Split type die structure for forming pins of electronic components

Abstract

The invention discloses a split type die structure for forming pins of an electronic component, comprising: a main die, which is provided with a plurality of pin grooves and a guide seat, and is provided with a plurality of head limiting members at the end of the periphery; and the plurality of split dies are provided with forming dies matched with the pin grooves, the plurality of split dies are respectively and movably connected to the guide seat, the split dies move downwards through the pushing piece, and the forming dies and the pin grooves are closed to machine and form the pins of the electronic elements in the pin grooves. According to the invention, a plurality of split dies capable of being processed into different pin shapes are arranged on the main die, the head of an electronic element is put into the limiting groove, the pin is abutted against the pin groove, and then the head limiting piece limits the two ends of the electronic element, so that when the split dies move downwards along the guide post, the split dies and the main die are closed, and the pin shape of the electronic element is changed. By means of the structure, the pins of the electronic element can be machined and formed, multiple pin shapes can be machined through one mold, and the equipment input cost is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of pin forming molds, and in particular relates to a split mold structure for forming the pins of electronic components. Background Art

[0002] The pin forming of electronic components is an important link in the electronics industry. It involves processing the wiring pins of components into interfaces with specific shapes according to certain forms and sizes, and marking their functions and serial numbers on the interfaces.

[0003] At present, most of the pins of electronic components in the market are processed into S-type pins, J-type pins, G-type pins and U-type pins. Among them, S-type pins are closely connected with components and are relatively firm, which can effectively prevent vibration and loosening. J-type pins are formed and connected to components in an inserted manner to avoid problems such as poor pin contact and easy pin breakage. G-type pins are more suitable for plug-in components and have a stable shape. U-type pins can effectively prevent component failure caused by excessively high welding temperatures.

[0004] However, the current Chinese patent CN202110621513.4 is a component pin forming device, including: a driving support mechanism, a forming positioning mechanism and a stamping forming mechanism; the forming positioning mechanism is installed on the driving support mechanism, and is used to position the main body of several components that require pin forming and the pin forming, and the forming center distance is adjusted steplessly so that the main body of the component and the pin forming do not interfere with each other; the stamping forming mechanism is connected to the output end of the driving support mechanism, and under the driving force of the driving support mechanism, it cooperates with the forming positioning mechanism to complete the one-time stamping forming of the component pin, while avoiding the root force when the component pin is formed. The present invention realizes the batch program of component pins, and uses the forming center distance to be steplessly adjustable within a certain range, which has the characteristics of wide application range, strong versatility, reliable quality and high efficiency.

[0005] Chinese Patent CN202011641402.1 A field effect tube pin forming device, which facilitates the automatic completion of the bending and forming operation of the pin by setting a bending mechanism, avoids the situation where the bending angle is not uniform due to manual bending, and improves practicality of use; it includes a base plate, two groups of support plates, a mounting cross plate, a bending mechanism and a pressing mechanism, the two groups of support plates are symmetrically fixedly mounted on the base plate, the mounting cross plate is fixedly mounted between the two groups of support plates, the pressing mechanism is fixedly mounted on the mounting cross plate to drive the forming mechanism to move, the bending mechanism is mounted on the base plate for bending and forming the pin, the bending mechanism includes a guide sliding pressure block, a pin pressure plate, two groups of first guide pillars, a limit block, a plane pressure plate, a workpiece placement seat and a pin body, the pin pressure plate is fixedly mounted on the bottom end of the guide sliding pressure block, and the first guide pillar is slidably mounted on the guide sliding pressure block.

[0006] The pin forming device of Chinese patent CN201810727383.0 includes: a driving assembly, including a driving member and a receiving plate, the receiving plate is fixedly connected to the transmission shaft of the driving member; a first cutter and a second cutter, each including a first end and a second end arranged oppositely, the first end is fixedly connected to the receiving plate, and the second end is a free end, when the first cutter and / or the second cutter cuts the pin, the cutting is completed by the second end; and a carrier assembly, corresponding to the first cutter and the second cutter, the carrier assembly is provided with a first receiving groove corresponding to the first cutter, and a second receiving groove corresponding to the second cutter, when the electronic component is placed on the carrier assembly, the pin of the electronic component is arranged across the first receiving groove and the second receiving groove. The above-mentioned pin forming device drives the first cutter and the second cutter through the driving assembly, so that the first cutter and the second cutter cut different pins of the electronic component at the same time or at different times, and completes the bending of the pin after cutting. The cutting of different pins is realized, and the pins can be cut into different specifications in one step without using two processes.

