Thermal insulation assembly, preparation method thereof and thermal insulation equipment

Abstract

According to the heat preservation assembly, the preparation method thereof and the heat preservation equipment, the heat preservation assembly comprises N layers of heat insulation layers which are arranged in a stacked mode, N is an integer larger than or equal to 2, and at least two layers of heat insulation layers in the N layers of heat insulation layers are different in reflectivity and / or heat conductivity. Heat loss is effectively reduced through the stacking heat insulation effect and layer-by-layer reflection of the N heat insulation layers, the reflectivity and / or heat conductivity of at least two heat insulation layers are different, and effective regulation and control of the temperature gradient of the temperature field can be achieved through flexible arrangement of the heat insulation layers.

Description

Technical Field

[0001] The present application relates to the technical field of thermal insulation materials, and in particular to a thermal insulation component and a preparation method thereof, and thermal insulation equipment. Background Art

[0002] Existing insulation layers with simple structures have relatively simple functions, primarily reducing heat loss through a single approach, such as reducing heat conduction or reducing heat radiation. This results in poor insulation and poor control of the temperature gradient of the temperature field. To address this problem, insulation structures with composite insulation layers have been proposed. However, while these structures have improved insulation performance, their preparation methods are complex and their configuration is limited, making it impossible to flexibly adjust the temperature gradient of the temperature field according to insulation requirements. Summary of the Invention

[0003] The embodiments of the present application provide a thermal insulation component and a preparation method and thermal insulation equipment, which can effectively reduce heat loss and improve thermal energy utilization. The thermal insulation component has a simple structure and can be flexibly set according to thermal insulation requirements.

[0004] In a first aspect, the present application provides a thermal insulation component, which includes: N layers of thermal insulation layers stacked together, where N is an integer greater than or equal to 2, and at least two of the N layers of thermal insulation layers have different reflectivities and / or thermal conductivities. In the thermal insulation component of the present application, the thermal insulation effect of the N layers of thermal insulation layers is superimposed, and layer-by-layer reflection effectively reduces heat loss. Furthermore, the reflectivities and / or thermal conductivities of at least two layers of thermal insulation layers are different, and the temperature gradient can be effectively controlled by flexibly setting the reflectivities and / or thermal conductivities of different thermal insulation layers, thereby enabling flexible settings based on thermal insulation requirements.

[0005] In one possible implementation, the direction in which N layers of thermal insulation layers are stacked is taken as a first direction. Along the first direction, the reflectivity of the N layers of thermal insulation layers increases or decreases successively, so that multiple thermal insulation layers can reflect heat layer by layer, resulting in better thermal insulation effect and making the temperature gradient of the temperature field formed by the thermal insulation component more uniform.

[0006] In one possible implementation, the direction in which N layers of thermal insulation layers are stacked is taken as a first direction. Along the first direction, the thermal conductivity of the N layers of thermal insulation layers increases or decreases in sequence, thereby effectively controlling the temperature field and temperature gradient of the multiple thermal insulation layers.

[0007] In one possible implementation, the direction in which the N layers of thermal insulation are stacked is defined as a first direction. Along the first direction, the reflectivity of the N layers of thermal insulation decreases, while the thermal conductivity of the N layers of thermal insulation increases. This arrangement of N layers of thermal insulation forms a thermal insulation assembly that not only provides excellent thermal insulation but also provides a more uniform temperature gradient distribution.

[0008] In one possible implementation, at least one target insulation layer is present among the N insulation layers. Along the second direction, the reflectivity of each target insulation layer increases or decreases sequentially. With the direction of the stacked N insulation layers as the first direction, the second direction is perpendicular to the first direction. Along the first direction, at least two insulation layers have different reflectivities and / or thermal conductivities. Flexible configuration of the insulation layers allows for effective regulation of the temperature gradient in the first direction. Simultaneously, along the second direction, the reflectivity of the target insulation layer increases or decreases sequentially, allowing for effective regulation of the temperature gradient in the second direction. Therefore, the thermal insulation assembly can effectively regulate the temperature gradient in both directions of the temperature field simultaneously, resulting in a more uniform temperature gradient.

[0009] In one possible implementation, at least one target insulation layer is present among the N insulation layers. The thermal conductivity of each target insulation layer increases or decreases sequentially along the second direction. With the direction of the stacked N insulation layers as the first direction, the second direction is perpendicular to the first direction. At least two insulation layers have different reflectivities and / or thermal conductivities along the first direction, enabling effective regulation of the temperature gradient in the first direction through flexible configuration of the insulation layers. Simultaneously, the thermal conductivity of the target insulation layer increases or decreases sequentially along the second direction, enabling effective regulation of the temperature gradient in the second direction. Therefore, the thermal insulation assembly can effectively regulate the temperature gradient in both directions of the temperature field simultaneously, resulting in a more uniform temperature gradient.

