Photoelectric co-packaging structure

Abstract

The invention relates to the technical field of semiconductors, in particular to a photoelectric co-packaging structure. The photoelectric co-packaging structure comprises: an optical signal emission module, which is used for emitting incident light; the optical transmission structure comprises a first surface and a second surface which are oppositely arranged, the first surface is provided with a protrusion extending in the direction away from the second surface, the protrusion comprises an incident surface and a reflecting surface, and the incident surface faces the light emitting side of the optical signal emitting module, so that incident light enters from the incident surface, is reflected by the reflecting surface and then is emitted from the second surface; and the optical signal receiving module is used for receiving the light emitted from the second surface. According to the photoelectric co-packaging structure, the first surface of the light transmission structure is provided with the bulges, so that the incident light can be reflected to the second surface by the reflecting surface, the incident light can be emitted from the second surface, an optical signal receiving module can be arranged on the second surface of the light transmission structure, the area of the photoelectric co-packaging structure is reduced, and the photoelectric co-packaging effect is improved. Therefore, miniaturization of the photoelectric co-packaging structure is facilitated.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to an optoelectronic co-packaging structure. Background Art

[0002] ‌Co-Packaged Optics (CPO) is a new type of optoelectronic integration technology that packages network switching chips and optical modules in the same slot to achieve co-packaging of chips and modules. ‌Currently, co-packaged optoelectronics has been widely used in data centers, cloud computing, artificial intelligence and other fields.

[0003] As the communication industry demands higher speeds and higher bandwidths, optoelectronic co-packaging needs to have a smaller space and integrate more channels. However, in the related art, the optical path in optoelectronic co-packaging needs to occupy a longer distance, which makes it difficult to miniaturize optoelectronic co-packaging. Summary of the invention

[0004] Based on this, it is necessary to provide an optoelectronic co-packaging structure to address the problem that optoelectronic co-packaging in the prior art is difficult to miniaturize.

[0005] In order to achieve the above object, on the one hand, a photoelectric co-packaging structure is provided, comprising: An optical signal transmitting module, used for transmitting incident light; The optical transmission structure comprises a first surface and a second surface arranged opposite to each other, the first surface is provided with a protrusion extending in a direction away from the second surface, the protrusion comprises an incident surface and a reflecting surface, the incident surface faces the light emitting side of the optical signal transmitting module, so that the incident light is incident from the incident surface and is emitted from the second surface after being reflected by the reflecting surface; The optical signal receiving module is used to receive the light emitted from the second surface.

[0006] In one embodiment, the incident light enters from the incident surface along a first direction, and the incident surface is inclined relative to the first direction.

[0007] In one embodiment, the refractive index of the light transmission structure is greater than the refractive index of the transmission medium of the incident light, and in the direction from the second surface to the first surface, the incident surface is inclined toward the direction close to the reflecting surface, and the reflecting surface is inclined toward the direction close to the incident surface.

[0008] In one embodiment, the first surface further includes a first sub-surface and a second sub-surface, the first sub-surface is located on a side of the incident surface away from the reflective surface and the first sub-surface is connected to the incident surface, the second sub-surface is located on a side of the reflective surface away from the incident surface and the second sub-surface is connected to the reflective surface, the first sub-surface has a first distance from the second surface, the second sub-surface has a second distance from the second surface, and the first distance is greater than the second distance.

[0009] In one embodiment, the incident light enters from the incident surface in a first direction, is reflected by the reflective surface, and then is emitted from the second surface in a second direction, and an angle between the second direction and the first direction is in the range of 75°-105°.

[0010] In one embodiment, the optoelectronic co-packaging structure includes a first anti-reflection film, which covers the incident surface, and / or the optoelectronic co-packaging structure includes a reflective film, which covers the reflective surface, and / or the optoelectronic co-packaging structure includes a second anti-reflection film, which covers the second surface.

[0011] In one embodiment, a lens is formed on the second surface of the light transmission structure, and the lens is used to converge the light emitted from the second surface.

[0012] In one of the embodiments, a plurality of lenses are disposed on the second surface of the light transmission structure, and the plurality of lenses are arranged in an extension direction of the optoelectronic co-packaging structure.

