[0189] Among them, a plurality of penetration portions 1027a are at least arrayed and penetrated in the first group of thermally conductive films 1023. A plurality of first connection portions 1027b and the first group of thermally conductive fiber felts 1025 are located on the same side of the first group of thermally conductive films 1023, and the plurality of first connection portions 1027b are respectively connected between the plurality of penetration portions 1027a. A plurality of second connection portions 1027c are located on the side of the first group of thermally conductive films 1023 that is away from the first group of thermally conductive fiber felts 1025, and the plurality of second connection portions 1027c are respectively connected between the plurality of penetration portions 1027a.

[0190] In this way, with the help of the fiber line 1027, the bonding strength between each layer in each first thermally conductive film in the first group of thermally conductive films 1023 and between each first thermally conductive film can be further increased, thereby effectively improving the interlayer bonding strength of the multilayer stacking structure 102 and improving the mechanical structural strength of the thermally conductive composite material 100.

[0191] In the above embodiments, the plurality of first connection portions 1027b may be located between the first group of thermal conductive fiber felts 1025 and the first group of thermal conductive films 1023, or between the first group of thermal conductive fiber felts 1025 and the first group of thermal conductive fiber cloths 1021, or on the side of the first group of thermal conductive fiber cloths 1021 facing away from the first group of thermal conductive fiber felts 1025.

[0192] In some embodiments, please refer to Fig.16 A plurality of penetration portions 1027a are also arrayed and penetrated through the first group of thermal conductive fiber felts 1025 and the first group of thermal conductive fiber cloths 1021, and the first connection portion 1027b is located on the side of the first group of thermal conductive fiber cloths 1021 facing away from the first group of thermal conductive fiber felts 1025.

[0193] In this way, with the help of the fiber wire 1027, the bonding force between the first group of thermally conductive films 1023 and the first group of thermally conductive fiber felts 1025, and between the first group of thermally conductive fiber felts 1025 and the first group of thermally conductive fiber cloths 1021 can be improved, further increasing the mechanical structural strength of the thermally conductive composite material 100. At the same time, when the fiber wire 1027 is a thermally conductive fiber wire, the fiber wire 1027 can also form a thermally conductive path, which can enhance the thermal conductivity of the multi-layer stacked structure 102 in the stacking direction, and improve the thermal conductivity of the thermally conductive composite material 100.

[0194] Similarly, the plurality of second connection portions 1027c may be located between the second group of thermal conductive fiber felts 1026 and the first group of thermal conductive films 1023, or between the second group of thermal conductive fiber felts 1026 and the second group of thermal conductive fiber cloth 1022, or on the side of the second group of thermal conductive fiber cloth 1022 facing away from the second group of thermal conductive fiber felts 1026.

[0195] In some embodiments, please refer to Fig.16 A plurality of penetration portions 1027a are also arrayed and penetrated through the second group of thermal conductive fiber felts 1026 and the second group of thermal conductive fiber cloths 1022, and the second connection portion 1027c is located on the side of the second group of thermal conductive fiber cloths 1022 facing away from the second group of thermal conductive fiber felts 1026.

[0196] In this way, with the help of the fiber line 1027, the bonding force between the first group of thermally conductive films 1023 and the second group of thermally conductive fiber felts 1026, and between the second group of thermally conductive fiber felts 1026 and the second group of thermally conductive fiber cloths 1022 can be improved, further increasing the mechanical structural strength of the thermally conductive composite material 100. At the same time, when the fiber line 1027 is a thermally conductive fiber line, the fiber line 1027 can also form a thermally conductive path, which can enhance the thermal conductivity of the multi-layer stacked structure 102 in the stacking direction and enhance the thermal conductivity of the thermally conductive composite material 100. At the same time, the fiber line 1027 can also form a thermally conductive path, which can enhance the thermal conductivity of the multi-layer stacked structure 102 in the stacking direction and enhance the thermal conductivity of the thermally conductive composite material 100.

[0197] In some embodiments, when the multi-layer stack structure 102 is Fig.14 When the second group of thermal conductive films 1028 and the third group of thermal conductive fiber felts 1029 are also shown, multiple penetration portions 1027a can also be arranged in an array and penetrate the second group of thermal conductive films 1028 and the third group of thermal conductive fiber felts 1029, the first connecting portion 1027b is located on the side of the first group of thermal conductive fiber cloth 1021 facing away from the first group of thermal conductive fiber felts 1025, and the second connecting portion 1027c is located on the side of the second group of thermal conductive fiber cloth 1022 facing away from the third group of thermal conductive fiber felts 1029.

[0198] When the multi-layer stack structure 102 is Fig.15 When the figure also includes a second group of thermally conductive films 1028, a third group of thermally conductive fiber felts 1029, a fourth group of thermally conductive fiber felts 1030 and a third group of thermally conductive fiber cloth 1031, a plurality of penetration portions 1027a may also be arranged in an array and penetrate the second group of thermally conductive films 1028, the third group of thermally conductive fiber felts 1029, the fourth group of thermally conductive fiber felts 1030 and the third group of thermally conductive fiber cloth 1031, and the second connecting portion 1027c is located on the side of the third group of thermally conductive fiber cloth 1031 facing away from the fourth group of thermally conductive fiber felts 1030.

[0199] In any of the above embodiments, the material of the fiber line 1027 includes but is not limited to at least one of polyester fiber, polyamide fiber, polyethylene fiber and aramid fiber. These materials have high strength and can ensure the mechanical structural strength of the thermal conductive composite material 100.

[0200] The plurality of first connection parts 1027b and the plurality of second connection parts 1027c may be arranged in a straight line, an S-shaped quilted line, a diamond grid, etc., and the present application does not make any specific limitation on this.

[0201] The fiber line 1027 can be arranged in the multi-layer stacked structure 102 by means of a stitching process, and the stitching process includes but is not limited to a warp knitting process and a quilting process. The stitching gap can be greater than or equal to 3 mm and less than or equal to 50 mm.

[0202] In order to reduce the difficulty of the suturing process, in some embodiments, refer to Fig.16 The first group of thermally conductive films 1023 array is provided with a plurality of through holes 1023a, a plurality of through portions 1027a are respectively accommodated in the plurality of through holes 1023a, and a diameter of the through hole 1023a is greater than a diameter of the through portion 1027a in the through hole 1023a.

[0203] In this way, before the fiber lines 1027 are arranged by the stitching process, a plurality of through holes 1023a can be pre-arranged on the first group of thermally conductive films 1023, and during the stitching process, the fiber lines 1027 are arranged along the through holes 1023a to reduce the force required for stitching, thereby reducing the difficulty of stitching operation and saving costs. At the same time, the first group of thermally conductive films will not be damaged during the stitching process.

[0204] It is understandable that, in the above embodiment, the diameter of the through hole 1023a affects the alignment accuracy of the stitching process, the in-plane structural strength and thermal conductivity of the first group of thermally conductive films 1023. Specifically, the larger the diameter of the through hole 1023a, the lower the alignment accuracy requirement of the stitching process, the smaller the required force, the lower the stitching difficulty, but the lower the in-plane structural strength and thermal conductivity of the first group of thermally conductive films 1023.

[0205] Based on this, optionally, the diameter of the through hole 1023a can be greater than or equal to 0.3 mm and less than or equal to 5 mm. Specifically, the diameter of the through hole 1023a can be 0.3 mm, 0.5 mm, 1 mm, 2 mm, 3 mm, 4 mm or 5 mm. When the diameter of the through hole 1023a is within this range, the alignment accuracy of the stitching process, the in-plane structural strength and thermal conductivity of the first group of thermal conductive films 1023 can be taken into account at the same time.

[0206] The present application also provides a method for processing the thermally conductive composite material 100. Fig.17 , Fig.17 A flowchart of a method for processing a thermally conductive composite material 100 provided in some embodiments of the present application, the method comprising the following steps S100 to S200.

[0207] Step S100: manufacturing a multi-layer stacking structure 102 .

[0208] The multi-layer stacked structure 102 includes a first group of thermally conductive films 1023 and a first group of thermally conductive fiber felts 1025 .

[0209] For details, please continue to refer to Fig.17 , step S100 may include the following steps S101 and S102.