[0010] In one possible implementation, at least one target thermal insulation layer exists among the N layers of thermal insulation layers. Along the second direction, the reflectivity of each target thermal insulation layer decreases sequentially, while the thermal conductivity increases sequentially. Wherein, the direction in which the N layers of thermal insulation layers are stacked is defined as the first direction, and the second direction is perpendicular to the first direction. Along the first direction, at least two thermal insulation layers have different reflectivities and / or thermal conductivities. By flexibly configuring the thermal insulation layers, effective regulation of the temperature gradient in the first direction of the temperature field can be achieved. Simultaneously, along the second direction, the reflectivity of the target thermal insulation layers decreases sequentially, while the thermal conductivity increases sequentially, so that the temperature gradient of the temperature field along the second direction is more uniform. Therefore, the thermal insulation assembly can simultaneously and effectively regulate the temperature gradient in both directions of the temperature field, resulting in a more uniform temperature gradient.

[0011] In one possible implementation, the reflectivity of the thermal insulation layer is greater than or equal to 60%, which can significantly reduce the energy lost by thermal radiation. At the same time, the thermal conductivity is less than or equal to 5W / m·K, which can effectively reduce the energy lost by thermal conduction and reduce heat loss.

[0012] In one possible implementation, the thermal insulation layer is made of a thermal insulation material, which includes at least one of an inorganic salt, a ceramic, a polymer-based composite material, a metal-based composite material, a ceramic-based composite material, or a carbon and graphite-based composite material. Optionally, the material of the thermal insulation layer is selected from a white material to further improve the reflectivity of the thermal insulation layer. Exemplarily, the inorganic salt includes at least one of niobate, tantalate, vanadate, titanate, zirconate, chromate, molybdate, tungstate, barium salt, silicate, and sulfate. The above-mentioned inorganic salts have a high melting point, and the thermal insulation component composed of them has higher thermal stability, thereby increasing the service life of the thermal insulation component.

[0013] In one possible implementation, the particle diameter of the thermal insulation material is 0.1 μm-50 μm. Optionally, the particle size of the material is 0.1 μm-30 μm, so that the material can be mixed more evenly when preparing the thermal insulation layer, thereby achieving better thermal insulation effect.

[0014] In one possible implementation, there are P1 target insulation layers among N insulation layers. Along a second direction, each target insulation layer may include M1 stacked insulation units, with at least two insulation units having different reflectivities and / or thermal conductivities. The second direction is perpendicular to the direction in which the N insulation layers are stacked. Here, 1 ≤ P1 ≤ N, P1 is a positive integer, and M1 is an integer greater than or equal to 2. Along the second direction, the stacked insulation effect of the M1 insulation units reflects heat layer by layer, effectively reducing heat loss. Furthermore, since at least two insulation units have different reflectivities and / or thermal conductivities, the reflectivity or thermal conductivity of the insulation layer can be effectively controlled through the flexible configuration of the insulation units.

[0015] In one possible implementation, there are P2 target insulation layers within N insulation layers. Along a first direction, each target insulation layer includes M2 stacked insulation units, with at least two insulation units having different reflectivities and / or thermal conductivities. The first direction is the direction in which the N insulation layers are stacked. Here, 1 ≤ P2 ≤ N, P2 is a positive integer, and M2 is an integer greater than or equal to 2. Along the first direction, the stacked insulation effect of the M2 insulation units reflects heat layer by layer, effectively reducing heat loss. Furthermore, since at least two insulation units have different reflectivities and / or thermal conductivities, the reflectivity or thermal conductivity of the insulation layer can be effectively controlled through the flexible arrangement of the insulation units.

[0016] In a second aspect, the present application provides a method for preparing the thermal insulation assembly of the first aspect and any possible implementation thereof, the method comprising the following steps:

[0017] N thermal insulation layers comprising thermal insulation materials are prepared; wherein N is an integer greater than or equal to 2, and at least two thermal insulation layers have different reflectivities and / or thermal conductivities; and the N thermal insulation layers are stacked to form a thermal insulation assembly.

[0018] The preparation method of the insulation component in the present application adopts an insulation material to prepare an insulation layer, and according to the insulation requirements, N layers of insulation layers are stacked in different arrangements and combinations to achieve effective control of the temperature gradient. Compared with the traditional temperature field adjustment method (mainly by changing the size of the heating electric power, the number of heat coils or the size of the insulation bricks, etc.), the preparation method in the present application can achieve flexible control of the temperature gradient of the temperature field with a higher degree of freedom.