[0013] In one of the embodiments, the material of the light transmission structure includes silicon crystal.

[0014] In one embodiment, the optical signal transmitting module includes a silicon photonic chip, and the optical signal receiving module includes an optical fiber array.

[0015] The optoelectronic co-packaging structure of the present application has the following beneficial effects: by providing a protrusion on the first surface of the optical transmission structure, the reflective surface can reflect the incident light to the second surface, so that the incident light can be emitted from the second surface. The protrusion in this embodiment can change the optical path of the reflected light, so that the optical signal receiving module can be provided on the second surface of the optical transmission structure, thereby reducing the area of ​​the optoelectronic co-packaging structure, which is conducive to the miniaturization of the optoelectronic co-packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 is a schematic diagram of an optical transmission structure provided in an embodiment; Figure 2 A schematic diagram of an optical transmission structure provided in another embodiment; Figure 3 A schematic diagram of a protrusion provided in an embodiment; Figure 4 A schematic diagram of an optical transmission structure provided in yet another embodiment; Figure 5 FIG. 4 is a schematic diagram of a lens provided in an embodiment.

[0018] Explanation of reference numerals: light transmission structure-100; first surface-110; protrusion-111; incident surface-1111; reflecting surface-1112; first sub-surface-112; second sub-surface-113; second surface-120; lens-130.

[0019] In order to better describe and illustrate the embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more drawings. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed inventions, the embodiments and / or examples currently described, and the best modes of these inventions currently understood. DETAILED DESCRIPTION

[0020] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0022] In each embodiment, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in each embodiment can be understood according to the specific situation.

[0023] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teaching of the present embodiment, the first element, component, region, layer or part discussed below can be represented as the second element, component, region, layer or part.

[0024] Spatial relationship terms such as "under", "below", "below", "under", "above", "above", etc., may be used herein to describe the relationship between an element or feature shown in the figures and other elements or features. It should be understood that in addition to the orientations shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, the element or feature described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0025] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0026] Embodiments of the present application are described herein with reference to schematic diagrams that are ideal embodiments (and intermediate structures) of the present application, so that variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, embodiments of the present application should not be limited to the specific shapes of the zones shown herein, but include shape deviations due to, for example, manufacturing techniques. The zones shown in the figures are schematic in nature, and their shapes do not represent the actual shapes of the zones of the device, and do not limit the scope of the embodiments of the present application. In addition, the angles shown in the drawings in the present application are for exemplary purposes only, and therefore, embodiments of the present application should not be limited to the specific angles shown herein.

[0027] In one embodiment, an optoelectronic co-packaging structure is provided. Figures 1 to 5 The optoelectronic co-packaging structure includes an optical signal transmitting module, an optical transmission structure 100 and an optical signal receiving module.

[0028] The optical signal transmitting module is used to emit incident light. As an example, the optical signal transmitting module can be a silicon photonic chip. Optical devices such as optical modulators, lasers, and photodetectors can be integrated on the silicon photonic chip. This embodiment does not specifically limit the silicon photonic chip.

[0029] The optical transmission structure 100 may be used to receive incident light emitted from an optical signal transmission module. As an example, the material of the optical transmission structure 100 may include silicon crystal.

[0030] See also Figure 1 , the light transmission structure 100 may include a first surface 110 and a second surface 120 that are arranged opposite to each other. The second surface 120 may be a plane. The first surface 110 may be provided with a protrusion 111 extending in a direction away from the second surface 120. As an example, the cross-sectional view of the protrusion 111 may be triangular, trapezoidal, etc. This embodiment does not specifically limit the shape and size parameters of the protrusion 111.

[0031] See also Figure 2, the protrusion 111 may include an incident surface 1111 and a reflective surface 1112. The incident surface 1111 and the reflective surface 1112 may be arranged opposite to each other. The side of the incident surface 1111 away from the second surface 120 may be connected to the side of the reflective surface 1112 away from the second surface 120. The incident surface 1111 may face the light-emitting side of the optical signal transmitting module, so that the incident light is incident from the incident surface 1111, and is emitted from the second surface 120 after being reflected by the reflective surface 1112.