[0210] Step S101: stacking the first group of thermal conductive fiber felts 1025 on one side of the first group of thermal conductive films 1023; that is, stacking the first group of thermal conductive fiber felts 1025 on one side of the first group of thermal conductive films 1023 and stacking the first group of thermal conductive fiber felts 1025 and the first group of thermal conductive films 1023.

[0211] Step S102 : extending part of the fibers of the first group of thermally conductive fiber felts 1025 into the first group of thermally conductive films 1023 .

[0212] In this way, some fibers in the first group of thermally conductive fiber felts 1025 extending into the first group of thermally conductive films 1023 form a Z-direction connection structure, which can increase the bonding force between the first group of thermally conductive fiber felts 1025 and the first group of thermally conductive films 1023, between at least some of the layers in the first group of thermally conductive films 1023, and between at least some of the first thermally conductive films, thereby improving the interlayer bonding force of the multilayer stacking structure 102 and increasing the mechanical structural strength of the thermally conductive composite material 100. At the same time, some fibers extending into the first group of thermally conductive films 1023 form a thermally conductive path, which can strengthen the thermal conductivity of the multilayer stacking structure 102 in the stacking direction and improve the thermal conductivity of the thermally conductive composite material 100.

[0213] In some embodiments, step S102 may include: using a needle punching process to extend part of the fibers of the first group of thermally conductive fiber felts 1025 into the first group of thermally conductive films 1023. With the aid of the needle punching process, by setting the needle punching density and the needle punching depth, more fibers on the first group of thermally conductive fiber felts 1025 can be extended into the first group of thermally conductive films 1023, which is conducive to improving the interlayer bonding force and thermal conductivity. Moreover, the needle punching process is simple and easy to operate. In some other embodiments, a water spunlace process can also be used to extend part of the fibers of the first group of thermally conductive fiber felts 1025 into the first group of thermally conductive films 1023.

[0214] In some embodiments, step S102 may include: extending part of the fibers of the first group of thermally conductive fiber felts 1025 into the first group of thermally conductive films 1023, and allowing the part of the fibers of the first group of thermally conductive fiber felts 1025 to penetrate the first group of thermally conductive films 1023. In this way, with the help of the part of the fibers, the bonding force between the sheets in each first thermally conductive film in the first group of thermally conductive films 1023 and between each first thermally conductive film can be increased, thereby effectively improving the interlayer bonding force of the multilayer stacking structure 102 and improving the mechanical structural strength of the thermally conductive composite material 100.

[0215] In some embodiments, the multi-layer stacked structure 102 may further include a second group of thermally conductive fiber felts 1026. On this basis, the above step S100 may include the following steps S103 and S104 in addition to the above steps S101 and S102.

[0216] Step S103 : stacking the second group of thermally conductive fiber felts 1026 on the side of the first group of thermally conductive films 1023 facing away from the first group of thermally conductive fiber felts 1025 .

[0217] Step S103 may be performed after step S101 or simultaneously with step S101. When step S103 is performed after step S101, step S103 may be performed before step S102 or after step S102 or simultaneously with step S102, which is not specifically limited here.

[0218] Step S104: extending some fibers of the second group of thermally conductive fiber felts 1026 into the first group of thermally conductive films 1023, and the first group of thermally conductive films 1023, the first group of thermally conductive fiber felts 1025 and the second group of thermally conductive fiber felts 1026 form a first preform.

[0219] Step S104 may be performed after step S101 or simultaneously with step S101. When step S104 is performed after step S101, step S104 may be performed before step S102 or after step S102 or simultaneously with step S102, which is not specifically limited here.

[0220] In this way, part of the fibers in the second group of thermally conductive fiber felts 1026 extending into the first group of thermally conductive films 1023 also form a Z-direction connection structure, which can increase the bonding force between the second group of thermally conductive fiber felts 1026 and the first group of thermally conductive films 1023, between at least part of the first thermally conductive films in the first group of thermally conductive films 1023, and between at least part of the first thermally conductive films, thereby further improving the interlayer bonding force of the multilayer stacking structure 102 and increasing the mechanical structural strength of the thermally conductive composite material 100. At the same time, part of the fibers extending into the first group of thermally conductive films 1023 form a thermally conductive path, which can strengthen the thermal conductivity of the multilayer stacking structure in the stacking direction and improve the thermal conductivity of the thermally conductive composite material 100.

[0221] In some embodiments, step S104 may include: using a needle punching process to extend part of the fibers of the second group of thermally conductive fiber felts 1026 into the first group of thermally conductive films 1023. With the aid of the needle punching process, by setting the needle punching density and the needle punching depth, more fibers on the second group of thermally conductive fiber felts 1026 can be extended into the first group of thermally conductive films 1023, which is conducive to improving the interlayer bonding force and thermal conductivity. Moreover, the needle punching process is simple and easy to operate. In some other embodiments, a water spunlace process can also be used to extend part of the fibers of the second group of thermally conductive fiber felts 1026 into the first group of thermally conductive films 1023.

[0222] In some embodiments, step S104 may include: extending part of the fibers of the second group of thermally conductive fiber felts 1026 into the first group of thermally conductive films 1023, and allowing the part of the fibers of the second group of thermally conductive fiber felts 1026 to penetrate the first group of thermally conductive films 1023. In this way, with the help of the part of the fibers, the bonding force between the sheets in each first thermally conductive film in the first group of thermally conductive films 1023 and between each first thermally conductive film can be increased, thereby effectively improving the interlayer bonding force of the multilayer stacked structure 102 and improving the mechanical structural strength of the thermally conductive composite material 100.

[0223] On the basis of the above embodiment, the above step S102 may further include: extending part of the fibers of the first group of thermally conductive fiber felts 1025 into the first group of thermally conductive films 1023, and passing through the first group of thermally conductive films 1023, and extending into the second group of thermally conductive fiber felts 1026. Thus, part of the fibers of the first group of thermally conductive fiber felts 1025 may be connected with the fibers in the second group of thermally conductive fiber felts 1026, and anchor the first group of thermally conductive films 1023, which can further increase the bonding force between the first group of thermally conductive films 1023 and the first group of thermally conductive fiber felts 1025, between the first group of thermally conductive films 1023 and the second group of thermally conductive fiber felts 1026, between the layers in each first thermally conductive film in the first group of thermally conductive films 1023, and between each first thermally conductive film, thereby improving the mechanical structural strength of the thermally conductive composite material 100.

[0224] Similarly, the above step S104 may further include: extending part of the fibers of the second group of thermally conductive fiber felts 1026 into the first group of thermally conductive films 1023, and passing through the first group of thermally conductive films 1023, and extending into the first group of thermally conductive fiber felts 1025. Thus, part of the fibers of the second group of thermally conductive fiber felts 1026 may be connected with the fibers in the first group of thermally conductive fiber felts 1025, and anchor the first group of thermally conductive films 1023, which can further increase the bonding force between the first group of thermally conductive films 1023 and the first group of thermally conductive fiber felts 1025, between the first group of thermally conductive films 1023 and the second group of thermally conductive fiber felts 1026, between the layers in each first thermally conductive film in the first group of thermally conductive films 1023, and between each first thermally conductive film, thereby improving the mechanical structural strength of the thermally conductive composite material 100.

[0225] It can be known that the factors affecting the mechanical structural strength of the thermally conductive composite material 100 include not only the interlayer bonding force of the multilayer stacked structure 102 , but also the in-plane structural strength of the multilayer stacked structure 102 .

[0226] On the basis of the above embodiments, in order to further improve the in-plane structural strength of the multilayer stacked structure 102 on the basis of improving the interlayer bonding force of the multilayer stacked structure 102, in some embodiments, the multilayer stacked structure 102 may further include a first group of thermal conductive fiber cloths 1021 and a second group of thermal conductive fiber cloths 1022. On this basis, the above step S100 further includes the following steps S105 and S106.

[0227] Step S105 : stacking the first group of thermal conductive fiber cloths 1021 on the side of the first group of thermal conductive fiber felts 1025 facing away from the first group of thermal conductive films 1023 .

[0228] Step S106 : stacking the second group of thermally conductive fiber cloths 1022 on the side of the second group of thermally conductive fiber felts 1026 facing away from the first group of thermally conductive films 1023 .