[0019] In a third aspect, the present application provides an insulation device, which includes an insulation chamber, in which the insulation component according to the first aspect and any possible implementation thereof is provided.

[0020] The insulation equipment in the present application can be a single crystal silicon growth furnace, a polycrystalline silicon ingot furnace, a zone melting single crystal silicon furnace, etc. Among them, the single crystal silicon growth furnace, the polycrystalline silicon ingot furnace, the zone melting single crystal silicon furnace and other equipment are all equipped with an insulation chamber, and the insulation component can be directly coated on the inner wall of the insulation chamber, or it can be provided as an independent insulation body in other areas of the insulation chamber. Because the insulation component in the first aspect of the present application and any possible implementation thereof is applied, the insulation equipment here has a better insulation effect, can improve the utilization rate of thermal energy, thereby reducing the power consumption in the entire preparation process, and thus saving energy; moreover, the temperature gradient inside the insulation equipment can be flexibly adjusted as needed to meet different insulation requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the structure of a heat preservation assembly in one embodiment;

[0022] Figure 2 is a schematic structural diagram of a heat preservation assembly in another embodiment;

[0023] Figure 3 is a cross-sectional view of a heat preservation device in one embodiment;

[0024] Figure 4 Graph showing radial temperature gradient distribution in the crystal growth furnace in Examples 1-2 and Comparative Example 1;

[0025] Figure 5 Graph showing the axial temperature gradient distribution in the crystal growth furnace in Examples 1-2 and Comparative Example 1.

[0026] Reference numerals:

[0027] 100-first thermal insulation layer; 200-second thermal insulation layer; 300-third thermal insulation layer; 110-first thermal insulation unit; 120-second thermal insulation unit; 130-third thermal insulation unit;

[0028] 10-heat preservation chamber; 20-heat source. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0030] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "above", "the", and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise.

[0031] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0032] At present, the preparation process of most materials needs to be carried out in insulation equipment, such as the manufacture of metal materials, semiconductor materials or crystals. The preparation process of crystals usually requires the raw materials to react in a growth furnace above 1000°C. The whole process lasts for at least several days, and heating requires a lot of electricity. Because a lot of heat is lost to the environment during the preparation process, it is wasted. In order to reduce heat loss, an insulation structure is provided in the growth furnace. The existing insulation structure is mainly composed of alumina refractory bricks, zirconia refractory bricks, or platinum (iridium) gold reflective covers. Although the above insulation structure can improve the insulation effect, a large amount of heat is still lost to the environment through thermal radiation, and the structure of the existing insulation structure is single, and it is impossible to flexibly adjust the temperature gradient inside the insulation equipment according to the insulation requirements.

[0033] To solve the above technical problems, an embodiment of the present application provides a thermal insulation component, which can be used in various equipment with thermal insulation requirements, such as in a growth furnace. Of course, it can also be used in other thermal insulation equipment with thermal insulation requirements other than a growth furnace. The thermal insulation component includes N layers of thermal insulation layers stacked together, where N is an integer greater than or equal to 2, and at least two of the N layers of thermal insulation layers have different reflectivities and / or thermal conductivities. N is typically, but not limited to, 2, 3, 4, 5, or 10. For example, when N=2, the reflectivities of the two thermal insulation layers are different, or the thermal conductivities of the two thermal insulation layers are different, or both the reflectivities and thermal conductivities of the two thermal insulation layers are different; when N≥3, the reflectivities of at least two of the multiple thermal insulation layers are different, or the thermal conductivities of at least two of the thermal insulation layers are different, or both the thermal conductivity and emissivity of at least two of the thermal insulation layers are different. Thermal insulation layers with different reflectivities and / or thermal conductivities can be arranged adjacent to each other or spaced apart. The thermal insulation component can be flexibly set up by thermal insulation layers with different reflectivities and / or thermal conductivities to achieve effective regulation of the temperature gradient, and thus can be flexibly set up based on thermal insulation requirements.

[0034] Among them, the reflectivity of the insulation layer is greater than or equal to 60%, optionally, the reflectivity is greater than or equal to 80%, which can greatly reduce the energy lost by thermal radiation; the thermal conductivity is less than or equal to 5W / m·K, optionally, the thermal conductivity is less than or equal to 4W / m·K, which can effectively reduce the energy lost by heat conduction.