[0032] The optical signal receiving module can be used to receive light emitted from the second surface 120. As an example, the optical signal receiving module can be an optical fiber array. Specifically, the optical fiber array can be close to the second surface 120 of the optical transmission structure 100, and one end of the optical fiber array can face the second surface 120. As an example, the incident light is in a first direction (for example, Figure 1 ) is incident from the incident surface 1111 and is reflected by the reflective surface 1112 in a second direction (eg, Figure 1 The Y direction shown in FIG. 1 is emitted from the second surface 120. Figure 4 , the angle between the second direction and the first direction is in the range of 75°-105°. For example, the second direction may be perpendicular to the first direction (90°), that is, the angle between the second direction and the first direction may have a deviation of -15°-15°. The above data are only used as examples. In actual embodiments, the angle between the second direction and the first direction is not limited to the above data.

[0033] Furthermore, the optical signal receiving module can be stacked on the second surface 120 of the optical transmission structure 100. In this case, the second surface 120 of the optical transmission structure 100 is a plane, so that the optical signal receiving module can be stably supported. The optical transmission structure 100 can also be stacked on the optical signal transmitting module, thereby forming a stacked structure of optical signal transmitting module-optical transmission structure 100-optical signal receiving module.

[0034] In addition, the second surface 120 of the light transmission structure 100 may also be provided with a lens 130. The lens 130 is used to converge and focus the light emitted from the second surface 120. Figure 5 As an example, the second surface 120 of the optical transmission structure 100 is provided with a plurality of lenses 130, and the plurality of lenses 130 are arranged in the extension direction of the optoelectronic co-packaging structure to form an array of lenses 130. Each lens 130 can form a channel, and the plurality of lenses 130 can form a multi-channel optical transmission structure 100. As an example, the channel spacing can be less than 0.2 mm, and the channel spacing error can be less than 0.1 μm. The orthographic projection of the lens 130 on the second surface 120 can overlap with the orthographic projection of the reflective surface 1112 on the second surface 120, which is conducive to the lens 130 converging the incident light.

[0035] Exemplarily, when preparing the light transmission structure 100, a lens 130 can be first prepared on one side of the initial substrate, and then the protrusion 111 can be formed by combining dry etching with wet etching. Dry etching can include at least one of reactive ion etching, inductively coupled plasma etching or high concentration plasma etching. Of course, after that, each surface can also be ground to obtain a neat light transmission structure 100. In addition, in other examples, the lens 130 can also be mounted to the second surface 120 of the light transmission structure 100. Moreover, other optical devices can also be set at the second surface 120 of the light transmission structure 100 to adjust parameters such as the focal length of the incident light.

[0036] It can be understood that the optoelectronic co-packaging structure in this embodiment may also be provided with other unit modules, circuit structures, etc. This embodiment does not limit this.

[0037] In this embodiment, by providing a protrusion 111 on the first surface 110 of the optical transmission structure 100, the reflective surface 1112 can reflect the incident light to the second surface 120, so that the incident light can be emitted from the second surface 120. The protrusion 111 in this embodiment can change the optical path of the reflected light, so that the optical signal receiving module can be provided on the second surface 120 of the optical transmission structure 100, thereby reducing the area of ​​the optoelectronic co-packaging structure (the overall optical path length can be less than 1 mm), which is conducive to the miniaturization of the optoelectronic co-packaging structure.

[0038] In one embodiment, the incident light enters from the incident surface 1111 along a first direction, and the incident surface 1111 may be tilted relative to the first direction. Figure 3 As an example, the inclination angle (θ2) between the incident surface 1111 and the first direction may be in the range of 49°-59°. For example, when the material of the light transmission structure 100 may include silicon crystal, the inclination angle between the incident surface 1111 and the first direction may be 50°, 54.74°, 56°, etc. The above data are only examples. In actual embodiments, the inclination angle between the incident surface 1111 and the first direction is not limited to the above data.