[0007] It mainly solves the problem of batch pin forming and ensuring the accuracy of pin forming, but it fails to solve the problem of realizing multiple pin forming on the same device at the same time. One device can only process a single type of pin forming, which increases investment costs. Summary of the invention

[0008] The purpose of the present invention is to propose a split mold structure for electronic component pin molding in order to solve the problem that garbage in the existing fountain pool is easily blocked in the fountain water pipe, causing the fountain to be unable to work, and the existing operators need to regularly replace the water in the fountain pool, which causes troublesome water changes and high water replacement costs.

[0009] In order to achieve the above object, the present invention adopts the following technical solution: a split mold structure for forming the pins of electronic components, comprising:

[0010] The main mold is provided with a plurality of pin grooves and guide seats, and a plurality of head stoppers are provided at the four ends;

[0011] A plurality of split molds are provided with forming molds matching the pin slots, and the plurality of split molds are movably connected to the guide seats respectively. The split molds are moved downward by a pusher, and the forming molds and the pin slots are molded together to process and form the pins of the electronic components in the pin slots.

[0012] As a further description of the above technical solution:

[0013] The head limiting member includes a telescopic member and a limiting groove, the limiting groove is connected to the telescopic member, and the telescopic member is connected to the side end of the main mold.

[0014] As a further description of the above technical solution:

[0015] The telescopic member is a telescopic rod or a telescopic cylinder.

[0016] As a further description of the above technical solution:

[0017] Guide posts are arranged on both sides of the pin groove, springs are sleeved on the guide posts, through holes are arranged on both sides of the forming die, and the guide posts are located in the through holes.

[0018] As a further description of the above technical solution:

[0019] The guide seat is provided with guide rails around it, and the inner side of the split mold is provided with guide grooves, and the guide grooves are slidably connected to the guide rails.

[0020] As a further description of the above technical solution:

[0021] The guide seat may be surrounded by a linear motor, and a guide groove is provided on the inner side of the split mold, and the split mold is slidably connected to the linear motor through the guide groove.

[0022] As a further description of the above technical solution:

[0023] A connecting hole is arranged in the guide seat, and the rotating member is connected in the connecting hole.

[0024] As a further description of the above technical solution:

[0025] A rubber layer is arranged in the limiting groove.

[0026] As a further description of the above technical solution:

[0027] An oblique block is arranged in the pin groove, an oblique groove is arranged in the forming groove, and the oblique groove matches the oblique block.

[0028] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0029] 1. In the present invention, a plurality of split molds that can be processed into different pin shapes are arranged on the main mold, and the molding mold on the split mold matches the pin hole of the main mold. When processing is required, only the head of the electronic component needs to be placed in the limiting groove, and the pin abuts in the pin groove. Then, the head limiting piece limits the two ends of the electronic component, so that when the split mold moves down along the guide column, the split mold and the main mold are molded together to process and shape the pin of the electronic component. This structure can realize the processing of multiple pin shapes with one mold, thereby reducing the equipment investment cost.

[0030] 2. In the present invention, the telescopic part can be set as an elastic telescopic rod or a telescopic cylinder according to actual needs to limit the head of the electronic component to ensure that the electronic component will not shake when the mold is closed. When the mold is closed, the head of the electronic component will abut against the rubber layer along the oblique block to accurately process the pin.

[0031] 3. In the present invention, guide rails or linear motors can be arranged around the guide seat according to actual needs. If it is a guide rail, a pusher is arranged on the top of the split mold. If it is a linear motor, the linear motor directly drives the split mold to move downward, which has high flexibility.

[0032] 4. In the present invention, each split mold is independent of each other and can be processed simultaneously or individually, with flexible operation and strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 A three-dimensional diagram of a split mold structure for forming electronic component pins.

[0035] Figure 2 A breakdown of the split mold structure for forming electronic component pins Figure 1 .

[0036] Figure 3 A breakdown of the split mold structure for forming electronic component pins Figure 2 .

[0037] Figure 4 A breakdown of the split mold structure for forming electronic component pins Figure 3 .

[0038] Figure 5 The present invention is a cross-sectional view of a split mold structure for forming the pins of electronic components.