[0035] As an optional embodiment, Figure 1 This is a schematic diagram of the structure of the insulation component in an embodiment, referring to Figure 1 For example, the thermal insulation assembly includes three layers of insulation. The three layers are stacked in a first direction D1. Along the first direction, the three insulation layers are sequentially designated as first insulation layer 100, second insulation layer 200, and third insulation layer 300. The first insulation layer 100 has a reflectivity of R1 and a thermal conductivity of K1. The second insulation layer 200 has a reflectivity of R2 and a thermal conductivity of K2. The third insulation layer 300 has a reflectivity of R3 and a thermal conductivity of K3. Among them, the reflectivity of the three-layer thermal insulation layer can be set as any one of R1≤R2<R3, R1≤R2>R3, R1<R2=R3, R1>R2≥R3, R1>R2<R3; the thermal conductivity of the three-layer thermal insulation layer can be set as any one of K1≤K2<K3, K1≤K2>K3, K1<K2=K3, K1>K2≥K3, K1>K2<K3.

[0036] The reflectivity and thermal conductivity of the three insulation layers can be freely combined based on actual insulation requirements, allowing for effective control of the temperature gradient through differentiated configuration of the insulation assembly. It is understood that when the insulation assembly includes more insulation layers, the temperature gradient will be more balanced. The specific configuration can be referenced to the description of the insulation assembly including three insulation layers, and will not be further elaborated here. Optionally, the insulation assembly can include three insulation layers to balance insulation effectiveness and cost control.

[0037] In an optional embodiment, the direction in which N layers of thermal insulation layers are stacked is taken as a first direction, that is, the direction from the heat source to the direction away from the heat source. Along the first direction, according to the position of the heat source and the insulation requirements, the reflectivity of the N layers of thermal insulation layers can be reduced successively. That is to say, the thermal insulation layer closest to the heat source has the highest reflectivity, thereby minimizing the energy lost by thermal radiation. At the same time, under the superimposed effect of heat reflection by multiple thermal insulation layers, the thermal insulation effect of the thermal insulation component is effectively improved, and the temperature gradient distribution along the first direction is more balanced.

[0038] In another optional embodiment, along the first direction, the thermal conductivity of the N layers of insulation can be increased successively according to the position of the heat source and the insulation requirements. That is, the thermal conductivity of the insulation layer closest to the heat source is the lowest, thereby minimizing the energy lost by heat conduction. At the same time, under the superposition effect of the N layers of insulation, the insulation effect of the insulation component is effectively improved, and the temperature gradient distribution along the first direction is more balanced.

[0039] In another optional embodiment, along the first direction, the reflectivity of the N layers of insulation layers can be reduced successively, and the thermal conductivity of the N layers of insulation layers can be increased successively, thereby minimizing the energy lost by heat radiation and heat conduction, effectively improving the insulation effect of the insulation component, and effectively reducing the temperature gradient.

[0040] Limited by the structure of the thermal insulation component, the existing thermal insulation components usually only regulate the temperature gradient in a single direction. However, in the preparation process of some materials, it is often necessary to simultaneously regulate the temperature gradient in two directions of the temperature field, such as the radial direction and the axial direction. In view of this, in the thermal insulation component in the embodiment of the present application, there can be at least one target thermal insulation layer in the N layers of thermal insulation layers. Along the second direction, the second direction is the direction from the heat source to the direction away from the heat source. Taking the direction of the stacking of the N layers of thermal insulation layers as the first direction, the second direction is perpendicular to the first direction. The reflectivity of each target thermal insulation layer can be reduced in sequence, that is, the reflectivity of the part of each target thermal insulation layer close to the heat source is higher, thereby minimizing the energy lost by thermal radiation, and the temperature gradient distribution along the second direction is more balanced.

[0041] In another possible embodiment, there may be at least one target thermal insulation layer in the N layers of thermal insulation layers. Along the second direction, the thermal conductivity of each target thermal insulation layer may increase successively, and the thermal conductivity of the portion of each target thermal insulation layer close to the heat source is lower, thereby minimizing the energy lost by heat conduction, and the temperature gradient distribution along the second direction is more balanced.

[0042] In another optional embodiment, there is at least one target thermal insulation layer among the N layers of thermal insulation layers. Along the second direction, the reflectivity of each target thermal insulation layer can be successively decreased, and the thermal conductivity can be successively increased, that is, the thermal conductivity of the part of each target thermal insulation layer close to the heat source is lower and the reflectivity is higher, thereby minimizing the energy lost by heat conduction and heat radiation, and the temperature gradient distribution along the second direction is more balanced.

[0043] In summary, the thermal insulation assembly in the embodiment of the present application includes N stacked insulation layers. Along a first direction, at least two insulation layers have different reflectivities and / or thermal conductivities. Flexible configuration of the insulation layers allows for effective regulation of the temperature gradient in the first direction of the temperature field. Along a second direction, the reflectivity of each target insulation layer decreases, and / or the thermal conductivity increases, in sequence, to achieve effective regulation of the temperature gradient in the second direction of the temperature field. Therefore, the structural configuration of the thermal insulation assembly is more flexible, and the temperature gradients in both directions of the temperature field can be effectively regulated simultaneously, resulting in a more uniform temperature gradient.