[0039] Furthermore, the material of the light transmission structure 100 may include silicon crystal, and the transmission medium of the incident light may be air or glue, etc. As an example, see Figure 3, the incident angle of the incident light in the transmission medium may be θ1, and θ1 may be 35.26°. The crystal plane angle of the optical transmission structure 100 in the transmission medium may be θ2, and θ2 may be 54.74°. The exit of the incident light in the transmission medium may be θ3, and θ3 may be 35.26°. The refraction angle of the incident light in the optical transmission structure 100 may be θ4, and θ4 may be 9.71°. Of course, the data of the above multiple angles are only for exemplary purposes. In actual embodiments, the multiple angles of the optical transmission structure 100 are not limited to the above data.

[0040] The refractive index of the optical transmission structure 100 may be greater than the refractive index of the transmission medium of the incident light. In the direction from the second surface 120 to the first surface 110, the incident surface 1111 is inclined in a direction close to the reflective surface 1112, and the reflective surface 1112 is inclined in a direction close to the incident surface 1111. Specifically, the incident surface 1111 intersects with the reflective surface 1112, and the angle formed by the incident surface 1111 and the reflective surface 1112 may be in the range of 65°-75°. For example, the angle formed by the incident surface 1111 and the reflective surface 1112 is θ5, and θ5 may be 70.52°. The incident angle of the incident light in the optical transmission structure 100 may be θ6, and θ6 may be 60.81°. The reflection angle of the incident light in the optical transmission structure 100 may be θ7, and θ7 may be 60.81°. The above data are only used as examples. In actual embodiments, the angle formed by the incident surface 1111 and the reflecting surface 1112 is not limited to the above data.

[0041] In this embodiment, the incident surface 1111 can be tilted relative to the first direction, thereby reducing the reflection of the incident light by the incident surface 1111. At the same time, in this embodiment, the tilt angle between the incident surface 1111 and the first direction can be set within the range of 49°-59°, thereby controlling the incident light to accurately be directed to the reflective surface 1112 in the silicon crystal. It can be understood that in this embodiment, the tilt angle between the incident surface 1111 and the first direction can be determined based on the crystal parameters of the material of the light transmission structure 100. For example, when the material of the light transmission structure 100 is other materials, the tilt angle between the incident surface 1111 and the first direction can also change accordingly.

[0042] In one embodiment, see Figure 1 , the first surface 110 may further include a first sub-surface 112 and a second sub-surface 113. The first sub-surface 112 may be located on a side of the incident surface 1111 away from the reflective surface 1112 and connected to the incident surface 1111, and the second sub-surface 113 may be located on a side of the reflective surface 1112 away from the incident surface 1111 and connected to the reflective surface 1112. As an example, the first sub-surface 112 and the second sub-surface 113 may be arranged in parallel. Further, the first sub-surface 112 and the second sub-surface 113 may be horizontal planes.

[0043] The first sub-surface 112 and the second surface 120 may have a first distance. The second sub-surface 113 and the second surface 120 may have a second distance. The first distance may be greater than the second distance. This embodiment does not limit the specific values ​​of the first distance and the second distance. Further, at this time, the length of the incident surface 1111 may be shorter than the length of the reflecting surface 1112, which is conducive to the reflecting surface 1112 reflecting more incident light toward the second surface 120.

[0044] In this embodiment, the optical signal transmission module can be located below the first sub-surface 112, which is conducive to fixing the optical signal transmission module to the optical transmission structure 100. At this time, the portion of the optical transmission structure 100 between the second sub-surface 113 and the second surface 120 is conducive to balancing the entire optical transmission structure 100.

[0045] Of course, in some cases, part of the light transmission structure 100 between the second sub-surface 113 and the second surface 120 may not be provided, so as to further miniaturize the light transmission structure 100 .

[0046] In one embodiment, the optoelectronic co-packaging structure may include a first anti-reflection film, which covers the incident surface 1111. The optoelectronic co-packaging structure may include a reflective film, which covers the reflective surface 1112. For example, the reflective film may be a high reflective film. The optoelectronic co-packaging structure may include a second anti-reflection film, which covers the second surface 120.