[0039] Legend:

[0040] 1-main mold; 2-pin groove; 3-guide seat; 4-head limiter; 41-telescopic member; 42-limiting groove; 5-split mold; 6-forming mold; 7-guide column; 8-through hole; 9-guide rail; 10-guide groove; 11-connecting hole; 12-oblique groove; 13-oblique block. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0043] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0045] In the description of the embodiments of the present invention, it should be noted that the terms "upper", "inner", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0046] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] See also Figure 1-5 The present invention provides a technical solution: a split mold structure for forming the pins of electronic components, comprising:

[0048] A main mold 1 is provided with a plurality of pin grooves 2 and guide seats 3, and a plurality of head stoppers 4 are provided at the four ends;

[0049] A plurality of split molds 5 are provided with a forming mold 6 matching the pin slot 2, and the plurality of split molds 5 are movably connected to the guide seat 3 respectively. The split mold 5 is moved downward by a pushing member, and the forming mold 6 and the pin slot 2 are molded together to process and form the pins of the electronic components in the pin slot 2.

[0050] The head limiting member 4 includes a telescopic member 41 and a limiting groove 42 . The limiting groove 42 is connected to the telescopic member 41 . The telescopic member 41 is connected to the side end of the main mold 1 .

[0051] The telescopic member 41 is a telescopic rod or a telescopic cylinder.

[0052] Guide pillars 7 are arranged on both sides of the pin groove 2, springs are sleeved on the guide pillars 7, through holes 8 are arranged on both sides of the molding die 6, and the guide pillars 7 are located in the through holes 8. Avoid excessive pressure of the split die to damage the pins.

[0053] The guide seat 3 is surrounded by guide rails 9, and the inner side of the split mold 5 is provided with guide grooves 10, which are slidably connected to the guide rails 9. A pusher is provided on the split mold, and a force sensor is provided on the pusher to prevent damage to the pins caused by excessive pressure.

[0054] The guide seat 3 may be surrounded by a linear motor, and a guide groove 10 is provided inside the split mold 5. The split mold 5 is slidably connected to the linear motor through the guide groove 10. The linear motor drives the split mold to move downward to avoid damage to the pins caused by excessive impact.

[0055] The guide seat 3 is provided with a connecting hole 11 , and the rotating member is connected in the connecting hole 11 .

[0056] A rubber layer is arranged in the limiting groove 42 to protect the head of the electronic component.

[0057] An oblique block 13 is arranged in the pin groove 2, and an oblique groove 12 is arranged in the molding groove, and the oblique groove 12 matches the oblique block 13, so that the pin groove and the molding mold can be precisely molded.

[0058] Working principle: By setting several split molds that can be processed into different pin shapes on the main mold, the forming mold on the split mold matches the pin hole of the main mold. When processing is required, just put the head of the electronic component into the limiting groove, the pin abuts in the pin groove, and then the head limiting piece limits the two ends of the electronic component, so that when the split mold moves down along the guide column, the split mold and the main mold are combined to process and shape the pin of the electronic component. This structure can realize the processing of multiple pin shapes with one mold, reducing the equipment investment cost.

[0059] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A split mold structure for forming electronic component pins, characterized in that: include: The main mold is provided with a plurality of pin grooves and guide seats, and a plurality of head stoppers are provided at the four ends; A plurality of split molds are provided with forming molds matching the pin slots, and the plurality of split molds are movably connected to the guide seats respectively. The split molds are moved downward by a pusher, and the forming molds and the pin slots are molded together to process and form the pins of the electronic components in the pin slots.

2. The split mold structure for forming the pins of electronic components according to claim 1, characterized in that: The head limiting member includes a telescopic member and a limiting groove, the limiting groove is connected to the telescopic member, and the telescopic member is connected to the side end of the main mold.

3. The split mold structure for forming the pins of electronic components according to claim 2, characterized in that: The telescopic member is a telescopic rod or a telescopic cylinder.

4. The split mold structure for forming the pins of electronic components according to claim 1, characterized in that: Guide posts are arranged on both sides of the pin groove, springs are sleeved on the guide posts, through holes are arranged on both sides of the forming die, and the guide posts are located in the through holes.

5. The split mold structure for forming the pins of electronic components according to claim 1, characterized in that: The guide seat is provided with guide rails around it, and the inner side of the split mold is provided with guide grooves, and the guide grooves are slidably connected to the guide rails.

6. The split mold structure for forming the pins of electronic components according to claim 1, characterized in that: The guide seat may be surrounded by a linear motor, and a guide groove is provided on the inner side of the split mold, and the split mold is slidably connected to the linear motor through the guide groove.

7. The split mold structure for forming the pins of electronic components according to claim 1, characterized in that: A connecting hole is arranged in the guide seat, and the rotating member is connected in the connecting hole.

8. The split mold structure for forming the pins of electronic components according to claim 2, characterized in that: A rubber layer is arranged in the limiting groove.

9. The split mold structure for forming the pins of electronic components according to claim 2, characterized in that: An oblique block is arranged in the pin groove, an oblique groove is arranged in the forming groove, and the oblique groove matches the oblique block.

Images