[0044] In other embodiments, there are P1 target thermal insulation layers in the N thermal insulation layers. Along the second direction, each target thermal insulation layer may include M1 stacked thermal insulation units, and the reflectivity and / or thermal conductivity of at least two thermal insulation units are different; the second direction is perpendicular to the stacking direction of the N thermal insulation layers; wherein 1≤P1≤N, and P1 is a positive integer, and M1 is an integer greater than or equal to 2. The shape of the thermal insulation unit may be a cube, a cuboid, or a triangular prism, etc., and may be specifically configured according to actual needs. The advantage of this structure is that through different arrangements and combinations of the thermal insulation units, the reflectivity or thermal conductivity of the thermal insulation layer along the second direction can be flexibly controlled, thereby effectively controlling the temperature gradient of the temperature field.

[0045] For example, continue to refer to Figure 1Along a second direction D2 perpendicular to the first direction D1, the first thermal insulation layer 100 includes three stacked thermal insulation units, namely, a first thermal insulation unit 110, a second thermal insulation unit 120, and a third thermal insulation unit 130. The first thermal insulation unit 110 has a reflectivity of R4 and a thermal conductivity of K4, the second thermal insulation unit 120 has a reflectivity of R5 and a thermal conductivity of K5, and the third thermal insulation unit 130 has a reflectivity of R6 and a thermal conductivity of K6. The reflectivities of the three thermal insulation units can be set in any of the following conditions: R4 ≤ R5 < R6, R4 ≤ R5 > R6, R4 < R5 = R6, R4 > R5 ≥ R6, or R4 > R5 < R6. The thermal conductivity of the three thermal insulation units can be set in any of the following conditions: K4 ≤ K5 < K6, K4 ≤ K5 > K6, K4 < K5 = K6, K4 > K5 ≥ K6, or K4 > K5 < K6.

[0046] It can be understood that when each insulation layer includes more insulation units along the second direction D2, the temperature gradient will be more balanced. The specific setting method can refer to the description of the above insulation layer including three insulation units, which will not be repeated here.

[0047] In another embodiment, there are P2 target insulation layers within N insulation layers. Each target insulation layer may include M2 ​​stacked insulation units along a first direction, with at least two insulation units having different reflectivities and / or thermal conductivities. The first direction is the direction in which the N insulation layers are stacked. Here, 1 ≤ P2 ≤ N, P2 is a positive integer, and M2 is an integer greater than or equal to 2. This structure has the advantage of enabling the reflectivity or thermal conductivity of the insulation layer to be controlled along the first direction through different arrangements and combinations of the insulation units, thereby effectively controlling the temperature gradient of the temperature field.

[0048] For example, Figure 2 This is a schematic diagram of the structure of the insulation component in another embodiment, referring to Figure 2 Along the first direction D1, the first thermal insulation layer 100 includes three stacked thermal insulation units, namely, a first thermal insulation unit 110, a second thermal insulation unit 120, and a third thermal insulation unit 130. The first thermal insulation unit 110 has a reflectivity of R4 and a thermal conductivity of K4, the second thermal insulation unit 120 has a reflectivity of R5 and a thermal conductivity of K5, and the third thermal insulation unit 130 has a reflectivity of R6 and a thermal conductivity of K6. The reflectivities of the three thermal insulation units can be set in any of the following conditions: R4 ≤ R5 < R6, R4 ≤ R5 > R6, R4 < R5 = R6, R4 > R5 ≥ R6, or R4 > R5 < R6. The thermal conductivity of the three thermal insulation units can be set in any of the following conditions: K4 ≤ K5 < K6, K4 ≤ K5 > K6, K4 < K5 = K6, K4 > K5 ≥ K6, or K4 > K5 < K6.

[0049] It can be understood that when each thermal insulation layer includes more thermal insulation units along the first direction D1, the temperature gradient will be more balanced. The specific setting method can refer to the description of the thermal insulation layer including three thermal insulation units, which will not be repeated here.