[0229] The first group of thermally conductive films 1023 , the first group of thermally conductive fiber felts 1025 , the second group of thermally conductive fiber felts 1026 , the first group of thermally conductive fiber cloths 1021 and the second group of thermally conductive fiber cloths 1022 constitute a second preform.

[0230] Since the extension direction of the fibers in the first group of thermally conductive fiber felts 1025 and the second group of thermally conductive fiber felts 1026 is not fixed, the free ends of some fibers in the first group of thermally conductive fiber felts 1025 can be inserted into the first group of thermally conductive fiber cloths 1021 to be tightly combined with the first group of thermally conductive fiber cloths 1021; the free ends of some fibers in the second group of thermally conductive fiber felts 1026 can be inserted into the second group of thermally conductive fiber cloths 1022 to be tightly combined with the second group of thermally conductive fiber cloths 1022. Based on this, since the first group of thermally conductive fiber cloths 1021 and the second group of thermally conductive fiber cloths 1022 can have better in-plane structural strength, the in-plane structural strength of the multilayer stacked structure 102 can be improved by means of the first group of thermally conductive fiber cloths 1021 and the second group of thermally conductive fiber cloths 1022, thereby further improving the mechanical structural strength of the thermally conductive composite material 100.

[0231] In some embodiments, both step S105 and step S106 can be performed after step S102 and step S104. In this way, it is possible to avoid damaging the in-plane structural strength and surface roughness of the first group of thermally conductive fiber cloths 1021 and the second group of thermally conductive fiber cloths 1022 when part of the fibers of the first group of thermally conductive fiber felts 1025 are inserted into the first group of thermally conductive films 1023 and part of the fibers of the second group of thermally conductive fiber felts 1026 are inserted into the first group of thermally conductive films 1023 by using a needle punching process or a hydroentanglement process, thereby ensuring the structural strength of the thermally conductive composite material 100 and not increasing the surface roughness of the thermally conductive composite material 100.

[0232] In some embodiments, the multilayer stacked structure 102 may further include a fiber line 1027. The fiber line 1027 includes a plurality of through portions 1027a, a plurality of first connection portions 1027b, and a plurality of second connection portions 1027c. On this basis, the above step S100 may further include the following step S107.

[0233] Step S107: The fiber wire 1027 is at least arranged on the first group of thermally conductive films 1023, and a plurality of penetration portions 1027a are arrayed and arranged through the first group of thermally conductive films 1023, a plurality of first connection portions 1027b and the first group of thermally conductive fiber felts 1025 are located on the same side of the first group of thermally conductive films 1023, and the plurality of first connection portions 1027b are respectively connected between the plurality of penetration portions 1027a, and a plurality of second connection portions 1027c are located on the side of the first group of thermally conductive films 1023 facing away from the first group of thermally conductive fiber felts 1025, and are respectively connected between the plurality of penetration portions 1027a.

[0234] In this way, with the help of the fiber line 1027, the bonding strength between each layer in each first thermally conductive film in the first group of thermally conductive films 1023 and between each first thermally conductive film can be further increased, thereby effectively improving the interlayer bonding strength of the multilayer stacking structure 102 and improving the mechanical structural strength of the thermally conductive composite material 100.

[0235] In some embodiments, the above step S107 may include: using a stitching process to set the fiber line 1027 at least on the first group of thermal conductive films. The stitching process includes but is not limited to a warp knitting process and a quilting process. The stitching process is simple, easy to operate, highly efficient, and has a neat structure after forming.

[0236] In some embodiments, the above-mentioned step S107 may include: setting the fiber line 1027 on the above-mentioned second preform, and making a plurality of penetration parts 1027a arrayed and penetrated in the second preform, a plurality of first connection parts 1027b are located on the side of the first group of thermal conductive fiber cloth 1021 in the second preform facing away from the first group of thermal conductive fiber felt 1025, and the plurality of first connection parts 1027b are respectively connected between the plurality of penetration parts 1027a, and a plurality of second connection parts 1027c are located on the side of the second group of thermal conductive fiber cloth 1022 facing away from the second group of thermal conductive fiber felt 1026, and are respectively connected between the plurality of penetration parts 1027a.

[0237] In this way, with the help of the fiber wire 1027, the bonding force between the first group of thermally conductive films 1023 and the first group of thermally conductive fiber felts 1025, between the first group of thermally conductive fiber felts 1025 and the first group of thermally conductive fiber cloths 1021, between the first group of thermally conductive films 1023 and the second group of thermally conductive fiber felts 1026, and between the second group of thermally conductive fiber felts 1026 and the second group of thermally conductive fiber cloths 1022 can be improved, thereby further increasing the mechanical structural strength of the thermally conductive composite material 100. At the same time, when the fiber wire 1027 is a thermally conductive fiber wire, the fiber wire 1027 can also form a thermally conductive path, which can strengthen the thermal conductivity of the multi-layer stacked structure 102 in the stacking direction and improve the thermal conductivity of the thermally conductive composite material 100.

[0238] In some embodiments, the above step S100 may further include the following step S108.

[0239] Step S108 : arranging a plurality of through holes 1023 a in an array on the first group of thermally conductive films 1023 .

[0240] Step S108 may be performed using a punching process or a drilling process.

[0241] The shape of the through hole 1023a can be circular, square, triangular, rectangular, polygonal, etc. When the shape of the through hole 1023a is circular, the diameter of the through hole 1023a can be greater than or equal to 0.3 mm and less than or equal to 5 mm. In this way, the thermal conductivity of the first group of thermal conductive films 1023 will not be damaged.

[0242] Step S108 may be performed before step S101.

[0243] On the basis of the above, the above step S107 may include: using a suturing process to set the fiber line 1027 at least on the first group of thermally conductive films 1023, and to place the plurality of through parts 1027a in the plurality of through holes 1023a, respectively, thereby reducing the force required for suturing, reducing the difficulty of suturing and the degree of wear of the suturing tool. At the same time, the first group of thermally conductive films will not be damaged during the suturing process.

[0244] In some other embodiments, the above steps S107 and S108 may not be performed.

[0245] Step S200: Fill the multi-layer stacked structure 102 with a resin substrate 101. The resin substrate 101 may be provided with a thermally conductive filler 103. Specifically, the thermally conductive filler 103 may be dispersed in the resin substrate 101 to enhance the thermal conductivity of the resin substrate 101.

[0246] Specifically, in step S200 , the resin substrate 101 may be filled in the multi-layer stacked structure 102 by a dry process or a wet process.

[0247] The dry process may be to stack a thermoplastic resin film or a thermosetting resin film on the surface of the multi-layer stacked structure 102, then heat press to melt the resin film, and immerse the multi-layer stacked structure 102 in the molten resin, and finally cool. The pressurized and heated equipment includes but is not limited to a hot press mold, a flat plate heater, a hot press roller, and the like.

[0248] In addition, the wet process may be to infiltrate the multilayer stacked structure 102 with a liquid thermosetting resin or a molten thermoplastic resin, and then heat press to solidify the liquid resin. The liquid thermosetting resin includes but is not limited to epoxy resin. The hot pressing equipment includes but is not limited to a hot pressing mold, a flat heater, a hot pressing roller, and the like.

[0249] In some embodiments, step S200 may be performed after step S107 . When the multilayer stacked structure 102 does not include the fiber line 1027 , step S200 may also be performed after step S106 .

[0250] In some other embodiments, step S200 may include the following steps S201 to S203. Steps S201 to S203 may be performed before the above step S105.

[0251] Step S201: filling a first portion of resin matrix into a first preform, and the first preform and the first portion of resin matrix form a third preform.

[0252] Step S202: filling the first group of thermally conductive fiber cloth 1021 with a second portion of resin matrix, so that the first group of thermally conductive fiber cloth and the second portion of resin matrix form a fourth preform.

[0253] Step S203: filling the second group of thermally conductive fiber cloth 1022 with the third portion of resin matrix, and the second group of thermally conductive fiber cloth and the third portion of resin matrix form a fifth preform.

[0254] Among them, step S201 to step S203 can be performed using the above-mentioned dry process or the above-mentioned wet process, and this application does not make any specific limitations on this.