[0047] As an example, the first anti-reflection film and the second anti-reflection film may be a single-layer film or a multi-layer film. The materials of the first anti-reflection film and the second anti-reflection film may include SnO2, SiO2, TiO2, etc. The multi-layer film may include 5-layer, 6-layer or 7-layer films, etc., so as to achieve better anti-reflection effects in different wavelength ranges.

[0048] As an example, the reflective film may include a metal reflective film, an all-dielectric reflective film, a metal-dielectric reflective film, etc. The reflective film may be formed by a vacuum evaporation method or a sputtering method.

[0049] This embodiment provides a first anti-reflection film, a reflective film, and a second anti-reflection film, thereby facilitating control of the optical path of the incident light, thereby increasing the transmission efficiency of the light transmission structure 100 .

[0050] In the description of the present application, the descriptions with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc., mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In the present application, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that "this embodiment" or "one embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification may not necessarily refer to the same embodiment.

[0051] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features of the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present application.

[0052] The embodiments described above only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all fall within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the attached claims. The above description is only a preferred implementation method of the present application, and does not limit the scope of the patent of the present application. All equivalent structural transformations made by using the contents of the specification and drawings of the present application under the inventive concept of the present application, or direct / indirect application in other related technical fields are included in the scope of protection of the patent of the present application.

Claims

1. An optoelectronic co-packaging structure, characterized in that: include: An optical signal transmitting module, used for transmitting incident light; The optical transmission structure comprises a first surface and a second surface arranged opposite to each other, the first surface is provided with a protrusion extending in a direction away from the second surface, the protrusion comprises an incident surface and a reflecting surface, the incident surface faces the light emitting side of the optical signal transmitting module, so that the incident light is incident from the incident surface and is emitted from the second surface after being reflected by the reflecting surface; The optical signal receiving module is used to receive the light emitted from the second surface.

2. The optoelectronic co-packaging structure according to claim 1, characterized in that: The incident light enters from the incident surface along a first direction, and the incident surface is inclined relative to the first direction.

3. The optoelectronic co-packaging structure according to claim 2, characterized in that: The refractive index of the optical transmission structure is greater than the refractive index of the transmission medium of the incident light. In the direction from the second surface to the first surface, the incident surface is inclined toward the direction close to the reflecting surface, and the reflecting surface is inclined toward the direction close to the incident surface.

4. The optoelectronic co-packaging structure according to claim 3, characterized in that: The first surface also includes a first sub-surface and a second sub-surface, the first sub-surface is located on a side of the incident surface away from the reflecting surface and the first sub-surface is connected to the incident surface, the second sub-surface is located on a side of the reflecting surface away from the incident surface and the second sub-surface is connected to the reflecting surface, the first sub-surface has a first distance from the second surface, the second sub-surface has a second distance from the second surface, and the first distance is greater than the second distance.

5. The optoelectronic co-packaging structure according to claim 1, characterized in that: The incident light enters from the incident surface in a first direction, is reflected by the reflection surface, and then is emitted from the second surface in a second direction, and an angle formed by the second direction and the first direction is in the range of 75°-105°.

6. The optoelectronic co-packaging structure according to claim 1, characterized in that: The optoelectronic co-packaging structure includes a first anti-reflection film, which covers the incident surface, and / or the optoelectronic co-packaging structure includes a reflective film, which covers the reflective surface, and / or the optoelectronic co-packaging structure includes a second anti-reflection film, which covers the second surface.

7. The optoelectronic co-packaging structure according to claim 1, characterized in that: A lens is formed on the second surface of the light transmission structure, and the lens is used to converge the light emitted from the second surface.

8. The optoelectronic co-packaging structure according to claim 7, characterized in that: The second surface of the optical transmission structure is provided with a plurality of lenses, and the plurality of lenses are arranged in an extension direction of the optoelectronic co-packaging structure.

9. The optoelectronic co-packaging structure according to claim 1, characterized in that: The material of the light transmission structure includes silicon crystal.

10. The optoelectronic co-packaging structure according to claim 1, characterized in that: The optical signal transmitting module includes a silicon photonic chip, and the optical signal receiving module includes an optical fiber array.

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