[0050] As an optional embodiment, the thermal insulation layer is prepared from a thermal insulation material, and the thermal insulation material includes at least one of an inorganic salt, a ceramic, a polymer-based composite material, a metal-based composite material, a ceramic-based composite material, a carbon- and graphite-based composite material. Optionally, the thermal insulation material is selected from a white material to further improve the reflectivity of the thermal insulation layer. Exemplarily, when the thermal insulation material is an inorganic salt, the thermal insulation material may be at least one of niobate, tantalate, vanadate, titanate, zirconate, chromate, molybdate, tungstate, barium salt, silicate or sulfate. The above-mentioned inorganic salts have a high melting point, and the thermal insulation component composed thereof has higher thermal stability, thereby improving the service life of the thermal insulation component.

[0051] The particle size diameter of the thermal insulation material is 0.1 μm-50 μm. Optionally, the particle size diameter of the material is 0.1 μm-30 μm, so that the material can be mixed more evenly when preparing the thermal insulation layer, and the thermal insulation effect is better.

[0052] The thickness of the heat insulation layer is 10 μm-1000 μm. Optionally, the thickness of the heat insulation layer is 200 μm-800 μm. The heat insulation layer in the above range still has an excellent heat insulation effect while saving space.

[0053] It is understandable that the thermal insulation material of the thermal insulation assembly can be mixed with other materials to improve the overall performance of the thermal insulation assembly, such as strength or hardness.

[0054] The above explains the structure and materials of the thermal insulation component. The following will further explain the preparation method of the thermal insulation component of the present application. The preparation method of the thermal insulation component of the present application includes the following steps:

[0055] S1: preparing N thermal insulation layers comprising thermal insulation materials; wherein N is an integer greater than or equal to 2, and at least two thermal insulation layers have different reflectivities and / or thermal conductivities; in an optional embodiment, preparing the thermal insulation layers using the thermal insulation materials in step S1 comprises the following steps:

[0056] A plurality of heat insulation units are prepared by using heat insulation materials. According to the heat preservation requirements, the plurality of heat insulation units are arranged along a preset direction (such as Figure 1 The thermal insulation layers are stacked (in the D1 direction and / or D2 direction) to form a thermal insulation layer, wherein at least two thermal insulation units have different reflectivities and / or thermal conductivities.

[0057] S2: stacking N insulation layers to form a thermal insulation assembly.

[0058] Among them, the connection method between different insulation layers can be bonding or clamping, or different insulation layers can be directly stacked, or even adjacent insulation layers can be set at intervals, and the interval distance is specifically set according to the requirements for controlling the temperature gradient in the temperature field.

[0059] Based on the same technical concept, the embodiment of the present application also provides a heat preservation device, Figure 3 is a cross-sectional view of a heat preservation device in an embodiment, referring to Figure 3 The heat preservation device includes a heat preservation chamber 10, a heat source 20 is provided in the heat preservation chamber 10, and the heat preservation component of the first aspect, which is provided between the inner wall of the heat preservation chamber 10 and the heat source 20.

[0060] Continue to refer to Figure 3 The first direction D1 is the radial direction of the heat preservation device, and the second direction is the axial direction of the heat preservation device. Based on the good heat insulation effect and flexible control of the temperature gradient of the heat preservation assembly of the embodiment of the present application, the heat preservation device using the heat preservation assembly of various possible embodiments of the present application can also achieve the same effect.

[0061] Among them, the heat preservation equipment can be a crystal growth furnace used to prepare crystals, such as a silicon carbide growth furnace, a polysilicon growth furnace, a semiconductor growth furnace, a silicon single crystal growth furnace, a graphene growth furnace, etc.

[0062] It is understandable that the above-mentioned insulation component can be directly coated on the inner wall of the insulation device or the outer surface of the heat source, or the insulation component can be made into a block shape and arranged between the inner wall of the insulation device and the heat source.

[0063] The insulation component and insulation equipment of the present application will be further described in detail below in combination with specific embodiments and comparative examples. The following embodiments take the insulation equipment in which the insulation component is applied as a crystal growth furnace as an example.

[0064] Example 1

[0065] This embodiment provides a thermal insulation component and a crystal growth furnace including the thermal insulation component. The thermal insulation component is arranged between the inner wall of the furnace body and the crucible, and the thermal insulation component includes three layers of thermal insulation. Along the direction from the crucible to the inner wall of the furnace body, that is, along the radial direction of the crystal growth furnace, the three layers of thermal insulation are the first thermal insulation layer, the second thermal insulation layer, and the third thermal insulation layer. The reflectivity of the first thermal insulation layer is R1 and the thermal conductivity is K1. The reflectivity of the second thermal insulation layer is R2 and the thermal conductivity is K2. The reflectivity of the third thermal insulation layer is R3 and the thermal conductivity is K3. Among them, the thermal insulation material of the first thermal insulation layer is tantalate, the thermal insulation material of the second thermal insulation layer is niobate, and the thermal insulation material of the third thermal insulation layer is zirconate. R1>R2>R3, K1<K2<K3. The thickness of the three thermal insulation layers is 30μm.