[0255] Based on this, the above step S105 includes: stacking the fourth preform on one side of the third preform, and positioning the first group of thermal conductive fiber cloths 1021 on the side of the first group of thermal conductive fiber felts 1025 facing away from the first group of thermal conductive films 1023 .

[0256] The step S106 includes: stacking the fifth preform on the side of the third preform facing away from the fourth preform, and positioning the second group of thermal conductive fiber cloths 1022 on the side of the second group of thermal conductive fiber felts 1026 facing away from the first group of thermal conductive films 1023 .

[0257] Based on the above, step S200 also includes the following step S204, which is located after the above step S106.

[0258] Step S204: forming the first portion of the resin base material in the third preform, the second portion of the resin base material in the fourth preform, and the third portion of the resin base material in the fifth preform into one body.

[0259] In some embodiments, a hot pressing process may be used to form the first portion of the resin substrate in the third preform, the second portion of the resin substrate in the fourth preform, and the third portion of the resin substrate in the fifth preform into one body.

[0260] In this way, during the process of manufacturing the multi-layer stacking structure 102 , the resin matrix is ​​filled in the multi-layer stacking structure 102 , so that the resin matrix can be fully filled in the multi-layer stacking structure to ensure the structural strength of the thermal conductive composite material 100 .

[0261] In some embodiments, when the first thermally conductive fiber cloth in the first group of thermally conductive fiber cloths 1021 and the second thermally conductive fiber cloth in the second group of thermally conductive fiber cloths 1022 are unidirectional cloths, since the thermally conductive fibers in the unidirectional cloths are fixed by resin, resin already exists in the first group of thermally conductive fiber cloths 1021 and the second group of thermally conductive fiber cloths 1022, and therefore, there is no need to fill the second portion of resin matrix in the first group of thermally conductive fiber cloths 1021, and there is no need to fill the third portion of resin matrix in the second group of thermally conductive fiber cloths 1022. That is, there is no need to perform the above steps S202 and S203.

[0262] In some embodiments, when the first thermal conductive fiber cloth in the first group of thermal conductive fiber cloths 1021 and the second thermal conductive fiber cloth in the second group of thermal conductive fiber cloths 1022 are unidirectional cloths, the resin of the unidirectional cloths can be the same as the material of the above-mentioned resin substrates, so that these resin substrates can be combined together during the hot pressing process to ensure structural strength.

[0263] According to the processing method of the thermally conductive composite material 100 described in the above embodiments, two specific embodiments of the processing method are listed below. The two specific embodiments are respectively the following embodiment 1 and embodiment 2.

[0264] Embodiment 1

[0265] The method for processing the thermally conductive composite material 100 includes the following steps S11 to S17 .

[0266] Step S11: stack the first group of thermally conductive films 1023 between the first group of thermally conductive fiber felts 1025 and the second group of thermally conductive fiber felts 1026 to form a laminated module. The first group of thermally conductive films 1023 includes graphite films; the fibers in the first group of thermally conductive fiber felts 1025 and the second group of thermally conductive fiber felts 1026 are carbon fibers, and the length of the carbon fibers is selected between 1 mm and 10 mm according to the requirements of toughening, strength, and thermal conductivity.

[0267] Step S12: The lamination module is needle-punched from opposite sides of the lamination module along a direction perpendicular to the lamination module, so that part of the fibers in the first group of thermal conductive fiber felts 1025 pass through the first group of thermal conductive films 1023 and extend into the second group of thermal conductive fiber felts 1026, and at the same time, part of the fibers in the second group of thermal conductive fiber felts 1026 pass through the first group of thermal conductive films 1023 and extend into the first group of thermal conductive fiber felts 1025, so as to form a first preform.

[0268] Step S13: Covering the surface of the first preform with a thermoplastic resin film, preheating with a flat heater, and then hot pressing with a hot pressing roller to melt the thermoplastic resin film and impregnate it with the first preform to form a third preform.

[0269] Step S14: Cover the surface of the first group of thermal conductive fiber cloths with a thermoplastic resin film, preheat with a flat heater, and then heat press with a hot pressing roller to melt the thermoplastic resin film and impregnate it with the first group of thermal conductive fiber cloths to form a fourth preform. The first group of thermal conductive fiber cloths are woven cloths formed by T300 thermal conductive fibers through a plain weave process.

[0270] Step S15: Cover the surface of the second group of thermal conductive fiber cloth with a thermoplastic resin film, preheat it with a flat heater, and then heat press it with a hot pressing roller to melt the thermoplastic resin film and impregnate it with the second group of thermal conductive fiber cloth to form a fifth preform. The second group of thermal conductive fiber cloth is a plain woven cloth formed by a weaving process of T300 thermal conductive fiber.

[0271] Step S16: stack the third preform between the fourth preform and the fifth preform, and make the first group of thermal conductive fiber cloth 1021 located on the side of the first group of thermal conductive fiber felt 1025 facing away from the first group of thermal conductive film 1023, and the second group of thermal conductive fiber cloth 1022 located on the side of the second group of thermal conductive fiber felt 1026 facing away from the first group of thermal conductive film 1023.

[0272] Step S17: hot-pressing the third preform, the fourth preform and the fifth preform to form a whole by stacking them using a mold, so that the resin substrate in the third preform, the resin substrate in the fourth preform and the resin substrate in the fifth preform are molded into one body, thereby forming a thermally conductive composite material 100.

[0273] It has been verified that the in-plane thermal conductivity of the thermally conductive composite material 100 obtained through steps S11 to S17 can be increased to greater than 40 W / (m·K), and the thermal conductivity along the stacking direction of the multilayer stacking structure 102 is approximately 1 W / (m·K).

[0274] Embodiment 2

[0275] The method for processing the thermally conductive composite material 100 includes the following steps S21 to S25 .

[0276] Step S21: stacking a first group of thermally conductive films 1023 having a plurality of through holes 1023a in an array between a first group of thermally conductive fiber felts 1025 and a second group of thermally conductive fiber felts 1026 to form a laminated module. The first group of thermally conductive films 1023 includes a graphite film; and the fibers in the first group of thermally conductive fiber felts 1025 and the second group of thermally conductive fiber felts 1026 are carbon fibers.

[0277] Step S22: The stacking module is needle-punched from opposite sides of the stacking module along a direction perpendicular to the stacking module, so that part of the fibers in the first group of thermal conductive fiber felts 1025 pass through the first group of thermal conductive films 1023 and extend into the second group of thermal conductive fiber felts 1026, and at the same time, part of the fibers in the second group of thermal conductive fiber felts 1026 pass through the first group of thermal conductive films 1023 and extend into the first group of thermal conductive fiber felts 1025, so as to form a first preform.

[0278] Step S23: stacking the first preform between the first group of thermal conductive fiber cloth 1021 and the second group of thermal conductive fiber cloth 1022 to form a second preform, wherein the first group of thermal conductive fiber cloth 1021 and the second group of thermal conductive fiber cloth 1022 are twill woven fabrics formed by weaving T300 thermal conductive fibers.

[0279] Step S24: Using a quilting process, the fiber line 1027 is arranged on the second preform, and a plurality of penetration portions 1027a are arranged in an array and penetrated on the second preform, a plurality of first connection portions 1027b are located on the side of the first group of thermal conductive fiber cloth 1021 in the second preform that is opposite to the first group of thermal conductive fiber felt 1025, and are respectively connected between the plurality of penetration portions 1027a, and a plurality of second connection portions 1027c are located on the side of the second group of thermal conductive fiber cloth 1022 in the second preform that is opposite to the second group of thermal conductive fiber felt 1026, and are respectively connected between the plurality of penetration portions 1027a, so as to form a multi-layer stacking structure. The material of the fiber line 1027 is aramid.

[0280] Step S25 : pre-impregnating the multi-layer stacked structure with resin by using a dry process or a wet process, and hot pressing to form a thermally conductive composite material 100 .

[0281] In order to improve the structural strength of the thermally conductive composite material 100 in the stacking direction, please refer to Fig.18 , Fig.18 The three-dimensional diagram of the multi-layer stack structure 102 provided in some other embodiments of the present application. In this embodiment, the multi-layer stack structure 102 includes a first group of thermally conductive films 1023 and fiber lines 1027 .

[0282] The fiber line 1027 includes a plurality of penetration portions 1027a, a plurality of first connection portions 1027b, and a plurality of second connection portions 1027c.

[0283] Among them, the plurality of penetration portions 1027a are at least arranged in an array and penetrate the first group of thermally conductive films 1023. The plurality of first connecting portions 1027b are located on one side of the first group of thermally conductive films 1023, and the plurality of first connecting portions 1027b are respectively connected between the plurality of penetration portions 1027a. The plurality of second connecting portions 1027c are located on the side of the first group of thermally conductive films 1023 that is opposite to the plurality of first connecting portions 1027b, and the plurality of second connecting portions 1027c are respectively connected between the plurality of penetration portions 1027a.

[0284] In this way, with the help of the fiber line 1027, the bonding strength between each layer in each first thermally conductive film in the first group of thermally conductive films 1023 and between each first thermally conductive film can be increased, thereby improving the interlayer bonding strength of the multilayer stacking structure 102, inhibiting interlayer peeling, and enhancing the resistance of the thermally conductive composite material 100 to delamination damage and impact resistance.

[0285] Based on the above embodiment, optionally, please refer to Fig.19 , Fig.19 A three-dimensional diagram of a multilayer stacked structure 102 provided in some other embodiments of the present application. In this embodiment, the multilayer stacked structure 102 includes, in addition to the first group of thermally conductive films 1023 and fiber lines 1027, a first group of thermally conductive fiber cloths 1021. The first group of thermally conductive fiber cloths 1021 are stacked on one side of the first group of thermally conductive films 1023.

[0286] Based on this, a plurality of penetration portions 1027a are also arranged in an array and penetrate the first group of thermally conductive fiber cloths 1021. A plurality of first connection portions 1027b are located on a side of the first group of thermally conductive fiber cloths 1021 that is away from the first group of thermally conductive films 1023.

[0287] In this way, with the help of the fiber line 1027, the bonding force between the first group of thermally conductive films 1023 and the first group of thermally conductive fiber cloths 1021 can be improved, and the mechanical structural strength of the thermally conductive composite material 100 can be further increased. At the same time, since the in-plane structural strength of the first group of thermally conductive fiber cloths 1021 is relatively good, the in-plane structural strength of the multi-layer stacking structure 102 can be improved with the help of the first group of thermally conductive fiber cloths 1021, thereby further suppressing interlayer peeling and enhancing the anti-delamination damage and impact strength of the thermally conductive composite material 100. Moreover, when the fiber line 1027 is a thermally conductive fiber line, the fiber line 1027 can also form a thermally conductive path, which can strengthen the thermal conductivity of the multi-layer stacking structure 102 in the stacking direction and improve the thermal conductivity of the thermally conductive composite material 100.

[0288] Based on the above embodiment, optionally, please refer to Fig. 20 , Fig. 20 A three-dimensional diagram of a multilayer stacked structure 102 provided in some other embodiments of the present application. In this embodiment, the multilayer stacked structure 102 includes, in addition to the first group of thermally conductive films 1023, fiber lines 1027 and the first group of thermally conductive fiber cloths 1021, a second group of thermally conductive fiber cloths 1022. The second group of thermally conductive fiber cloths 1022 are stacked on the side of the first group of thermally conductive films 1023 that faces away from the first group of thermally conductive fiber cloths 1021.

[0289] Based on this, a plurality of penetration portions 1027a are also arranged in an array and penetrate the second group of thermally conductive fiber cloth 1022. A plurality of second connection portions 1027c are located on a side of the second group of thermally conductive fiber cloth 1022 that is away from the first group of thermally conductive films 1023.

[0290] In this way, with the help of the fiber wire 1027, the bonding force between the first group of thermally conductive films 1023 and the second group of thermally conductive fiber cloths 1022 can be improved, interlayer peeling can be further suppressed, and the anti-delamination damage and impact resistance of the thermally conductive composite material 100 can be enhanced. At the same time, since the second group of thermally conductive fiber cloths 1022 have a better in-plane structural strength, the in-plane structural strength of the multi-layer stacking structure 102 can be further improved with the help of the second group of thermally conductive fiber cloths 1022, thereby further improving the mechanical structural strength of the thermally conductive composite material 100.

[0291] In some embodiments, see Fig.21 , Fig.21 The multilayer stacking structure 102 is a three-dimensional diagram of some other embodiments of the present application. In addition to the first group of thermal conductive films 1023, the first group of thermal conductive fiber cloths 1021, the second group of thermal conductive fiber cloths 1022 and the fiber lines 1027, the multilayer stacking structure 102 may also include a second group of thermal conductive films 1028 and a third group of thermal conductive fiber cloths 1031.

[0292] The second group of thermal conductive films 1028 is stacked on the side of the second group of thermal conductive fiber cloth 1022 facing away from the first group of thermal conductive films 1023 , and the third group of thermal conductive fiber cloth 1031 is stacked on the side of the second group of thermal conductive films 1028 facing away from the second group of thermal conductive fiber cloth 1022 .

[0293] On this basis, multiple penetration portions 1027a are also arrayed and penetrated in the second group of thermal conductive films 1028 and the third group of thermal conductive fiber cloth 1031, and multiple second connection portions 1027c are located on the side of the third group of thermal conductive fiber cloth 1031 facing away from the second group of thermal conductive films 1028.

[0294] In this way, the number of layers of the thermally conductive material in the thermally conductive composite material 100 is increased, which is beneficial to improving the thermal conductivity. Moreover, the thermally conductive fiber cloth forms the outermost layers on both sides of the multi-layer stacking structure 102 , which can ensure the structural strength of the multi-layer stacking structure 102 .

[0295] For further information, see Fig. 22 , Fig. 22 A three-dimensional diagram of a multilayer stacking structure 102 is provided for some other embodiments of the present application. In addition to the first group of thermal conductive films 1023, the first group of thermal conductive fiber cloths 1021, the second group of thermal conductive fiber cloths 1022, the second group of thermal conductive films 1028, the third group of thermal conductive fiber cloths 1031 and the fiber lines 1027, the multilayer stacking structure 102 may also include a third group of thermal conductive films 1032 and a fourth group of thermal conductive fiber cloths 1033.

[0296] The third group of thermal conductive films 1032 is stacked on the side of the third group of thermal conductive fiber cloth 1031 facing away from the second group of thermal conductive films 1028 , and the fourth group of thermal conductive fiber cloth 1033 is stacked on the side of the third group of thermal conductive films 1032 facing away from the third group of thermal conductive fiber cloth 1031 .

[0297] On this basis, multiple penetration portions 1027a are also arrayed and penetrated in the third group of thermal conductive films 1032 and the fourth group of thermal conductive fiber cloth 1033, and multiple second connection portions 1027c are located on the side of the fourth group of thermal conductive fiber cloth 1033 facing away from the third group of thermal conductive films 1032.

[0298] This further increases the number of layers of thermally conductive material in the thermally conductive composite material 100 , which is beneficial to improving thermal conductivity. The thermally conductive fiber cloth forms the outermost layers on both sides of the multi-layer stacking structure 102 , which can ensure the structural strength of the multi-layer stacking structure 102 .

[0299] The present application also provides a method for processing the thermally conductive composite material 100. Fig.23 , Fig.23 A flowchart of a method for processing a thermally conductive composite material 100 provided in some embodiments of the present application, the method comprising the following steps S300 and S400.

[0300] Step S300: manufacturing a multi-layer stacking structure 102 .

[0301] The multi-layer stacked structure 102 includes a first group of thermally conductive films 1023 and fiber lines 1027 .

[0302] The fiber line 1027 includes a plurality of penetration portions 1027a, a plurality of first connection portions 1027b, and a plurality of second connection portions 1027c.

[0303] Based on the above, step S300 may include the following step S301.