[0066] Example 2

[0067] This embodiment provides a thermal insulation component and a crystal growth furnace including the thermal insulation component. The thermal insulation component is arranged between the inner wall of the furnace body and the crucible, and the thermal insulation component includes three layers of thermal insulation. Along the direction from the crucible to the inner wall of the furnace body, that is, along the radial direction of the crystal growth furnace, the three layers of thermal insulation are the first thermal insulation layer, the second thermal insulation layer, and the third thermal insulation layer. The reflectivity of the first thermal insulation layer is R1 and the thermal conductivity is K1. The reflectivity of the second thermal insulation layer is R2 and the thermal conductivity is K2. The reflectivity of the third thermal insulation layer is R3 and the thermal conductivity is K3. Among them, the thermal insulation material of the first thermal insulation layer is vanadate, the thermal insulation material of the second thermal insulation layer is an inorganic composite material, and the thermal insulation material of the third thermal insulation layer is silicate. R1<R2<R3, K1>K2>K3. The thickness of the three thermal insulation layers is 30μm.

[0068] Comparative Example 1

[0069] Comparative Example 1 is an existing crystal growth furnace, which uses alumina insulation bricks to regulate the temperature field and temperature gradient.

[0070] Examples 1-2 and Comparative Example 1 were used to produce the same crystals, and the crystals had the same melting point. The power of the crystal growth furnace in Example 1 was 5400 W, the power of the crystal growth furnace in Example 2 was 5400 W, and the power of the crystal growth furnace in Example 1 was 6900 W. The radial temperature gradient distribution and axial temperature gradient distribution within the crystal growth furnaces in Examples 1-2 and Comparative Example 1 were measured, and the results are as follows:

[0071] Figure 4 The axial temperature gradient distribution diagram of the crystal growth furnace in Example 1-2 and Comparative Example 1 is shown in FIG. Figure 4 , along the axial direction of the crystal growth furnace, the difference between the highest temperature and the lowest temperature in the crystal growth furnace in Example 1 is 46°C, the difference between the highest temperature and the lowest temperature in the crystal growth furnace in Example 2 is 58°C, and the difference between the highest temperature and the lowest temperature in the crystal growth furnace in Comparative Example 1 is 91°C. The temperature gradient range of the temperature field in the crystal growth furnace in Examples 1 and 2 is smaller than that in Comparative Example 1, indicating that the thermal insulation component with three layers of insulation in the embodiment of the present application can significantly improve the thermal insulation effect, reduce energy consumption, and reduce the temperature gradient in the axial direction of the crystal growth furnace. A higher temperature can still be maintained in the area away from the bottom wall of the crystal growth furnace, and the crystal growth environment is more stable. The minimum temperature in the crystal growth furnace using the thermal insulation component in the present application is increased by at least 10°C, and the electricity saved is greater than 24kWh / day. The thermal insulation component in the present application can effectively reduce heat loss from thermal radiation, double the service life of the thermal field, protect the heating element, and extend the service life.

[0072] In addition, the insulation effect of the insulation component in Example 1 is better than that of the insulation component in Example 2, which means that along the direction of the crucible pointing to the inner wall of the furnace body, the reflectivity of the insulation layer decreases and the thermal conductivity increases successively, which is conducive to a more uniform dispersion of the heat emitted by the heat source and a more balanced temperature gradient distribution in the axial direction of the crystal growth furnace.

[0073] Figure 5 The radial temperature gradient distribution diagram of the crystal growth furnace in Example 1-2 and Comparative Example 1 is shown in FIG. Figure 5 Along the radial direction of the crystal growth furnace, the difference between the highest temperature and the lowest temperature in the crystal growth furnace in Example 1 is 350°C, the difference between the highest temperature and the lowest temperature in the crystal growth furnace in Example 2 is 417°C, and the difference between the highest temperature and the lowest temperature in the crystal growth furnace in Comparative Example 1 is 600°C. The temperature gradient range of the temperature field in the crystal growth furnace in Examples 1 and 2 is smaller than that in Comparative Example 1, indicating that the thermal insulation component with three layers of thermal insulation in the embodiment of the present application can significantly improve the thermal insulation effect, reduce energy consumption, and reduce the temperature gradient in the radial direction of the crystal growth furnace. A higher temperature can still be maintained in the area close to the inner wall of the crystal growth furnace, and the crystal growth environment is more stable.