[0304] Step S301: The fiber line 1027 is at least arranged on the first group of thermally conductive films 1023, and a plurality of penetrating portions 1027a are at least arrayed and arranged through the first group of thermally conductive films 1023, a plurality of first connecting portions 1027b are located on one side of the first group of thermally conductive films 1023, and the plurality of first connecting portions 1027b are respectively connected between the plurality of penetrating portions 1023, a plurality of second connecting portions 1027c are located on a side of the first group of thermally conductive films 1023 which is opposite to the plurality of first connecting portions 1027b, and the plurality of second connecting portions 1027c are respectively connected between the plurality of penetrating portions 1027a.

[0305] In this way, with the help of the fiber line 1027, the bonding force between each layer in each first thermally conductive film in the first group of thermally conductive films 1023 and between each first thermally conductive film can be increased, thereby improving the interlayer bonding force of the multilayer stacking structure 102 and improving the mechanical structural strength of the thermally conductive composite material 100.

[0306] In some embodiments, the multilayer stacked structure 102 includes, in addition to the first group of thermally conductive films 1023 and fiber lines 1027 , a first group of thermally conductive fiber cloths 1021 .

[0307] Based on this, before the above step S301, step S300 also includes the following step S302.

[0308] Step S302 : stacking the first set of thermally conductive fiber cloths 1021 on one side of the first set of thermally conductive films 1023 .

[0309] On the basis of the above, step S301 may include: arranging the fiber line 1027 at least on the first group of thermally conductive films 1023 and the first group of thermally conductive fiber cloths 1021, and making a plurality of penetration portions 1027a arrayed and penetrated on the first group of thermally conductive films 1023 and the first group of thermally conductive fiber cloths 1021, a plurality of first connection portions 1027b are located on the side of the first group of thermally conductive fiber cloths 1021 facing away from the first group of thermally conductive films 1023, and the plurality of first connection portions 1027b are respectively connected between the plurality of penetration portions 1023, a plurality of second connection portions 1027c are located on the side of the first group of thermally conductive films 1023 facing away from the first group of thermally conductive fiber cloths 1021, and the plurality of second connection portions 1027c are respectively connected between the plurality of penetration portions 1027a.

[0310] In this way, with the help of the fiber line 1027, the bonding force between the first group of thermally conductive films 1023 and the first group of thermally conductive fiber cloths 1021 can be improved, and the mechanical structural strength of the thermally conductive composite material 100 can be further increased. At the same time, since the first group of thermally conductive fiber cloths 1021 have a better in-plane structural strength, the in-plane structural strength of the multi-layer stacking structure 102 can be improved with the help of the first group of thermally conductive fiber cloths 1021, thereby further improving the mechanical structural strength of the thermally conductive composite material 100. Moreover, when the fiber line 1027 is a thermally conductive fiber line, the fiber line 1027 can also form a heat conduction path, which can strengthen the thermal conductivity of the multi-layer stacking structure 102 in the stacking direction and improve the thermal conductivity of the thermally conductive composite material 100.

[0311] On the basis of the above embodiment, optionally, the multilayer stacked structure 102 includes a second group of thermally conductive fiber cloths 1022 in addition to the first group of thermally conductive films 1023 , the fiber lines 1027 and the first group of thermally conductive fiber cloths 1021 .

[0312] Based on this, before the above step S301, step S300 also includes the following step S303.

[0313] Step S303 : stacking the second group of thermal conductive fiber cloths 1022 on the side of the first group of thermal conductive films 1023 facing away from the first group of thermal conductive fiber cloths 1021 .

[0314] On the basis of the above, step S301 may include: arranging the fiber wire 1027 on the first group of thermally conductive films 1023, the first group of thermally conductive fiber cloths 1021, and the second group of thermally conductive fiber cloths 1022, and making a plurality of penetration portions 1027a arrayed and penetrated on the first group of thermally conductive films 1023, the first group of thermally conductive fiber cloths 1021, and the second group of thermally conductive fiber cloths 1022, a plurality of first connecting portions 1027b are located on a side of the first group of thermally conductive fiber cloths 1021 facing away from the first group of thermally conductive films 1023, and the plurality of first connecting portions 1027b are respectively connected between the plurality of penetration portions 1023, a plurality of second connecting portions 1027c are located on a side of the second group of thermally conductive fiber cloths 1022 facing away from the first group of thermally conductive films 1023, and the plurality of second connecting portions 1027c are respectively connected between the plurality of penetration portions 1027a.

[0315] In this way, the fiber wire 1027 can also improve the bonding force between the first group of thermally conductive films 1023 and the second group of thermally conductive fiber cloths 1022, further increasing the mechanical structural strength of the thermally conductive composite material 100. At the same time, since the second group of thermally conductive fiber cloths 1022 have a better in-plane structural strength, the in-plane structural strength of the multilayer stacked structure 102 can be further improved by using the second group of thermally conductive fiber cloths 1022, thereby further improving the mechanical structural strength of the thermally conductive composite material 100.

[0316] In some embodiments, step S301 can be performed using a stitching process, including but not limited to a warp knitting process and a quilting process. The stitching gap is greater than or equal to 3 mm and less than or equal to 50 mm. The stitching process is simple and efficient, and can improve the execution efficiency of step S301. The stitching process will not damage the arrangement and continuity of the fibers in the first group of thermal conductive fiber cloths 1021 and the second group of thermal conductive fiber cloths 1022, and will not affect the in-plane structural strength and surface roughness of the multi-layer stacked structure 102.

[0317] In some embodiments, the above step S300 may further include step S304.

[0318] Step S304 : Arranging a plurality of through holes 1023 a in an array on the first group of thermally conductive films 1023 .

[0319] Step S304 may be performed by a punching process or a drilling process.

[0320] The shape of the through hole 1023a can be circular, square, triangular, rectangular, polygonal, etc. When the shape of the through hole 1023a is circular, the diameter of the through hole 1023a can be greater than or equal to 0.3 mm and less than or equal to 5 mm. In this way, the thermal conductivity of the first group of thermal conductive films 1023 will not be damaged.

[0321] Step S304 may be performed before the above step S302.

[0322] On the basis of the above, the above step S301 may include: arranging the fiber wire 1027 on the first group of thermally conductive films 1023, the first group of thermally conductive fiber cloths 1021 and the second group of thermally conductive fiber cloths 1022, and making a plurality of penetration portions 1027a arrayed and penetrated in the first group of thermally conductive films 1023, the first group of thermally conductive fiber cloths 1021 and the second group of thermally conductive fiber cloths 1022, the plurality of penetration portions 1027a are respectively accommodated in the plurality of through holes 1023a, the plurality of first connecting portions 1027b are located on the side of the first group of thermally conductive fiber cloths 1021 facing away from the first group of thermally conductive films 1023, and the plurality of first connecting portions 1027b are respectively connected between the plurality of penetration portions 1023, the plurality of second connecting portions 1027c are located on the side of the second group of thermally conductive fiber cloths 1022 facing away from the first group of thermally conductive films 1023, and the plurality of second connecting portions 1027c are respectively connected between the plurality of penetration portions 1027a.

[0323] This can reduce the force required for suturing, reduce the difficulty of suturing and the degree of wear of suturing tools. At the same time, the first set of thermal conductive films will not be damaged during the suturing process.

[0324] Step S400: Filling a resin substrate in the multi-layer stacked structure 102. The resin substrate may be provided with a thermally conductive filler. Specifically, the thermally conductive filler may be dispersed in the resin substrate to enhance the thermal conductivity of the resin substrate.

[0325] Step S400 can be performed after step S301, and can be performed by the dry process or wet process, which is not specifically limited in this application. In this way, the multi-layer stacked structure 102 is infiltrated with the resin substrate as a whole, which can simplify the stacking operation of the thermally conductive composite material 100 and save the infiltration process time and cost.

[0326] With the help of the resin matrix, the structural strength of the thermally conductive composite material 100 can be ensured.

[0327] According to the processing method of the thermally conductive composite material 100 described in the above embodiments, a specific embodiment of the processing method is listed below, and the specific embodiment is the following embodiment 3.

[0328] Embodiment 3

[0329] The method for processing the thermally conductive composite material 100 includes the following steps S31 to S34 .

[0330] Step S31: The first group of thermally conductive films 1023, the second group of thermally conductive films, and the third group of thermally conductive films are stacked and arranged between the first group of thermally conductive fiber cloths 1021 and the second group of thermally conductive fiber cloths 1022, between the second group of thermally conductive fiber cloths 1022 and the third group of thermally conductive fiber cloths, and between the third group of thermally conductive fiber cloths and the fourth group of thermally conductive fiber cloths, respectively. The first group of thermally conductive films 1023, the second group of thermally conductive films, and the third group of thermally conductive films are all arranged with a plurality of through holes 1023a in an array, and are all graphite films. The first group of thermal conductive fiber cloth 1021, the second group of thermal conductive fiber cloth 1022, the third group of thermal conductive fiber cloth and the fourth group of thermal conductive fiber cloth are all unidirectional cloths. The fibers in the unidirectional cloths are T700 thermal conductive carbon fibers. The thermal conductive fibers in the first group of thermal conductive fiber cloth 1021 are arranged at 45°, the thermal conductive fibers in the second group of thermal conductive fiber cloth 1022 are arranged at 0°, the thermal conductive fibers in the third group of thermal conductive fiber cloth are arranged at -45°, and the thermal conductive fibers in the fourth group of thermal conductive fiber cloth are arranged at 90°, so as to ensure strong mechanical properties in all directions, thereby ensuring the structural strength in the plane.

[0331] The first group of thermally conductive films 1023 , the second group of thermally conductive films, the third group of thermally conductive films, the first group of thermally conductive fiber cloths 1021 , the second group of thermally conductive fiber cloths 1022 , the third group of thermally conductive fiber cloths and the fourth group of thermally conductive fiber cloths form a multilayer structure.

[0332] Step S32: Using a warp knitting process, the fiber line 1027 is arranged in a parallel straight line pattern on the above-mentioned multi-layer structure, and a plurality of penetration parts 1027a are arranged in an array and penetrated in the multi-layer structure, and the plurality of penetration parts 1027a are respectively penetrated in the plurality of through holes 1023a, a plurality of first connecting parts 1027b are located on the side of the first group of thermal conductive fiber cloth 1021 facing away from the first group of thermal conductive films 1023, and the plurality of first connecting parts 1027b are respectively connected between the plurality of penetration parts 1023, a plurality of second connecting parts 1027c are located on the side of the fourth group of thermal conductive fiber cloth facing away from the third group of thermal conductive films, and the plurality of second connecting parts 1027c are respectively connected between the plurality of penetration parts 1027a, so as to form a sixth preform. The material of the fiber line 1027 is polyester fiber.

[0333] Step S33: Infiltrating the sixth preform with a liquid epoxy resin matrix to form a seventh preform, wherein the epoxy resin liquid contains thermal conductive fillers such as boron nitride and graphene, and the thermal conductive fillers account for 50% of the resin matrix.

[0334] Step S34: hot pressing the seventh preform to form a thermally conductive composite material, wherein the hot pressing temperature is 140° C.-160° C., the pressure is 1 MPa-3 MPa, and the hot pressing time is 10 min-30 min.

[0335] According to experimental verification, the thermal conductivity of the thermally conductive composite material 100 obtained through steps S31 to S34 is above 30W / (m·K) in the plane, which is about 700% higher than that of the prior art, and the thermal conductivity along the stacking direction of the multilayer stacking structure 102 is about 1W / (m·K), which is about 30% higher than that of the prior art, and the tensile strength of the material is increased by 30%, and the elastic modulus is almost unaffected, and the delamination and peeling resistance is improved. Moreover, the fiber lines 1027 set by the warp knitting process are arranged neatly, and the appearance performance is excellent, which can ensure the surface flatness of the thermally conductive composite material 100.

[0336] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0337] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A thermally conductive composite material, characterized in that: A multi-layer stacking structure and a resin substrate filled in the multi-layer stacking structure; wherein the multi-layer stacking structure comprises: A first group of thermally conductive films, wherein the first group of thermally conductive films comprises at least one layer of a first thermally conductive film; A first group of thermally conductive fiber felts, wherein the first group of thermally conductive fiber felts are stacked on one side of the first group of thermally conductive films, and the first group of thermally conductive fiber felts include at least one layer of first thermally conductive fiber felts; and some fibers of the first group of thermally conductive fiber felts extend into the first group of thermally conductive films.

2. The thermally conductive composite material according to claim 1, characterized in that: The multi-layer stacked structure further comprises: The first group of thermally conductive fiber cloths are stacked on a side of the first group of thermally conductive fiber felts facing away from the first group of thermally conductive films, and the first group of thermally conductive fiber cloths include at least one layer of first thermally conductive fiber cloths.

3. The thermally conductive composite material according to claim 2, characterized in that: The multi-layer stacked structure further comprises: A second group of thermally conductive fiber felts, wherein the second group of thermally conductive fiber felts are stacked on a side of the first group of thermally conductive films that is opposite to the first group of thermally conductive fiber felts, and the second group of thermally conductive fiber felts include at least one layer of second thermally conductive fiber felts; and some fibers of the second group of thermally conductive fiber felts extend into the first group of thermally conductive films.

4. The thermally conductive composite material according to claim 3, characterized in that: The multi-layer stacked structure further comprises: The second group of thermally conductive fiber cloths are stacked on the side of the second group of thermally conductive fiber felts facing away from the first group of thermally conductive films, and the second group of thermally conductive fiber cloths include at least one layer of second thermally conductive fiber cloths.

5. The thermally conductive composite material according to claim 4, characterized in that: The multi-layer stacked structure further comprises: A fiber line, the fiber line comprising a plurality of through parts, a plurality of first connecting parts and a plurality of second connecting parts; wherein, The plurality of penetration portions are at least arranged in an array and penetrate the first group of thermally conductive films; The plurality of first connection portions and the first group of heat-conductive fiber felts are located on the same side of the first group of heat-conductive films, and the plurality of first connection portions are respectively connected between the plurality of penetration portions; The plurality of second connection portions are located on a side of the first group of heat-conductive films facing away from the first group of heat-conductive fiber felts, and the plurality of second connection portions are respectively connected between the plurality of penetration portions.

6. The thermally conductive composite material according to claim 5, characterized in that: The plurality of penetration portions are also arranged in an array and penetrate the first group of thermally conductive fiber felts, the first group of thermally conductive fiber cloths, the second group of thermally conductive fiber felts, and the second group of thermally conductive fiber cloths; The plurality of first connection portions are located on a side of the first group of thermally conductive fiber cloths facing away from the first group of thermally conductive fiber felts; The plurality of second connection portions are located on a side of the second group of thermally conductive fiber cloths facing away from the second group of thermally conductive fiber felts.

7. The thermally conductive composite material according to claim 5 or 6, characterized in that: The first group of thermally conductive film arrays is provided with a plurality of through holes, the plurality of through parts are respectively accommodated in the plurality of through holes, and the diameter of the through holes is greater than the diameter of the through parts in the through holes.

8. The thermally conductive composite material according to any one of claims 1 to 7, characterized in that: The material of the first heat-conducting film includes at least one of graphite and graphene.

9. The thermally conductive composite material according to any one of claims 4 to 7, characterized in that: The first thermally conductive fiber cloth and the second thermally conductive fiber cloth are woven cloth or unidirectional cloth.

10. The thermally conductive composite material according to any one of claims 1 to 9, characterized in that: A thermal conductive filler is arranged in the resin substrate.

11. A thermally conductive composite material, characterized in that: A multi-layer stacking structure and a resin substrate filled in the multi-layer stacking structure; wherein the multi-layer stacking structure comprises: A first group of thermally conductive films, wherein the first group of thermally conductive films comprises at least one layer of a first thermally conductive film; A fiber line, the fiber line comprising a plurality of through parts, a plurality of first connecting parts and a plurality of second connecting parts; wherein, The plurality of penetration portions are at least arranged in an array and penetrate the first group of thermally conductive films; The plurality of first connection portions are located on one side of the first group of heat-conductive films, and the plurality of first connection portions are respectively connected between the plurality of penetration portions; The plurality of second connection portions are located on a side of the first group of heat-conductive films that is opposite to the plurality of first connection portions, and the plurality of second connection portions are respectively connected between the plurality of through portions.