[0074] In addition, the insulation effect of the insulation component in Example 1 is better than that of the insulation component in Example 2, which means that along the direction from the center of the crucible to the inner wall of the crystal growth furnace, the reflectivity of the insulation layer decreases and the thermal conductivity increases, which is conducive to a more uniform dispersion of the heat emitted by the heat source and a more balanced distribution of the temperature gradient in the radial direction of the crystal growth furnace.

[0075] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A thermal insulation component, characterized in that: include: N layers of thermal insulation layers are stacked, wherein N is an integer greater than or equal to 2, and at least two of the N layers of thermal insulation layers have different reflectivities and / or thermal conductivities.

2. The thermal insulation assembly according to claim 1, characterized in that: The direction in which the N layers of the heat insulation layers are stacked is taken as a first direction. Along the first direction, the reflectivity of the N layers of the heat insulation layers increases or decreases in sequence.

3. The thermal insulation assembly according to claim 1, characterized in that: The direction in which the N layers of the heat insulation layers are stacked is taken as a first direction. Along the first direction, the thermal conductivity of the N layers of the heat insulation layers increases or decreases in sequence.

4. The thermal insulation assembly according to claim 1, characterized in that: The direction in which the N layers of the heat insulation layer are stacked is taken as a first direction. Along the first direction, the reflectivity of the N layers of the heat insulation layer decreases sequentially, and the thermal conductivity of the N layers of the heat insulation layer increases sequentially.

5. The thermal insulation assembly according to any one of claims 1 to 4, characterized in that: There is at least one target thermal insulation layer among the N thermal insulation layers, and the reflectivity of the target thermal insulation layer increases or decreases in sequence along the second direction; wherein the second direction is perpendicular to the stacking direction of the N thermal insulation layers.

6. The thermal insulation assembly according to any one of claims 1 to 4, characterized in that: There is at least one target thermal insulation layer among the N thermal insulation layers, and the thermal conductivity of the target thermal insulation layer increases or decreases in sequence along the second direction; wherein the second direction is perpendicular to the stacking direction of the N thermal insulation layers.

7. The thermal insulation assembly according to any one of claims 1 to 4, characterized in that: There is at least one target thermal insulation layer among the N thermal insulation layers, and along the second direction, the reflectivity of the target thermal insulation layer decreases successively, and the thermal conductivity increases successively; wherein, the second direction is perpendicular to the stacking direction of the N thermal insulation layers.

8. The thermal insulation assembly according to any one of claims 1 to 7, characterized in that: The heat insulation layer has a reflectivity greater than or equal to 60%, and a thermal conductivity less than or equal to 5 W / m·K.

9. The thermal insulation assembly according to any one of claims 1 to 7, characterized in that: The thermal insulation layer is made of a thermal insulation material, and the thermal insulation material includes at least one of an inorganic salt, a ceramic, a polymer-based composite material, a metal-based composite material, a ceramic-based composite material, or a carbon and graphite-based composite material.

10. The thermal insulation assembly according to claim 9, characterized in that: The inorganic salt includes at least one of niobate, tantalate, vanadate, titanate, zirconate, chromate, molybdate, tungstate, barium salt, silicate and sulfate.

11. The thermal insulation assembly according to claim 9 or 10, characterized in that: The particle diameter of the thermal insulation material is 0.1 μm-50 μm.

12. The thermal insulation assembly according to any one of claims 1 to 11, characterized in that: There are P1 target thermal insulation layers in the N layers of thermal insulation layers, and along the second direction, each of the target thermal insulation layers includes M1 thermal insulation units stacked, and at least two of the thermal insulation units have different reflectivities and / or thermal conductivities; the second direction is perpendicular to the stacking direction of the N layers of thermal insulation layers; Wherein, 1≤P1≤N, P1 is a positive integer, and M1 is an integer greater than or equal to 2.

13. The thermal insulation assembly according to any one of claims 1 to 11, characterized in that: There are P2 target thermal insulation layers in the N layers of thermal insulation layers, and along the first direction, each of the target thermal insulation layers includes M2 thermal insulation units stacked, and at least two of the thermal insulation units have different reflectivities and / or thermal conductivities; the first direction is the direction in which the N layers of thermal insulation layers are stacked; Wherein, 1≤P2≤N, P2 is a positive integer, and M2 is an integer greater than or equal to 2.

14. A method for preparing the thermal insulation assembly according to any one of claims 1 to 13, characterized in that: include: Prepare N heat-insulating layers comprising heat-insulating materials; wherein N is an integer greater than or equal to 2, and at least two of the heat-insulating layers have different reflectivities and / or thermal conductivities; N of the thermal insulation layers are stacked to form the thermal insulation assembly.

15. A heat preservation device, characterized in that: It comprises a heat preservation chamber, in which the heat preservation assembly according to any one of claims 1 to 13 is arranged.

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