12. The thermally conductive composite material according to claim 11, characterized in that: The multi-layer stacked structure further comprises: A first group of thermally conductive fiber cloths, wherein the first group of thermally conductive fiber cloths are stacked on one side of the first group of thermally conductive films, and the first group of thermally conductive fiber cloths includes at least one layer of first thermally conductive fiber cloth; The plurality of penetration portions are also arranged in an array and penetrate the first group of thermally conductive fiber cloths; the plurality of first connection portions are located on a side of the first group of thermally conductive fiber cloths facing away from the first group of thermally conductive films.

13. The thermally conductive composite material according to claim 12, characterized in that: The multi-layer stacked structure further comprises: A second group of thermally conductive fiber cloths, wherein the second group of thermally conductive fiber cloths are stacked on a side of the first group of thermally conductive films that is opposite to the first group of thermally conductive fiber cloths, and the second group of thermally conductive fiber cloths includes at least one layer of second thermally conductive fiber cloths; The plurality of penetration portions are also arranged in an array and penetrate the second group of thermally conductive fiber cloths; the plurality of second connection portions are located on a side of the second group of thermally conductive fiber cloths facing away from the first group of thermally conductive films.

14. An electronic device, characterized in that: It comprises a middle frame or a shell, and the material of the middle frame or the shell is the thermally conductive composite material according to any one of claims 1 to 13.

15. A method for processing a thermally conductive composite material, characterized in that: include: A multilayer stacked structure is manufactured; wherein the multilayer stacked structure comprises a first group of thermally conductive films and a first group of thermally conductive fiber felts; the first group of thermally conductive films comprises at least one layer of a first thermally conductive film; the first group of thermally conductive fiber felts comprises at least one layer of a first thermally conductive fiber felt; the manufacturing of the multilayer stacked structure comprises: Laminating the first group of thermally conductive fiber felts on one side of the first group of thermally conductive films; extending part of the fibers of the first group of thermally conductive fiber felts into the first group of thermally conductive films; A resin matrix is ​​filled in the multi-layer stack structure.

16. The processing method according to claim 15, characterized in that: The multi-layer stacked structure further includes a second group of thermally conductive fiber felts, wherein the second group of thermally conductive fiber felts includes at least one layer of a second thermally conductive fiber felt; The manufacturing of the multi-layer stacked structure further comprises: The second group of thermally conductive fiber felts are stacked and arranged on a side of the first group of thermally conductive films that is opposite to the first group of thermally conductive fiber felts; Part of the fibers of the second group of thermally conductive fiber felts are extended into the first group of thermally conductive films; wherein the first group of thermally conductive films, the first group of thermally conductive fiber felts and the second group of thermally conductive fiber felts form a first preform.

17. The processing method according to claim 16, characterized in that: The multi-layer stacking structure further includes a first group of thermally conductive fiber cloths and a second group of thermally conductive fiber cloths; The first group of thermally conductive fiber cloths includes at least one layer of first thermally conductive fiber cloth; The second group of thermally conductive fiber cloth includes at least one layer of second thermally conductive fiber cloth; The manufacturing of the multi-layer stacked structure further comprises: The first group of thermally conductive fiber cloths are stacked and arranged on a side of the first group of thermally conductive fiber felts that is opposite to the first group of thermally conductive films; The second group of thermal conductive fiber cloth is stacked on the side of the second group of thermal conductive fiber felt facing away from the first group of thermal conductive films; wherein the first group of thermal conductive films, the first group of thermal conductive fiber felt, the second group of thermal conductive fiber felt, the first group of thermal conductive fiber cloth and the second group of thermal conductive fiber cloth constitute a second preform.

18. The processing method according to any one of claims 15 to 17, characterized in that: The multi-layer stacked structure further includes a fiber line, the fiber line including a plurality of through portions, a plurality of first connecting portions, and a plurality of second connecting portions; The manufacturing of the multi-layer stacked structure further comprises: The fiber wire is at least arranged on the first group of thermally conductive films, so that the multiple penetration parts are at least arranged in an array and penetrate the first group of thermally conductive films, the multiple first connecting parts and the first group of thermally conductive fiber felts are located on the same side of the first group of thermally conductive films, and the multiple first connecting parts are respectively connected between the multiple penetration parts, and the multiple second connecting parts are located on the side of the first group of thermally conductive films facing away from the first group of thermally conductive fiber felts, and are respectively connected between the multiple penetration parts.

19. The processing method according to claim 17, characterized in that: Before stacking the first group of thermally conductive fiber cloths on a side of the first group of thermally conductive fiber felts facing away from the first group of thermally conductive films, filling the multi-layer stacked structure with a resin matrix comprises: Filling a first portion of resin matrix into the first preform to form a third preform; Filling the first group of thermally conductive fiber cloths with a second portion of resin matrix to form a fourth preform; Filling a third portion of resin matrix into the second group of thermally conductive fiber cloths to form a fifth preform; The method of laminating the first group of thermally conductive fiber cloths on a side of the first group of thermally conductive fiber felts facing away from the first group of thermally conductive films comprises: Laminating the fourth preform on one side of the third preform; The method of laminating the second group of heat-conductive fiber cloths on a side of the second group of heat-conductive fiber felts facing away from the first group of heat-conductive films comprises: stacking the fifth preform on a side of the third preform facing away from the fourth preform; After the second group of heat-conductive fiber cloths are stacked on the side of the second group of heat-conductive fiber felts facing away from the first group of heat-conductive films, the resin substrate is filled in the multi-layer stacking structure, further comprising: The first portion of the resin base material, the second portion of the resin base material, and the third portion of the resin base material are molded into one body.

20. A method for processing a thermally conductive composite material, characterized in that: include: A multilayer stacked structure is manufactured; wherein the multilayer stacked structure comprises a first group of thermally conductive films and a fiber line; the first group of thermally conductive films comprises at least one layer of a first thermally conductive film; the fiber line comprises a plurality of through portions, a plurality of first connecting portions and a plurality of second connecting portions; the manufacturing of the multilayer stacked structure comprises: The fiber wire is at least arranged on the first group of heat-conducting films, and the plurality of penetration portions are at least arranged in an array and penetrate the first group of heat-conducting films, the plurality of first connecting portions are located on one side of the first group of heat-conducting films, and the plurality of first connecting portions are respectively connected between the plurality of penetration portions, the plurality of second connecting portions are located on a side of the first group of heat-conducting films facing away from the plurality of first connecting portions, and the plurality of second connecting portions are respectively connected between the plurality of penetration portions; A resin matrix is ​​filled in the multi-layer stack structure.

21. The processing method according to claim 20, characterized in that: The multi-layer stacking structure further includes a first group of thermally conductive fiber cloths; the first group of thermally conductive fiber cloths includes at least one layer of first thermally conductive fiber cloth; The fiber wire is arranged at least before the first group of thermally conductive films, and the manufacturing of the multi-layer stacking structure further comprises: Laminating the first group of thermally conductive fiber cloths on one side of the first group of thermally conductive films; Arranging the fiber line at least on the first group of thermally conductive films comprises: The fiber wire is at least arranged on the first group of thermally conductive films and the first group of thermally conductive fiber cloths, and the multiple penetration portions are also arranged in an array and penetrated through the first group of thermally conductive fiber cloths, and the multiple first connection portions are located on a side of the first group of thermally conductive fiber cloths that is away from the first group of thermally conductive films.

22. The processing method according to claim 21, characterized in that: The multi-layer stacking structure further includes a second group of thermally conductive fiber cloths; the second group of thermally conductive fiber cloths includes at least one layer of second thermally conductive fiber cloths; The fiber wire is arranged at least before the first group of thermally conductive films, and the manufacturing of the multi-layer stacking structure further comprises: The second group of thermally conductive fiber cloths are stacked on the side of the first group of thermally conductive films facing away from the first group of thermally conductive fiber cloths; Arranging the fiber line at least on the first group of thermally conductive films comprises: The fiber wire is arranged on the first group of thermally conductive films, the first group of thermally conductive fiber cloths and the second group of thermally conductive fiber cloths, and the multiple penetration portions are also arranged in an array and penetrated on the second group of thermally conductive fiber cloths, and the multiple second connection portions are located on the side of the second group of thermally conductive fiber cloths facing away from the first group of thermally conductive films.

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